CN220626964U - Mainboard fixing assembly and chassis - Google Patents

Abstract

The embodiment of the application relates to the technical field of computer reinforcement and discloses a mainboard fixing assembly and a chassis. Through design bilayer structure, fix mainboard and two apron simultaneously to set up the opening that corresponds with shape and the position of heating element on the mainboard on a apron, make heating element on the mainboard dispel the heat through the heat conduction module that sets up on opening and the other apron, ensured the structural stability of mainboard, can also provide the heat dissipation for heating element on the mainboard when improving the shock resistance of mainboard.

Description

Mainboard fixing assembly and chassis

Technical Field

The embodiment of the application relates to the technical field of computer reinforcement, in particular to a mainboard fixing assembly and a chassis.

Background

Currently, with the development of computer technology, computers are required to perform auxiliary operations in many fields. In some fields, due to the special nature of the working environment, the computer used needs to be reinforced to have the performance of shock resistance, dust resistance, shock resistance and the like. Such computers are commonly referred to as ruggedized computers or tri-proof computers.

In the design of a reinforced computer, in order to meet the requirements of vibration prevention, dust prevention and the like, air cooling cannot be assembled in a computer case to actively dissipate heat of hardware such as a processor on a main board, and a material with high thermal conductivity is adopted instead to conduct heat of the hardware so as to achieve a heat dissipation effect.

However, the design of the motherboard fixing assembly of the conventional reinforced computer is limited, and the conventional reinforced computer cannot always achieve both the assembly stability and the heat dissipation performance of the motherboard, so that the motherboard performance of the reinforced computer is limited.

Disclosure of Invention

In view of the above problems, embodiments of the present application provide a motherboard fixing assembly and a chassis, which are used for solving the problem that it is difficult to consider both structural stability and heat dissipation performance in the existing motherboard fixing assembly.

According to an aspect of the embodiments of the present application, there is provided a motherboard fixing assembly, including: a first cover plate and a second cover plate; the first cover plate is used for being fixed with the main plate, a first opening is formed in the first cover plate, and the shape and the position of the first opening are respectively the same as the shape and the position of projection of a heating element arranged on one surface of the main plate, which faces the first cover plate, on the first cover plate; the second apron sets up in the one side that first apron deviates from the mainboard, is provided with first heat conduction module on the second apron, and the second apron is used for through first opening and mainboard fixed connection to make first heat conduction module pass through first opening and heating element looks butt, first heat conduction module is used for deriving heating element's heat.

Through setting up first apron and second apron to fixed with first apron and mainboard, set up the first opening that the shape and the position of the heating element of installing on the mainboard correspond on first apron, rethread first opening is with mainboard and second apron fixed connection, make the mainboard can be fixed by first apron and second apron simultaneously, the steadiness is higher, simultaneously, install first heat conduction module on the second apron, can provide effectual heat conduction to the heating element of mainboard through the heating element on the first opening butt mainboard, realize the radiating effect, make the mainboard fixed subassembly that this application embodiment provided also can guarantee the radiating effect when possessing good shock resistance.

In an alternative manner, a plurality of first fixing points are uniformly arranged on the area, where the first opening is not arranged, of the first cover plate, and the first fixing points are used for fixing the main plate to the first cover plate.

Through set up a plurality of first fixed points in the regional even setting of first open-ended that does not set up on first apron for the fixed whole face that is close to of first apron and mainboard is fixed more, can furthest guarantee the structural stability who is connected between mainboard and the first apron, when meetting violent vibrations, is difficult for making the mainboard drop from first apron, has improved shock resistance.

In an alternative form, the first securing point comprises a nut post and a screw that passes through the main plate and is connected to the nut post to clamp the main plate to the first cover plate.

Because screw and nut post have connect firm and detachable characteristics, realize the fixed of mainboard and first apron through adopting screw and nut post, can make the fixed firm more of mainboard and first apron, be difficult for droing, when ageing or damage appear in the mainboard simultaneously, also can dismantle and change the mainboard through unscrewing screw comparatively conveniently, be convenient for the technician maintains.

In an optional manner, a plurality of second fixing points are uniformly arranged on the second cover plate along the peripheral edge of the first heat conduction module, and the second fixing points are used for being connected with the main board so that the second cover plate is fixedly connected with the main board.

