JP2702225B2 - Integrated circuit with metal substrate - Google Patents

Description

The present invention relates to a circuit board in which a conductive layer of a desired shape is formed on a metal substrate via an insulating layer, and is mounted on the insulating layer in a non-removable manner. And a circuit element having nonvolatile storage contents rewritable by an external operation.

[Prior art] Conventionally, conductive layers are bonded to each other via an insulating layer, circuit elements are fixed to each conductive layer, and both conductive layers are connected to each other via a connection substrate. As an integrated circuit having a pair of metal substrates provided in a state facing each other,
A technique disclosed in Japanese Patent Publication No. 46-13234 is known.
In the method of manufacturing an integrated circuit disclosed in this prior art, a step of anodizing at least one main surface of an aluminum substrate to form an aluminum oxide thin layer on the substrate surface, and a step of forming a resistor on the aluminum oxide thin layer Forming a plurality of circuit elements by selectively forming a substance and a good conductor material; and fixing a transistor pellet on a lead portion formed by selectively attaching a good conductor. The method includes a step of sealing at least all of the circuit elements with an insulating resin.

In an integrated circuit formed in this manner, in a circuit board having a conductive layer of a desired shape formed on a metal substrate via an insulating layer, at least one storage element cannot be removed as a so-called bare chip on the insulating layer. It is attached to.

[Problem to be Solved by the Invention] The integrated circuit formed as described above may be adopted for use in a vehicle from the viewpoint of its small size and low cost. However, when an integrated circuit having such a metal substrate is actually used for a vehicle, various tests are performed in a development stage, and data stored in the storage element is rewritten or controlled as necessary. You will have to make changes to the program.

However, as described above, this storage element is directly attached to a circuit as a bare chip, and once attached, it is not possible to remove the storage element. It is pointed out that it is difficult to work on the stored contents such as, and the degree of freedom in development is greatly limited.

The present invention has been made in view of the above-described problems, and an object of the present invention is to externally rewrite data, change control programs, monitor storage contents, and other processing operations on storage contents during the development stage of an integrated circuit. Make it possible
An object of the present invention is to provide an integrated circuit having a metal substrate capable of increasing the degree of freedom of development.

[Means for Solving the Problems] In order to solve the above problems and achieve the object, an integrated circuit having a metal substrate according to the present invention has a conductive layer of a desired shape formed on a metal substrate via an insulating layer. Circuit board, a circuit element which is non-removably mounted on the insulating layer and has nonvolatile storage contents which can be rewritten by an external operation, and first connector means for connecting at least the circuit element to the outside And second connector means for connecting the circuit element and an external processing device via a path different from that of the first connector means for processing the stored contents of the circuit element. .

Further, in the integrated circuit having the metal substrate according to the present invention, the conductive layer includes a second signal connecting a first signal line group connecting the circuit element to another circuit element and a second connector means. A line group, which is located on the first signal line group and adjacent to the circuit element so as to block data transmission when rewriting the storage contents of the circuit element. It is characterized in that there is provided a signal blocking means.

Further, in the integrated circuit having the metal substrate according to the present invention, the second connector means is configured to be filled with a resin when the non-use state is determined.

[Operation] In an integrated circuit having a metal substrate configured as described above, data rewriting, control program change,
Regarding the processing of storage contents such as data monitoring, at the stage of development, the circuit elements in charge of these are connected to an external processing device via dedicated second connector means in a state in which they are irremovably mounted. , With this external processing device,
Processing of stored contents such as rewriting of data and modification of control programs can be performed from the outside to increase the degree of freedom in development.

[Embodiment] Hereinafter, a case where an embodiment of an integrated circuit having a metal substrate according to the present invention is applied to a case-shaped hybrid integrated circuit will be described with reference to FIGS. 1 to 11 of the accompanying drawings. This will be described in detail.

FIG. 1 shows a hybrid integrated circuit 10 of this embodiment. The hybrid integrated circuit 10 is configured as a control unit as an independent in-vehicle functional component. Specifically, for example, the hybrid integrated circuit 10 is configured as a hybrid correction circuit independently having a function as an engine control unit. ing.

