CN213186960U - Circuit board assembly structure - Google Patents

Circuit board assembly structure Download PDF

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Publication number
CN213186960U
CN213186960U CN202021979384.3U CN202021979384U CN213186960U CN 213186960 U CN213186960 U CN 213186960U CN 202021979384 U CN202021979384 U CN 202021979384U CN 213186960 U CN213186960 U CN 213186960U
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CN
China
Prior art keywords
circuit board
stud
structure according
mounting structure
upper cover
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Application number
CN202021979384.3U
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Chinese (zh)
Inventor
王喜
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Guangzhou Shiyuan Electronics Thecnology Co Ltd
Guangzhou Shikun Electronic Technology Co Ltd
Original Assignee
Guangzhou Shiyuan Electronics Thecnology Co Ltd
Guangzhou Shikun Electronic Technology Co Ltd
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Application filed by Guangzhou Shiyuan Electronics Thecnology Co Ltd, Guangzhou Shikun Electronic Technology Co Ltd filed Critical Guangzhou Shiyuan Electronics Thecnology Co Ltd
Priority to CN202021979384.3U priority Critical patent/CN213186960U/en
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Publication of CN213186960U publication Critical patent/CN213186960U/en
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Abstract

The embodiment of the utility model discloses a circuit board assembly structure, which comprises an upper cover, a circuit board, a lower shell and a plurality of locking screws; the upper cover is provided with a connecting lug, the surface of the lower shell is provided with a stud, the stud is provided with a threaded hole, and a connecting hole is formed in the position of the circuit board corresponding to the stud; the stud penetrates through the connecting hole of the circuit board, and the locking screw penetrates through the connecting lug and is screwed into the threaded hole of the stud. Such an arrangement may allow for quick assembly and reduce the use of screw parts.

