JPH02170379A - Connector structure of hybrid integrated circuit - Google Patents

Abstract

PURPOSE:To make a connector for a hybrid integrated circuit in small size and at a low cost and enhance the easiness in assembly by fixing connecting pin supports to appropriate circuit base board, fitting the two supports in a fit hole in connector housing upon jointing together, and consolidating with the hybrid integrated circuit by a molding agent injected. CONSTITUTION:In the stage prior to constituting an integrated circuit 10, connecting pin supports 30a, 30b are fixed to the mating circuit base boards 16a, 16b, and connecting pins 24a, 24b are connected with mating connection terminals 22g, 22h. The two connecting pin supports 30a, 30b are jointed together up and down and fitted in a fit hole 34 in a connector housing 28 with this jointed condition held, and this connector housing 28 is fixed to the integrated circuit by a molding agent 38 injected through an injection hole in the condition that the connector structure is constituted. This allows making the connector in small size and at low cost and enhances the easiness in assembly.

Description

Detailed Description of the Invention [Industrial Application Field] The present invention comprises two hybrid integrated circuit boards on which a conductive layer of a desired shape is formed and a plurality of circuit elements are attached on the conductive layer. , relates to a connector structure for a hybrid integrated circuit in which both the conductive layers are opposed to each other.

[Prior Art] Conventionally, conductive layers are pasted to each other through an insulating layer, a circuit element is fixed to each conductive layer, and both conductive layers are connected to each other via a connecting substrate, and then both conductive layers are bonded to each other through an insulating layer. As an integrated circuit having a pair of metal substrates facing each other,
A technique disclosed in Japanese Patent Publication No. 46-13234 is known. The method for manufacturing an integrated circuit disclosed in this prior art includes the steps of anodizing at least the main surface of an aluminum substrate to form a thin aluminum oxide layer on the surface of the substrate, and forming a resistor on the thin aluminum oxide layer. a step of forming a plurality of circuit elements by selectively depositing a substance and a good conductor material; a step of fixing a transistor bellet on a lead portion formed by selectively depositing a good conductor; The method is characterized by including a step of sealing at least all of the circuit elements with an insulating resin.

In the integrated circuit formed in this way, heat generated from resistors, transistors, etc. during operation can be dissipated quickly and effectively, making it possible to integrate output circuits, etc. .

[Problems to be Solved by the Invention] The integrated circuit formed as described above may be adopted for use in vehicles from the viewpoint of its small size and low cost. However, when such an integrated circuit is actually used in a vehicle, it is necessary to take advantage of its small size and low cost while also reliably connecting it to other control parts of the vehicle.

Here, if conventional connecting devices are used, this connecting device is relatively large and not cheap, so even if the integrated circuit itself is made smaller and lower in cost, the benefits cannot be fully demonstrated. Problems that are not possible have been pointed out.

Furthermore, even if the connected devices are made smaller, if the assembly is poor, there may be situations where they cannot actually be assembled.
This assemblability must be fully considered.

This invention has been made in view of the above-mentioned problems, and an object of the invention is to create a hybrid integrated circuit that can be made smaller and lower in cost, as well as exhibit good assemblability. The purpose is to provide a connector structure.

[Means for Solving the Problems] In order to solve the above-mentioned problems and achieve the objects, a connector structure for a hybrid integrated circuit according to the present invention is provided, in which a conductive layer having a desired shape is formed, and a plurality of layers are formed on the conductive layer. In a hybrid integrated circuit having two hybrid integrated circuit boards to which circuit elements are attached, and in which both the conductive layers are opposed to each other, the respective conductive layers are fixed to the two hybrid integrated circuit boards and correspond to each other. a connector housing having a fitting hole to be fitted with each of the connection pin supports; It is characterized in that it is integrated with the hybrid integrated circuit by a molding agent injected into the hybrid integrated circuit.

Further, the present invention is characterized in that both the conductive layers are connected to each other via a connection substrate.

Further, each of the connection pin supports according to the present invention is fixed to a terminal side of each of the hybrid integrated circuit boards, and the respective connection pin supports are joined to each other and integrally formed to form a protrusion and It is characterized in that the fitting holes of the connector housing are fitted.