As shown in the figure, the hybrid integrated circuit 10 is formed as a box-shaped case whose inside is closed. The hybrid integrated circuit 10 has first and second ends which are opposed to each other. Two connector mechanisms 12, 14 are connected respectively. That is, the first connector mechanism 12 connects the integrated circuit 10 to the vehicle harness, and the first male connector 12a formed integrally with one end (rear end) of the integrated circuit 10.
And a first female connector 12 detachably connected thereto.
b. Also, the second connector mechanism 14
Is connected to an external processing device for processing the storage content of the storage element mounted on the integrated circuit 10, and a second female integrated with the other end (front end) of the integrated circuit 10 The second connector 14a includes a second male connector 14b detachably connected to the second female connector 14a.

Although the first male connector 12a will be described later, a first female connector 12a of a commonly used type is used.
12b is configured to be connected as a vehicle harness. The second female connector 14a is configured to be connected to a second male connector 14b of a commonly used type.

Here, as shown in FIGS. 2 to 3B, the hybrid integrated circuit 10 includes a pair of first and second circuit boards 16a and 16b that are vertically separated from each other, and a first and second circuit board. 16a and 16b are separated by a predetermined distance and a side plate 18 for closing the side surface, and the first and second circuit boards 16a and 16b and the side plate 1
8 and a frame 20 for integrally fixing them.

Specifically, the first and second circuit boards 16a and 16b include:
Necessary to demonstrate the function of the engine control unit.
A circuit element such as an IC chip, a storage element, a resistor, and a capacitor that functions as a CPU is mounted. For details,
A so-called logic circuit element is connected to the lower first circuit board 16a, and a so-called power circuit element is connected to the upper second circuit board 16b. I have.

The mounting state of the circuit elements on the first circuit board 16a constitutes a gist of the present invention, and will be described later in detail.

Here, the first and second circuit boards 16a and 16b are set to be formed by dividing one common board 22 into two, as shown in FIG. 4A. That is, as shown in FIG.4B, the common substrate 22 includes a substrate body 22a formed of a conductive material, for example, aluminum, and an insulating layer 22b adhered over the front surface of the substrate body 22a. On the insulating layer 22b, a conductive layer 22c formed in a predetermined circuit pattern and defining a circuit network, and fixed on the conductive layer 22c,
It is formed from a circuit element 22d that is electrically connected.

As shown in FIG. 4A, an opening 22e extending in the vertical direction is formed in the center of the common substrate 22 in advance. Here, the circuit networks on both the left and right sides of the opening 22e are connected to each other via a flexible substrate 22f provided across the opening 22e. still,
The end adjacent to the flexible substrate 22f has an opening 22e.
Is connected to a position inward of the corresponding side edge by a predetermined distance. That is, in the range of the predetermined distance, the protruding portions 16c and 16d are defined at the other end of each of the circuit boards 16a and 16b. The upper and lower edges including the upper and lower ends of the opening 22e (regions indicated by reference numerals X and Y)
By cutting off the pair of circuit boards 16a, 16
The b is set so as to be connected to each other via the flexible substrate 22f.

In the common substrate 22, the upper surfaces of the portions corresponding to the outer ends of the two circuit boards 16a and 16b, that is, the upper and lower ends that define one end of the case are opposed to each other. On the inner surface, a plurality of first connection terminals 22g, 22h
Are formed in a horizontal line along the edge. In addition, connection pins 24a, 24b of the first male connector 12, which will be described later, are fixed to these connection terminals 22g, 22h so as to protrude outward, respectively, and are electrically connected. .

On the other hand, in a state where the two circuit boards 16a and 16b face each other vertically separated from each other, opposing portions of the ends defining the other end of the case, that is, the inner surfaces of the protruding portions 16c and 16d have a Are formed in a horizontal line along the edge. Also, these second connection terminals 22i, 22j
Is set so as to constitute a connection terminal of a second female connector 14a to be described later.

As shown in FIG. 2, the above-mentioned side plate 18 is formed in a U-shape with one side open, and the open side is set to be one end of the case.
Stepped portions 18a, 1 for receiving the three edges of the corresponding circuit boards 16a, 16b are provided on the inner edges of the upper and lower end surfaces of the side plate 18.
8b are formed respectively.

Here, the respective circuit boards 16a and 16b are fitted into the corresponding step portions 18a and 18b via the seal rubber 26 as shown in FIG. 3A. By providing the seal rubber 26, dust is prevented from entering the case from between them.

