JP2008270688A - Electric and electronic module for motor vehicle - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an electric and electronic module having high sealing (waterproofing) reliability without causing resin leakage in resin sealing even when there is variation in the thickness of a metal base, and to provide a method for manufacturing it. <P>SOLUTION: The electric and electronic module is provided by integrally sealing a circuit board 5 which is mounted with a component and the metal base 1 to which the circuit board 5 is fixed, with a sealing resin. When seal-molding by molten resin, a following member deformed by mold clamping force is arranged between the part where the metal base 1 is clamped by a molding die and the molding die. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention relates to an electric / electronic module, and more particularly to a housing structure for resin-sealing an electronic circuit board of an in-vehicle electric / electronic module, and a metal base thereof.

  As an electric / electronic module such as a microcomputer, there is an electric / electronic module in which a circuit board on which various components are mounted and a metal base for mounting are resin-sealed (for example, Patent Document 1).

  As shown in FIG. 20, the resin sealing of such an electric / electronic module is performed by setting the metal base 110 and the circuit board 120 on the lower mold 100, and clamping the lower mold 100 and the upper mold 101. And filling the cavity 102 defined by the above with a molten resin for sealing.

JP 2006-190726 A

  In the resin sealing of the electric / electronic module, as shown in FIGS. 14 and 15, the cavity defining portion 103 of the upper mold 101 is in direct surface contact with the flat portion 111 of the metal base 110. There may be a mold structure that must ensure the sealing of the cavity 102.

  In the case of such a mold structure, as shown in FIG. 16, if the variation (size tolerance) in the thickness t of the portion where the metal base 110 is clamped by the cavity defining portion 103 of the upper die 101 is large. A gap L is generated between the metal base 110 and the cavity defining portion 103 of the upper mold 101.

  In such a state, when the cavity 102 is filled with the molten resin M and sealed with resin, as shown in FIG. 17, a resin leak d occurs, and the amount of filled resin in the cavity 102 correspondingly. Is insufficient, so that a resin unfilled portion m is formed. Further, since the molding pressure is not sufficiently applied to the molten resin M in the cavity 102, many bubbles a as shown in FIG. 18 may remain in the molded sealing resin. As a result, the sealing performance (waterproof performance) is hindered, the degree of occurrence of defective products is increased, and the yield is deteriorated.

  For this, a measure to increase the thickness accuracy of the mold clamping portion of the metal base 110 can be considered, but in actual parts manufacturing, there is a problem that an increase in processing steps and cost increase occur, Adopting measures is difficult.

  The present invention has been made in view of the problems to be solved, and the object of the present invention is to prevent resin leakage in resin sealing even if the thickness of the metal base varies. An object of the present invention is to provide an electrical / electronic module with high sealing (waterproof) reliability and a method for manufacturing the same.

  To achieve the above object, an electrical and electronic module according to the present invention is an electrical and electronic module in which a circuit board on which components are mounted and a metal base to which the circuit board is mounted are integrally sealed with a sealing resin. A follow-up member that is deformed by a clamping force is disposed between a portion where the metal base is clamped to the molding die and the molding die during sealing molding with a molten resin.

  In order to achieve the above object, a method of manufacturing an electric / electronic module according to the present invention includes an electric / electronic module in which a circuit board on which components are mounted and a metal base to which the circuit board is attached are integrally sealed with sealing resin. A follow-up member that is deformed by a clamping force is disposed between a portion where the metal base is clamped to the molding die and the molding die during sealing molding with a molten resin. The follow-up member is crushed by a tightening force to improve the sealing property of the cavity of the sealing resin molding.

  According to the electrical and electronic module of the present invention, the metal base mold is provided between the portion where the metal base is clamped to the molding die and the molding die, and the follow-up member is deformed by the clamping force. Even when there is variation in the thickness of the tightening portion, the gap between the metal base and the resin molding die can be eliminated during resin molding, and reliable sealing (waterproofing) can be achieved. In addition, a processing step for increasing the accuracy of the height (thickness) of the mold clamping part is not required, which facilitates manufacturing and reduces component costs.

  An embodiment of an electric and electronic module according to the present invention will be described with reference to the drawings.

  FIGS. 1A to 1E are five-sided views showing the external appearance of the electric and electronic module according to the present embodiment, and FIG. 2 is a cross-sectional view taken along the line A-A ′ of FIG.

The electrical and electronic module 20 according to the present embodiment includes a metal base 1, a connector assembled with metal terminals 3, a circuit board 5 on which an electronic component (not shown) is mounted and mounted, and a sealing resin 4. The metal base 1 has an ear piece portion 9 for mounting a module. On the left side of the metal base 1 in FIG. 2, there is a frame portion 1 b that forms an opening for attaching the connector 2. The assembly of the connector 2 to the frame portion 1b is performed with screws 6 or an adhesive. When the connector 2 is assembled to the metal base 1, the metal terminal 3 is accommodated inside the rising portion 1 a continuous with the frame portion 1 b of the metal base 1.

  The circuit board 5 is mounted on the metal base 1 and fixed to the metal base 1 with screws or the like not shown. When the circuit board 5 is fixed to the metal base 1, the conductor member of the circuit board 5 and the metal terminal 3 are simultaneously conductively connected by soldering or the like.

  Hereinafter, the assembly as described above is referred to as a module sub-assembly 10 and means an assembly before sealing with the sealing resin 4. The module sub-assembly 10 sealed with the sealing resin 4 is the electric / electronic module 20 of the present embodiment.

Next, an example of a transfer mold forming method for manufacturing the above-described electric and electronic module of the present embodiment will be described with reference to FIGS.
(1) As shown in FIGS. 3A and 3B, the lower mold 30 and the upper mold 40 are dug in advance in a desired sealing resin shape for outer shape molding. Heated to 180 ° C. The module subassembly 10 is set in the lower mold 30, and at the same time, the molded resin tablet T that is in a solid state at normal temperature is loaded in the pot 31. Here, if the module sub-assembly 10 is preheated at a predetermined temperature in advance, the cycle time can be shortened.
(2) As shown in FIG. 3C, the mold is clamped with a force of several tens of tons.
(3) As shown in FIG. 4D, the plunger 32 is pushed up at an arbitrary speed. Thereby, the molten sealing resin, that is, the molten resin M is injected into the mold cavity 50.
(4) As shown in FIG. 4E, when the mold resin 50 is filled with the molten resin M, a molding pressure of about several tens of kgf / cm ² is applied, and about 3 minutes. Hold that state.
(5) Then, as shown in FIG. 4 (f), the mold is opened.
(6) After the mold is opened, as shown in FIG. 5G, the mold is taken out from the mold from the module sub-assembly 10 to which the sealing resin 4 formed by solidifying the molten resin M is applied.
(7) As shown in FIG. 5 (h), an extra portion of the sealing resin called Cull C is finally removed to complete the electric / electronic module 20.

  In such a transfer mold forming method, in the step (2), the metal base 1 is clamped with a force of several tens of tons to form a sealed space (cavity 50) filled with the molten resin M for the sealing resin. Forming.

  As shown in FIG. 6, the electric / electronic module 20 of the present embodiment has a following member (seal member) on the mold clamping portion 1 </ b> A in which the metal base 1 corresponds to the cavity defining portion 41 of the upper die (molding die) 40. ) 7 is arranged.

  The follow-up member 7 is made of a rubber-like elastic material, such as a rubber packing material, which is elastically deformed to show hermeticity and has high heat resistance equal to or higher than the mold temperature at the time of molding (for example, 180 ° C. or higher). . The follower member 7 is crushed by the clamping force when the sealed space (cavity 50) is obtained.

  Thereby, even if the thickness of the metal base 1 varies, no gap is generated in the mold clamping portion, the space filled with the sealing resin is sealed, and no resin leakage occurs. That is, the follow-up member 7 is crushed by the mold clamping force, and the sealing performance of the cavity 50 for sealing resin molding is enhanced.

  Thereby, even if the thickness of the metal base 1 varies, sufficient sealing (waterproof) performance can be obtained, the degree of occurrence of defective products is reduced, and the yield is improved.

  The follow-up member 7 can be improved in molding stability by being provided on the entire periphery of the clamping portion.

  In addition, a processing step for increasing the accuracy of the height (thickness) of the mold clamping part is not required, which facilitates manufacturing and reduces component costs.

  The crushing amount of the follow-up member 7 at the time of mold clamping is preferably equal to or greater than the thickness variation (dimensional tolerance) of the mold clamping part 1A of the metal base 1.

  As described above, resin leakage does not occur in resin sealing, and an electric / electronic module with high sealing (waterproof) reliability can be obtained stably.

  As shown in FIG. 7, the follower member 7 is a concave groove 8 formed in the clamping part 1A of the metal base 1, or a cavity defining part 41 of the upper mold 40 as shown in FIG. It can be fitted and fitted in a concave groove 42 formed on the front end surface of the. This fitting mounting stabilizes the arrangement position of the follow-up member 7 and facilitates assembly without shifting the position of the follow-up member 7 during assembling work and setting in a mold.

  When the concave groove 8 is provided in the metal base 1, the follower member 7 is assembled in the concave groove 8 in a state of a resin-sealed assembly (module sub-assembly 20). When the concave groove 42 is provided in the cavity defining portion 41 of the upper mold 40, the follower member 7 is assembled to the concave groove 42 of the upper mold 40 before resin sealing.

  The follow-up member 7 is not a separate part made of a rubber-like elastic material, but may be constituted by a crushing protrusion 11 formed integrally with the mold clamping portion 1A of the metal base 1, as shown in FIG. The protrusion 11 is crushed by the upper mold 40 during mold clamping to obtain a sealed space filled with the molten resin.

  As a result, there is no gap in the mold clamping part, the space filled with the sealing resin is sealed, the moldability is stable, and the resin leakage does not occur, so that sufficient sealing (waterproof) performance can be obtained. it can.

  The height dimension of the crushing protrusion 11 formed on the metal base 1 is, for example, about 0.1 mm to 1 mm. It is preferable that the crushing amount of the crushing protrusion 11 at the time of mold clamping be equal to or greater than the thickness variation (dimensional tolerance) of the mold clamping part 1A of the metal base 1. For example, it is about 0.05 mm to 0.3 mm.

  As shown in FIG. 10, the crushing protrusion 11 is provided on the entire periphery of the mold clamping portion. Even when the crushing amount of the crushing protrusions 11 formed on the metal base 1 is not uniform (a sufficient crushing amount cannot be partially obtained), as shown in FIG. The protrusion heights H1 and H2 of the crushing protrusion 11 are formed at different heights in a portion where the amount of crushing is insufficient and a portion where the amount of crushing is sufficient, or as shown in FIG. 12, the protrusion width W1 By forming W2 with different widths, the amount of crushing can be made uniform.

  The follower member 7 and the crushing protrusion 11 may be provided so as to partially include a defective portion as shown in FIG. 13 instead of the entire circumference of the mold clamping portion. In this case, the non-formed part 19 is formed. As a result, a minute gap is generated between the non-formed part 19 and the upper mold 40 at the time of clamping, and an air vent (in the space filled with resin at the time of molding ( Hereinafter, it is referred to as air vent).

  That is, the follower member 7 and the crushing protrusion 11 are not formed on the entire circumference of the mold clamping part, but are partially (partially) formed with the non-formed part 19 to intentionally provide an air vent function. It is set as the structure provided in.

BRIEF DESCRIPTION OF THE DRAWINGS (a)-(e) is the front view, top view, back view, side view, and bottom view which show one Embodiment of the electric and electronic module by this invention. A-A 'expanded sectional view of Drawing 1 (e). (A)-(c) is a figure which shows the process of the transfer mold molding of the electric and electronic module of this embodiment. (D)-(f) is a figure which shows the process of the transfer mold molding of the electric and electronic module of this embodiment. (G), (h) is a figure which shows the process of the transfer mold molding of the electrical / electronic module of this embodiment. The expanded sectional view of the principal part of the electric and electronic module of this embodiment. The expanded sectional view of the important section of one embodiment of the electric and electronic module by the present invention. The expanded sectional view of the principal part of other embodiment of the electric and electronic module by this invention. The expanded sectional view of the principal part of other embodiment of the electric and electronic module by this invention. The top view of one embodiment of the electrical and electronic module by this invention. D-D 'expanded sectional view of FIG. D-D 'expanded sectional view of FIG. The top view of other embodiment of the electric and electronic module by this invention. Sectional drawing at the time of resin molding of the electric / electronic module (at the time of mold clamping). The expanded sectional view of the principal part at the time of resin molding of the electric and electronic module (at the time of mold clamping). The expanded sectional view which shows the clearance gap generation | occurrence | production of the contact part of a metal base and a metal mold | die. The expanded sectional view which shows resin leak. The expanded sectional view which shows resin leak.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Metal base 1A Clamping part 2 Connector 3 Metal terminal 4 Sealing resin 5 Circuit board 6 Screw 7 Follow-up member 8 Groove 9 Ear piece part 10 Module sub-assembly 11 Crushing protrusion 20 Electric and electronic module 30 Lower mold 40 Upper mold 41 Cavity defining part 42 Concave groove 50 Cavity

Claims (8)

An electrical and electronic module that integrally seals a circuit board on which components are mounted and a metal base to which the circuit board is mounted with a sealing resin,
An electrical and electronic device characterized in that a follow-up member that is deformed by a clamping force is disposed between a portion where the metal base is clamped to a molding die and the molding die during sealing molding with a molten resin. module.   The electrical and electronic module according to claim 1, wherein the follower member is configured as a separate part from the metal base, and a groove for mounting the follower member is formed in the metal base. .   2. The electric and electronic device according to claim 1, wherein the follower member is configured as a separate part from the metal base, and a groove for mounting the follower member is formed in the molding die. module.   The electrical and electronic module according to claim 1, wherein the follow-up member is configured by a protrusion integrally formed on the metal base.   5. The electrical and electronic module according to claim 1, wherein the follower member is partially different in height.   The electric and electronic module according to any one of claims 1 to 5, wherein the following member has a partially different width.   The electric and electronic module according to any one of claims 1 to 6, wherein the follow-up member is arranged so as to include a defective portion around the entire clamping portion. A method of manufacturing an electric and electronic module in which a circuit board on which components are mounted and a metal base to which the circuit board is attached are integrally sealed with a sealing resin,
At the time of sealing molding with a molten resin, a tracking member that is deformed by a clamping force is disposed between a portion where the metal base is clamped to the molding die and the molding die, and the tracking member is placed by the clamping force. A method for manufacturing an electric and electronic module, characterized by enhancing the sealing property of a cavity of crushing and sealing resin molding.

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