JP5020056B2 - How to attach electronic components to circuit boards - Google Patents

Description

  The present invention relates to a method for mounting an electronic component suitable for use in electrically and mechanically mounting a small electronic component to a circuit board.

  Conventionally, in order to mount and attach a chip-type electronic component having a substantially rectangular shape and protruding metal terminals from the left and right side surfaces of a resin-made main body case on the circuit substrate, the electronic component mounted on the circuit substrate An electronic component mounting body made of synthetic resin is formed around the periphery (for example, see Patent Document 1). Specifically, the circuit board on which the electronic component is placed is housed in a mold, and the mold for forming the electronic component mounting body provided in the mold is filled with a melt molding resin, and melt molding is performed by cooling. An electronic component mounting body is formed by removing the mold after the resin is solidified, and the electronic component is attached to the circuit board.

  However, the conventional method for attaching the electronic component to the circuit board has the following problems. In other words, if the electronic component has a relatively large size, there is no problem even if there is a slight shift in the connection position between the metal terminal of the electronic component and the conductive pattern of the circuit board to which the metal terminal is connected. If the size and pitch of the metal terminal and the conductive pattern become very small (for example, the length of the main body case is about 2 mm), a slight shift in the connection position between the metal terminal and the conductive pattern will cause a connection between the two. It will cause defects. For this reason, the smaller the electronic component is, the more accurate alignment between the electronic component set in the mold and the circuit board is required.

  Therefore, conventionally, a storage recess for storing the upper part of the electronic component (the upper part protruding the metal terminal) is provided on the inner surface of the mold cavity, and the circuit board on which the electronic component is placed is stored in the mold. When this is done, the upper part of the electronic component is inserted into the housing recess to accurately position the electronic component.

  However, the electronic component has a small protrusion (resin injection protrusion) due to the resin residue (hereinafter referred to as “gate residue”) from the gate when molding the main body case, and this protrusion is one of the outer peripheral side surfaces of the main body case. In the case of this portion, there is a case where this protrusion interferes and the upper part of the main body case cannot be stored well in the storage recess provided in the mold.

In addition, when the electronic components are downsized, the metal terminals attached to them become very small and short, and the electronic component mounting body is molded around the metal terminals in contact with the conductive pattern of the circuit board. In this case, the position of the conductive pattern and the metal terminal may be shifted due to the pressure of the melt-molded resin, and the connection may not be performed satisfactorily.
Japanese Patent Laid-Open No. 10-172713

  SUMMARY OF THE INVENTION The present invention has been made in view of the above points, and an object of the present invention is to provide an electronic component circuit board that can be securely and mechanically mounted on a circuit board even if the electronic component is downsized. It is in providing the attachment method to.

  According to the first aspect of the present invention, there is provided an electronic component that protrudes a metal terminal from an outer peripheral side surface of a resin-made main body case and has a resin injection protrusion on one side surface of the outer peripheral side surface of the main body case; A circuit board provided with a conductive pattern for joining a metal terminal and a mold are prepared, and the electronic component and the circuit board are placed in the mold in a state where the conductive pattern of the circuit board and the metal terminal of the electronic part are joined. At the same time, a cavity is formed on the part surrounding the outer peripheral side surface of the electronic component in the mold and on the opposite side of the circuit board on which the electronic component is placed, and at the same time, a resin injection protrusion is provided on the main body case. The outer peripheral side except for the part is guided by guide protrusions protruding from the mold into the cavity to position the electronic component, and the mold is removed after filling the cavity with molten molding resin and cooling. Thus in the method of mounting to the circuit board of the electronic component, characterized in that to attach the electronic component to the circuit board by the electronic component mounting body to be molded.

  According to a second aspect of the present invention, the guide projection is provided at a position for guiding both end portions of the main body case where the resin injection projection is not provided on the outer peripheral side surface where the resin injection projection is provided. 2. The method of attaching an electronic component to a circuit board according to claim 1, wherein the component is positioned.

