JP4360989B2 - Rotating electronic component substrate and method of manufacturing rotating electronic component substrate - Google Patents

Description

  The present invention relates to a rotary electronic component substrate used for a semi-fixed variable resistor and the like, and a method for manufacturing the rotary electronic component substrate.

  Conventionally, a chip-type semi-fixed variable resistor includes a ceramic substrate, a slider, and a current collector plate. The slider is disposed on the upper surface of the ceramic substrate and the current collector plate is disposed on the lower surface of the ceramic substrate. In this case, the cylindrical protrusion provided on the current collector plate is inserted into the through hole provided in the ceramic substrate and the fitting insertion hole provided in the slider, and the tip of the cylindrical protrusion is caulked to thereby attach the slider to the ceramic substrate. It was configured to be pivotable on the top. Then, by rotating the slider, the sliding contact provided on the slider slidably contacts the surface of the horseshoe-shaped resistor pattern provided on the ceramic substrate, whereby the terminal pattern provided on both ends of the resistor pattern. The resistance value between the current collector plate and the current collector plate was changed.

However, the semi-fixed variable resistor uses a ceramic substrate, and a resistor pattern has to be baked on the ceramic substrate. Therefore, the production efficiency is low, the material cost is high, and the cost is reduced. There was a limit. Further, the ceramic substrate is easily damaged, and it is difficult to further reduce the thickness.
JP-A-11-307317

  SUMMARY OF THE INVENTION The present invention has been made in view of the above-mentioned points, and its purpose is to provide a rotating electronic component substrate and a rotating device that have high production efficiency, can reduce material costs, can be reduced in cost, and can be easily reduced in thickness. Another object of the present invention is to provide a method for manufacturing a substrate for electronic electronic components.

The invention according to claim 1 of the present invention provides an insulating base made of a synthetic resin, a conductive pattern on which a slider is slidably contacted on the surface of the synthetic resin film, and a terminal pattern connected to the conductive pattern. A flexible circuit board to be mounted on the base, a metal terminal to be attached to the insulating base in a state connected to the terminal pattern of the flexible circuit board, insert-molded on the insulating base, and installed inside the insulating base And a current collector plate that has a terminal connection portion that protrudes radially outward from the outer periphery of the cylindrical protrusion, and is inserted into the insulating base of the terminal connection portion of the current collector plate At least a part of the molded part is in contact with the surface of the flexible circuit board .

In the invention described in immediate Chi the claims 1, part being insert molded into the insulating base of the terminal connecting portion of the current collector plate, as in the first embodiment, in its entirety to the surface of the flexible circuit board The terminal connection part may be in contact with the surface of the flexible circuit board and the surface of the part may be opposite to the side on which the flexible circuit board of the insulating base is installed as in the third embodiment. It may be the case where it is exposed on the surface of the side.

According to the second aspect of the present invention, there is provided a flexible circuit board comprising a conductive pattern on which a slider is slidably contacted on a surface of a synthetic resin film, a terminal pattern connected to the conductive pattern, a metal terminal, and a cylinder A current collector plate having a pin-like protrusion and a terminal connecting portion protruding radially outward from the outer periphery of the cylindrical protrusion, and a mold having a cavity formed in the outer shape of the electronic component substrate The flexible circuit board, the metal terminals, and the current collector are housed in the mold cavity, and the surface of the flexible circuit board on which the conductor pattern is provided is brought into contact with one surface of the cavity. At the same time one end of the metal terminal to the terminal pattern contact causes further at least a portion of the terminal connecting portion of the collector plate in contact with the surface of the flexible circuit board in the cavity, the key The mold resin is filled after the molten molding resin is solidified in the bite, and the mold is removed, so that the flexible circuit board is insert-molded on the insulating base made of molding resin so that the conductor pattern is exposed. attached at the same time, the metal terminal and the current collector plate embeds by insert molding, further wherein at least a portion of said terminal connecting portions of the insert molded collector plate in the insulating base, the surface of the flexible circuit board The electronic component substrate manufacturing method is characterized in that the electronic component substrate is brought into contact .

The invention according to claim 3 of the present invention exposes an insulating base made of synthetic resin, a conductive pattern having a slider slidingly contacting the surface of the synthetic resin film, and a terminal pattern connected to the conductive pattern. A flexible circuit board provided on the insulating base; a cylindrical protrusion which is insert-molded on the insulating base and installed inside the insulating base; and radially outward from the outer periphery of the cylindrical protrusion. And a portion of the terminal connection portion of the current collector plate that is insert-molded on the insulating base, at least a portion of which is formed on the flexible circuit board. The substrate for a rotary electronic component is in contact with a surface.

In the invention described in immediate Chi the claims 3, portions are insert molded in the insulating base of the terminal connecting portion of the current collector plate is, to its entirety may be in contact with the surface of the flexible circuit board, terminals There may be a case where a part of the connecting portion abuts on the surface of the flexible circuit board and a part of the surface is exposed on the surface of the insulating base opposite to the side where the flexible circuit board is installed.

  According to the first aspect of the present invention, since the flexible circuit board, the current collector plate and the metal terminal are integrally formed on the insulating base, the flexible base circuit board, the current collector plate, and the metal terminal are provided with the insulating base. In addition, the fixing process of the metal terminals to the insulating base and the electrical connection of the metal terminals to the terminal pattern can be easily and reliably performed.

According to the invention described in claim 1, by abutting the terminal connection portion to the lower surface of the flexible circuit board, the strength can increase the insulating base in the thickness to be formed on the lower side of the terminal connecting portion Can be strong.

According to the invention described in claim 2 , since the flexible circuit board and the current collector plate and the metal terminal are simultaneously insert-molded on the insulating base, the individual flexible circuit board, the current collector and the metal terminal can be attached to the insulating base. An attachment process becomes unnecessary.

According to the second aspect of the present invention, the rotary electronic component substrate according to the first aspect can be easily manufactured.

According to the invention described in claim 3 , since the flexible circuit board and the current collector plate are simultaneously insert-molded on the insulating base, the step of attaching the individual flexible circuit board and the current collector plate to the insulating base becomes unnecessary. .

According to the third aspect of the present invention, by bringing the terminal connection portion into contact with the lower surface of the flexible circuit board, the thickness of the insulating base formed on the lower side of the terminal connection portion can be increased and its strength is increased. it can.

Hereinafter, reference examples and embodiments of the present invention will be described in detail with reference to the drawings.
[First Reference Example ]
1A and 1B are diagrams showing a rotary electronic component substrate 1-1 according to a first reference example of the present invention. FIG. 1A is a plan view, and FIG. 1B is an A- A sectional view and FIG.1 (c) are back views. As shown in the figure, the rotary electronic component substrate 1-1 is configured by integrally attaching a flexible circuit board 20, a current collecting plate 50, and metal terminals 70, 70 to an insulating base 10 by insert molding. . Each component will be described below.