Through evenly setting up a plurality of second fixed points at first heat conduction module's edge all around can make the heating element of installation on the mainboard of first heat conduction module butt more closely, and heat conduction efficiency is ensured, is difficult for because vibrations or jolt make appear the space influence heat conduction effect between first heat conduction module and the heating element, has improved the heat dispersion of the fixed subassembly of mainboard that this application embodiment provided.

In an alternative mode, the second fixing point is a screwing structure, and the second cover plate is connected with the main plate through the second fixing point.

Because the structure of tying soon has the installation firm, the characteristics of being convenient for dismantle, when the second fixed point adopted the structure of tying soon, can make the second apron more firm with being connected of mainboard, and the dismantlement when being convenient for maintainer maintains the mainboard.

In an alternative way, the second cover plate is provided with a fin-like structure protruding from a side facing away from the first cover plate.

Through the one side protrusion that deviates from first apron at the second apron sets up fin structure, makes the surface of second apron and the area of contact increase of air, when first heat conduction module conducts the heat of heating element on the mainboard to the second apron, because the fin structure of second apron for the heat on the second apron is more easy to be given off to in the air, has improved the radiating effect of the fixed subassembly of mainboard that this application provided.

In an alternative, the edge of the first cover plate is fixedly connected to the edge of the second cover plate.

Through the edge fixed connection with first apron and second apron for mainboard and first apron are fixed, first apron is fixed with the second apron, second apron is fixed with the mainboard, and the structure of three can be fixed as a whole, has further improved the whole shock resistance of mainboard fixed subassembly.

In an alternative mode, the first heat conduction module and the second cover plate are both made of aluminum alloy materials.

The first heat conduction module and the second cover plate are made of aluminum alloy materials, so that heat generated by the heating element on the main board is conducted out more quickly, the whole weight of the main board fixing assembly can be reduced, and the heat conduction device has the advantage of low production cost.

In an alternative manner, the device further comprises a third cover plate and a fourth cover plate; the plane where the main board is located is taken as a symmetrical plane, the third cover plate and the first cover plate are symmetrically arranged, and the fourth cover plate and the second cover plate are symmetrically arranged; the third cover plate is used for being fixed with the main plate, a second opening is formed in the third cover plate, and the shape and the position of the second opening are respectively the same as the shape and the position of projection of a heating element arranged on one surface of the main plate, which faces the third cover plate, on the third cover plate; the fourth cover plate is provided with a second heat conduction module and is fixedly connected with the main board through the second opening, so that the second heat conduction module is abutted against the heating element through the second opening, and the second heat conduction module is used for leading out heat of the heating element.

Through set up third apron and fourth apron at mainboard two sides and first apron and second apron symmetry to set up second opening and second heat conduction module, make when the equal installation heating element in mainboard two sides, can provide good heat dispersion simultaneously to the heating element of mainboard two sides installation, and further improve the stability of mainboard.

According to another aspect of the embodiments of the present application, there is provided a chassis including a housing and the motherboard fixing assembly of any of the embodiments above; the housing is a box-shaped structure with one open surface, and the second cover plate covers the open surface of the housing, so that the first cover plate and the main board are positioned in the box-shaped structure of the housing.

Through adopting the mainboard fixed subassembly that this application embodiment provided in quick-witted case for the mainboard of quick-witted incasement is difficult for not hard up when jolting or vibrations drops, has guaranteed the heat dispersion of heating element on the mainboard simultaneously, has improved the stability of quick-witted case under adverse circumstances, makes the quick-witted case that has adopted the mainboard fixed subassembly that this application embodiment provided can adapt to more application scenario.

The foregoing description is only an overview of the technical solutions of the present application, and may be implemented according to the content of the specification in order to make the technical means of the present application more clearly understood, and in order to make the above-mentioned and other objects, features and advantages of the present application more clearly understood, the following detailed description of the present application will be given.

Drawings

Various other advantages and benefits will become apparent to those of ordinary skill in the art upon reading the following detailed description of the preferred embodiments. The drawings are only for purposes of illustrating the preferred embodiments and are not to be construed as limiting the application. Also, like reference numerals are used to designate like parts throughout the figures. In the drawings:

fig. 1 is a schematic diagram of a combination state of a motherboard fixing assembly according to an embodiment of the present application;

fig. 2 is a schematic exploded view of a motherboard fixing assembly according to an embodiment of the present disclosure;

FIG. 3 is an exploded view of another embodiment of a motherboard fixing assembly according to the present disclosure;

fig. 4 is a schematic structural diagram of a first cover plate of the motherboard fixing assembly according to an embodiment of the present application;

fig. 5 is a schematic diagram of a connection manner of a motherboard fixing assembly according to an embodiment of the present application;

fig. 6 is a schematic structural diagram of a second cover plate of the motherboard fixing assembly according to the embodiment of the present application;

fig. 7 is a schematic structural diagram of a second cover plate of the motherboard fixing assembly according to an embodiment of the present application.