  According to the third aspect of the present invention, when the electronic component and the circuit board are accommodated in the mold, only a part of the front end surface of the contact pin provided so as to protrude from the mold into the cavity is provided. 3. The method for attaching an electronic component to a circuit board according to claim 1, wherein the electronic component is brought into contact with a tip portion of a metal terminal joined to the conductive pattern.

  The invention according to claim 4 of the present application is characterized in that the electronic component mounting body is integrally formed with a mounting portion that protrudes from the outer periphery of the electronic component mounting body and has a mounting engagement portion therein. The electronic component mounting method according to claim 1, 2 or 3.

  According to the first aspect of the present invention, when the electronic component and the circuit board are stored in the mold, the outer peripheral side surface of the electronic component body case excluding the portion provided with the resin injection protrusion is guided by the guide protrusion. Therefore, the electronic component guide by the guide protrusion is not obstructed by the resin injection protrusion. For this reason, the guide (positioning) in the mold of the electronic component is ensured, and the electronic component is not misaligned when the melt molding resin is filled in the cavity, and the conductive pattern of the circuit board is surely formed. The electronic component mounting body can be formed with the metal terminals connected.

  According to the second aspect of the invention, the guide protrusion can guide the outer peripheral side surface of the main body case of the electronic component provided with the resin injection protrusion without being obstructed by the resin injection protrusion. Thus, the guide (positioning) in the mold is surely prevented from being displaced, and the electronic component attachment body can be molded with the metal terminal of the electronic component being securely connected to the conductive pattern of the circuit board.

  According to the invention described in claim 3, since the cavity is filled with the molten molding resin in a state where the tip portion of the metal terminal is in contact with the tip surface of the contact pin, the metal terminal and the metal terminal are joined to the cavity. An electronic component mounting body with the metal terminal of the electronic component being more securely connected to the conductive pattern of the circuit board from this point as well. Can be molded. In particular, in the present invention, since only a part of the tip surface of the contact pin is in contact with the tip portion of the metal terminal, even when the electronic component is very downsized and the entire metal terminal cannot be contacted with the contact pin. In addition, it is possible to reliably support the metal terminal and the circuit board bonded thereto at the time of filling the molten molding resin. Furthermore, many portions of the metal terminal can be covered with the resin constituting the electronic component mounting body, thereby ensuring the mechanical and electrical connection between the conductive pattern and the metal terminal.

  According to the fourth aspect of the present invention, since the attachment portion having the attachment engagement portion is integrally formed on the electronic component attachment body, positioning when attaching the electronic component attached with the circuit board to the electronic device can be performed with high accuracy.

  Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. 1 to 6 are views showing a structure for mounting an electronic component constructed using the present invention to a circuit board. FIG. 1 is a perspective view seen from the upper side, and FIG. 2 is a perspective view seen from the lower side. 3 is a perspective view with the back side of FIG. 1 being the front side, FIG. 4 is a cross-sectional view taken along line AA in FIG. 1, FIG. 5 is a cross-sectional view taken along line BB in FIG. It is CC sectional view taken on the line. As shown in these drawings, the mounting structure of the electronic component according to the present embodiment to the circuit board includes a portion surrounding the outer peripheral side surfaces 51a to 51d (see FIG. 7) of the electronic component 50 placed on the circuit board 10, and By forming the electronic component mounting body 100 on the opposite side of the circuit board 10 on which the electronic component 50 is placed, the circuit board 10, the electronic component 50, and the electronic component mounting body 100 are integrated. . Hereinafter, after explaining each component, the manufacturing method will be explained. In the following description, “up” refers to the direction facing the electronic component 50 from the circuit board 10, and “down” refers to the direction facing the opposite side.

