JPH0334450A - Integrated circuit having metallic board - Google Patents

Abstract

PURPOSE:To rewrite data, change a control program and monitor storage contents from outside to increase freedom in development by a method wherein a circuit board formed on a conductive layer of a desired shape via an insulation layer, an electronic part packaged on the insulation layer are provided on a metallic board while a means for installing a circuit device having rewritable memory contents nonvolatile is provided on the outer face of an integrated circuit. CONSTITUTION:On an insulation layer 22b of a circuit board 16a, an IC chip 22d2 into which data required by a CPU22d1 for executing a control sequence is written is packaged and it is set to be connected to a specific group in a bus line. In a stage of development an IC package 42 as a memory device having rewritable memory contents nonvolatile mounted on a socket 44 instead of the memory device 22d2 is connected to the specific group in the bus line. If data is to be changed as the result of testing in the stage of development, an IC package 42 is removed from the socket 44 and the IC package with data rewritten is installed again. Therefore operation in the stage of function estimation is easy with freedom.

Description

[Detailed Description of the Invention] [Industrial Application Field] The present invention relates to a circuit board in which a conductive layer of a desired shape is formed on a metal substrate via an insulating layer, and an electronic component mounted on the insulating layer. The present invention relates to an integrated circuit comprising:

Conventionally, conductive layers are adhered to each other through an insulating layer, a circuit element is fixed to each conductive layer, and both conductive layers are connected to each other via a connecting substrate, and then both conductive layers are bonded together via an insulating layer. As an integrated circuit having a pair of metal substrates facing each other,
A technique disclosed in Japanese Patent Publication No. 46-13234 is known. The method for manufacturing an integrated circuit disclosed in this prior art includes the steps of anodizing at least the main surface of an aluminum substrate to form a thin aluminum oxide layer on the surface of the substrate, and forming a thin layer of aluminum oxide on the thin aluminum oxide layer. selectively depositing a resistor material and a good conductor material to form a plurality of circuit elements;

The method is characterized by the steps of fixing a transistor pellet on a lead portion formed by selectively attaching a good conductor, and sealing at least all of the circuit elements with an insulating resin.

In the integrated circuit formed in this manner, a conductive layer having a desired shape is formed on a metal substrate via an insulating layer, and at least one memory element as an electronic component is disposed on the insulating layer. It is non-removably attached as a bare chip.

[Problems to be Solved by the Invention] The integrated circuit formed as described above may be adopted for use in vehicles from the viewpoint of its small size and low cost. However, when an integrated circuit with such a metal substrate is actually used in a vehicle, various tests are conducted during the development stage, and as necessary, the data stored in the memory element may be rewritten or controlled. This will require changes to the program.

However, as mentioned above, this memory element is directly attached to the circuit as a bare chip,
- Once installed, it is impossible to remove it, making it difficult to rewrite data, change control programs, monitor memory contents, etc., and it has been pointed out that the degree of freedom in development is greatly restricted. ing.

This invention was made in view of the above-mentioned problems, and the purpose of this invention is to enable operations such as rewriting data, changing control programs, and monitoring stored contents externally during the development stage of integrated circuits. An object of the present invention is to provide an integrated circuit having a metal substrate that can increase the degree of freedom in development.

[Means for Solving the Problems] In order to solve the above-mentioned problems and achieve the objects, an integrated circuit having a metal substrate according to the present invention includes a conductive layer having a desired shape formed on the metal substrate via an insulating layer. an electronic component mounted on the insulating layer; and a mounting means for mounting a circuit element having rewritable memory contents in a non-volatile manner to a portion defining the outer surface of the integrated circuit. It is characterized by

Further, in the integrated circuit having a metal substrate according to the present invention, the mounting means includes a socket to which a package-type circuit element is detachably mounted.

Further, in the integrated circuit having a metal substrate according to the present invention, the socket is attached to the outer surface of the metal substrate in an insulated state.

[Function] In an integrated circuit having a metal substrate configured as described above, electronic components having non-volatile rewritable memory contents are used for tasks such as rewriting data and changing control programs during the development stage. Since the electronic component is attached via the attachment means attached to the part that defines the outer surface of the integrated circuit, data on this electronic component can be rewritten and controlled by removing it from the attachment means and attaching it to an external processing device. Work such as changing programs can be done externally and independently. In this way, the degree of freedom in the development of integrated circuits is increased.