Reference numerals in the specific embodiments are as follows:

100. a motherboard fixing assembly;

110. a first cover plate 111, a first opening;

112. a first fixing point 1121, a nut post 1122, a screw;

120. the second cover plate 121, the first heat conduction module 122, the second fixed point 123 and the fin-shaped structure;

200. motherboard 210, heating element.

Detailed Description

Embodiments of the technical solutions of the present application will be described in detail below with reference to the accompanying drawings. The following examples are only for more clearly illustrating the technical solutions of the present application, and thus are only examples, and are not intended to limit the scope of protection of the present application.

Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs; the terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the application; the terms "comprising" and "having" and any variations thereof in the description and claims of the present application and in the description of the figures above are intended to cover non-exclusive inclusions.

In the description of the embodiments of the present application, the technical terms "first," "second," etc. are used merely to distinguish between different objects and are not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated, a particular order or a primary or secondary relationship. In the description of the embodiments of the present application, the meaning of "plurality" is two or more unless explicitly defined otherwise.

Reference herein to "an embodiment" means that a particular feature, structure, or characteristic described in connection with the embodiment may be included in at least one embodiment of the present application. The appearances of such phrases in various places in the specification are not necessarily all referring to the same embodiment, nor are separate or alternative embodiments mutually exclusive of other embodiments. Those of skill in the art will explicitly and implicitly appreciate that the embodiments described herein may be combined with other embodiments.

In the description of the embodiments of the present application, the term "and/or" is merely an association relationship describing an association object, which means that three relationships may exist, for example, a and/or B may mean: there are three cases, a, B, a and B simultaneously. In addition, the character "/" herein generally indicates that the front and rear associated objects are an "or" relationship.

In the description of the embodiments of the present application, the term "plurality" refers to two or more (including two), and similarly, "plural sets" refers to two or more (including two), and "plural sheets" refers to two or more (including two).

In the description of the embodiments of the present application, the orientation or positional relationship indicated by the technical terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc. are based on the orientation or positional relationship shown in the drawings, and are merely for convenience of describing the embodiments of the present application and for simplifying the description, rather than indicating or implying that the apparatus or element referred to must have a specific orientation, be configured and operated in a specific orientation, and therefore should not be construed as limiting the embodiments of the present application.

In the description of the embodiments of the present application, unless explicitly specified and limited otherwise, the terms "mounted," "connected," "secured" and the like are to be construed broadly and may be, for example, fixedly connected, detachably connected, or integrally formed; or may be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium, and can be communicated with the inside of two elements or the interaction relationship of the two elements. The specific meaning of the above terms in the embodiments of the present application will be understood by those of ordinary skill in the art according to the specific circumstances.

With the progress of modern technology, people are not helped by computers in life, and in many fields, the people have to rely on the computers to realize the processing and operation of complex data. The computer greatly reduces the difficulty of people in processing complex data, and plays an important role in scientific research and daily operation of people. In some cases, people may need to use the computer in a more complex environment, such as in a dusty, bumpy or humid environment, and because of the precise and complex structure of the computer, the internal parts or circuits may be damaged once they are damaged due to vibration and other factors, so that the computer cannot be used normally, and thus, reinforcement of the computer has been generated.

The reinforced computer is to adapt to various severe environments, and when the computer is designed, the computer adopts corresponding assurance measures on various factors affecting the performance of the computer, such as system structure, electrical characteristics, mechanical and physical structures, and the like, and is also called a severe environment resistant computer, and the reinforced computer is generally characterized by stronger environmental adaptability, high reliability and Gao Kewei. Generally, the most basic reinforced computer should be able to meet a certain degree of anti-seismic, dustproof and waterproof performances, and in order to ensure the dustproof and waterproof performances, the chassis of the reinforced computer is often designed in a sealed manner, and does not include an air vent for performing air exchange and heat dissipation in the air cooling module of the computer, so that in general, air cooling for heat dissipation cannot be added in the structural design of the reinforced computer, and other passive heat dissipation means are needed to be adopted instead, for example, a material with good heat conduction performance is added to form a heat conduction module to conduct heat to a heating component in the computer, so that a heat dissipation effect is achieved, and abnormal operation of a circuit or a part caused by serious heat accumulation in the sealed chassis of the reinforced computer is avoided.

