JPH02119076A - Integrated circuit having metal substrate - Google Patents

Abstract

PURPOSE:To reduce the size and cost of an integrated circuit by using a metal substrate as a ground plate and part of it as a connection terminal. CONSTITUTION:On a metal substrate 22a are disposed an insulation layer 22b, a conductive foil 22c and a circuit element 22d and, leaving a connecting section 22f in its center, they are bent to form circuit boards 16a, 16b. The circuit boards 16a, 16b, electrically connected to each other and maintaining relative specified distance from each other, are housed in a frame 20 to form a compact integrated circuit 10. The central part of the circuit board 16a located higher is cut and erected to form a fin 30. The metal substrate 22a is used as a ground while the fin 30 is used as a ground connection terminal. As a result, an expensive and bulky connection device is not used to reduce cost accordingly.

Description

DETAILED DESCRIPTION OF THE INVENTION [Industrial Application Field] The present invention relates to an integrated circuit having a metal substrate, in which a conductive foil is adhered to the metal substrate via an insulating layer and circuit elements are fixed thereto.

[Prior art] Conventionally, an integrated circuit in which a conductive foil is pasted on a metal substrate via an insulating layer and circuit elements are fixed is known as
A technique disclosed in Japanese Patent No. 3234 is known. The integrated circuit manufacturing method disclosed in this prior art includes the steps of anodizing at least one main surface of an aluminum substrate to form a single layer of aluminum oxide on the surface of the substrate, and forming a resistor on the aluminum oxide thin layer. The process of forming multiple circuit elements by selectively depositing a material and a good conductor material, and fixing a transistor bellet on the lead portion formed by selectively depositing a number of good conductor materials. and a step of sealing at least all of the circuit elements with an insulating resin.

In the integrated circuit formed in this way, heat generated from resistors, transistors, etc. during operation can be dissipated quickly and effectively, making it possible to integrate output circuits, etc. .

[Problems to be Solved by the Invention] The integrated circuit formed as described above may be used, for example, in a vehicle from the viewpoint of its small size and low cost. Here, when such an integrated circuit is actually used in a vehicle, it is necessary to connect the ground to the integrated circuit.However, in the past, the connector terminal for this grounding was connected separately to the integrated circuit. However, even if an integrated circuit with a metal substrate of the above-mentioned configuration is used to take advantage of its small size and low cost, and to ensure reliable connection with other control parts of the vehicle, These effects will be lost because a special connector terminal must be used.

This Motomachi was developed in view of the above-mentioned problems, and an object of the present invention is to provide a small-sized and
An object of the present invention is to provide an integrated circuit having a metal substrate that can reduce costs.

[Means for Solving the Problems] In order to solve the above-mentioned problems and achieve the purpose, an integrated circuit having a metal substrate according to the present invention is provided by pasting a conductive foil on the metal substrate with an insulating layer interposed therebetween. However, in the integrated circuit in which circuit elements are fixed, the metal substrate is used as a grounding plate, and a part of this is used as a grounding connector terminal.

[Function] In an integrated circuit having a metal substrate configured as described above, the metal substrate is used as a grounding plate and a part of this metal substrate is used as a grounding connector terminal, so that the overall In addition to being lighter in weight, there is no need to use conventional expensive and bulky connecting equipment, and costs can be reduced.

[Embodiment] The structure of a first embodiment of an integrated circuit having a metal substrate according to the present invention will be described in detail below with reference to the accompanying drawings.

FIG. 1 shows an integrated circuit 10 of this first embodiment. The integrated circuit 10 is configured as an independent functional component for a vehicle, and specifically, is configured as an integrated circuit that independently functions as, for example, an engine control unit.

As shown in the figure, this integrated circuit IO is formed as a box-shaped case with a closed interior, and a male connector 12 as a connecting device is integrally attached to one end. The male connector 12 will be described in detail later, but is configured to be connected to a commonly used female connector 14.

