JPH03104151A - Integrated circuit provided with metal board - Google Patents

Abstract

PURPOSE:To increase freedom of development by providing a plurality of circuit boards, and fixing the circuit board in parallel to a circuit element directly mounted on one circuit board. CONSTITUTION:A hybrid integrated circuit 10 is provided with a pair of circuit boards 16a, 16b which are vertically separated, and side plates 18 which separate the boards 16a, 16b a specified interval apart and close the side surfaces. A frame body 20 fixes them in a unified body. The boards 16a, 16b form a circuit element 22d and a conducting layer 22c having a desired shape by dividing a common board 22. The conducting layer 22c and the element 22d are formed via an insulating layer 22b. An element 22c is directly mounted as bare chip and has memory contents capable of rewriting from the outside in a non-volatile manner. The element 22d and the board 16a having it are connected by using a cable, and connected with an external processing equipment, from a bus connection terminal arranged in parallel. Hence rewriting of external data, changing of program, and monitoring of memory contents are enabled in the stage of development of the circuit 10. Thereby the freedom of development can be increased.

Description

DETAILED DESCRIPTION OF THE INVENTION [Industrial Application Field] The present invention comprises a pair of circuit boards facing each other, in which a conductive layer having a desired shape is formed on a metal substrate with an insulating layer interposed therebetween;
The present invention relates to an integrated circuit having a metal substrate and a connection cable that electrically connects these circuit boards to each other.

[Prior Art] Conventionally, conductive layers are pasted to each other through an insulating layer, a circuit element is fixed to each conductive layer, and both conductive layers are connected to each other via a connecting substrate, and then both conductive layers are bonded to each other through an insulating layer. As an integrated circuit having a pair of metal substrates facing each other,
A technique disclosed in Japanese Patent Publication No. 46-13234 is known. The integrated circuit manufacturing method disclosed in this prior art includes the steps of anodizing at least one main surface of an aluminum substrate to form a thin aluminum oxide layer on the substrate surface, and forming a resistor on the aluminum oxide thin layer. a step of forming a plurality of circuit elements by selectively depositing a substance and a good conductor material; a step of fixing a transistor bellet on a lead portion formed by selectively depositing a good conductor; The method is characterized by including a step of sealing at least all of the circuit elements with an insulating resin.

In an integrated circuit formed in this manner, a conductive layer of a desired shape is formed on a metal substrate via an insulating layer, and at least one memory element is removed from the insulating layer as a so-called bare chip. It is installed in an impossible way.

[Problems to be Solved by the Invention] The integrated circuit formed as described above may be adopted for use in vehicles from the viewpoint of its small size and low cost. However, when an integrated circuit with such a metal substrate is actually used in a vehicle, various tests are conducted during the development stage, and as necessary, the data stored in the memory element may be rewritten or controlled. This will require changes to the program.

However, as mentioned above, this memory element is directly attached to the circuit as a bare chip,
Once installed, it is impossible to remove it, making it difficult to rewrite data, change control programs, monitor memory contents, etc., and it has been pointed out that the degree of freedom in development is greatly restricted. There is.

This invention was made in view of the above-mentioned problems, and the purpose of this invention is to enable tasks such as rewriting data, changing control programs, and monitoring stored contents from outside during the development stage of integrated circuits. An object of the present invention is to provide an integrated circuit having a metal substrate that can increase the degree of freedom in development.

[Means for Solving the Problems] In order to solve the above-mentioned problems and achieve the objects, an integrated circuit having a metal substrate according to the first aspect of the present invention includes a conductive layer having a desired shape on the metal substrate via an insulating layer. A pair of circuit boards facing each other with layers formed, a connecting cable that electrically connects these circuit boards to each other, and a bare chip mounted directly on the insulating layer of one of the circuit boards, and can be rewritten from the outside. A circuit element having non-volatile memory contents, and a bus connection terminal connected to a bus line of the circuit element, attached to one circuit board in parallel with the connection cable, and for connection to an external device. It is characterized by

