JP2702224B2 - Integrated circuit with metal substrate - Google Patents

Description

The present invention relates to a circuit board in which a conductive layer of a desired shape is formed on a metal substrate via an insulating layer, and is mounted on the insulating layer in a non-removable manner. And an at least one circuit element.

[Prior art] Conventionally, conductive layers are bonded to each other via an insulating layer, circuit elements are fixed to each conductive layer, and both conductive layers are connected to each other via a connection substrate. As an integrated circuit having a pair of metal substrates provided so as to face each other, a technique disclosed in Japanese Patent Publication No. 46-13234 is known. In the method of manufacturing an integrated circuit disclosed in this prior art, a step of anodizing at least one main surface of an aluminum substrate to form an aluminum oxide thin layer on the substrate surface, and a step of forming a resistor on the aluminum oxide thin layer Forming a plurality of circuit elements by selectively forming a substance and a good conductor material; and fixing a transistor pellet on a lead portion formed by selectively attaching a good conductor.
The method includes a step of sealing at least all of the circuit elements with an insulating resin.

In an integrated circuit formed in this manner, in a circuit board having a conductive layer of a desired shape formed on a metal substrate via an insulating layer, at least one storage element cannot be removed as a so-called bare chip on the insulating layer. It is attached to.

In the integrated circuit formed in this manner, heat generated from the resistor, the transistor, and the like during operation is quickly and effectively dissipated, and the output circuit and the like can be integrated. .

[Problem to be Solved by the Invention] The integrated circuit formed as described above may be adopted for use in a vehicle from the viewpoint of its small size and low cost. However, when an integrated circuit having such a metal substrate is actually used for a vehicle, various tests are performed in a development stage in a state where the storage element is attached, and the storage element is stored in the storage element as necessary. That is, it is necessary to rewrite the data.

However, as described above, it has been pointed out that the storage element is directly attached to a circuit as a bare chip and cannot be removed, thereby greatly limiting the degree of freedom in development.

SUMMARY OF THE INVENTION The present invention has been made in view of the above-described problems, and it is an object of the present invention to provide an integrated circuit having a metal substrate that can increase the degree of freedom in the development of an integrated circuit.

[Means for Solving the Problems] In order to solve the above problems and achieve the object, an integrated circuit having a metal substrate according to the present invention has a conductive layer of a desired shape formed on a metal substrate via an insulating layer. Circuit board, and at least one electronic component including a circuit element that is non-removably attached on the insulating layer and has nonvolatile memory contents that can be rewritten by an external operation, and the circuit board includes: A housing is formed in which the circuit board is a part of an outer wall, and one surface of the housing is closed by a connector connectable to an external device.

In the integrated circuit having a metal substrate according to the present invention, a signal cutoff circuit is provided on a signal line group connecting the circuit element and a peripheral circuit element on the circuit board. I have.

Further, in the integrated circuit having the metal substrate according to the present invention, a conductive contact member is electrically connected to a signal line group between the signal cutoff circuit and the circuit element, and through the contact member, It is characterized in that input and output of stored contents to and from circuit elements are performed.

[Operation] In the integrated circuit having the metal substrate configured as described above, at least one electronic component irremovably mounted on the conductive layer has non-volatile storage contents that can be rewritten by an external operation. Since the setting is made so as to include the circuit element, as a result, the stored contents stored in this circuit element can be freely rewritten, and the degree of freedom in development increases.

[Embodiment] Hereinafter, a case where an embodiment of an integrated circuit having a metal substrate according to the present invention is applied to a case-shaped hybrid integrated circuit will be described with reference to FIGS. 1 to 11 of the accompanying drawings. This will be described in detail.

FIG. 1 shows a hybrid integrated circuit 10 of this embodiment. The hybrid integrated circuit 10 is configured as a control unit as an independent in-vehicle functional component. Specifically, for example, the hybrid integrated circuit 10 is configured as a hybrid correction circuit independently having a function as an engine control unit. ing.

As shown, the hybrid integrated circuit 10 is formed as a box-shaped case whose inside is closed, and a male connector 12 as a connection device is integrally attached to one end (rear end). I have. The male connector 12 will be described later in detail, but a commonly used female connector
14 are configured to be connected.