  As shown in FIG. 8 (FIG. 8 is one of illustrations of how to attach the electronic component 50 to the circuit board 10), the circuit board 10 is a flexible synthetic resin film 11 formed in a substantially rectangular shape. A plurality of (four) conductive patterns 13 are formed on the upper surface of the substrate. In this embodiment, a polyethylene terephthalate (PET) film is used as the material of the synthetic resin film 11, but the material is not limited to this, and other various thermoplastic, thermosetting, and photocurable synthetic resin films (for example, Polyphenylene sulfide (PPS) film, polyimide (PI) film, polyethylene naphthalate (PEN) film, polyetherimide (PEI) film, polyetheretherketone (PEEK) film, polyetherketone (PEK) film, polycarbonate ( PC) film, polybutylene naphthalate (PBN) film, polybutylene terephthalate (PBT) film, etc.) may be used.

  Each of the conductive patterns 13 has a substantially rectangular shape and is provided at a position where two conductive patterns are provided side by side. The positions of the conductive patterns 13 coincide with the positions facing the metal terminals 53 of the electronic component 50 described below. These conductive patterns 13 are formed by printing a conductive paste (screen printing or the like), but may be formed by another method such as etching or vapor deposition of a metal foil. Each conductive pattern 13 is connected to a circuit pattern (not shown) that is drawn to a drawing portion 15 that is connected to the outer periphery of the circuit board 10. A plurality of substantially rectangular shapes (left and right sides) penetrating vertically are formed on the periphery of each conductive pattern 13 of the synthetic resin film 11 (position between the adjacent conductive patterns 13 and positions on both outer sides of both conductive patterns 13). Three (three by one) resin insertion holes 17 are provided. That is, each resin insertion hole 17 is provided adjacent to each conductive pattern 13.

  7 is a view showing the electronic component 50, FIG. 7 (a) is a perspective view, FIG. 7 (b) is a perspective view in which the back side of FIG. 7 (a) is the front side, FIG. 7 (c). Is a side view. As shown in these drawings, the electronic component 50 is configured by protruding a pair of metal terminals 53 from the left and right outer peripheral side surfaces 51a and 51b of a substantially rectangular main body case 51 made of resin. In this example, the electronic component 50 is a magnetic sensor (Hall element), which converts a magnetic field into an electric signal. For example, it detects whether a magnet has approached. Each metal terminal 53 protrudes from the outer peripheral side surfaces 51a and 51b of the main body case 51, and is then bent downward at a substantially right angle, and further has its tip portion bent at a substantially right angle in the opposite direction. That is, the tip of the metal terminal 53 protrudes substantially horizontally toward the direction away from the outer peripheral side surfaces 51 a and 51 b of the main body case 51, and its lower surface forms a mounting surface 55 that is substantially horizontal. Each of the four placement surfaces 55 is located on substantially the same surface, and is located slightly below the bottom surface of the main body case 51. On the other hand, a resin injection protrusion 57 is formed on one outer peripheral side surface 51b of the pair of outer peripheral side surfaces 51a and 51b protruding from the metal terminals 53 of the main body case 51. The resin injection protrusion 57 is a so-called gate residue formed from a resin residue by a gate for injecting a resin used when the main body case 51 is molded using a mold. The resin injection protrusion 57 has a rectangular shape in this example, and is formed at a position between the two metal terminals 53 protruding from the outer peripheral side surface 51b.