In addition, in order to solve the above-mentioned problems and achieve the object, an integrated circuit having a metal substrate according to a second aspect of the present invention has conductive layers having a desired shape formed on the metal substrate via an insulating layer, and facing each other. a pair of circuit boards, a connection cable that electrically connects the circuit boards to each other, and a first circuit board that is mounted directly as a bare chip on the insulating layer of one of the circuit boards and has non-volatile storage contents that can be rewritten from the outside. a second circuit element that is directly mounted as a bare chip on the insulating layer of the other circuit board and has non-volatile storage contents that can be rewritten from the outside; and a second circuit element that is connected to the bus line of the first circuit element. , a first bus connection terminal attached to one circuit board in parallel with the connection cable for connection to an external device, and a first bus connection terminal connected to the bus line of the second circuit element, and attached to the other circuit board. , and a second bus connection terminal attached in parallel with the connection cable for connection to other external devices.

[Function] In an integrated circuit having a metal substrate configured as described above, operations such as rewriting data and changing control programs can be performed via the bus connection terminals (first and second bus connection terminals). It is connected to an external processing device, which allows tasks such as rewriting data and changing control programs to be performed from outside, thereby increasing the degree of freedom in development.

[Embodiment] Hereinafter, with reference to FIGS. 1 to 11B of the accompanying drawings, an embodiment of an integrated circuit having a metal substrate according to the present invention is applied to a case-shaped hybrid integrated circuit. Explain in detail.

FIG. 1 shows a hybrid integrated circuit 10 of this embodiment. This hybrid integrated circuit 10 is configured as a control unit as an independent in-vehicle functional component, and specifically, for example, is configured as a hybrid integrated circuit that independently functions as an engine control unit. ing.

As shown in the figure, this hybrid integrated circuit 10 is formed as a box-shaped case with a closed interior, and a male connector 12 as a connecting device is integrally attached to one end (rear end). There is. The male connector 12 will be described in detail later, but is configured to be connected to a commonly used female connector 14.

Here, as shown in FIGS. 2 to 3B, this hybrid integrated circuit 10 includes a pair of first and second circuit boards 16a and 16b that are vertically spaced apart, and a first and second circuit board. It is composed of a side plate 18 that separates the circuit boards 16a and 16b by a predetermined distance and closes the side surfaces, and a frame 20 that integrally fixes the first and second circuit boards 16a and 16b and the side plate 18. has been done.

Specifically, the first and second circuit boards 16a and 16b include an IC chip that functions as a CPU necessary to perform the function as an engine control unit, an IC chip that functions as a memory element, a resistor, and a capacitor. Circuit elements such as are attached. In detail, the first
A so-called logic circuit element is connected to the circuit board 16a, and a so-called power circuit element is connected to the second circuit board 16b located above. In this embodiment, the above-mentioned IC chips are directly mounted (fixed) on the insulating layer 22b as a pair of chips, as will be described later.

Note that the mounting state of the circuit elements on the first circuit board 16a constitutes the gist of the present invention, and will be explained in detail later.

Here, the first and second circuit boards 16a and 16b are set to be formed by dividing one common board 22 into two, as shown in FIG. 4A. That is,
As shown in FIG. 4B, this common substrate 22 includes a substrate body 22a made of a conductive material, for example, aluminum.
, an insulating layer 22b adhered to the front surface of the substrate main body 22a, a conductive layer 22c formed with a predetermined circuit pattern on the insulating layer 22b and defining a circuit network, and the conductive layer 22c. The circuit element 22d is fixedly fixed thereon and electrically connected to the circuit element 22d.

As shown in FIG. 4A, this common substrate 22 has an opening 22e formed in the center thereof in advance and extending vertically. Here, the circuit network on both the left and right sides of the opening 22e is connected via a flexible board 22f serving as a connection cable provided across one side of the opening 22e (the front side in the figure). connected to each other.

The left end of the flexible substrate 22f in the figure is connected to a position a predetermined distance further to the left than the left edge of the opening 22e. That is, within this predetermined distance range, the connection portion 16 to which an external bus cable, which will be described later, is connected.
c is integrally defined on the other side of the other edge of the first circuit board 16 (the opposite side in the figure). By cutting both upper and lower edges (areas indicated by symbols X and Y) of the opening 22e, the above-mentioned pair of circuit boards 16a and 16b are connected to each other via the flexible board 22f. is set to form.

