KR930011604B1 - Integrated circuit for vehicle - Google Patents

Abstract

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Description

Vehicle-mounted integrated circuit

1 is a perspective view showing a configuration of a first embodiment of a vehicle integrated circuit according to the present invention.

FIG. 2 is an exploded perspective view showing the configuration of the integrated circuit shown in FIG. 1. FIG.

3A is a cross-sectional view taken along a line A-A in FIG.

3B is a cross-sectional view taken along a line B-B in FIG.

4A is a plan view showing the structure of a common substrate.

4B is a cross-sectional view showing the structure of a common substrate.

5 is a cross-sectional view showing a configuration of an integrated circuit of a second embodiment of the present invention.

6 is a sectional view showing a configuration of a modification of the integrated circuit of the second embodiment.

7 is a circuit diagram showing the configuration of the third embodiment when the integrated circuit according to the present invention is applied to a TWS.

FIG. 8 is a perspective view specifically showing a state in which two types of integrated circuits in the TWS shown in FIG. 7 are connected to a joint box. FIG.

* Explanation of symbols for main parts of the drawings

10,44,46: integrated circuit

12, 48a, 50a, 52a, 58a, 60a, 62a: male connector

14, 48b, 50b, 52b, 58b, 60b, 62b: female connector

16a, 16b: circuit board 18: side plate

20: frame 22: common substrate

22a: substrate body 22b: insulating layer

22c: conductive foil 22d: circuit element

22e: opening 22f: flexible substrate

22g, 22h: Connection terminal 22i, 22j: Outward flange part (bending part)

24: connection pin 26: seal rubber

28: Connector body 28a: Standing piece

28b, 28c: Connection piece 28d, 28e: Mounting piece

28f, 28g: Through Hole 40: Joint Box

44a, 46a: control circuit 44b, 46b: multiple communication interface circuit

48, 50, 52, 58, 60, 62: splice mechanism

54, 64, 66, 68: multiplexing harness 56: multiplexing unit

70: multiplexed interface circuit

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an integrated circuit used for vehicle mounting in which a conductive layer is formed on an electrically conductive substrate via an insulating layer, and a circuit element is fixed.

DESCRIPTION OF RELATED ART Conventionally, the technique disclosed by Unexamined-Japanese-Patent No. 46-13234 is known as an integrated circuit which affixed the electrically conductive foil on the electrically conductive substrate through the insulating layer, and fixed the circuit element. In the method of manufacturing an integrated circuit disclosed in the prior art, a step of anodizing at least one main surface of an aluminum substrate to form a thin aluminum oxide layer on the surface of the substrate, and a resistive material and amount on the thin aluminum oxide layer Forming a plurality of circuit elements by selectively attaching (positive) conductive material, fixing the transistor pellets on a lead portion formed by selectively attaching a good conductor, and insulating at least all of the circuit elements It has a process of sealing with resin, It is characterized by the above-mentioned.

In the qualitative circuit thus formed, heat generated from a resistor, a transistor, or the like during operation can be quickly and effectively dissipated to enable integrated circuits of the output circuit and the like.

The integrated circuit formed as described above may be considered to be employed for vehicle mounting in view of its small size and low cost. However, when such an integrated circuit is actually used for vehicle mounting, it is necessary to reliably connect with other control parts of the vehicle while taking advantage of its small size and low cost. Here, when the conventional connection device is used, this connection device is relatively large and inexpensive. Therefore, even if the integrated circuit itself is miniaturized and low cost, there is a problem that the advantages cannot be sufficiently exhibited. It is pointed out.

SUMMARY OF THE INVENTION The present invention has been made in view of the above problems, and an object of the present invention is to provide a compact device in which an electrically conductive foil is pasted on an electrically conductive substrate via an insulating layer to fix a circuit element. To provide a vehicle-mounted integrated circuit that can achieve a low cost.

In order to solve the above problems and achieve the object, the vehicle-mounted integrated circuit according to the present invention includes a metal circuit board body, an insulating layer formed on the entire surface of the circuit board body, and a predetermined circuit pattern on the insulating layer. And a pair of circuit boards each having a conductive layer formed of a conductive layer and a plurality of circuit elements electrically connected to predetermined portions of the conductive layer, and an external connection connector means electrically connected to another connector. The connector housing according to claim 1, wherein the connector for external connection has an recess for accommodating the other connector and a plurality of through holes formed therein, the connector housing being an externally mounted housing fixed to an outer surface of the pair of circuit boards. And an end portion of which is connected to a connecting terminal formed at an edge of the conductive layer, and an intermediate portion of which is formed in the connector housing. It has a plurality of connector pins extending through the hole, the other end protruding into the concave portion to be connected to the other connector, wherein each circuit board is bent outward and fixed to the connector housing And a bent portion integrally formed, wherein the connector housing extends from the main body portion to the corresponding recessed portion and is attached to the end surface of the corresponding circuit board. And a pair of mounting portions and a pair of connecting portions extending from the main body portion in a direction opposite to the extending direction of the mounting portion and defining the recesses therebetween.