  1 to 6, the electronic component mounting body 100 is an integrally molded product of synthetic resin (in this example, PBT resin is used, but other various synthetic resin materials may be used), and the circuit Through the resin insertion hole 17 (see FIG. 8) provided in the substrate 10, the circuit board 10 is formed in a substantially rectangular shape on the upper and lower surfaces as a whole. In addition, the upper part (surface side on which the electronic component 50 is placed) of the circuit board 10 of the electronic component attachment body 100 is the first attachment portion 110, and the lower part (the surface side on which the electronic component 50 is not placed). The portion is referred to as a second attachment portion 150. The first mounting portion 110 is formed so as to surround the entire outer periphery of the electronic component 50, the upper surface of the electronic component 50 is exposed, and the upper surface of the first mounting portion 110 is higher than the upper surface of the electronic component 50 (main body case 51). Try to be positioned low. A circular recess 111 reaching the upper surface of the metal terminal 53 is provided in a portion of the first mounting portion 110 located immediately above the metal terminal 53 of the electronic component 50. As shown in FIG. 6, the top surface of the tip portion of the metal terminal 53 is exposed at a part (only a part) of the bottom surface of each recess 111. Further, three guide protrusion insertion recesses 113a, 113b, 113c, which are recessed so as to expose the upper portions of the outer peripheral side surfaces 51a to 51d of the main body case 51, are formed in a portion surrounding the main body case 51 of the electronic component 50 of the first mounting portion 110. Is provided. Two of the three guide protrusion insertion recesses 113a and 113b are formed from the resin injection protrusions 57 of the main body case 51 from almost the entire upper portions of the outer peripheral side surfaces 51c and d that do not protrude the metal terminal 53 of the main body case 51. It is formed in a substantially L shape over both end portions of the provided outer peripheral side surface 51b. Another guide projection insertion recess 113 c is formed at a position between the two metal terminals 53 on the outer peripheral side surface 51 a of the main body case 51. On the other hand, the second mounting portion 150 has the same outer shape as the outer shape of the first mounting portion 110, and a concave portion 151 having a small protrusion in the center, which is the remaining gate, is formed at the gate connection place in the center.

  According to the mounting structure of the electronic component 50 to the circuit board 10, the circuit board 10 and the electronic component 50 can be reliably integrated by the electronic component mounting body 100.

  Next, a method for attaching the electronic component 50 to the circuit board 10 will be described. First, as shown in FIGS. 8 and 9, the electronic component 50 is placed on the upper surface of the circuit board 10. At this time, each metal terminal 53 of the electronic component 50 is bonded onto each conductive pattern 13 of the circuit board 10. Next, as shown in FIGS. 10, 11, and 12, the upper and lower sides of the electronic component 50 and the circuit board 10 are sandwiched between molds (first and second molds) 200 and 300, and the first and second molds are held. The electronic component 50 and the circuit board 10 are accommodated in the 200, 300. 10 to 12 are views showing a state in which the electronic component 50 and the circuit board 10 are housed in the first and second molds 200 and 300, and FIG. 10 is a cross section cut along the same cross section as FIG. 11 is a cross-sectional view taken along the same cross section as FIG. 5, and FIG. 12 is a cross-sectional view taken along the same cross section as FIG. As shown in these drawings, in the first and second molds 200 and 300, the cavity C1 surrounding the outer peripheral side surfaces 51a to 51d of the electronic component 50 and the opposite surface on which the electronic component 50 of the circuit board 10 is placed. A side cavity C2 is formed. The cavity C1 is for molding the first mounting part 110, and the cavity C2 is for molding the second mounting part 150.

  As shown in FIGS. 10 and 11, the first mold 200 has three guide protrusions 201a, b, and c projecting into the cavity C1. The guide protrusions 201a, 201b, and 201c are formed on the outer peripheral side surfaces 51a to 51d of the electronic component 50 except for the portion provided with the resin injection protrusion 57 of the main body case 51 and the portion protruding the metal terminal 53. In this way, the electronic component 50 is positioned by projecting and guiding it into the cavity C1. Specifically, the guide protrusions 201a and 201b are formed on both the outer peripheral side surfaces 51c and d of the main body case 51 that do not protrude from the metal terminal 53 and the outer peripheral side surface 51b of the main body case 51 provided with the resin injection protrusions 57. It is formed in a substantially L shape over the position of the end portion without the resin injection projection 57 and guides the main body case 51, and forms the guide projection insertion recesses 113a and 113b. The guide protrusion 201c is formed at a position between the metal terminal 53 on the opposite outer peripheral side surface 51a where the resin injection protrusion 57 of the main body case 51 is provided and guides the main body case 51. The guide projection insertion recess 113c is formed.