Meanwhile, some precision components in the reinforced computer are fragile in structure and poor in anti-seismic performance, and in order to enable the reinforced computer to be used normally after being subjected to a certain degree of vibration, a stable enough fixing structure is required to be arranged for fixing the internal components of the reinforced computer.

In the reinforced computer, the parts with serious heat generation, precise structure and poor earthquake resistance are the main board and the heating element arranged on the main board. The inventor notices that the processing of the main board in the conventional reinforced computer is to perform whole-surface reinforcement on the main board, so that although the anti-seismic performance and stability of the main board are ensured, the heating element is difficult to install on the reinforced surface of the main board, or the heat conduction module is mounted on the whole surface to dissipate heat, so that the heat dissipation of the heating element installed on the main board can be ensured, but the stability is difficult to ensure, if the main board is fixed on one surface and is mounted in a heat dissipation manner, only one surface of the main board is used for installing the heating element, the space utilization rate of the main board is greatly reduced, and when the reinforced computer with a complex functional module is required, the main board is difficult to ensure that enough space exists for installing all the elements. Therefore, designing a motherboard fixing assembly that is stable in connection and at the same time can ensure heat dissipation is critical to the production and application of a ruggedized computer.

In order to solve the technical problem, the inventor designs a mainboard fixing assembly through research, through designing bilayer structure, fix mainboard and two apron simultaneously to set up the opening that corresponds with shape and position of the heating element on the mainboard on a apron, make the heating element on the mainboard dispel the heat through the heat conduction module that the opening set up on another apron, ensured the structural stability of mainboard, still can provide the heat dissipation for the heating element on the mainboard when improving the shock resistance of mainboard.

Referring to fig. 1, and further referring to fig. 2 and fig. 3, fig. 1 is a schematic view of a combined state of a motherboard fixing assembly 100 according to an embodiment of the present application, fig. 2 is a schematic view of a structural explosion of the motherboard fixing assembly 100 according to an embodiment of the present application, and fig. 3 is a schematic view of another angular structural explosion of the motherboard fixing assembly 100 according to an embodiment of the present application. As shown in fig. 1, 2 and 3, an aspect of an embodiment of the present application provides a motherboard fixing assembly 100, including: a first cover plate 110 and a second cover plate 120; the first cover plate 110 is used for being fixed with the main plate 200, a first opening 111 is arranged on the first cover plate 110, and the shape and the position of the first opening 111 are respectively the same as those of the projection of the heating element 210 arranged on one surface of the main plate 200 facing the first cover plate 110 on the first cover plate 110; the second cover plate 120 is disposed on a surface of the first cover plate 110 facing away from the motherboard 200, a first heat conducting module 121 is disposed on the second cover plate 120, the second cover plate 120 is fixedly connected with the motherboard 200 through the first opening 111, so that the first heat conducting module 121 abuts against the heating element 210 through the first opening 111, and the first heat conducting module 121 is used for conducting out heat of the heating element 210.

The first cover plate 110 is fixed to the main board 200, as shown in fig. 1, and may be directly overlapped and fixed to the main board 200, and the fixing manner may be screwing or welding through a screw and a nut, etc., and a person skilled in the art may adopt different fixing manners according to actual needs, so that the main board 200 may be stably fixed to the first cover plate 110, and it is ensured that the main board 200 will not loosen or fall off when being jolt or rocked.

As shown in fig. 2, the second cover plate 120 is provided with a first heat conducting module 121, where the first heat conducting module 121 is used for conducting and radiating heat generated by the heating element 210 installed on the motherboard 200, that is, the first heat conducting module 121 should have good heat conductivity or large specific heat capacity, and the heat radiating mode of the heating element 210 may be that the heat generated by the heating element 210 is absorbed by its high specific heat capacity, so as to reduce the heat of the heating element 210, or the heat generated by the heating element 210 is conducted to the second cover plate 120 by its good heat conductivity for radiating. Therefore, the first heat conduction module 121 can adopt a solid block made of metal material to conduct heat to the heating element 210, or adopts a hollow structure made of metal material, and injects a cold conducting medium into the hollow structure to make the hollow structure have a higher specific heat capacity to absorb heat generated by the heating element 210.