Further, the present invention is characterized in that the respective connection pin supports are integrally joined to form the injection hole for injecting the molding agent.

Further, each of the hybrid integrated circuit boards according to the present invention is characterized in that they are spaced apart by a predetermined distance by a case material.

Further, each of the hybrid integrated circuit boards according to the present invention is characterized in that it is an insulated metal board.

[Function] In the hybrid integrated circuit connector structure configured as described above, with both metal boards open, the connection pin support is fixed to the corresponding circuit board, and a plurality of This allows connection pins to be connected. In this way, since both metal substrates are open, this connection operation can be easily and reliably performed, and the ease of assembly is improved.

Then, when assembling both metal boards facing each other, one connector structure is created by fitting both connection pin supports into a fitting hole formed in the connector housing while joining and integrating both connection pin supports to each other. At the same time, an integrated circuit to which this connector is integrally connected is completed.

In this manner, with the connector structure configured, the connector housing is fixed to the integrated circuit by the molding agent injected through the injection hole, and the two are integrated.

[Embodiment] Hereinafter, the configuration of an embodiment of the connector structure for a hybrid integrated circuit according to the present invention will be described in detail with reference to FIGS. 1 to 8 of the accompanying drawings.

FIG. 1 shows an integrated circuit 10 to which a connecting device having the connector structure of this embodiment is connected. The integrated circuit 10 is configured as an independent functional component for a vehicle, and specifically, is configured as an integrated circuit that independently functions as, for example, an engine control unit.

As shown in the figure, this integrated circuit IO is formed as a box-shaped case with a closed interior, and a male connector 12 as a connecting device is integrally attached to one end. The male connector 12 will be described in detail later, but is configured to be connected to a commonly used female connector 14.

Here, as shown in FIGS. 2 to 3B, this integrated circuit 10 consists of a pair of circuit boards 16a and 1 that are vertically spaced apart.
6b and both circuit boards lea.

16b are spaced apart by a predetermined interval and are comprised of a side plate 18 for closing the side surface, and a frame 20 that integrally fixes both circuit boards 16a, 16b and the side plate 18.

Specifically, both circuit boards 16a and 16b are equipped with circuit elements such as an IC chip, a resistor, and a capacitor necessary for functioning as an engine control unit. Here, both circuit boards 16a and 16b are set to be formed by dividing one common board 22 into two, as shown in FIG. 4A. That is, as shown in FIG. 4B, the common substrate 22 includes a substrate body 22a made of a conductive material, for example, aluminum, and an insulating layer 2 adhered to the front surface of the substrate body 22a.
2b, a conductive layer 22c formed in a predetermined circuit pattern on this insulating layer 22b and defining a circuit network, and a circuit element 2 fixed and electrically connected on this conductive layer 22c.
2d.

As shown in FIG. 4A, the common substrate 22 has an opening 22e formed in advance in the central portion thereof, which extends in the vertical direction. Here, the circuit networks in the left and right portions are connected to each other via a flexible substrate 22f provided across the opening 22e.

Then, the pair of circuit boards 16a described above are formed by cutting out both upper and lower edges (areas indicated by symbols X and Y) including the upper and lower ends of this opening 22e.

16b is set to be formed.

Note that both circuit boards 16a and 16 on the common board 22
A plurality of connection terminals 22g, 22g, and
22h are formed in rows along the edge. Furthermore, connection pins 24a and 24b of the male connector 12, which will be described later, are fixed to these connection terminals 22g and 22h, respectively, so as to protrude outward, and are electrically connected.

Further, the above-mentioned side plate 18 is formed in a U-shape on the upper surface with the minus side open, and the open side is set to become one end of the case.

Step portions 18a and 18b are formed at the inner edges of both upper and lower end surfaces of the side plate 18 to receive the three edges of the corresponding circuit boards 16a and 16b.

Here, each circuit board 16a, 16b is fitted into a corresponding step portion 18a, 18b via a seal rubber 26, as shown in FIG. 3A.

By interposing this seal rubber 26, dust is prevented from entering the case from between these rubbers.