In addition, as shown in the figure, the portion of the side plate 18 that closes the other end of the integrated circuit 10
It is set to be located exactly at the boundary between d and the circuit boards 16a and 16b. As a result, the housing of the second female connector 12b is defined by the projecting portion located outside the side plate 18.

On the other hand, as shown in FIG. 2, the above-mentioned frame body 20 is formed of a synthetic resin as an insulating member, and is configured so as to surround the side surface closed by the side plate 18 from above and below. That is, the frame body 20 is provided with a main body 20a facing the side plate 18 and a predetermined distance from the upper and lower ends of the main body 20a (specifically, the three open edges of the upper and lower circuit boards 16a and 16b). Are formed integrally with the flange portions 20b and 20c extending inward by a distance sufficient to hold each of them.

In the main body 20a of the frame 20, a portion that defines the other end surface (front end surface) of the integrated circuit 10 allows connection of the second male connector 14b to the above-described second female connector 14a. Therefore, the opening 20d is formed over the entire surface.

As shown in FIG. 3B, the frame body 20 holds the upper and lower first and second circuit boards 16a and 16b fitted respectively in the upper and lower step portions 18a and 18b of the side plate 18 from above and below. The case is formed so as to be integrally formed. As shown in the figure, a flexible board 22f for connecting the circuit elements 22d of the upper and lower first and second circuit boards 16a and 16b to each other is a side plate.
It is set so as to be located more inward than the other end of 18.

Since the frame body 20 is formed in this way, the side plate 18
And the first and second substrate circuits 16a, 16b
Will be maintained in an assembled state while being separated vertically by a predetermined distance.

That is, in this embodiment, the hybrid integrated circuit 10
The case is formed, and both upper and lower surfaces of the case are directly defined by the circuit boards 16a and 16b.
As a result, compared to a case where the first and second circuit boards 16a and 16b are housed in a separately prepared case, a reduction in size and weight is achieved.

Next, the case-shaped hybrid integrated circuit thus configured
Referring to FIGS. 5 to 8, a description will be given of a configuration of a connection device for connecting the device 10 to a controlled portion of the vehicle via a vehicle harness.

This connection device is connected to a first male connector 12a attached to an opening of one end of a case-shaped hybrid integrated circuit 10 in a so-called internal state, and is detachably connected to the first male connector 12a. And a first female connector 12b. As shown in FIG. 5, the first male connector 12a includes a connector housing 28 formed of a box-shaped housing that is opened with both front and rear surfaces penetrated, and an upper connection pin.
The upper connection pin support 30a attached with the 24a, 24b arranged in a horizontal line, and the lower connection attached with the lower connection pin 24b arranged in a horizontal line The pin support 30b forms a so-called three-piece shape.

Here, the upper connection pin support 30a and the lower connection pin support 30b are formed symmetrically in the vertical direction with the center in the vertical direction being sloped, and the upper connection pin support 30a is substantially L-shaped.
The shape, the standing piece 30a _1, are integrally formed from the protruding piece 30a ₂ Metropolitan projecting outwardly from the lower end of the upright pieces 30a _1. On the other hand, the lower mold of the connecting pin support 30b is in a substantially inverted L-shape, the standing piece 30b _1, is integrally formed from the protruding piece 30b ₂ Metropolitan protruding upper end how outside of the standing piece 30b ₁ I have.

Then, the upper connecting pins 24a includes a horizontal portion 24a ₁ projecting forward and backward protruding piece 30a ₂ and extends horizontally through, the horizontal portion 24a ₁
Are formed integrally from a vertical portion 24a ₂ that rises vertically along the inner surface of the standing piece 30a ₁ from the inner end of the vertical portion 24a, and a bent portion 24a ₃ that is bent inward from the upper end of the vertical portion 24a _2. I have. The bent portion 24a _3, are defined as a connection portion to be connected by soldering to form connection terminals 22h to the second circuit board 16b of the upper described above. The portion of the horizontal portion 24a ₁ projecting outward is defined as a connection portion to be inserted, connected to the female connector 14.

The lower connecting pin 24b is provided with a horizontal portion 24b ₁ which projects back and forth projecting piece 30b ₂ and extends horizontally through, along connexion perpendicularly from inner end of the horizontal portion 24b ₁ on the inner surface of the standing piece 30b ₁ are formed integrally falling vertical portion 24b _2, from the broken from the lower end of the vertical portion 24b ₂ inwardly song ivy bent part 24b ₃ Prefecture in. This bent portion 24b _3, and is defined as a connection portion by soldering to the first circuit connecting terminals 22g which is formed on a substrate 16a of the lower described above. The portion of the horizontal portion 24b ₁ which projects outward, is defined as a connecting portion to be inserted, connected to the female connector 14.

