JP7010481B2 - Connection structure between rigid circuit board and flexible circuit board - Google Patents

Connection structure between rigid circuit board and flexible circuit board Download PDF

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JP7010481B2
JP7010481B2 JP2018113959A JP2018113959A JP7010481B2 JP 7010481 B2 JP7010481 B2 JP 7010481B2 JP 2018113959 A JP2018113959 A JP 2018113959A JP 2018113959 A JP2018113959 A JP 2018113959A JP 7010481 B2 JP7010481 B2 JP 7010481B2
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circuit board
flexible circuit
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case
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JP2019216221A (en
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涼 遠藤
真也 齋藤
弘誠 西脇
高司 篠木
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帝国通信工業株式会社
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Description

本発明は、硬質回路基板とフレキシブル回路基板の接続構造に関するものである。 The present invention relates to a connection structure between a rigid circuit board and a flexible circuit board.

従来、回転式電子部品やスライド式電子部品などの各種電子部品を構成する回路基板から出力される電気信号を、コネクタに接続する構造として、例えば特許文献1や特許文献2に記載された技術がある。 Conventionally, as a structure for connecting an electric signal output from a circuit board constituting various electronic components such as a rotary electronic component and a slide electronic component to a connector, for example, the techniques described in Patent Document 1 and Patent Document 2 have been used. be.

特許文献1においては、回転式電子部品を構成する電子部品用ケース(40)内にフレキシブル基板(10)のパターン形成部(13)をインサート成形し、このフレキシブル基板(11)の引出部(17)を電子部品用ケース(40)から引き出し、その先端にコネクタ接続用の端子パターン(25)を形成することが開示されている。 In Patent Document 1, a pattern forming portion (13) of a flexible substrate (10) is insert-molded in a case (40) for an electronic component constituting a rotary electronic component, and a drawer portion (17) of the flexible substrate (11) is formed. ) Is pulled out from the electronic component case (40), and a terminal pattern (25) for connecting a connector is formed at the tip thereof.

また特許文献2においては、操作板(1)を構成するフレキシブル回路基板(60)の一端近傍に設けた接続用回路パターン(69)と、その下側に配置した硬質回路基板(90)に設けた接続用回路パターン(93)とを当接し、さらにフレキシブル回路基板(60)の上面側に設置した弾発部材(120)によって前記当接部分を弾発することで両接続用回路パターン(69)、(93)間を接続し、これによって硬質回路基板(90)の下面側に設置したコネクタ(110)に電気的に接続することが開示されている。 Further, in Patent Document 2, the connection circuit pattern (69) provided near one end of the flexible circuit board (60) constituting the operation plate (1) and the rigid circuit board (90) arranged below the connection circuit pattern (69) are provided. The connection circuit pattern (69) is contacted with the connection circuit pattern (93), and the contact portion is repelled by the elastic member (120) installed on the upper surface side of the flexible circuit board (60). , (93) are connected, thereby electrically connecting to a connector (110) installed on the lower surface side of the rigid circuit board (90).

また従来、フレキシブル回路基板にはんだ耐熱性がある場合は、弾発部材の代わりに、はんだなどを用いて接続する方法もあった。 Further, conventionally, when the flexible circuit board has solder heat resistance, there is also a method of connecting by using solder or the like instead of the elastic member.

特開2003-174266号公報Japanese Patent Application Laid-Open No. 2003-174266 特開2010-118195号公報Japanese Unexamined Patent Publication No. 2010-118195

しかしながら、上記従来例には、以下のような課題があった。
上記引用文献1に示すフレキシブル基板(10)を構成する合成樹脂フィルム(11)として、ポリエチレンテレフタレート(PET)フィルムなどの融点の低い材料を使用する場合は、この合成樹脂フィルム(11)上に形成した抵抗体パターン(21)を高温で焼成することができず、このためこの抵抗体パターン(21)を使用した回転式電子部品を高温環境下に置いた場合に、その抵抗値が変化してしまう虞があった。一方、この課題を解決するために、合成樹脂フィルム(11)として、耐熱性の高いポリイミド(PI)フィルムなどを使用する場合は、材料コストが高くなってしまう。
However, the above-mentioned conventional example has the following problems.
When a material having a low melting point such as a polyethylene terephthalate (PET) film is used as the synthetic resin film (11) constituting the flexible substrate (10) shown in the above cited document 1, it is formed on the synthetic resin film (11). The resulting resistor pattern (21) cannot be fired at a high temperature, and therefore, when a rotary electronic component using this resistor pattern (21) is placed in a high temperature environment, its resistance value changes. There was a risk that it would end up. On the other hand, when a polyimide (PI) film having high heat resistance is used as the synthetic resin film (11) in order to solve this problem, the material cost becomes high.

上記引用文献2に示すように、弾発部材(120)を用いて、フレキシブル回路基板(60)と、コネクタ(110)を設置した硬質回路基板(90)とを接続すると、弾発部材(120)を用いることで部品点数が増加してコストも増大してしまう。また組立作業も煩雑になってしまう。 As shown in the above cited document 2, when the flexible circuit board (60) and the rigid circuit board (90) in which the connector (110) is installed are connected by using the elastic member (120), the elastic member (120) is connected. ) Will increase the number of parts and increase the cost. In addition, the assembly work becomes complicated.

また弾発部材の代わりにはんだなどを用いて接続する場合は、はんだ工程などが必要になって手間がかかってしまうばかりか、耐熱性の高いPIフィルムなどを使用しなければならないので、材料コストが高くなってしまう。 In addition, when connecting using solder instead of the elastic member, not only the soldering process is required and it takes time, but also a PI film with high heat resistance must be used, so the material cost. Will be high.