Here, as shown in FIGS. 2 to 3B, the hybrid integrated circuit 10 includes a pair of first and second circuit boards 16a and 16b that are vertically separated from each other, and a first and second circuit board. 16a and 16b are separated by a predetermined distance and a side plate 18 for closing the side surface, and the first and second circuit boards 16a and 16b and the side plate 1
8 and a frame 20 for integrally fixing them.

Specifically, the first and second circuit boards 16a and 16b include:
Necessary to demonstrate the function of the engine control unit.
IC chip functioning as CPU, I functioning as storage element
Circuit elements such as C chips, resistors and capacitors are attached. Specifically, a first circuit board located below
A so-called logic circuit element is connected to 16a, and a so-called power circuit element is connected to the upper second circuit board 16b. In addition, as mentioned above
In this embodiment, the IC chip is directly mounted (fixed) as a bare chip on the insulating layer 22b as described later.

The mounting state of the circuit elements on the first circuit board 16a constitutes a gist of the present invention, and will be described later in detail.

Here, the first and second circuit boards 16a and 16b are set to be formed by dividing one common board 22 into two, as shown in FIG. 4A. That is, as shown in FIG.4B, the common substrate 22 includes a substrate body 22a formed of a conductive material, for example, aluminum, and an insulating layer 22b adhered over the front surface of the substrate body 22a. On the insulating layer 22b, a conductive layer 22c formed in a predetermined circuit pattern and defining a circuit network, and fixed on the conductive layer 22c,
It is formed from a circuit element 22d that is electrically connected.

As shown in FIG. 4A, an opening 22e extending in the vertical direction is formed in the center of the common substrate 22 in advance. Here, the circuit networks on both the left and right sides of the opening 22e are connected to each other via a flexible substrate 22f provided across the opening 22e. By cutting off the upper and lower edges (regions indicated by X and Y) including the upper and lower ends of the opening 22e, the above-mentioned pair of circuit boards 16a and 16b are connected to each other via the flexible board 22f. It is set to be formed.

In the common substrate 22, the upper surfaces of the portions corresponding to the outer ends of the two circuit boards 16a and 16b, that is, the upper and lower ends that define one end of the case are opposed to each other. A plurality of connection terminals 22g and 22h are formed in a horizontal line along the edge on the inner surface. In addition, connection pins 24a and 24b of the male connector 12, which will be described later, are fixed to these connection terminals 22g and 22h, respectively, so as to protrude outward, and are electrically connected.

As shown in FIG. 2, the above-mentioned side plate 18 is formed in a U-shape with one side open, and the open side is set to be one end of the case.
Stepped portions 18a, 1 for receiving the three edges of the corresponding circuit boards 16a, 16b are provided on the inner edges of the upper and lower end surfaces of the side plate 18.
8b are formed respectively.

Here, the respective circuit boards 16a and 16b are fitted into the corresponding step portions 18a and 18b via the seal rubber 26 as shown in FIG. 3A. By providing the seal rubber 26, dust is prevented from entering the case from between them.

On the other hand, as shown in FIG. 2, the above-mentioned frame body 20 is formed of a synthetic resin as an insulating member, and is configured so as to surround the side surface closed by the side plate 18 from above and below. That is, the frame body 20 is provided with a main body 20a facing the side plate 18 and a predetermined distance from the upper and lower ends of the main body 20a (specifically, the three open edges of the upper and lower circuit boards 16a and 16b). Are formed integrally with the flange portions 20b and 20c extending inward by a distance sufficient to hold each of them.

As shown in FIG. 3B, the frame body 20 holds the upper and lower first and second circuit boards 16a and 16b fitted respectively in the upper and lower step portions 18a and 18b of the side plate 18 from above and below. The case is formed so as to be integrally formed. As shown in the figure, a flexible board 22f for connecting the circuit elements 22d of the upper and lower first and second circuit boards 16a and 16b to each other is a side plate.
It is set so as to be located more inward than the other end of 18.

Since the frame body 20 is formed in this way, the side plate 18
And the first and second substrate circuits 16a, 16b
Will be maintained in an assembled state while being separated vertically by a predetermined distance.

That is, in this embodiment, the hybrid integrated circuit 10
The case is formed, and both upper and lower surfaces of the case are directly defined by the circuit boards 16a and 16b.
As a result, compared to a case where the first and second circuit boards 16a and 16b are housed in a separately prepared case, a reduction in size and weight is achieved.