The two connection pin supports 30a and 30b are set to a size that can be just fitted into one end opening of the case-shaped hybrid integrated circuit 10 in a state where they are vertically joined to each other. In other words, the range (outer periphery) extending between the two upright pieces 30a ₁ and 30b ₁ in the state of being joined up and down is set to exactly define the inner periphery of one end opening of the hybrid integrated circuit 10. .

Here, as shown in FIG. 6, recesses 32a and 32b are formed in the center of both upper and lower edges of both connection pin supports 30a and 30b, respectively. These recesses 32a and 32b are defined as injection holes for the epoxy resin to be injected, as described later, in a state where the first male connector 12a is integrated into the hybrid integrated circuit 10.

The upper and lower connection pins 24a, 24b are formed in a vertically symmetric shape, that is, the same shape, and the upper and lower connection pin supports 30a, 30b are also formed in the same shape, which is vertically symmetric. As described above, since the connection pin supports 30a and 30b to which the connection pins 24a and 24b are respectively attached have the same shape, parts can be shared and cost can be reduced. .

On the other hand, the above-described connector housing 28 has a fitting hole 34 formed therein in a state penetrating along the front-rear direction. As shown in FIG. 7, this fitting hole 34 is sufficient for the two projecting pieces 30a ₂ and 30b ₂ that are overlapped with each other to be just fitted in the state where the upper and lower connection pin supports 30a and 30b are joined. Is set to a reasonable size.

Further, mounting flange portions 40a and 40b are integrally formed on both side portions of the connector housing 28. The flange portions 40a and 40b are provided for fixing the first male connector 12a to a vehicle body (not shown) in a state where the first male connector 12a is attached and fixed to the hybrid integrated circuit 10. In this manner, since it is not necessary to provide a flange portion for mounting the hybrid integrated circuit 10 on the hybrid integrated circuit 10 itself, the configuration of the hybrid integrated circuit 10 can be simplified.

In this embodiment, these connection pins 24a, 24
The vertical distance l and the left and right pitches p of b are defined based on the specifications of the pin arrangement conventionally used. As a result, as the first female connector 12b connected to the first male connector 12a, a type conventionally used conventionally can be adopted, and the economy is improved.

Also, since the type conventionally used as a male connector is heavy and large, without adopting this type, the case-shaped hybrid integrated circuit 10 is reduced in size and weight.
, A first male connector 12a for exclusive use is formed. Therefore, according to this embodiment, it is possible to reliably prevent the above-described hybrid integrated circuit 10 from being reduced in size and weight.

Next, with reference to FIG. 8, the assembling operation of the first integrated connector 12a and the assembling operation of the hybrid integrated circuit 10 shown in FIG.

First, as described above with reference to FIGS. 4A and 4B,
Common board 22 with a predetermined circuit element 22d attached
The first and second circuit boards 16a, 16b are formed open on the same plane by cutting the upper and lower edges X, Y from the top. As shown in FIG. 5, the corresponding connection pin supports 30a and 30b are fixed to the first and second circuit boards 16a and 16b in the opened state via an adhesive, respectively.

Here, as described above, these connection pin supports 30a,
The corresponding connection pins 24a and 24b are already attached to 30b. In this way, these connection pins 24a, 24b
When the first and second circuit boards 16a and 16b are opened, they are soldered to the corresponding connection terminals 22g and 22h, respectively. In particular, this soldering work requires the connection terminals 22
Since the numbers of g and 22h are large, fine work is required. In this embodiment, the first and second circuit boards 16a and 16b are respectively opened on the same plane. As a result, the work is reliably performed, the workability is improved, and the assemblability is well maintained.

Thereafter, with the first circuit board 16a held in the same position, the second circuit board 16b is lifted up so as to be parallel to and above the lower first circuit board 16a. Moving. Then, as shown in FIG. 8, both connection pin supports 30a and 30b are joined to each other up and down.
Here, the first and second circuit boards 16a and 16b are set to be parallel to each other when the two connection pin supports 30a and 30b are joined vertically.

