JP2702223B2 - Integrated circuit with metal substrate - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION [Industrial Application Field] The present invention relates to a pair of circuit boards in which a conductive layer of a desired shape is formed on a metal substrate via an insulating layer, and is opposed to each other. And a connection cable electrically connected to each other.

[Prior art] Conventionally, conductive layers are bonded to each other via an insulating layer, circuit elements are fixed to each conductive layer, and both conductive layers are connected to each other via a connection substrate. As an integrated circuit having a pair of metal substrates provided so as to face each other, a technique disclosed in Japanese Patent Publication No. 46-13234 is known. In the integrated circuit manufacturing method disclosed in this prior art, at least one principal surface of an ammonium substrate is anodized to form an ammonium oxide thin layer on the substrate surface, and a resistor is formed on the ammonium oxide thin layer. A step of selectively adhering and forming a substance and a good conductor substance to form a plurality of circuit elements; and a step of fixing a transistor pellet on a lead portion formed by selectively adhering a good conductor.
The method includes a step of sealing at least all of the circuit elements with an insulating resin.

In an integrated circuit formed in this manner, in a circuit board having a conductive layer of a desired shape formed on a metal substrate via an insulating layer, at least one storage element cannot be removed as a so-called bare chip on the insulating layer. It is attached to.

[Problem to be Solved by the Invention] The integrated circuit formed as described above may be adopted for use in a vehicle from the viewpoint of its small size and low cost. However, when an integrated circuit having such a metal substrate is actually used for a vehicle, various tests are performed in a development stage, and data stored in the storage element is rewritten or controlled as necessary. You will have to make changes to the program.

However, as described above, this storage element is directly attached to a circuit as a bare chip, and once attached, it is not possible to remove the storage element. However, it is pointed out that such a task is difficult and the degree of freedom in development is greatly restricted.

In particular, in the forefront of the present applicant, a pair of circuit boards each having a conductive layer of a desired shape formed on a metal substrate via an insulating layer are opposed to each other so as to be parallel to each other, and fixed with a frame or the like. If you want to look inside during development or if you want to rewrite data, change control programs, or monitor stored contents, as described above, It has been pointed out that it is difficult to modify the control contents and the like in terms of configuration.

SUMMARY OF THE INVENTION The present invention has been made in view of the above-described problems, and an object of the present invention is to rewrite data externally, change a control program, monitor storage contents, and the like without externally disassembling a configuration in an integrated circuit development stage. It is an object of the present invention to provide an integrated circuit having a metal substrate capable of increasing the degree of freedom of development by performing the above operations.

[Means for Solving the Problems] In order to solve the above problems and achieve the object, an integrated circuit having a metal substrate according to the present invention has a conductive layer of a desired shape formed on a metal substrate via an insulating layer. In an integrated circuit comprising a pair of circuit boards facing each other and a connection cable for electrically connecting these circuit boards to each other, an electronic component that is irremovably mounted on an insulating layer of one of the circuit boards. A first signal line group formed on the one circuit board so as to connect the connection cable, and a first signal line group formed on the one circuit board so as to be separated from the first signal line group; And a second signal line group capable of connecting the component to the external processing unit.

In the integrated circuit having a metal substrate according to the present invention, when the first and second signal line groups are connected to each other, the second signal line group is connected to an external processing unit via an external signal cable. And is emulated or tuned by this external processing unit.

Further, in the integrated circuit having the metal substrate according to the present invention, the first and second signal line groups are separated from each other, and the second signal group is separated from the external processing unit by the one of the one signal line group. The electronic component is mounted on a circuit board.

Further, in the integrated circuit having a metal substrate according to the present invention, a conductive layer having a desired shape is formed on the metal substrate via an insulating layer, and a pair of circuit boards facing each other are electrically connected to each other. An integrated circuit including a connection cable to be connected; a first component formed on the one circuit board so as to connect the electronic component unremovably mounted on an insulating layer of the one circuit board to the connection cable;
And a second signal line group which is branched from the first signal line group while being electrically connected thereto and which can connect the electronic component to an external monitor unit. I have.

Further, in the integrated circuit having the metal substrate according to the present invention, the second signal line group is connected to the external monitor unit via an external signal cable, and the external signal cable is removed after the monitor operation is completed. Is characterized by

[Operation] In an integrated circuit having a metal substrate configured as described above, with respect to operations such as data rewriting and control program change, at the stage of development, a circuit element in charge of these is not mounted, It is connected to an external processing device via a dedicated signal line group (second signal line group) and an external signal cable, and the external processing device enables operations such as data rewriting and control program change from the outside. To increase the degree of freedom in development. And
When the development is completed, the circuit elements are set to be mounted while the circuit network pattern used in the development stage is used as it is.