Note that both circuit boards 16a and 16 on the common board 22
A plurality of connection terminals 22g,
22h are formed in a horizontal line along the edge. Moreover, these connection terminals 22g. Connecting pins 24a and 24b of a male connector 12, which will be described later, are fixed to the pins 22h so as to protrude outward, and are electrically connected to the pins 22h.

On the other hand, in the common board 22, the above-mentioned connection portion 16c has a plurality of connection terminals 2 as external monitor bus take-out terminals to which one end of an external bus cable is detachably connected.
2i are formed in a horizontal line along the edge of the connecting portion 16c.

In other words, the connection terminal 22i in this connection portion 16c
is arranged in parallel with the flexible board 22f at the other end of the first circuit board 16a.

Further, as shown in FIG. 2, the above-mentioned side plate 18 is formed in a U-shape at the top with one side open, and this open side is set to become one end of the case.

Step portions 18a and 18b are formed at the inner edges of both upper and lower end surfaces of the side plate 18 to receive the three edges of the corresponding circuit boards 16a and 16b, respectively.

Here, each circuit board 16a, 16b is fitted into a corresponding step portion 18a, 18b via a seal rubber 26, as shown in FIG. 3A.

By interposing this seal rubber 26, dust is prevented from entering the case from between these rubbers.

On the other hand, as shown in FIG. 2, the above-mentioned frame body 20 is formed from a composite resin as an insulating member, and is configured to support and surround the side surface closed by the side plate l8 from above and below. There is. That is, this frame 20 has side plates 18
and a predetermined distance from both the upper and lower ends of the main body 20a (specifically, the
The flange portions 20b, 20 extend inward by a distance sufficient to sandwich the three unopened edges of 6b, respectively.
It is integrally formed with c.

As shown in FIG. 3B, this frame body 20 is constructed by sandwiching the upper and lower first and second circuit boards 16a and 16b, which are respectively fitted into the upper and lower step portions 18a and 18b of the side plate 18, from above and below. The case is formed integrally. As shown in the figure, the flexible substrate 22f that connects the circuit elements 22d of the upper and lower first and second circuit boards 16a and 16b to each other is set to be located inward from the other end portion of the side plate 18. .

Since the frame body 20 is formed in this way, the side plate l
8, the first and second substrate circuits 16a,
16b will be maintained in an assembled state while being separated vertically by a predetermined distance.

That is, in this embodiment, the hybrid integrated circuit 10 is
It is formed into a case shape, and both upper and lower surfaces of the case are directly defined by the circuit boards 16a and 16b. As a result, the first and second circuit boards 16a, 16
This results in a reduction in size and weight compared to the case where the device b is housed in a separately prepared case.

Next, the case-shaped hybrid integrated circuit 1 configured in this way will be explained.
The configuration of a connecting device for connecting the control unit 0 to a controlled portion of a vehicle will be explained with reference to FIGS. 5 to 8.

This connecting device consists of a male connector 12 attached to one end opening of a case-shaped hybrid integrated circuit 10 in a so-called internal state, and a female connector l4 detachably connected to the male connector 12. It is being organized. As shown in FIG. 5, this male connector 12 has a connector housing 28 formed from a box-shaped housing that is open with both front and rear surfaces penetrated, and an upper connecting pin 24a that is arranged in a horizontal line. Upper connecting bin support 3 installed in the arranged condition
0a and a lower connecting bin support 30b to which the lower connecting bins 24b are attached in a horizontally aligned manner, making up a so-called three-piece structure.

Here, the upper connecting bottle support 30a and the lower connecting bottle support 30b are vertically symmetrical with a sloped central portion in the vertical direction, and the upper connecting bottle support 30a is
It is integrally formed in a substantially L-shape from an upright piece 30a and a protrusion piece 30az that projects outward from the lower end of this upright piece 30a+. On the other hand, the lower mold connecting bin support 30
b is an upright piece 30b and this upright piece 3 in a substantially inverted L shape.
0b Projection piece 30ba that projects outward from the upper end of I
It is integrally formed from.