Description

Circuit board assembly structure
Technical Field
The utility model relates to an electrical product field especially relates to a circuit board assembly structure.
Background
At present, a module power supply has widely used a structural form of a PCBA board external hanging radiator shell, and the structure can effectively solve the heat dissipation problem of a high-heat device. However, in the assembly process of the PCBA board and the housing, it is necessary to use more than ten screws to fasten the upper housing and the lower housing with the PCBA board, which is slow in the assembly process and low in efficiency.
SUMMERY OF THE UTILITY MODEL
In order to overcome the defects of the prior art, the embodiment of the utility model discloses a circuit board assembly structure, which comprises an upper cover, a circuit board, a lower shell and a plurality of locking screws; the upper cover is provided with a connecting lug, the surface of the lower shell is provided with a stud, the stud is provided with a threaded hole, and a connecting hole is formed in the position of the circuit board corresponding to the stud; the stud penetrates through the connecting hole of the circuit board, and the locking screw penetrates through the connecting lug and is screwed into the threaded hole of the stud. Such an arrangement may allow for quick assembly and reduce the use of screw parts.
As a further improvement of the utility model, the upper cover includes the mainboard and sets up the curb plate of mainboard both sides, the curb plate is provided with the engaging lug.
As a further improvement of the present invention, both ends of the side plate are provided with the engaging lugs.
As a further improvement of the present invention, each of the engaging lugs on the side plate extends toward the other side plate.
As a further improvement of the utility model, the upper cover inner wall is provided with the boss, the boss is located circuit board top compresses tightly the circuit board.
As a further improvement of the utility model, the inner wall symmetry of the upper cover is provided with two the boss.
As a further improvement of the utility model, the boss surface is an arc surface.
As a further improvement of the utility model, the lower shell surface is provided with four the double-screw bolt.
As a further improvement, the utility model also comprises a heat-conducting silica gel pad, the heat-conducting silica gel pad is arranged on the circuit board and between the inferior valve.
As a further improvement of the utility model, the top of double-screw bolt is provided with the bulge loop, the bulge loop centers on the screw hole sets up.
The utility model discloses a convenient equipment of circuit board assembly structure can combine circuit board and housing component through a small amount of screws, has promoted the packaging efficiency, has reduced the screw part and has used.
For a better understanding and an implementation, the present invention is described in detail below with reference to the accompanying drawings.
Drawings
Fig. 1 is a schematic diagram of the circuit board assembly structure of the present invention.
Fig. 2 is a schematic view of the stud of the present invention.
Detailed Description
Reference will now be made in detail to embodiments of the present invention, examples of which are illustrated in the accompanying drawings, wherein like reference numerals refer to the same or similar elements or elements having the same or similar function throughout. The embodiments described below with reference to the drawings are exemplary only for the purpose of explaining the present invention, and should not be construed as limiting the present invention.
Referring to fig. 1 and 2, an embodiment of the present invention discloses a circuit board assembly structure, which includes an upper cover, a circuit board 200, a lower cover 300, and a plurality of locking screws 400; the upper cover is provided with a connecting lug 120, the surface of the lower shell 300 is provided with a stud 310, the stud 310 is provided with a threaded hole, and the position of the circuit board 200 corresponding to the stud 310 is provided with a connecting hole 210; the stud 310 passes through the connection hole 210 of the circuit board 200, and the locking screw 400 passes through the connection lug 120 and is screwed into the threaded hole of the stud 310. Through such an arrangement, the circuit board 200 can be restricted by the studs 310 from moving, and the locking screws 400 can fix the upper cover together with the circuit board 200 and the lower cover 300, so that rapid assembly can be realized with a small number of screws.
After assembly, an accommodating space is formed between the upper cover and the lower case 300, the circuit board 200 is located in the accommodating space, and the upper cover and the lower case 300 can protect the circuit board 200 and have a certain heat transfer and dissipation function. In this embodiment, in order to manufacture the upper cover, the upper cover includes a main plate 111 and side plates 112 disposed on two sides of the main plate 111, the side plates 112 are provided with the connecting lugs 120, and the connecting lugs 120 may be integrally formed with the main plate 111 and the side plates 112, or the connecting lugs 120 may be fixed to the side plates 112 by welding. The included angle between the main plate 111 and the side plate 112 may be formed by bending a plate, and the connection lug 120 may also be bent to form a state protruding and extending toward the accommodation space.
The surface of the side plate 112 is provided with the engaging lug 120 to facilitate the fastening of the upper cover by the locking screw 400, in this embodiment, the engaging lugs 120 are respectively arranged at the two ends of the side plate 112, so that the arrangement and the processing are convenient, and meanwhile, the connecting stability can be enhanced by the engaging lugs 120 symmetrically arranged at the two ends of the side plate 112. The extending direction of the engaging lug 120 on the surface of the side plate 112 may face the accommodating space or deviate from the accommodating space as required, in this embodiment, the engaging lug 120 on each side plate 112 extends towards the other side plate 112, such arrangement may facilitate the fixed serial connection of the engaging lug 120 and the circuit board 200, and increase the heat dissipation space.
In order to prevent the circuit board 200 from being bent after assembly, in this embodiment, the inner wall of the upper cover is provided with a boss 130, the boss 130 is located above the circuit board 200 and presses the circuit board 200, and the boss 130 can be pressed downward from the side of the circuit board 200 to prevent the side of the circuit board 200 from warping upward. Meanwhile, in order to facilitate the formation of symmetrical downward pressure on the circuit board 200, in this embodiment, the inner wall of the upper cover is symmetrically provided with two bosses 130, and the two bosses 130 form downward pressing forces on two sides of the circuit board 200, thereby fixing the position of the circuit board 200 in the up-down direction. In order to avoid damage to the circuit board 200 during the process of pressing down the boss 130, in this embodiment, the surface of the boss 130 is an arc-shaped surface, and through such arrangement, the boss 130 does not scratch the circuit board 200 during assembly, so that the safety of the circuit board 200 is maintained.
In this embodiment, the four studs 310 are disposed on the surface of the lower case 300, and the fixing points between the lower case 300 and the circuit board 200 are symmetrically arranged, so that stable and symmetrical fixing pressure is formed on the circuit board 200. In order to limit the left and right movement of the circuit board 200, in this embodiment, a convex ring 311 is disposed at the top of the stud 310, the convex ring 311 is disposed around the threaded hole, the diameter of the connection hole 210 of the circuit board 200 is larger than that of the convex ring 311 but smaller than that of the stud 310, and the convex ring 311 passes through the connection hole 210 of the circuit board 200, so as to prevent the circuit board 200 from shaking left and right and enhance the stability of the circuit board 200.
In order to enhance the heat dissipation performance of the assembly structure, in this embodiment, the assembly structure further includes a heat-conducting silicone pad 320, the heat-conducting silicone pad 320 is disposed between the circuit board 200 and the lower case 300, and through such an arrangement, the heat-conducting silicone pad 320 can transfer the heat of the circuit board 200 to the lower case 300 and then is dissipated by the lower case 300. Meanwhile, when the boss 130 presses the circuit board 200 downward, the circuit board 200 may be pressed against the thermal conductive silicone pad 320, so as to enhance the contact between the thermal conductive silicone pad 320 and the circuit board 200 for heat conduction.
In this embodiment, the circuit board is a PCBA board, and power components are disposed thereon, and the assembly structure can be applied to various circuit board structures.
The utility model discloses a convenient equipment of circuit board assembly structure can combine circuit board and housing component through a small amount of screws, has promoted the packaging efficiency, has reduced the screw part and has used.
In the description of the present invention, it is to be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "left", "right", "top", "bottom", "inner", "outer", "axial", "radial", "circumferential", and the like indicate orientations or positional relationships based on those shown in the drawings, and are merely for convenience of description and to simplify the description, and do not indicate or imply that the device or element so referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus, are not to be considered limiting of the present invention. Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the present invention, "a plurality" means two or more unless otherwise specified.
In the description of the present invention, it is to be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present invention can be understood in specific cases to those skilled in the art.
In the present disclosure, unless expressly stated or limited otherwise, the first feature "on" or "under" the second feature may comprise direct contact between the first and second features, or may comprise contact between the first and second features not directly. Also, the first feature being "on," "above" and "over" the second feature includes the first feature being directly on and obliquely above the second feature, or merely indicating that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature includes the first feature being directly above and obliquely above the second feature, or simply meaning that the first feature is at a lesser level than the second feature.
In the description herein, references to the description of the term "one embodiment," "some embodiments," "an illustrative embodiment," "an example," "a specific example," or "some examples" or the like mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the present invention. In this specification, the schematic representations of the terms used above do not necessarily refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.
The present invention is not limited to the above embodiment, and if various modifications or variations of the present invention do not depart from the spirit and scope of the present invention, they are intended to be covered if they fall within the scope of the claims and the equivalent technology of the present invention.

