JPH0581874U - Dot matrix light emitting display device - Google Patents

Dot matrix light emitting display device

Info

Publication number
JPH0581874U
JPH0581874U JP2802592U JP2802592U JPH0581874U JP H0581874 U JPH0581874 U JP H0581874U JP 2802592 U JP2802592 U JP 2802592U JP 2802592 U JP2802592 U JP 2802592U JP H0581874 U JPH0581874 U JP H0581874U
Authority
JP
Japan
Prior art keywords
light emitting
emitting display
dot matrix
heat
display device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2802592U
Other languages
Japanese (ja)
Inventor
昭治 武市
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Takiron Co Ltd
Original Assignee
Takiron Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Takiron Co Ltd filed Critical Takiron Co Ltd
Priority to JP2802592U priority Critical patent/JPH0581874U/en
Publication of JPH0581874U publication Critical patent/JPH0581874U/en
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805Shape
    • H01L2224/4809Loop shape
    • H01L2224/48091Arched

Abstract

(57)【要約】 【目的】 ドットマトリクス発光表示体3の発熱を効率
よく放出できるドットマトリクス発光表示体装置を提供
することを目的としている。 【構成】 表面側の縦横にn×n個の発光ドット2が形
成されたドットマトリクス発光表示体3と、該発光表示
体3の裏面側略全面に密着された断面略コ字状の熱伝導
性の良好な熱伝導体4と、該熱伝導体4の裏面側に上記
発光表示体3と接続されてそれぞれの発光ドット2を選
択的に点灯制御するための制御部5や各電子部品6など
が搭載された駆動回路基板7を密着させて構成する。
(57) [Abstract] [Purpose] An object of the present invention is to provide a dot matrix light emitting display device capable of efficiently releasing heat generated by the dot matrix light emitting display body 3. [Structure] A dot matrix light emitting display body 3 in which n × n light emitting dots 2 are formed vertically and horizontally on the front surface side, and heat conduction having a substantially U-shaped cross section that is adhered to substantially the entire back surface side of the light emitting display material 3. Of good heat conductivity, and a control unit 5 and electronic components 6 connected to the light emitting display 3 on the back surface side of the heat conductor 4 for selectively lighting and controlling the respective light emitting dots 2. The drive circuit board 7 on which components such as the above are mounted is closely attached.

Description

【考案の詳細な説明】[Detailed description of the device]

【0001】[0001]

【産業上の利用分野】[Industrial applications]

本考案は、LED発光素子等を用いたドットマトリックス発光表示体装置に関 する。 The present invention relates to a dot matrix light emitting display device using an LED light emitting element or the like.

【0002】[0002]

【従来の技術】[Prior Art]

ドットマトリクス発光表示体102としては、例えば、図6に示すように、配 線基板110の上面に多数の透孔100を縦横に形成したマスク板111を配置 し、該マスク板111の各透孔100内に上記配線基板110に配設配線された 少なくとも1個のLED発光素子(不図示)を収容して個々の発光ドット101 をマトリクス状に形成したドットマトリクス発光表示体102と、該発光表示体 102の各発光ドット101を点灯制御するための制御部103や各種の電子部 品106を搭載した駆動回路基板104とをスペーサ107を介在させて空気の 循環を考慮し、電極ピン105によって接続したものがある。 As the dot matrix light emitting display 102, for example, as shown in FIG. 6, a mask plate 111 having a large number of through holes 100 formed vertically and horizontally is arranged on the upper surface of a wiring board 110, and each through hole of the mask plate 111 is arranged. A dot matrix light emitting display body 102 in which at least one LED light emitting element (not shown) arranged and wired in the wiring board 110 is housed in 100 to form individual light emitting dots 101 in a matrix, and the light emitting display. A control unit 103 for controlling lighting of each light emitting dot 101 of the body 102 and a drive circuit board 104 on which various electronic components 106 are mounted are connected by an electrode pin 105 in consideration of air circulation through a spacer 107. There is something I did.

【0003】 そして、このドットマトリクス発光表示体102は、例えば、図7示すように 、発光表示体Aを取付用スタッド108を介してそれぞれ支持板120に固定し 、例えば、上下面に通気孔123を穿孔した金属製筐体121に収容してCPU 等で構成される表示コントローラ122と個々の発光表示体Aを接続し、この筐 体121を建物の壁面や室内の壁面等に設置して横列に並ぶドットマトリクス発 光表示体装置として使用するのが一般的であった。このような発光表示装置Aは 、前記表示コントローラ122のプログラムに従った点灯制御により、各発光表 示体102のそれぞれの発光ドット101を選択的に点灯制御し、ドットパター ンで構成される所望の文字、図形、記号等を発光表示するようになっている。In this dot matrix light emitting display body 102, for example, as shown in FIG. 7, the light emitting display body A is fixed to a support plate 120 via mounting studs 108, and, for example, ventilation holes 123 are formed on the upper and lower surfaces. The display controller 122 including a CPU and the like is housed in a perforated metal casing 121, and the individual light emitting display bodies A are connected to each other. The casing 121 is installed on a wall surface of a building or an indoor wall surface and the like. It was generally used as a dot-matrix light-emitting display device lined up with. Such a light-emitting display device A is configured to be a dot pattern by selectively controlling the light-emitting dots 101 of each light-emitting display body 102 by performing lighting control according to a program of the display controller 122. The characters, figures, symbols, etc. are displayed in a light emitting manner.