In the vehicle-mounted integrated circuit configured as described above, the connector (connector) structure for connecting the integrated circuit to the outside can be integrally attached thereto, whereby compactness and low cost can be achieved.

EMBODIMENT OF THE INVENTION Below, the structure of 1st Example of the vehicle mounting integrated circuit which concerns on this invention is demonstrated in detail with reference to an accompanying drawing.

In FIG. 1, the integrated circuit 10 of this first embodiment is shown. This integrated circuit 10 is configured as an independent vehicle mounting functional part, and specifically, is configured as an integrated circuit having, for example, an independent function as an engine control unit.

As shown in the drawing, the integrated circuit 10 is formed of a box-shaped case in which the inside is closed, and at one end, a male connector 12 as a connecting device is integrally mounted. Although this male connector 12 is demonstrated in detail later, the female connector 14 of the type currently used is comprised so that it may be connected.

Here, the integrated circuit 10 includes a pair of circuit boards 16a, 16b and both substrates 16a, 16b spaced up and down as shown in FIGS. A side plate 18 for closing the side surface and being separated by a predetermined interval, and a frame body 20 for fixing both of the substrates 16a, 16b and the side plate 18 integrally.

Specifically, circuit boards such as IC chips, resistors, and capacitors necessary for exerting a function as an engine control unit constituted as independent vehicle-mounted functional parts are mounted on both substrates 16a and 16b. Here, both substrates 16a and 16b are set to be formed by dividing one common substrate 22 into two, as shown in FIG. 4A. That is, as shown in FIG. 4B, the common substrate 22 includes a substrate body 22a formed of a conductive material, for example, aluminum, and an insulating layer formed on the substrate body 22a over the entire surface. A circuit element formed on the insulating layer 22b in a predetermined circuit pattern and fixed to the electrically conductive foil 22c defining the network, and electrically connected to the electrically conductive foil 22c. It is formed of 22d.

In the common substrate 22, as shown in FIG. 4A, an opening portion 22e extending along the vertical direction is formed in advance in the center of the figure. Here, the left and right portions of the network are connected to each other via the flexible substrate 22f disposed across the opening 22e with the opening 22e as a boundary. And the above-mentioned pair of board | substrates 16a and 16b are cut | disconnected by cutting out the upper and lower edge parts (region shown by the code | symbol X and Y) including the upper and lower ends of this opening part 22e. .

In addition, in the upper surface of the outer edge part of one board | substrate 16a (the left board | substrate in drawing), ie, the inner surface of the edge part which defines one end of a case in the state which spaced apart and faced up and down, a plurality of The connecting terminals 22g are formed in a line shape horizontally along the edges. In addition, the connection pins 24 of the male connector 12 described later are fixed to these connection terminals 22g so as to protrude outward and are electrically connected.

Moreover, the above-mentioned side plate 18 is formed in the upper surface U-shape which opened one side, and is set so that this open side part may become one end of a case. At the inner edges of the upper and lower end faces of the side plate 18, stepped portions 18a and 18b are formed, respectively, for supporting the edge portions in the three directions of the corresponding substrates 16a and 16b.

Here, each of the substrates 16a and 16b is sandwiched between the corresponding step portions 18a and 18b via the seal rubber 126 as shown in FIG. 3A. By providing this seal rubber 26 via, the invasion of dust in the case is prevented from among them.

On the other hand, as shown in FIG. 2, the said frame 20 is enclosed so that the side surface closed by the side plate 18 may be fitted so that it may be fitted from upper and lower sides. That is, the frame body 20 has a main body 20a facing the side plate 18 and a predetermined distance (specifically, the upper and lower substrates 16a, 16b) from both upper and lower ends of the main body 20a. It is formed integrally with the flanges 20b and 20c extending inwardly by a distance sufficient to fit the edge portions in three directions that are not open.

As shown in FIG. 3B, the frame 20 is provided with the upper and lower substrates 16a and 16b respectively fitted to the upper and lower stepped portions 18a and 18b of the side plate 18 from above and below. By being clamped, it is formed so that a case may be comprised integrally. As shown in the figure, the flexible substrate 22f for connecting the circuit elements 22d of the upper and lower substrates 16a and 16b to each other is set to be positioned inward from the other end of the side plate 18. .

Since the frame body 20 is formed in this way, in the state which interposed the side plate 18 between, both board | substrates 16a and 16b will maintain the assembled state, spaced apart a predetermined distance up and down.

That is, in this first embodiment, the integrated circuit 10 is formed in a case shape, and both upper and lower sides of the case are defined directly from the substrates 16a and 16b. As a result, compared with the case where both the board | substrates 16a and 16b are accommodated in the case prepared separately, compactness and weight reduction are achieved.

As described in detail above, the integrated circuit 10 of this first embodiment is configured to define both upper and lower surfaces from a pair of substrates 16a and 16b. As a result, according to this first embodiment, the number of parts of the integrated circuit 10 is reduced, and compactness and low cost are achieved.

In the first embodiment, the substrates 16a and 16b each include a conductive aluminum substrate body 22a, an insulating layer 22b formed on the substrate body 22a, and The conductive foil 22c is formed on the insulating worm 22b with a predetermined circuit pattern. As a result, heat generated from various circuit elements 22d can be dissipated using the aluminum substrate body 22a as a heat dissipation plate. Therefore, it is not necessary to provide a heat dissipation member separately. Will be achieved.

In the first embodiment, as described above, the upper and lower surfaces of the case are each composed of a pair of substrates 16a and 16b each having an aluminum substrate body 22a. ) And (16b) can be used as the electromagnetic shielding member. As a result, the internal space of the integrated circuit 10 on this case is substantially shielded electronically, and the circuit element 22d is less likely to be subjected to electromagnetic interference.

The present invention is not limited to the configuration of the above-described first embodiment and goes without saying that various modifications can be made without departing from the gist of the present invention. Hereinafter, various embodiments and various modifications of the present invention will be described. In addition, in the various modified examples and other actual examples which are demonstrated below, the same code | symbol is attached | subjected to the part same as the structure of the said 1st Example, and the description is abbreviate | omitted. For example, in the above first embodiment, the integrated circuit 10 has been described to function as an engine control unit, but the present invention is not limited thereto. For example, in the vehicle speed control device and the four-wheel steering, It can be configured to operate as a functional part constituted as each of the independent vehicle functional parts such as the control device and the automatic transmission control device.

In the first embodiment, the male connector 12 is illustrated to be configured as a so-called internal mounting type with respect to the case-shaped integrated circuit 10, but the present invention is not limited to such a configuration. It may be configured as an external mounting type as in the second embodiment of FIG.

That is, as shown in FIG. 5, the male connector 12 of this second embodiment is configured as a so-called external mounting type and extends to the bent portion of the corresponding end of the integrated circuit 10 as shown. And a connecting capital body 28 formed so as to close the opening end, and a plurality of connecting pins 24 attached to the connecting capital body 28.

That is, the connecting body 28 is positioned so as to close the open end of the case-shaped integrated circuit 10, and the standing piece 28a through which the connecting pin 24 passes, and the standing piece 28a. From each of the upper and lower ends of the integrated circuit 10 extends in the opposite direction to the disposed side of the integrated circuit 10, and protects the connecting pins 24 passing through the standing piece 28a, while being coupled with the female connector 14 A pair of upper and lower pairs of mounting pieces 28d, described later, which extends toward the integrated circuit 10 from the upper and lower pairs of connecting pieces 28b and 28c and the upper and lower ends of the standing pieces 28a. 28e) is integrally formed and formed of an insulating material, for example, plastic.

Here, in this connecting body 28, a plurality of through holes 28f and 28g through which a plurality of linear connecting pins 24 respectively penetrate the standing piece 28a are formed in advance. And these connection pins 24 are fixed and connected to each connection terminal 22g and 22h provided in the corresponding position of the upper and lower board | substrates 16a and 16b.

In this second embodiment, one edge of each of the upper and lower substrates 16a and 16b is bent upwards and downwards to integrate the outer flange portions 22i and 22j, respectively. It is formed to have as enemy. Then, the pair of mounting pieces 28d and 28e of the male connector 12 are fixed to each other by fixing the opposing surfaces with the outer flange portions 22i and 22j facing them. The connector 12 is integrally mounted to the case-shaped integrated circuit 10.

In this way, even if the male connector 12 is mounted on the integrated circuit 10, the size and cost reduction of the case-shaped integrated circuit 10 can be achieved similarly to the first embodiment.

That is, in this embodiment, as the male connector, a male connector 12 exclusively corresponding to the small-sized, lightweight case-shaped integrated circuit 10 is employed without employing a heavy and large one conventionally used. ). Therefore, according to the second embodiment, it is possible to reliably prevent damage to the compactness and weight reduction of the integrated circuit 10.

In the second embodiment, the connecting pins 24 used for the male connector 12 are shown to have a straight shape, but the present invention is not limited thereto. In FIG. 6, as a modification of the second embodiment, FIG. You may comprise as shown.

That is, as shown in FIG. 6, in this modification, each connection pin 24 has a stepped portion formed in the middle portion thereof, and an end portion connected to the corresponding connection terminals 22g and 22h. Silver is formed in a state of being folded back 180 degrees. By constituting such a modification, in addition to the effects of the second embodiment, there will be effects described below.

Specifically, the coupling with the female connector 14 is not performed well, and the connection pin 24 abuts on the end surface of the female connector 14 and may be pressurized inward. When the connecting pin 24 is press-fit inward in this manner, in the straight shape as described above, the connecting pin 24 is pulled out from the corresponding connecting terminals 22g and 22h. However, in this modification, even if such a situation occurs, the connection pin 24 is deformed satisfactorily on the basis of the shape of the connection pin 24, such press-in is absorbed, and the teeth are connected to the connection terminal. The escape from (22g) and (22h) can be reliably prevented.

Here, the vehicle-mounted integrated circuit according to the present invention, if changed in view, is an integrated circuit that is used as an integrated circuit used for vehicle-mounted circuits in which a conductive foil is adhered to an electrically conductive substrate via an insulating layer and a circuit element is fixed. It can also be expressed as an invention characterized by forming one vehicle mounting functional part and forming the conductive substrate as a functional part case. In other words, by grasping the present invention in this way, since an independent integrated circuit constitutes one vehicle-mounted functional part and the conductive substrate is formed as a functional part case, the overall weight can be reduced, It is not necessary to use the same expensive connecting equipment, and the cost can be reduced.

7 and 8, signal systems used for the anti-theft system, lamp flash system, wiper operation system, etc. are collectively connected in the joint box (connection box). Next, the third embodiment to be applied to a system (hereinafter referred to as TOEFL WIRING SYSTEM and abbreviated as TWS) for connecting and controlling a control system to this joint box will be described in detail.

As shown in FIG. 7, the joint box 40 used in this third embodiment is shown. The joint box 40 is a state in which a control unit of a conventional TWS is divided into units of a single module, and a plurality of logic circuit modules in the third embodiment include two first and second integrated circuits ( 44 and 46 are detachably connected via the 1st and 2nd connector mechanisms 48 and 50, respectively.

Here, the configuration of each of the integrated circuits 44 and 46 is basically the same as that of the integrated circuit 10 described in the first or second embodiment, and the description thereof is omitted, but each independent vehicle is omitted. The control content in the mounting functional part is set to be different. That is, in detail, the first integrated circuit 44 includes a control circuit 44a for executing a function of an anti-theft system configured as an independent vehicle mounting functional part, the control circuit 44a, and an external blood. A first multiple communication interface circuit (multiple 1 / F) 44b is provided for connecting the control unit and the detection unit by multiplexing. On the other hand, the second integrated circuit 46 includes a control circuit 46a for executing a function of a flash system of a lamp, which is configured as an independent vehicle mounting functional part, and the control circuit 46a and external blood. A second multiple communication interface circuit (multiple 1 / F) 46b is provided for connecting the control unit and the detection unit by multiplexing.

Here, the first connector mechanism 48 includes a first male connector 48a integrally formed in the first integrated circuit 44 and a joint box 40 freely detachable from the first male connector 48a. It consists of the 1st female type connector 48b integrally attached to the top. The second connector mechanism 50 includes a second male connector 50a integrally formed in the second integrated circuit 46 and a joint box 40 freely detachable from the second male connector 50a. It consists of the 2nd female type | mold connector 50b integrally attached to the top.

In addition, the first and second male connectors 48a and 50a are all formed in the same shape as the male connector 12 in the first or second embodiment. As a result, the first and second male connectors 48a and 50a are formed. The second female connector 48b and 57b are also formed in the same shape. As a result, the first male connector 48a integrally mounted to the first integrated circuit 44 can be connected to the second female connector 50b, and the second integrated circuit 46 can be connected. It is also possible to connect the 2nd male type connector 50a integrally attached to the 1st female type connector 48b.

