JPH02170380A - Connector structure of integrated circuit with metal base board - Google Patents

Abstract

PURPOSE:To make a connector for integrated circuit in small size and at low cost and enhance the easiness in assembly by overlapping a pair of connector housing halves one over another, where a plurality of connecting pins are installed which are fixed to metal base boards and connected to appropriate conductive layers, so as to constitute one connector housing. CONSTITUTION:A connector housing 28 of a male connector 12 is composed of connector housing halves 28a, 28b previously divided into two up and down so as to constitute an integrated circuit 10, wherein the connector housing halves 28a, 28b are fixed to the corresponding circuit boards 16a, 16b while connecting pins 24a, 24b with appropriate connection terminals 22g, 22h. The lower connector housing half 28b is fitted in a recess 30 in the upper connector housing half 28a, and the two are consolidated through fitting of a boss 32 with a recess 34. This allows making the connector in small size and at low cost and enhances the easiness in assembly.

Description

[Detailed Description of the Invention] [Industrial Application Field] This invention provides a circuit board in which a conductive layer is adhered to a metal substrate via an insulating layer, and circuit elements are fixed to each conductive layer. The present invention relates to a connector structure for an integrated circuit having a pair of metal substrates in which layers are connected to each other via a connection substrate and both conductive layers are opposed to each other.

[Prior Art] Conventionally, conductive layers are pasted to each other through an insulating layer, a circuit element is fixed to each conductive layer, and both conductive layers are connected to each other via a connecting substrate, and then both conductive layers are bonded to each other through an insulating layer. As an integrated circuit having a pair of metal substrates facing each other,
A technique disclosed in Japanese Patent Publication No. 46-13234 is known. The integrated circuit manufacturing method disclosed in this prior art includes the steps of anodizing at least one main surface of an aluminum substrate to form a thin aluminum oxide layer on the substrate surface, and forming a resistor on the aluminum oxide thin layer. a step of forming a plurality of circuit elements by selectively depositing a substance and a good conductor material; a step of fixing a transistor bellet on a lead portion formed by selectively depositing a good conductor; The method is characterized by including a step of sealing at least all of the circuit elements with an insulating resin.

In the integrated circuit formed in this way, heat generated from resistors, transistors, etc. during operation can be dissipated quickly and effectively, making it possible to integrate output circuits, etc. .

[Problems to be Solved by the Invention] The integrated circuit formed as described above may be adopted for use in vehicles from the viewpoint of its small size and low cost. However, when such an integrated circuit is actually used in a vehicle, it is necessary to take advantage of its small size and low cost while also reliably connecting it to other control parts of the vehicle.

Here, if a conventional connecting device is used, this connecting device is relatively large and not cheap, so even if the integrated circuit itself is made smaller and lower in cost, the benefits cannot be fully demonstrated. Problems have been pointed out that make it impossible to do so.

Furthermore, even if the connected devices are made smaller, if the assembly is poor, there may be situations where they cannot actually be assembled.
This assemblability must be fully considered.

This invention was made in view of the above-mentioned problems, and an object of the invention is to have a metal substrate which can be made smaller and lower in cost, and which can exhibit good assemblability. The purpose is to provide a connector structure for integrated circuits.

[Means for Solving the Problems] In order to solve the above-mentioned problems and achieve the objects, a connector structure for an integrated circuit having a metal substrate according to the first aspect of the present invention includes a conductive layer formed on the metal substrate via an insulating layer. the layers are pasted,
An integrated circuit board having a circuit board having a circuit element fixed to each conductive layer, both conductive layers connected to each other via a connecting substrate, and a pair of metal substrates having both conductive layers facing each other. In the circuit connector structure, a pair of connector housing halves are fixed to both metal substrates in correspondence with each other, and a plurality of connection pins connected to the corresponding conductive layers are attached, and both connector housing halves are respectively formed, The connector housing is characterized by having an overlapping portion that overlaps with each other to form one connector housing when the two metal substrates are assembled facing each other.

