JPH02220376A - Connector structure for integrated circuit including metal substrate - Google Patents

Abstract

PURPOSE:To simplify the structure, make the size compact and the cost low by providing a connector housing installed at a pair of circuit substrates with connection pins directly connected with the connected substrate. CONSTITUTION:An integrated circuit consists of a pair of circuit substrates 16a, 16b, a side plate 18, and a frame body 20, and a circuit element is installed at the substrates 16a, 16b. The substrates 16a, 16b are formed by separating a common substrate 22 into two, and the substrate 22 has an aperture part 22e formed extending vertically, where circuit nets at the right part and the left part of this are connected with each other through a flexible substrate 22f. Connection terminals 22g, 22h are formed in lateral two lines to be directly connected having male connector connection pins 24a, 24b soldered to be electrically connected almost at the center of the flexible substrate 22. The frame 20 is assembled by holding the substrates 16a, 16b engaged at an upper and a lower step part 18a, 18b of the side plate 18.

Description

[Detailed Description of the Invention] [Industrial Application Field] This invention provides a circuit board in which a conductive layer is adhered to a metal substrate via an insulating layer, and circuit elements are fixed to each conductive layer. The present invention relates to a connector structure for an integrated circuit having a pair of metal substrates in which layers are connected to each other via a connection substrate and both conductive layers are opposed to each other.

[Prior art] Conventionally, conductive layers are attached to each other through an insulating layer, a circuit element is fixed to each conductive layer, and both conductive layers are connected to each other via a connecting board. As an integrated circuit having a pair of metal substrates facing each other,
A technique disclosed in Japanese Patent Publication No. 46-13234 is known. The integrated circuit manufacturing method disclosed in this prior art includes the steps of anodizing at least one surface of an aluminum substrate to form a thin aluminum oxide layer on the substrate surface, and forming a resistor material on the aluminum oxide thin layer. a step of forming a plurality of circuit elements by selectively attaching a good conductor material; and a step of fixing a transistor pellet on the lead portion formed by selectively attaching a good conductor material; The method is characterized by including a step of sealing at least all of the circuit elements with an insulating resin.

In the integrated circuit formed in this way, heat generated from resistors, transistors, etc. during operation can be dissipated quickly and effectively, making it possible to integrate output circuits, etc. .

[Problems to be Solved by the Invention] The integrated circuit formed as described above may be adopted for use in vehicles from the viewpoint of its small size and low cost. However, when such an integrated circuit is actually used in a vehicle, it is necessary to take advantage of its small size and low cost while also reliably connecting it to other control parts of the vehicle.

Here, if a conventional connecting device is used, this connecting device is relatively large and not cheap, so even if the integrated circuit itself is made smaller and lower in cost, the benefits cannot be fully demonstrated. Problems have been pointed out that make it impossible to do so.

This invention has been made in view of the above-mentioned problems, and an object of the invention is to provide a connector structure for an integrated circuit having a metal substrate that can be made smaller and lower in cost.

[Means for Solving the Problems] In order to solve the above-mentioned problems and achieve the objectives, a connector structure for an integrated circuit having a metal substrate according to the present invention has the following features:
A pair of circuit boards, in which a conductive layer is pasted on a metal substrate through an insulating layer, and a circuit element is fixed to each conductive layer, are connected to each other through a connecting board, and both conductive layers are connected to each other through a connecting board. In a connector structure for an integrated circuit having layers facing each other, there is a connector housing attached across the pair of circuit boards, and a connector housing provided on the connector housing for inputting and outputting signals to and from the outside. The device is characterized in that it includes a connection pin for connecting the device, and a connection pin directly bonded to the connection board.

[Function] In the integrated circuit connector structure having the metal substrate configured as described above, the connection pins are directly joined to the connection board that connects both circuit boards to each other. As a result,
There is no need to connect the connection pin and the circuit board with a dedicated connector, and the overall configuration can be simplified.

[Embodiment] Hereinafter, the configuration of an embodiment of a connector structure for an integrated circuit having a metal substrate according to the present invention will be described in detail with reference to FIGS. 1 to 7 of the accompanying drawings.

FIG. 1 shows an integrated circuit 10 to which a connecting device having the connector structure of this embodiment is connected. This integrated circuit IO is configured as an independent in-vehicle functional component, and specifically, is configured as an integrated circuit that independently functions as, for example, an engine control unit.

As shown in the figure, this integrated circuit 10 is formed as a box-shaped case with a closed interior, and a male connector 12 as a connecting device is integrally attached to one end. The male connector 12 will be described in detail later, but is configured to be connected to a commonly used female connector 14.

Here, as shown in FIGS. 2 to 3B, this integrated circuit 10 consists of a pair of circuit boards 16a and 1 that are vertically spaced apart.
6b, a side plate 18 for separating both circuit boards 16a, 16b by a predetermined distance and closing the side surfaces, and a frame 20 for integrally fixing both circuit boards 16a, 16b and side plate 18. has been done.

Specifically, both circuit boards 16a and 16b are equipped with circuit elements such as an IC chip, a resistor, and a capacitor necessary for functioning as an engine control unit. Here, both circuit boards 16a and 16b are set to be formed by dividing one common board 22 into two, as shown in FIG. 4A. That is, as shown in FIG. 4B, the common substrate 22 includes a substrate body 22a made of a conductive material, for example, aluminum, and an insulating layer 2 adhered to the front surface of the substrate body 22a.
2b, a conductive layer 22c formed in a predetermined circuit pattern on this insulating FJ 22b to define a circuit network, and a circuit element 22d fixed on and electrically connected to this conductive layer 22c. There is.

As shown in FIG. 4A, the common substrate 22 has an opening 22e formed in advance in the central portion thereof, which extends in the vertical direction. Here, the circuit networks in the left and right portions with the opening 22e as a boundary are connected to each other via a flexible substrate 22f serving as a connection substrate provided across the opening 22e. And this opening 22e
By cutting both the upper and lower edges (areas indicated by symbols X and Y) including the upper and lower ends of the flexible substrate 2 described above,
a pair of circuit boards 16a connected to each other via 2f;
16b is set to be formed.

Incidentally, approximately in the center of this flexible substrate 22f, there is a fifth
As shown in the figure, a plurality of connection terminals 22g and 22h are formed in two horizontal rows to which connection pins 24a and 24b of a male connector 12, which will be described later, are electrically connected by soldering. ing.

Further, the above-mentioned side plate 18 is formed in a U-shape on the upper surface with the minus side open, and the open side is set to become one end of the case.

Step portions 18a and 18b are formed at the inner edges of both upper and lower end surfaces of the side plate 18 to receive the three edges of the corresponding circuit boards 16a and 16b.

Here, each circuit board 16a, 16b is fitted into a corresponding step portion 18a, lQb via a seal rubber 26, as shown in FIG. 3A.

By interposing this seal rubber 26, dust is prevented from entering the case from between these rubbers.

On the other hand, as shown in FIG. 2, the above-mentioned frame body 20 is formed so as to sandwich and surround the side surface closed by the side plate 18 from above and below. That is, this frame 20
is a main body 20a facing the side plate 18, and this main body 20a.
A predetermined distance from both the upper and lower ends of (specifically, the upper and lower circuit boards 16a).

The flange portions 20b, 2 extend inward by a distance sufficient to hold the three unopened edges of the flange portion 16b, respectively.
2c.

As shown in FIG. 3B, this frame body 20 is constructed by sandwiching the upper and lower circuit boards 16a and 16b, which are fitted into the upper and lower step portions 18a and 18b of the side plate 18, from above and below, so that the case is integrated. It is formed to be configured. As shown in the figure, the flexible board 22f that connects the circuit elements 22d of the upper and lower circuit boards 16a and 16b to each other is
It is set so as to be located opposite to the opening surface on one end side to which the male connector 12 of the case is attached.

Since the frame body 20 is formed in this way, the side plate 1
8, both board circuits 16a and 16b are maintained in an assembled state while being separated vertically by a predetermined distance.

That is, in this embodiment, the integrated circuit 10 is formed in the shape of a case, and the upper and lower surfaces of the case are
It will be defined directly from the circuit boards 16a, 16b. As a result, the size and weight of the circuit boards 16a and 16b can be reduced compared to the case where the circuit boards 16a and 16b are housed in a separately prepared case.

Next, the configuration of a connecting device having a connector structure, which is a feature of the present invention, for connecting the case-shaped integrated circuit 10 configured as described above to a controlled part of a vehicle is shown in FIGS. 6 and 7. This will be explained with reference to the figures.

As shown in FIG. 6, this connecting device includes a male connector 12 which is attached to an opening at one end of a case-shaped integrated circuit 10 in a so-called external state, and is detachably connected to this male connector 12. It is composed of a female connector 14. The male connector 12 includes a connector housing 28 formed from a box-shaped housing with both front and rear sides open, and the connector housing 28 is fitted into an opening at one end of the case-shaped integrated circuit 10. It is set like this.

Moreover, this connector housing 28 is formed with an integral partition wall 30 for dividing the internal space into two parts in the front and back parts, and the above-mentioned connection pin 24a and 24b are attached. Here, the outer end (i.e., the left end in the figure) of each of these connection pins 24a, 24b functions as a connection end connected to the female connector 14, and the inner end (i.e., the left end in the figure) functions as a connection end to be connected to the female connector 14.
The right end) functions as a joining end to be joined to the flexible substrate 22f described above.

Here, each connection end of each connection pin 24a, 24b is
As shown in FIG. 7, a connecting terminal 2 that penetrates through the flexible substrate 22f and forms a part of a circuit network formed on the flexible substrate 22f by soldering on the inner surface thereof.
It is set to be connected to 2g and 22h, respectively.

In this embodiment, these connection pins 24a,
The vertical separation β and the horizontal arrangement pitch p of the pins 24b are defined based on the specifications of the conventionally used pin arrangement. As a result, the female connector 14 connected to the male connector 12 can be of a conventionally used type, improving economical efficiency.

In addition, the conventional male connector type is heavy and large, so instead of using this type, we have developed a dedicated male connector to accommodate this smaller and lighter case-shaped integrated circuit lO. A type connector 12 is formed. Therefore, according to this embodiment, it is possible to reliably prevent the reduction in size and weight of the integrated circuit 10 described above from being impaired.

As described in detail above, in the connector structure of this embodiment, the connecting pin 24a is attached to the connector housing 28 of the male connector 12.

24b is the first and second circuit board 16a.

They are directly joined to connecting terminals 22g and 22h formed on the flexible substrate 22f that connects the flexible substrates 16b to each other. As a result, according to this embodiment, there is no need to connect the connecting pins 24a, 24b and the circuit boards 16a, 16b using dedicated connectors, and the overall configuration can be simplified.

Further, in the above-described embodiment, the integrated circuit 10 to which the male connector 12 is fixed is configured such that its upper and lower surfaces are defined by a pair of circuit boards 16a and 16b. As a result, according to this embodiment, the number of parts of the integrated circuit 10 is reduced, and the integrated circuit 10 is made smaller and less expensive.

Further, in this embodiment, the circuit board 16a,
16b is a conductive aluminum substrate body 22a, an insulating N22b stuck on this substrate body 22a,
It is formed to include a conductive layer 22c adhered in a predetermined circuit pattern on the t♀ layer 22b. As a result, the heat generated from the various circuit elements 22d can be dissipated by using the aluminum substrate body 22a as a heat sink, eliminating the need for a separate heat dissipation member, resulting in significant downsizing. will be achieved.

Furthermore, in this embodiment, as described above, since the upper and lower surfaces of the case are respectively constituted by a pair of circuit boards 16a and 16b having a board body 22a made of aluminum, these circuit boards 16a and 16b are It can be used as an electromagnetic shielding member. As a result, the internal space of the integrated circuit IO on this case is substantially electromagnetically shielded, and the circuit element 22d is less susceptible to electromagnetic interference.

It goes without saying that this invention is not limited to the configuration of the one embodiment described above, and can be modified in various ways without departing from the gist of the invention.

For example, in the embodiment described above, the integrated circuit 10 was explained to function as an engine control unit, but the integrated circuit 10 is not limited to this, and may be used, for example, as an automobile speed control device, a control device for four-wheel steering, or an automatic transmission control device. It can be configured to operate as a functional component of a control device or the like.

Furthermore, in the embodiment described above, the male connector 12
Although it has been described that the male connector 12 is fixed to the integrated circuit 10 using a so-called external method, the present invention is not limited to such a configuration, and the male connector 12 is fixed to the integrated circuit 10 using a so-called internal sealing method. It may be configured to be fixed to.

[Effects of the Invention] As detailed above, in the connector structure for an integrated circuit having a metal substrate according to the present invention, a conductive layer is adhered to the metal substrate via an insulating layer, and a circuit element is attached to each conductive layer. In a connector structure for an integrated circuit in which a fixed pair of circuit boards are provided with both conductive layers connected to each other via a connecting board and both conductive layers facing each other, the pair of circuit boards The device is characterized by comprising a connector housing attached across the connector housing, and a connecting pin provided on the connector housing for inputting and outputting signals to the outside, and connected directly to the connecting board. .

Therefore, according to the present invention, there is provided a connector structure for an integrated circuit having a metal substrate that can be made smaller and lower in cost.

[Brief explanation of the drawing]

FIG. 1 is a perspective view showing an embodiment of a connector structure for an integrated circuit having a metal substrate according to the present invention, together with an integrated circuit to which this is applied; FIG. 2 is an exploded view showing the structure of the integrated circuit shown in FIG. 1. Perspective view; Figure 3A is a cross-sectional view taken along line A-A in Figure 1; Figure 3B is a cross-sectional view taken along line B-B in Figure 1; Figure 4A; Figure 4B is a plan view showing the configuration of the common board; Figure 4B is a cross-sectional view showing the configuration of the common board; Figure 5 is a plan view showing how the connection terminals are formed on the flexible board; Figure 6 is the attachment of the male connector. is a cross-sectional view showing the state; and FIG. 7 is a cross-sectional view showing the state of connection of the connection pin to the flexible substrate. In the figure, 1o... integrated circuit, 12... male connector,
14...Female connector, 16a; 16b...Circuit board, 18...Side plate, 18a; 18b...Step part,
20... Frame body, 20a... Main body, 20b; 20
c...Flange part, 22...Common board, 22a...
- Substrate body, 22b... Insulating layer, 22c... Conductive layer, 22d... Circuit element, 22e... Opening, 22f
... Flexible board, 22g: 22h... Connection terminal, 22i; 22j... Outer flange part, 24a
; 24b...Connection pin, 26...Seal rubber,
28... Connector housing, 30... Partition wall.

Claims (1)

[Claims] A pair of circuit boards in which a conductive layer is adhered to a metal substrate via an insulating layer and a circuit element is fixed to each conductive layer, and both conductive layers are connected to each other via a connecting substrate. In a connector structure for an integrated circuit having both conductive layers facing each other, a connector housing is attached across the pair of circuit boards, and a connector housing is provided on the connector housing to communicate signals with the outside. 1. A connector structure for an integrated circuit having a metal substrate, comprising a connection pin for input/output, which is directly bonded to the connection substrate.