As shown in fig. 3, the shape and position of the first opening 111 provided on the first cover plate 110 are the same as the shape and position of the projection of the heat generating element 210 mounted on the side of the main board 200 facing the first cover plate 110 on the first cover plate 110, for example, a square processor is mounted on the central area of the side of the main board 200 facing the first cover plate 110, and the shape of the first opening 111 on the first cover plate 110 should be the same square as the processor and be provided on the central area of the first cover plate 110, so that the processor mounted on the main board 200 is exposed from the first opening 111 and is not blocked by the first cover plate 110 when the main board 200 is fixed with the first cover plate 110. The purpose of this arrangement is to avoid the heat accumulation of the heat generating element 210 during the operation of the heat generating element 210 caused by the complete shielding of the heat generating element 210 mounted on the main board 200 by the first cover plate 110, and to enable the first heat conducting module 121 on the second cover plate 120 to be in direct contact with the heat generating element 210 mounted on the main board 200 through the first opening 111, so as to facilitate heat conduction.

Through setting up first apron 110 and second apron 120 to fixed with first apron 110 and mainboard 200, set up the first opening 111 that the shape and the position of the heating element 210 of installing on mainboard 200 correspond on first apron 110, rethread first opening 111 is with mainboard 200 and second apron 120 fixed connection, make mainboard 200 can be fixed by first apron 110 and second apron 120 simultaneously, the steadiness is higher, simultaneously, install first heat conduction module 121 on the second apron 120, can provide effectual heat conduction through the heating element 210 on first opening 111 butt mainboard 200 to the heating element 210 of mainboard 200, realize the radiating effect, make the mainboard fixed subassembly 100 that this application embodiment provided also can guarantee the radiating effect when possessing good shock resistance.

Referring to fig. 4, fig. 4 is a schematic diagram illustrating a connection manner of the motherboard fixing assembly 100 according to an embodiment of the present application. According to some embodiments of the present application, as shown in fig. 4, a plurality of first fixing points 112 are uniformly disposed on a region of the first cover plate 110 where the first opening 111 is not disposed, and the first fixing points 112 are used to fix the main plate 200 to the first cover plate 110.

The first fixing point 112 refers to an area or a structural component for realizing fixing, for example, when the first cover plate 110 and the main board 200 are adhered and fixed by glue, the first fixing point 112 is an adhesive area formed by a plurality of adhesive points adhered by glue, and when the first cover plate 110 and the main board 200 are fixed by a single-point fixing structure, the first fixing point 112 is the single-point fixing structure itself. It can be appreciated that when the first fixing point 112 is a single-point fixing structure, since most fixing structures have separability, when the first cover plate 110 is separated from the main plate 200, the first fixing point 112 may also be separated into two parts respectively located on the main plate 200 and the first cover plate 110, for example, the first fixing point 112 is a threaded hole and a screw, and the fixing manner of the first cover plate 110 and the main plate 200 may be that the main plate 200 is provided with a threaded hole, the screw is connected with the first cover plate 110 and screwed into the threaded hole on the main plate 200, and the threaded hole and the screw together form the first fixing point 112 described in the embodiment of the present application.

Through evenly setting up a plurality of fixed points 112 in the region that does not set up first opening 111 on first apron 110 for the fixed whole face that is close to of first apron 110 and mainboard 200 is fixed more, can furthest guarantee the structural stability of being connected between mainboard 200 and the first apron 110, when meetting violent vibrations, be difficult for making mainboard 200 drop from first apron 110, improved shock resistance.

Referring to fig. 5, fig. 5 is a schematic diagram illustrating a connection manner of the motherboard fixing assembly 100 according to an embodiment of the present application. According to some embodiments of the present application, as shown in fig. 5, the first fixing point 112 includes a nut post 1121 and a screw 1122, and the screw 1122 passes through the main plate 200 and is connected with the nut post 1121 to clamp and fix the main plate 200 to the first cover plate 110.

As shown in fig. 5, the screw 1122 penetrates the main plate 200 and is connected to the nut post 1121, and the main plate 200 is fixed to the first cover plate 110 by clamping the screw 1122 to the nut post 1121. It can be understood that the nut post 1121 is a hollow cylindrical structure, and is provided with a threaded structure, for example, the nut post can be a press-riveting nut post, which is also called a press-riveting stud, and is a fastener applied to a sheet metal, a thin plate, a case and a cabinet, when the fastener is applied, the press-riveting nut post is often pressed into a preset hole of a fixed point by a press machine or other equipment in advance, so that the periphery of the preset hole is plastically deformed, the deformed part is squeezed into a pressing part of the press-riveting nut post to rivet, so that the press-riveting nut post is fixed in the preset hole, and then the part to be fixed is penetrated through a screw and screwed into the internal thread of the press-riveting nut post, so that the fixing of the part can be realized.

It should be noted that, to achieve the clamping and fixing of the main board 200 by the screw 1122 and the nut post 1121, the screw 1122 needs to be penetrated through the main board 200, that is, the main board 200 should be perforated in advance, and the diameter of the hole should be smaller than that of the large end of the screw 1122, so that the large end of the screw 1122 can be screwed into the nut post 1121 to clamp the main board 200, and those skilled in the art should be able to reasonably assemble the screw 1122 and the nut post 1121 according to actual needs, so that the screw 1122 and the nut post 1121 clamp and fix the main board 200 on the first cover board 110.

Because the screw 1122 has the characteristics of being connected firmly and can be dismantled with the nut post 1121, through adopting screw 1122 and nut post 1121 to realize the fixed of mainboard 200 and first apron 110, can make the fixed firm more of mainboard 200 and first apron 110, be difficult for droing, when mainboard 200 ageing or damage appears simultaneously, also can dismantle and change mainboard 200 through unscrewing screw 1122 comparatively conveniently, the technician of being convenient for maintains.

Referring to fig. 6, fig. 6 is a schematic structural diagram of a second cover plate 120 of the motherboard fixing assembly 100 according to the embodiment of the present application. According to some embodiments of the present application, as shown in fig. 6, a plurality of second fixing points 122 are uniformly disposed on the second cover 120 along the peripheral edge of the first heat conduction module 121, and the second fixing points 122 are used for connecting with the motherboard 200, so that the second cover 120 is fixedly connected with the motherboard 200.

In this embodiment, the second fixing point 122 may be, for example, a threaded hole surrounding the periphery of the first heat conducting module 121, and when a screw or a bolt passing through the main board 200 is screwed into the threaded hole, the main board 200 and the second cover board 120 are clamped and fixed. In addition, a plurality of glue bonding points surrounding the periphery of the first heat conduction module 121 may be also used. The purpose of the second fixing point 122 is to enable the second fixing point 122 to fixedly connect the main board 200 with the second cover board 120 through the first opening 111 of the first cover board 110, further provide fixing for the main board 200, and a plurality of different fixing structures or modes can be used as the second fixing point 122, which is not limited in particular in the embodiment of the present application.

Through evenly setting up a plurality of second fixed points 122 at first heat conduction module 121's peripheral edge can make first heat conduction module 121 can more closely the heating element 210 of installation on the butt mainboard 200, and heat conduction efficiency is ensured, is difficult for because vibrations or jolt make the heat conduction effect of space influence appear between first heat conduction module 121 and the heating element 210, has improved the heat dispersion of mainboard fixed subassembly 100 that this application embodiment provided.

According to some embodiments of the present application, the second fixing point 122 is a screwing structure, and the second cover plate 120 is connected to the main plate 200 through the second fixing point 122.

The screwing structure used for the second fixing point 122 may be, for example, a lead screw nut structure.

Because the structure of tying soon has the characteristics of installation firm, be convenient for dismantle, when second fixed point 122 adopted the structure of tying soon, can make the second apron 120 more firm with being connected of mainboard 200, and the dismantlement when the maintainer of being convenient for maintains mainboard 200.

Referring to fig. 7, fig. 7 is a schematic structural diagram of a second cover plate 120 of the motherboard fixing assembly 100 according to an embodiment of the present application. According to some embodiments of the present application, as shown in fig. 7, a surface of the second cover plate 120 facing away from the first cover plate 110 is convexly provided with a fin structure 123.

The fin structure 123 refers to a strip-shaped or sheet-shaped protrusion like a fish fin, and the fin structure 123 disposed on the side of the second cover plate 120 facing away from the first cover plate 110 may be one or more channels, so as to increase the contact area between the outer surface of the second cover plate 120 and the air.