  The insulating base 10 is a substantially rectangular and plate-shaped synthetic resin molded product, and has an inner diameter dimension larger than the outer diameter dimension of the cylindrical protrusion 53 in which a cylindrical protrusion 53 of the current collector plate 50 described below is arranged at the center. The circular through hole 11 is provided on the metal terminal 70, 70 on the side where the metal terminal 70, 70 and the terminal pattern 29, 29 (see FIG. 2C) of the flexible circuit board 20 described below are provided. One linear pressing portion 13 for pressing the side is provided, and one arc-shaped pressing portion 15 for pressing this is also provided on the end side of the flexible circuit board 20 facing the end side. In addition, rectangular openings 17 and 17 are provided on the lower surface side of the portion where the terminal patterns 29 and 29 of the flexible circuit board 20 and the metal terminals 70 and 70 are in contact with each other. The insulating base 10 is made of a thermoplastic synthetic resin, such as nylon or polyphenylene sulfide (PPS).

  The flexible circuit board 20 is configured by providing terminal patterns 29 and 29 (see FIG. 2C) on a synthetic resin film (for example, polyimide film) and a conductor pattern 25 on which the slider 60 described below is in sliding contact. ing. That is, the flexible circuit board 20 is provided with a through hole 21 having the same inner diameter at a position corresponding to the through hole 11 in the center of the synthetic resin film, and a conductor surrounding the through hole 21 on the surface thereof in a horseshoe shape. A pattern (hereinafter referred to as a “resistor pattern” in each embodiment) 25 is provided, and terminal patterns 29 and 29 are connected to the resistor pattern 25 at both ends of the resistor pattern 25, respectively.

  Here, FIG. 2 is a view showing a method of manufacturing the flexible circuit board 20. That is, in order to manufacture the flexible circuit board 20, first, as shown in FIG. 2A, a large-sized synthetic resin film (for example, polyimide film) 20A is prepared, and portions to be the terminal patterns 29 and 29 and the resistor pattern 25 are prepared. The first terminal pattern portions 29A and 29A are formed on the portions that are in contact with both ends of the first terminal pattern portion 29A.

  Next, as shown in FIG. 2 (b), a resistor pattern 25 is formed on the synthetic resin film 20A. At this time, both ends of the resistor pattern 25 are placed on a part of the first terminal pattern portions 29A and 29A. Connecting. On the other hand, the terminal patterns 29 and 29 are formed by forming the second terminal pattern portions 29B and 29B so as to cover the portions of the first terminal pattern portions 29A and 29A where the resistor pattern 25 is not formed.

  Here, the first terminal pattern portions 29A and 29A are formed by printing and baking a conductive paste (a conductive paste obtained by kneading silver powder in a phenolic resin binder and solvent), and the second terminal pattern portions 29B and 29B are rubber. It is formed by printing and baking a conductive paste having elasticity (a conductive paste in which silver powder is kneaded with a urethane-based rubber elastic resin binder and a solvent). Accordingly, the second terminal pattern portions 29B and 29B become a conductor having rubber elasticity.

On the other hand, the resistor pattern 25 is configured by printing and baking a carbon paste. The resistor pattern 25 may be formed of a metal thin film by physical vapor deposition or chemical vapor deposition instead of being formed by carbon paste. As a method of physical vapor deposition, vacuum vapor deposition, sputtering, ion beam vapor deposition, or the like is used. As a chemical vapor deposition method, a thermal CVD method, a plasma CVD method, a photo CVD method or the like is used. As the material of the resistor pattern 25 to be deposited, a nickel-based material such as a nickel-chromium alloy, a cermet-based material made of a chromium silicate-based compound (Cr—SiO ₂ ), or a tantalum-based material such as tantalum nitride is used. . Since the chromium silicate compound can easily realize a large specific resistance of 2000 μΩ · cm or more, it is suitable for miniaturization of the substrate for rotary electronic components 1-1. The resistor pattern 25 using the carbon paste is suitable because it is easy to manufacture and can be formed at low cost. However, since the conductive powder is mixed in the resin, the resin is easily affected by heat and humidity, and its resistance. The value is likely to change with changes in temperature and humidity. On the other hand, in the case of the resistor pattern 25 by metal vapor deposition, the manufacturing is more complicated than the printing of the carbon paste, and the cost cannot be reduced. However, the entire resistor pattern 25 can be formed in a uniform thickness. Since there is no resin inside, there is an advantage that the resistance value hardly changes due to heat or temperature.

  Then, as shown in FIG. 2C, by cutting the large synthetic resin film 20A, the through hole 21 is formed at the center of the resistor pattern 25, and at the same time, the outer shape thereof is changed to the shape of the flexible circuit board 20. Thus, the flexible circuit board 20 is completed. At that time, connecting portions 31, 31 protrude from both sides of the flexible circuit board 20, and the same multiple flexible circuit boards 20 are connected in parallel by these connecting portions 31, 31.

  Returning to FIG. 1, the current collecting plate 50 is made of a metal plate, and is provided with a cylindrical protrusion 53 projecting perpendicularly to the surface of the base 51 in a substantially rectangular shape and a flat plate shape. A substantially band-shaped terminal connecting portion 55 is projected from the outside toward the outer side of the cylindrical projection 53 in the radial direction. A bent portion 57 is provided at a portion protruding from the insulating base 10 of the terminal connection portion 55, so that the lower surface on the tip side is used as a connection surface 59. The surface of the base 51 and the connection surface 59 are parallel surfaces. The bent portion 57 of the current collector plate 50 may be provided in advance before the insulating base 10 is molded, or may be formed after molding without being provided before the insulating base 10 is molded.

  The metal terminal 70 is a band-shaped metal plate having one end substantially T-shaped, and a bent portion 71 is provided in the middle portion thereof, so that the lower surface on the flexible circuit board 20 side at one end is used as the connection surface 73. The lower surface of the end protruding from the insulating base 10 at the other end is used as the connection surface 75. Both connection surfaces 73 and 75 are planar. The bent portion 71 of the metal terminal 70 may also be provided in advance before the insulating base 10 is formed, or may be formed after forming without being provided before the insulating base 10 is formed.

