EP2511063A4 - Resin sealing apparatus and resin sealing method - Google Patents

Resin sealing apparatus and resin sealing method Download PDF

Info

Publication number
EP2511063A4
EP2511063A4 EP10835939.9A EP10835939A EP2511063A4 EP 2511063 A4 EP2511063 A4 EP 2511063A4 EP 10835939 A EP10835939 A EP 10835939A EP 2511063 A4 EP2511063 A4 EP 2511063A4
Authority
EP
European Patent Office
Prior art keywords
resin sealing
sealing method
sealing apparatus
resin
sealing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
EP10835939.9A
Other languages
German (de)
French (fr)
Other versions
EP2511063A1 (en
EP2511063B1 (en
Inventor
Takafumi Uratani
Shin Takeuchi
Masanori Shirasawa
Koichi Takahashi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Towa Corp
Original Assignee
Towa Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Towa Corp filed Critical Towa Corp
Publication of EP2511063A1 publication Critical patent/EP2511063A1/en
Publication of EP2511063A4 publication Critical patent/EP2511063A4/en
Application granted granted Critical
Publication of EP2511063B1 publication Critical patent/EP2511063B1/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14639Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components
    • B29C45/14655Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components connected to or mounted on a carrier, e.g. lead frame
    • B29C45/1468Plants therefor
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14065Positioning or centering articles in the mould
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17Component parts, details or accessories; Auxiliary operations
    • B29C45/72Heating or cooling
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14065Positioning or centering articles in the mould
    • B29C2045/14131Positioning or centering articles in the mould using positioning or centering means forming part of the insert
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C2045/1486Details, accessories and auxiliary operations
    • B29C2045/14868Pretreatment of the insert, e.g. etching, cleaning
    • B29C2045/14877Pretreatment of the insert, e.g. etching, cleaning preheating or precooling the insert for non-deforming purposes
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/02Transfer moulding, i.e. transferring the required volume of moulding material by a plunger from a "shot" cavity into a mould cavity
EP10835939.9A 2009-12-07 2010-12-06 Resin-sealing apparatus and resin-sealing method Active EP2511063B1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2009277808A JP5334821B2 (en) 2009-12-07 2009-12-07 Resin sealing device and resin sealing method
PCT/JP2010/071842 WO2011071019A1 (en) 2009-12-07 2010-12-06 Resin sealing apparatus and resin sealing method

Publications (3)

Publication Number Publication Date
EP2511063A1 EP2511063A1 (en) 2012-10-17
EP2511063A4 true EP2511063A4 (en) 2017-09-20
EP2511063B1 EP2511063B1 (en) 2018-11-28

Family

ID=44145564

Family Applications (1)

Application Number Title Priority Date Filing Date
EP10835939.9A Active EP2511063B1 (en) 2009-12-07 2010-12-06 Resin-sealing apparatus and resin-sealing method

Country Status (3)

Country Link
EP (1) EP2511063B1 (en)
JP (1) JP5334821B2 (en)
WO (1) WO2011071019A1 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5774538B2 (en) * 2012-04-11 2015-09-09 Towa株式会社 Resin sealing device and resin sealing method

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07321137A (en) * 1994-05-19 1995-12-08 Towa Kk Resin sealed molding method of electronic part
JP2008270688A (en) * 2007-04-25 2008-11-06 Hitachi Ltd Electric and electronic module for motor vehicle

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3811244B2 (en) * 1997-01-31 2006-08-16 Towa株式会社 Mold for resin sealing molding of electronic parts
JP2007243146A (en) 2006-02-09 2007-09-20 Sharp Corp Manufacturing method and apparatus for semiconductor device
JP2007281366A (en) * 2006-04-11 2007-10-25 Towa Corp Resin sealing molding apparatus for electronic component
JP4518128B2 (en) * 2007-10-01 2010-08-04 株式会社デンソー Electronic circuit device manufacturing method and electronic circuit device

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07321137A (en) * 1994-05-19 1995-12-08 Towa Kk Resin sealed molding method of electronic part
JP2008270688A (en) * 2007-04-25 2008-11-06 Hitachi Ltd Electric and electronic module for motor vehicle

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See also references of WO2011071019A1 *

Also Published As

Publication number Publication date
EP2511063A1 (en) 2012-10-17
JP2011116084A (en) 2011-06-16
WO2011071019A1 (en) 2011-06-16
JP5334821B2 (en) 2013-11-06
EP2511063B1 (en) 2018-11-28

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