The upper connecting bin 24a has a horizontal portion 24a+ that horizontally penetrates the protruding piece 30az and protrudes forward and backward, and an upright piece 30a. a vertical portion 24a2 rising vertically along the inner surface of the vertical portion 24a2;
It is integrally formed with a bent portion 24as bent inward from the upper end of a2. This bent portion 24a3 corresponds to the connection terminal 2 formed on the above-mentioned upper second circuit board 16b.
2h is specified as a connection part connected by soldering. Furthermore, the horizontal portion 24a that protrudes outward is defined as a connecting portion that is inserted and connected to the female connector 14.

The lower connecting bin 24b has a horizontal portion 24b1 that horizontally penetrates the protruding piece 30b2 and protrudes back and forth, and vertically extends from the inner end of the horizontal portion 24b along the inner surface of the upstanding piece 30b. The vertical portion 24b2 that descends and the vertical portion 24b
It is integrally formed with a bent portion 24b3 that is bent inward from the lower end of 2. This bent portion 24b3 corresponds to the connection terminal 22 formed on the lower l-th circuit board 16a described above.
It is defined as a connection part that is connected to g by soldering. Furthermore, the horizontal portion 24b that protrudes outward is defined as a connecting portion that is inserted and connected to the female connector 14.

The connecting bin supports 30a and 30b are sized to fit into an opening at one end of the case-like hybrid integrated circuit 10 while being joined vertically to each other. In other words, both the upright pieces 30a,
The range (outer periphery) extending over 30b and 30b is set to exactly define the inner periphery of the opening at one end of the hybrid integrated circuit 10.

Here, as shown in FIG. 6, recesses 32a,
32b is formed. These recesses 32a and 32b are defined as injection holes for epoxy resin to be injected, as will be described later, when the male connector 12 is integrated into the hybrid integrated circuit 10.

Further, the above-mentioned upper and lower connecting bins 24a and 24b are formed in a vertically symmetrical shape, that is, the same shape, and the upper and lower connecting bin supports 30a and 30b are also formed in a vertically symmetrical and identical shape. In this way, the connection bins 24a,
Connecting bin supports 30a, 30b with attached 24b
Since they have the same shape, parts can be made common and costs can be reduced.

On the other hand, the connector housing 28 described above has a fitting hole 34 formed therein so as to extend through the connector housing 28 in the front-rear direction. As shown in FIG. 7, this fitting hole 34 is provided with two protruding pieces 30az that are overlapped with each other in a state where both the upper and lower connecting bottle supports 30a and 30b are joined.
．． The size is set to be large enough to fit a 30bz into the hole.

Furthermore, mounting flanges 40a and 40b are integrally formed on both sides of the connector housing 28. These flange portions 40a, 40b are provided for fixing the male connector 12 to the body of a vehicle (not shown) in a state where it is attached and fixed to the hybrid integrated circuit 10. In this way, it is not necessary to provide a flange portion on the hybrid integrated circuit 10 itself for attaching the hybrid integrated circuit 10, so that the configuration of the hybrid integrated circuit 10 can be simplified.

In this embodiment, these connection bins 24a,
The vertical separation β and the left and right arrangement bits p of the bins 24b are defined based on the conventional bin arrangement specifications. As a result, the female connector l4 connected to the male connector l2 can be of a conventionally used type, improving economical efficiency.

In addition, since conventionally used male connectors are heavy and large, this compact and lightweight case-shaped hybrid integrated circuit 10
A dedicated male connector 12 is formed correspondingly.

Therefore, according to this embodiment, it is possible to reliably prevent the reduction in size and weight of the hybrid integrated circuit IO described above from being impaired.

Next, referring to FIG. 8, the assembly operation of the hybrid integrated circuit 10 will be described together with the assembly operation of the male connector 12 whose state after assembly is shown in FIG.