On the other hand, regarding the monitoring of stored contents,
A dedicated signal line group (second signal line group) on which circuit elements are mounted
And an external signal cable to connect to an external processing device, and the external processing device enables a monitor operation of the stored contents, thereby increasing the degree of freedom in development. Then, at the stage when the development is completed, the setting is made so as to configure the integrated circuit while using the circuit network pattern used in this development stage as it is.

[Embodiment] Hereinafter, a case where an embodiment of an integrated circuit having a metal substrate according to the present invention is applied to a case-shaped hybrid integrated circuit will be described with reference to FIGS. 1 to 11B of the accompanying drawings. This will be described in detail.

FIG. 1 shows a hybrid integrated circuit 10 of this embodiment. The hybrid integrated circuit 10 is configured as a control unit as an independent in-vehicle functional component, and specifically, for example, is configured as a hybrid integrated circuit having an independent function as an engine control unit. ing.

As shown, the hybrid integrated circuit 10 is formed as a box-shaped case whose inside is closed, and a male connector 12 as a connection device is integrally attached to one end (rear end). I have. The male connector 12 will be described later in detail, but a commonly used female connector
14 are configured to be connected.

Here, as shown in FIGS. 2 to 3B, the hybrid integrated circuit 10 includes a pair of first and second circuit boards 16a and 16b that are vertically separated from each other, and a first and second circuit board. A side plate for separating 16a and 16b by a predetermined distance and closing the side surface
18, the first and second circuit boards 16a and 16b and the side plate 18
And a frame body 20 that integrally fixes them.

Specifically, the first and second circuit boards 16a and 16b include:
Necessary to fulfill the function of the engine control unit.
IC chip functioning as CPU, I functioning as storage element
Circuit elements such as C chips, resistors and capacitors are attached. Specifically, a first circuit board located below
A so-called logic circuit element is connected to 16a, and a so-called power circuit element is connected to the upper second circuit board 16b. In addition, as mentioned above
In this embodiment, the IC chip is directly mounted (fixed) as a bare chip on the insulating layer 22b as described later.

The mounting state of the circuit elements on the first circuit board 16a constitutes a gist of the present invention, and will be described later in detail.

Here, the first and second circuit boards 16a and 16b are set to be formed by dividing one common board 22 into two, as shown in FIG. 4A. That is, as shown in FIG.4B, the common substrate 22 includes a substrate body 22a formed of a conductive material, for example, aluminum, and an insulating layer 22b adhered over the front surface of the substrate body 22a. On the insulating layer 22b, a conductive layer 22c formed in a predetermined circuit pattern and defining a circuit network, and fixed on the conductive layer 22c,
It is formed from a circuit element 22d that is electrically connected.

As shown in FIG. 4A, an opening 22e extending in the vertical direction is formed in the center of the common substrate 22 in advance. Here, the circuit networks on both the left and right sides of the opening 22e are connected to each other via a flexible substrate 22f provided across the opening 22e. still,
The left end of the flexible substrate 22f in the figure is connected to a position where it enters the left side of the left edge of the opening 22e by a predetermined distance. That is, in the range of the predetermined distance, the connection portion 16c to which the external bus cable described later is connected is integrally defined at the other end of the first circuit board 16. By cutting off the upper and lower edges (regions indicated by reference symbols X and Y) including the upper and lower ends of the opening 22e, the pair of circuit boards 16a and 16b is connected to each other via the flexible board 22f. It is set to be formed.

In the common substrate 22, the upper surfaces of the portions corresponding to the outer ends of the two circuit boards 16a and 16b, that is, the upper and lower ends that define one end of the case are opposed to each other. A plurality of connection terminals 22g and 22h are formed in a horizontal line along the edge on the inner surface. In addition, connection pins 24a and 24b of the male connector 12, which will be described later, are fixed to these connection terminals 22g and 22h, respectively, so as to protrude outward, and are electrically connected.

On the other hand, on the common board 22,
A plurality of connection terminals 22i to which one end of the external bus cable is connected by soldering or the like are formed in a horizontal row along the edge.