  In order to manufacture the rotating electronic component substrate 1-1 using each of the above components, first, each flexible circuit board 20, the current collector plate 50, the metal terminal 70, 70 is inserted into the molds 41 and 45 as shown in FIG. At this time, a cavity C1 having the same shape as the outer shape of the insulating base 10 is formed in the molds 41 and 45. The flexible circuit board 20 has a resistor pattern 25 forming surface on the mold of the cavity C1. It is in contact with the plane C11 on the 41 side. In addition, the base 51 of the current collector plate 50 is sandwiched between protrusions 43 and 47 provided on both molds 41 and 45. These protrusions 43 and 47 are formed in a columnar shape having substantially the same outer diameter as the inner diameter of the through hole 21 of the flexible circuit board 20, and are joined via the base 51 to form the through hole 11 of the insulating base 10. Is formed. In addition, in the portion where the terminal pattern 29 of the flexible circuit board 20 and the connection surface 73 of the metal terminal 70 are in contact, pressing portions 44 and 48 are provided to sandwich them from above and below. The pressing portion 44 on the surface side of the terminal pattern 29 is constituted by a long stepped portion that simultaneously presses the two metal terminals 70, 70, while the pressing portion 48 on the side opposite to the surface side of the terminal pattern 29 is made of each metal It is comprised by the two rectangular protrusions which protrude in the cavity C1 corresponding to the terminals 70 and 70. FIG. The two pressing portions 48 and 48 form the openings 17 and 17 (see FIG. 1C) of the insulating base 10.

  Then, a synthetic resin (nylon, PPS, etc.) heated and melted from a resin injection port (position in the mold 45 corresponding to the point P1 shown in FIG. 1C) provided on the mold 45 side is press-fitted and filled. Fill the cavity C1. After the molten synthetic resin is cooled and solidified, the molds 41 and 45 are removed, and the connecting portions 31 and 31 protruding from both sides of the molded insulating base 10 are cut. When the bent portions 71 and 71 of the metal terminals 70 and 70 and the bent portion 57 of the terminal connection portion 55 are not formed in advance, the substrate 1-1 for the rotary electronic component is completed by forming these.

As shown in FIG. 1, the completed rotary electronic component substrate 1-1 is formed by insert-molding a flexible circuit board 20, a current collector plate 50, and metal terminals 70, 70 on an insulating base 10. The resistor pattern 25 of the flexible circuit board 20 is exposed on the surface of the rotary electronic component board 1-1, and the metal terminals 70 and 70 protrude from the outer periphery of the insulating base 10, and the connection surface 73 is formed on the flexible circuit. Abutting on the terminal patterns 29, 29 of the substrate 20, the upper part is pressed and fixed by the pressing part 13. At the same time, the pressing portion 13 is fixed by covering one end of the flexible circuit board 20 on the side where the terminal patterns 29 and 29 are provided with the pressing portion 13. Further, the other end side of the flexible circuit board 20 on the side facing the end side on which the terminal patterns 29 and 29 are provided is also fixed by being covered with the presser portion 15. Further, the outer peripheral portion of the base 51 of the current collector plate 50 is embedded in the insulating base 10, and the cylindrical projection 53 is exposed in the through holes 11 and 21 and is installed inside the insulating base 10, and the tip thereof is It protrudes upward from the upper surface of the flexible circuit board 20. Further, in this reference example , the portion of the terminal connection portion 55 of the current collector plate 50 that is insert-molded on the insulating base 10 passes entirely through the intermediate portion of the thickness of the insulating base 10, and further the terminal The connecting portion 55 protrudes from the outer peripheral side surface of the insulating base 10 to the outside. Further, the connection surface 59 of the terminal connection portion 55 protruding from the insulating base 10 of the current collector plate 50 and the connection surface 75 of the metal terminals 70 and 70 are located on the same plane as the lower surface of the insulating base 10. ing.

  If the flexible circuit board 20 and the current collector plate 50 and the metal terminals 70 and 70 are insert-molded on the insulating base 10 as in this rotating electronic component board 1-1, the individual flexible circuit boards 20 and The process of attaching the current collecting plate 50 and the metal terminals 70, 70 to the insulating base 10 is not required, and the metal terminals 70, 70 are fixed to the insulating base 10 and the terminal patterns 29, 29 of the metal terminals 70, 70 are fixed. The electrical connection to can be easily and reliably performed.

  FIG. 4 is a view showing a rotary electronic component (hereinafter referred to as “semi-fixed variable resistor”) 100-1 configured using the above-described rotary electronic component substrate 1-1, and FIG. 4 (b) is a cross-sectional view taken along the line BB of FIG. 4 (a), and FIG. 4 (c) is a rear view. As shown in the figure, the semi-fixed variable resistor 100-1 has a slider 60 disposed on the upper surface of the substrate for rotating electronic components 1-1, and the cylindrical projection 51 provided on the current collector plate 50 at this time. The slider 60 is rotatably mounted by caulking the tip after passing through the fitting insertion hole 61 provided in the slider 60. Then, when the slider 60 is rotated, the sliding contact 63 provided on the slider 60 is in sliding contact with the surface of the resistor pattern 25 (see FIG. 1A) to collect the current with the metal terminals 70, 70. The resistance value between the plates 50 is changed.

  By the way, since the portion insert-molded on the insulating base 10 of the terminal connection portion 55 of the current collector plate 50 is configured to pass through the intermediate portion of the thickness of the insulating base 10, the upper and lower sides of the terminal connection portion 55 are insulated from each other. It will be pinched by the base 10, and the fixation will become reliable.

  As shown in FIG. 5, the semi-fixed variable resistor 100-1 is mounted on the mounting substrate 150, and the connection surface 59 of the terminal connection portion 55 of the semi-fixed variable resistor 100-1 is connected to the mounting substrate 150. The connection pattern 151 is connected to the connection pattern 151 via the solder 155, and the connection surface 75 of the metal terminals 70, 70 on the substantially same plane is connected to the connection pattern 153 provided on the flat mounting board 150 via the solder 157. . At this time, connection means with a high temperature such as melting the solders 155 and 157 is used. However, in this embodiment, the metal terminals 70 and 70 are used, so that the connection means with a high temperature to the mounting substrate 150 is used. The terminal patterns 29 and 29 and the flexible circuit board 20 can be made of a material that is weak against heat.

[ First embodiment ]
6A and 6B are diagrams showing the rotary electronic component substrate 1-2 according to the first embodiment of the present invention. FIG. 6A is a plan view, and FIG. 6B is an E-line in FIG. E sectional drawing and FIG.6 (c) are back views. In the rotary electronic component substrate 1-2 shown in the figure, the same or corresponding parts as those of the rotary electronic component substrate 1-1 are denoted by the same reference numerals, and detailed description thereof is omitted. That is, the rotary electronic component board 1-2 is also configured by integrally attaching the flexible circuit board 20, the current collecting plate 50, and the metal terminals 70 to the insulating base 10 by insert molding.

  In the rotary electronic component board 1-2, the main difference from the rotary electronic component board 1-1 is the terminal connection of the current collector plate 50 as in the rotary electronic component board 1-1. Instead of passing the portion of the portion 55 that is insert-molded on the insulating base 10 through the intermediate portion of the thickness of the insulating base 10, the position of the current collector 50 in the insulating base 10 is changed, and the current collector plate A point where the insert-molded portion of the 50 terminal connection portions 55 in the insulating base 10 is in contact with the flexible circuit board 20 (specifically, the back surface side of the surface on which the conductor pattern 25 is provided); The shape of the bent portion 57 is changed in accordance with the change of the position of the terminal connection portion 55 in the insulating base 10 of the plate 50 so that the position of the connection surface 59 is substantially flush with the position of the lower surface of the insulating base 10. And the terminal connection portion 55 of the current collector plate 50 The point which provided the hole 551 which penetrates the part currently molded by the insert in the edge base 10, and the holes 701 and 701 which penetrate the part molded in the insulating base 10 of the metal terminals 70 and 70 are provided. And the shape of the presser part 13 and the presser part 15 are slightly changed.

  That is, the insulating base 10 is a substantially rectangular plate-shaped synthetic resin molded product. The through hole 11 is provided in the center of the insulating base 10, the presser 13 and the presser 15 are provided, and the back side of the insulating base 10 is provided. The openings 17 and 17 are provided with the same material as in the first embodiment. In addition, openings 131 and 131 of the insulating base 10 are provided on the end portions of the metal terminals 70 and 70 of the holding portion 13 that are in contact with the end sides of the flexible circuit board 20, respectively.

  Next, the hole 551 provided in the current collector plate 50 and the holes 701 and 701 provided in the metal terminals 70 and 70 are both made stronger by connecting the synthetic resins constituting the upper and lower insulating bases 10. The current collector plate 50 and the metal terminals 70 are fixed to the insulating base 10.

  And in order to manufacture this board | substrate 1-2 for rotary electronic components, as shown in FIG. 7, the flexible circuit board 20, the current collection board 50, and the metal terminals 70 and 70 are put in the metal mold | die 41,45. At that time, the upper surface of the terminal connection portion 55 of the current collector plate 50 is brought into contact with the flexible circuit board 20, and thereby the terminal connection portion 55 of the current collector plate 50 is formed in the molded insulating base 10. A portion of the insulating base 10 that is insert-molded is brought into contact with the flexible circuit board 20. At this time, the holes 551 of the current collector plate 50 and the holes 701, 701 of the metal terminals 70, 70 are exposed in the cavity C1, and the molding resin is inserted through the inside thereof, and the terminal pattern 29 of the flexible circuit board 20 is inserted. And the contact surface 73 of the metal terminals 70 and 70 are sandwiched by the pressing portions 44 and 48 from above and below. Here, the point that the pressing portion 48 is constituted by two rectangular protrusions protruding into the cavity C1 corresponding to the respective metal terminals 70, 70 is the same as in the first embodiment. In FIG. 2, the pressing portion 44 is also constituted by two columnar protrusions protruding into the cavity C1 corresponding to the metal terminals 70,70. The two pressing portions 44 and 44 form the openings 131 and 131 of the insulating base 10.

In this embodiment, as described above, the part formed in the insulating base 10 of the terminal connection portion 55 of the current collector plate 50 in contact with the flexible circuit board 20 is configured for the following reason. That is, when the portion of the terminal connection portion 55 of the current collector plate 50 that is insert-molded in the insulation base 10 is positioned at the middle portion of the thickness of the insulation base 10 as in the first reference example , Is fixed by the insulating base 10, so that the fixing is ensured. This state is originally desirable. However, when the thickness of the substrate for rotating electronic components 1-1 is reduced by reducing the size and thickness, the thickness of the insulating base 10 on the upper surface side and the lower surface side of the terminal connection portion 55 is considerably reduced. In addition, the fixing strength of the terminal connection portion 55 by the insulating base 10 may be weakened.

As shown in FIG. 3, when the flexible circuit board 20, the current collector plate 50, etc. are inserted into the molds 41 and 45 and the cavity C1 is filled with the molding resin, the resin in the first reference example is shown in FIG. Since filling is performed from a position in the mold 45 corresponding to the point P1 shown in (c), the distance in the cavity C1 from this position to the terminal connecting portion 55 is long, and the terminal connection is structurally related. There was a problem that the space between the portion 55 and the flexible circuit board 20 was difficult to fill with resin. In particular, if the space is thin, it is difficult to fill the resin.

  Therefore, in this embodiment, by bringing the terminal connection portion 55 into contact with the lower surface of the flexible circuit board 20, the thickness of the insulating base 10 formed on the lower side of the terminal connection portion 55 is increased and the strength thereof is increased. It was. At the same time, since no space is formed between the flexible circuit board 20 and the terminal connection portion 55, the problem that the molding resin hardly enters the space is solved at the same time.

  FIG. 8 is a cross-sectional view (a cross-sectional view of a portion corresponding to FIG. 4B) showing a semi-fixed variable resistor 100-2 configured using the substrate for rotary electronic components 1-2. As shown in the figure, also in this semi-fixed variable resistor 100-2, the slider 60 is arranged on the upper surface of the substrate for rotary electronic component 1-2, and the cylindrical projection provided on the current collecting plate 50 at that time 53 is configured such that the tip of 53 is passed through a fitting insertion hole 61 provided in the slider 60 and then the tip is crimped to attach the slider 60 so as to be rotatable. When the slider 60 is rotated, the sliding contact 63 provided on the slider 60 slides on the surface of the resistor pattern 25 to change the resistance value between the metal terminals 70 and 70 and the current collector plate 50. To do.

[ Second Embodiment ]
FIG. 9 is a view showing a state in which the semi-fixed variable resistor 100-3 configured using the rotary electronic component substrate 1-3 according to the second embodiment of the present invention is mounted on the mounting substrate 160. FIG. This semi-fixed variable resistor 100-3 is a type in which the slider 60 attached thereto is attached to the mounting substrate 160 side, and is different from the rotary electronic component substrate 1-2 of the first embodiment. Only the shape of the portion protruding from the insulating base 10 of the terminal connection portion 55 of the current collector plate 50 and the shape of the portion protruding from the insulating base 10 of the metal terminals 70 and 70 are shown. Since other points are the same as those of the first embodiment , detailed description thereof is omitted.

That is, the current collecting plate 50 according to this embodiment is provided with a cylindrical protrusion 53 protruding from the center of the substantially rectangular and flat plate-like base 51 perpendicularly to the surface thereof , as in the first embodiment . A substantially band-like terminal connection portion 55 is projected from the outer periphery toward the outer side in the radial direction of the cylindrical protrusion 53, but unlike the first embodiment , from the insulating base 10 of the terminal connection portion 55. The bending direction of the bent portion 57 provided in the protruding portion is opposite to that in the first embodiment, that is, from the flat surface of the base portion 51 toward the cylindrical protrusion 53, thereby the slider 60 of the insulating base 10. A flat connection surface 59 is provided in parallel with the base 51 protruding to the surface side to which the lens is attached. The connection surface 59 faces the surface of the rotary electronic component substrate 1-3 on which the slider 60 is attached.

Metal terminal 70, like the first embodiment, one end in the strip is substantially T-shaped metal plate, different from the first embodiment, provided in a portion protruding from the insulating base 10 bent The part 71 is protruded in the direction opposite to that of the first embodiment , that is, the surface to which the slider 60 of the insulating base 10 is attached. The current collector plate 50 is positioned substantially on the same plane as the connection surface 59 of the current collector plate 50. The connection surface 75 faces the surface of the rotary electronic component board 1-3 on which the slider 60 is attached.

  On the other hand, the mounting board 160 has an outer diameter dimension of the insulating base 10 and the slider 60 at a position facing the insulating base 10 and the slider 60 of the semi-fixed variable resistor 100-3 attached to the mounting board 160. An opening (adjustment hole) 161 having a larger inner diameter is provided, and the connection pattern 163 and the connection surfaces of the metal terminals 70 and 70 are arranged at positions on the upper surface around the opening 161 facing the connection surface 59 of the current collector plate 50. Connection patterns 165 and 165 are provided at positions facing 75 and 75.

  As shown in FIG. 9, the semi-fixed variable resistor 100-3 configured by attaching the slider 60 to the rotary electronic component substrate 1-3 is mounted on the surface on which the slider 60 is attached. The slider 60 is placed opposite to the upper surface of the substrate 160, and the slider 60 is opposed to the opening 161. At the same time, the connection surface 59 of the current collector plate 50 and the connection surfaces 75 and 75 of the metal terminals 70 and 70 are respectively connected. The solders 171 and 173 are melted and solidified by reflowing or the like on the patterns 163, 165 and 165, and both are electrically and mechanically connected and attached. If the slider 60 is rotated from the back surface (lower surface) side of the mounting substrate 160 by an adjustment jig (not shown) inserted into the opening 161 (for example, a plus or minus driver), the slide provided on the slider 60 is provided. The contact 63 slides on the surface of the resistor pattern 25 (see FIG. 6A) to change the resistance value between the metal terminals 70 and 70 and the current collector plate 50.

Note that, as in this embodiment, the substrate for a rotary electronic component used in the semi-fixed variable resistor 100-3 having a structure attached to the mounting substrate 160 so that the surface on which the slider 60 is attached faces the mounting substrate 160. 1-3 is the terminal connection portion of the current collector plate 50 in the rotary electronic component substrate 1-1 of the first reference example and the rotary electronic component substrate 1-4 of the second reference example described below . The present invention can be similarly applied only by changing the shape of 55 and the shape of the metal terminals 70 and 70.

[ Second Reference Example ]
FIG. 10 is a cross-sectional view (a cross-sectional view of a portion corresponding to FIG. 1B) of the rotary electronic component substrate 1-4 according to the second reference example of the present invention. In the rotary electronic component substrate 1-4 shown in the figure, the same parts as those of the rotary electronic component substrate 1-1 are denoted by the same reference numerals, and detailed description thereof is omitted. That is, the rotary electronic component board 1-4 differs from the rotary electronic component board 1-1 in that the terminal connection portion 55 of the current collector plate 50 is different from the rotary electronic component board 1-1. Instead of passing the part formed by insert molding on the insulating base 10 through the middle part of the thickness of the insulating base 10, the position of the current collecting plate 50 in the insulating base 10 is changed, and The portion of the terminal connecting portion 55 that is insert-molded on the insulating base 10 is exposed on the surface of the insulating base 10 opposite to where the flexible circuit board 20 is installed, and the insulating base of the current collector 50 In accordance with the change of the position of the terminal connection portion 55 in the base 10, the bent portion 57 is eliminated, and the position of the terminal connection portion 55 is made substantially flush with the position of the lower surface of the insulating base 10 from the base portion 51. The terminal connection 55 is linearly connected to the insulating base 10. A point which projects towards the outside.

  And in order to manufacture this board | substrate 1-4 for rotary electronic components, as shown in FIG. 11, the flexible circuit board 20, the current collection board 50, and the metal terminals 70 and 70 are put in the metal mold | die 41,45. When inserted, the lower surface of the terminal connection portion 55 of the current collector plate 50 is brought into contact with the plane C12 of the mold 45 so that the terminal connection portion 55 of the current collector plate 50 is formed in the insulating base 10 after molding. A portion of the insulating base 10 that is insert-molded is exposed on the surface of the insulating base 10 opposite to the side on which the flexible circuit board 20 is installed.

The reason for this configuration is as follows.
That is, when the portion of the terminal connecting portion 55 of the current collector plate 50 that is insert-molded in the insulating base 10 is positioned in the middle portion of the thickness of the insulating base 10 as in the first reference example , as described above, the terminal Since the upper and lower sides of the connecting portion 55 are sandwiched between the insulating bases 10, the fixing is ensured, and this state is originally desirable. However, when the thickness of the substrate for rotating electronic components 1-1 is reduced by reducing the size and thickness, the thickness of the insulating base 10 on the upper surface side and the lower surface side of the terminal connection portion 55 is considerably reduced. In addition, the fixing strength of the terminal connection portion 55 by the insulating base 10 may be weakened.

As shown in FIG. 3, when the flexible circuit board 20, the current collector plate 50, etc. are inserted into the molds 41 and 45 and the cavity C1 is filled with the molding resin, the resin in the first reference example is shown in FIG. Since filling is performed from a position in the mold 45 corresponding to the point P1 shown in (c), the distance in the cavity C1 from this position to the terminal connecting portion 55 is long, and the terminal connection is structurally related. There was a problem that the space between the portion 55 and the flexible circuit board 20 was difficult to fill with resin. In particular, if the space is thin, it is difficult to fill the resin.

Therefore, in this reference example , the terminal connection portion 55 is exposed on the surface of the insulating base 10 opposite to where the flexible circuit substrate 20 is installed, so that the insulation base between the flexible circuit board 20 and the terminal connection portion 55 is exposed. The thickness of the base 10 is increased to increase its strength. At the same time, by increasing the thickness of the space between the flexible circuit board 20 and the terminal connection portion 55, the molding resin easily enters the space.

  FIG. 12 is a cross-sectional view (a cross-sectional view of a portion corresponding to FIG. 4B) showing a semi-fixed variable resistor 100-4 configured by using the substrate for rotary electronic components 1-4. As shown in the figure, also in the semi-fixed variable resistor 100-4, the slider 60 is disposed on the upper surface of the rotary electronic component substrate 1-4, and the cylindrical protrusion provided on the current collector plate 50 at that time. 53 is configured such that the tip of 53 is passed through a fitting insertion hole 61 provided in the slider 60 and then the tip is crimped to attach the slider 60 so as to be rotatable. When the slider 60 is rotated, the sliding contact 63 provided on the slider 60 slides on the surface of the resistor pattern 25 to change the resistance value between the metal terminals 70 and 70 and the current collector plate 50. To do.

If the position of the terminal connecting portion 55 is set at the position of the lower surface of the insulating base 10 as in this reference example , the positions of the base 51 and the cylindrical projection 53 can be lowered accordingly. The height of the slider 60 attached to the projection 53 can be reduced, and the thickness of the entire rotary electronic component 1-4 can be reduced.

[ Third reference example ]
13A and 13B are views showing a rotary electronic component substrate 1-5 according to a third reference example of the present invention. FIG. 13A is a plan view, and FIG. 13B is a C- C sectional view and FIG. 13C are back views. In the rotary electronic component substrate 1-5 shown in the figure, the same parts as those of the rotary electronic component substrate 1-1 are denoted by the same reference numerals, and detailed description thereof is omitted. That is, the rotary electronic component substrate 1-5 is different from the rotary electronic component substrate 1-1 in that the terminal connection portion 55 of the current collector plate 50 is different from the rotary electronic component substrate 1-1. Is not projected from the outer peripheral side surface of the insulating base 10, the bent portion 57 of the terminal connection portion 55 is provided in the insulating base 10, and the portion closer to the base 51 than the bent portion 57 is an intermediate portion of the thickness of the insulating base 10. The connection surface 59 on the lower surface of the tip side of the bent portion 57 is directly exposed to the lower surface of the insulating base 10. The distal end side of the terminal connecting portion 57 is separated into three by providing two cut lines 57a, and the central portion thereof is a bent portion 57b bent upward so that the solder can be easily attached. When configured in this manner, the terminal connection portion 55 of the current collector plate 50 does not protrude to the outside of the insulating base 10 (or the protruding length to the outside is short), so that the external shape can be reduced in size.

In this reference example , the portion of the terminal connecting portion 55 that is insert-molded on the insulating base 10 passes through an intermediate portion of the thickness of the insulating base 10, a part of which is located on the cylindrical protrusion 53 side, and A part of the surface located on the outer peripheral side of the insulating base 10 is exposed on the surface of the insulating base 10 opposite to the side where the flexible circuit board 20 is installed. Therefore, the effect by the terminal connection part 55 being located in the intermediate part of the thickness of the insulation base 10 demonstrated in the said 1st, 2nd reference example , and the terminal connection part 55 the flexible circuit board 20 of the insulation base 10 are demonstrated. It has the same effect as the effect of being exposed on the surface opposite to the installed side.

[ Third embodiment ]
FIG. 14 is a cross-sectional view (a cross-sectional view corresponding to the cross section of FIG. 13B) showing a substrate 1-6 for a rotary electronic component according to a third embodiment of the present invention. In the rotary electronic component substrate 1-6 shown in the same figure, the same parts as those of the rotary electronic component substrate 1-1 are denoted by the same reference numerals, and detailed description thereof is omitted. That is, this rotary electronic component substrate 1-6 is different from the rotary electronic component substrate 1-1 in that a bent portion 57 of the terminal connection portion 55 is provided in the insulating base 10, and the bent portion 57 Also, the portion on the base 51 side is brought into contact with the flexible circuit board 20 (specifically, the back surface side on which the conductor pattern 25 or the like is not provided), and the connection surface 59 on the lower surface of the tip side of the bent portion 57 is insulated. It is only the point exposed directly on the lower surface of the base 10. The front end side of the terminal connection part 57 is separated into three parts, and the central part thereof is a bent part 57b that is bent upward, so that the solder can be easily attached to the same as in the third reference example . Even in such a configuration, as in the third reference example , the terminal connection portion 55 of the current collector plate 50 does not protrude to the outside of the insulating base 10 (or the protruding length to the outside is short). Miniaturization can be achieved.

In this embodiment, the portion of the terminal connection portion 55 that is insert-molded on the insulating base 10 is in contact with the surface of the flexible circuit board 20 with a portion thereof located on the cylindrical projection 53 side, and is insulated. A part of the surface located on the outer peripheral side of the base 10 is exposed on the surface of the insulating base 10 opposite to the side where the flexible circuit board 20 is installed. Therefore, as described in the first embodiment and the second reference example , the effect of the terminal connecting portion 55 being in contact with the surface of the flexible circuit board 20 and the flexible circuit board 20 of the insulating base 10 are described. It has the same effect as the effect by exposing to the surface on the opposite side to the side which installed.

[ Fourth Reference Example ]
FIG. 15 is a cross-sectional view (a cross-sectional view corresponding to the cross section of FIG. 13B) showing a substrate 1-7 for a rotary electronic component according to a fourth reference example of the present invention. In the rotary electronic component substrate 1-7 shown in the figure, the same parts as those of the rotary electronic component substrate 1-1 are denoted by the same reference numerals, and detailed description thereof is omitted. In other words, the rotary electronic component substrate 1-7 is different from the rotary electronic component substrate 1-1 in that the terminal connection portion 55 of the current collector plate 50 is different from the rotary electronic component substrate 1-1. Is not projected from the outer peripheral side surface of the insulating base 10 and the substantially entire surface (lower surface) of the base 51 of the current collector plate 50 and the portion of the terminal connecting portion 55 that is insert-molded on the insulating base 10 is It is only the point exposed to the surface on the opposite side to the side where the flexible circuit board 20 of the base 10 is installed. The tip end side of the terminal connection part 57 is divided into three parts, and a central part thereof is a bent part 57b that is bent upward so that the solder can be easily attached. When configured in this manner, the terminal connection portion 55 of the current collector plate 50 does not protrude to the outside of the insulating base 10 (or the protruding length to the outside is short), so that the external shape can be reduced in size.

In this reference example , substantially the entire surface (lower surface) of the terminal connection portion 55 is exposed on the surface of the insulating base 10 opposite to the side where the flexible circuit board 20 is installed. Therefore, according to this reference example , the same effect as the effect by which the terminal connection part 55 exposed in the surface on the opposite side to the side which installed the flexible circuit board 20 of the insulation base 10 demonstrated in said 2nd reference example is demonstrated. Have

[ Fifth Reference Example ]
16 and 17 are views showing a rotary electronic component substrate 1-8 according to a fifth reference example of the present invention, in which FIG. 16 (a) is a perspective view seen from above, and FIG. 17 (a) is a plan view, FIG. 17 (b) is a front view, FIG. 17 (c) is a DD cross-sectional view of FIG. 17 (a), and FIG. FIG. In the substrate for rotary electronic components 1-8 shown in the figure, the same parts as those in the substrate for rotary electronic components 1-1 are denoted by the same reference numerals, and detailed description thereof is omitted. Also in this rotary electronic component substrate 1-8, the flexible circuit board 20 is integrally attached to the upper surface of the insulating base 10 by insert molding, and the current collector plate 50 is also integrally formed in the insulating base 10 by insert molding. It is attached. In this reference example , the main points different from the above-described embodiments and reference examples are that the metal terminals 70 and 70 are not attached, but instead, the terminal patterns 29 and 29 provided on the flexible circuit board 20 are used as the insulating base 10. It is the point which is made to act instead of the metal terminals 70 and 70 by exposing outside. Each component will be described below. However, since the material of each member is the same as that of each said embodiment, the description is abbreviate | omitted.

  The insulating base 10 is a substantially rectangular plate body, and a circular through hole 11 is provided at the center thereof.

  The flexible circuit board 20 is provided with a through hole 21 having the same inner diameter at a position corresponding to the central through hole 11 of the synthetic resin film, and a resistor pattern surrounding the through hole 21 on the surface thereof in a horseshoe shape. 25, and terminal patterns 29 and 29 are connected to both ends of the resistor pattern 25, respectively. The side of the flexible circuit board 20 on which the terminal patterns 29 and 29 are provided is folded back from the upper surface of the insulating base 10 to the lower surface side through the outer peripheral side, whereby the flexible circuit board 20 is folded back. It is attached to the insulating base 10 in a state where it is bent so that its upper surface, outer peripheral side surface and lower surface are exposed. Therefore, the resistor pattern 25 is exposed on the upper surface of the insulating base 10, and the terminal patterns 29 and 29 are exposed from the upper surface of the insulating base 10 and the outer peripheral side to the lower surface.

  And in this board | substrate 1-8 for rotary electronic components, the edge 74 used as the edge part (resistor pattern 25 side) of the one side of the length direction (A) in the outer side of the resistor pattern 25 of the flexible circuit board 20 is shown. A presser part 17a having an arc shape covering the two terminal patterns 29 and 29 in a portion in the vicinity of the outer periphery of the end portion (25e, 25e) of the resistor pattern 25 of the flexible circuit board 20. And a flat plate-shaped presser portion 17c on the same surface as the lower surface of the insulating base 10 that covers the edge 73 on the side where the terminal patterns 29, 29 of the flexible circuit board 20 provided on the lower surface of the insulating base 10 are provided. The flexible circuit board 20 is firmly fixed to the insulating base 10 by molding resin integrally formed with the insulating base 10. The edge 74 of the flexible circuit board 20 is formed in an arc shape according to the arc shape of the resistor pattern 25, and the holding portion 17a is also formed in an arc shape according to the arc shape.

  A pair of notches that are notched in the outer side sides of the portion of the flexible circuit board 20 to which the terminal patterns 29, 29 of the resistor pattern 25 are connected (that is, both ends in the width direction (B) of the flexible circuit board 20). Resin insertion portions 75a and 75a are provided, and a resin insertion portion 75b formed of a through hole is provided between the terminal patterns 29 and 29. The resin insertion portions 75a, 75a, and 75b are passed through the resistor insertion portions 75a, 75a, and 75b. The presser portion 17b is formed in an arc shape in accordance with the arc shape of the pattern 25. The presser portion 17b is connected to the molding resin constituting the insulating base 10 on the lower side thereof at the resin insertion portions 75a, 75a, and 75b.

  On the end side 73 which is the end portion (terminal pattern 29, 29 side) of the other side in the length direction (A) folded back to the lower surface side of the insulating base 10 of the flexible circuit board 20, the end side A presser portion 17c is formed so as to hold 73 at a plurality of locations (five locations). The surface in the vicinity of the edge 73 of the flexible circuit board 20 is further insulated from the surface immediately after the flexible circuit board 20 is folded back to the lower surface side of the insulating base 10 (the lower surface located on the side surface side of the insulating base 10). 10 is recessed up to the bottom surface of the recessed portion 78 that is recessed toward the inside, but since the surface of the holding portion 17c is flush with the exposed surface of the terminal patterns 29 and 29, the flexible circuit is provided by the thickness of the holding portion 17c. This is because it is necessary to keep the surface of the substrate 20 low.

  The current collector plate 50 is configured by projecting a terminal connection portion 55 from one side of the base portion 51 provided with the cylindrical projection 53 toward the radially outer side of the cylindrical projection 53. The cylindrical protrusion 53 is installed in the insulating base 10 so as to be positioned (in the center) in the through hole 11 having an inner diameter larger than the outer diameter of the cylindrical protrusion 53 provided on the insulating base 10. The terminal connecting portion 55 hardly protrudes from the outer peripheral side surface of the insulating base 10, and the bent portion 57 of the terminal connecting portion 55 is provided in the insulating base 10, and the portion closer to the base 51 than the bent portion 57 is provided on the insulating base 10. The connection surface 59 on the lower surface of the tip side of the bent portion 57 is directly exposed on the lower surface of the insulating base 10. The tip side of the terminal connecting portion 55 is separated into three by providing two cut lines 57a, and the central portion thereof is a bent portion 57b that is bent upward so that the solder can be easily attached. Further, the cylindrical protrusion 53 protrudes on the upper surface side of the flexible circuit board 20.

Also in this reference example , since the flexible circuit board 20 and the current collecting plate 50 are integrally attached to the insulating base 10 by insert molding, the insulating base 10, the flexible circuit board 20 and the current collecting plate 50 are simultaneously integrated. It is possible to simplify the manufacturing process.

  The electronic component substrate 1-8 manufactured as described above penetrates the cylindrical projection 53 into the fitting insertion hole 61 of the slider 60 similar to that shown in FIG. Thus, the slider 60 is pivotally attached, thereby forming a semi-fixed variable resistor.

In this reference example , similarly to the case of the rotary electronic component substrate 1-5 of the third reference example , the bent portion 57 of the terminal connection portion 55 is provided in the insulating base 10 and is more cylindrical than the bent portion 57. The portion located on the protrusion 53 side is positioned at the middle portion of the thickness of the insulating base 10, and the connection surface 59 of the lower surface of the portion located on the outer peripheral side of the insulating base 10 relative to the bent portion 57 is the lower surface of the insulating base 10. Instead, the bent portion 57 of the terminal connection portion 55 is provided in the insulating base 10 in the same manner as the rotary electronic component substrate 1-6 of the third embodiment. Also, a portion located on the cylindrical projection 53 side is brought into contact with the flexible circuit board 20 (the back side where the conductor pattern 25 or the like is not provided), and the lower surface of the portion located on the outer peripheral side of the insulating base 10 relative to the bent portion 57. The connection surface 59 is directly exposed to the lower surface of the insulating base 10. It may be, also in the same manner as the rotary electronic component substrate 1-7 in the fourth reference example, the insulating base 10 of the base portion 51 and the terminal connecting portions 55 of the current collector plate 50 of a portion which is insert-molded You may comprise so that the surface (lower surface) of the substantially whole may be exposed to the surface on the opposite side to the side which installed the flexible circuit board 20 of the insulation base 10. FIG. Thus, by changing the position of the current collector plate 50 in the insulating base 10 , the same effects as the effects described in the third, fourth reference examples, and the third embodiment can be obtained.

Further, in this reference example , the bent portion 57 of the terminal connecting portion 55 is provided in the insulating base 10, and the terminal connecting portion 55 of the current collector plate 50 is configured not to protrude from the outer peripheral side surface of the insulating base 10. Instead, the terminal connection portion 55 of the current collector plate 50 may be configured to protrude from the outer peripheral side surface of the insulating base 10 as in the first, second reference examples , and the first embodiment . Also in that case, the portion of the terminal connection portion 55 of the current collector plate 50 that is insert-molded on the insulating base 10 is allowed to pass through an intermediate portion of the thickness of the insulating base 10 or the surface (the lower surface) of the flexible circuit board 20. Or the surface thereof is exposed to the surface of the insulating base 10 opposite to the side where the flexible circuit board 20 is installed. Thus, by changing the position of the current collector plate 50 in the insulating base 10, the same effects as the effects described in the first, second reference examples , and the first embodiment can be obtained.

  Although the embodiments of the present invention have been described above, the present invention is not limited to the above-described embodiments, and various modifications can be made within the scope of the technical idea described in the claims and the specification and drawings. Is possible. It should be noted that any shape, structure, and material not directly described in the specification and drawings are within the scope of the technical idea of the present invention as long as the effects and advantages of the present invention are exhibited. For example, in each of the above embodiments, the resistor pattern is used as the conductor pattern, but other various patterns such as a switch pattern may be used. When the switch pattern is provided, the switch pattern and the terminal pattern may be made of the same material and formed in the same process.

It is a figure which shows the board | substrate 1-1 for rotary electronic components, Fig.1 (a) is a top view, FIG.1 (b) is AA sectional drawing of Fig.1 (a), FIG.1 (c) is a back view. It is. 5 is a diagram illustrating a method for manufacturing the flexible circuit board 20. FIG. It is a figure which shows the manufacturing method of the board | substrate 1-1 for rotary electronic components. It is a figure which shows the semi-fixed variable resistor 100-1 comprised using the board | substrate 1-1 for rotary electronic components, Fig.4 (a) is a top view, FIG.4 (b) is B of Fig.4 (a). -B sectional drawing and FIG.4 (c) are back views. 6 is a cross-sectional view showing a state where the semi-fixed variable resistor 100-1 is mounted on a mounting substrate 150. FIG. It is a figure which shows the board | substrate 1-2 for rotary electronic components, Fig.6 (a) is a top view, FIG.6 (b) is EE sectional drawing of Fig.6 (a), FIG.6 (c) is a back view. It is. It is a figure which shows the manufacturing method of the board | substrate 1-2 for rotary electronic components. It is sectional drawing which shows the semi-fixed variable resistor 100-2 comprised using the board | substrate 1-2 for rotary electronic components. It is sectional drawing which shows the state which mounted the semi-fixed variable resistor 100-3 on the mounting board | substrate 160. FIG. It is sectional drawing of the board | substrate 1-4 for rotary electronic components. It is a figure which shows the manufacturing method of the board | substrate 1-4 for rotary electronic components. It is sectional drawing which shows the semi-fixed variable resistor 100-4 comprised using the board | substrate 1-4 for rotary electronic components. It is a figure which shows the board | substrate 1-5 for rotary electronic components, Fig.13 (a) is a top view, FIG.13 (b) is CC sectional drawing of Fig.13 (a), FIG.13 (c) is a back view. It is. It is sectional drawing which shows the board | substrate 1-6 for rotary electronic components. It is sectional drawing which shows the board | substrate 1-7 for rotary electronic components. It is a figure which shows the board | substrate 1-8 for rotary electronic components, Fig.16 (a) is the perspective view seen from the upper side, FIG.16 (b) is the perspective view seen from the lower side. It is a figure which shows the board | substrate 1-8 for rotary electronic components, Fig.17 (a) is a top view, FIG.17 (b) is a front view, FIG.17 (c) is DD sectional drawing of Fig.17 (a). FIG. 17D is a rear view.

Explanation of symbols

1-1 Rotating Electronic Component Board 10 Insulation Base 20 Flexible Circuit Board 25 Conductor Pattern (Resistance Pattern)
29 Terminal patterns 41, 45 Mold C1 Cavity 50 Current collector 51 Base 53 Cylindrical protrusion 55 Terminal connection 70 Metal terminal 60 Slider (rotary body)
1-2 Rotating Electronic Component Substrate 1-3 Rotating Electronic Component Substrate 1-4 Rotating Electronic Component Substrate 1-5 Rotating Electronic Component Substrate 1-6 Rotating Electronic Component Substrate 1-7 Rotating Electronic Component Substrate for electronic components 1-8 Substrate for rotary electronic components

Claims (3)

An insulating base made of synthetic resin;
Provided on the synthetic resin film a conductive pattern in which the slider is in sliding contact with the surface and a terminal pattern connected to the conductive pattern, and a flexible circuit board attached on the insulating base;
A metal terminal attached to the insulating base in a state connected to the terminal pattern of the flexible circuit board;
A current collector plate that is insert-molded on the insulating base and has a cylindrical protrusion installed inside the insulating base, and a terminal connecting portion that protrudes radially outward from the outer periphery of the cylindrical protrusion. and,
At least a part of a portion of the terminal connection portion of the current collector plate that is insert-molded on the insulating base is in contact with the surface of the flexible circuit board. From a synthetic resin film, a flexible circuit board provided with a conductor pattern in which a slider slides on its surface and a terminal pattern connected to the conductor pattern, a metal terminal, a cylindrical protrusion, and an outer periphery of the cylindrical protrusion A current collector plate having a terminal connection portion protruding outward in the radial direction and a mold having a cavity formed in the outer shape of the electronic component substrate are prepared,
The flexible circuit board, the metal terminals, and the current collector plate are accommodated in the cavity of the mold, and the surface on which the conductive pattern of the flexible circuit board is provided is brought into contact with one surface in the cavity, and at the same time Abutting one end of the metal terminal to the terminal pattern, and abutting at least a part of the terminal connecting portion of the current collector plate to the surface of the flexible circuit board in the cavity;
Insert molding so that the conductor pattern of the flexible circuit board is exposed to the insulating base made of molding resin by filling the cavity with the molten molding resin and removing the mold after the filled molding resin has solidified. simultaneously with attaching the metal terminal and the current collector plate embeds by insert molding, further the insulating base at least part of the terminal connecting portion of the insert molded collector plates, the said flexible circuit board A method of manufacturing an electronic component substrate, wherein the substrate is brought into contact with a surface . An insulating base made of synthetic resin;
Provided on the synthetic resin film so as to expose a conductor pattern in which a slider slides on its surface and a terminal pattern connected to the conductor pattern, and a flexible circuit board attached on the insulating base;
A current collector plate that is insert-molded on the insulating base and has a cylindrical protrusion installed inside the insulating base, and a terminal connection portion that protrudes radially outward from the outer periphery of the cylindrical protrusion. A rotary electronic component comprising: a portion of the terminal connection portion of the current collector plate that is insert-molded on the insulating base, wherein at least a portion thereof is in contact with the surface of the flexible circuit board Substrate.

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