First, as described above with reference to FIGS. 4A and 4B, the first and second The circuit boards 16a and 16b are formed on the same plane in an open state. As shown in FIG. 5, the corresponding connection bin supports 30a are attached to the first and second circuit boards 16a and 16b in the opened state.
, 30b are fixed to each other via an adhesive.

Here, as described above, these connecting bin supports 30a
, 30b are already fitted with corresponding connection bins 24a, 24b. In this way, these connection bins 24a, 24b connect the first and second circuit boards 16a, 1
6b is open, the corresponding connection terminal 22g
, 22h, respectively. In particular, this soldering work requires detailed work since there are many connection terminals 22g and 22h, but in this embodiment, the first and second circuit boards 16a are , 16b are opened on the same plane, the work can be carried out reliably, the workability is improved, and the ease of assembly is maintained well.

After that, while holding the first circuit board 16a in the same position, lift the second circuit board 16b so that it is above and parallel to the first circuit board 16a located below. Moving. Then, as shown in Figure 8,
The two connecting bin supports 30a, 30b are joined one above the other.

Here, when both the connection bin supports 30a and 30b are joined vertically in this way, the first and second circuit boards 16
a and 16b are set parallel to each other.

On the other hand, prior to such a joining operation, the first and second circuit boards 16a, 1 are placed on the front and rear parts of the l-th circuit board 16a located below, as shown in FIG.
Frame members 3 6 a and 3 6 b are installed in an upright state for shielding the internal space from the outside while keeping the interval between 6 b constant at a predetermined value and ensuring the strength of the hybrid integrated circuit 10 . Here, one frame member 36a is located slightly inward from the flexible substrate 22f, and the other frame member 36b is located slightly inward from the connection terminals 22g, 22h. The respective installation positions are set.

Then, while maintaining this joined state, they are fitted into the fitting hole 34 of the connector housing 28, and in this fitted state, the male connector l2 is integrally attached to the hybrid integrated circuit 10. Become. Thereafter, as described above, the side plate 18 is attached to the hybrid integrated circuit 10, and the frame 20 is fitted. In this way, a hybrid integrated circuit 10 as shown in FIG. 1 is formed which integrally includes the male connector 12.

After completing such an assembly operation, the assembled male connector 12 is securely bonded to the hybrid integrated circuit 10, and the inside of the hybrid integrated circuit 10 is completely shielded, while each connection bin 24a, 24b is attached. In order to securely fix the soldered portions of the corresponding connection terminals 22g and 22h, an epoxy resin 38 is placed between the male connector 12 and the frame member 36b in the recesses 32a and 32h.
The epoxy resin 38 is injected through the epoxy resin 38, respectively, and the space between the two is filled with the epoxy resin 38.

Further, in order to protect the flexible substrate 22f and to shield the inside of the hybrid integrated circuit 10, the frame member 3
The area in front of 6a is set to be filled with a similar epoxy resin 38 before the frame 20 is attached.

On the other hand, the first circuit board 1 located below as described above
The mounting states of various electronic components in 6a are set as shown in FIG.

In detail, first, as shown in FIG. 9, a circuit network, in other words, a plurality of buses defined from the conductive layer 22c is formed on the insulating layer 22b of the first circuit board 16a in a predetermined pattern. A line is formed. Then, on the insulating layer 22b of the first circuit board 16a, an IC package (for example, a Motorola MC
An IC chip 22d having the same function as 6801) is mounted as a bare chip and connected to the above-mentioned predetermined group of bus lines via bonding wires.

Although not shown in this IC chip 22d,
A ROM containing a predetermined control program is connected.

Further, on the insulating layer 22b of the first circuit board 16a, an IC package (
For example, the IC chip 22d2, which has the same function as the μPD2764 manufactured by NEC, is used as a nonvolatile rewritable memory element in a predetermined group in the above-mentioned bus line via a bonding wire, similar to the IC chip 22d1. It is set to be implemented directly in

Note that a predetermined map, default values, constants defining threshold values, and the like are set and stored in the memory element 22d2. In addition, on this first circuit board 16a, in addition to the CPU 2 2 d + , a peripheral circuit 22 d 3 that manages control operations and an address/data hybrid bus from the CPU 22 d are connected to an address bus and a data path. An input interface circuit 2 2 d s and the like are mounted, which are interposed between a bus separation circuit 22 d that separates the bus into a bus, and a connecting terminal 22 g serving as an input terminal and the CPtJ 22 d.