Through the one side protrusion that deviates from first apron 110 at second apron 120 sets up fin structure 123, makes the surface of second apron 120 and the area of contact increase of air, when first heat conduction module 121 conducts the heat of heating element 210 on the mainboard 200 to second apron 120, because the fin structure 123 of second apron 120 for the heat on the second apron 120 more easily gives off to in the air, has improved the radiating effect of mainboard fixed subassembly 100 that this application embodiment provided.

According to some embodiments of the present application, an edge of the first cover plate 110 is fixedly connected with an edge of the second cover plate 120.

Through the edge fixed connection of first apron 110 and second apron 120 for mainboard 200 is fixed with first apron 110, first apron 110 is fixed with second apron 120, second apron 120 is fixed with mainboard 200, and the structure of three can be fixed as a whole, has further improved the whole shock resistance of mainboard fixed subassembly 100.

According to some embodiments of the present application, the first heat conduction module 121 and the second cover 120 are both made of aluminum alloy.

The aluminum alloy refers to an alloy based on aluminum and added with a certain amount of other alloying elements, and besides the general characteristic of aluminum, the aluminum alloy also has high strength, good heat conducting performance and light weight, and the heat generated by the heating element 210 on the motherboard 200 can be more quickly led out by adopting the aluminum alloy material to manufacture the first heat conducting module 121 and the second cover plate 120, and meanwhile, the overall weight of the motherboard fixing assembly 100 can be reduced, and the manufacturing cost is low.

According to some embodiments of the present application, a third cover plate and a fourth cover plate are further included; the plane where the main board 200 is located is taken as a symmetrical plane, the third cover board and the first cover board 110 are symmetrically arranged, and the fourth cover board and the second cover board 120 are symmetrically arranged; the third cover plate is used for being fixed with the main plate 200, a second opening is arranged on the third cover plate, and the shape and the position of the second opening are respectively the same as the shape and the position of the projection of the heating element 210 arranged on one surface of the main plate 200 facing the third cover plate on the third cover plate; the fourth cover plate is provided with a second heat conducting module, and the fourth cover plate is fixedly connected with the main board 200 through the second opening, so that the second heat conducting module is abutted against the heating element 210 through the second opening, and the second heat conducting module is used for guiding out heat of the heating element 210.

Through set up third apron and fourth apron at mainboard 200 two sides and first apron 110 and second apron 120 symmetry to set up second opening and second heat conduction module, make when mainboard 200 two sides all install heating element 210, can provide good heat dispersion simultaneously to heating element 210 of mainboard 200 two sides installation, and further improve the stability of mainboard 200.

According to another embodiment of the present application, there is provided a chassis including a housing and the motherboard fixing assembly 100 of any one of the above embodiments; the housing is a box-like structure with one side open, and the second cover plate 120 covers the open side of the housing, so that the first cover plate 110 and the main board 200 are positioned in the box-like structure of the housing.

In an embodiment of the chassis provided in this application, a structure such as a handle that is convenient to hold or fix may be provided on the housing of the chassis, so that a person can move the chassis, or further fix the chassis in cooperation with an external fixing component during transportation. In general, all basic elements of a computer should be accommodated in a chassis, for example, a power module, a power panel, a filter, etc. are further installed in the chassis, and it can be understood that, according to the structural design of the chassis itself, an interface or an installation slot for installing electronic elements such as the power module, the power panel, the filter, etc. is further provided in the chassis, hereinafter collectively referred to as a heating element 210, in order to meet performance requirements such as vibration prevention and dust prevention of these elements, a shielding case may be further provided in the chassis at the corresponding interface or installation slot thereof for shielding the elements such as the power module, the power panel, the filter, etc. to prevent the heating element 210 from falling off or entering ash, and to provide an effect of preventing interference coupling between the heating elements 210.

Further, for the heating element 210 possibly installed in the chassis and used for forming the computer, the number and the positions of the first heat conducting modules 121 installed on the second cover plate 120 should also be changed correspondingly, so as to ensure that the heat generated by the heating element 210 installed in the chassis with higher heat productivity can be led out as much as possible, and achieve better heat dissipation effect.

