JP3073162B2 - Electronic equipment housing - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention is to prevent electromagnetic waves generated inside an electronic device such as a notebook type personal computer or a word processor from leaking to the outside, and to reduce the frame ground of a substrate as a constituent member. The present invention relates to a housing for an electronic device configured to be secured through a boss protruding inside the housing.

[0002]

2. Description of the Related Art The components of an electronic device such as a portable personal computer can be reduced in weight by applying an injection molding technique of a thermoplastic resin material, and a component having a relatively complicated shape can be easily molded. It is becoming. However,
There is a problem that electromagnetic waves generated inside the device leak to the outside. In other words, in the case of a casing made of a metal plate, while the casing itself has a shielding function,
In the case of a resin molded product which is an insulating material, it is necessary to provide a separate shield means.

Conventionally, to provide a housing made of a resin material with a shielding function, a conductive material such as a metal filler is contained in the resin material constituting the housing, or a conductive material is provided inside or on the surface of the housing. Means for providing a shielding material made of a material can be considered. In this case, the means for including the conductive material in the resin material not only requires extra work for preparing the raw material, but also lowers the fluidity of the molten resin material during injection molding, and particularly reduces the wall thickness. Such a molded product has a disadvantage that the molding operation is complicated and the molding yield is deteriorated. On the other hand, the means of providing a separate shield material on the housing has the drawbacks of increasing the number of parts and complicating the manufacture, and hindering the weight reduction of the housing.

As means for integrally forming a shielding material made of a conductive material on the inner surface of the housing, means such as plating, vapor deposition, or thermal spraying is often used. However, according to such means, although there is an advantage that a shield material having a uniform thickness can be formed on the inner surface of the housing, the thickness of the shield material is relatively small, and the forming step and the plating vapor deposition step are performed. However, there is a disadvantage that the time and man-hours required for forming a shield material having a predetermined thickness are increased by performing the process by another manufacturer.

[0005] In order to solve the above-mentioned drawbacks, means for bonding and fixing a metal foil to a predetermined portion of a housing via an adhesive have been attempted. According to this means, it is possible to provide a shield material thicker than that obtained by plating, vapor deposition, thermal spraying or the like.

Next, in order to secure the frame ground of the board constituting the electronic device, it is necessary to electrically connect the shield material provided inside the housing and the board as described above. In this case, the most common means is to provide a terminal member on both terminals and connect the terminal members with a lead wire.

[0007]

However, when the above-mentioned metal foil is bonded to the housing, it is necessary to apply an adhesive to the housing or the metal foil in advance, and the adhesive is uniformly applied to a predetermined location. Is difficult, the operation requires skill, and when the surface to which the adhesive is applied is complicated, a large number of steps and time are required. In addition, heating of, for example, 200 ° C. or more is required for curing the adhesive, and there are restrictions on the resin constituting the adhesive.

If the shape of the housing is complicated, the metal foil may be partially damaged or may not be completely adhered to the housing, and it is necessary to perform secondary processing of the protruding portion of the adhesive. is there. Further, as in the case of the plating or thermal spraying, since the bonding operation of the metal foil is performed in a step different from the molding step of the housing, a work between the steps is required, and the production cost increases. is there.

On the other hand, in the means for connecting the substrate and the metal foil serving as the shield material with a lead wire, the connection work with the thin metal foil is particularly complicated and extra work. It is also the cause of soaring.

The present invention solves the above-mentioned problems in the prior art, prevents leakage of electromagnetic waves to the outside, and forms a boss having a frame ground of a substrate, which is a component member of an electronic device, protruding therein. It is an object of the present invention to provide a housing for an electronic device configured to be secured through the electronic device.

[0011]

In order to solve the above-mentioned problems, in the present invention, a sheet-shaped shielding material made of a conductive material is integrally transferred to an inner peripheral surface of a housing made of a resin material. An electronic device housing configured to electrically connect an upper end of a boss protruding from a part of the inner peripheral surface to the shield material, the housing being made of a conductive elastic material.
Ri, and having an end portion exposed to at least a portion of the upper end surface of the boss, and the leg portion in contact with the shield member, and a plurality of connecting portions for connecting together the said end portion and the leg portion,
An earth member with the connecting part formed radially outside the end ,
The technical means of integrally forming with the boss was adopted.

[0012]

[0013]

FIG. 1 is a perspective view of a main part showing an embodiment of the present invention. In FIG. 1, reference numeral 1 denotes a housing, which is made of a thermoplastic resin material and is formed into a box shape by, for example, injection molding means. Reference numeral 2 denotes a shielding material, which is formed of a conductive material such as copper or a copper alloy into a foil shape or a sheet shape having a thickness of, for example, 30 to 50 μm, and is formed on the inner surface of the housing 1 by an in-mold It is transferred integrally by transfer. Next, reference numeral 3 denotes a boss, a plurality of which are integrally protruded from the inner surface of the housing 1, and a grounding member 4 formed as described later is integrally formed.

FIG. 2 is an enlarged longitudinal sectional view of the boss 3 in FIG. 1, FIG. 3 is an enlarged explanatory view showing the ground member 4 in FIGS. 1 and 2, (a) is a perspective view, and (b) is a longitudinal sectional view. The same parts are indicated by the same reference numerals as those in FIG. FIG.
In FIG. 3 and FIG. 3, the ground member 4 is made of a conductive material such as copper or copper alloy (having a thickness of, for example, 0.2 to 0.2).
(Formed into 0.3 mm), the end portion 41 (44 is a hole) exposed on the upper end surface of the boss 3, the leg portion 42, and the connecting portion 43 for integrally connecting the end portion 41 and the leg portion 42. Is done. The connecting portion 43 is provided radially outside the end portion 41. The leg 42 is buried in the housing 1 in contact with the shield member 2.

With the above structure, the substrate 5 is placed on the boss 3 as shown in FIG. 2, and the substrate 5 is fastened to the boss 3 by, for example, a tapping screw (not shown), so that the frame ground of the substrate 5 is formed. Can be secured. Electromagnetic waves generated inside the electronic device can be prevented from leaking to the outside by the shield member 2 provided in the housing 1.

FIGS. 4A and 4B are cross-sectional views showing a main part of the housing 1 in FIG. 1 showing a molding step.
(B) when closing the mold, (c) when opening the mold after molding, (d)
Denotes the time of mold release, and the same parts are denoted by the same reference numerals as in FIG. In FIG. 4, the boss 3 and the ground member 4 in FIG. 1 are not shown.

In FIG. 4, reference numerals 11 and 12 denote a fixed mold and a movable mold, respectively, which are attached to a fixed plate and a movable plate (neither is shown) of an injection molding machine via an attaching member. It is formed to be able to advance and retreat with respect to the fixed mold 11. As shown in FIG.
As shown in (b), when the divided surfaces 13 and 14 are brought into close contact with each other and the mold is closed, the concave and convex portions are formed so that a molding cavity 15 corresponding to the shape contour of the casing 1 which is a molded product is formed. Is provided.

Reference numeral 16 denotes an injection port, which is provided in the fixed mold 11 and is formed so as to communicate with the molding cavity 15. Reference numeral 17 denotes an injection nozzle, which is an injection port 1 of the fixed mold 11.
The thermoplastic resin material in a heated and melted state is formed so as to be capable of being injected and filled into the molding cavity 15 at a high pressure so as to be capable of engaging and disengaging with the molding cavity 15.

With the above configuration, first, as shown in FIG. 4 (a), in a state where the movable mold 12 is moved to the left and the mold is opened, the shield member 2 previously formed into a predetermined shape is attached to the movable mold 12. set. Next, as shown in FIG. 4B, the movable mold 12 is moved rightward to bring the divided surfaces 13 and 14 into close contact with each other to bring the mold closed. By closing the mold, the fixed mold 11
A molding cavity 15 is formed between the opposing surfaces of the mold and the movable mold 12. In this case, a suitable suction means is provided in the movable mold 12 so that the shielding material 2 is formed in the molding cavity 15 on the movable mold 12 side.
And may be temporarily fixed by being adsorbed on the surface of the substrate.

Next, referring to FIG.
When the thermoplastic resin material in a heated and melted state is injected and filled into the molding cavity 15 at a high pressure through the injection port 16, the shield material 2 is pressed against the movable mold 12 by the pressure of the thermoplastic resin material. Thus, a molded product obtained by integrally transferring the shield material 2 to the inner surface, that is, a casing can be molded. This state is maintained for a predetermined time, and the molding cavity 1
After the thermoplastic resin material in 5 has cooled and solidified, the movable mold 12 is moved to the left.

In the state where the mold is opened as shown in FIG. 4C, the casing 1 as a molded product is fixed to the molding cavity surface of the movable mold 12, The mold pin (not shown) is moved rightward and released from the movable mold 12 as shown in FIG. After taking out the casing 1 which is a molded product, the surfaces of the fixed mold 11 and the movable mold 12 are cleaned, a release agent is applied if necessary, and the above-described steps are repeated. As described above, the housing 1 in which the shield member 2 is integrally transferred and fixed to the inner surface can be formed.

FIG. 5 is a perspective view showing the main part of the movable mold 12 shown in FIG. In FIG. 5, reference numeral 18 denotes a concave hole.
And a cavity portion for forming the boss 3 in FIG.
Reference numeral 9 denotes a suction port, which is connected to a reduced pressure source (neither is shown) through a pipe.