  As shown in FIG. 12, the first mold 200 is provided with four contact pins 230 (two shown in FIG. 12) projecting into the cavity C1. Each abutment pin 230 abuts only a part of its front end surface on the front end portion of each of the four metal terminals 53 joined to the conductive pattern 13 of the circuit board 10, and each metal terminal 53 is brought into contact with the upper surface side. I support it. The four recesses 111 are formed by the contact pins 230.

  On the other hand, as shown in FIGS. 10 and 11, a substantially rectangular cavity C <b> 2 is formed in the second mold 300, and one resin injection port (gate) 301 is provided at the center in the upward direction. Is provided.

  Then, the melt molding resin is filled into the cavities C2 and C1 from the resin injection port 301, and after cooling, the first and second molds 200 and 300 are removed, and the electronic component mounting body 100 is molded. The electronic component 50 is attached to the circuit board 10 by the attachment body 100.

  By the way, when the melt molding resin is filled in the cavities C2 and C1, fluid pressure of the melt molding resin is applied to the circuit board 10 and the electronic component 50, and the position of the electronic component 50 with respect to the circuit board 10 is shifted, or the conductive pattern 13 And a gap is likely to occur between the joint surfaces of the metal terminal 53 and the metal terminal 53. However, the electronic component 50 is positioned by the three guide protrusions 201a, b, c, and the circuit board 10 is fixed by being sandwiched between the first and second molds 200, 300. The position of the electronic component 50 does not shift with respect to the circuit board 10 due to the fluid pressure of the molten resin. Further, since the contact pin 230 is in contact with the opposite surface side of the metal terminal 53 in contact with each conductive pattern 13, the surface on which the electronic component 50 of the circuit board 10 is not placed by the fluid pressure of the molten resin. Even if a strong fluid pressure is applied from the side (resin inlet 301 side on the opposite side of the circuit board 10 on which the electronic component 50 is installed), the metal terminal 53 and the circuit board 10 bonded thereto are made of melt-molded resin. The positional deviation is not caused by bending due to pressure or the like, and the connection state between the joint surfaces of the conductive pattern 13 and the metal terminal 53 can be reliably maintained. Also from this point, the conductive pattern 13 of the circuit board 10 is surely maintained. The electronic component mounting body 100 can be formed while the metal terminal 53 of the electronic component 50 is connected to the electronic component 50.

  By the way, according to this embodiment, when the electronic component 50 and the circuit board 10 are accommodated in the first and second molds 200 and 300 as described above, the resin injection protrusion 57 of the main body case 51 of the electronic component 50. Since the outer peripheral side surface excluding the portion provided with at least three outer peripheral side surfaces 51a, c, d without the resin injection projection 57 is guided by the guide projections 201a, b, c, the electronic component 50 is positioned. The guide of the electronic component 50 by the protrusions 201a, b, c is not obstructed by the resin injection protrusion 57. For this reason, the guide (positioning) of the electronic component 50 in the first and second molds 200 and 300 is ensured. For this reason, as described above, it is possible to reliably prevent the electronic component 50 from being displaced when the cavities C1 and C2 are filled with the melt-molded resin. The electronic component mounting body 100 can be molded while the metal terminals 53 are connected.

  In particular, in the case of this embodiment, the guide protrusions 201a, b, and c also interfere with the outer peripheral side surface 51b (both ends) of the main body case 51 of the electronic component 50 provided with the resin injection protrusions 57. Therefore, the guide (positioning) of the electronic component 50 in the first and second molds 200 and 300 is further ensured, so that no positional deviation occurs, and the conductive pattern of the circuit board 10 is more reliably secured. The electronic component mounting body 100 can be molded while the metal terminal 53 of the electronic component 50 is connected to the connector 13.