[Example] Below, an example of an integrated circuit having a metal substrate according to the present invention is applied to a case-shaped hybrid integrated circuit, with reference to FIGS. 1 to 1O of the attached drawings. , will be explained in detail.

FIG. 1 shows a hybrid integrated circuit 10 of this embodiment. This hybrid integrated circuit 10 is configured as a control unit as an independent in-vehicle functional component, and specifically, for example, is configured as a hybrid integrated circuit that independently functions as an engine control unit. ing.

As shown in the figure, this integrated circuit IO is formed as a box-shaped case with a closed interior, and a male connector 12 as a connecting device is integrally attached to one end (rear end). ing. The male connector 12 will be described in detail later, but is configured to be connected to a commonly used female connector 14.

Here, as shown in FIGS. 2 to 3B, this hybrid integrated circuit IO includes a pair of first and second circuit boards 16a and 16b that are vertically spaced apart, and a first and second circuit board. 1
6a and 16b at a predetermined interval and a side plate 18 for closing the side surfaces, and these first and second circuit boards 16a.

16b and a frame 20 that integrally fixes the side plate 18.

Specifically, the first and second circuit boards 16a.

Circuit elements such as an IC chip that functions as a CPU, an IC chip that functions as a memory element, a resistor, and a capacitor, which are necessary to perform the functions of the engine control unit, are attached to the 16b. Specifically, a so-called logic circuit element is connected to the first circuit board 16a located above, and the second circuit board 16b located below
A so-called power circuit element is connected to the . In this embodiment, the above-mentioned IC chip is set to be directly mounted (fixed) on the insulating layer 22b as a bare chip, as will be described later.

Here, the first and second circuit boards 16a.

16b is one common substrate 22 as shown in FIG. 4A.
It is set to be formed by dividing into two pieces. That is, as shown in FIG. 4B, the common substrate 22 includes a substrate body 22a made of a conductive material such as aluminum, an insulating layer 22b adhered to the front surface of the substrate body 22a, and On this insulating layer 22b, a conductive layer 22c is formed in a predetermined circuit pattern and defines a circuit network, and a circuit element 22d is fixed and electrically connected on this conductive layer 22c.

As shown in FIG. 4A, this common substrate 22 has an opening 22e formed in the center thereof in advance and extending vertically. Here, the circuit networks in the left and right portions are connected to each other via a flexible substrate 22f provided across the opening 22e. By cutting out both upper and lower edges (areas indicated by symbols X and Y) of the opening 22e, the above-mentioned pair of circuit boards 16a and 16b are connected to each other via the flexible board 22f. is set to form.

Note that both circuit boards 16a and 16 on the common board 22
A plurality of connection terminals 22g, 22g, and
22h are formed in rows along the edge. Furthermore, connection pins 24a and 24b of the male connector 12, which will be described later, are fixed to these connection terminals 22g and 22h, respectively, so as to protrude outward, and are electrically connected.

Further, as shown in FIG. 2, the above-mentioned side plate 18 is formed in a U-shape on the upper surface with the minus side open, and this open side is set to become one end of the case.

Corresponding circuit boards 16a are provided on the inner edges of both upper and lower end surfaces of the side plate 18.

A stepped portion 18a for receiving the three edges of +6b.

18b are formed respectively.

Here, each circuit board 16a, 16b is fitted into a corresponding step portion 18a, 18b via a seal rubber 26, as shown in FIG. 3A.

By interposing this seal rubber 26, dust is prevented from entering the case from between these rubbers.

On the other hand, as shown in FIG. 2, the above-described frame body 20 is made of synthetic resin as an insulating member, and is configured to sandwich and surround the side surface closed by the side plate 18 from above and below. That is, this frame 20 has side plates 18
and a predetermined distance from both upper and lower ends of the main body 20a (specifically, the upper and lower circuit boards 16a).

The flange portions 20b, 2 extend inward by a distance sufficient to sandwich the three unopened edges of the flange portion 16b, respectively.
It is integrally formed with 0c.

As shown in FIG. 3B, this frame body 20 is constructed by sandwiching the upper and lower first and second circuit boards 16a and 16b, which are respectively fitted into the upper and lower steps 18a and 18b of the side plate l8, from above and below. The case is formed integrally. In addition, as shown in the figure, the first and second circuit boards 1
6a.