Further, in the connector structure for an integrated circuit having a metal substrate according to the second aspect of the present invention, a conductive layer is adhered to the metal substrate via an insulating layer, and a circuit board in which circuit elements are fixed to each conductive layer is provided. In an integrated circuit connector structure having a pair of metal substrates in which both conductive layers are connected to each other via a connecting substrate and both conductive layers are opposed to each other, the integrated circuit is fixed to one of the metal substrates in advance. , a connector housing to which a plurality of first connection pins connected to the conductive layer of one metal substrate are attached, a plurality of second connection pins connected in advance to the conductive layer of the other metal substrate, and the connector The housing is characterized by comprising a mounting portion formed on the housing to which the second connection pin is mounted when the two metal substrates are assembled facing each other.

[Function] In the integrated circuit connector structure having the metal substrate configured as described above, it is possible to connect a plurality of connection pins corresponding to each conductive layer with both metal substrates open. Become. In this way, this connection behavior is
Since both metal substrates are open, assembly can be easily and reliably performed, and assembly efficiency is improved.

In the first invention, when assembling the two metal substrates facing each other, the two halves are overlapped with each other through the overlapping portion, thereby forming one connector housing and forming one connector structure. is composed, while
In the second invention, when assembling both metal substrates facing each other, the second connection pin connected to the conductive layer of the other metal substrate is attached to the connector housing via the attachment portion thereof. , one connector structure is constructed.

[Embodiment] Hereinafter, the configuration of an embodiment of a connector structure for an integrated circuit having a metal substrate according to the present invention will be described in detail with reference to FIGS. 1 to 8 of the accompanying drawings.

FIG. 1 shows an integrated circuit 10 to which a connecting device having the connector structure of this embodiment is connected. The integrated circuit 10 is configured as an independent functional component for a vehicle, and specifically, is configured as an integrated circuit that independently functions as, for example, an engine control unit.

As shown in the figure, this integrated circuit 10 is formed as a box-shaped case with a closed interior, and a male connector 12 as a connecting device is integrally attached to one end. The male connector 12 will be described in detail later, but is configured to be connected to a commonly used female connector 14.

Here, as shown in FIGS. 2 to 3B, this integrated circuit 10 consists of a pair of circuit boards 16a and 1 that are vertically spaced apart.
6b, and both circuit boards 16a.

18b are spaced apart by a predetermined distance and are comprised of a side plate 18 for closing the side surface, and a frame body 20 that integrally fixes both the circuit boards lea, 16b and the side plate 18.

Specifically, both circuit boards 16a and 16b are equipped with circuit elements such as an IC chip, a resistor, and a capacitor necessary for functioning as an engine control unit. Here, both circuit boards 16a and 16b are set to be formed by dividing one common board 22 into two, as shown in FIG. 4A. That is, as shown in FIG. 4B, the common substrate 22 includes a substrate body 22a made of a conductive material, for example, aluminum, and an insulating layer 2 adhered to the front surface of the substrate body 22a.
2b, a conductive layer 22c formed in a predetermined circuit pattern on this insulating layer 22b and defining a circuit network, and a circuit element 2 fixed and electrically connected on this conductive layer 22c.
2d is formed.

As shown in FIG. 4A, the common substrate 22 has an opening 22e formed in advance in the central portion thereof, which extends in the vertical direction. Here, the circuit networks in the left and right portions are connected to each other via a flexible substrate 22f provided across the opening 22e.

Then, the pair of circuit boards 16a described above are formed by cutting out both upper and lower edges (areas indicated by symbols X and Y) including the upper and lower ends of this opening 22e.

16b is set to be formed.

Note that both circuit boards 16a and 16 on the common board 22
A plurality of connection terminals 22g, 22g, and
22h are formed in a horizontal line along the edge. Furthermore, connection pins 24a and 24b of the male connector 12, which will be described later, are fixed to these connection terminals 22g and 22h, respectively, so as to protrude outward, and are electrically connected.

Further, the above-mentioned side plate 18 is formed in a U-shape on the upper surface with the minus side open, and the open side is set to become one end of the case.

Step portions 18a and 18b are formed at the inner edges of both upper and lower end surfaces of the side plate 18 to receive the three edges of the corresponding circuit boards 16a and 16b, respectively.

Here, each circuit board 16a, 16b is fitted into a corresponding step portion 18a, 18b via a seal rubber 26, as shown in FIG. 3A.

By interposing this seal rubber 26, dust is prevented from entering the case from between these rubbers.