【0004】 そして、このドットマトリクス発光表示体Aでは発光表示時に、発光表示体1 02の各発光ドット101のそれぞれのLED発光素子の点灯や、駆動回路基板 104に搭載された電子部品106の内部発熱等によって筐体121の内部温度 が上昇して空気に対流を生じ、筐体121の下面に穿孔された通気孔123を通 って冷たい外気が流れこみ、スペーサ107によって発光表示体102と駆動回 路基板104との間に形成された隙間を循環して温度が高められてから、筐体1 21の上面に穿孔された各通気孔123から暖かい空気が放出されて筐体121 内を冷却するといった自然の空気の流れによる冷却が行われていた。In the dot-matrix light-emitting display A, at the time of light-emitting display, each LED light-emitting element of each light-emitting dot 101 of the light-emitting display 102 is turned on, and inside the electronic component 106 mounted on the drive circuit board 104. The internal temperature of the casing 121 rises due to heat generation and the like to generate convection in the air, and cold outside air flows in through the ventilation holes 123 formed in the lower surface of the casing 121, and the spacer 107 drives the light emitting display body 102 and the light emitting display body 102. After the temperature is raised by circulating through the gap formed between the circuit board 104 and the circuit board 104, warm air is released from each ventilation hole 123 formed in the upper surface of the housing 121 to cool the inside of the housing 121. It was cooled by the natural air flow.

【0005】[0005]

【考案が解決しようとする課題】[Problems to be solved by the device]

しかしながら上記したようにドットマトリクス発光表示体装置Aでは、筐体1 21内の温度上昇を緩和するために自然の空気対流を起こさせて外気と換気して いるため、発光表示体102と駆動回路基板104との間に隙間を形成する必要 があり、大型化が余儀なくされ、筐体121が大きくなって重量が嵩むとコスト アップはもちろん、どうしても筐体121内部の温度は外気温度よりかなり高い 状態になるといった問題があった。 However, as described above, in the dot matrix light emitting display device A, since natural air convection is caused to ventilate the outside air in order to mitigate the temperature rise in the housing 121, the light emitting display device 102 and the drive circuit. Since it is necessary to form a gap with the substrate 104, the size must be increased, and the case 121 becomes larger and heavier, which not only increases the cost, but the temperature inside the case 121 is inevitably higher than the outside air temperature. There was a problem that became.

【0006】 また、自然の空気対流ではなく、電動ファン等によって筐体121内を強制換 気してもよいが、これでも表示体装置に電動ファン等の装置を別途取り付けるス ペースが必要となり、大型化するといった問題がある。しかも、外気中のほこり 等が筐体121内部に侵入付着するといった問題もあった。Further, instead of natural air convection, the inside of the housing 121 may be forcibly replaced by an electric fan or the like, but this also requires a space for separately attaching a device such as an electric fan to the display device, There is a problem that it becomes larger. In addition, there is also a problem that dust and the like in the outside air enters and adheres inside the housing 121.

【0007】 このように、筐体内部の温度が上昇すると、各発光表示体102のそれぞれの 発光ドット101内に配線配設されたLED発光素子の温度がより高められ、輝 度低下などの電気的特性に悪影響を及ぼし、かつ寿命の低下等の問題を生じる虞 があった。As described above, when the temperature inside the housing rises, the temperature of the LED light emitting element arranged in the light emitting dot 101 of each light emitting display body 102 is further raised, and the electric power such as the decrease in brightness is generated. There is a possibility that the physical characteristics may be adversely affected and that problems such as shortening of life may occur.

【0008】[0008]

【課題を解決するための手段】[Means for Solving the Problems]

上記課題を解決するために本考案のドットマトリクス発光表示体装置は、配線 基板上に多数個のLED発光素子を配設配線して縦横に複数の発光ドットを形成 してなるドットマトリクス発光表示体の裏面側を熱伝導性の良好な熱伝導体に密 着一体に取り付けると共に、該熱伝導体の裏面側に前記発光表示体の各発光ドッ トを選択点灯駆動させるための駆動回路基板を密着させることを特徴とする。 In order to solve the above problems, a dot matrix light emitting display device of the present invention is a dot matrix light emitting display device in which a plurality of LED light emitting elements are arranged and wired on a wiring substrate to form a plurality of light emitting dots in vertical and horizontal directions. The back side of the light-emitting device is closely attached to a heat conductor having good heat conductivity, and a drive circuit board for selectively driving each light-emitting dot of the light-emitting display is closely attached to the back face of the heat conductor. It is characterized in that

【0009】[0009]

【作用】[Action]