The flexible substrate 22f that connects the circuit elements 22d of the side plate 16b to each other is set to be located inward from the other end portion of the side plate 18.

Since the frame body 20 is formed in this way, the side plate 1
8, the first and second substrate circuits 16a,
16b will be maintained in an assembled state while being separated vertically by a predetermined distance.

That is, in this embodiment, the layered integrated circuit lO is
It is formed in a case shape, and both upper and lower surfaces of the case are directly defined by the circuit boards 16a and 16b. As a result, the first and second circuit boards 16a, 16
This results in a reduction in size and weight compared to the case where the device b is housed in a separately prepared case.

On the other hand, as is clear from FIG. 1, the first circuit board 16a
A package-type IC 42 that functions as a memory element having non-volatile memory contents that can be rewritten from the outside is detachably attached to the upper surface, specifically, on the substrate body 22a that defines the outer surface of the first circuit board 16a. A socket 44 for the purpose is attached. Here, this socket 4
At the mounting position 4, the IC chip functioning as a memory element inside the integrated circuit 10 is mounted on the insulating layer 2 as a bare chip.
It is set to correspond to the position where it is directly mounted on 2b.

Next, the case-shaped hybrid integrated circuit I configured in this way is
The configuration of a connecting device for connecting the O to a controlled part of the vehicle will be explained with reference to FIGS. 5 to 8.

This connecting device includes a male connector 12 that is attached in a so-called fleshed state to an opening at one end of a case-shaped hybrid integrated circuit 10, and a female connector 14 that is detachably connected to the male connector 12. It consists of As shown in FIG. 5, this male connector 12 includes a connector housing 28 formed of a box-shaped housing with both front and rear surfaces opened and penetrated, and an upper connecting pin 24a arranged in a horizontal line. Upper connecting bin support 3 installed with
0a and a lower connecting bin support 30b to which the lower connecting bins 24b are attached in a horizontally aligned manner, making up a so-called three-piece configuration.

Here, the upper connecting bottle support 30a and the lower connecting bottle support 30b are vertically symmetrical with a sloped central portion in the vertical direction, and the upper connecting bottle support 30a is
It is integrally formed in an abbreviated form from an upright piece 30a1 and a protruding piece 30a2 that projects outward from the lower end of this upright piece 30a+. On the other hand, the lower connecting bin support 30b is
The upright piece 30bl and this upright piece 30b1 are arranged in a substantially inverted shape.
It is integrally formed with a protruding piece 30b that protrudes outward from the upper end thereof.

The upper connecting bin 24a includes a horizontal portion 24a that horizontally penetrates the protrusion piece 30a2 and protrudes back and forth, and a vertical portion that rises vertically from the inner end of the horizontal portion 24a1 along the inner surface of the upright piece 30a1. 24a2 and this vertical part 24
Bend part 24a bent inward from the upper end of a2 [II]
It is integrally formed from. This bent portion 24a3 is
It is defined as a connection portion that is connected by soldering to the connection terminal 22g formed on the above-mentioned upper first circuit board 16a. In addition, the horizontal portion 24a1 protrudes outward.
This portion is defined as a connection portion that is inserted and connected to the female connector 14.

Further, the lower connecting bin 24b has a horizontal portion 24b + that horizontally penetrates the protruding piece 30b2 and protrudes back and forth, and a vertical portion vertically extends along the inner surface of the piece 30b that stands up from the inner end of the horizontal portion 24b1. It is integrally formed from a falling vertical portion 24b2 and a bent portion 24b bent inward from the lower end of this vertical portion 24b2. This bent portion 24b is defined as a connection portion that is connected by soldering to the connection terminal 22h formed on the lower second circuit board 16b described above. Further, a portion of the horizontal portion 24b1 that protrudes outward is defined as a connecting portion that is inserted and connected to the female connector 14.

The connecting bin supports 30a and 30b are set to a size that allows them to be fitted into an opening at one end of the case-like hybrid integrated circuit 10 while being joined vertically to each other. In other words, both the upright pieces 30a,
, 30b, and is set to exactly define the inner periphery of the opening at one end of the hybrid integrated circuit 10.

Here, as shown in FIG. 6, a recess 32a, a recess 32a, a
32b is formed. These recesses 32a, 32b are defined as injection holes for epoxy resin to be injected when the male connector 12 is integrated into the hybrid integrated circuit 10, as will be described later.

Further, the above-mentioned upper and lower connecting bins 24a and 24b are formed in a vertically symmetrical shape, that is, the same shape, and the upper and lower connecting bin supports 30a and 30b are also formed in a vertically symmetrical and identical shape. In this way, the husband//connection bin 24a
, 24b attached to the connecting bin supports 30a, 30
Since the parts b have the same shape, parts can be made common, and costs can be reduced.

On the other hand, the above-mentioned connector housing 28 has an orthogonal hole 34 formed therein so as to pass through the connector housing 28 in the front-rear direction. As shown in FIG. 7, this fitting hole 34 has the same protruding pieces 30aa and 30a that are overlapped with each other when both the upper and lower connecting bottle supports 30a and 30b are joined.
, 30bx are set to a size large enough to fit them.

Furthermore, mounting flanges 40a and 40b are integrally formed on both sides of the connector housing 28. These flange portions 40a.

40b is provided for fixing the model connector 12 to the body of a vehicle (not shown) in a state where it is attached and fixed to the hybrid integrated circuit 10. In this way, it is not necessary to provide a flange portion on the hybrid integrated circuit 10 itself for attaching the hybrid integrated circuit 10, so that the configuration of the hybrid integrated circuit IO can be simplified.

In this embodiment, these connection bins 24a,
The vertical separation distance β and the left and right arrangement pitches of the bins 24b are defined based on the specifications of the conventionally used bin arrangement. As a result, the female connector 14 connected to the male connector 12 can be of a conventionally used type, and the permeability is improved.

In addition, since conventionally used male connectors are heavy and large, this compact and lightweight case-shaped hybrid integrated circuit 10
A dedicated male connector 12 is formed correspondingly.

Therefore, according to this embodiment, it is possible to reliably prevent the reduction in size and weight of the hybrid integrated circuit IO described above from being impaired.

Next, referring to FIG. 8, the assembly operation of the hybrid integrated circuit 10 will be explained together with the assembly operation of the male connector 12, which is shown in FIG. 5 after the assembly is completed.

First, as described above with reference to FIGS. 4A and 4B, the first and second The circuit boards 16a and 16b are formed on the same plane in an open state. The first and second circuit boards 16a, 16b are in such an open state.

As shown in FIG. 5, a corresponding connecting bin support 30a,
30b are fixed to each other via an adhesive.

Here, as mentioned above, these connection bin supports 14 bodies 30
a, 30b have corresponding connection bins 24a, 24
b is already attached. In this way, these connection bins 24a, 24b connect the first and second circuit boards 1
6a, 16b are open, the corresponding connection terminal 22g.

22h respectively. In particular, this soldering process requires a 22g connection terminal.

Since the number of circuit boards 22h is large, detailed work is required, but in this embodiment, the first and second circuit boards 16a and 16b are opened on the same plane. Therefore, the work can be carried out reliably, the workability is improved, and the assemblability is maintained well.

After that, while holding the first circuit board 16a in the same position, lift the first circuit board 16a so that it is above and parallel to the first circuit board 16a located below. Moving. Then, as shown in Figure 8,
Both connecting bin supports 30a, 30b are joined one above the other.

Here, in this way both connecting bin supports 30a.

When the upper and lower circuit boards 30b are joined together, the first and second circuit boards 16a and 16b are set parallel to each other.

On the other hand, prior to such a joining operation, the first and second circuit boards 16a, 1 are placed on the front and rear parts of the first circuit board 16b located below, as shown in FIG.
6b is maintained constant at a predetermined value, the frame members 36a and 36b are installed in an upright state for shielding the internal space from the outside while ensuring the strength of the hybrid integrated circuit 10. And one frame member 36a
are located slightly inward from the flexible substrate 22f, and the other frame member 36b is located slightly inward from the connection terminals 22g and 22h. ing.

Then, while maintaining this joined state, they are fitted into the fitting hole 34 of the connector housing 28, and in this fitted state, the male connector 12 is integrally attached to the hybrid integrated circuit 10. . After this,
As described above, the side plate 18 is attached to the hybrid integrated circuit IO, and the frame 20 is fitted. In this way, a hybrid integrated circuit 10 as shown in FIG. 1 is formed which integrally includes the male connector 12.

After completing such an assembly operation, the assembled male connector 12 is reliably bonded to the layered integrated circuit 10, and the inside of the hybrid integrated circuit 10 is completely shielded, while each connection bin 24a, 24b and a corresponding connection terminal 22g.

22h, in order to securely fix the parts, epoxy resin 38 is injected between the male connector 12 and the frame member 36b through the above-mentioned recesses 32a and 32b, respectively. The epoxy resin 38 fills the space between the two.

Further, in order to protect the flexible substrate 22f and to shield the inside of the hybrid integrated circuit IO, the frame member 3
The area in front of 6a is set to be completely filled with a similar epoxy resin 38 before the frame body 20 is attached.

On the other hand, the above-mentioned first circuit board 1 located above
The mounting states of various electronic components in 6a are set as shown in FIG.

In detail, first, as shown in FIG. 9, on the insulating layer 22b of the first circuit board 16a, a plurality of circuit networks, in other words, formed from the conductive layer 22c are formed in a predetermined pattern. A pass line is formed. Then, on the insulating layer 22b of this first circuit board 111ii 16a, there is a C.
An IC chip 22d1 having the same function as a tC package (for example, MC6801 manufactured by Motorola) functioning as a PU is mounted as a bare chip, and is connected to a predetermined group of the above-mentioned pass lines via bonding wires. Although not shown, a ROM containing a predetermined 1JII program is connected to this IC chip 22d1.

Moreover, on the insulating layer 22b of this first circuit board lea, there is a
2d is an IC chip 22 having the same function as an IC package (for example, μPD2764 manufactured by NEC) into which various data necessary for executing control procedures are written.
d2 is mounted as a bare chip and is set to be connected to a predetermined group in the path line, but at the development stage, this memory element 22d2 is not mounted.
Instead of this memory element 22d2, the above-mentioned socket 44
An IC package 42, which serves as a storage element having non-volatile rewritable storage contents, is connected to a predetermined group of the above-mentioned pass lines.

Specifically, as shown in FIG.
A is formed with through holes 16c through which the connection pins 44a of the socket 44 are inserted, and these through holes 16c are insulated including their surroundings. And these through holes 16c
The tip of the connecting pin 44a protrudes into the case-shaped integrated circuit 10 through the bonding wire 46 or is directly soldered to the memory element mounted as a pair chip at the product stage. 22d2, respectively.

Note that a predetermined map, default values, constants defining threshold values, etc. are set and stored in the memory element 22d2. In addition, various other circuit elements such as a power transistor, a gate circuit element, a voltage regulator, a capacitor, a resistor, a diode, etc. are mounted on the first circuit board 16a.

In this embodiment, the IC package 42 is connected to the integrated circuit 10 via the socket 44 during the development stage.
The same configuration is achieved when the memory element 22d2 is mounted as a pair chip at the product stage. As a result, if it is necessary to change the data as a result of testing the hybrid integrated circuit 10 configured in this way during the development stage, this IC package 42
is removed from the socket 44 and attached to a data rewriting device (not shown), where predetermined data is rewritten. Then, the IC package 42 whose data has been rewritten in this way is attached to the socket 44 again, and a state in which it can function as a hybrid integrated circuit 1O is achieved.

In this way, in this embodiment, the setting of data to be stored in the memory element 22d2 at the product stage, which is the most problematic at the development stage, is achieved by setting the IC package 42 which acts on behalf of the function of the memory element 22d2. Since it is attached externally to the integrated circuit 1O, work at the function evaluation stage can be performed easily and with a large degree of freedom.

On the other hand, after this development stage is completed, the memory element 22d3
When the data to be stored in the memory element 22d2 is determined, such data is separately written in the memory element 22d2 and then mounted on a predetermined location on the insulating layer 22b of the first circuit board 16a. .

Since the integrated circuit 10 of this embodiment is configured as described above, at the development stage, an IC package that acts as the memory element 22d2 is installed via the socket 44 without mounting a RAM or a rewritable ROM. 42 is externally connected to the integrated circuit 10, so
When rewriting the data stored in this IC package 42, remove this IC package 42.

By attaching it to the data rewriting device, the integrated circuit 1
This means that 0 can be easily rewritten without being decomposed.

In this way, according to this embodiment, it is possible to easily rewrite the data stored in the storage element 22d2 at the development stage, and to control the control procedure for operating the CPU 22d based on the rewritten data. Since this can be actually carried out using the integrated circuit 10 itself, the degree of freedom in the development stage is greatly improved.

It goes without saying that this invention is not limited to the configuration of the one embodiment described above, and can be modified in various ways without departing from the gist of the invention.

For example, in one embodiment described above, the hybrid integrated circuit 1
0, it has been explained that it functions as an engine control unit, but it is not limited to this, and for example, it can operate as a functional component of a vehicle speed control device, a control device for four-wheel steering, an automatic transmission control device, etc. It can be configured to do so.

Furthermore, in the embodiment described above, the hybrid integrated circuit 10
has been described as having a pair of upper and lower circuit boards 16a and 16b, but the present invention is not limited to this configuration, and may be configured to have three circuit boards arranged parallel to each other, for example. Needless to say, it's a good thing.

Further, in the above-described embodiment, the IC package mounted on the socket 44 is described as corresponding to the memory element 22d, but the IC package is not limited to this.
An IC package corresponding to the CPU 22d may be attached.

As a result, the present invention can be similarly applied to the case where the control program for the IC chip is processed from the outside.

Furthermore, in the embodiment described above, the CPU 22d and the memory element 22d2 as circuit elements were described as being mounted directly on the insulation H22b as a bare chip.
The present invention is not limited to such a configuration, and the CPU 22c1. The present invention can be similarly applied to a case where the memory element 22d2 is formed of a package type IC and is non-removably mounted on a predetermined pass line by soldering.

Further, in the embodiment described above, the socket 44 was described as being attached on the upper first circuit board 16a, but the present invention is not limited to such a configuration, and the socket 44 shown in FIG. As shown in other embodiments shown in FIGS. 13 to 13, it may be configured to be attached to the side surface of the hybrid integrated circuit 10. Other embodiments will be described in detail below.

In the following description, the same parts as in the above-described embodiment are given the same reference numerals, and the description thereof will be omitted.

As shown in FIG. 11, an opening 50 is formed seven times over the entire surface of the frame 20 that constitutes the rear side surface of the hybrid integrated circuit 10. A ROM socket 52 is provided over the entire area, and this ROM socket 52 is attached to the rear surface of the side plate 18. This ROM socket 52 is attached with the IC package 42 functioning as the above-mentioned storage element inserted therein. The outer surface of the ROM socket 52 is set to extend inward from the opening 50 by a predetermined distance, more specifically, by at least a distance longer than the thickness of the IC package 42.

On the other hand, as shown in FIG. 12, both upper and lower circuit boards 16a,
In the part that defines the other end of the case of 16b, flexible connection terminals 22i and 22j are formed inwardly and connected by a flexible board 22f, and a ROM socket is provided at the end. 22g are respectively formed on the ROM connection terminals 22 to which the connection pins 52a of the ROM connection pins 52a are slidably connected and electrically connected.

As shown in FIG. 13, when the ROM socket 52 is attached with the hybrid integrated circuit 10 configured, the connection pin 52a of the ROM socket 52 is attached.
are ROM connection terminals 22k of the upper and lower circuit boards 16a and 16b, respectively.

22I2. As a result,
This ROM socket 52 has an IC that functions as a storage element.
By attaching the package 42, the IC package 42 is electrically connected to both the upper and lower circuit boards 16a and 16b. Furthermore, this ROM socket 52
As in the above-mentioned embodiment, the IC package 42
This IC is removably attached.
The package 42 may include the ROM package 5 as required.
2, that is, it can be removed from the hybrid integrated circuit 10.

In this way, by configuring other embodiments as shown in FIGS. 11 to 13, it becomes possible to achieve the same effects as the above-mentioned embodiments, and also to provide a removable IC. The package 42 has a ROM socket 52
When the hybrid integrated circuit 10 is attached to the IC package, it is generally hidden inside the case.
It has the unique effect of eliminating the risk of falling off.

[Effects of the Invention] As detailed above, the integrated circuit having a metal substrate according to the present invention includes a circuit board in which a conductive layer of a desired shape is formed on the metal substrate via an insulating layer, and The integrated circuit is characterized by having an electronic component mounted on the integrated circuit, and a mounting means for mounting a circuit element having non-volatile rewritable memory contents to a portion defining the outer surface of the integrated circuit.

Further, in the integrated circuit having a metal substrate according to the present invention, the mounting means includes a socket to which a package-type circuit element is detachably mounted.

Further, in the integrated circuit having a metal substrate according to the present invention, the socket is attached to the outer surface of the metal substrate in an insulated state.

Therefore, according to the present invention, during the development stage of an integrated circuit, it is possible to perform operations such as rewriting data, changing control programs, and monitoring stored contents externally.
An integrated circuit having a metal substrate that can increase the degree of freedom in development will be provided.

[Brief explanation of drawings]

FIG. 1 is a perspective view showing an embodiment of an integrated circuit having a metal substrate according to the present invention; FIG. 2 is an exploded perspective view showing the structure of the integrated circuit shown in FIG. 1; FIG. 3B is a sectional view taken along line AA in FIG. 1; FIG. 4A is a plan view showing the configuration of the common substrate; Figure 4B is a sectional view showing the configuration of the common board; Figure 5 is a sectional view showing the configuration of the integrated circuit to which the male connector is attached; Figure 6 is an exploded perspective view specifically showing the configuration of the male connector: Figure 7 is a front view of the male connector in its assembled state; Figure 8 is a top view of both connection bin supports secured to the circuit board in the open position; Figure 9 is a top view of the male connector in its assembled state; A perspective view schematically showing the arrangement of circuit elements on the first circuit board: Fig. 10 is a cross-sectional view showing the connection state of the socket attached to the first circuit board shown in Fig. 9: Fig. 11 The figure is a perspective view showing another embodiment of this embodiment; FIG. 12 is a perspective view showing both the upper and lower circuit boards that constitute the hybrid integrated circuit shown in FIG. 11 in an open state; FIG. 13 is a longitudinal cross-sectional view showing the hybrid integrated circuit shown in FIG. 11 with the rear section cut away. In the figure, 10: hybrid integrated circuit, 12: male connector, 14: female connector, 14a; 14b: connecting terminal, 16a: first circuit board, 16b: first circuit board. 2
circuit board, 16c... through hole, 18... side plate, 18
a: 18b...Stepped portion, 18c...Through hole, 20...
Frame body, 20a... Main body, 20b; 20c... Flange portion, 22... Common board, 22a... Board main body, 22b... Insulating layer, 22c... Conductive layer, 22d...
...Circuit element, 22d, CPU, 22da'', memory element, 22e, opening, 22f, flexible substrate, 22g; 22h, connection terminal, 22i; 22j.
...Flexible connection terminal, 22, 22β...RO
M connection terminal, 24a; 24b... connection bin, 24a+
;24b+...Horizontal part, 24az;24b*
...Vertical part, 24aa; 24tz'' Bent part, 26-...Seal rubber, 28...Connector housing, 30a...Upper connection bin support, 30a1.
...Upright piece, 30az...Protruding piece, 30b...Lower connection bin support, 30 b + '-' Upright piece, 30
b, ... protrusion piece, 32a:32b ... recess,
34... Fitting hole, 36a; 36b... Frame member, 38... Epoxy resin, 40a:40b... Flange portion, 42... IC package, 44... Socket, 44a... - Connection bin, 46... Bonding wire, 48... Bonding pad, 50... Opening, 52... ROM socket, 52a... Connection bin.

Claims (3)

[Claims] (1) A circuit board in which a conductive layer of a desired shape is formed on a metal substrate via an insulating layer, an electronic component mounted on the insulating layer, and a portion that defines the outer surface of this integrated circuit can be rewritten. 1. An integrated circuit having a metal substrate, the integrated circuit comprising a mounting means to which a circuit element having non-volatile memory contents is mounted. (2) The integrated circuit having a metal substrate according to claim 1, wherein the mounting means includes a socket to which a package-type circuit element is detachably mounted. (3) The integrated circuit having a metal substrate according to claim 2, wherein the socket is attached to the outer surface of the metal substrate in an insulated manner.