JPH06226776A - Manufacture of housing with electromagnetic wave shielding function - Google Patents
Manufacture of housing with electromagnetic wave shielding functionInfo
- Publication number
- JPH06226776A JPH06226776A JP1448093A JP1448093A JPH06226776A JP H06226776 A JPH06226776 A JP H06226776A JP 1448093 A JP1448093 A JP 1448093A JP 1448093 A JP1448093 A JP 1448093A JP H06226776 A JPH06226776 A JP H06226776A
- Authority
- JP
- Japan
- Prior art keywords
- housing
- molds
- mold
- gauze
- pair
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
- B29C45/14778—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles the article consisting of a material with particular properties, e.g. porous, brittle
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
- B29K2995/00—Properties of moulding materials, reinforcements, fillers, preformed parts or moulds
- B29K2995/0003—Properties of moulding materials, reinforcements, fillers, preformed parts or moulds having particular electrical or magnetic properties, e.g. piezoelectric
- B29K2995/0011—Electromagnetic wave shielding material
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Mechanical Engineering (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
Abstract
Description
【0001】[0001]
【産業上の利用分野】本発明は、電磁波障害を受け易い
電気電子機器、あるいは電磁波を発する電気電子機器を
収納して電磁波障害を防止するための電磁波シールド機
能をもつ筺体を製造する方法に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for housing an electric / electronic device susceptible to electromagnetic interference or an electric / electronic device that emits an electromagnetic wave and manufacturing a housing having an electromagnetic wave shielding function for preventing the electromagnetic interference.
【0002】[0002]
【従来の技術】電磁波障害を防止するための一般的な方
法としては、障害を受け易い物品あるいは電磁波を発す
る物品を、一定の電位に保たれた導体板で囲めばよい。
これにより導体板で囲まれた内部と外部を電磁的に遮蔽
することができる。普通の場合には導体板を使わなくと
も、銅やアルミニウムで形成された導電性の金網で囲め
ば、内部への電場の影響を充分に弱めることができる。2. Description of the Related Art As a general method for preventing electromagnetic interference, an article susceptible to interference or an article emitting electromagnetic waves may be surrounded by a conductor plate kept at a constant potential.
This makes it possible to electromagnetically shield the inside and the outside surrounded by the conductor plate. In the usual case, without using a conductor plate, it is possible to sufficiently weaken the influence of the electric field to the inside by surrounding it with a conductive wire mesh formed of copper or aluminum.
【0003】ところが単に金網で囲っただけでは、金網
を通して内部の物品が見えて意匠上好ましくないし、強
度的にも問題がある。そこで、金網を内部に埋設した筺
体を樹脂から形成し、その筺体内に物品を収納すること
が考えられている。例えば特開平4−113819号公
報には、筺体ではないが、電磁反射層を有するシートを
型内に配置して射出圧縮成形するパラボラアンテナの製
造方法が開示されている。However, if it is simply surrounded by a wire mesh, the article inside can be seen through the wire mesh, which is not preferable in terms of design and has a problem in strength. Therefore, it has been considered to form a housing in which a wire net is embedded from a resin and to store the article in the housing. For example, Japanese Patent Application Laid-Open No. 4-113819 discloses a manufacturing method of a parabolic antenna, which is not a housing, but has a sheet having an electromagnetic reflection layer arranged in a mold and injection compression molded.
【0004】[0004]
【発明が解決しようとする課題】箱状の筺体に障害を受
け易い物品あるいは電磁波を発する物品を収容する場
合、一対の箱状の筺体で密封容器を構成し、その中に収
容する方法が考えられる。しかしこの場合、それぞれの
筺体中の金網を同じ電位とする必要があり、一対の金網
をそれぞれ電気的に導通させなければならない。そのた
めには、箱状の筺体の縁部から金網の端部を外部へ延出
させ、その端部どうしを接続するのが最も便利である。When a box-shaped housing contains an article that is susceptible to damage or an article that emits electromagnetic waves, a method of forming a hermetically sealed container with a pair of box-shaped housings and housing it inside is considered. To be However, in this case, it is necessary to set the wire nets in the respective housings to the same potential, and the pair of wire nets must be electrically connected to each other. For that purpose, it is most convenient to extend the end of the wire netting from the edge of the box-shaped housing to the outside and connect the ends.