上記構成のドットマトリクス発光表示体装置では、駆動回路基板と接続される ドットマトリクス発光表示体の複数の発光ドット内に配設配線された各LED発 光素子を選択的に点灯制御してドットパターンで構成される所望の文字、図形、 記号等を発光表示すると、点灯したLED発光素子の発熱によってドットマトリ クス発光表示体の温度が上昇するが、この熱は該発光表示体の裏面側に密着され た熱伝導性の良好な熱伝導体に伝導し、この熱伝導により熱を外部に放出する。 一方、駆動回路基板に搭載される各発光ドットを選択点灯駆動させるための電子 部品等の自己発熱も前記同様に密着された熱伝導体に伝導し、従って、発光表示 体の各LED発光素子などの温度上昇による電気的特性や寿命特性等への悪影響 が防止緩和されるなどして、信頼性の向上したドットマトリクス発光表示体装置 となる。 In the dot matrix light emitting display device having the above configuration, each LED light emitting element arranged and wired in the plurality of light emitting dots of the dot matrix light emitting display connected to the drive circuit board is selectively turned on to control the dot pattern. When a desired character, figure, symbol, etc. composed of is displayed by light emission, the temperature of the dot matrix light emitting display body rises due to the heat generated by the light emitting LED light emitting element. This heat adheres to the back side of the light emitting display body. It conducts to the heat conductor having good heat conductivity, and the heat is released to the outside by this heat conduction. On the other hand, the self-heating of the electronic components for selectively lighting each light-emitting dot mounted on the drive circuit board is also conducted to the closely-bonded heat conductor as described above, and therefore each LED light-emitting element of the light-emitting display or the like. The dot-matrix light-emitting display device is improved in reliability by preventing and mitigating the adverse effects on the electrical characteristics and life characteristics due to the temperature rise.

【0010】[0010]

【実施例】【Example】

以下、図面を参照して本考案の一実施例を説明する。 An embodiment of the present invention will be described below with reference to the drawings.

【0011】 図1は本考案の一実施例に係るドットマトリクス発光表示体装置を一部破断し て示す分解斜視図であり、図2は同実施例の使用状態を示す概略縦断面図である 。本考案のドットマトリクス発光表示体装置1は、図に示すように、表面側の縦 横にn×n個の発光ドット2が形成されたドットマトリクス発光表示体3と、該 発光表示体3の裏面側略全面に密着され、断面略コ字状に折曲加工が施された熱 伝導性の良好の熱伝導体4と、該熱伝導体4の裏面側に密着される上記発光表示 体3の各発光ドット2を選択的に点灯制御するための制御部5や各電子部品6な どが搭載された駆動回路基板7とによって構成される。FIG. 1 is a partially broken exploded perspective view showing a dot matrix light emitting display device according to an embodiment of the present invention, and FIG. 2 is a schematic vertical sectional view showing a usage state of the same embodiment. .. As shown in the figure, the dot matrix light emitting display device 1 of the present invention includes a dot matrix light emitting display body 3 in which n × n light emitting dots 2 are formed vertically and horizontally on the surface side, and a light emitting display body 3 of the dot matrix light emitting display body 3. A heat conductor 4 having good thermal conductivity, which is adhered to substantially the entire back surface side and is bent into a substantially U-shaped cross section, and the light emitting display 3 which is adhered to the back surface side of the heat conductor 4. The control unit 5 for selectively controlling the lighting of each of the light emitting dots 2 and the drive circuit board 7 on which the electronic components 6 are mounted.

【0012】 上記ドットマトリクス発光表示体3は、図3に示すように、配線基板31をガ ラスエポキシ樹脂や紙フェノール等を基材とした銅張積層板にエッチング加工等 により、表面側に縦にn本の導電パターン32a(例えばXパターン郡)を形成 すると共に、裏面側に横のn本の導電パターン32b(例えばYパターン郡)を 形成してある。そして、裏面の導電パターン32bをスルーホール33を介して 各発光ドット2ごとに基板31表面に導出し、その上に高輝度のLED発光素子 34を銀ペースト等で固定すると共に、ボンディングワイヤ35で基板表面の他 方の導電パターン32aと接続し、n×nのX−Yマトリックス点灯表示回路が 構成されている。更に、配線基板31には、各LED発光素子34に対応して擂 鉢状の透孔36を縦横にn×n個形成したマスク板37が接合一体となっており 、透孔性樹脂38で各透孔36内のLED発光素子34を封止し、個々の発光ド ット2を形成している。上記マスク板37は、隣接する発光ドットへの光の漏れ 防止や視認性を改善するためのもので、表面を黒色ないし灰色系の光無反射面と する一方、透孔36の内周面を白色系の光反射面としたものが一般的である。そ して、配線基板31の裏面側には各発光ドット2に対応するX−Yマトリクス点 灯表示回路の各電極ピン39がそれぞれ突出されている。これらの電極ピン39 の突出位置としては図示した位置に限らず適宜設計変更可能であり、図示した位 置に限定されるものではない。As shown in FIG. 3, the dot-matrix light-emitting display 3 has a wiring board 31 which is vertically arranged on the front surface side by etching a copper clad laminate using glass epoxy resin, paper phenol, etc. as a base material. N conductive patterns 32a (for example, X pattern group) are formed on the same side, and lateral n conductive patterns 32b (for example, Y pattern group) are formed on the back surface side. Then, the conductive pattern 32b on the back surface is led out to the surface of the substrate 31 for each light emitting dot 2 through the through hole 33, and the LED light emitting element 34 of high brightness is fixed thereon with silver paste or the like, and the bonding wire 35 is used. By connecting to the other conductive pattern 32a on the surface of the substrate, an n × n XY matrix lighting display circuit is constructed. Further, the wiring board 31 is integrally joined with a mask plate 37 in which n × n mortar-shaped through holes 36 are formed vertically and horizontally corresponding to each LED light emitting element 34. The LED light emitting element 34 in each through hole 36 is sealed to form each light emitting dot 2. The mask plate 37 is for preventing light from leaking to adjacent light emitting dots and improving visibility. The surface of the mask plate 37 is a black or gray light non-reflective surface, and the inner peripheral surface of the through hole 36 is A white light-reflecting surface is generally used. Then, each electrode pin 39 of the XY matrix lighting display circuit corresponding to each light emitting dot 2 is projected on the back surface side of the wiring board 31. The projecting positions of these electrode pins 39 are not limited to the positions shown in the figure, and the design can be changed as appropriate, and are not limited to the positions shown in the figure.