On the other hand, as shown in FIG. 2, the frame body 20 described above is formed so as to sandwich and surround the side surface closed by the side plate 18 from above and below. That is, this frame 20
is a main body 20a facing the side plate 18, and this main body 20a.
A predetermined distance from both the upper and lower ends of (specifically, the upper and lower circuit boards 16a).

The flange portions 20b, 2 extend inward by a distance sufficient to clamp the three unopened edges of the flange portion 16b, respectively.
It is integrally formed with 0c.

As shown in FIG. 3B, this frame body 20 is constructed by sandwiching the upper and lower circuit boards 16a and 16b, which are fitted into the upper and lower step portions 18a and 18b of the side plate 18, from above and below, so that the case is integrated. It is formed to be configured. As shown in the figure, the flexible board 22f that connects the circuit elements 22d of the upper and lower circuit boards 16a and 16b to each other is
It is set to be located more inward than the other end portion of the side plate 18.

Since the frame body 20 is formed in this way, the side plate 1
8, the side board circuits 16a and 16b are maintained in an assembled state while being separated vertically by a predetermined distance.

That is, in this embodiment, the integrated circuit 10 is formed into a case, and both upper and lower surfaces of the case are directly defined by the circuit boards 18a and 18b. As a result, the size and weight of the circuit boards 16a and 16b can be reduced compared to the case where the circuit boards 16a and 16b are housed in a separately prepared case.

Next, the configuration of a connecting device having a connector structure, which is a feature of the present invention, for connecting the case-shaped integrated circuit IO configured in this manner with a controlled part of a vehicle is shown in FIGS. 5 to 8. This will be explained with reference to the figures.

This connection device includes a male connector 12 that is attached to an opening at one end of a case-shaped integrated circuit 10 with a so-called inner bone.
and a female connector 14 which is detachably connected to the male connector 12. As shown in FIG. 5, this male connector 12 is attached to a connector housing 28 formed from a box-shaped case with an open front, and upper connection pins 24a arranged in a horizontal row. The upper connecting pin support 30a and the lower connecting pin 2
4b and the lower connecting pin support 30b attached in a horizontally aligned manner, it is constructed in a so-called three-piece shape.

Here, the upper connecting pin support 30a and the lower connecting pin support 30b are vertically symmetrical with a sloped central part in the vertical direction, and the upper connecting pin support 30a is
The upright piece 30a+ and this upright piece 30a+ are arranged in an abbreviated form.
It is integrally formed with a protruding piece 30a that protrudes outward from the lower end. On the other hand, the connecting pin support 30b of the lower mold has an upright piece 30b+ and an upright piece 30 in a substantially inverted shape.
It is integrally formed with a protruding piece 30b2 that protrudes outward from the upper end of b1.

The upper connecting pin 24a has a horizontal portion 24a+ that horizontally penetrates the protrusion piece 30ai and protrudes back and forth, and a vertical portion 24a2 that rises vertically from the inner end of the horizontal portion 24a+ along the inner surface of the upright piece 30a1. and a bent part 24a bent inward from the upper end of the placing part 24a2. This bent portion 24a3 is connected to the connection terminal 22 formed on the above-mentioned upper circuit board 16b.
It is defined as a connection part that is connected to h by soldering. Further, the horizontal portion 24a that protrudes outward is defined as a connecting portion that is inserted and connected to the female connector 14.

In addition, the lower connecting pin 24b has a horizontal portion 24b that horizontally penetrates the protruding piece 30bz and protrudes forward and backward, and a horizontal portion 24b that extends vertically from the inner end of the horizontal portion 24bl along the inner surface of the upright piece 30b+. Falling vertical portion 24b2 and this vertical portion 2
It is integrally formed with a bent portion 24b3 that is bent inward from the lower end of 4b2. This bent portion 24b is the connecting terminal 22g formed on the lower circuit board 16a mentioned above.
It is defined as a connection part that is connected by soldering. Further, the portion of the horizontal portion 24b1 that projects outward is
It is defined as a connecting portion that is inserted into and connected to the female connector 14.

The connecting pin supports 30a and 30b are set to a size that allows them to be fitted into an opening at one end of the case-shaped integrated circuit 1O while being joined vertically to each other. In other words, both the upright pieces 30a+,
The range (outer circumference) extending over 30b+ is exactly the integrated circuit 10
It is set so as to define the inner circumference of the opening at one end.