Next, the case-shaped hybrid integrated circuit thus configured
Referring to FIGS. 5 to 8, a description will be given of a configuration of a connection device for connecting the device 10 to a controlled portion of the vehicle.

This connection device is a male connector attached in a so-called internal state to one end opening of the case-shaped hybrid integrated circuit 10.
12 and a male connector 14 detachably connected to the male connector 12. This male connector 12
Is a connector housing formed of a box-shaped housing which is open with both front and rear surfaces penetrated as shown in FIG.
28, an upper connection pin support 30a mounted with the upper connection pins 24a arranged in a horizontal line, and an upper connection pin support 30a mounted with the lower connection pins 24b arranged in a horizontal line. The lower connection pin support 30b is formed in a so-called three-piece shape.

Here, the upper connection pin support 30a and the lower connection pin support 30b are formed symmetrically in the vertical direction with the center in the vertical direction being sloped, and the upper connection pin support 30a is substantially L-shaped.
The shape, the standing piece 30a _1, are integrally formed from the protruding piece 30a ₂ Metropolitan projecting outwardly from the lower end of the upright pieces 30a _1. On the other hand, the lower mold of the connecting pin support 30b is in a substantially inverted L-shape, the standing piece 30b _1, is integrally formed from the protruding piece 30b ₂ Metropolitan protruding upper end how outside of the standing piece 30b ₁ I have.

Then, the upper connecting pins 24a includes a horizontal portion 24a ₁ projecting forward and backward protruding piece 30a ₂ and extends horizontally through, the horizontal portion 24a ₁
Are formed integrally from a vertical portion 24a ₂ that rises vertically along the inner surface of the standing piece 30a ₁ from the inner end of the vertical portion 24a, and a bent portion 24a ₃ that is bent inward from the upper end of the vertical portion 24a _2. I have. The bent portion 24a _3, are defined as a connection portion to be connected by soldering to form connection terminals 22h to the second circuit board 16b of the upper described above. The portion of the horizontal portion 24a ₁ projecting outward is defined as a connection portion to be inserted, connected to the female connector 14.

The lower connecting pin 24b is provided with a horizontal portion 24b ₁ which projects back and forth projecting piece 30b ₂ and extends horizontally through, along connexion perpendicularly from inner end of the horizontal portion 24b ₁ on the inner surface of the standing piece 30b ₁ are formed integrally falling vertical portion 24b _2, from the broken from the lower end of the vertical portion 24b ₂ inwardly song ivy bent part 24b ₃ Prefecture in. The bent portion 24b _3, are defined as a connection portion to be connected by soldering to the connecting terminal 22g formed on the first circuit board 16a of the lower described above. In addition, the horizontal part 24 protruding outward
b ₁ a portion is defined as a connecting portion to be inserted, connected to the female connector 14.

The two connection pin supports 30a and 30b are set to a size that can be just fitted into one end opening of the case-shaped hybrid integrated circuit 10 in a state where they are vertically joined to each other. In other words, the range (outer periphery) extending between the two upright pieces 30a ₁ and 30b ₁ in the state of being joined up and down is set to exactly define the inner periphery of one end opening of the hybrid integrated circuit 10. .

Here, as shown in FIG. 6, recesses 32a and 32b are formed in the center of both upper and lower edges of both connection pin supports 30a and 30b, respectively. These recesses 32a and 32b are for male connector 12
Are integrated into the hybrid integrated circuit 10, and are defined as injection holes for epoxy resin to be injected, as described later.

The upper and lower connection pins 24a, 24b are formed in a vertically symmetric shape, that is, the same shape, and the upper and lower connection pin supports 30a, 30b are also formed in the same shape, which is vertically symmetric. As described above, since the connection pin supports 30a and 30b to which the connection pins 24a and 24b are respectively attached have the same shape, parts can be shared and cost can be reduced. .

On the other hand, the above-described connector housing 28 has a fitting hole 34 formed therein in a state penetrating along the front-rear direction. As shown in FIG. 7, this fitting hole 34 is sufficient for the two projecting pieces 30a ₂ and 30b ₂ that are overlapped with each other to be just fitted in the state where the upper and lower connection pin supports 30a and 30b are joined. Is set to a reasonable size.