【0013】 ドットマトリクス発光表示体3の裏面側略全面に密着される上記熱伝導体4は 、例えば、鉄,銅,アルミニウム等の金属系の熱伝導率が0.1cal/cm・ s・℃以上の熱伝導性の良好なもので、横断面略コ字状の型材又は帯状の板体の 折曲加工品である。表面部41には、前記ドットマトリクス発光表示体3の裏面 から突出される各電極ピン39の導出位置と対応して4箇所に長孔状開口部42 が穿孔されている。この開口部42は図示したものに限らず各電極ピン39にそ れぞれ対応した孔(電極ピンと電気絶縁が保持できる最小限のもの)であっても よいことはいうまでもない。そして、この熱伝導体4の上下縁43,44を例え ば、熱伝導性の良好なの鉄,銅,アルミニウム等で上記熱伝導体4と略同一のコ 字状に折曲加工される金属製筐体8の上下縁81,82に重ね合わせて取り付け ることにより密閉された容器が構成されている。The thermal conductor 4 adhered to substantially the entire back surface side of the dot matrix light emitting display 3 has a thermal conductivity of, for example, a metal system such as iron, copper or aluminum having a thermal conductivity of 0.1 cal / cm · s · ° C. It has good thermal conductivity as described above, and is a bent product of a mold material or a strip-shaped plate having a substantially U-shaped cross section. The front surface portion 41 is provided with four long hole-shaped openings 42 at four positions corresponding to the lead-out positions of the electrode pins 39 protruding from the back surface of the dot matrix light emitting display body 3. It is needless to say that the opening 42 is not limited to the one shown in the figure and may be a hole corresponding to each electrode pin 39 (minimum hole capable of holding electrical insulation with the electrode pin). For example, the upper and lower edges 43 and 44 of the heat conductor 4 are made of metal having good heat conductivity, such as iron, copper, and aluminum, which are bent into a substantially U-shape similar to the heat conductor 4. A hermetically sealed container is formed by stacking and mounting the upper and lower edges 81, 82 of the housing 8.

【0014】 上記熱伝導体4の裏面側、即ち内面45側に密着される駆動回路基板7は、ガ ラスエポキシ樹脂等を基材とする多層プリント基板の表面上に上記ドットマトリ クス発光表示体3の各発光ドット3を構成するそれぞれLED発光素子34の点 灯・消灯を駆動制御するための制御部5や各種の電子部品6が搭載されて駆動回 路構成がなされると共に、上記発光表示体3の裏面に突出する各電極ピン39が 挿通されて駆動回路と接続されるピン挿通孔71がそれぞれ穿孔されている。こ の上記発光表示体3と駆動回路基板7とが各電極ピン39を介して電気的に接続 されることにより点灯駆動できる。そして、例えば、密閉容器内に収納されるC PU等で構成された表示コントローラ9等と制御部5とを接続して所望の文字・ 図形等の点灯制御がなされる。The drive circuit board 7 closely attached to the back surface side of the heat conductor 4, that is, the inner surface 45 side is the dot matrix light emitting display member on the surface of a multilayer printed board having a glass epoxy resin or the like as a base material. The control unit 5 for driving and controlling the lighting and extinguishing of the LED light emitting elements 34 constituting the respective light emitting dots 3 of No. 3 and various electronic components 6 are mounted to form a drive circuit, and the above-mentioned light emitting display is provided. Each of the electrode pins 39 projecting on the back surface of the body 3 is inserted to form a pin insertion hole 71 that is connected to the drive circuit. The light-emitting display 3 and the drive circuit board 7 are electrically connected via the electrode pins 39, so that lighting can be driven. Then, for example, the display controller 9 or the like configured by a CPU or the like housed in a closed container and the control unit 5 are connected to perform lighting control of desired characters and figures.