Here, the above-mentioned CPU 22d has a bus output terminal A, which has a mixture of address bus signals and data path signals.
Configured to have a total of 20 output terminals: 8 terminals that output /D mixed bus signals, 8 terminals that output only address bus signals, and 4 terminals that output control bus signals. has been done. As a result, in a state where the bus separation circuit 22d4 separates address buses and data paths into 8 each, the number of the plurality of connection terminals 22i as external monitor bus take-out terminals is 2.
The number will be set to eight.

As described above, in this embodiment, a plurality of connection terminals 22i as external monitor bus take-out terminals are arranged in parallel with the flexible board 22f at the other end of the lower first circuit board 16a. With this configuration, the connection terminal 22i can be arranged in a state where it coexists with the flexible board 22f, without impairing the function of the flexible board 22f that connects the upper and lower circuit boards 16a, 16b to each other. Further, this connecting terminal 22i is arranged at the other end located on the opposite side to the one end to which the female connector 14 is detachably attached.

In this way, the connection state between the male connector 12 and the female connector 14 once connected is not released in any way, in other words, the hybrid integrated circuit 10 continues to be driven, as shown in the figure. However, connect the connector formed at one end of the monitor device's bus takeoff cable to connection terminal 2.
2i, it becomes possible to easily extract and monitor bus signals.

Since the integrated circuit 10 of this embodiment is configured as described above, at the development stage, with the integrated circuit 10 being driven, an emulator is installed as an external processing device connected via a bus takeoff cable. Accordingly, these R
The data stored in AM or rewritable ROM is also stored in <CPU 22d. A tuning operation will be performed to simulate the control procedure in , and to rewrite data stored in the RAM or rewritable ROM.

In this way, according to this embodiment, it is possible to easily rewrite the data stored in the memory element 22d2 at the development stage, and to simulate the control procedure for operating the CPU 22d based on the rewritten data. Since it is possible to easily implement the following functions, the degree of freedom at the development stage is greatly improved.

It goes without saying that this invention is not limited to the configuration of the embodiments described above, and can be modified in various ways without departing from the gist of the invention.

For example, in the embodiment described above, the hybrid integrated circuit 1
0, it has been explained that it functions as an engine control unit, but it is not limited to this, and for example, it can operate as a functional component of a vehicle speed control device, a control device for four-wheel steering, an automatic transmission control device, etc. It can be configured as follows.

Furthermore, in the embodiment described above, the hybrid integrated circuit 10
has been described as having a pair of upper and lower circuit boards 16a and 16b, but the present invention is not limited to this configuration, and may be configured to have three circuit boards arranged parallel to each other, for example. Needless to say, it's a good thing.

Furthermore, in the embodiments described above, the emulator 42
Although it has been explained that the target to be simulated and tuned is the storage element 22d2 in which data is stored, the target is not limited to this, but it can also be used when the control program of the IC chip as the CPU 22d is similarly processed from the outside. can also be applied in the same way.

Further, in the embodiment described above, the number of signal lines required on the flexible substrate 22f is 22 in total, including 8 data signal lines, 3 power supply lines, and 11 input signal lines. On the other hand, the number of terminals in the connection terminal 22i described above is 28.
Therefore, as a result, the number of terminals set at the other end of the lower first circuit board 16a is 50 in total. This number of terminals can be definitely achieved by widening the width of the hybrid integrated circuit 10 or by using expensive fine-pitch terminals, but miniaturization of the hybrid integrated circuit 10 Or when considering price reduction, 5
It is more preferable to reduce the number of zero terminals as much as possible.

Below, in a state in which the connection terminals 22i are arranged in parallel to the flexible board 22f, the number of terminals set at the other end of the first circuit board 16a will be reduced compared to the above-mentioned embodiment. Regarding other embodiments to achieve, the first
This will be explained with reference to FIG. In the following description, the same parts as in the above-mentioned embodiment are given the same reference numerals, and the description thereof will be omitted.

In this embodiment, as shown in FIG.
22d. Focusing on the fact that eight A/D mixed bus signals are output from the first circuit board 16a, the CP
In addition to U22d, input interface circuit 22d,
The plurality of connection terminals 22i serving as external monitor bus take-out terminals are equipped with only the CPU 2 2.
It is set so that only 12 signals in total, 4 control bus signals from d and 8 address bus signals, are connected.

Further, on the second circuit board 16b, there is an IC chip 22d2 as a memory element disposed on the first circuit board 16a in the above-described embodiment, and a peripheral circuit 22d3.
In the state where the bus separation circuit 22d4 is transferred, the power supply circuit 22d, output circuit 22d, which is originally arranged,
, are arranged together with the output interface circuit 22d8.

Here, in this other embodiment, in order to send eight A/D mixed bus signals and four control bus signals output from the CPU 22d1 to the upper second circuit board 16b, the flexible board 22f is required. The number of signal lines becomes 26. That is, this first circuit board 16a
, the connecting terminal 22i and the flexible board 22f
The number of terminals in and is 38 in total.

On the other hand, in this embodiment, the upper second circuit board 1
6b is also provided with a plurality of connection terminals 22j as external monitor bus take-out terminals. This connection terminal 22j
The number of terminals is set to 16 in total, 8 for address buses and 8 for data paths. That is, in the second circuit board 16b, the number of terminals in the connection terminal 22j and the flexible board 22f is 42 in total.

Thus, in the integrated circuit 1o in another embodiment, the maximum number of required terminals on the first or second circuit board 16a, 16b is 4 on the second circuit board 16b.
Only two pieces are required, and the 50 pieces in the above-mentioned example are sufficient.
Compared to books, you will need 8 fewer copies. By configuring another embodiment in this way, a plurality of connection terminals are connected to the upper and lower circuit boards 16a,
16b, the number of terminals required in the width direction, that is, the number of terminals required for the connection terminals 22i, 22j and the flexible substrate 22f, can be reduced compared to one embodiment. It becomes possible to set the length of the hybrid integrated circuit 10 in the width direction short, or it becomes unnecessary to use expensive terminals with a fine pitch, thereby achieving cost reduction.

[Effects of the Invention] As detailed above, an integrated circuit having a metal substrate according to the present invention is an integrated circuit having a metal substrate according to the first aspect of the present invention. A pair of circuit boards facing each other with a conductive layer formed thereon, a connecting cable that electrically connects these circuit boards to each other, and a paired chip mounted directly on the insulating layer of one circuit board, and can be rewritten from the outside. a circuit element having non-volatile memory contents, and a bus connection terminal connected to a bus line of the circuit element, attached to one circuit board in parallel with the connection cable, and for connection to an external device. It is characterized by

Further, an integrated circuit having a metal substrate according to a second aspect of the present invention includes a conductive layer having a desired shape formed on the metal substrate via an insulating layer, a pair of circuit boards facing each other, and electrical connection between these circuit boards. a second circuit element that is directly mounted as a bare chip on the insulating layer of one circuit board and has non-volatile memory contents that can be rewritten from the outside; a second circuit element that is directly mounted as a bare chip on the board and has non-volatile storage contents that can be rewritten externally; and a second circuit element that is connected to the bus line of the first circuit element and is in parallel with the connection cable on the other circuit board. A first bus connection terminal for connecting to an external device and a bus line of the second circuit element are attached to the other circuit board in parallel with the connection cable. It is characterized by comprising a second bus connection terminal for connecting to external equipment.

Therefore, according to the present invention, in the development stage of an integrated circuit, it is possible to perform operations such as rewriting data, changing control programs, and monitoring stored contents from the outside, thereby increasing the degree of freedom in development. An integrated circuit having a substrate will be provided.