本発明は上述の点に鑑みてなされたものでありその目的は、高温環境下においても安定した電気的出力が得られ、また部品点数が少なくて製造も容易であり、コストの増加を招くこともない硬質回路基板とフレキシブル回路基板の接続構造を提供することにある。 The present invention has been made in view of the above points, and an object thereof is to obtain a stable electric output even in a high temperature environment, to have a small number of parts, to be easy to manufacture, and to increase the cost. It is an object of the present invention to provide a connection structure between a rigid circuit board and a flexible circuit board.

本発明は、硬質回路基板の接続パターンに、フレキシブル回路基板の接続パターンを接続する硬質回路基板とフレキシブル回路基板の接続構造であって、前記硬質回路基板の接続パターンと前記フレキシブル回路基板の接続パターンとを互いに接合し、この接合した部分を溶融樹脂の成形による成形体によって封止し、前記成形体の前記フレキシブル回路基板を引き出す側の側面に、当該フレキシブル回路基板に至る凹部を形成し、さらに前記凹部は、前記接合した部分の上面もしくは下面から投影した際に、前記フレキシブル回路基板の接続パターンから導出された回路パターンと重なる箇所に設けてあることを特徴としている。
本発明によれば、硬質回路基板上に設けた回路パターンと、フレキシブル回路基板上に設けた回路パターンとを、少ない部品点数で、容易且つ確実に接続することができ、また低コスト化を図ることもできる。
このとき、上記硬質回路基板を用いて回転式電子部品やスライド式電子部品などの各種の電子部品を構成すれば(各種電子部品用硬質回路基板とすれば)、硬質回路基板上に設けた抵抗体パターンなどの各種回路パターンを容易に高温で焼成することができるので、高温環境下においても安定した電気的出力を得ることができる。
また成形体の側面から引き出したフレキシブル回路基板は、成形体の側面から引き出した辺の部分において、フレキシブル回路基板の表裏方向に向けて屈曲するが、その際、フレキシブル回路基板が鋭角に屈曲すると、屈曲した部分にあるフレキシブル回路基板上の回路パターンに亀裂などの損傷を生じる虞がある。しかし本発明によれば、成形体の側面においてフレキシブル回路基板が屈曲した際、その屈曲は凹部を設けた部分においては凹部の前方の空間において行われるので、鋭角な屈曲とはならず、円弧を描いた屈曲となる。そしてこの凹部に重なるようにフレキシブル回路基板の回路パターンを設けたので、この回路パターンの損傷を容易且つ確実に防止することができる。
The present invention is a connection structure of a rigid circuit board and a flexible circuit board for connecting a connection pattern of a flexible circuit board to a connection pattern of the rigid circuit board, wherein the connection pattern of the rigid circuit board and the connection pattern of the flexible circuit board are connected. And are joined to each other, and the joined portion is sealed by a molded body formed by molding a molten resin, and a recess leading to the flexible circuit board is further formed on the side surface of the molded body on the side where the flexible circuit board is pulled out. The recess is characterized in that it is provided at a position overlapping the circuit pattern derived from the connection pattern of the flexible circuit board when projected from the upper surface or the lower surface of the joined portion .
According to the present invention, the circuit pattern provided on the rigid circuit board and the circuit pattern provided on the flexible circuit board can be easily and surely connected with a small number of parts, and the cost can be reduced. You can also do it.
At this time, if various electronic components such as rotary electronic components and slide-type electronic components are configured by using the above-mentioned rigid circuit board (if it is a rigid circuit board for various electronic components), a resistor provided on the rigid circuit board is provided. Since various circuit patterns such as body patterns can be easily fired at a high temperature, stable electrical output can be obtained even in a high temperature environment.
Further, the flexible circuit board pulled out from the side surface of the molded body bends toward the front and back directions of the flexible circuit board at the side portion pulled out from the side surface of the molded body, but at that time, when the flexible circuit board bends at an acute angle, There is a risk of damage such as cracks in the circuit pattern on the flexible circuit board in the bent portion. However, according to the present invention, when the flexible circuit board is bent on the side surface of the molded body, the bending is performed in the space in front of the recess in the portion where the recess is provided, so that the bending is not an acute angle and an arc is formed. It becomes the drawn bend. Since the circuit pattern of the flexible circuit board is provided so as to overlap the recesses, damage to the circuit pattern can be easily and surely prevented.

また本発明は、上記特徴に加え、前記硬質回路基板の接続パターンと、前記フレキシブル回路基板の接続パターンは、接着性を有する導電材料を介して接合されていることを特徴としている。
接着性を有する導電材料を用いることによって、硬質回路基板の接続パターンと、フレキシブル回路基板の接続パターンとを、より確実に接続することができる。
Further, in addition to the above features, the present invention is characterized in that the connection pattern of the rigid circuit board and the connection pattern of the flexible circuit board are joined via a conductive material having adhesiveness.
By using the conductive material having adhesiveness, the connection pattern of the rigid circuit board and the connection pattern of the flexible circuit board can be more reliably connected.

本発明によれば、高温環境下においても安定した電気的出力が得られ、また部品点数が少なくて製造作業も容易であり、またコストの低減化を図ることもできる。 According to the present invention, stable electrical output can be obtained even in a high temperature environment, the number of parts is small, manufacturing work is easy, and cost can be reduced.