With the above configuration, the movable mold 1 in the mold open state is provided.
2, the shield member 2 having the hole 20 provided at a position corresponding to the concave hole 18 (boss-formed cavity portion) as shown in FIG. 5B is set, and the suction port 19 shown in FIG.
To temporarily fix the shield member 2 to the movable mold 12.
Next, as shown in FIG. 5C, the ground member 4 is mounted in the hole 20 and the concave hole 18. In this case, since the ground member 4 is formed to have elasticity, the hole 20 and the concave hole 1 are formed.
8 is set with some elastic deformation, and the leg 42 is in contact with or close to the surface of the shield material 2. That is, the state shown in FIG. 3B is changed from the state shown in FIG.
The suction is provided by a suction port (not shown) provided in the apparatus, and is set in the state shown in FIG.

With the ground member 4 set as shown in FIG. 5 (c), the steps shown in FIGS. 4 (b) to 4 (d) are advanced to form the boss 3 as shown in FIG. At the same time, the ground member 4 has its end 41
The leg 42 is buried in the housing 1 in a state where the leg 42 is securely in contact with the shield material 2. Therefore, the frame ground of the substrate 5 can be secured.

FIGS. 6 and 7 are enlarged longitudinal sectional views of a main part showing a comparative example of the present invention, and the same parts are denoted by the same reference numerals as in FIG. 6 and 7, reference numeral 6 denotes an insert nut, which is provided in the boss 3 by integral molding or press-fitting. Reference numeral 7 denotes a coil spring, which is formed of a conductive material. Reference numeral 8 denotes an elastic member, which is formed to be elastically deformable, for example, by adding a conductive material such as a metal filler and a carbon filler to rubber.

With the above configuration, a coil spring 7 or an elastic member 8 is interposed between the insert nut 6 and the shield member 2 at the bottom of the boss 3 to electrically connect the insert nut 6 and the shield member 2. By doing so, if the substrate 5 is attached to the boss 3 via the screw 9, a frame ground of the substrate 5 can be secured.

However, since the insert nut 6 and the coil spring 7 or the elastic member 8 need to be inserted into the boss 3 in the case shown in FIG. 6 and FIG. It has the disadvantage of low reliability, and the one shown in FIGS. 1 and 2 is superior.

In the above embodiment, an example in which the shielding material is formed in a sheet shape, a plate shape, or a foil shape has been described, but in addition to the above, a mesh shape is formed by a fiber made of a metal material or another conductive material. Alternatively, it may be formed in a woven fabric shape. The shielding material formed in this manner is expandable and contractable in a direction along the surface, and has deformability and liquid permeability. Therefore, even if there are local irregularities, ribs, and the like in the molded case, the transfer material can be easily and reliably transferred and fixed to the inner and outer peripheral surfaces of the case without damaging the shield material and / or the heat sink. .

[0029]

Since the present invention has the above-described configuration and operation, it is possible to prevent the electromagnetic wave from leaking out of the housing for an electronic device to the outside and to secure the frame ground of the substrate. Further, since the shield member and the ground member can be integrally transferred or fixed simultaneously with the molding of the housing, there is an effect that the operation is easy and the manufacturing cost can be reduced.

[Brief description of the drawings]

FIG. 1 is a perspective view of a main part showing an embodiment of the present invention.

FIG. 2 is an enlarged longitudinal sectional view of a boss 3 in FIG.

FIGS. 3A and 3B are enlarged explanatory views showing a ground member 4 in FIGS. 1 and 2, wherein FIG. 3A is a perspective view and FIG.

FIGS. 4A and 4B are cross-sectional views of a main part showing a molding step of the housing 1 in FIG. 1, wherein FIG. 4A shows a state when the mold is opened, FIG. 4B shows a state when the mold is closed, and FIG. And (d) show the state at the time of mold release.

FIG. 5 is a perspective view of a main part showing a movable mold 12 in FIG. 4;

FIG. 6 is an enlarged longitudinal sectional view of a main part showing a comparative example of the present invention.

FIG. 7 is an enlarged longitudinal sectional view of a main part showing a comparative example of the present invention.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Housing 2 Shielding material 3 Boss 4 Earth member

──────────────────────────────────────────────────続 き Continuation of the front page (56) References JP-A-63-240100 (JP, A) JP-A-64-81399 (JP, A) JP-A-61-51996 (JP, A) 67400 (JP, U) Japanese Utility Model 7-18409 (JP, U) Japanese Utility Model 4-107896 (JP, U) Japanese Utility Model Utility Model 3-34285 (JP, U) (58) Fields surveyed (Int. ⁷ , DB name) H05K 9/00

Claims (1)

(57) [Claims] 1. A boss formed by integrally transferring a shielding material formed in a sheet shape from a conductive material to an inner peripheral surface of a housing made of a resin material and projecting from a part of the inner peripheral surface. and an upper end portion and the shield member provides an electronic equipment housing arrangement electrically connected, Ri Do a conductive elastic material, and an end portion exposed to at least a portion of the upper end surface of the boss, said shield And a plurality of connecting portions for integrally connecting the end portion and the leg portion, and the connecting portion is formed radially outward of the end portion.
A housing for an electronic device, wherein the formed ground member is formed integrally with the boss.