On the other hand, as shown in FIG. 2, the frame body 20 described above is formed so as to sandwich and surround the side surface closed by the side plate 18 from above and below. That is, this frame 20
is a main body 20a facing the side plate 18, and this main body 20a.
A predetermined distance from both the upper and lower ends of (specifically, the upper and lower circuit boards 16a).

The flange portions 20b, 2 extend inward by a distance sufficient to hold the three unopened edges of the flange portion 16b, respectively.
It is integrally formed with 0c.

As shown in FIG. 3B, this frame body 20 is constructed by sandwiching the upper and lower circuit boards 16a and 16b, which are fitted into the upper and lower step portions 18a and 18b of the side plate 18, from above and below, so that the case is integrated. It is formed to be configured. As shown in the figure, the flexible board 22f that connects the circuit elements 22d of the upper and lower circuit boards 16a and 16b to each other is
It is set to be located more inward than the other end portion of the side plate 18.

Since the frame body 20 is formed in this way, the side plate 1
8, the side board circuits 16a and 16b are maintained in an assembled state while being separated vertically by a predetermined distance.

That is, in this embodiment, the integrated circuit 10 is formed in a case shape, and both upper and lower surfaces of the case are directly defined by the circuit boards 16a and 16b. As a result, the size and weight of the circuit boards 16a and 16b can be reduced compared to the case where the circuit boards 16a and 16b are housed in a separately prepared case.

Next, the configuration of a connecting device having a connector structure, which is a feature of the present invention, for connecting the case-shaped integrated circuit 1o configured as described above to a controlled part of a vehicle is shown in FIGS. 5 and 6. This will be explained with reference to the figures.

This connection device includes a male connector 12 attached to an opening at one end of a case-shaped integrated circuit 10 with the so-called internal phase connected.
and a female connector 14 which is detachably connected to the male connector 12. The male connector 12 includes a connector housing 28 formed from a box-shaped housing with open sides, and the connector housing 28 is fitted into an opening at one end of the case-like integrated circuit 10. It is set like this.

The connector housing 28 is constructed by vertically connecting an upper connector housing half 28a and a lower connector housing half 28b, which are divided into two parts. That is, the upper connector housing half 28a is fixed to the lower surface of one end of the other circuit board 16b located on the upper side via screws (not shown), and the lower connector housing half 28b is fixed to the lower surface of one end of the other circuit board 16b located on the lower side. The circuit board 16a is fixed to the top surface of one end of the circuit board 16a via screws or the like (not shown).

Here, the upper connector housing half 28a has the sixth
As shown, lower connector housing half 28b
A recess 30 is formed on the lower surface of the recess 30 into which the lower connector housing half 28b is inserted from below.

A plurality of boss portions 32 projecting downward are formed on the surface defining the upper bottom of the recess 3o, while a plurality of boss portions 32 protruding downward are formed on the upper surface of the lower connector housing half 28b, complementary to these boss portions 32. A plurality of recesses 34 are formed into which each recess is fitted. By fitting these boss portions 32 and recesses 34,
The state in which the upper and lower connector housing halves 28a and 28b are fitted together, that is, one connector housing 2
The state in which 8 is formed will be accurately defined.

Furthermore, guide grooves 36 are formed on both side surfaces of the recess 30 and extend in the vertical direction, while guide grooves 36 are formed on both side surfaces of the lower connector housing half 28b. A protrusion 38 is formed that fits in a complementary manner. By fitting these guide grooves 36 and protrusions 38,
The relative positions of the two connector housing halves 28a and 28b when they are assembled together are reliably defined, and both are accurately guided to the mating position defined by the boss portion 32 and the recess 34. At the same time, the parallelism of both circuit boards 16a and 16b is accurately defined after assembly.

Here, the upper and lower connector housing halves 28a, 28b
The above-mentioned connecting pin 24a is provided.

Holes 40a and 40b are formed, respectively, for attachment with the holes 24b penetrating therethrough. In this embodiment, both connector housing halves 28a
, 28b are assembled.
a and 24b are the upper and lower connector housing halves 2, respectively;
Corresponding attachments 8a and 28b are attached and fixed in a state that they penetrate through holes 40a and 40b.

In this embodiment, these connection pins 24a,
The vertical separation distance 4 and the horizontal arrangement pitch p of the pins 24b are defined based on the specifications of the conventionally used pin arrangement. As a result, the female connector 14 connected to the male connector 12 can be of a conventionally used type, improving economical efficiency.

In addition, since conventionally used male connectors are heavy and large, we have developed a dedicated male connector to accommodate this compact and lightweight case-shaped integrated circuit 10. A type connector 12 is formed. Therefore, according to this embodiment, it is possible to reliably prevent the reduction in size and weight of the integrated circuit 10 described above from being impaired.

Next, referring to FIGS. 7 and 8, FIG. 5 shows the state after assembly of both connector housing halves 28a.
, 28b will explain the operation.

First, as described above with reference to FIGS. 4A and 4B, both upper and lower edges X and Y are cut from the common board 22 to which a predetermined circuit element 22d is attached, thereby forming both circuit boards 16a and 16b. are formed in an open state on the same plane. As shown in FIG. 7, corresponding connector housing halves 28a and 28b are fixed to both circuit boards 16a and 16b in such an open state with screws or the like.

Here, as described above, these connector housing halves 28a, 28b have corresponding connection pins 24a, 2.
4b is already installed.

In this way, these connection pins 24a, 24b are soldered to the corresponding connection terminals 22g, 22h, respectively, with both circuit boards 16a, 16b open. In particular, this soldering work should be done on the connection terminal 22.
Since there are a large number of circuit boards 16a and 22h, detailed work is required, but in this embodiment, since both circuit boards 16a and 16b are opened on the same plane, Work can be carried out reliably, work efficiency is improved, and the ease of assembly is maintained well.

After this, as shown in FIG. 8, while one circuit board 16a is held in the same position, the other circuit board 16a is
one circuit board 16a located below.
Move above and parallel to this. and,
As shown in FIG. 6, with the protrusion 38 fitted into the guide groove 36 and guided, the upper circuit board 16b is pushed down and inserted into the recess 30 of the upper connector housing half 28a fixed thereto. , insert the lower connector housing half 28b, and when this insertion operation is completed,
By fitting the boss portion 32 and the recess 34, the two are accurately positioned and integrated.

In this way, both connector housing halves 28a
, 28b are integrated into one connector housing 28.
When the circuit boards 16a and 16b are formed, both circuit boards 16a and 16b are set parallel to each other. Then, as described above, by attaching the side plate 18 and fitting the frame 20, the integrated circuit 10 as shown in FIG. 1 is formed with the male connector 12 integrated therein. .

As detailed above, in the connector structure of this embodiment, the connector housing 28 of the male connector 12 is formed in advance to be composed of the upper and lower halves of the connector housing halves 28a and 28b. Prior to constructing the integrated circuit IO, each connector housing half 28a, 28b is connected to a corresponding circuit board 16a.

16b, and the connecting pins 24a.

24b to the corresponding connection terminals 22g and 22h, respectively. In this way, the assemblability of integrated circuit 10 is maintained well.

Further, in the above-described embodiment, the integrated circuit 10 to which the male connector 12 is fixed is configured such that its upper and lower surfaces are defined by a pair of circuit boards 16a and 16b. As a result, according to this embodiment, the number of parts of the integrated circuit 1o is reduced, and the integrated circuit 1o is made smaller and less expensive.

Further, in this embodiment, the circuit board 16a,
16b is a conductive aluminum substrate body 22a, an insulating layer 22b stuck on this substrate body 22a,
A conductive layer 22c is formed on the insulating layer 22b with a predetermined circuit pattern. As a result, the heat generated from the various circuit elements 22d is absorbed by using the aluminum substrate main body 22a as a heat sink.
Since heat can be radiated, there is no need to provide a separate heat radiating member, resulting in significant downsizing.

Furthermore, in this embodiment, as described above, since the upper and lower surfaces of the case are respectively constituted by a pair of circuit boards 16a and 16b having a board body 22a made of aluminum, these circuit boards 16a and 16b are It can be used as an electromagnetic shielding member. As a result, the internal space of the integrated circuit 10 on this case is substantially electromagnetically shielded, and the circuit element 22d is less susceptible to electromagnetic interference.

It goes without saying that this invention is not limited to the configuration of the one embodiment described above, and can be modified in various ways without departing from the gist of the invention.

For example, in the embodiment described above, the integrated circuit 10 was explained to function as an engine control unit, but the integrated circuit 10 is not limited to this, and may be used, for example, as an automobile speed control device, a control device for four-wheel steering, or an automatic transmission control device. It can be configured to operate as a functional component of a control device or the like.

Furthermore, in the embodiment described above, the male connector 12
Although it has been described that the male connector 12 is fixed to the integrated circuit 10 using a so-called internal method, the present invention is not limited to this configuration, and the male connector 12 is fixed to the integrated circuit 10 using a so-called external method. It may be configured to be fixed to.

In addition, in the embodiment described above, each circuit board 16a, 16 corresponds to the upper and lower rows of connection pins 24a, 24b.
Although it has been described that the connection terminals 22g and 22h are formed in a row in FIG. , the connection terminals 22g and 22h may be arranged in two rows.

Further, in the above-mentioned embodiment, the connector housing 28 is divided into two parts in order to maintain good assembly performance, but the present invention is not limited to such a configuration. As shown in the figure as another example,
The male connector 12 may be divided into two parts, one connecting pin 24a and the other connecting pin 24b attached to the connector housing 28 in advance.

Another embodiment of the invention will be described below with reference to FIG.

In other embodiments described below, parts that are the same as the configuration of the above-mentioned embodiment are given the same reference numerals, and the explanation thereof will be omitted.

As shown in FIG. 9, in the connector structure of another embodiment, the male connector 12 is divided into two connector housing halves 28a and 28b in the above-described embodiment.
Unlike the conventional connector housing 28, the connector housing 28 is integrally formed in advance. This connector housing 28 is formed in the same shape as the shape in which both connector housing halves 28a and 28b are joined together and integrated in one embodiment, and the connecting pins 24a and 24b are attached in two rows, upper and lower. The mounting hole is 40a.
, 40b are formed in advance.

In the connector housing 28, connection pins 24b are pre-installed in holes 40b for attachment of the lower row.

That is, in the other embodiment shown in FIG. 9, the male connector 12 has one connecting pin 24a and the other connecting pin 24a.
4b is preliminarily attached to the connector housing 28, and is preconfigured in a two-part state.

Then, when assembling this integrated circuit 10 while assembling such a male connector 12 to the integrated circuit 10, first, both circuit boards 16a are assembled, as in the above-mentioned embodiment.
, 16b are formed in an open state on the same plane, and first, one connection pin 24a is connected to the connection terminal 22h of the other circuit board 16b located above. Further, the connector housing 28 to which the other connecting pin 24b is attached in advance is fixed to one circuit board 16a located below, and the other connecting pin 24b is connected to the connecting terminal 22g of the one circuit board 16a.
Connect to.

After that, similarly to the above-mentioned embodiment, one circuit board 1 is
While holding the circuit board 6a in the same position, the other circuit board 16b is lifted and moved above and parallel to the one circuit board lea located below. One of the connecting pins 24a connected to the other circuit board 16b is inserted into the hole 40a of the upper row formed in advance on the connector housing 28 fixed to the one circuit board 16a. Attach.

In this manner, with both the upper and lower rows of connection pins 24a and 24b attached to the connector housing 28,
This connector housing 28 and the upper circuit board 16b are fixed to each other.

In this way, the connector housing 28 connects both circuit boards 16a
, 16b, both circuit boards 16a, 16b
b will be set parallel to each other. Then, similarly to the embodiment described above, the side plate 18 is attached and the frame body 20 is
By fitting them together, an integrated circuit 10 as shown in FIG. 1 is formed including the male connector 12 integrally.

As detailed above, in the connector structure of this other embodiment, the connector housing 28 of the male connector 12 is formed with the other connecting pin 24b attached in advance, and one of the connecting pins 24b is attached in advance. The pin 24a is attached in advance so as to be connected to the connection terminal 22h of the other circuit board 16b. Then, in a stage before configuring the integrated circuit 10, after one connecting pin 24a is attached to the connector housing half 28, the other circuit board 16 is attached.
b to be fixed to the connector housing.

In this way, in other embodiments, the integrated circuit 10
The ease of assembly will be maintained well.

[Effects of the Invention] As detailed above, in the connector structure for an integrated circuit having a metal substrate according to the first aspect of the present invention, a conductive layer is adhered to the metal substrate via an insulating layer, and each conductive layer is An integrated circuit connector structure in which a circuit board to which a circuit element is fixed has a pair of metal substrates, in which both conductive layers are connected to each other via a connecting board, and both conductive layers are opposed to each other. a pair of connector housing halves each having a plurality of connecting pins fixed to both metal substrates and connected to the corresponding conductive layers; It is characterized by comprising an overlapping portion that overlaps with each other to form one connector housing when assembled facing each other.

Further, in the connector structure for an integrated circuit having a metal substrate according to the second aspect of the present invention, a conductive layer is adhered to the metal substrate via an insulating layer, and a circuit board in which circuit elements are fixed to each conductive layer is provided. In an integrated circuit connector structure having a pair of metal substrates in which both conductive layers are connected to each other via a connecting substrate and both conductive layers are opposed to each other, the integrated circuit is fixed to one of the metal substrates in advance. , a connector housing to which a plurality of first connection pins connected to the conductive layer of one metal substrate are attached, a plurality of second connection pins connected in advance to the conductive layer of the other metal substrate, and the connector The housing is characterized by comprising an attachment part formed on the housing, to which the second connection pin is attached when the two metal-flexion boards are assembled to face each other.

Therefore, according to the present invention, there is provided a connector structure for an integrated circuit having a metal substrate, which can be made smaller and lower in cost, and can exhibit good assembly performance.

[Brief explanation of the drawing]

FIG. 1 is a perspective view showing an embodiment of a connector structure for an integrated circuit having a metal substrate according to the present invention, together with an integrated circuit to which this is applied; FIG. 2 is an exploded view showing the structure of the integrated circuit shown in FIG. 1. A perspective view; Fig. 3A is a cross-sectional view taken along the line A-A in Fig. 1; Fig. 3B is a cross-sectional view taken along the line B-B in Fig. 1; Fig. 4A is a plan view showing the configuration of the common board; FIG. 4B is a sectional view showing the configuration of the common board; FIG. 5 is a sectional view showing the configuration of the male connector attached to the integrated circuit; FIG. 6 is the configuration of the connector housing. FIG. 7 is a front view showing the state where the upper and lower connector housing halves are just before being fitted together; FIG. 7 is a top view showing the state where both connector housing halves are respectively fixed to the open circuit board; FIG. 8 The figure is a side view showing a state in which the circuit boards to which the connector housing halves are respectively fixed are being assembled to each other; and FIG. 9 is a side view showing the configuration of another embodiment of the connector structure according to the present invention. ... Seal rubber 28 ... Connector housing (
Other Examples) 28a... Upper connector housing half (one embodiment), 28b... Lower connector housing half (one embodiment), 30... Recess, 32... Boss portion, 34... ... recess, 36... guide groove, 38...
- Projection, 40a; 40b... Mounting is through a hole.

Claims (2)

[Claims] (1) A conductive layer is pasted on a metal substrate via an insulating layer,
An integrated circuit board having a circuit board having a circuit element fixed to each conductive layer, both conductive layers connected to each other via a connecting substrate, and a pair of metal substrates having both conductive layers facing each other. In the horizontal connector construction of a circuit, a pair of connector housing halves are fixed to both metal substrates in correspondence with each other, and a plurality of connection pins connected to the corresponding conductive layers are attached, and a pair of connector housing halves are formed on both connector housing halves, respectively. 1. A connector structure for an integrated circuit having a metal substrate, comprising: an overlapping portion that overlaps each other to form one connector housing when the two metal substrates are assembled facing each other. (2) A conductive layer is pasted on a metal substrate via an insulating layer,
An integrated circuit board having a circuit board having a circuit element fixed to each conductive layer, both conductive layers connected to each other via a connecting substrate, and a pair of metal substrates having both conductive layers facing each other. In a circuit connector structure, a connector housing is provided with a plurality of first connection pins connected to a conductive layer of a plate, and a plurality of second connection pins are connected in advance to a conductive layer of another metal substrate.
and a mounting portion formed on the connector housing to which the second connection pin is attached when the two metal substrates are assembled facing each other. Integrated circuit connector structure.