Meanwhile, the heat conducting paste or pad can be filled between the first heat conducting module 121 and the heating element 210 to ensure that the contact between the first heat conducting module 121 and the heating element 210 is more sufficient, and the heat conduction efficiency is improved. A thermal paste is understood to be a filler material or medium with good thermal conductivity, such as heat dissipating silicone grease for computer CPU heat dissipation, or a metal sheet with high thermal conductivity. At this time, the heat conduction path of the chassis provided in the embodiment of the present application is: the heat is generated by the heating element 210, and is conducted to the first heat conduction module 121 through the heat conduction paste or the heat conduction pad, the first heat conduction module 121 conducts the heat to the second cover plate 120 through the heat conduction paste or the heat conduction pad, and the second cover plate 120 dissipates the heat to the outside air.

By adopting the mainboard fixing assembly 100 provided by the embodiment of the application in the case, the mainboard 200 in the case is not easy to loose and fall off during jolt or vibration, meanwhile, the heat dissipation performance of the heating element 210 on the mainboard 200 is guaranteed, the stability of the case in a severe environment is improved, and the case adopting the mainboard fixing assembly 100 provided by the embodiment of the application can adapt to more application scenes.

Finally, it should be noted that: the above embodiments are only for illustrating the technical solution of the present application, and not for limiting the same; although the present application has been described in detail with reference to the foregoing embodiments, it should be understood by those of ordinary skill in the art that: the technical scheme described in the foregoing embodiments can be modified or some or all of the technical features thereof can be replaced by equivalents; such modifications and substitutions do not depart from the spirit of the embodiments, and are intended to be included within the scope of the claims and description. In particular, the technical features mentioned in the respective embodiments may be combined in any manner as long as there is no structural conflict. The present application is not limited to the specific embodiments disclosed herein, but encompasses all technical solutions falling within the scope of the claims.

Claims (10)

1. A motherboard securing assembly, comprising: a first cover plate and a second cover plate;

the first cover plate is used for being fixed with the main plate, a first opening is formed in the first cover plate, and the shape and the position of the first opening are respectively the same as the shape and the position of projection of a heating element arranged on one surface of the main plate, facing the first cover plate, on the first cover plate;

the second cover plate is arranged on one face, deviating from the main board, of the first cover plate, a first heat conduction module is arranged on the second cover plate, the second cover plate is fixedly connected with the main board through the first opening, the first heat conduction module is in butt joint with the heating element through the first opening, and the first heat conduction module is used for conducting out heat of the heating element.

2. The motherboard fixing assembly as recited in claim 1 wherein the area of the first cover plate where the first opening is not provided is uniformly provided with a plurality of first fixing points for fixing the motherboard to the first cover plate.

3. The motherboard securing assembly of claim 2 wherein said first securing point comprises a nut post and a screw passing through said motherboard and connected to said nut post to clamp said motherboard to said first cover plate.

4. The motherboard fixing assembly as claimed in claim 1, wherein a plurality of second fixing points are uniformly arranged on the second cover plate along the peripheral edge of the first heat conduction module, and the second fixing points are used for being connected with the motherboard so that the second cover plate is fixedly connected with the motherboard.

5. The motherboard fixing assembly of claim 4 wherein said second fixing point is a swivel structure, said second cover plate being connected to said motherboard by said second fixing point.

6. The motherboard fixing assembly of claim 1 wherein a face of the second cover plate facing away from the first cover plate is convexly provided with a fin structure.

7. The motherboard securing assembly of claim 1 wherein an edge of said first cover plate is fixedly connected to an edge of said second cover plate.

8. The motherboard fixing assembly as claimed in any one of claims 1-7 wherein said first heat conductive module and said second cover plate are both aluminum alloy materials.

9. The motherboard fixing assembly of any one of claims 1-7, further comprising a third cover plate and a fourth cover plate;

the plane where the main board is located is taken as a symmetrical plane, the third cover plate and the first cover plate are symmetrically arranged, and the fourth cover plate and the second cover plate are symmetrically arranged;

the third cover plate is used for being fixed with the main plate, a second opening is formed in the third cover plate, and the shape and the position of the second opening are respectively the same as the shape and the position of projection of a heating element arranged on one surface of the main plate, facing the third cover plate, on the third cover plate;

the fourth cover plate is provided with a second heat conduction module, and the fourth cover plate is used for being fixedly connected with the main board through the second opening, so that the second heat conduction module is in butt joint with the heating element through the second opening, and the second heat conduction module is used for leading out heat of the heating element.

10. A chassis comprising a housing and the motherboard securing assembly of any one of claims 1-9;

the shell is of a box-shaped structure with one open surface, and the second cover plate covers the open surface of the shell, so that the first cover plate and the main plate are positioned in the box-shaped structure of the shell.