  On the other hand, in this embodiment, since only a part of the front end surface of the contact pin 230 is in contact with the front end portion of the metal terminal 53, the electronic component 50 is very miniaturized and the entire metal terminal 53 is connected to the contact pin. Even when it cannot contact 230, the metal terminal 53 and the circuit board 10 bonded to the metal terminal 53 can be reliably supported at the time of filling with the molten molding resin. Further, when the substantially entire surface of the contact pin 230 is in contact with the upper surface of the metal terminal 53, the area of the exposed surface of the upper surface of the metal terminal 53 is increased after the electronic component mounting body 100 is formed, and the metal terminal 53 is held by that amount. Although the presser strength is weakened and the connection between the metal terminal 53 and the conductive pattern 13 may be hindered, this can also be prevented.

  FIGS. 13 and 14 are views showing a structure for mounting an electronic component manufactured using another embodiment of the present invention to a circuit board. FIG. 13 is a perspective view seen from the upper side, and FIG. FIG. In both drawings, the same or corresponding parts as those in the embodiment shown in FIGS. Note that matters other than those described below are the same as those in the embodiment shown in FIGS. In this embodiment, the electronic component 50 manufactured using the above embodiment differs from the mounting structure on the circuit board 10 in that the electronic component mounting body 100 protrudes from the outer periphery of the electronic component mounting body 100 and enters the inside thereof. In order to provide the mounting portion 153 at the point where the mounting portion 153 having the mounting engaging portion (hereinafter referred to as “mounting hole”) 155 is integrally formed and the outer peripheral side opposite to the side where the drawing portion 15 of the circuit board 10 is provided. This is only a short point.

  The attachment portion 153 is formed so as to protrude in a rectangular shape from the outer periphery of the second attachment portion 150 of the electronic component attachment body 100, and an attachment hole 155 penetrating in a circular shape is provided at the center thereof. In other words, the cavities C1 and C2 of the first and second molds 200 and 300 are formed so that the mounting portion 153 having such a structure can be provided. The reason why the mounting portion 153 having the mounting hole 155 is integrally formed in the electronic component mounting body 100 is as follows. That is, for example, the electronic component 50 of this embodiment is a Hall element as described above, but the electronic component 50 is a door provided with a liquid crystal display unit or the like with respect to an operation main unit provided with various keys of a mobile phone, for example. When used as a detection sensor that detects whether the part is open or closed, for example, a position where the magnet is attached near the tip of the door (near the end opposite to the hinge side) and faces the magnet of the operation body The electronic component 50 is installed. This makes it possible to detect whether the door is open or closed. In this case, both the magnet and the electronic component 50 are quite small (for example, the size of the electronic component 50 is about 2 mm on the longer side of the main body case 51). The component 50 cannot be operated by a magnet. Therefore, the mounting part 153 as described above is provided directly and integrally with the electronic component mounting body 100 itself, and the mounting hole 155 is used to attach to a fixing member such as a case of a mobile phone by using, for example, a screw. The attached electronic component 50 is configured to be accurately attached (positioned) to the mobile phone. For example, when a metal terminal of an electronic component is attached to the conductive pattern of the circuit board by soldering, when the solder melts, a force such as surface tension is applied and moved to thereby improve the position accuracy of the electronic component relative to the circuit board. It cannot be increased, and the above-described effect does not occur.

  Although the embodiments of the present invention have been described above, the present invention is not limited to the above-described embodiments, and various modifications can be made within the scope of the technical idea described in the claims and the specification and drawings. Is possible. It should be noted that any shape, structure, and material not directly described in the specification and drawings are within the scope of the technical idea of the present invention as long as the effects and advantages of the present invention are exhibited. For example, although the Hall element is used as the electronic component 50 in the above example, the electronic component 50 may be various magnetic sensors other than the Hall element, and may be various electronic components other than the magnetic sensor (for example, a light emitting element). In the above example, a flexible circuit board is used as the circuit board 10, but other various circuit boards such as a hard board may be used. In the above example, the two first and second molds 200 and 300 are used as the molds. However, molds having other various structures may be used. It goes without saying that the shapes of the cavities C1 and C2 can be variously changed. In the above example, the guide protrusions 201a, 201b, and 201c are provided on all (four) outer peripheral sides 51a to 51d including both ends of the outer peripheral side surface 51b provided with the resin injection protrusion 57 of the main body case 51. However, it is not always necessary to guide all the outer peripheral sides 51a to 51d. For example, a portion that guides the outer peripheral side surface 51b provided with the resin injection protrusions 57 may be omitted. The point is that the electronic component 50 may be positioned by guiding at least one of the outer peripheral side surfaces (preferably the remaining three side surfaces) excluding the portion provided with the resin injection protrusion 57 of the main body case 51.