Further, mounting flange portions 40a and 40b are integrally formed on both side portions of the connector housing 28. The flange portions 40a and 40b are provided for fixing the male connector 12 to a vehicle body (not shown) in a state where the male connector 12 is attached and fixed to the hybrid integrated circuit 10. In this manner, since it is not necessary to provide a flange portion for mounting the hybrid integrated circuit 10 on the hybrid integrated circuit 10 itself,
The configuration of the hybrid integrated circuit 10 can be simplified.

In this embodiment, these connection pins 24a, 24
The vertical distance l and the left and right pitches p of b are defined based on the specifications of the pin arrangement conventionally used. As a result, as the female connector 14 connected to the male connector 12, a type conventionally used conventionally can be adopted, and the economy is improved.

Also, since the type conventionally used as a male connector is heavy and large, without adopting this type, the case-shaped hybrid integrated circuit 10 is reduced in size and weight.
, A dedicated male connector 12 is formed. Therefore, according to this embodiment, the hybrid integrated circuit 10 described above is
It is possible to reliably prevent the reduction in size and weight of the device.

Next, with reference to FIG. 8, the assembling operation of the hybrid integrated circuit 10 together with the assembling operation of the male connector 12 shown in FIG.

First, as described above with reference to FIGS. 4A and 4B,
Common board 22 with a predetermined circuit element 22d attached
The first and second circuit boards 16a, 16b are formed open on the same plane by cutting the upper and lower edges X, Y from the top. As shown in FIG. 5, the corresponding connection pin supports 30a and 30b are fixed to the first and second circuit boards 16a and 16b in the opened state via an adhesive, respectively.

Here, as described above, these connection pin supports 30a,
The corresponding connection pins 24a and 24b are already attached to 30b. In this way, these connection pins 24a, 24b
When the first and second circuit boards 16a and 16b are opened, they are soldered to the corresponding connection terminals 22g and 22h, respectively. In particular, this soldering work requires the connection terminals 22
Since the numbers of g and 22h are large, fine work is required. In this embodiment, the first and second circuit boards 16a and 16b are respectively opened on the same plane. As a result, the work is reliably performed, the workability is improved, and the assemblability is well maintained.

Thereafter, with the first circuit board 16a held in the same position, the second circuit board 16b is lifted up so as to be parallel to and above the lower first circuit board 16a. Moving. Then, as shown in FIG. 8, both connection pin supports 30a and 30b are joined to each other up and down.
Here, the first and second circuit boards 16a and 16b are set to be parallel to each other when the two connection pin supports 30a and 30b are joined vertically.

On the other hand, prior to such a bonding operation, as shown in FIG. 5, the first and second circuit boards 16a and 16b are provided on the front and rear portions of the first circuit board 16a located below. The frame members 36a and 36b for shielding the internal space from the outside are mounted while keeping the interval constant at a predetermined value and securing the strength of the hybrid integrated circuit 10. Here, one frame member 36a is located slightly inward of the flexible board 22f, and the other frame member 36b is located slightly inward of the connection terminals 22g and 22h. Each arrangement position is set.

Then, while maintaining the joined state, they are fitted into the fitting holes 34 of the connector housing 28, and in this fitted state, the male connector 12 is
Will be attached integrally to the Thereafter, the side plate 18 is attached to the hybrid integrated circuit 10 as described above, and the frame 20
Fit. Thus, the hybrid integrated circuit 10 as shown in FIG. 1 is formed with the male connector 12 integrally provided.

After such an assembling operation is completed, the assembled male connector 12 is securely bonded to the hybrid integrated circuit 10, and the connection pins 24a, 24b are completely shielded from inside the hybrid integrated circuit 10. And corresponding connection terminals 22g, 22h
Between the male connector 12 and the frame member 36b in order to securely fix the soldered portion with the epoxy resin 38.
Is injected through the recesses 32a and 32b, respectively, and the space between the two is filled with the epoxy resin 38.

Further, in order to protect the flexible substrate 22f and shield the inside of the hybrid integrated circuit 10, the frame member 36a
At the stage before the frame body 20 is inserted, a more forward portion is provided on the lower first circuit board 16a so as to be filled with a similar epoxy resin 38 so-called a circuit for so-called logic. The elements are connected, and in detail, as shown in FIGS. 9 to 11, on the first circuit board 16a, there is provided an IC functioning as a CPU required to exhibit a function as an engine control unit. Package (for example, Motorola MC68
01) and an IC chip 22 d ₁ having the same function, implemented as Beachitsupu, in other words, via the bonding wires are mounted directly. In addition, this IC chip 22d ₁
Although not shown, a predetermined control program is built in
ROM is connected.