Here, as shown in FIGS. 2 to 3B, this integrated circuit 10 consists of a pair of circuit boards 16a and 2 that are vertically spaced apart.
6b, a side plate 18 for separating the two rotation boards 16a, 16b by a predetermined interval and closing the side surfaces, and a frame 20 for integrally fixing the two rotation boards 16a, 16b and the side plate 18. It consists of

Specifically, circuit elements such as an IC chip, a resistor, a capacitor, etc. necessary for performing the function as an engine control unit are attached to the two rotation boards 16a and 16b. Here, the dual-use substrates 16a, 16b are set to be formed by dividing one common substrate 22 into two, as shown in FIG. 4A. That is, as shown in FIG. 4B, the common substrate 22 includes a substrate body 22 made of a conductive material, for example, a metal such as aluminum.
a, an insulating layer 22b adhered to the front surface of the substrate body 22a, and a conductive foil 22c formed in a predetermined circuit pattern on the insulating layer 22b to define a circuit network.
It is formed from a circuit element 22d fixed on the conductive foil 22c and electrically connected to it.

As shown in FIG. 4A, this common substrate 22 has an opening 22e extending downward 1 in the center of the figure.
is preformed. Here, the circuit networks in the left and right portions with the opening 22e as a boundary are connected to each other via a flexible circuit board 22f provided across the opening 22e. The pair of circuit boards 16a described above are formed by cutting out both upper and lower edges (areas not indicated by symbols X and Y) including the upper and lower ends of the opening 22e.

16b is set to be formed.

It should be noted that the two surfaces of the outer end of one circuit board 16a (the left circuit board in the figure), that is, the inner surfaces of the end defining one end of the case, are vertically spaced apart and facing each other. A plurality of connection terminals 22g are formed in horizontal rows along the edge. Further, connection pins 24 of the male connector 12, which will be described later, are fixed to these connection terminals 22g so as to protrude outward, and are electrically connected.

Further, the above-mentioned side plate 18 is formed in a box-shaped upper surface with the minus side open, and is set so that this open side becomes one end of the case.

Step portions 18a and 18b are formed at the inner edges of both upper and lower end surfaces of the side plate 18 to receive the three edges of the corresponding circuit boards 16a and 16b, respectively.

Here, each circuit board 16a, 16b is fitted into a corresponding step portion 18a, 18b via a seal rubber 26, as shown in FIG. 3A.

By interposing this seal rubber 26, dust is prevented from entering the case from between these rubbers.

On the other hand, the above-mentioned frame body 20 is formed so as to sandwich and surround the side surface closed by the side plate 18 from below, as shown in FIG. That is, this frame 2
0 is a main body 20a facing the side plate 18, and this main body 20
A flange portion 20b that extends inward by a predetermined distance (specifically, a distance sufficient to sandwich the three open edges of the upper and lower circuit boards 16a and 16b, respectively) from both the upper and lower ends of a. , 20c.

As shown in FIG. 3B, this frame body 20 is constructed by sandwiching the upper and lower circuit boards 16a and 16b, which are fitted into the upper and lower step portions 18a and 18b of the side plate 18, from above and below, so that the case is integrated. It is formed to be configured. As shown in the figure, a flexible circuit board 22f connects the circuit elements 22d of the upper and lower circuit boards 16a and 16b to each other.
is set to be located more inward than the other end portion of the side plate 18.

Since the frame body 20 is formed in this way, the side plate 1
8, the peripheral circuit boards 16a and 16b are maintained in an assembled state while being separated vertically by a predetermined distance.

That is, in this first embodiment, the integrated circuit 10 is
It is formed in a case shape, and both upper and lower surfaces of the case are directly defined by the circuit boards 16a and 16b. As a result, the circuit boards 16a, 16b can be made smaller and lighter than in the case where they are housed in a separately prepared case.

Next, the structure of a connecting device for connecting the case-shaped integrated circuit 10 configured as described above to a controlled portion of a vehicle will be described with reference to FIG.