Here, as shown in FIG. 6, a recess 32a, a recess 32a, a
32b is formed. These recesses 32a, 32b are defined as injection holes for epoxy resin to be injected, as will be described later, when the male connector 12 is integrated into the integrated circuit IO.

Further, the above-mentioned upper and lower connecting pins 24a and 24b are vertically symmetrical, that is, formed in the same shape, and the upper and lower connecting pin supports 30a and 30b are also formed in the same vertically symmetrical shape. In this way, the connection pins 24a,
Connecting pin supports 30a, 30b with attached pins 24b
Since they have the same shape, parts can be shared and costs can be reduced.

On the other hand, the connector housing 28 described above has a fitting hole 34 formed therein so as to extend through the connector housing 28 in the front-rear direction. As shown in FIG. 7, this fitting hole 34 is formed by the same protruding pieces 30az that are overlapped with each other when both the upper and lower connecting pin supports 30a and 30b are joined.
, 30bz is set to a size large enough to fit it.

Furthermore, mounting flanges 40a and 40b are integrally formed on both sides of the connector housing 28. These flange portions 40a.

40b is provided for fixing the male connector 12 to the body of a vehicle (not shown) in a state where it is attached and fixed to the integrated circuit IO. In this way, there is no need to provide a flange section on the integrated circuit IO itself for attaching the integrated circuit IO.
It is possible to simplify the configuration.

In this embodiment, these connection pins 24a,
The vertical separation β and the horizontal arrangement pitch p of the pins 24b are defined based on the specifications of the conventionally used pin arrangement. As a result, the female connector 14 connected to the male connector 12 can be of a conventionally used type, improving economical efficiency.

In addition, since conventionally used male connectors are heavy and large, we have developed a dedicated male connector to accommodate this compact and lightweight case-shaped integrated circuit 10. A type connector 12 is formed. Therefore, according to this embodiment, it is possible to reliably prevent the above-mentioned reduction in size and weight of the integrated circuit IO from being impaired.

Next, referring to FIG. 8, the assembly operation of the integrated circuit 10 as well as the assembly operation of the male connector 12, which is shown in FIG. 5 after the assembly is completed, will be described.

First, as described above with reference to FIGS. 4A and 4B, both upper and lower edges X and Y are cut from the common board 22 to which a predetermined circuit element 22d is attached, thereby forming both circuit boards 16a and 16b. are formed in an open state on the same plane. As shown in FIG. 8, corresponding connection pin supports 30a and 30b are fixed to both circuit boards 16a and 16b in such an open state via an adhesive.

Here, as described above, these connection pin supports 30a
, 30b have corresponding connection pins 24a, 24b already attached. In this way, these connection pins 24a, 24b are soldered to the corresponding connection terminals 22g, 22h, respectively, with both circuit boards 16a, 16b open. In particular, this soldering work requires detailed work since there are many connection terminals 22g and 22h, but in this embodiment, both the circuit boards 16a and 16b are Since they are opened on the same plane, the work can be carried out reliably, the workability is improved, and the ease of assembly is maintained well.

Thereafter, while holding one circuit board 16a in the same position, the other circuit board 16b is lifted and moved above and parallel to the one circuit board 16a located below. Then, as shown in Figure 8,
Both connecting pin supports 30a, 30b are joined one above the other.

Here, in this way, both connection pin supports 30a.

30b are joined vertically, both circuit boards 16a,
16b will be set parallel to each other.

On the other hand, prior to such a joining operation, as shown in FIG. 5, both circuit boards 16a are placed on the front and rear parts of the circuit board 16a located below.

Frame members 36a and 36b are installed in an upright state for shielding the internal space from the outside while keeping the interval between 16b constant at a predetermined value and ensuring the strength of the integrated circuit 1o. Here, the negative frame member 36a is
The respective arrangement positions are set so that the other frame member 36b is located slightly inward from the flexible substrate 22f, and the other frame member 36b is located slightly inward from the connection terminals 22g and 22h.