Claims (10)

1. A circuit board assembly structure characterized in that: comprises an upper cover, a circuit board, a lower shell and a plurality of locking screws; the upper cover is provided with a connecting lug, the surface of the lower shell is provided with a stud, the stud is provided with a threaded hole, and a connecting hole is formed in the position of the circuit board corresponding to the stud; the stud penetrates through the connecting hole of the circuit board, and the locking screw penetrates through the connecting lug and is screwed into the threaded hole of the stud.
2. A circuit board mounting structure according to claim 1, wherein: the upper cover includes the mainboard and sets up the curb plate of mainboard both sides, the curb plate is provided with the engaging lug.
3. A circuit board mounting structure according to claim 2, wherein: the both ends of curb plate all are provided with the engaging lug.
4. A circuit board mounting structure according to claim 2 or 3, wherein: the connecting lug on each side plate extends towards the other side plate.
5. A circuit board mounting structure according to claim 1, wherein: the inner wall of the upper cover is provided with a boss, and the boss is located above the circuit board and tightly presses the circuit board.
6. A circuit board mounting structure according to claim 5, wherein: the inner wall of the upper cover is symmetrically provided with two bosses.
7. A circuit board mounting structure according to claim 5, wherein: the boss surface is an arc surface.
8. A circuit board mounting structure according to claim 1, wherein: the surface of the lower shell is provided with four studs.
9. A circuit board mounting structure according to claim 1, wherein: still include heat conduction silica gel pad, heat conduction silica gel pad sets up the circuit board with between the inferior valve.
10. A circuit board mounting structure according to claim 1, wherein: and a convex ring is arranged at the top of the stud and surrounds the threaded hole.
CN202021979384.3U 2020-09-10 2020-09-10 Circuit board assembly structure Active CN213186960U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202021979384.3U CN213186960U (en) 2020-09-10 2020-09-10 Circuit board assembly structure

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202021979384.3U CN213186960U (en) 2020-09-10 2020-09-10 Circuit board assembly structure

Publications (1)

Publication Number Publication Date
CN213186960U true CN213186960U (en) 2021-05-11

Family

ID=75772762

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202021979384.3U Active CN213186960U (en) 2020-09-10 2020-09-10 Circuit board assembly structure

Country Status (1)

Country Link
CN (1) CN213186960U (en)

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