【0015】 上記構成のドットマトリクス発光表示体装置1は、ドットマトリクス発光表示 体3の各電極ピン39を熱伝導体4に接触させることなく(電気絶縁状態であれ ばよい)4ヶ所の長孔状開口部42内に挿通すると共に、裏面側を熱伝導体4の 表面部41に例えば、熱伝導性を有する接着剤等で接合して密着一体とする。一 方、駆動回路基板7も例えば、熱伝導性を有する接着剤等で熱伝導体4の内面4 5に接合し、駆動回路基板7の各ピン挿通孔71に対応する発光表示体1の裏面 側に突出する電極ピン39を挿着して接続すると共に、制御部5とCPU等で構 成される表示コントローラ9と接続する。そして、熱伝導体4の裏側に筐体8を 配置し、それぞれの上下縁43,81と44,82とを重ね合わせて取り付ける ことにより密閉容器を形成したものとなる。The dot-matrix light-emitting display device 1 having the above-described configuration has four long holes without contacting the electrode pins 39 of the dot-matrix light-emitting display 3 with the heat conductors 4 (which may be in an electrically insulated state). While being inserted into the circular opening 42, the back surface side is joined to the front surface portion 41 of the heat conductor 4 with, for example, an adhesive having heat conductivity so as to be closely integrated. On the other hand, the drive circuit board 7 is also bonded to the inner surface 45 of the heat conductor 4 with, for example, an adhesive having heat conductivity, and the rear surface of the light emitting display body 1 corresponding to each pin insertion hole 71 of the drive circuit board 7. The electrode pin 39 protruding to the side is inserted and connected, and at the same time, it is connected to the display controller 9 including a control unit 5 and a CPU. Then, the housing 8 is arranged on the back side of the heat conductor 4 and the upper and lower edges 43, 81 and 44, 82 are overlapped and attached to form a hermetically sealed container.

【0016】 上記構成のドットマトリクス発光表示体装置1では、例えば、図2に示すよう に、建物の壁面等に図示していない止具等で直接取り付けて使用できるようにな り、表示コントローラ10のプログラムに従って発光表示体3のそれぞれの発光 ドット2内のLED発光素子34を選択的に点灯制御してドットパターンで構成 される所望の文字、図形、記号等を表示できるようになる。尚、この場合、上記 発光表示体3は防水構造であり、かつ、駆動回路基板7は熱伝導体4によって防 水遮断される構成となっているため屋外に設置できる。このとき、点灯する発光 素子34は発熱するので発光表示体3自体の温度が上昇するが、この熱は、熱伝 導性の良好な熱伝導体4に伝導し、該熱伝導体4の外気と接触している部分や固 定されている筐体8に伝ってその表面から周囲の外気中に放熱されるようになる 。さらに、この場合は発光表示板3の表面から直接外気中への放熱も加わる。そ のため、発光表示体3自体の温度上昇が緩和され、各発光ドット2内に配設され るLED発光素子34の昇温による輝度低下などの電気的特性への悪影響や寿命 低下などの心配が大幅に緩和される。また、各発光ドット2を点灯させるための 駆動回路基板7上の各電子部品6自体が動作して発熱しても、この熱は駆動回路 基板7を介して発光表示体3と同様に熱伝導体4に伝導し、従って、駆動回路基 板7に発生した熱も外部に放熱され、熱伝導体4と筐体8で形成される容器内の 温度上昇も緩和され、制御部5や各電子部品6等への電気的特性に与える悪影響 が緩和される。In the dot-matrix light-emitting display device 1 having the above-described configuration, for example, as shown in FIG. 2, the device can be directly attached to a wall surface of a building by a fastener or the like not shown, and the display controller 10 can be used. According to the program, the LED light emitting elements 34 in the respective light emitting dots 2 of the light emitting display body 3 are selectively controlled to be turned on so that a desired character, figure, symbol or the like formed of a dot pattern can be displayed. In this case, since the light emitting display body 3 has a waterproof structure and the drive circuit board 7 has a structure in which the heat conductor 4 is used to block water, it can be installed outdoors. At this time, since the light-emitting element 34 that is turned on generates heat, the temperature of the light-emitting display body 3 itself rises, but this heat is conducted to the heat conductor 4 having good heat conductivity, and the outside air of the heat conductor 4 is transmitted. The heat is transmitted to the portion in contact with the casing 8 or the fixed casing 8 and is radiated from the surface to the ambient air. Further, in this case, heat is also radiated directly from the surface of the light emitting display plate 3 to the outside air. Therefore, the temperature rise of the light emitting display 3 itself is moderated, and there is a concern that the temperature rise of the LED light emitting elements 34 arranged in each light emitting dot 2 may adversely affect the electrical characteristics such as the brightness decrease and the life of the LED light emitting element 34. Is significantly eased. Further, even if each electronic component 6 itself on the drive circuit board 7 for lighting each light emitting dot 2 operates and generates heat, this heat is thermally conducted through the drive circuit board 7 similarly to the light emitting display body 3. Therefore, the heat generated in the drive circuit board 7 is also radiated to the outside and the temperature rise in the container formed by the heat conductor 4 and the housing 8 is alleviated. The adverse effect on the electrical characteristics of the component 6 etc. is mitigated.

【0017】 また、このドットマトリクス発光表示体装置1では熱伝導体4と筐体8で密閉 した容器を構成して内部に発熱する電子部品6を搭載した駆動回路基板7を配置 しているが、上記したように容器内部の温度が上昇し難くなるので、密閉容器に よる防水や防塵や防爆対応等に有効であり、しかも、従来の発光表示体Aと比べ ると筐体全体の容積がほぼ半減した発光表示装置1となり、直接壁面等への取付 けが容易となってコスト的も有利となる。また、筐体8と熱伝導体4を一体形成 として、しかも合理的な放熱作用を奏する発光表示体装置1aとなっている。In addition, in this dot matrix light emitting display device 1, the heat conductor 4 and the casing 8 constitute a sealed container, and the drive circuit board 7 on which the electronic component 6 that generates heat is mounted is arranged. As described above, the temperature inside the container is less likely to rise, so it is effective for waterproofing, dustproofing, and explosion-proofing with a sealed container, and moreover, the volume of the entire housing is smaller than that of the conventional light emitting display A. The light emitting display device 1 is almost halved, and it is easy to mount directly on the wall surface and the like, which is advantageous in terms of cost. The housing 8 and the heat conductor 4 are integrally formed, and the light emitting display device 1a has a reasonable heat dissipation effect.

【0018】 図4は他の実施例に係るドットマトリクス発光表示体装置1aの使用状態を示 す概略縦断面図である。この発光表示板装置1aは、ドットマトリクス発光表示 体3の裏面側が密着一体となる熱伝導板4aの上下縁43a,44aが表面側に 折曲されて金属製筐体8aの内部に収容配置され、かつ、発光表示体3の表面に 透光性アクリル樹脂等の板でフィルターの役目をする表面保護板10が配置され た点を除き、上記ドットマトリクス発光表示体装置1と実質的に同一の構成とな っている。FIG. 4 is a schematic vertical sectional view showing a usage state of a dot matrix light emitting display device 1a according to another embodiment. In this light emitting display plate device 1a, the upper and lower edges 43a and 44a of the heat conducting plate 4a, which is in close contact with the back surface side of the dot matrix light emitting display body 3, are bent to the front surface side and housed inside the metal casing 8a. The dot matrix light emitting display device 1 is substantially the same as the dot matrix light emitting display device 1 except that the surface protection plate 10 serving as a filter is arranged on the surface of the light emitting display body 3 by a plate of translucent acrylic resin or the like. It is composed.

【0019】 熱伝導体4aが収容される金属製筐体8aは、図4に示すように、前方側が開 口した箱状を呈しており、前面上下縁81,82aと上記熱伝導板4aの上下縁 43a,44aとの間に表面保護板10が挟持固定されるようになっている。As shown in FIG. 4, the metal casing 8a in which the heat conductor 4a is housed has a box shape with the front side opened, and the front and lower edges 81, 82a and the heat conduction plate 4a are formed. The surface protection plate 10 is sandwiched and fixed between the upper and lower edges 43a and 44a.

【0020】 このような発光表示体装置1aであっても熱伝導体4aと筐体8aで密閉した 容器が構成されるが、発光素子34の点灯によって生じる発光表示体3の熱は、 同様に、熱伝導性の良好な熱伝導体4aに伝導し、上記筐体8と比べて表面積の 広い筐体8aの表面から周囲の外気中に直接放熱されるようになると共に、駆動 回路基板7に発生する熱もこの熱伝導体4aを介して筐体8aに伝導されて周囲 の外気中に直接放熱され、筐体8a内の温度上昇が緩和される。従って、発光表 示体3の各発光ドット2内に配設されるLED発光素子34の昇温による輝度低 下などの電気的特性への悪影響や寿命低下などの心配が緩和され、熱伝導体4a と筐体8aで形成される容器内の温度上昇も緩和されて制御部5や各電子部品6 への熱の影響が及び難くなり、信頼性の高い発光表示体装置1aとなる。また、 このドットマトリクス発光表示体装置1aも密閉容器となって防水や防塵や防爆 対応等に特に有効であり、筐体8aの容積もほぼ半減し、コスト的にも有利とな る。Even in such a light emitting display device 1a, a container closed by the heat conductor 4a and the housing 8a is formed, but the heat of the light emitting display device 3 generated by lighting the light emitting element 34 is similarly generated. The heat is conducted to the heat conductor 4a having good heat conductivity, and the heat is dissipated directly from the surface of the casing 8a having a larger surface area than that of the casing 8 into the ambient air. The generated heat is also conducted to the housing 8a through the heat conductor 4a and is radiated directly into the surrounding outside air, and the temperature rise in the housing 8a is moderated. Therefore, it is possible to mitigate the adverse effects on the electrical characteristics such as a decrease in brightness due to the temperature rise of the LED light emitting elements 34 arranged in each light emitting dot 2 of the light emitting display body 3 and the fear of shortening the life. The temperature rise in the container formed by 4a and the housing 8a is also moderated, and the influence of heat on the control unit 5 and each electronic component 6 is less likely to occur, resulting in a highly reliable light emitting display device 1a. Further, the dot matrix light emitting display device 1a also serves as an airtight container, which is particularly effective for waterproofing, dustproofing, and explosion proofing, and the volume of the housing 8a is almost halved, which is advantageous in terms of cost.

【0021】 尚、上記ドットマトリクス発光表示体装置1,1aはいずれも単独で使用する 場合より、図5に示すように、例えば、複数枚の発光表示板3を横列に一列に並 べてそれぞれの発光表示体3を熱伝導体4,4aに密着一体に取り付けると共に 、対応する駆動回路基板7もそれぞれ密着一体に取り付けて配線接続し、表示コ ントローラ10のプログラムに従って各発光表示体3のそれぞれの発光ドット2 内のLED発光素子34を選択的に点灯制御してドットパターンで構成される所 望の文字、図形、記号等を流れ表示できるようになる。It should be noted that, as shown in FIG. 5, for example, a plurality of light emitting display plates 3 are arranged in a row and in a row, respectively, as compared with the case where each of the dot matrix light emitting display devices 1 and 1a is used alone. The light-emitting display 3 is attached to the heat conductors 4 and 4a in close contact with each other, and the corresponding drive circuit boards 7 are also attached in close contact to each other and connected by wiring, and each light-emitting display 3 is connected in accordance with the program of the display controller 10. It becomes possible to selectively display and control the LED light-emitting elements 34 in the light-emitting dots 2 to display desired characters, figures, symbols and the like, which are formed in a dot pattern, in a flowing manner.

【0022】 また、各発光表示体3と熱伝導板4,4a、及び熱伝導板4,4aと駆動回路 基板7とを熱伝導性を有する接着剤等にて密着一体に接合しているが、このとき 、熱伝導性の良好な例えば、シリコーンゴム等のゴム弾性体層又は熱伝導性ペー スト層を介在させて密着接合すると、各発光表示体3、熱伝導板4,4a、駆動 回路基板7のそれぞれの熱膨張係数が異なることによって生じる熱応力などによ る歪みが、介在されるゴム弾性体層又はペースト層によって吸収緩和され、各発 光表示体3や駆動回路基板7を変形させる心配もなくなるので好ましい。尚、こ の場合は接着剤に限るものでなくビス等によってもよい事は云うまでもない。Further, the light emitting display bodies 3 and the heat conduction plates 4 and 4a, and the heat conduction plates 4 and 4a and the drive circuit board 7 are closely joined together by an adhesive agent having heat conductivity. At this time, if a rubber elastic body layer having good thermal conductivity, such as a silicone rubber layer, or a thermally conductive paste layer is placed in close contact with each other, each light emitting display body 3, the heat conductive plates 4, 4a, the drive circuit. Distortion due to thermal stress or the like caused by the different thermal expansion coefficients of the substrate 7 is absorbed and relaxed by the rubber elastic body layer or paste layer interposed, and the respective light emitting display bodies 3 and the drive circuit board 7 are deformed. It is preferable because there is no need to worry. In this case, needless to say, it is not limited to the adhesive and may be a screw or the like.

【0023】 尚、何れの場合も熱伝導体としては熱伝導率の高い材料で且つ熱伝導断面積が 大きいもの程、熱伝導量が増大し好ましいことは云うまでもない。例えば、上記 したように、熱伝導率が0.1cal/cm・s・℃以上の金属系材料で、その 厚みは2mm以上となるのが効果的である。In any case, it goes without saying that a material having a high heat conductivity and a large heat conduction cross-sectional area is preferable as the heat conductor, because the heat conduction amount increases. For example, as described above, it is effective that the metallic material has a thermal conductivity of 0.1 cal / cm · s · ° C. or more and the thickness thereof is 2 mm or more.

【0024】[0024]

【考案の効果】[Effect of the device]

以上の説明から明かなように、本考案のドットマトリクス発光表示体装置では 、LED発光素子の点灯による発熱でドットマトリクス発光表示体の温度が高め られると、熱伝導性の良好な熱伝導体に伝導されると共に、駆動回路基板に搭載 される各電子部品の発熱による熱も密着された熱伝導体に伝導されて直接外気中 に放熱されるようになり、発光表示体の温度上昇によるLED発光素子等の電気 的特性等への影響が防止され、信頼性の高いドットマトリクス発光表示体装置と なるといった効果を奏する。 As is clear from the above description, in the dot matrix light emitting display device of the present invention, when the temperature of the dot matrix light emitting display is raised by the heat generated by the lighting of the LED light emitting element, it becomes a heat conductor having good thermal conductivity. In addition to being conducted, the heat generated by each electronic component mounted on the drive circuit board is also conducted to the closely attached heat conductor and is radiated directly to the outside air. The effect on the electric characteristics of the elements and the like is prevented, and the dot matrix light emitting display device with high reliability is obtained.

【図面の簡単な説明】[Brief description of drawings]

【図1】本考案の一実施例に係るドットマトリクス発光
表示体装置を一部破断して示す概略斜視図である。
FIG. 1 is a partially cutaway schematic perspective view of a dot matrix light emitting display device according to an embodiment of the present invention.

【図2】同実施例の発光表示体装置の使用状態を示す概
略断面図である。
FIG. 2 is a schematic cross-sectional view showing a usage state of the light emitting display device of the embodiment.

【図3】図1のA−A線に沿った上記実施例の概略横断
面図である。
3 is a schematic cross-sectional view of the above embodiment taken along the line AA of FIG.

【図4】本考案の他の実施例に係るドットマトリクス発
光表示体装置の使用状態を示す概略断面図である。
FIG. 4 is a schematic cross-sectional view showing a usage state of a dot matrix light emitting display device according to another embodiment of the present invention.

【図5】本考案のドットマトリクス発光表示体装置の他
の使用状態を示す概略正面図である。
FIG. 5 is a schematic front view showing another usage state of the dot matrix light emitting display device of the present invention.

【図6】従来のドットマトリクス発光表示体モジュール
の概略斜視図。
FIG. 6 is a schematic perspective view of a conventional dot matrix light emitting display module.

【図7】図6の従来例の概略平面図。7 is a schematic plan view of the conventional example of FIG.

【符号の説明】[Explanation of symbols]

1,1a ドットマトリクス発光表示体装置 2 発光ドット 3 ドットマトリクス発光表示体 31 配線基板 34 LED発光素子 4 熱伝導体 7 駆動回路基板 1, 1a Dot matrix light emitting display device 2 Light emitting dot 3 Dot matrix light emitting display 31 Wiring board 34 LED light emitting element 4 Thermal conductor 7 Driving circuit board

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 【請求項1】配線基板上に多数個のLED発光素子を配
設配線して縦横に複数の発光ドットを形成してなるドッ
トマトリクス発光表示体の裏面側を熱伝導性の良好な熱
伝導体に密着一体に取り付けると共に、該熱伝導体の裏
面側に前記発光表示体の各発光ドットを選択点灯駆動さ
せるための駆動回路基板を密着させてなるドットマトリ
クス発光表示体装置。
1. A heat conductor having good heat conductivity on the back surface side of a dot matrix light emitting display body in which a large number of LED light emitting elements are arranged and wired on a wiring board to form a plurality of light emitting dots vertically and horizontally. A dot matrix light emitting display device in which a driving circuit board for selectively lighting each light emitting dot of the light emitting display is closely attached to the back surface of the heat conductor.
JP2802592U 1992-03-31 1992-03-31 Dot matrix light emitting display device Pending JPH0581874U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2802592U JPH0581874U (en) 1992-03-31 1992-03-31 Dot matrix light emitting display device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2802592U JPH0581874U (en) 1992-03-31 1992-03-31 Dot matrix light emitting display device

Publications (1)

Publication Number Publication Date
JPH0581874U true JPH0581874U (en) 1993-11-05

Family

ID=12237213

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2802592U Pending JPH0581874U (en) 1992-03-31 1992-03-31 Dot matrix light emitting display device

Country Status (1)

Country Link
JP (1) JPH0581874U (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006018175A (en) * 2004-07-05 2006-01-19 Nec Lcd Technologies Ltd Display device
JP2010244726A (en) * 2009-04-01 2010-10-28 Koito Mfg Co Ltd Vehicle head lamp
JP2011097047A (en) * 2009-10-29 2011-05-12 Foxsemicon Integrated Technology Inc Illumination device
US8207908B2 (en) 2005-08-12 2012-06-26 Semiconductor Energy Laboratory Co., Ltd. Display module, and cellular phone and electronic device provided with display module
JP2012525612A (en) * 2009-05-01 2012-10-22 ビルボード ビデオ,インク. Electronic display panel

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006018175A (en) * 2004-07-05 2006-01-19 Nec Lcd Technologies Ltd Display device
JP4701642B2 (en) * 2004-07-05 2011-06-15 日本電気株式会社 Display device
US8207908B2 (en) 2005-08-12 2012-06-26 Semiconductor Energy Laboratory Co., Ltd. Display module, and cellular phone and electronic device provided with display module
US8957833B2 (en) 2005-08-12 2015-02-17 Semiconductor Energy Laboratory Co., Ltd. Display module, and cellular phone and electronic device provided with display module
JP2010244726A (en) * 2009-04-01 2010-10-28 Koito Mfg Co Ltd Vehicle head lamp
JP2012525612A (en) * 2009-05-01 2012-10-22 ビルボード ビデオ,インク. Electronic display panel
JP2011097047A (en) * 2009-10-29 2011-05-12 Foxsemicon Integrated Technology Inc Illumination device

Similar Documents

Publication Publication Date Title
KR100385296B1 (en) Plasma display device and its manufacturing method
US7315049B2 (en) LED assembly with vented circuit board
JP3713088B2 (en) Display device
KR200438525Y1 (en) Cooling device for led light source using non-conductive liquid
JP5374166B2 (en) Thin panel display
JP2005331945A (en) Plasma display display
JPH0416468Y2 (en)
JP3232389B2 (en) Dot matrix light emitting display with shading louver
JP2004126151A (en) Display device
KR20070113068A (en) Heat-dissipating backlighting module for use in a flat panel display
JPH0581874U (en) Dot matrix light emitting display device
KR20100081699A (en) Light source, light emitting module and backlight assembly having the same
JPH08234684A (en) Dot matrix light emitting display with light shielding louver
JP4927679B2 (en) Electric equipment and circuit board cooling method
JP2009147258A (en) Led package and light-emitting module
JPH0850458A (en) Light emitting display device
JPH0555181U (en) Dot matrix light emitting display module
JPH10123981A (en) Light emitting display of led dot matrix system
KR20080067893A (en) Waterproof type led module
JPH0339819Y2 (en)
JP2007179834A (en) Light source device
CN210429161U (en) Waterproof LED display module
JPH0732684U (en) LED display
CN216817728U (en) LED display device
JP5649408B2 (en) Display device

Legal Events

Date Code Title Description
A02 Decision of refusal

Free format text: JAPANESE INTERMEDIATE CODE: A02

Effective date: 19980818