Then, while maintaining this joined state, they are fitted into the fitting hole 34 of the connector housing 28, and in this fitted state, the male connector 12 is connected to the integrated circuit 1.
It will be integrally attached to 0. Thereafter, as described above, by attaching the side plate 18 to the integrated circuit 10 and fitting the frame 20, the integrated circuit 10 as shown in FIG. 1 is formed with the male connector 12 integrated therein. will be done.

After such an assembly operation is completed, the assembled male connector 12 is reliably bonded to the integrated circuit 1o, and the inside of the integrated circuit 10 is completely shielded, while each connection pin 24a is attached.

24b and the corresponding connection terminals 22g, 22h are soldered together, an epoxy resin 38 is placed between the male connector 12 and the frame member 36b in the recesses 32a, 32b. The epoxy resin 38 fills the space between the two.

Further, in order to protect the flexible substrate 22f and shield the inside of the integrated circuit 10, the frame member 36a
The more forward portion is set to be completely filled with this epoxy resin 38.

As described in detail above, in the connector structure of this embodiment, the male connector 12 is connected to the connector housing 28.
and connection pin supports 30a and 30b divided into upper and lower halves.
At the stage before configuring the integrated circuit 10, each connection pin support 30a, 30b is fixed to the corresponding circuit board 16a, 16b, and the connection pin 24a, 24b is fixed to the corresponding circuit board 16a, 16b. Connecting terminal 22g
, 22h, respectively. In this way, the assemblability of integrated circuit 10 is maintained well.

Further, in the above-described embodiment, the integrated circuit 10 to which the male connector 12 is fixed is configured such that its upper and lower surfaces are defined by a pair of circuit boards 16a and 16b. As a result, according to this embodiment, the number of parts of the integrated circuit 10 is reduced, and the integrated circuit 10 is made smaller and less expensive.

Further, in this embodiment, the circuit board 16a,
16b is a conductive aluminum substrate body 22a, an insulating layer 22b stuck on this substrate body 22a,
A conductive layer 22c is formed on the insulating layer 22b with a predetermined circuit pattern. As a result, the heat generated from the various circuit elements 22d is absorbed by using the aluminum substrate main body 22a as a heat sink.
Since heat can be radiated, there is no need to provide a separate heat radiating member, resulting in significant downsizing.

Furthermore, in this embodiment, as described above, since the upper and lower surfaces of the case are respectively constituted by a pair of circuit boards lea and 16b having a board body 22a made of aluminum, these circuit boards 16a and 16b are It can be used as an electromagnetic shielding member. As a result, the internal space of the integrated circuit IO on this case is substantially electromagnetically shielded, and the circuit element 22d is less susceptible to electromagnetic interference.

It goes without saying that this invention is not limited to the configuration of the one embodiment described above, and can be modified in various ways without departing from the gist of the invention.

For example, in the above-described embodiment, the integrated circuit IO functions as an engine control unit. It can be configured to operate as a functional component of a control device or the like.

Furthermore, in the embodiment described above, the male connector 12
Although it has been described that the male connector 12 is fixed to the integrated circuit 10 using a so-called external mounting method, the present invention is not limited to such a configuration. It may be configured to be fixed to.

In addition, in the embodiment described above, each circuit board 16a, 1
Although it has been described that the connecting terminals 22g and 22h are formed in a row on the pin 6b, the present invention is not limited to such a configuration, and can be applied when the number of connecting pins 24a and 24b is large. , the connection terminals 22g and 22h may be arranged in two rows.

[Effects of the Invention] As described in detail above, the connector structure for a hybrid integrated circuit according to the present invention has a conductive layer of a desired shape formed thereon, and a plurality of circuit elements attached on the conductive layer. In a hybrid integrated circuit having an integrated circuit board and having both conductive layers facing each other, a plurality of connection pins are fixed to the two hybrid integrated circuit boards and connected to the corresponding respective conductive layers. and a connector housing having a fitting hole to be fitted with each of the connecting pin supports, the connector housing being molded by a molding agent injected into the hybrid integrated circuit. It is characterized in that it is integrated with the hybrid integrated circuit.

Further, the present invention is characterized in that both the conductive layers are connected to each other via a connection substrate.