Moreover, IC On this first circuit board 16a, with the CPU22d ₁ is IC bobbin that various data are written to be required to execute a control procedure (e.g., MyuPD28D64 made NEC) equivalent functions and chip 22 d ₂ is, as a rewritable nonvolatile memory element, similarly to the IC chip 22 d _1, are mounted directly through the bonding wire 22 d _3. still,
The storage element 22d _2, given and Matsupu, default values and constants or the like for defining the threshold value is set and stored.
Further, on the second circuit board 16b, other various circuit elements such as a power transistor, a gate circuit element, a voltage regulator, a capacitor, a resistor, and a diode are mounted.

Further, the first circuit conductor layer 22c on the substrate 16a in which tip portions of the bonding wire 22 d ₃ from the storage element 22 d ₂ is connected, an electrically conductive for use in rewriting the data in the storage element 22 d ₂ pads 22 d ₄ as a contact member is, in a state of being respectively corresponding to the bonding wire 22 d _3, and is electrically connected.

Here, the conductive layer 22c of the network connecting the these storage element 22 d ₂ and CPU22d ₁ together, i.e., to the bus line as a signal line group, as shown in FIG. 11, the data of the storage element 22 d ₂ when rewriting, rewriting information is transmitted to other circuit elements, the rewriting of unnecessary data in these other circuit elements in order to reliably prevent the bus cutoff circuit 22 d ₅ as a signal cutoff circuit, 22 d _6, 22 d ₇ are interposed.

These buses cutoff circuit 22d _5, 22d _6, 22d ₇ is place using analog switch of C-MOS type which functions as a so-called tri-state punishment Hua, a conventionally known configuration,
The description is omitted. In addition, as is clear from FIG.
Between the first bus blocking circuit 22 d ₅ and CPU22d _1, the CPU
Address La Tutsi circuit 22 d ₈ to latch the address data output from the 22 d ₁ is interposed.

In the circuit configuration of the first circuit board 16a configured as described above, in the middle of development conditions, when the need to rewrite the data stored in the storage element 22 d ₂ occurs,
Using probes Units - 42 for data rewriting shown in FIG. 9, thereby rewriting the data in the storage element 22 d _2.

Here, the probe Units - 42, as shown, and has a probe which is in contact thereto so as to correspond to the respective pads 22 d _4, as shown in FIG. 11, which is connected to the write Zener Bull terminal ▲ ▼ Bonding wire 22d ₃
And pads 22 d _4a for write mode setting which is attached via an inverter, Chitsupuenaburu terminal ▲ ▼ and Autopu bract Zener Bull terminal ▲ ▼ and pads for each linked pair of lights mounted on the bonding wire 22 d ₃ was a 22 d _4b , 22d and _4c .

That is, upon rewriting data, the hybrid integrated circuit 10 once assembled is disassembled, and the first and second circuit boards 16a and 16b are again positioned on the same plane as shown in FIG. Opened to. In this open state, the probe Units - 42 having the above structure, the pad 22 d ₄ that these probes corresponding, 22d _4a .22d _4b, attached to respective contacts to 22 d _4c.

Thereafter, this probe Units - 42 are connected via a flexible connecting board 44 through the data writing device (not shown), the data stored in the storage element 22 d _2, will be rewritten to the desired data .

In this rewriting operation, the probe unit
42 a high level signal to the pad 22d _4a for setting the write mode is sent from the result, each of the control terminals of the bus blocking circuit 22d _5, 22d _6, 22d ₇ goes low, the bus blocking circuit 22d each _5, 22d in _6, 22 d _7, open internal switch, the bus line is open. Thus, rewriting the information from the probe Units - 42 would be communicated in these buses cutoff circuit 22d _5, 22d _6, 22d ₇ in addition to the memory element 22 d ₂ is reliably prevented.

On the other hand, the output of the high level signal to the write mode setting pad 22d _4a causes the write enable terminal ▲ ▼ in the memory block 22d _{2 to} go low, and the probe unit 42 outputs a pair of write pads 22d.
The chip enable terminal ▼ is set to a high level and the output enable terminal ▼ is set to a low level via d _4b and 22d _4c.
writable state to d ₂ is to be set.

As described in detail above, the hybrid integrated circuit 10 of this embodiment is
In, as a storage element 22 d ₂ supplies predetermined data to CPU22d _1, uses nonvolatile writeable IC chip, the data stored in the storage element 22 d ₂ is
It can be rewritten arbitrarily. In this way,
In the course of development, when the need to rewrite the data of the storage element 22 d ₂ occurs also, it is possible to easily cope with this rewrite request, the degree of freedom in development will significantly improve.

Further, when the data rewriting operation, since the set to the open state by bus blocking circuit 22d _5, 22d _6, 22d ₇ a bus line connecting the storage element 22 d ₂ and CPU22d _1, the output from the probe Units - 42 rewrite information of data, in addition to memory element 22 d ₂ will be not transmitted, stored data in CPU22d ₂ other circuit elements,
This data rewrite information reliably prevents erroneous rewrite.

As described above, in this embodiment, the rewriting of data, through the probe Units - 42, set this to take place by contacting pads 22d _4, 22d _4a .22d _4b, the 22 d _4c Therefore, this data rewriting operation can be performed very simply and easily.

Also, in one embodiment described above, the male connector 12
Is formed from the connector housing 28 and the connection pin supports 30a and 30b divided into upper and lower portions. In a stage before the hybrid integrated circuit 10 is formed, each connection pin support 30a and 30b is formed. And fixing them to the corresponding circuit boards 16a and 16b, respectively, and connecting the connection pins 24a and 24b to the corresponding connection terminals 22g and 22h.
Are set so as to perform the operation of connecting to each of them. In this way, the assemblability of the hybrid integrated circuit 10 is maintained well.

In the above-described embodiment, the hybrid integrated circuit 10 to which the male connector 12 is fixed is configured such that both upper and lower surfaces are defined by a pair of circuit boards 16a and 16b.
As a result, according to the first embodiment, the number of components of the hybrid integrated circuit 10 is reduced, and small size and low cost are achieved.

In this embodiment, the circuit boards 16a, 16a
b is a conductive aluminum substrate main body 22a, an insulating layer 22b stuck on the substrate main body 22a, and an insulating layer 22b
And a conductive layer 22c adhered thereto in a predetermined circuit pattern. As a result, various circuit elements
The heat generated from 22d is
Since the heat can be dissipated by using the 2a as a heat radiating plate, it is not necessary to separately provide a heat radiating member, and a significant reduction in size can be achieved.

Further, in this embodiment, as described above, since the upper and lower surfaces of the case are each constituted by a pair of circuit boards 16a and 16b having an aluminum substrate body 22a,
These circuit boards 16a and 16b can be used as electromagnetic shielding members. As a result, the internal space of the hybrid integrated circuit 10 on this case is substantially electromagnetically shielded, and the circuit element 22d is less susceptible to electromagnetic interference.

It is needless to say that the present invention is not limited to the configuration of the above-described embodiment, but can be variously modified without departing from the gist of the present invention.

For example, in one embodiment described above, a hybrid integrated circuit
Although described as functioning as an engine control unit as 10, the present invention is not limited to this. For example, it may operate as a functional component such as a vehicle speed control device, a control device for four-wheel steering, an automatic transmission control device, or the like. It can be configured as follows.

Further, in one embodiment described above, the hybrid integrated circuit 10
Has been described as including a pair of upper and lower circuit boards 16a and 16b, but the present invention is not limited to such a configuration, and may be configured to have, for example, three circuit boards parallel to each other. Needless to say, this is acceptable.

Further, in one embodiment described above, rewritten in the storage element 22 d ₂ has been described as a data, without having to be limited to this, even when the rewrite control program of the IC chip which functions as a memory element It can be applied similarly.

Further, in the above-described embodiment, it has been described that data rewriting is effective in the development of the hybrid integrated circuit 10. However, the present invention is not only effective in such a development stage, but also includes, for example, In the case where the control content is changed by version up at the stage when the product is distributed to the market, the user can bring the hybrid integrated circuit 10 to a repair shop or the like without replacing the hybrid integrated circuit 10. It can be easily rewritten into the version-up control contents at low cost, which is very convenient for the user.

[Effects of the Invention] As described above in detail, an integrated circuit having a metal substrate according to the present invention includes a circuit board in which a conductive layer having a desired shape is formed on a metal substrate with an insulating layer interposed therebetween; At least one electronic component including a circuit element that is non-removably attached and has nonvolatile storage contents that can be rewritten by an external operation, and the circuit board includes the circuit board as a part of an outer wall. A body is formed, and one surface of the housing is closed by a connector connectable to an external device.

In the integrated circuit having a metal substrate according to the present invention, a signal cutoff circuit is provided on a signal line group connecting the circuit element and a peripheral circuit element on the circuit board. I have.

Further, in the integrated circuit having the metal substrate according to the present invention, a conductive contact member is electrically connected to a signal line group between the signal cutoff circuit and the circuit element, and through the contact member, It is characterized in that input and output of stored contents to and from circuit elements are performed.

Therefore, according to the present invention, there is provided an integrated circuit having a metal substrate capable of increasing the degree of freedom of development in the development stage of the integrated circuit.

[Brief description of the drawings]

FIG. 1 is a perspective view showing an embodiment of an integrated circuit having a metal substrate according to the present invention; FIG. 2 is an exploded perspective view showing a configuration of the integrated circuit shown in FIG. 1; FIG. 3B is a cross-sectional view taken along line AA; FIG. 3B is a cross-sectional view taken along line BB in FIG. 1; FIG. 4A is a plan view showing a configuration of a common substrate; 4B is a cross-sectional view showing the configuration of the common board; FIG. 5 is a cross-sectional view showing the configuration of an integrated circuit to which the male connector is attached; FIG. 6 is an exploded perspective view specifically showing the configuration of the male connector; FIG. 7 is a front view showing the assembled state of the male connector; FIG. 8 is a top view showing a state in which both connection pin supports are fixed to the circuit board in an opened state, respectively; FIG. 10 is a perspective view schematically showing an arrangement state of circuit elements on a first circuit board; FIG. 10 is a first circuit shown in FIG. Block diagram showing a block configuration of an ECU in the plate; and FIG. 11 is a connection diagram showing a specific connection between the CPU and the memory element in the first circuit board illustrated in Figure 9. In the figure, 10 ... hybrid integrated circuit, 12 ... male connector, 14 ...
... female connector, 14a; 14b ... connection terminal, 16a ... first circuit board, 16b ... second circuit board, 18 ... side plate, 18a;
8b ... step, 20 ... frame, 20a ... body, 20b; 20c ... flange, 22 ... common board, 22a ... board body, 22b ...
Insulating layer, 22c ...... conductive layer, 22d ...... circuit elements, 22d ₁ ...... CP
U, 22d ₂ … storage element, 22d ₃ … bonding wire, 2
22d ₄ ; 22d _4a ; 22d _4b ; 22d _4c ...... pad, 22d ₅ ; 22d ₆ ; 22d ₇ ;
… Bus interrupting circuit, 22e… Opening, 22f… Flexible board, 22g; 22h… Connection terminal, 24a; 24b… Connection pin,
24a ₁ ; 24b ₁ ... horizontal part, 24a ₂ ; 24b ₂ ... vertical part, 24a ₃ ; 24b
₃ … Bending part, 26… Seal rubber, 28… Connector housing, 30 a… Upper connection pin support, 30 a ₁ … Standing piece, 30 a ₂ … Projecting piece, 30 b… Lower connection Pin support, 30b ₁ ... standing piece, 30b ₂ ... projecting piece, 32a; 32b ... recess, 34 ... fitting hole, 36a; 36b ... frame member, 38 ...
An epoxy resin, 40a; 40b ... a flange portion, 42 ... a probe unit, 44 ... a flexible connection board.

Claims (3)

(57) [Claims] A circuit board having a conductive layer of a desired shape formed on a metal substrate via an insulating layer; and a non-removable storage content which is irremovably mounted on the insulating layer and which can be rewritten by an external operation. And at least one electronic component including a circuit element included in the circuit board, wherein the circuit board forms a housing having the circuit board as a part of an outer wall, and one surface of the housing is connectable to an external device. An integrated circuit having a metal substrate closed by a connector. 2. The circuit according to claim 1, wherein a signal cutoff circuit is provided on a signal line group connecting the circuit element and a peripheral circuit element on the circuit board. An integrated circuit having a metal substrate. 3. A conductive contact member is electrically connected to a signal line group between the signal cutoff circuit and the circuit element, and input / output of stored contents to / from the circuit element via the contact member. 2. An integrated circuit having a metal substrate according to claim 1, wherein: