EP2511063A4 - Resin sealing apparatus and resin sealing method - Google Patents
Resin sealing apparatus and resin sealing method Download PDFInfo
- Publication number
- EP2511063A4 EP2511063A4 EP10835939.9A EP10835939A EP2511063A4 EP 2511063 A4 EP2511063 A4 EP 2511063A4 EP 10835939 A EP10835939 A EP 10835939A EP 2511063 A4 EP2511063 A4 EP 2511063A4
- Authority
- EP
- European Patent Office
- Prior art keywords
- resin sealing
- sealing method
- sealing apparatus
- resin
- sealing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000011347 resin Substances 0.000 title 2
- 229920005989 resin Polymers 0.000 title 2
- 238000007789 sealing Methods 0.000 title 2
- 238000000034 method Methods 0.000 title 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
- B29C45/14639—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components
- B29C45/14655—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components connected to or mounted on a carrier, e.g. lead frame
- B29C45/1468—Plants therefor
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
- B29C45/14065—Positioning or centering articles in the mould
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/17—Component parts, details or accessories; Auxiliary operations
- B29C45/72—Heating or cooling
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
- B29C45/14065—Positioning or centering articles in the mould
- B29C2045/14131—Positioning or centering articles in the mould using positioning or centering means forming part of the insert
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
- B29C2045/1486—Details, accessories and auxiliary operations
- B29C2045/14868—Pretreatment of the insert, e.g. etching, cleaning
- B29C2045/14877—Pretreatment of the insert, e.g. etching, cleaning preheating or precooling the insert for non-deforming purposes
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/02—Transfer moulding, i.e. transferring the required volume of moulding material by a plunger from a "shot" cavity into a mould cavity
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2009277808A JP5334821B2 (en) | 2009-12-07 | 2009-12-07 | Resin sealing device and resin sealing method |
PCT/JP2010/071842 WO2011071019A1 (en) | 2009-12-07 | 2010-12-06 | Resin sealing apparatus and resin sealing method |
Publications (3)
Publication Number | Publication Date |
---|---|
EP2511063A1 EP2511063A1 (en) | 2012-10-17 |
EP2511063A4 true EP2511063A4 (en) | 2017-09-20 |
EP2511063B1 EP2511063B1 (en) | 2018-11-28 |
Family
ID=44145564
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP10835939.9A Active EP2511063B1 (en) | 2009-12-07 | 2010-12-06 | Resin-sealing apparatus and resin-sealing method |
Country Status (3)
Country | Link |
---|---|
EP (1) | EP2511063B1 (en) |
JP (1) | JP5334821B2 (en) |
WO (1) | WO2011071019A1 (en) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5774538B2 (en) * | 2012-04-11 | 2015-09-09 | Towa株式会社 | Resin sealing device and resin sealing method |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH07321137A (en) * | 1994-05-19 | 1995-12-08 | Towa Kk | Resin sealed molding method of electronic part |
JP2008270688A (en) * | 2007-04-25 | 2008-11-06 | Hitachi Ltd | Electric and electronic module for motor vehicle |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3811244B2 (en) * | 1997-01-31 | 2006-08-16 | Towa株式会社 | Mold for resin sealing molding of electronic parts |
JP2007243146A (en) | 2006-02-09 | 2007-09-20 | Sharp Corp | Manufacturing method and apparatus for semiconductor device |
JP2007281366A (en) * | 2006-04-11 | 2007-10-25 | Towa Corp | Resin sealing molding apparatus for electronic component |
JP4518128B2 (en) * | 2007-10-01 | 2010-08-04 | 株式会社デンソー | Electronic circuit device manufacturing method and electronic circuit device |
-
2009
- 2009-12-07 JP JP2009277808A patent/JP5334821B2/en active Active
-
2010
- 2010-12-06 EP EP10835939.9A patent/EP2511063B1/en active Active
- 2010-12-06 WO PCT/JP2010/071842 patent/WO2011071019A1/en active Application Filing
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH07321137A (en) * | 1994-05-19 | 1995-12-08 | Towa Kk | Resin sealed molding method of electronic part |
JP2008270688A (en) * | 2007-04-25 | 2008-11-06 | Hitachi Ltd | Electric and electronic module for motor vehicle |
Non-Patent Citations (1)
Title |
---|
See also references of WO2011071019A1 * |
Also Published As
Publication number | Publication date |
---|---|
EP2511063A1 (en) | 2012-10-17 |
JP2011116084A (en) | 2011-06-16 |
WO2011071019A1 (en) | 2011-06-16 |
JP5334821B2 (en) | 2013-11-06 |
EP2511063B1 (en) | 2018-11-28 |
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