Further, each of the connection pin supports according to the present invention is fixed to a terminal side of each of the hybrid integrated circuit boards, and the respective connection pin supports are joined to each other and integrally formed to form a protrusion and It is characterized in that the fitting holes of the connector housing are fitted.

Further, the present invention is characterized in that the respective connection pin supports are integrally joined to form the injection hole for injecting the molding agent.

Further, each of the hybrid integrated circuit boards according to the present invention is characterized in that they are spaced apart by a predetermined distance by a case material.

Further, each of the hybrid integrated circuit boards according to the present invention is characterized in that it is an insulated metal board.

Therefore, according to the present invention, there is provided a connector structure for a hybrid integrated circuit which can be made smaller and lower in cost, and which can exhibit good assembly performance.

[Brief explanation of the drawing]

FIG. 1 is a perspective view showing an embodiment of a connector structure for a hybrid integrated circuit according to the present invention, together with an integrated circuit to which this is applied; FIG. 2 is an exploded perspective view showing the configuration of the integrated circuit shown in FIG. 1; Figure 3A is a cross-sectional view taken along the line A-A in Figure 1; Figure 3B is a cross-sectional view taken along the line B-B in Figure 1; Figure 4A is the common substrate. Figure 4B is a sectional view showing the configuration of the common board; Figure 5 is a sectional view showing the configuration of the male connector attached to the integrated circuit; Figure 6 is the configuration of the male connector. Exploded perspective view; Figure 7 is a front view showing the male connector in its assembled state; and Figure 8 is a top view showing both connection pin supports fixed to the open circuit board. be. In the figure, 10... integrated circuit, 12... male connector,
14...Female connector, 16a; 16b...Circuit board, 18...Side plate, 18a; 18b...Step part, 20
... Frame, 20a... Main body, 20b; 20c.
...Flange portion, 22...Common board, 22a...Board body, 22b...Insulating layer, 22c...Conductive layer, 2
2d...Circuit element, 22e...Opening, 22f...
・Flexible board, 22g, 22h... Connection terminal, 22i; 22j... Outer flange portion, 24a;
24b... Connection pin, 24al; 24b+ ・
・Horizontal part, 24az; 24 b 2 ・Vertical part, 24a3: 24ba ・'Bending part, 26... Seal rubber 28... Connector housing, 30a.
... Upper connection pin support, 30a + ... Standing piece, 3
0a2... Projection piece, 30b... Lower connection pin support, 30b1... Upright piece, 30b2... Projection piece, 3
2a; 32b... recess, 34... fitting hole, 36
a; 36b...frame member; 38...epoxy resin; 40a; 40b...flange portion. Figure 1 Figure 2 Figure 3A Figure 3B Figure 4A

Claims (6)

[Claims] (1) A hybrid integrated circuit comprising two hybrid integrated circuit boards on which a conductive layer having a desired shape is formed and a plurality of circuit elements attached on the conductive layer, and in which both the conductive layers are opposed to each other, Respective connection pin supports fixed to the two hybrid integrated circuit boards and having a plurality of connection pins attached thereto and connected to the corresponding respective conductive layers; and fitted with the respective connection pin supports. a connector housing having a fitting hole, the connector housing being integrated with the hybrid integrated circuit by a molding agent injected into the hybrid integrated circuit. . (2) The connector structure for a hybrid integrated circuit according to claim 1, wherein both the conductive layers are connected to each other via a connection board. (3) The respective connecting pin supports are fixed to the terminal sides of the respective hybrid integrated circuit boards, and the respective connecting pin supports are joined to each other and integrally formed to form a protrusion and the connector housing. 2. The connector structure for a hybrid integrated circuit according to claim 1, wherein the fitting holes are fitted. (4) The connector structure for a hybrid integrated circuit according to claim 1, wherein the respective connection pin supports are joined and integrated to form an injection hole for injecting the molding agent. (5) Claim 1, wherein the respective hybrid integrated circuit boards are spaced apart by a predetermined distance by a case material.
The hybrid integrated circuit connector structure described. (6) The hybrid integrated circuit connector structure according to claim 1, wherein each of the hybrid integrated circuit boards is an insulated metal board.