引出部付き電子部品用ケース1を上側から見た斜視図である。It is a perspective view which looked at the case 1 for an electronic component with a drawer part from the upper side. 引出部付き電子部品用ケース1を下側から見た斜視図である。It is a perspective view which looked at the case 1 for an electronic component with a drawer part from the lower side. 電子部品用ケース10からフレキシブル回路基板80を引き出した部分を上側から見た要部拡大斜視図である。It is an enlarged perspective view of the main part which looked at the part which pulled out the flexible circuit board 80 from the case 10 for an electronic component, and looked at from the upper side. 電子部品用ケース10からフレキシブル回路基板80を引き出した部分を下側から見た要部拡大斜視図である。FIG. 3 is an enlarged perspective view of a main part of a portion in which a flexible circuit board 80 is pulled out from a case 10 for electronic components as viewed from below. 引出部付き電子部品用ケース1を上側から見た分解斜視図である。It is an exploded perspective view of the case 1 for an electronic component with a drawer part seen from the upper side. 引出部付き電子部品用ケース1を下側から見た分解斜視図である。It is an exploded perspective view of the case 1 for an electronic component with a drawer part seen from the lower side. 第1,第2金型A1,A2に挟持・収納された硬質回路基板20とフレキシブル回路基板80の接続部分周辺を拡大して示す拡大概略断面図(図3のA-A線部分での拡大概略断面図)である。An enlarged schematic cross-sectional view (enlarged in the AA line portion of FIG. 3) showing an enlarged periphery of the connection portion between the rigid circuit board 20 sandwiched and stored in the first and second molds A1 and A2 and the flexible circuit board 80. Schematic cross-sectional view). 凹部53a,53b,53cの作用説明図である。It is an operation explanatory drawing of the recesses 53a, 53b, 53c.

以下、本発明の実施形態を図面を参照して詳細に説明する。図1,図2はそれぞれ本発明を用いて構成された引出部付き電子部品用ケース1を上側または下側から見た斜視図、図3,図4はそれぞれ電子部品用ケース10からフレキシブル回路基板80を引き出した部分を上側または下側から見た要部拡大斜視図、図5,図6はそれぞれ引出部付き電子部品用ケース1を上側または下側から見た分解斜視図(但し、実際には各部材は分解できず、またケース50はインサート成形される他の部品による空間を省略した中実の状態を示している)である。 Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. 1 and 2 are perspective views of an electronic component case 1 with a drawer configured using the present invention as viewed from above or below, and FIGS. 3 and 4 are flexible circuit boards from the electronic component case 10 respectively. Enlarged perspective view of the main part when the part where 80 is pulled out is seen from the upper side or the lower side, and FIGS. Each member cannot be disassembled, and the case 50 shows a solid state in which space due to other parts to be insert-molded is omitted).

これらの図に示すように、引出部付き電子部品用ケース1は、電子部品用ケース10を構成する硬質回路基板(各種電子部品用硬質回路基板)20及びケース(成形体)50と、フレキシブル回路基板80とを具備して構成されている。なお以下の説明において、「上」又は「表」とは、硬質回路基板20の下記する抵抗体パターン25などを形成した面をその反対面側から見る方向をいい、「下」とはその反対方向をいうものとする。 As shown in these figures, the electronic component case 1 with a drawer includes a rigid circuit board (hard circuit board for various electronic components) 20 and a case (molded body) 50 constituting the electronic component case 10, and a flexible circuit. It is configured to include a substrate 80. In the following description, the "top" or "front" refers to the direction in which the surface of the rigid circuit board 20 on which the resistor pattern 25 or the like described below is formed is viewed from the opposite surface side, and is the opposite of the "bottom". It shall refer to the direction.

硬質回路基板20は、図5,図6に示すように、略矩形平板状で長尺な絶縁性の硬質基板21の上面に、1本の直線状の導電体パターン23と、前記導電体パターン23に対して平行に配置される1本の直線状の抵抗体パターン25とを形成し、また硬質基板21の上面の短い方の一方の外周辺近傍部分に、複数(3つ)の接続パターン27,29,31を形成し、また導電体パターン23の一方の端部と接続パターン27間を引出パターン33で接続し、抵抗体パターン25の一方の端部と接続パターン29間を引出パターン35で接続し、抵抗体パターン25の他方の端部と接続パターン31間を引出パターン37で接続して構成されている。各接続パターン27,29,31間に位置する外周辺は、当該外周辺を凹状に切り欠くことで、2つの溝部38,39が形成されている。また硬質基板21の長手方向に沿う左右両辺の接続パターン27,31の根元側位置には、半円弧状に切り欠かれた凹部41が形成されている。また硬質基板21の所定位置には、貫通する小孔からなる位置決め部43が形成されている。 As shown in FIGS. 5 and 6, the rigid circuit board 20 has a substantially rectangular flat plate-shaped and long insulating rigid substrate 21 on the upper surface thereof, a linear conductor pattern 23, and the conductor pattern. A single linear resistor pattern 25 arranged parallel to the 23 is formed, and a plurality (three) connection patterns are formed in the vicinity of the outer periphery of one of the shorter surfaces of the upper surface of the hard substrate 21. 27, 29, 31 are formed, one end of the conductor pattern 23 and the connection pattern 27 are connected by a drawer pattern 33, and one end of the resistor pattern 25 and the connection pattern 29 are connected to the drawer pattern 35. The other end of the resistor pattern 25 and the connection pattern 31 are connected by a drawer pattern 37. In the outer periphery located between the connection patterns 27, 29, 31, two grooves 38, 39 are formed by cutting out the outer periphery in a concave shape. Further, a recess 41 cut out in a semicircular shape is formed at a position on the root side of the connection patterns 27 and 31 on both the left and right sides along the longitudinal direction of the hard substrate 21. Further, a positioning portion 43 formed of small holes penetrating is formed at a predetermined position of the hard substrate 21.

ケース50は、合成樹脂を略矩形状に成形した一体成型品であり、硬質回路基板20の下面全体に成形される底部51と、硬質回路基板20の外周を囲む部分に成形される側壁部51a,51b,51c,51dとを具備して構成されている。ケース50の上面には、硬質回路基板20上面の導電体パターン23と抵抗体パターン25とが露出している。フレキシブル回路基板80は、その一端側部分の下面が前記硬質回路基板20の一端側部分の上面に当接・接続された状態で、その上下部分がケース50によって挟持・固定されている。ケース50のフレキシブル回路基板80を引き出す側の側壁部51aの外周側の側面には、側壁部51aの上面からフレキシブル回路基板80に至る3つの凹部53a,53b,53cが形成されている。各凹部53a,53b,53cは、図3に示すように、硬質回路基板20とフレキシブル回路基板80の接合部分をその上面もしくは下面から投影した際に、フレキシブル回路基板80の下記する回路パターン83,85,87と重なる箇所に設けられている。 The case 50 is an integrally molded product obtained by molding a synthetic resin into a substantially rectangular shape, and has a bottom portion 51 formed on the entire lower surface of the hard circuit board 20 and a side wall portion 51a formed on a portion surrounding the outer periphery of the hard circuit board 20. , 51b, 51c, 51d. The conductor pattern 23 and the resistor pattern 25 on the upper surface of the rigid circuit board 20 are exposed on the upper surface of the case 50. The upper and lower portions of the flexible circuit board 80 are sandwiched and fixed by the case 50 in a state where the lower surface of the one end side portion thereof is in contact with and connected to the upper surface of the one end side portion of the rigid circuit board 20. Three recesses 53a, 53b, 53c extending from the upper surface of the side wall portion 51a to the flexible circuit board 80 are formed on the outer peripheral side surface of the side wall portion 51a on the side where the flexible circuit board 80 of the case 50 is pulled out. As shown in FIG. 3, each of the recesses 53a, 53b, 53c has the following circuit pattern 83 of the flexible circuit board 80 when the joint portion between the rigid circuit board 20 and the flexible circuit board 80 is projected from the upper surface or the lower surface thereof. It is provided at a location overlapping with 85 and 87.

またケース50の長手方向に沿う左右両側壁部51b,51dの外周側の側面から底部51の底面にかけて、一対ずつの図示しないカバーの爪を挿入するカバー取付用凹部55が形成されている。なお図示しないカバーは、ケース50の上面を覆う形状に形成される。またケース50の底部51の前記硬質回路基板20の各接続パターン27,29,31に対応する位置には、硬質回路基板20の底面に至る小穴からなる3つの凹部57が形成されている。 Further, a cover mounting recess 55 for inserting a pair of claws of a cover (not shown) is formed from the outer peripheral side surfaces of the left and right side wall portions 51b and 51d along the longitudinal direction of the case 50 to the bottom surface of the bottom portion 51. The cover (not shown) is formed so as to cover the upper surface of the case 50. Further, at the positions corresponding to the connection patterns 27, 29, 31 of the rigid circuit board 20 on the bottom 51 of the case 50, three recesses 57 formed of small holes leading to the bottom surface of the rigid circuit board 20 are formed.

フレキシブル回路基板80は、可撓性を有する絶縁性の合成樹脂フィルム(例えばPETフィルム、ポリフェニレンスルフイド〔PPS〕フィルムなど)を略帯状に形成してなるフレキシブル基板81の下面に、図6に示すように、複数本(3本)の引出用の回路パターン83,85,87をほぼ直線状で平行に形成して構成されている。フレキシブル基板81下面の硬質基板21側の先端辺近傍部分には、当該先端辺に沿うように所定間隔をあけて複数(3つ)の接続パターン89,91,93が形成されている。これら接続パターン89,91,93は、それぞれ前記各回路パターン83,85,87の一端に接続されている。これら接続パターン89,91,93は、それぞれ前記硬質回路基板20の各接続パターン27,29,31に対向する位置に設けられている。一方、前記フレキシブル基板81の硬質基板21とは反対側の先端辺近傍部分には、当該先端辺に沿うように所定間隔をあけて複数(3つ)のコネクタ接続パターン95,97,99が形成されている。これらコネクタ接続パターン95,97,99は、それぞれ前記各回路パターン83,85,87の一端に接続されている。 The flexible circuit board 80 is formed on the lower surface of the flexible substrate 81 in which a flexible insulating synthetic resin film (for example, PET film, polyphenylene sulfide [PPS] film, etc.) is formed in a substantially strip shape, as shown in FIG. As shown, a plurality of (three) drawing circuit patterns 83, 85, and 87 are formed in a substantially linear and parallel manner. A plurality (three) connection patterns 89, 91, 93 are formed on the lower surface of the flexible substrate 81 in the vicinity of the tip end side on the hard substrate 21 side at predetermined intervals along the tip end side. These connection patterns 89, 91, and 93 are connected to one end of each of the circuit patterns 83, 85, 87, respectively. These connection patterns 89, 91, and 93 are provided at positions facing each of the connection patterns 27, 29, and 31 of the rigid circuit board 20, respectively. On the other hand, a plurality of (three) connector connection patterns 95, 97, 99 are formed in the portion of the flexible substrate 81 near the tip side opposite to the hard board 21 at predetermined intervals along the tip side. Has been done. These connector connection patterns 95, 97, 99 are connected to one end of each of the circuit patterns 83, 85, 87, respectively.

フレキシブル回路基板80の前記接続パターン89,91,93の間の位置には、略矩形状の小孔からなる樹脂挿通用孔101,103が形成されている。また前記接続パターン89,91,93の両外側位置(フレキシブル基板81の両角部位置)には、フレキシブル基板81の左右両辺から外方に向けて張り出す一対の矩形状の張出部105,107が設けられ、これら張出部105,107には、小孔からなる樹脂挿通部109,111が形成されている。またフレキシブル回路基板80の所定位置には、2つの貫通孔からなる位置決め部113,115が形成されている。またフレキシブル回路基板80のコネクタ接続パターン95,97,99を設けた反対側の面には、補強板117が貼り付けられている。 Resin insertion holes 101 and 103 made of substantially rectangular small holes are formed at positions between the connection patterns 89, 91 and 93 of the flexible circuit board 80. Further, at both outer positions of the connection patterns 89, 91, 93 (both corner positions of the flexible substrate 81), a pair of rectangular overhanging portions 105, 107 projecting outward from both the left and right sides of the flexible substrate 81. , And the overhanging portions 105 and 107 are formed with resin insertion portions 109 and 111 having small holes. Further, positioning portions 113 and 115 composed of two through holes are formed at predetermined positions of the flexible circuit board 80. Further, a reinforcing plate 117 is attached to the opposite surface of the flexible circuit board 80 provided with the connector connection patterns 95, 97, 99.

次に、引出部付き電子部品用ケース1の製造方法を説明する。即ち、引出部付き電子部品用ケース1を製造するには、図7に示すように、硬質回路基板20とフレキシブル回路基板80を、第1,第2金型A1,A2内に挟持・収納する。このとき、硬質回路基板20に設けた接続パターン27,29,31とフレキシブル回路基板80に設けた接続パターン89,91,93とを、それぞれ導電性接着材117,119,121(図5,図6参照)を介して接合・接着しておく。導電性接着材117,119,121としては、例えば銀ペーストを用いる。 Next, a method of manufacturing the case 1 for electronic parts with a drawer portion will be described. That is, in order to manufacture the case 1 for electronic components with a drawer portion, as shown in FIG. 7, the rigid circuit board 20 and the flexible circuit board 80 are sandwiched and stored in the first and second molds A1 and A2. .. At this time, the connection patterns 27, 29, 31 provided on the rigid circuit board 20 and the connection patterns 89, 91, 93 provided on the flexible circuit board 80 are attached to the conductive adhesives 117, 119, 121, respectively (FIGS. 5 and 5). 6) to join and bond. As the conductive adhesives 117, 119, 121, for example, silver paste is used.

このとき、図7に示すように、硬質回路基板20に設けた位置決め部43には、第1金型A1に設けた位置決めピンA11が挿入され、またフレキシブル回路基板80に設けた位置決め部113,115(図7には113のみ示す)には、第1金型A1に設けた位置決めピンA13が挿入され、位置決めされる。また第1,第2金型A1,A2によって、ケース50の形状のキャビティーCが形成される。また第1金型A1側には、キャビティーCに開口する樹脂注入部C13が設けられている。また硬質回路基板20の接続パターン27,29,31を設けた部分と、フレキシブル回路基板80の接続パターン89,91,93を設けた部分は、主として、第1金型A1に設けた基板押圧部A15と、第2回路基板A2に設けた基板押圧部A21によって押圧され、挟持・圧接される。なお、基板押圧部A15は幅方向に3か所あり、これらによって前記ケース50の3つの凹部53a,53b,53cが形成される。また基板押圧部A21も幅方向に3か所あり、これらによって前記ケース50の3つの凹部57が形成される。またこのとき、硬質回路基板20に設けた各溝部38,39は、フレキシブル回路基板80に設けた各樹脂挿通用孔101,103に対向しており、また硬質回路基板20に設けた各凹部41,41は、フレキシブル回路基板80に設けた各樹脂挿通部109,111に対向している。 At this time, as shown in FIG. 7, the positioning pin A11 provided in the first mold A1 is inserted into the positioning portion 43 provided on the rigid circuit board 20, and the positioning portion 113 provided on the flexible circuit board 80. The positioning pin A13 provided in the first mold A1 is inserted into the 115 (only 113 is shown in FIG. 7) and positioned. Further, the first and second molds A1 and A2 form a cavity C in the shape of the case 50. Further, on the side of the first mold A1, a resin injection portion C13 that opens into the cavity C is provided. Further, the portion provided with the connection patterns 27, 29, 31 of the rigid circuit board 20 and the portion provided with the connection patterns 89, 91, 93 of the flexible circuit board 80 are mainly the substrate pressing portions provided in the first mold A1. It is pressed by A15 and the substrate pressing portion A21 provided on the second circuit board A2, and is sandwiched and pressure-welded. The substrate pressing portions A15 are provided at three locations in the width direction, and these three recesses 53a, 53b, and 53c of the case 50 are formed. Further, the substrate pressing portions A21 are also provided at three locations in the width direction, whereby the three recesses 57 of the case 50 are formed. At this time, the groove portions 38 and 39 provided in the hard circuit board 20 face each of the resin insertion holes 101 and 103 provided in the flexible circuit board 80, and the recesses 41 provided in the hard circuit board 20. , 41 face each of the resin insertion portions 109 and 111 provided on the flexible circuit board 80.

そして、前記樹脂注入部C13からキャビティーC内に溶融樹脂を充填して固化した後、第1,第2金型A1,A2を取り外せば、引出部付き電子部品1が完成する。なお、樹脂注入部C13は、フレキシブル回路基板80の接続パターン91を設けた部分の反対面側に対向して位置しているので、射出された溶融樹脂の圧力は、接続パターン89,91,93を硬質回路基板20の接続パターン27,29,31に押し付ける力として作用し、これによってさらに接続パターン27,29,31と接続パターン89,91,93間の接続強度を向上させることができる。なお上記製造手順はその一例であり、他の各種異なる製造手順を用いて製造しても良いことはいうまでもない。 Then, the cavity C is filled with the molten resin from the resin injection portion C13 and solidified, and then the first and second molds A1 and A2 are removed to complete the electronic component 1 with a drawer portion. Since the resin injection portion C13 is located opposite to the opposite surface side of the portion of the flexible circuit board 80 where the connection pattern 91 is provided, the pressure of the injected molten resin is the connection patterns 89, 91, 93. Acts as a force for pressing the connection patterns 27, 29, 31 of the rigid circuit board 20, thereby further improving the connection strength between the connection patterns 27, 29, 31 and the connection patterns 89, 91, 93. It is needless to say that the above manufacturing procedure is an example thereof, and manufacturing may be performed using various other different manufacturing procedures.

上記引出部付き電子部品1によれば、硬質回路基板20の接続パターン27,29,31とフレキシブル回路基板80の接続パターン89,91,93とを互いに接合し、当該接合部分を溶融樹脂の成形によるケース(成形体)50によって封止する構成としているので、硬質回路基板20上に設けた回路パターン23,25,33,35,37と、フレキシブル回路基板80上に設けた回路パターン83,85,87とを、少ない部品点数で、容易且つ確実に接続することができ、また低コスト化を図ることもできる。また上記硬質回路基板20を用いて電子部品(電子部品用ケース10)を構成しているので、硬質回路基板20上に設けた抵抗体パターン25などの各種回路パターンを容易に高温で焼成することができる。このため、この電子部品(電子部品用ケース10またはこの電子部品用ケース10を用いて構成した電子部品(スライド式電子部品))を高温環境下に置いても安定した電気的出力を得ることができる。 According to the electronic component 1 with a drawer portion, the connection patterns 27, 29, 31 of the rigid circuit board 20 and the connection patterns 89, 91, 93 of the flexible circuit board 80 are bonded to each other, and the bonded portions are formed of molten resin. Since it is configured to be sealed by the case (molded body) 50 according to the above, the circuit patterns 23, 25, 33, 35, 37 provided on the rigid circuit board 20 and the circuit patterns 83, 85 provided on the flexible circuit board 80 , 87 can be easily and surely connected with a small number of parts, and the cost can be reduced. Further, since the electronic component (case 10 for electronic component) is configured by using the hard circuit board 20, various circuit patterns such as the resistor pattern 25 provided on the hard circuit board 20 can be easily fired at a high temperature. Can be done. Therefore, stable electrical output can be obtained even when the electronic component (the electronic component case 10 or the electronic component (sliding electronic component) configured by using the electronic component case 10) is placed in a high temperature environment. can.

また、上記引出部付き電子部品1は、硬質回路基板20の接続パターン27,29,31と、フレキシブル回路基板80の接続パターン89,91,93とが、導電性接着材(接着性を有する導電材料)117,119,121を介して接合されているので、硬質回路基板20の接続パターン27,29,31と、フレキシブル回路基板80の接続パターン89,91,93とを、より確実に接続することができる。 Further, in the electronic component 1 with a drawer portion, the connection patterns 27, 29, 31 of the rigid circuit board 20 and the connection patterns 89, 91, 93 of the flexible circuit board 80 are made of a conductive adhesive material (conductive property). Material) Since they are joined via 117, 119, 121, the connection patterns 27, 29, 31 of the rigid circuit board 20 and the connection patterns 89, 91, 93 of the flexible circuit board 80 are more reliably connected. be able to.

また、上記引出部付き電子部品1は、ケース50のフレキシブル回路基板80を引き出す側の側面(側壁部51aの外周側側面)に、当該フレキシブル基板80(その上面)に至る凹部53a,53b,53cを形成し、さらにこの凹部53a,53b,53cは、硬質回路基板20とフレキシブル回路基板80の接合部分をその上面もしくは下面から投影した際に、フレキシブル回路基板80の接続パターン89,91,93から導出された回路パターン83,85,87と重なる箇所に設けてあるので、回路パターン83,85,87の損傷を容易且つ確実に防止することができる。即ち、ケース50の側面から引き出したフレキシブル回路基板80は、ケース50の側面から引き出した凹部53a,53b,53cのない辺H1(図8参照)の部分において、フレキシブル回路基板80の表裏方向に向けて屈曲するが、その際、フレキシブル回路基板80が鋭角に屈曲すると、屈曲した部分にあるフレキシブル回路基板80上の回路パターンに亀裂などの損傷を生じる虞がある。しかしこの引出部付き電子部品1によれば、ケース50の側面においてフレキシブル回路基板80が屈曲した際、その屈曲は凹部53a,53b,53cを設けた部分においては凹部53a,53b,53cの前方の空間H2において行われるので、鋭角な屈曲とはならず、円弧を描いた屈曲となる。そしてこの凹部53a,53b,53cに重なるようにフレキシブル回路基板80の回路パターン83,85,87が設けられているので、これら回路パターン83,85,87の損傷を容易且つ確実に防止することができるのである。 Further, the electronic component 1 with a drawer portion has recesses 53a, 53b, 53c leading to the flexible substrate 80 (upper surface thereof) on the side surface (side surface on the outer peripheral side of the side wall portion 51a) on the side where the flexible circuit board 80 of the case 50 is pulled out. The recesses 53a, 53b, 53c are further formed from the connection patterns 89, 91, 93 of the flexible circuit board 80 when the joint portion between the rigid circuit board 20 and the flexible circuit board 80 is projected from the upper surface or the lower surface thereof. Since it is provided at a position overlapping with the derived circuit patterns 83, 85, 87, damage to the circuit patterns 83, 85, 87 can be easily and surely prevented. That is, the flexible circuit board 80 pulled out from the side surface of the case 50 faces the front and back directions of the flexible circuit board 80 at the portion of the side H1 (see FIG. 8) without the recesses 53a, 53b, 53c pulled out from the side surface of the case 50. However, if the flexible circuit board 80 is bent at an acute angle at that time, the circuit pattern on the flexible circuit board 80 in the bent portion may be damaged such as cracks. However, according to the electronic component 1 with a drawer portion, when the flexible circuit board 80 is bent on the side surface of the case 50, the bending is in front of the recesses 53a, 53b, 53c in the portion where the recesses 53a, 53b, 53c are provided. Since it is performed in the space H2, it does not bend at an acute angle, but bends in an arc. Since the circuit patterns 83, 85, 87 of the flexible circuit board 80 are provided so as to overlap the recesses 53a, 53b, 53c, damage to these circuit patterns 83, 85, 87 can be easily and surely prevented. You can.

また、ケース50となっている成形体は、フレキシブル回路基板80に設けた樹脂挿通用孔101,103と、硬質回路基板20に設けた溝部38,39とを上下に貫通し、またフレキシブル回路基板80に設けた樹脂挿通部109,111と、硬質回路基板20に設けた凹部41,41とを上下に貫通しているので、硬質回路基板20とケース50とフレキシブル回路基板80間の固定(接続)をより確実に行うことができる。さらにフレキシブル回路基板80に設けた張出部105,107がケース50内に位置することで、フレキシブル回路基板80のケース50からの引き抜き強度をさらに強固にすることができる。 Further, the molded body as the case 50 penetrates the resin insertion holes 101 and 103 provided in the flexible circuit board 80 and the grooves 38 and 39 provided in the rigid circuit board 20 vertically, and also penetrates the flexible circuit board vertically. Since the resin insertion portions 109 and 111 provided in the 80 and the recesses 41 and 41 provided in the rigid circuit board 20 penetrate vertically, the rigid circuit board 20, the case 50, and the flexible circuit board 80 are fixed (connected). ) Can be performed more reliably. Further, by locating the overhanging portions 105 and 107 provided on the flexible circuit board 80 in the case 50, the pull-out strength of the flexible circuit board 80 from the case 50 can be further strengthened.

また上述のように、ケース50を構成する成形体が、フレキシブル回路基板80の樹脂挿通用孔101,103と硬質回路基板20の溝部38,39とを上下に貫通するので、これによって硬質回路基板20の各接続パターン27,29,31と、フレキシブル回路基板80の各接続パターン89,91,93の接合部分が、各接合部分毎に上記成形体によって仕切られる。このため、各接合部分間の短絡を確実に防止することができる。 Further, as described above, the molded body constituting the case 50 penetrates the resin insertion holes 101 and 103 of the flexible circuit board 80 and the grooves 38 and 39 of the hard circuit board 20 vertically, whereby the hard circuit board is formed. The joint portions of the connection patterns 27, 29, 31 of 20 and the connection portions 89, 91, 93 of the flexible circuit board 80 are partitioned by the molded body for each joint portion. Therefore, it is possible to reliably prevent a short circuit between the joint portions.

以上本発明の実施形態を説明したが、本発明は上記実施形態に限定されるものではなく、特許請求の範囲、及び明細書と図面に記載された技術的思想の範囲内において種々の変形が可能である。なお直接明細書及び図面に記載がない何れの形状や構造や材質であっても、本願発明の作用・効果を奏する以上、本願発明の技術的思想の範囲内である。例えば、上記実施形態では、本発明を、スライド式電子部品用の引出部付き電子部品用ケース1に適用した例を示したが、例えば回転式電子部品用の引出部付き電子部品用ケースなど、他の各種用途に用いる引出部付き電子部品に適用しても良い。また上記実施形態では、硬質回路基板の接続パターンとフレキシブル回路基板の接続パターンとを接合した接合部分を封止する成形体として、電子部品用のケースを用いたが、電子部品用のケース以外の各種成形体(例えば、単に前記接合部分を封止することのみに用いる成形体など)を用いて前記接合部分を封止する構成としても良い。また上記実施形態では、ケースのフレキシブル回路基板を引き出す側の側面に形成する凹部を、フレキシブル回路基板の上面側に設けたが、その逆に、フレキシブル回路基板の下面側に設けても良く、さらには、フレキシブル回路基板の上面側と下面側の両方に設けても良い。また、上記記載及び各図で示した実施形態は、その目的及び構成等に矛盾がない限り、互いの記載内容を組み合わせることが可能である。また、上記記載及び各図の記載内容は、その一部であっても、それぞれ独立した実施形態になり得るものであり、本発明の実施形態は上記記載及び各図を組み合わせた一つの実施形態に限定されるものではない。 Although the embodiments of the present invention have been described above, the present invention is not limited to the above embodiments, and various modifications may be made within the scope of claims and the technical ideas described in the specification and drawings. It is possible. It should be noted that any shape, structure or material not directly described in the specification or drawings is within the scope of the technical idea of the present invention as long as the action and effect of the present invention are exhibited. For example, in the above embodiment, an example in which the present invention is applied to a case 1 for an electronic component with a drawer for a slide-type electronic component is shown, but for example, a case for an electronic component with a drawer for a rotary electronic component, etc. It may be applied to electronic components with drawers used for various other purposes. Further, in the above embodiment, a case for electronic parts is used as a molded body for sealing the joint portion where the connection pattern of the rigid circuit board and the connection pattern of the flexible circuit board are joined, but the case other than the case for electronic parts is used. The joint portion may be sealed by using various molded bodies (for example, a molded body used only for sealing the joint portion). Further, in the above embodiment, the recess formed on the side surface of the case on the side where the flexible circuit board is pulled out is provided on the upper surface side of the flexible circuit board, but conversely, it may be provided on the lower surface side of the flexible circuit board. May be provided on both the upper surface side and the lower surface side of the flexible circuit board. In addition, the above description and the embodiments shown in each figure can be combined with each other as long as there is no contradiction in the purpose, configuration, and the like. Further, the above description and the description contents of each figure can be independent embodiments even if they are a part thereof, and the embodiment of the present invention is one embodiment in which the above description and each figure are combined. Not limited to.