On the other hand, the multiplexing unit 56 is connected to the joint box 40 via the multiplexing harness 54 via the third connector mechanism 52. Here, the third connector mechanism 52 is detachably connected to the third male connector 52a to which one end of the multiplexing harness 54 is connected, and the male connector 52a, and is connected to the joint box ( It consists of the 3rd female type connector 52b integrally mounted on 40).

Here, these first to third connection mechanisms 48, 50, and 52 are configured to be connected in order to major in multiplexed signals as described later, and each connection terminal is for one power supply. It is formed so as to have four poles for the bus line (BUS-A), the other bus line (BUS-B), and the ground (GND).

In addition, the joint box 40 includes a lamp and a horn not shown as a controlled part controlled by the first and second integrated circuits 44 and 46, various sensors as a detection part, a battery as a power supply, and the like. For example, the 4th to 6th connector mechanisms 58, 60, and 62 are connected via each other. These fourth to sixth connector mechanisms 58, 60 and 62 are males mounted at one end of the harnesses 64, 66 and 68 respectively connected to the corresponding connected portions. Female connector (58a), (60a), (62a), and female connector (58a), (60a), (62a) detachable to the male connector (58a, 60a, 62a), integrally formed on the joint box (40) 58b), (60b), and (62b).

Here, the fourth to sixth connector mechanisms 58, 60, and 62 are configured to connect signals which are not multiplexed, and the number of the connection terminals depends on the number of connected devices and the like, respectively. It is decided individually.

In the inside of the joint box 40 to which various connector mechanisms are connected as described above, a multiplexing interface circuit 70 for converting multiplexed information into unmultiplexed information and converting unmultiplexed information into multiplexed information is provided. It is installed. The multiplexing interface circuit 70 includes a multiplex terminal group for inputting / outputting multiplexed information and a nonmultiplexing terminal group for inputting / outputting information not multiplexed.

Here, as described above, the multiplexing terminal group includes four poles for power supply, one bus line, the other bus line, and ground, respectively, the first to third female connector 48b, It is connected to the corresponding terminal of 50b, 52b in independent state. That is, the multiplexing interface circuit 70 and each of the first to third female connector 48b, 50b, and 52b are connected via four connection lines. Further, the non-multiplexed terminal group is connected to a corresponding terminal of the fourth to sixth female connector 58b, 60b, 62b via a plurality of connection lines.

The first and second integrated circuits 44 and 46 are connected to the joint box 40 of the third embodiment, which is configured as described above, as shown in FIG.

Here, in this third embodiment, the male connector is conventionally used, and since the type is heavy and large, it is not employed and corresponds to the compact and lightweight case-shaped integrated arc 44, which is a dedicated agent. The first and second male connector 48a and 50a are formed. Therefore, according to the third embodiment, it is possible to contribute to the miniaturization of the joint box 40 based on the miniaturization and the lightening of the integrated circuits 44 and 46.

As described in detail above, in this third embodiment, the integrated circuits 44 and 46 constituting the logic module are each configured to have a metal substrate body 22a. In this way, the compact and lightweight integrated circuits 44 and 46 can satisfactorily achieve its miniaturization without damaging the miniaturization of the joint box 40 to which it is connected.

As described above, according to the present invention, in an integrated circuit in which an electrically conductive foil is adhered on an electrically conductive substrate via an insulating layer and the circuit element is fixed, it can be miniaturized and used in vehicle mounting. An on-vehicle integrated circuit can be provided.

Claims (1)

A circuit board body made of metal, an insulating layer formed on the entire surface of the circuit board body, a conductive layer formed in a predetermined circuit pattern on the insulating layer, and a plurality of circuit elements electrically connected to predetermined portions of the conductive layer, respectively. In a vehicle-mounted integrated circuit comprising a pair of circuit boards and an external connection connector means electrically connected to another connector, the external connection connector means has a concave portion for accommodating the other connector and a plurality of internally. Two through-holes are formed, the connector housing being an externally mounted housing fixed to an outer surface of the pair of circuit boards, one end of which is connected to a connection terminal formed at an edge of the conductive layer, and an intermediate part of the connector housing. Extends through the formed through hole, and the other end protrudes into the recess to contact the other connector; And a plurality of connector pins configured to be enabled, wherein each circuit board integrally includes a bent portion which is bent outward and fixed to the connector housing, and the connector housing has an open end of the pair of circuit boards. A main body portion for closing the portion, a pair of mounting portions extending from the main body portion to the corresponding concave portion and mounted on the end surface of the corresponding circuit board, and extending from the main body portion in a direction opposite to the extending direction of the mounting portion; And integrally including a pair of connecting portions defining the recesses therebetween.

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