It is the perspective view which looked at the attachment structure to the circuit board 10 of the electronic component 50 from the upper side. It is the perspective view which looked at the attachment structure to the circuit board 10 of the electronic component 50 from the lower side. It is the perspective view which made the back side of FIG. 1 the near side. It is the sectional view on the AA line of FIG. It is the BB sectional view taken on the line of FIG. It is CC sectional view taken on the line of FIG. FIG. 7A is a perspective view, FIG. 7B is a perspective view in which the back side of FIG. 7A is the front side, and FIG. 7C is a side view. It is. It is explanatory drawing of the attachment method to the circuit board 10 of the electronic component 50. FIG. It is explanatory drawing of the attachment method to the circuit board 10 of the electronic component 50. FIG. It is explanatory drawing of the attachment method to the circuit board 10 of the electronic component 50. FIG. It is explanatory drawing of the attachment method to the circuit board 10 of the electronic component 50. FIG. It is explanatory drawing of the attachment method to the circuit board 10 of the electronic component 50. FIG. It is the perspective view which looked at the attachment structure to the circuit board 10 of the electronic component 50 from the upper side. It is the perspective view which looked at the attachment structure to the circuit board 10 of the electronic component 50 from the lower side.

Explanation of symbols

DESCRIPTION OF SYMBOLS 10 Circuit board 13 Conductive pattern 50 Electronic component 51 Main body case 51a, b, c, d Outer peripheral side surface 53 Metal terminal 57 Protrusion 100 for resin injection Electronic component attachment body 200 1st metal mold | die (metal mold | die)
201a, b, c Guide protrusion 230 Contact pin 300 Second mold (mold)
C1, C2 Cavity 153 Mounting portion 155 Mounting hole (Mounting engagement portion)

Claims (4)

An electronic component that protrudes a metal terminal from the outer peripheral side surface of the resin main body case and has a resin injection protrusion on one side surface of the outer peripheral side surface of the main body case;
A circuit board provided with a conductive pattern for joining the metal terminals of the electronic component;
Prepare the mold and
The electronic component and the circuit board are housed in a mold in a state where the conductive pattern of the circuit board and the metal terminal of the electronic component are joined, and at that time, a portion surrounding the outer peripheral side surface of the electronic component in the mold, A cavity is formed on the opposite surface side on which the electronic component is placed, and at the same time, the outer peripheral side surface of the main body case excluding the portion provided with the resin injection protrusion is guided by the guide protrusion protruding from the mold into the cavity. And positioning the electronic component,
A method of attaching an electronic component to a circuit board, wherein the electronic component is attached to the circuit board by an electronic part attachment body formed by removing a mold after filling a cavity with a molten molding resin and cooling.   The guide protrusion is also provided at a position for guiding both ends of the main body case where the resin injection protrusion is not provided on the outer peripheral side surface where the resin injection protrusion is provided to position the electronic component. A method for attaching the electronic component according to claim 1 to a circuit board.   When the electronic component and the circuit board are stored in a mold, a metal in which only a part of the front end surface of a contact pin provided so as to protrude from the mold into the cavity is bonded to the conductive pattern The method for attaching an electronic component to a circuit board according to claim 1 or 2, wherein the electronic component is brought into contact with a tip portion of the terminal.   The said electronic component attachment body is integrally formed with the attachment part which protrudes from the outer periphery of this electronic component attachment body and has an attachment engagement part in the inside. To attach electronic parts to circuit board.

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