As shown in FIG. 2, the above-mentioned side plate 18 is formed in a U-shape with one side open, and the open side is set to be one end of the case.
Stepped portions 18a, 1 for receiving the three edges of the corresponding circuit boards 16a, 16b are provided on the inner edges of the upper and lower end surfaces of the side plate 18.
8b are formed respectively.

Here, as shown in FIG. 3A, the circuit boards 16a and 16b are fitted into the corresponding step portions 18a and 18b via the seal rubber 26. By providing the seal rubber 26, dust is prevented from entering the case from between them.

On the other hand, as shown in FIG. 2, the above-mentioned frame body 20 is formed of a synthetic resin as an insulating member, and is configured to sandwich the side surface closed by the side plate 18 from above and below. That is, the frame body 20 is provided with a main body 20a facing the side plate 18 and a predetermined distance from the upper and lower ends of the main body 20a (specifically, the three open edges of the upper and lower circuit boards 16a and 16b). Are formed integrally with the flange portions 20b and 20c which extend inward by a distance sufficient to hold the respective members.

As shown in FIG.3B, the frame body 20 holds the upper and lower first and second circuit boards 16a and 16b fitted respectively to the upper and lower step portions 18a and 18b of the side plate 18 from above and below, The case is formed so as to be integrally formed. As shown in the figure, a flexible board 22f for connecting the circuit elements 22d of the upper and lower first and second circuit boards 16a and 16b to each other is a side plate.
It is set so as to be located more inward than the other end of 18.

Since the frame body 20 is formed in this way, the side plate 18
And the first and second substrate circuits 16a, 16b
Will be maintained in an assembled state while being separated vertically by a predetermined distance.

That is, in this embodiment, the hybrid integrated circuit 10
The case is formed, and both upper and lower surfaces of the case are directly defined by the circuit boards 16a and 16b. As a result, compared to the case where the first and second circuit boards 16a and 16b are housed in a separately prepared case, the size and size are reduced.
Weight reduction will be achieved.

Next, a case-like hybrid integrated circuit configured as described above
Referring to FIGS. 5 to 8, a description will be given of a configuration of a connection device for connecting the device 10 to a controlled portion of the vehicle.

This connection device is a male connector attached in a so-called internal state to one end opening of the case-shaped hybrid integrated circuit 10.
And a female connector 14 detachably connected to the male connector 12. This male connector 12
Is a connector housing formed from a box-shaped housing which is opened with both front and rear surfaces penetrated as shown in FIG.
28, an upper connection pin support 30a mounted with the upper connection pins 24a arranged in a horizontal line, and an upper connection pin support 30a mounted with the lower connection pins 24b arranged in a horizontal line. The lower connection pin support 30b is formed in a so-called three-piece shape.

Here, the upper connection pin support 30a and the lower connection pin support 30b are formed symmetrically in the vertical direction with a plate in the center in the vertical direction, and the upper connection pin support 30a is substantially L-shaped.
The shape, the standing piece 30a _1, are integrally formed from the protruding piece 30a ₂ Metropolitan projecting outwardly from the lower end of the upright pieces 30a _1. On the other hand, the lower mold of the connecting pin support 30b is in a substantially inverted L-shape, the standing piece 30b _1, is integrally formed from the protruding piece 30b ₂ Metropolitan protruding upper end how outside of the standing piece 30b ₁ I have.

Then, the upper connecting pins 24a includes a horizontal portion 24a ₁ projecting forward and backward protruding piece 30a ₂ and extends horizontally through, the horizontal portion 24a ₁
A vertical portion 24a ₂ which rises along connexion perpendicular to the inner surface of the standing pieces 30a ₁ from the inner end of, and is formed integrally from the song broken from an upper end of the vertical portion 24a ₂ inwardly ivy bent portion 24a ₃ Metropolitan . The bent portion 24a _3, are defined as a connection portion to be connected by soldering to form connection terminals 22h to the second circuit board 16b of the upper described above. Also, a horizontal part protruding outward
Portion of 24a ₁ has been specified as the connection portion to be inserted, connected to the female connector 14.

The lower connecting pin 24b is provided with a horizontal portion 24b ₁ which projects back and forth projecting piece 30b ₂ and extends horizontally through, along connexion perpendicularly from inner end of the horizontal portion 24b ₁ on the inner surface of the standing piece 30b ₁ are formed integrally falling vertical portion 24b _2, from the broken from the lower end of the vertical portion 24b ₂ inwardly song ivy bent part 24b ₃ Prefecture in. The bent portion 24b _3, are defined as a connection portion to be connected by soldering to the connecting terminal 22g formed on the first circuit board 16a of the lower described above. In addition, the horizontal part 24 protruding outward
b ₁ a portion is defined as a connecting portion to be inserted, connected to the female connector 14.

The two connection pin supports 30a and 30b are set to a size that can be just fitted into one end opening of the case-shaped hybrid integrated circuit 10 in a state where they are vertically joined to each other. In other words, the range (outer circumference) extending between the two upright pieces 30a ₁ and 30b ₁ in the state of being joined up and down is set to exactly define the inner circumference of the one-end opening of the hybrid integrated circuit 10. .

Here, as shown in FIG. 6, recesses 32a and 32b are formed in the center of both upper and lower edges of both connection pin supports 30a and 30b, respectively. These recesses 32a and 32b are for male connector 12
Are integrated into the hybrid integrated circuit 10, and are defined as injection holes for epoxy resin to be injected, as described later.

The upper and lower connection pins 24a and 24b are formed in a vertically symmetric shape, that is, the same shape, and the upper and lower connection pin supports 30a and 30b are also formed in the same shape in a vertically symmetric shape. As described above, since the connection pin supports 30a and 30b to which the connection pins 24a and 24b are respectively attached have the same shape, parts can be shared and cost can be reduced. .

On the other hand, the above-described connector housing 28 has a fitting hole 34 formed therein in a state penetrating along the front-rear direction. As shown in FIG. 7, this fitting hole 34 is sufficient for the two projecting pieces 30a ₂ and 30b ₂ that are overlapped with each other to be just fitted in the state where the upper and lower connection pin supports 30a and 30b are joined. Is set to a reasonable size.

Further, mounting flange portions 40a and 40b are integrally formed on both side portions of the connector housing 28. The flange portions 40a and 40b are provided for fixing the male connector 12 to a vehicle body (not shown) in a state where the male connector 12 is attached and fixed to the hybrid integrated circuit 10. In this manner, since it is not necessary to provide a flange portion for mounting the hybrid integrated circuit 10 on the hybrid integrated circuit 10 itself,
The configuration of the hybrid integrated circuit 10 can be simplified.

In this embodiment, these connection pins 24a, 24
The vertical distance l and the left and right pitches p of b are defined based on the specifications of the pin arrangement conventionally used. As a result, as the female connector 14 connected to the male connector 12, a type conventionally used conventionally can be adopted, and the economy is improved.

Also, since the type conventionally used as a male connector is heavy and large, without adopting this type, the case-shaped hybrid integrated circuit 10 is reduced in size and weight.
, A dedicated male connector 12 is formed. Therefore, according to this embodiment, the hybrid integrated circuit 10 described above is
It is possible to reliably prevent the reduction in size and weight of the device.

Next, with reference to FIG. 8, the assembling operation of the hybrid integrated circuit 10 together with the assembling operation of the male connector 12 shown in FIG. 5 after the completion of the assembling will be described.

First, as described above with reference to FIGS. 4A and 4B,
Common board 22 with a predetermined circuit element 22d attached
The first and second circuit boards 16a, 16b are formed open on the same plane by cutting the upper and lower edges X, Y from the top. As shown in FIG. 5, the corresponding connection pin supports 30a and 30b are fixed to the first and second circuit boards 16a and 16b in the opened state via an adhesive, respectively.

Here, as described above, these connection pin supports 30a,
The corresponding connection pins 24a and 24b are already attached to 30b. In this way, these connection pins 24a, 24b
When the first and second circuit boards 16a and 16b are opened, they are soldered to the corresponding connection terminals 22g and 22h, respectively. In particular, this soldering work requires the connection terminals 22
Since the numbers of g and 22h are large, fine work is required. In this embodiment, the first and second circuit boards 116a and 16b are opened on the same plane, respectively. As a result, the work is reliably performed, the workability is improved, and the assemblability is well maintained.

Thereafter, with the first circuit board 16a held in the same position, the second circuit board 16b is lifted up so as to be parallel to and above the lower first circuit board 16a. Moving. Then, as shown in FIG. 8, both connection pin supports 30a and 30b are joined to each other up and down.
Here, the first and second circuit boards 16a and 16b are set to be parallel to each other when the two connection pin supports 30a and 30b are joined vertically.

On the other hand, prior to such a bonding operation, as shown in FIG. 5, the first and second circuit boards 16a and 16b are provided on the front and rear portions of the first circuit board 16a located below. The frame members 36a and 36b for shielding the internal space from the outside are mounted while keeping the interval constant at a predetermined value and securing the strength of the hybrid integrated circuit 10. Here, one frame member 36a is located slightly inside the flexible substrate 22f, and the other frame member 36b is located slightly inside the connection terminals 22g and 22h, respectively. Has been set.

Then, while maintaining the joined state, they are fitted into the fitting holes 34 of the connector housing 28, and in this fitted state, the male connector 12 is
Will be attached integrally to the Thereafter, the side plate 18 is attached to the hybrid integrated circuit 10 as described above, and the frame 20
Fit. Thus, the hybrid integrated circuit 10 as shown in FIG. 1 is formed with the male connector 12 integrally provided.

After such an assembling operation is completed, the assembled male connector 12 is securely bonded to the hybrid integrated circuit 10, and the connection pins 24a, 24b are completely shielded from inside the hybrid integrated circuit 10. And corresponding connection terminals 22g, 22h
Between the male connector 12 and the frame member 36b in order to securely fix the soldered portion with the epoxy resin 38.
Is injected through the recesses 32a and 32b, respectively, and the space between the two is filled with the epoxy resin 38.

Further, in order to protect the flexible substrate 22f and shield the inside of the hybrid integrated circuit 10, the frame member 36a
The front portion is set so as to be filled with a similar epoxy resin 38 before the frame 20 is mounted.

On the other hand, the first circuit board located below,
The mounting state of various electronic components in 16a is set as shown in FIG.

Specifically, first, as shown in FIG. 9, a signal line group defined by a circuit network, in other words, a conductive layer 22c, is formed on the insulating layer 22b of the first circuit board 16a in a predetermined pattern. Are formed as a plurality of bus lines. And
On the insulating layer 22b of the first circuit board 16a, there is provided an IC package (for example, Motorola MC68) which functions as a CPU necessary for exhibiting a function as an engine control unit.
01) and an IC chip 22 d ₁ having the same function are fixed as Beachitsupu, via a bonding wire, is mounted in a predetermined group of the above-mentioned bus line. Incidentally, this is IC chip 22 d _1, although not shown, a predetermined control program is built ROM is connected.

Further, on the insulating layer 22b of the first circuit board 16a, at the stage of completing as a product, IC bobbin which various data this CPU22d ₁ is required in performing the control procedure is written (for example, IC chip 22 d ₂ having the same functions as MyuPD28C64) made by NEC, a rewritable nonvolatile memory element, similarly to the IC chip 22 d _1, the 10A
As shown in FIG. 10 and FIG. 10B, the bonding wire 22d ₃
Through, has been set to be directly mounted to a predetermined group among the above-mentioned bus line, in the development stage, the memory element 22 d ₂ is not implemented, the storage element 22 d ₂
Is defined only in the area E in which is mounted.

Note that the storage element 22d _2, given and Matsupu, default values and constants or the like for defining the threshold value is set and stored. In addition, various circuit elements such as a power transistor, a gate circuit element, a voltage regulator, a capacitor, a resistor, and a diode are mounted on the second circuit board 16b.

The feature of the present invention is that the conductive layer 22
network composed of c (circuit pattern), in the vicinity of the area E of scheduled to memory element 22 d ₂ as described above is mounted, is set as shown in 11A view and a 11B FIG.

Specifically, first, as shown in FIG. 11A, a predetermined pattern is formed on the insulating layer 22b of the first circuit board 16a,
Set circuitry as imaged in the storage element 22 d ₂ described above, in other words, a plurality of first bus lines 22c ₁ formed of a conductive layer 22c is formed.

Here, the inner ends of these first bus lines 22c ₁ are:
It is regulated so as to be arranged along the outer edge of the area E described above. Then, when the memory element 22 d ₂ are mounted, and this connection terminal, between the first inner end of the balance 22c ₁ is bonding wire 22 d ₃ (shown in FIG. 12.)
Is set to be directly connected. Further, the outer ends of the first bus line 22c ₁ is terminated at the retracted position by inwardly a predetermined distance than the outer edge of the first circuit board 16a, these outer ends Are connected to predetermined connection terminals at the lower end of the flexible substrate 22f described above.

On the other hand, in a state of being respectively disposed between ₁ The first bus line 22c, On the insulating layer 22b of the first circuit board 16, the bus line 22c ₁ of the first as an external processing apparatus to be described later the second bus line 22c ₂ for connection to the tuning device 42 is formed.

Here, the inner end of each second bus line 22c ₂ is extended so as to protrude inwardly of the above-mentioned area E, also, the outer end, a corresponding first bus line 22c ₁ And is terminated outside while being connected to the connection terminal 2i described above. As shown in FIG. 11B, in the development stage, these connection terminals 22i are connected to connection lines at one end of an external bus cable 44 as an external connection cable, respectively. As shown in FIG. 51, the side plate 18 and the rear surface of the frame 20 are respectively taken out through the through holes 18c and 22d formed on the rear surface thereof, and the other end thereof is connected to the tuning device 42. I have.

Further, in the development stage as described above, the first inner end portion of the bus line 22c ₁ is the second inner end of the bus line 22c ₂ corresponding thereto via the bonding wires 46 electrically Connected. In this way, at the development stage, although the storage element 22d ₂ is not mounted,
The integrated circuit 10 includes a RAM built in the tuning device 42.
Or because the rewritable ROM via an external bus cable 44 and the second bus line 22c ₂ are electrically connected, using various data stored in advance in these RAM or rewritable ROM, integrated The circuit 10 can execute a predetermined control operation.

And in this embodiment, the tuning device
If 42 is set to the simulation mode and the control procedure is simulated based on the data in the RAM or rewritable ROM, and the data needs to be changed,
If the address at which the data is changed is found, the tuning device 42 is switched to the tuning mode, and the data at the predetermined address is arbitrarily rewritten. Thereafter, the tuning device 42 is switched to the simulation mode again, and the control procedure is simulated based on the rewritten data. In this Yo, so that the setting of the data to be stored in the storage element 22 d ₂ in the development stage is carried out.

On the other hand, when such a development stage is completed, the storage element 22d ₃
If the data to be is stored within has been established, in a separate written state such data to the storage element 22 d _2, the first circuit board 16a, implemented as shown in FIG. 10A and the second 10B Figure Will do. In this case, in a state where neither the above-mentioned bonding wire 46 nor the external bus cable 44 is attached, the storage element 22d ₂ as a bare chip is mounted.
Are directly mounted (fixed) on the insulating layer 22b. Then, the inner end portion corresponding in a predetermined connecting terminal and the first bus line 22c ₁ of the implemented storage element 22 d ₂ is set will be connected to each other by bonding wires 22 d ₃ described above.

Since above the integrated circuit 10 of this embodiment is constituted, in the development stage, without implementing RAM or rewritable ROM, via a second bus line 22c ₂ and the external bus cable 44 the Chiyuningu device 42 as connected external processor Te, or perform Shimiyureta the control procedure in CPU22d ₁ that follows in the data stored in these RAM or rewritable ROM, stored in RAM or rewritable ROM A tuning operation for rewriting the data is performed.

Thus, according to this embodiment, the can easily rewrite the data stored in the storage element 22 d ₂ in the development stage, the control procedure to operate the CPU22d ₁ on the basis of the rewritten data Simulation can be easily performed, and the degree of freedom in the development stage is greatly improved.

Further, in this embodiment, the integrated circuit of the first and second circuit pattern of the bus lines 22c _1, 22c ₂ used in the development stage, as a product employs a raw shape
10 is set to complete. As a result, the cost of etching and forming the circuit pattern is greatly reduced, and since the circuit pattern that actually operated in the development stage is applied to the product, this product operates without mistake as in the development stage. Thus, stable operation of the product is ensured, in other words, reliability is ensured.

Further, in this embodiment, the efficiency of development is improved, and a highly complete electronic control unit is provided, which is very useful.

It is needless to say that the present invention is not limited to the configuration of the above-described embodiment, but can be variously modified without departing from the gist of the present invention.

For example, in one embodiment described above, a hybrid integrated circuit
Although described as functioning as an engine control unit as 10, the invention is not limited to this, and may operate as respective functional components such as a vehicle speed control device, a control device in four-wheel steering, an automatic transmission control device, and the like. It can be configured as follows.

Further, in one embodiment described above, the hybrid integrated circuit 10
Has been described as including a pair of upper and lower circuit boards 16a and 16b, but the present invention is not limited to such a configuration, and may be configured to have, for example, three circuit boards parallel to each other. Needless to say, this is acceptable.

Further, in one embodiment described above, the subject to be Shimiyureshiyon and data rewritten by Chiyuningu device 42 has been described as a storage element 22 d _2, without having to be limited to this, the control of the IC chip as CPU22d ₁ The same applies to the case where the program is similarly processed from outside.

Further, in one embodiment described above, the second bus line 22c ₂ has been described a memory element 22 d ₂ (or CPU22d ₁₎ by Chiyuningu device 42 to be used when Shimiyureshiyon and data rewriting, the present invention The present invention is not limited to such a configuration, and can be similarly applied to a case where emulation operation is performed by an emulator.
As shown in FIG. 3B as another embodiment, a tuning device
It can also be applied to the case of monitoring by 42.

Hereinafter, the configuration of an integrated circuit 10 according to another embodiment of the present invention will be described. In the following description, the same portions as those of the above-described embodiment are denoted by the same reference numerals, and description thereof will be omitted.

In this embodiment, as shown in FIG. 12A and FIG. 13A, the second bus line 22c _2, the first bus line 22c ₁
Is formed in a state of branching from the middle part, in the development stage, the storage element 22d ₂ as a monitored object,
As shown in FIG. 12B, while being fixed on the insulating layer 22b, connection terminals of the memory element 22 d ₂ and the first bus line 22
The inner end of the c _1, are connected to each other via a bonding wire 22 d _3. Also, the outer end of the second bus line 22c ₂ is connected to the Chiyuningu device 42 via the external bus cable 44.

Thus, in this embodiment, in the development step, when the need to monitor the data stored in the storage element 22 d ₂ occurs, as shown in FIG. 12A and FIG. 12B, the second by setting the Chiyuningu device 42 connected via a bus line 22c ₂ and the external bus cable 44 to the monitor mode, it is possible to monitor the data.

On the other hand, when the integrated circuit 10 is completed as a product, the external bus cable 44 is completed without being attached.

Thus, in the integrated circuit 10 in another embodiment, in the development stage, so that the data stored in any in the storage element 22 d ₂ can be monitored through the external Niokeruru monitoring device 48 Therefore, the degree of freedom in the development stage is greatly improved.

Further, in one embodiment described above, CPU22d ₁ and memory element 22 d ₂ as circuit elements, insulating layer 2 as Beachitsupu
Although described as being implemented directly on 2b, the present invention
Such a configuration is not limited to, CPU22d ₁ and memory element 22 d ₂ as a circuit element is constituted by package type IC, when implemented in non-removable state by soldering to a predetermined bus line Can be similarly applied.

[Effects of the Invention] As described above in detail, an integrated circuit having a metal substrate according to the present invention includes a pair of circuits in which a conductive layer having a desired shape is formed on a metal substrate via an insulating layer, and is opposed to each other. In an integrated circuit including a board and a connection cable for electrically connecting these circuit boards to each other, the connection cable is connected to an electronic component that is irremovably mounted on an insulating layer of one of the circuit boards. A first signal line group formed on one circuit board; and a first signal line group formed on the one circuit board so as to be separable from the first signal line group and capable of connecting the electronic component to an external processing unit. And two signal line groups.

In the integrated circuit having a metal substrate according to the present invention, when the first and second signal line groups are connected to each other, the second signal line group is connected to an external processing unit via an external signal cable. And is emulated or tuned by this external processing unit.

Further, in the integrated circuit having the metal substrate according to the present invention, the first and second signal line groups are separated from each other, and the second signal group is separated from the external processing unit by the one of the one signal line group. The electronic component is mounted on a circuit board.

Further, in the integrated circuit having a metal substrate according to the present invention, a conductive layer having a desired shape is formed on the metal substrate via an insulating layer, and a pair of circuit boards facing each other are electrically connected to each other. An integrated circuit including a connection cable to be connected; a first component formed on the one circuit board so as to connect the electronic component unremovably mounted on an insulating layer of the one circuit board to the connection cable;
And a second signal line group that is branched from the first connection line group while being electrically connected thereto and is capable of connecting the electronic component to an external monitor unit. I have.

Further, in the integrated circuit having the metal substrate according to the present invention, the second connection line group is connected to the external monitor unit via an external signal cable, and the external signal cable is removed after the monitor operation is completed. Is characterized by

Therefore, according to the present invention, at the development stage of an integrated circuit, it is possible to externally rewrite data, change a control program, monitor storage contents, and the like without disassembling the configuration, so that the degree of freedom of development can be improved. Thus, an integrated circuit having a metal substrate capable of increasing the size of the integrated circuit is provided.

[Brief description of the drawings]

FIG. 1 is a perspective view showing an embodiment of an integrated circuit having a metal substrate according to the present invention; FIG. 2 is an exploded perspective view showing a configuration of the integrated circuit shown in FIG. 1; FIG. 3B is a cross-sectional view taken along line AA; FIG. 3B is a cross-sectional view taken along line BB in FIG. 1; FIG. 4A is a plan view showing a configuration of a common substrate; 4B is a cross-sectional view showing the configuration of the common board; FIG. 5 is a cross-sectional view showing the configuration of an integrated circuit to which the male connector is attached; FIG. 6 is an exploded perspective view specifically showing the configuration of the male connector; FIG. 7 is a front view showing the assembled state of the male connector; FIG. 8 is a top view showing both connection pin supports fixed to the circuit board in an opened state; FIG. 10A and FIG. 10B are perspective views schematically showing an arrangement state of circuit elements on a first circuit board; FIGS. The first circuit board,
FIG. 11A and FIG. 11B show the first circuit board shown in FIG.
12A and 12B are plan views showing a first circuit board in another embodiment of the integrated circuit according to the present invention in a connection state in a development stage, respectively. FIGS. 13A and 13B are a plan view and a side view, respectively, showing the first circuit board shown in FIGS. 12A and 12B in a connected state in a product stage. In the figure, 10 ... hybrid integrated circuit, 12 ... male connector, 14 ...
... female connector, 14a; 14b ... connection terminal, 16a ... first circuit board, 16b ... second circuit board, 18 ... side plate, 18a;
8b: Step, 18c: Through hole, 20: Frame, 20a: Body,
20b; 20c ...... flange portion, 20d ...... hole, 22 ...... common substrate, 22a ...... substrate main body, 22b ...... insulating layer, 22c ...... conductive layer, 22c _1, 22c ₂ ...... bus lines, 22 d ... ... circuit elements, 22d
₁ ... CPU, 22d ₂ ... storage element, 22d ₃ ... bonding wire, 22e ... opening, 22f ... flexible board, 22g;
22h; 22i ...... connecting terminals, 24a; 24b ...... connection pins, 24a _1; 24
b ₁ … .horizontal part, 24a ₂ ; 24b ₂ …… vertical part, 24a ₃ ; 24b ₃ ……
Bent part, 26 Seal rubber, 28 Connector housing, 30a Upper connection pin support, 30a ₁ Standing piece, 3
0a ₂ ... projecting piece, 30b ... lower connection pin support, 30b ₁ ...
… Standing piece, 30b ₂ … Projecting piece, 32a; 32b …… Concave, 34 ……
Fitting holes, 36a; 36b: frame member, 38: epoxy resin, 40a; 40b: flange portion, 42: tuning device, 44: external bus cable, 46: bonding wire.

Claims (5)

(57) [Claims] An integrated circuit comprising: a pair of circuit boards in which a conductive layer of a desired shape is formed on a metal substrate via an insulating layer, and opposed to each other; and a connection cable for electrically connecting these circuit boards to each other. A first signal line group formed on one of the circuit boards so as to connect the connection cable to an electronic component which is irremovably mounted on an insulating layer of the one circuit board; A second signal line group formed on said one circuit board so as to be separable from said one signal line group and capable of connecting said electronic component to an external processing unit. . 2. In a state where the first and second signal line groups are connected to each other, the second signal line group is connected to an external processing unit via an external signal cable, and the external processing unit emulates the second signal line group. An integrated circuit having the metal substrate according to claim 1, wherein the integrated circuit is subjected to tuning. 3. The electronic component is mounted on the one circuit board in a state where the first and second signal line groups are separated from each other, and the second signal line group is separated from an external processing unit. An integrated circuit having the metal substrate according to claim 1, wherein the integrated circuit is mounted. 4. An integrated circuit comprising: a pair of circuit boards in which a conductive layer of a desired shape is formed on a metal substrate via an insulating layer, and opposed to each other; and a connection cable for electrically connecting these circuit boards to each other. In the circuit, a first signal line group formed on one circuit board so as to connect the connection cable to an electronic component irremovably mounted on an insulating layer of the one circuit board; A second signal line group that is branched while being electrically connected to the signal line group of (a), and is capable of connecting the electronic component to an external monitor unit. 5. The second signal line group is connected to the external monitor unit via an external signal cable, and the external signal cable is detached after a monitor operation is completed. An integrated circuit having the metal substrate according to claim 4.