【0005】ところで、金網を一対の金型内に配置して
一体成形する場合、金網の端部に樹脂が付着しないよう
にするためには金型で金網の端部を挟持する方法があ
る。しかし金網は硬質であるために、図6に示すように
金網の厚さ(t)分の隙間が生じ、その部分に樹脂が浸
入してバリが発生し不良品となる恐れが大きい。また、
筺体内に収納された物品が発熱するような場合は、筺体
に通気孔を設けて放熱を容易とする必要がある。しかし
電磁波シールド機能を損なわないようにするためには、
通気孔にも金網を残す必要がある。この場合にも上記と
同様に通気孔部分で金網を挟持して成形する方法が考え
られるが、やはり金網の厚さ分の隙間から樹脂が浸入
し、バリが発生する恐れがある。By the way, when the wire nets are arranged in a pair of molds and integrally molded, there is a method of holding the end parts of the wire nets by the molds in order to prevent the resin from adhering to the end parts of the wire nets. However, since the wire mesh is hard, a gap corresponding to the thickness (t) of the wire mesh is formed as shown in FIG. 6, and resin is likely to penetrate into the gap to cause burrs, resulting in a defective product. Also,
When the articles housed in the housing generate heat, it is necessary to provide ventilation holes in the housing to facilitate heat dissipation. However, in order not to impair the electromagnetic shield function,
It is necessary to leave a wire mesh also in the ventilation hole. In this case as well, a method may be considered in which the wire mesh is sandwiched between the vent holes in the same manner as described above, but the resin may still enter through the gap corresponding to the thickness of the wire mesh, and burrs may occur.
【0006】上記のような不具合の発生の懸念があるた
め、従来は金網が延出した筺体を製造することは行われ
ず、導電性塗料による塗装や真空蒸着法で筺体表面にシ
ールド層を形成することで電磁波シールド機能を付与し
ている。この方法によれば、筺体どうしの導通は互いの
シールド層を密着させる構造で確保され、通気孔などの
シールド機能は別部品の金網を取付けることにより形成
することができる。しかしこれらの方法では、筺体の形
成と模様の形成が別工程となり、工数や原材料費が多大
となってコスト面で不具合がある。Because of the fear of occurrence of the above-mentioned problems, conventionally, a case in which a wire net is extended has not been manufactured, but a shield layer is formed on the surface of the case by coating with a conductive paint or a vacuum deposition method. The electromagnetic wave shielding function is given by that. According to this method, the conduction between the housings is ensured by the structure in which the shield layers are in close contact with each other, and the shielding function such as the ventilation hole can be formed by attaching a wire mesh which is a separate component. However, in these methods, the formation of the housing and the formation of the pattern are separate steps, and the man-hours and raw material costs are large, resulting in a cost problem.
【0007】本発明は上記事情に鑑みてなされたもので
あり、金網を一対の金型内に配置して筺体を一体成形す
るとともに、筺体の端部や通気孔などにバリの発生なく
金網を筺体の外部へ延出又は表出させることを目的とす
る。The present invention has been made in view of the above circumstances. The metal mesh is placed in a pair of molds to integrally mold the housing, and the metal mesh is formed without burrs at the ends of the housing and the vent holes. The purpose is to extend or expose to the outside of the housing.
【0008】[0008]
【課題を解決するための手段】上記課題を解決する本発
明の電磁波シールド機能をもつ筺体の製造方法は、筺状
の樹脂製本体と本体に埋設された金網とからなる電磁波
シールド機能をもつ筺体を、金網を一対の金型内に配置
して一体成形することにより製造する方法であって、前
記金網は局部的に一対の金型で挟持され、一対の金型の
金網を挟持する部分の少なくとも一方の表面は金網の材
質より軟質とされていることを特徴とする。A method of manufacturing an enclosure having an electromagnetic wave shielding function according to the present invention which solves the above-mentioned problems is an enclosure having an electromagnetic wave shielding function composed of a housing-shaped resin main body and a wire mesh embedded in the main body. Is a method of manufacturing by arranging a wire mesh in a pair of molds and integrally molding, wherein the wire mesh is locally clamped by a pair of molds, and a part of the portion that clamps the wire mesh of a pair of molds is At least one of the surfaces is softer than the material of the wire mesh.
【0009】[0009]
【作用】本発明の製造方法では、金網を挟持する部分の
一対の金型の少なくとも一方の表面は、金網の材質より
軟質とされている。したがって金網を挟持すると、その
軟質部分は金網で押圧されて変形し、金網はその軟質部
分に埋没する。したがって軟質部分は他方の型表面との
接触面積が増大するため、成形時の樹脂の浸入が防止さ
れバリの発生がなく外観品質が良好な筺体を形成するこ
とができる。In the manufacturing method of the present invention, at least one surface of the pair of molds for sandwiching the wire net is made softer than the material of the wire net. Therefore, when the wire net is clamped, the soft part is pressed and deformed by the wire net, and the wire net is buried in the soft part. Therefore, the contact area of the soft part with the surface of the other mold increases, so that the resin can be prevented from entering during molding, burrs are not generated, and a housing having a good appearance quality can be formed.
【0010】[0010]
【実施例】以下、実施例により具体的に説明する。図1
及び図2に、本実施例で用いた金型を示す。この金型は
箱状の筺体を形成するものであり、上型1、下型2及び
スライドコア3から構成されている。上型1は意匠面を
形成する型面10をもつ凹型を構成し、下型2は型面2
0をもつ凸型を構成している。そして下型2の縦型面2
1に対向して四方からスライドコア3が近接駆動可能に
配置されている。それぞれのスライドコア3の先端表面
の厚さ5〜15mmの部分には、フッ素ゴム(「バイト
ン」デュポン社製)から構成された軟質部30が形成さ
れている。また、それぞれのスライドコア3は図示しな
いシリンダ装置に連結されている。EXAMPLES The present invention will be specifically described below with reference to examples. Figure 1
2 shows the mold used in this example. This die forms a box-shaped housing, and is composed of an upper die 1, a lower die 2 and a slide core 3. The upper mold 1 constitutes a concave mold having a mold surface 10 forming a design surface, and the lower mold 2 comprises a mold surface 2
A convex type having 0 is constructed. And the vertical mold surface 2 of the lower mold 2.
The slide cores 3 are arranged so as to be capable of driving close to each other from four sides so as to face 1. A soft portion 30 made of fluororubber ("Viton" manufactured by DuPont) is formed on a portion of the tip surface of each slide core 3 having a thickness of 5 to 15 mm. Further, each slide core 3 is connected to a cylinder device (not shown).
【0011】この金型を用いて、以下のように箱状の筺
体を形成した。先ず予め下型2の型面形状に沿うように
形成された銅製の金網4を、下型2の型面に配置する。
次にスライドコア3を前進駆動し、金網4の端部をスラ
イドコア3と下型2の縦型面21とで挟持する。このと
き、スライドコア3の軟質部30が金網4と接触する
が、軟質部30は金網4より軟質であるため変形し、図
3に拡大して示すように金網4が軟質部30に埋没した
状態となる。したがって軟質部30は下型2と密接し、
従来のような隙間が生じない。Using this mold, a box-shaped housing was formed as follows. First, the metal wire net 4 made of copper formed in advance along the mold surface shape of the lower mold 2 is arranged on the mold surface of the lower mold 2.
Next, the slide core 3 is driven forward, and the end of the wire net 4 is sandwiched between the slide core 3 and the vertical mold surface 21 of the lower mold 2. At this time, the soft part 30 of the slide core 3 comes into contact with the wire net 4, but the soft part 30 is deformed because it is softer than the wire net 4, and the wire net 4 is buried in the soft part 30 as shown in an enlarged view in FIG. It becomes a state. Therefore, the soft part 30 is in close contact with the lower mold 2,
There is no gap as in the past.
【0012】この状態でキャビティ内に所定量の溶融樹
脂が注入され、上型1と下型2とが近接駆動されて圧縮
成形が行われる。金網4の端部は軟質部30と下型2の
縦型面21とで液密に挟持されているため、挟持部に溶
融樹脂が浸入するのが防止されバリの発生が防止されて
いる。溶融樹脂が固化後上型1と下型2とが型開きさ
れ、スライドコア3が後退して成形体である筺体が離型
される。得られた筺体の断面図を図4に示す。この筺体
は箱状であり、開口周縁部から金網4が表出して延びて
いる。そして開口周縁部では樹脂のはみ出しによるバリ
は見られず、良好な外観品質を有している。In this state, a predetermined amount of molten resin is injected into the cavity, the upper mold 1 and the lower mold 2 are driven close to each other, and compression molding is performed. Since the end portion of the wire net 4 is liquid-tightly sandwiched between the soft portion 30 and the vertical mold surface 21 of the lower die 2, the molten resin is prevented from entering the sandwiched portion and burr is prevented from occurring. After the molten resin is solidified, the upper mold 1 and the lower mold 2 are opened, the slide core 3 is retracted, and the housing, which is a molded body, is released. A sectional view of the obtained housing is shown in FIG. The housing has a box shape, and the wire netting 4 is exposed and extends from the peripheral edge portion of the opening. No burr due to resin squeeze is seen at the peripheral edge of the opening, and the appearance is good.
【0013】この筺体は、2個一対で用いられ、それぞ
れの周縁部どうしが対向した状態で表出する金網4が接
続されて用いられる。ここで互いの金網どうしを確実に
接続するには、図5に示すような構造とするのがよい。
すなわち、一方の筺体5に内周側へ突出し内側に第1テ
ーパ表面51をもつリブ50を形成するとともに、他方
の筺体6の端部を段付構造とし内側に第2テーパ表面6
1を形成する。そして両方の筺体の開口周縁部から外部
へ延出する一対の金網4を挟むようにして、他方の筺体
6を一方の筺体5に挿入すれば、第1テーパ表面51と
第2テーパ表面61の継合により両方の金網4を確実に
接続することができる。This housing is used as a pair of two, and the wire nets 4 that are exposed with their peripheral portions facing each other are connected and used. Here, in order to reliably connect the wire nets to each other, the structure shown in FIG. 5 is preferable.
That is, the rib 50 having the first taper surface 51 protruding toward the inner peripheral side is formed on one housing 5, and the end portion of the other housing 6 has a stepped structure, and the second taper surface 6 is formed on the inside.
1 is formed. Then, by inserting the other housing 6 into the one housing 5 so as to sandwich the pair of wire nets 4 extending outward from the opening peripheral portions of both the housings, the joining of the first taper surface 51 and the second taper surface 61 is achieved. Thus, both wire nets 4 can be reliably connected.
【0014】[0014]
【発明の効果】すなわち本発明の電磁波シールド機能を
もつ筺体の製造方法によれば、金網を金型内に配置した
一体成形によっても、筺体の端部や通気孔などにバリの
発生なく金網を筺体の外部へ延出又は表出させることが
できる。したがって、従来の導電性塗料や真空蒸着など
でシールド機能を付与する方法に比べて工数を著しく低
減することができ、コストを大幅に低減することができ
る。That is, according to the method for manufacturing a casing having an electromagnetic wave shielding function of the present invention, even if the metal mesh is integrally formed by disposing the metal mesh in the mold, the metal mesh can be formed without burrs at the ends of the casing and the vent holes. It can be extended or exposed to the outside of the housing. Therefore, the number of steps can be remarkably reduced and the cost can be remarkably reduced as compared with the conventional method of providing the shield function with a conductive paint or vacuum deposition.
【図1】本発明の一実施例で用いた金型の断面図であ
る。FIG. 1 is a sectional view of a mold used in an embodiment of the present invention.
【図2】本発明の一実施例で圧縮成形完了時の成形体と
金型の断面図である。FIG. 2 is a cross-sectional view of a molded body and a mold after completion of compression molding in one embodiment of the present invention.
【図3】本発明の一実施例において、金網をスライドコ
アで挟持した状態を示す説明断面図である。FIG. 3 is an explanatory cross-sectional view showing a state where a wire mesh is sandwiched by slide cores in an embodiment of the present invention.
【図4】本発明の一実施例で得られた筺体の断面図であ
る。FIG. 4 is a cross-sectional view of a housing obtained in an example of the present invention.
【図5】本発明の製造方法で得られた筺体どうしの接続
構造の一例を示す説明断面図である。FIG. 5 is an explanatory cross-sectional view showing an example of a connection structure for housings obtained by the manufacturing method of the present invention.
【図6】本発明の製造方法を利用せず従来の金型で金網
を挟持した場合の状態を示す説明断面図である。FIG. 6 is an explanatory cross-sectional view showing a state in which a wire net is sandwiched between conventional dies without using the manufacturing method of the present invention.
1:上型 2:下型
3:スライドコア 4:金網 21:縦型面 3
0:軟質部1: Upper mold 2: Lower mold
3: Slide core 4: Wire mesh 21: Vertical surface 3
0: Soft part
Claims (1)
金網とからなる電磁波シールド機能をもつ筺体を、該金
網を一対の金型内に配置して一体成形することにより製
造する方法であって、 前記金網は局部的に一対の金型で挟持され、一対の該金
型の該金網を挟持する部分の少なくとも一方の表面は該
金網の材質より軟質とされていることを特徴とする電磁
波シールド機能をもつ筺体の製造方法。1. A method for producing a casing having an electromagnetic wave shielding function, which comprises a casing-shaped resin main body and a wire net embedded in the main body, by arranging the wire net in a pair of molds and integrally molding the same. The wire mesh is locally clamped by a pair of molds, and at least one surface of a portion of the pair of molds that clamps the metal mesh is softer than the material of the metal mesh. A method of manufacturing a housing having an electromagnetic wave shielding function.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1448093A JPH06226776A (en) | 1993-02-01 | 1993-02-01 | Manufacture of housing with electromagnetic wave shielding function |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1448093A JPH06226776A (en) | 1993-02-01 | 1993-02-01 | Manufacture of housing with electromagnetic wave shielding function |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH06226776A true JPH06226776A (en) | 1994-08-16 |
Family
ID=11862223
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1448093A Pending JPH06226776A (en) | 1993-02-01 | 1993-02-01 | Manufacture of housing with electromagnetic wave shielding function |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH06226776A (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0936045A1 (en) * | 1998-02-12 | 1999-08-18 | National-Standard Company | Molded electromagnetic shielding housings |
US6054647A (en) * | 1997-11-26 | 2000-04-25 | National-Standard Company | Grid material for electromagnetic shielding |
JP2008135476A (en) * | 2006-11-27 | 2008-06-12 | Matsushita Electric Works Ltd | Electromagnetic wave shield case article, and its production method |
-
1993
- 1993-02-01 JP JP1448093A patent/JPH06226776A/en active Pending
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6054647A (en) * | 1997-11-26 | 2000-04-25 | National-Standard Company | Grid material for electromagnetic shielding |
EP0936045A1 (en) * | 1998-02-12 | 1999-08-18 | National-Standard Company | Molded electromagnetic shielding housings |
JP2008135476A (en) * | 2006-11-27 | 2008-06-12 | Matsushita Electric Works Ltd | Electromagnetic wave shield case article, and its production method |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP2713059B2 (en) | A method for manufacturing a housing comprising a box or a lid for storing electronic components or electronic devices. | |
US20020191382A1 (en) | Surface-mount device and method for manufacturing the surface-mount device | |
US20040082370A1 (en) | Method for producing a housing of a mobile communication terminal, housing and mobile communication terminal | |
US20020180108A1 (en) | Electromagnetic shielding box and method of manufacturing the same | |
JPH06226776A (en) | Manufacture of housing with electromagnetic wave shielding function | |
JPH10290088A (en) | Enclosure for electronic apparatus and its manufacture | |
JP2000503266A (en) | Method for manufacturing case part having shield effect for wireless communication device | |
JP2667369B2 (en) | IC card manufacturing method and IC card | |
JPS63162209A (en) | Production of resin box with shielding plate | |
JP2001230586A (en) | Electromagnetic wave shielding case and its manufacturing method | |
JP2797557B2 (en) | Integrated circuit device having shield function and manufacturing method | |
JP3073162B2 (en) | Electronic equipment housing | |
JP2001283983A (en) | Cable connector and its manufacturing method | |
JP2001177285A (en) | Electromagnetic shielded enclosure, and manufacturing method therefor | |
JPH1051172A (en) | Enclosure for electronic apparatus and its manufacture | |
JPH0511498U (en) | Electronic component application case | |
JPS5820428A (en) | Production of frame body | |
JPH06252188A (en) | Method and device for manufacturing resin-encapsulated semiconductor chip | |
JP2004363450A (en) | Electromagnetic wave shield casing and method of producing the same | |
JPH11354977A (en) | Metal sheet inserted molding and manufacture thereof | |
JPH118016A (en) | Emi suppressing connector | |
US6276913B1 (en) | Mold for resin sealing | |
JPH05183285A (en) | Electromagnetically shielded cabinet | |
JP2627812B2 (en) | Electronic component manufacturing method | |
JP3458907B2 (en) | Lead frame |