[Brief explanation of drawings]

FIG. 1 is a perspective view showing an embodiment of an integrated circuit having a metal substrate according to the present invention; FIG. 2 is an exploded perspective view showing the structure of the integrated circuit shown in FIG. 1; FIG. 3B is a sectional view taken along line A-A; FIG. 3B is a sectional view taken along line B-B in FIG. 1; FIG. 4A is a plan view showing the structure of the common substrate; Figure 4B is a sectional view showing the configuration of the common board; Figure 5 is a sectional view showing the configuration of the integrated circuit to which the male connector is attached; Figure 6 is an exploded perspective view specifically showing the configuration of the male connector. Fig. 7 is a front view showing the male connector in an assembled state; Fig. 8 is a top view showing both connection bin supports fixed to the circuit board in an open state; Fig. 9 10 is a top view schematically showing the arrangement of circuit elements on the first and second circuit boards and the arrangement of external monitor bus take-out terminals; and FIG. FIG. 7 is a top view schematically showing the arrangement of first and second circuit board-shaped circuit elements and the arrangement of an external monitor bus extraction terminal in another embodiment of the circuit. In the figure, 10...Mixed integrated circuit, 12...Male connector, l4...Female connector, 14a; 14b...Connection terminal, 16a...First circuit board, 16b... Second circuit board, 18... side plate, 18a; 18b...
Stepped portion, 18c... Through hole, 20... Frame, 20a...
・Body, 20b; 20c...flange part, 20d
...Through hole, 22...Common substrate, 22a...Substrate body, 22b...Insulating layer, 22c...Conductive layer, 22C
i, 22C2...Bus line, 22d...Circuit element, 22d1...CPU, 22d2...Storage element,
22d3... Peripheral circuit, 22d4... Bus separation circuit, 22ds... Input interface circuit, 22d6
...power supply circuit, 22d, ...output circuit, 22d8.
...Output interface circuit, 22e...opening,
22f...Flexible board, 22g. 22h...
・Connection terminal, 221; 22j...Connection terminal as external monitor bus take-out terminal, 2 4 a; 2 4
b - connection bin, 24a1.24b. ...Horizontal part, 2
4 a2; 2 4 ba ・”Vertical part, 24as
24bx...Bending portion, 26...Seal rubber 28...Connector housing, 30a...Upper connecting bin support, 30a. ...Standing piece, 30a2...
・Protruding piece, 30b...lower connection bin support, 30b
,... Standing piece, 30b2... Protruding piece, 3 2 a
; 3 2 b... - recess, 3 4... fitting hole,
36a; 36b...Frame member, 38...Epoxy resin, 40a; 40b...Flange portion. Figure 2 Figure 3 Day A Figure 3B Figure 4A Figure 4B

Claims (2)

[Claims] (1) A pair of circuit boards facing each other, each having a conductive layer of a desired shape formed on a metal board via an insulating layer, and a connecting cable that electrically connects these circuit boards to each other; A circuit element that is directly mounted as a bare chip on an insulating layer and has non-volatile memory contents that can be rewritten from the outside, and a circuit element that is connected to a bus line of this circuit element and is attached to one circuit board in parallel with the connection cable. An integrated circuit having a metal substrate, characterized in that the integrated circuit is provided with a bus connection terminal for connection to an external processing device. (2) A pair of circuit boards facing each other, each having a conductive layer of a desired shape formed on a metal board via an insulating layer, and a connecting cable that electrically connects these circuit boards to each other; A first circuit element that is mounted directly as a bare chip on an insulating layer and has non-volatile memory content that can be rewritten from the outside; and a first circuit element that is mounted directly as a bare chip on the insulating layer of the other circuit board and has memory content that is rewritable from the outside. a second circuit element having a non-volatile state; and a first circuit element connected to the bus line of the first circuit element, attached to one circuit board in parallel with the connection cable, and connected to an external processing device. a second bus connection connected to the bus line of the second circuit element, attached to the other circuit board in parallel with the connection cable, and for connection to another external processing device. What is claimed is: 1. An integrated circuit having a metal substrate, comprising a terminal.