1 引出部付き電子部品用ケース
10 電子部品用ケース
20 硬質回路基板
23 導電体パターン(回路パターン)
25 抵抗体パターン(回路パターン)
27,29,31 接続パターン
40 ケース(成形体)
53a,53b,53c 凹部
80 フレキシブル回路基板
83,85,87 回路パターン
89,91,93 接続パターン
117,119,121 導電性接着材(接着性を有する導電材料)
1 Case for electronic parts with drawer 10 Case for electronic parts 20 Rigid circuit board 23 Conductor pattern (circuit pattern)
25 Resistance pattern (circuit pattern)
27, 29, 31 Connection pattern 40 Case (molded body)
53a, 53b, 53c Recessed 80 Flexible circuit board 83,85,87 Circuit pattern 89,91,93 Connection pattern 117,119,121 Conductive adhesive (conductive material)

Claims (2)

硬質回路基板の接続パターンに、フレキシブル回路基板の接続パターンを接続する硬質回路基板とフレキシブル回路基板の接続構造であって、
前記硬質回路基板の接続パターンと前記フレキシブル回路基板の接続パターンとを互いに接合し、この接合した部分を溶融樹脂の成形による成形体によって封止し
前記成形体の前記フレキシブル回路基板を引き出す側の側面に、当該フレキシブル回路基板に至る凹部を形成し、
さらに前記凹部は、前記接合した部分の上面もしくは下面から投影した際に、前記フレキシブル回路基板の接続パターンから導出された回路パターンと重なる箇所に設けてあることを特徴とする硬質回路基板とフレキシブル回路基板の接続構造。
It is a connection structure of a rigid circuit board and a flexible circuit board that connects the connection pattern of the flexible circuit board to the connection pattern of the rigid circuit board.
The connection pattern of the hard circuit board and the connection pattern of the flexible circuit board are joined to each other, and the joined portion is sealed by a molded body formed by molding a molten resin .
A recess leading to the flexible circuit board is formed on the side surface of the molded product on the side where the flexible circuit board is pulled out.
Further, the concave portion is provided at a position where it overlaps with the circuit pattern derived from the connection pattern of the flexible circuit board when projected from the upper surface or the lower surface of the joined portion. Board connection structure.
請求項1に記載の硬質回路基板とフレキシブル回路基板の接続構造であって、
前記硬質回路基板の接続パターンと、前記フレキシブル回路基板の接続パターンは、接着性を有する導電材料を介して接合されていることを特徴とする硬質回路基板とフレキシブル回路基板の接続構造。
The connection structure between the rigid circuit board and the flexible circuit board according to claim 1.
A connection structure between a rigid circuit board and a flexible circuit board, wherein the connection pattern of the rigid circuit board and the connection pattern of the flexible circuit board are joined via a conductive material having adhesiveness.
JP2018113959A 2018-06-14 2018-06-14 Connection structure between rigid circuit board and flexible circuit board Active JP7010481B2 (en)

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Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001249170A (en) 1999-12-28 2001-09-14 Teikoku Tsushin Kogyo Co Ltd Sensor element and its manufacturing method
JP2007273785A (en) 2006-03-31 2007-10-18 Teikoku Tsushin Kogyo Co Ltd Connection structure and connection method of circuit substrates
JP2007335574A (en) 2006-06-14 2007-12-27 Teikoku Tsushin Kogyo Co Ltd Lead-out unit of circuit board

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11346048A (en) * 1998-06-01 1999-12-14 Casio Comput Co Ltd Flexible wiring board
JP2004087709A (en) * 2002-08-26 2004-03-18 Teikoku Tsushin Kogyo Co Ltd Method for forming terminal fixing part to substrate

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001249170A (en) 1999-12-28 2001-09-14 Teikoku Tsushin Kogyo Co Ltd Sensor element and its manufacturing method
JP2007273785A (en) 2006-03-31 2007-10-18 Teikoku Tsushin Kogyo Co Ltd Connection structure and connection method of circuit substrates
JP2007335574A (en) 2006-06-14 2007-12-27 Teikoku Tsushin Kogyo Co Ltd Lead-out unit of circuit board

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