On the other hand, prior to such a bonding operation, as shown in FIG. 5, the first and second circuit boards 16a and 16b are provided on the front and rear portions of the first circuit board 16a located below. The frame members 36a and 36b for shielding the internal space from the outside are mounted while keeping the interval constant at a predetermined value and securing the strength of the hybrid integrated circuit 10. Here, one frame member 36a is located slightly inward of the flexible board 22f, and the other frame member 36b is located slightly inward of the connection terminals 22g and 22h. Each arrangement position is set.

Then, while maintaining the joined state, they are fitted into the fitting holes 34 of the connector housing 28, and in this fitted state, the first male connector 12a is integrally attached to the hybrid integrated circuit 10. Will be. Thereafter, as described above, the side plate 18 is attached to the hybrid integrated circuit 10, and the frame 20 is fitted. Thus, the hybrid integrated circuit 10 as shown in FIG. 1 is formed with the first male connector 12a integrally provided.

After such an assembling operation is completed, the assembled first male connector 12a is connected to the hybrid integrated circuit 1.
In order to securely fix the soldered portions of the respective connection pins 24a, 24b and the corresponding connection terminals 22g, 22h, while firmly adhering to 0, and completely shielding the inside of the hybrid integrated circuit 10,
An epoxy resin 38 is injected between the first male connector 12a and the frame member 36b via the recesses 32a and 32b described above, and the space between the two is filled with the epoxy resin 38. Done.

Further, in order to protect the flexible substrate 22f and shield the inside of the hybrid integrated circuit 10, the frame member 36a
And between the side wall 18 and before the frame body 20 is mounted,
It is set so as to be filled with a similar epoxy resin 38.

On the other hand, as described above, the second female connector 14a formed integrally with the other end of the case-shaped hybrid integrated circuit 10 has a pair of upper and lower circuit boards 16a,
Each of the protrusions 16c and 16d in 16b is defined as a housing, and is provided with connection terminals 22i and 22j, while being integrally connected to the case-shaped integrated circuit 10.

On the other hand, as shown in FIG. 5, the second male connector 14b detachably connected to the second female connector 14a has a distal end projecting into a space sandwiched between both projecting portions 16c and 16d. Housing 16b ₁ and this housing configured to
16b ₁ , a plurality of connection pins attached to the connection terminals 22i and 22j in a row so as to be slidable respectively.
16b ₂ and 16b ₃ .

The second male connector 14b is connected to a tuning device 44 as an external processing device described later via a connection cord 42 as an external bus cable.

On the other hand, the first circuit board located below,
The mounting state of various electronic components in 16a is set as shown in FIG.

Specifically, first, as shown in FIG. 9, a signal line group formed from a circuit network, in other words, a conductive layer 22c, is formed on the insulating layer 22b of the first circuit board 16a in a predetermined pattern. Are formed as a plurality of bus lines. And
On the insulating layer 22b of the first circuit board 16a, an IC package (for example, Motorola MC68) which functions as a CPU required to exhibit a function as an engine control unit is provided.
01) and an IC chip 22 d ₁ having the same function are fixed directly as Beachitsupu. And this CPU22d
_1, via a bonding wire 22 d _3, are directly mounted to a predetermined group of the above-mentioned bus line. Incidentally, this is IC chip 22 d _1, although not shown, a predetermined control program is built ROM is connected.

Further, this first circuit board 16a of the insulating layer 22b, the IC CPU22d ₁ Various data are written to be required to execute a control procedure bobbin (e.g., manufactured by NEC μPD28C64) equivalent of an IC chip 22 d ₂ having the function, are fixed directly as Beachitsupu. Incidentally, the IC chip 22 d _2, which functions as a rewritable nonvolatile memory element, similarly to the IC chip 22 d _1, as shown in FIG. 10A and the second 10B view, through the bonding wire 22 d ₃ Thus, it is directly mounted on a predetermined group in the bus line described above.

Note that the storage element 22d _2, given and Matsupu, default values and constants or the like for defining the threshold value is set and stored. In addition, various circuit elements such as a power transistor, a gate circuit element, a voltage regulator, a capacitor, a resistor, and a diode are mounted on the second circuit board 16b.

Then, the network (circuit pattern) formed from the conductive layer 22c has a first bus line for connecting the storage element 22 d ₂ and CPU22d _1, implemented as Beachitsupu as described above 2
2c ₁ and a second bus line 2 connecting the storage element 22d ₂ and the plurality of connection terminals 22i and 22j in the second female connector 12b.
And 2c _2, on a suitably connecting CPU22d ₁ and the various circuit elements, a plurality of connections in the first male connector 12a terminal 22
g, and a third bus line 22c ₃ for connecting the 22h.

Here, the conductive layer 22c of the network connecting the these storage element 22 d ₂ and CPU22d ₁ together, i.e., the second bus line 2
On 2c _2, as shown in FIG. 11, when rewriting the data of the storage element 22 d _2, rewriting the upper is transmitted to other circuit elements, ensure rewriting of unnecessary data in these other circuit elements to prevent the, bus blocking circuit 22 d ₄ as a signal cutoff circuit is interposed. This bus cutoff circuit 22d ₄
Is a C-MO that functions as a so-called tri-state buffer.
This is a conventionally well-known configuration using an S-type analog switch, and a description thereof will be omitted.

In the circuit configuration of the first circuit board 16a configured as described above, in the middle of development conditions, when the need to rewrite the data stored in the storage element 22 d ₂ occurs,
As shown in FIG. 5, the second male connector 14b is connected to the corresponding second female connector 14a.
By setting the data rewriting mode, thereby rewriting the data in the storage element 22 d _2.

Here, as described above, the second female connector 14a has connection terminals 22i and 22j corresponding to the connection pins 24c and 24d of the second male connector 14b, and is shown in FIG. As described above, these connection terminals 22i and 22j are connected to the second bus line 22c ₂
Through the write enable terminal of the storage element 22d ₂
And connected to the write mode setting connection terminal bonding wire 22 d ₃ which is connected through an inverter to ▼, Chitsupuenaburu terminal ▲ ▼ and Autopu bract Zener Bull terminal ▲ ▼ and bonding wire 22 d ₃ which are respectively connected to the
, And a pair of connection terminals for light connected to each other.

That is, when rewriting data, the second male connector 14b having the above-described configuration is connected to the female connector 12b, and the storage element 22d is connected via the tuning device 44 connected to the integrated circuit 10 via the connection cord 42. The data as the storage content stored in ₂ can be rewritten to desired data.

In this rewriting operation, a tuning device is used.
44 a high level signal to the connection terminal set write mode is sent, the result, the control terminal of the bus blocking circuit 22 d ₄ becomes low level, the bus blocking circuit 22 d _4, opens an internal switch, the bus line is open . Thus, rewriting the information from Chiyuningu device 44 would be transmitted to the other memory element 22 d ₂ in these buses cutoff circuit 22 d ₄ is reliably prevented.

On the other hand, the high level output signal to such write mode setting connection terminal, a write enable terminal ▲ ▼ goes low in the storage element 22 d _2, also,
From the tuning device 44, the chip enable terminal ▲ ▼ becomes a high level via a pair of write connection terminals,
Further, the output enable terminal ▲ ▼ are respectively set to the low level, in this way, the write enable state to the memory element 22 d ₂ is to be set.

As described in detail above, the hybrid integrated circuit 10 of this embodiment is
In, as a storage element 22 d ₂ supplies predetermined data to CPU22d _1, uses nonvolatile writeable IC chip, the data stored in the storage element 22 d ₂ is
It can be rewritten arbitrarily. In this way,
In the course of development, when the need to rewrite the data of the storage element 22 d ₂ occurs also, it is possible to easily cope with this rewrite request, the degree of freedom in development will significantly improve.

Further, when the data rewriting operation, since the set open a bus line connecting the storage element 22 d ₂ and CPU22d ₁ by the bus blocking circuit 22 d _4, rewriting information of the data output from Chiyuningu device 44 Is
It will not be transmitted to anything other than the storage element 22d ₂ and the CPU 22d
₍₂₎ Data stored in other circuit elements can be reliably prevented from being erroneously rewritten by the data rewrite information.

As described above, in this embodiment, the data rewriting is performed by simply connecting the integrated circuit 10 and the tuning device 44 by simply connecting the second male connector 14b to the second female connector. Therefore, the data rewriting operation can be performed very easily and easily.

Then, in this embodiment, in a state in which rewriting the data stored in the storage element 22 d _2, in the case of Shimiyureto the control procedure of the integrated circuit 10, Chiyuningu 44
Was set to stain Yoo rate Chillon mode, it will Shimiyureto a control procedure based on the data stored in the storage element 22 d _2. Further, in the case of monitoring the data stored in the storage element 22 d ₂ is similarly set the Chiyuningu device 44 to the monitor mode, it will be monitored. In this way, the setting of data to be stored in the storage element 22 d ₂ in the development stage (confirmation) is carried out in a state of having a large degree of freedom.

On the other hand, when such a development stage is completed, the storage element 22d ₃
If the data to be is stored within has been established, in such a separate written state data in the storage element 22 d _2, as the memory element 22 d ₂ is Beachitsupu, on the insulating layer 22b of the first circuit board 16a Will be implemented. In this case, since the unused state of the second female connector 14a is determined, the second female connector 14a is not used.
The above-mentioned synthetic resin is injected into the inside and is embedded in the whole. Thus, the hybrid integrated circuit 10
Is set as if there is no second female connector 14a in appearance when the product is completed, that is, when it is shipped as a product. As a result, as compared with the case where the unused second female connector 14a has an external configuration, an effect of preventing a decrease in commercial value is achieved.

As described above, since the integrated circuit 10 of this embodiment is configured, at the development stage, the second female connector 14
By connecting the second male connector 14b to the integrated circuit 10, the integrated circuit 10 and the tuning device 44 are connected to each other.
And perform emulation operation of the control procedure in CPU22d ₁ that follows in the data stored in the 22 d _2, or rewrites the data stored in a rewritable memory element 22 d _2, be easily Chiyuningu operation of monitoring or Shimiyureshiyon performed Will be done.

Thus, according to this embodiment, the can easily rewrite the data stored in the storage element 22 d ₂ in the development stage, the control procedure to operate the CPU22d ₁ on the basis of the rewritten data Since the simulation and the data monitoring can be easily performed, the degree of freedom in the development stage is greatly improved.

Further, in this embodiment, the circuit pattern of the bus lines 22c _1, 22c _2, 22c ₃ using in the development stage, is set so as to complete the integrated circuit 10 as a product employs a raw shape I have. As a result, the cost of etching and forming the circuit pattern is greatly reduced, and since the circuit pattern that actually operated in the development stage is applied to the product, this product operates without mistake as in the development stage. And the stable operation of the product is secured, in other words,
Reliability will be ensured.

It is needless to say that the present invention is not limited to the configuration of the above-described embodiment, but can be variously modified without departing from the gist of the present invention.

For example, in one embodiment described above, a hybrid integrated circuit
Although described as functioning as an engine control unit as 10, the present invention is not limited to this. For example, it may operate as a functional component such as a vehicle speed control device, a control device for four-wheel steering, an automatic transmission control device, or the like. It can be configured as follows.

Further, in one embodiment described above, the hybrid integrated circuit 10
Has been described as including a pair of upper and lower circuit boards 16a and 16b, but the present invention is not limited to such a configuration, and may be configured to have, for example, three circuit boards parallel to each other. Needless to say, this is acceptable.

Further, in one embodiment described above, Shimiyureshiyon by Chiyuningu device 44, a monitor, a subject to be rewriting data, the data is described as a storage element 22 d ₂ stored, without being limited thereto, CPU22d _{The same} can be applied to the case where the control program of the IC chip ₁ is externally processed.

Also, as a device connected via the connection cord 42,
In the above-described embodiment, the description has been made such that the tuning device 44 is connected.However, the present invention is not limited to such a configuration.
The emulator may be set so that the control contents of the integrated circuit 10 are emulated.

Further, in one embodiment described above, CPU22d ₁ and memory element 22 d ₂ as circuit elements, insulating layer 2 as Beachitsupu
Although described as being implemented directly on 2b, the present invention
Such a configuration is not limited to, CPU22d ₁ and memory element 22 d ₂ as circuit elements, when composed of Patsu cage type IC, is mounted in a removable state by soldering to a predetermined bus line Can be similarly applied.

[Effects of the Invention] As described in detail above, an integrated circuit having a metal substrate according to the present invention includes a circuit substrate having a conductive layer of a desired shape formed on a metal substrate via an insulating layer; A circuit element which is non-removably attached to the memory element and has a nonvolatile storage content which can be rewritten by an external operation, a first connector means for connecting at least the circuit element to the outside, and a processing means for processing the storage content of the circuit element. And a second connector means for connecting the circuit element and an external processing device through a path different from that of the first connector means.

Further, in the integrated circuit having the metal substrate according to the present invention, the conductive layer includes a second signal connecting a first signal line group connecting the circuit element to another circuit element and a second connector means. A line group, which is located on the first signal line group and adjacent to the circuit element so as to block data transmission when rewriting the storage contents of the circuit element. It is characterized in that there is provided a signal blocking means.

Further, in the integrated circuit having the metal substrate according to the present invention, the second connector means is configured to be able to focus on the resin when the non-use state is determined.

Therefore, according to the present invention, in the development stage of an integrated circuit, data rewriting, change of a control program, processing of storage contents such as monitoring of storage contents, and the like can be performed from the outside, thereby increasing the degree of freedom of development. Thus, an integrated circuit having a metal substrate that can be used is provided.

[Brief description of the drawings]

FIG. 1 is a perspective view showing an embodiment of an integrated circuit having a metal substrate according to the present invention; FIG. 2 is an exploded perspective view showing a configuration of the integrated circuit shown in FIG. 1; FIG. 3B is a cross-sectional view taken along line AA; FIG. 3B is a cross-sectional view taken along line BB in FIG. 1; FIG. 4A is a plan view showing a configuration of a common substrate; 4B is a cross-sectional view showing the configuration of the common board; FIG. 5 is a cross-sectional view showing the configuration of an integrated circuit to which the male connector is attached; FIG. 6 is an exploded perspective view specifically showing the configuration of the male connector; FIG. 7 is a front view showing the assembled state of the male connector; FIG. 8 is a top view showing a state in which both connection pin supports are fixed to the circuit board in an opened state, respectively; FIG. 10 is a perspective view schematically showing an arrangement state of circuit elements on a first circuit board; FIG. 10 is a first circuit shown in FIG. Block diagram showing a block configuration of an ECU in the plate; and FIG. 11 is a connection diagram showing a specific connection between the CPU and the memory element in the first circuit board illustrated in Figure 9. In the figure, 10 ... a hybrid integrated circuit, 12a ... a first male connector, 12b ... a first female connector, 14a ... a second female connector, 14b ... a second male connector, 16a first circuit board, 16b second circuit board, 16c; 16d projecting part,
18 ... side plate, 18a; 18b ... step, 20 ... frame, 20a ... body, 20b; 20c ... flange, 20d ... opening, 22 ... common board, 22a ... board body, 22b ...... insulating layer, 22c ...... conductive layer, 22 d ...... circuit _{elements, 22d 1 ...... CPU, 22d 2} ...... storage element, 22 d ₃ ...... bonding wire, 22 d ₄ ...... bus blocking circuit, 22e ...... opening , 22f …… Flexible board, 22g; 22
h …… Connection terminals, 22i; 22j …… Connection terminals, 24a, 24b; 24b…
… Connection pin, 24a ₁ ; 24b ₁ …… horizontal part, 24a ₂ ; 24b ₂ …… vertical part, 24a ₃ ; 24b ₃ …… bending part, 26 …… seal rubber, 28…
... connector housing, 30a ...... upper connecting pin support member, 30a ₁ ...... standing pieces, 30a ₂ ...... protruding piece, 30b ...... lower connecting pin support, 30b ₁ ...... standing pieces, 30b ₂ ...... Protruding piece, 32
a; 32b… recess, 34… fitting hole, 36a; 36b… frame member, 38… epoxy resin, 40a; 40b… flange portion, 4
2 ... connection cord, 44 ... a tuning device.

Claims (3)

(57) [Claims] A circuit board having a conductive layer of a desired shape formed on a metal substrate via an insulating layer; and a non-removable storage content which is irremovably mounted on the insulating layer and which can be rewritten by an external operation. A first connector means for connecting at least the circuit element and the outside; and a circuit different from the first connector means for processing stored contents of the circuit element. An integrated circuit having a metal substrate, comprising: a second connector means for connecting to an external processing device. 2. The conductive layer comprises a first signal line group for connecting the circuit element to another circuit element and a second signal line group for connecting a second connector means. On the first signal line group, at a position adjacent to the circuit element, there is provided a signal cutoff means that operates to cut off data transmission when rewriting the stored content of the circuit element. An integrated circuit having the metal substrate according to claim 1. 3. The integrated circuit having a metal substrate according to claim 1, wherein said second connector means is configured to be filled with a resin when a non-use state is determined. .