This connection device includes a male connector 12 that is attached to one end of the case-shaped integrated circuit 1o with a so-called threaded shape.
and a female connector 14 which is detachably connected to the male connector I2. The male connector 12 includes a connector main body 28 formed from a box-shaped housing with one side open, and the connector main body 28 is fitted into an opening at one end of the case-shaped integrated circuit 10. It is set like this. In this fitted state, the connector main body 28 is fixedly attached to the integrated circuit IO using screws or the like.

Here, the connector main body 28 has an upright piece 28a that just closes one end opening of the case-shaped integrated circuit 10, and this upright piece 28a has a pair of vertically spaced through holes 28b and 28c. , are arranged in multiple pairs in the horizontal direction. For this reason, every other connection bottle 24 arranged in a horizontal row is passed through the upper through hole 28b, and the remaining connection bottles 24 are biased to the side. , lower through hole 2
8e is set to be penetrated.

Note that the length of the connection pin 24 that is passed through the lower through hole 28 (2) is set shorter than the length of the connection pin 24 that is penetrated through the upper through hole 28b. In order to ensure sufficient heat dissipation when soldering the bottle 24 to the corresponding connection terminal 22g, a so-called 8 part 32 is provided with a rounded part 32 in the middle as shown in the figure. As described above, by having the eight portions 32, the length of the connecting bottle 24 that is penetrated by the lower through hole 28c is equal to the length of the connecting bottle 24 that is penetrated by the lower through hole 28b. They are set to be approximately the same and exhibit similar heat dissipation effects.

In addition, by forming the 8 part 32 in the connection bottle 24 penetrated by the lower through hole 28e in this way, the 8 part 32
However, it has a shock absorbing function. As a result,
In addition to the above-mentioned heat dissipation properties, sufficient impact is ensured when the connectors are connected, and the corresponding connection terminals 2 of the connection bins 24 are
This will prevent deviation from 2g.

In addition, in this first embodiment, these connection bins 24
The vertical separation distance β and the horizontal arrangement pitch p are defined based on the specifications of the conventionally used bin arrangement. As a result, the pair of female connectors 14 connected to the male connector 12 can be of a conventionally used type, improving economical efficiency.

In addition, since conventionally used male connectors are heavy and large, we have developed a dedicated male connector that is compatible with this compact and lightweight case-shaped integrated circuit 10, without having to make it stiff. A type connector 12 is formed. Therefore, according to this first embodiment, the above-mentioned integrated circuit 10
This will surely prevent the loss of size and weight reduction.

On the other hand, in this first embodiment, which is a feature of the present invention, the upper and lower circuit boards 16a and 16b are each made of a corresponding conductive foil 22c, which defines the ground wire of the circuit network. electrically connected to the part. Note that the ground wires in the conductive foils 22e of the upper and lower circuit boards 16a and 16b are electrically connected to each other via the flexible board 22f, and as a result, the upper and lower circuit boards 1
The substrate bodies 22a in 6a and 16b are electrically connected to each other.

Here, as shown in FIG. 1, a single fin 30 is formed in a substantially central portion of the upper circuit board 16a in a cut and raised state. This fin 30
Since the circuit board 16a is defined as a grounding plate, it functions as a male grounding connection terminal.

Although not shown in detail, a female joint connector 32 for grounding is detachably attached to the fin 30. This joint connector 32 connects the ground wires of a plurality of other electric circuits as a plurality of input wires, and connects these input wires and the ground wire of its own integrated circuit 1o together to the vehicle body. One ground wire is connected as an output line to be grounded.

In this way, the joint connector 32 is configured to output the ground wires of the integrated circuit 10 to which the stiffener is connected, as well as the ground wires of other electrical circuits, in a unified state.

As described above in detail l), in this first embodiment,
The board main body 22a of at least one circuit board 16a is used as a grounding plate, and the fin 3o functioning as a grounding male connector terminal is integrally molded on the board main body 22a serving as the grounding board. In this way, according to the first embodiment, there is no need to use a separate male grounding connector of the conventional configuration, and the configuration can be simplified, downsized, and lowered in cost. become.

Further, the fins 30 can function as a kind of heat sink, and as a result, in this first embodiment, the effect of improving the heat dissipation part of the integrated circuit 10 is This will be achieved.

Further, the integrated circuit 10 of the first embodiment is configured such that both upper and lower surfaces are defined by a pair of circuit boards 16a and 16b. As a result, according to the first embodiment, the number of parts of the integrated circuit 10 is reduced, and the integrated circuit 10 is made smaller and less expensive.

Further, in this first embodiment, each circuit board 16
a and 16b are conductive aluminum substrate main bodies 22
a, and an insulating layer 22b stuck on this substrate main body 22a.
and a conductive foil 22c stuck in a predetermined circuit pattern on the insulation @22b. As a result, the heat generated from the various circuit elements 22d can be radiated by using the aluminum board main body 22a as a heat sink, eliminating the need for a separate heat dissipation member, resulting in significant downsizing. will be achieved.

Furthermore, in this first embodiment, as mentioned above,
A pair of circuit boards 16a having board bodies 22a made of aluminum on both upper and lower surfaces of the case.

16b, these circuit boards 16
a and 16b can be used as electromagnetic shielding members. As a result, the internal space of the integrated circuit 10 on this case is substantially electromagnetically shielded, and the circuit element 22d is less susceptible to electromagnetic interference.

It goes without saying that this invention is not limited to the configuration of the first embodiment, which is a series of two, and can be modified in various ways without departing from the gist of the invention. Below, various embodiments and various modifications of this invention will be described. In the various modifications and other embodiments described below, the same parts as those in the first embodiment described above are denoted by the same reference numerals, and the explanation thereof will be omitted.

For example, in the first embodiment described above, the integrated circuit 1
0, it has been explained that it functions as an engine control unit, but it is not limited to this, and for example, it operates as a functional component of a vehicle speed control device, a control device for four-wheel steering, an automatic transmission control device, etc. It can be configured as follows.

In addition, in the first embodiment, the fin 30 functioning as a grounding connector terminal is integrally formed in an upright position approximately at the center of the board body 22a of the -1 circuit board 16a. However, the present invention is not limited to this configuration, and may be configured as shown in FIG. 6 as a second embodiment.

That is, in this second embodiment, as shown in the figure,
The integrated circuit 10 does not have a frame 20, and the side plate 18 does not have a frame 20.
Upper and lower circuit boards 16 are placed on the two lower step portions 18a and 18b, respectively.
a and 16b are inserted, and by bonding their mutual contact surfaces with adhesive, the case-like integrated circuit 10 is integrally constructed without using the frame 20. It is set.

Under such a configuration, the two consecutive fins 3° are integrally formed so as to extend laterally from one side edge of the board body 22a of the upper circuit board 16a. In this way the second
By configuring this embodiment, the same effects as the first embodiment described above can be achieved, and further miniaturization and cost reduction can be achieved since the frame 20 is not used.

Furthermore, as shown in FIGS. 7 and 8 as a third embodiment, the present invention provides a substrate main body 22 of the upper circuit board 16a.
The fins 30 may be integrally formed so as to extend forward from the opening edge in a. By forming the fins 30 in this way, as shown in FIG. It becomes possible to form them in one piece.

Furthermore, in the first embodiment, the fin 30 is connected to the board body 22 as a grounding male connector terminal.
Although it has been described that it is formed in a state extending from a, the present invention is not limited to such a configuration, and for example, it can be configured as shown in FIGS. 9 and 10 as a fourth embodiment. You may do so.

That is, in this fourth embodiment, the upper circuit board 1
On the upper surface of the board body 22a of 6a, a portion 34 corresponding to the open edge is directly set to function as a grounding connector terminal as it is. Here, by setting the grounding connector terminal in this way, the female connector 14 connected to the male connector 12 of the integrated circuit 10 and the grounding connector terminal 34 It becomes possible to integrally form the ground joint connector 32 connected to the ground joint connector 32.

Here, in the third embodiment described above, the female connector 14 and the joint connector 32 were simply combined into one structure, but in this fourth embodiment, the 10th As shown in the figure, the lower surface of the joint connector 32 corresponding to the connector housing 32a is open, and the plurality of grounding terminals 32b provided in the joint connector 32 are inserted downward through this opening. connector housing 32 in an exposed state toward
It is attached to a.

In this way, in this fourth embodiment, the tenth
J shown in the figure: In a state where the female connector 14 and the joint connector 32, which are integral with each other, are connected to the case-shaped integrated circuit 10, a plurality of grounding terminals 32b provided on the joint connector 32 are shown. contacts the upper surface of the board body 22a of the upper circuit board 16a and is electrically connected.

In this way, according to this fourth embodiment, the above-mentioned third
It is possible to achieve the same effects as in the embodiment described above, and the configuration is simplified since the fins 30 do not need to be specially formed.

Further, in the first embodiment described above, the fins 30 are described as being integrally formed on the board body 22a of the upper circuit board 16, but the present invention is not limited to such a configuration. Instead, it may be configured as shown in FIG. 11 as a fifth embodiment.

That is, in this fifth embodiment, as shown in the figure,
On the board body 22a of the upper circuit board 16a, three fins 34a, 34b, and 34c are mounted integrally through screws or the like in parallel to each other and spaced apart from each other by a predetermined distance. ing. Here, the front and middle fins 34a.

34b functions as a heat sink, and the rear fins 34c are set to function as earth connection terminals, similar to the fins 30 in the first embodiment.

By configuring the fifth embodiment as described above, it is possible to achieve the same effect as the first embodiment described above while ensuring a sufficient heat dissipation effect.

[Effects of the Invention] As detailed above, the integrated circuit having a metal circuit board according to the present invention is an integrated circuit in which a conductive foil is adhered to the metal circuit board via an insulating layer and circuit elements are fixed. ,
The metal substrate is used as a grounding plate, and a part of this is used as a grounding connector terminal.

Therefore, according to the present invention, an integrated circuit in which a conductive foil is pasted on a metal circuit board via an insulating layer and circuit elements are fixed thereto has a metal circuit board that can be made smaller and lower in cost. Integrated circuits will be provided.

[Brief explanation of the drawing]

FIG. 1 is a perspective view showing the structure of a first embodiment of an integrated circuit having a metal substrate according to the present invention; FIG. 2 is an exploded perspective view showing the +111 configuration of the integrated circuit shown in FIG. 1; FIG. 3A Figure 3B is a cross-sectional view showing how the frame is attached; Figure 4Δ is a plan view showing the configuration of the common board; 5 is a sectional view showing the structure of a fiber type connector attached to an integrated circuit; FIG. 6 is a perspective view showing the structure of a second embodiment of the integrated circuit according to the present invention; FIG. 7 is a perspective view showing the structure of a third embodiment of the integrated circuit according to the present invention; FIG. 8 is a longitudinal cross-sectional view schematically showing the structure of the female connector shown in FIG. 7; FIG. A perspective view showing the configuration of a fourth embodiment of the integrated circuit according to the invention; FIG. 10 is a perspective view showing the structure of the fourth embodiment of the integrated circuit shown in FIG. A sectional view showing a connected state; and FIG. 11 is a perspective view showing a 47.7 configuration of a fifth embodiment of the integrated circuit according to the present invention. Part, 22... Common board, 22a... Board main body, 22
b... Insulating layer, 22e... Conductive foil, 22d... Circuit element, 22e... Opening, 22f... Flexible circuit board, 22g, 22h... Connection terminal, 22L
H22j...outer flange part, 24...connection bin,
26...Seal rubber 28...Connector body (first embodiment) 28a-standing piece, 28b; 28
c - Through hole, 30...Fin, 32...Joint connector, 32a...Connector housing, 32b
...Opening, 34a, 34b; 34cm fin.

Claims (1)

[Claims] In an integrated circuit in which a conductive foil is attached to a metal substrate via an insulating layer and circuit elements are fixed, the metal substrate is used as a ground plate, and a part of this is used as a ground connector terminal. An integrated circuit having a metal substrate characterized by: