JP2019110241A - Electronic component and method of manufacturing the same - Google Patents

Abstract

To provide an electronic component that can be thinned and a method of manufacturing the same.SOLUTION: An electronic component 10 includes a circuit unit 30, a terminal 40, and an electrically insulating case 50 that holds the circuit unit 30 and the terminal 40. The circuit unit 30 includes an insulating layer 32 and a conductive layer 33 on the insulating layer 32. The terminal 40 has a circuit connection piece 401 superimposed on the conductive layer 33 in the thickness direction of the conductive layer 33 and in electrical contact.SELECTED DRAWING: Figure 6

Description

  The present disclosure generally relates to an electronic component and a method of manufacturing the electronic component, and more particularly to an electronic component having a terminal and a circuit portion, and a method of manufacturing the electronic component.

  Patent Document 1 discloses a variable resistor which is a type of electronic component. In the variable resistor of Patent Document 1, a metal fitting, a ground terminal, two output terminals, and two input terminals are integrally provided on a hoop-like metal plate. Then, after the resistance substrate is attached to the hoop-like metal plate, the respective terminals are cut and separated except for the ground terminal. Furthermore, the variable resistor is completed by rotatably mounting the knob on which the brush is mounted through the resistance substrate.

  In Patent Document 1, two input terminals are provided in two resistance paths provided concentrically at different radii on the resistance substrate, two output terminals are provided in two conductive portions, and two resistance paths are provided. A ground terminal is connected to each connection portion. Here, the eyelet portion of the metal fitting, the ground terminal, the output terminal, and the eyelet portion of the input terminal are inserted into the hole of the resistor substrate, and the eyelet portion of the output terminal and the input terminal is fixed by caulking.

JP-A-6-163216

  In Patent Document 1, terminals (a ground terminal, an output terminal, and an input terminal) are connected to a conductive layer (a resistance path, a conductive portion, and a connection portion) by caulking. In order to perform caulking, the terminal is provided with the eyelet portion, and the conductive layer is provided on the resistance substrate having a hole through which the eyelet portion passes. As described above, in order to realize caulking, a protrusion and a member having a hole through which the protrusion is required are required, and providing these may cause the thickness of the electronic component to be increased.

  An object of the present disclosure is to provide an electronic component whose thickness can be reduced and a method of manufacturing the electronic component.

  An electronic component according to an aspect of the present disclosure includes a circuit portion, a terminal, and an electrically insulating case that holds the circuit portion and the terminal. The circuit portion includes an insulating layer and a conductive layer on the insulating layer. The terminal has a circuit connection piece which is overlapped with the conductive layer in the thickness direction of the conductive layer and makes electrical contact.

  A method of manufacturing an electronic component according to an aspect of the present disclosure is the method of manufacturing the electronic component according to the above aspect, including an electrical connection process of electrically connecting the terminal and the conductive layer of the circuit portion. The electrical connection process includes disposing the conductive layer and the terminal such that the circuit connection piece overlaps the conductive layer.

  According to the above aspect of the present disclosure, it is possible to achieve thinning.

FIG. 1 is a perspective view of an electronic component of an embodiment. FIG. 2 is an exploded perspective view of the electronic component. FIG. 3 is a top view of the main body block of the electronic component. FIG. 4 is a cross-sectional view taken along line AA of FIG. FIG. 5 is a perspective view of the terminal of the main body block. FIG. 6 is a schematic partial cross-sectional view of the body block. FIG. 7 is a process diagram of the method of manufacturing the electronic component. FIG. 8 is a process diagram of the method of manufacturing the electronic component. FIG. 9 is a process diagram of the method of manufacturing the electronic component. FIG. 10 is a process diagram of the method of manufacturing the electronic component. FIG. 11 is a process diagram of the method of manufacturing the electronic component. FIG. 12 is a process diagram of the method of manufacturing the electronic component. FIG. 13 is a process diagram of the method of manufacturing the electronic component.

1. Embodiment 1.1 Outline FIGS. 1 and 2 show an electronic component 10 of the present embodiment. The electronic component 10 is a so-called variable resistor (potentiometer). The electronic component 10 is provided with the main body block 20, as shown in FIG. The main body block 20 is provided with the circuit part 30, the terminal 40, and the electrically insulating case 50 which hold | maintains the circuit part 30 and the terminal 40, as shown to FIG. 3 and FIG. The circuit unit 30 includes an insulating layer 32 and a conductive layer 33 on the insulating layer 32, as shown in FIG. The terminal 40 has a circuit connection piece 401 which is overlapped with and electrically in contact with the conductive layer 33 in the thickness direction of the conductive layer 33 (vertical direction in FIG. 6).

  Thus, in the electronic component 10, the electrical connection between the terminal 40 and the conductive layer 33 of the circuit section 30 is realized by overlapping a part of the terminal 40 (the circuit connection piece 401) on the conductive layer 33. Therefore, in order to connect the terminal 40 to the conductive layer 33, it is not necessary to provide a structure that causes the thickness of the electronic component, such as a member having a protrusion and a hole, to be increased. Therefore, thinning can be achieved.

1.2 Configuration Hereinafter, the electronic component 10 will be described in more detail with reference to the drawings. The electronic component 10 is provided with the main body block 20, the brush block 70, and the cover 80, as shown in FIG.

  As shown in FIGS. 3 and 4, the main body block 20 includes the circuit unit 30, a plurality of (three in the present embodiment) terminals 40, a case 50, and a plurality (three in the present embodiment) pressing members. And 62. In the following description, the three terminals 40 will be referred to as a first terminal 40a, a second terminal 40b, and a third terminal 40c, as necessary. Similarly, the three pressing members 62 are referred to as a first pressing member 62a, a second pressing member 62b, and a third pressing member 62c, as necessary. In FIG. 3, the pressing member 62 is omitted from the viewpoint of easy understanding.

  The circuit unit 30 includes a substrate 31, an insulating layer 32, a plurality of (three in the present embodiment) conductive layers 33, and a plurality of (two in the present embodiment) contact layers 34. The circuit unit 30 constitutes a circuit of a rotary potentiometer which detects a rotation angle. Note that, in FIG. 2, FIG. 3, and FIG. 7 to FIG. 11, the insulating layer 32, the conductive layer 33 (331, 332, 333) and the contact layer 34 are indicated by different hatchings in consideration of easy understanding of the drawings. ing.

  The substrate 31 is made of metal. The substrate 31 has a first surface and a second surface (upper surface and lower surface in FIG. 4) in the thickness direction, and supports the insulating layer 32, the conductive layer 33, and the contact layer 34 on the first surface (FIGS. 3). That is, the insulating layer 32, the conductive layer 33, and the contact layer 34 are on the substrate 31. In this case, since the insulating substrate for supporting the conductive layer 33 is unnecessary, the electronic component 10 can be thinned. In addition, since the insulating layer 32, the conductive layer 33, and the contact layer 34 are very thin compared with the board | substrate 31, they are not shown in FIG. 4 in fact.

  The board | substrate 31 has the main part 311, the protrusion part 312, and the attaching part 313, as shown to FIG. 3 and FIG. The main portion 311, the projecting portion 312, and the mounting portion 313 are integrally formed. The main portion 311 has a circular plate shape. The main portion 311 has a circular opening 314 at the center. The protrusion 312 is in the form of a rectangular plate. The protrusion 312 protrudes from the outer periphery of the main portion 311 in the direction orthogonal to the thickness. The mounting portion 313 protrudes from the outer periphery of the main portion 311 to the side opposite to the protruding portion 312. The attachment portion 313 is crank-shaped in a side view, as shown in FIG. The mounting portion 313 can be used together with the plurality of terminals 40 when mounting the electronic component 10 on a circuit board or the like. In the following description, the first direction (the left and right direction in FIG. 3) in which the protruding portion 312 and the mounting portion 313 are arranged is referred to as the longitudinal direction of the substrate 31. A second direction (vertical direction in FIG. 3) orthogonal to the thickness direction and the longitudinal direction of the substrate 31 is referred to as the width direction of the substrate 31.

  The insulating layer 32 is formed on the first surface of the substrate 31 so as to cover the entire first surface of the substrate 31 as shown in FIGS. 3 and 6. The insulating layer 32 is a layer having electrical insulation. Examples of the material of the insulating layer 32 include epoxy-based electrically insulating resins. That is, the insulating layer 32 is a layer for electrically insulating the conductive layer 33 and the contact layer 34 from the substrate 31.

  The plurality of conductive layers 33 include a first conductive layer 331, a second conductive layer 332, and a third conductive layer 333 as shown in FIG. 3 and FIG. The first conductive layer 331, the second conductive layer 332, and the third conductive layer 333 are all formed on the insulating layer 32. However, the first conductive layer 331, the second conductive layer 332, and the third conductive layer 333 are spatially separated from each other. The plurality of conductive layers 33 are all conductive layers. Examples of the material of the conductive layer 33 include conductive paste (for example, silver ink).

  The first conductive layer 331 and the third conductive layer 333 are located on the protrusion 312 of the substrate 31. As shown in FIG. 3, the first conductive layer 331 and the third conductive layer 333 are located on both sides of the protrusion 312 in the width direction of the substrate 31.

  The first conductive layer 331 includes a terminal connection portion 3311 and an extension portion 3312. The terminal connection portion 3311 has a rectangular shape. The terminal connection portion 3311 is electrically connected to the first terminal 40a. The terminal connection portion 3311 is located at one end of the protruding portion 312 in the width direction of the substrate 31. The extension 3312 extends from the terminal connection 3311 toward the center of the protrusion 312 in the width direction of the substrate 31.

  The third conductive layer 333 has a terminal connection portion 3331 and an extension portion 3332. The terminal connection portion 3331 has a rectangular shape. The terminal connection portion 3331 is electrically connected to the third terminal 40c. The terminal connection portion 3331 is located at the other end of the protrusion 312 in the width direction of the substrate 31. The extending portion 3332 extends from the terminal connection portion 3331 toward the center of the protruding portion 312 in the width direction of the substrate 31.

  As shown in FIG. 7, the second conductive layer 332 has a terminal connection portion 3321, a brush connection portion 3322, and a connection portion 3323. The terminal connection portion 3321 has a rectangular shape. The terminal connection portion 3321 is electrically connected to the second terminal 40 b. The terminal connection portion 3321 is located between the terminal connection portion 3311 of the first conductive layer 331 and the terminal connection portion 3331 of the third conductive layer 333 in the width direction of the substrate 31. The brush connection 3322 is used for electrical connection with the brush block 70. The brush connection portion 3322 is formed in the main portion 311 of the substrate 31 so as to surround the opening 314. As shown in FIG. 7, the brush connection portion 3322 has an annular shape. The connection portion 3323 connects and electrically connects the terminal connection portion 3321 and the brush connection portion 3322.

  The plurality of contact layers 34 include a first contact layer 341 and a second contact layer 342, as shown in FIG. However, the first contact layer 341 and the second contact layer 342 are spatially separated from each other. The plurality of contact layers 34 are all conductive layers. The contact layer 34 is also harder than the conductive layer 33. As a material of such a contact layer 34, a conductive paste (as an example, carbon ink) whose hardness is higher than that of the conductive paste of the conductive layer 33 can be mentioned. In this case, the contact layer 34 can be used for contact with the brush 71, and the electronic component 10 can be easily realized as a variable resistor or the like.

  The first contact layer 341 is formed on the insulating layer 32 in the main portion 311 of the substrate 31 so as to surround the brush connection portion 3322 of the second conductive layer 332. The first contact layer 341 has an arc shape. That is, the inner diameter of the first contact layer 341 is larger than the outer diameter of the brush connection portion 3322 of the second conductive layer 332. The first contact layer 341 is coupled to the extension 3312 of the first conductive layer 331 and the extension 3332 of the third conductive layer 333 at both ends thereof. Thus, the first contact layer 341 is electrically connected to the first conductive layer 331 and the third conductive layer 333. In other words, the first conductive layer 331 and the third conductive layer 333 are electrically connected by the first contact layer 341.

  The second contact layer 342 is formed on the second conductive layer 332 so as to cover a part of the second conductive layer 332 (the brush connection portion 3322 and the connection portion 3323). Thereby, the second contact layer 342 is electrically connected to the second conductive layer 332.

  The plurality of terminals 40 are used to electrically connect the circuit unit 30 to an external circuit. As shown in FIGS. 2 and 3, the plurality of terminals 40 are a first terminal 40a, a second terminal 40b, and a third terminal 40c, all of which have the same shape.

  Each terminal 40 has a spring property. Each terminal 40 has a circuit connection piece 401, an external connection piece 402, a connection piece 403, and a pair of retaining pieces 404, as shown in FIGS. The circuit connection piece 401 is a portion electrically connected to the conductive layer 33 of the circuit unit 30. The external connection piece 402 is a portion used for electrical connection with an external circuit. Each of the circuit connection piece 401 and the external connection piece 402 has a plate shape (in the present embodiment, a rectangular plate shape). The connection piece 403 is a portion for connecting the circuit connection piece 401 and the external connection piece 402. More specifically, the connection piece 403 extends in the planar direction of the second surface of the substrate 31 from the end (the left end in FIG. 4) of the circuit connection piece 401 opposite to the substrate 31. The external connection piece 402 protrudes from the tip of the connection piece 403 to the opposite side to the circuit connection piece 401. The pair of retaining pieces 404 respectively project from both sides of the end of the circuit connection piece 401 on the substrate 31 side. The pair of retaining pieces 404 are provided to prevent the terminal 40 from falling off the case 50. The circuit connection piece 401, the external connection piece 402, the connection piece 403, and the pair of retaining pieces 404 are integrally formed. The terminal 40 can be formed by bending a metal plate. Thus, the terminal 40 has the plate-like circuit connection piece 401. The layers (the insulating layer 32, the conductive layer 33, and the contact layer 34) on the substrate 31 are thinner than the circuit connection piece 401.

  Further, the circuit connection piece 401 has one or more protrusions 405 protruding toward the conductive layer 33 side. That is, the circuit connection piece 401 has one or more protrusions 405 on the surface facing the conductive layer 33. In the present embodiment, the circuit connection piece 401 has two protrusions 405, as shown in FIG. The two protrusions 405 are arranged in a line in the width direction (vertical direction in FIG. 3) of the circuit connection piece 401. Such a projection 405 can be formed on the circuit connection piece 401 by press processing (extension processing).

  The first terminals 40 a, the second terminals 40 b, and the third terminals 40 c are arranged in a line in the width direction of the substrate 31. Further, the first terminal 40 a, the second terminal 40 b, and the third terminal 40 c face the protrusion 312 of the substrate 31 in the longitudinal direction of the substrate 31. Here, the first terminal 40 a is at a position aligned with the terminal connection portion 3311 of the first conductive layer 331 in the longitudinal direction of the substrate 31, and a part (circuit connection piece 401) of the first terminal 40 a is a first conductive The first conductive layer 331 is overlapped and in electrical contact with the first conductive layer 331 in the thickness direction of the layer 331. Similarly, the second terminal 40 b is located at a position aligned with the terminal connection portion 3321 of the second conductive layer 332 in the longitudinal direction of the substrate 31, and a part (circuit connection piece 401) of the second terminal 40 b is a second conductive The second conductive layer 332 is overlapped and in electrical contact with the second conductive layer 332 in the thickness direction of the layer 332. Further, the third terminal 40c is located at a position aligned with the terminal connection portion 3331 of the third conductive layer 333 in the longitudinal direction of the substrate 31, and a part of the third terminal 40c (circuit connection piece 401) is the third conductive layer The third conductive layer 333 is overlapped and in electrical contact in the thickness direction of 333. Each of the first to third terminals 40a to 40c has a spring property, and the circuit connection piece 401 is brought into contact with the conductive layers 331 to 333 by an elastic force. As a result, the circuit connection piece 401 can be stably brought into contact with the conductive layers 33 (331 to 333).

  The case 50 has electrical insulation and holds the circuit unit 30 and the terminals 40 (the first terminal 40a, the second terminal 40b, and the third terminal 40c). In the present embodiment, the case 50 is a molded product of synthetic resin, and the circuit unit 30 and the terminals 40 are embedded in the case 50. Here, the circuit portion 30 is embedded in the case 50 such that the attachment portion 313 of the substrate 31 protrudes out of the case 50. Further, each terminal 40 is embedded in the case 50 such that the external connection piece 402 and the connection piece 403 protrude out of the case 50. Therefore, the electronic component 10 can be mounted on a desired circuit board by the mounting portion 313 and the external connection piece 402 of each terminal 40.

  The case 50 is a first half 501 which is a part covering the first surface of the substrate 31 (the upper part in FIG. 4) and a part covering the second surface of the substrate 31 (the lower part in FIG. 4) And a second half 502. The first half 501 includes a housing 51 that exposes the first contact layer 341 and the second contact layer 342 of the circuit unit 30 from the bottom surface. The housing portion 51 is a space penetrating the first half 501. The housing portion 51 has a circular portion sharing the central axis with the opening 314 of the substrate 31. The housing portion 51 rotatably houses the brush block 70 around the central axis of the housing portion 51. On the other hand, the second half 502 has an opening 52 that exposes the opening 314 of the substrate 31.

  Further, the first half 501 has a plurality of (three in the present embodiment) exposed holes 53. Each exposed hole 53 is a hole for exposing the conductive layer 33 and the terminal 40. Each exposed hole 53 has a circular shape, and the diameter decreases with the depth. In the present embodiment, the three exposed holes 53 are a first exposed hole 53a, a second exposed hole 53b, and a third exposed hole 53c, all of which have the same shape. The first exposure hole 53a exposes the tip end portion of the terminal connection portion 3311 of the first conductive layer 331 of the conductive layer 33 and the tip end portion of the circuit connection piece 401 of the first terminal 40a corresponding thereto. The second exposed hole 53b exposes the tip end portion of the terminal connection portion 3321 of the second conductive layer 332 of the conductive layer 33 and the tip end portion of the circuit connection piece 401 of the second terminal 40b corresponding thereto. The third exposure hole 53 c exposes the tip portion of the terminal connection portion 3331 of the third conductive layer 333 of the conductive layer 33 and the tip portion of the circuit connection piece 401 of the third terminal 40 c corresponding thereto.

  The plurality of pressing members 62 a, 62 b, 62 c are members for pressing the circuit connection pieces 401 of the plurality of terminals 40 a, 40 b, 40 c against the plurality of conductive layers 331, 332, 333. In other words, the pressing member 62 is a member for applying a preload (initial load). More specifically, the pressing member 62 a is disposed in the exposed hole 53 a and presses the circuit connection piece 401 of the first terminal 40 a against the conductive layer 331. The pressing member 62 b is disposed in the exposed hole 53 b and presses the circuit connection piece 401 of the second terminal 40 b against the conductive layer 332. The pressing member 62 c is disposed in the exposed hole 53 c and presses the circuit connection piece 401 of the third terminal 40 c against the conductive layer 333. As a result, the circuit connection piece 401 can be stably brought into contact with the conductive layer 33.

  Each pressing member 62 is columnar (in the present embodiment, substantially cylindrical). Each pressing member 62 has electrical insulation. For example, the pressing member 62 is formed of a material having electrical insulation. In the present embodiment, the pressing member 62 is formed of a material (for example, silicone) having electrical insulation and elasticity.

  Furthermore, the electronic component 10 is provided with a plurality of adhesive layers 63 (see FIG. 6). The plurality of adhesive layers 63 are provided corresponding to the plurality of terminals 40 respectively. Each adhesive layer 63 has conductivity. Each adhesive layer 63 is provided between the circuit connection piece 401 and the conductive layer 33, as shown in FIG. Such an adhesive layer 63 is formed of an adhesive having conductivity, and exhibits a function of adhering the circuit connection piece 401 to the conductive layer 33. That is, the adhesive layer 63 is a solidified product of the conductive adhesive. An example of the conductive adhesive is a conductive paste.

  The brush block 70 is a member for electrically connecting the second contact layer 342 to any position of the first contact layer 341. The brush block 70 includes a brush 71 and a mounting plate 72, as shown in FIG.

  The brush 71 has conductivity. The brush 71 includes a base 711, a pair of first contacts 712, and a pair of second contacts 713. The base portion 711 is a portion fixed to the mounting plate 72. Both of the pair of first contacts 712 are used for contacting the first contact layer 341 of the circuit unit 30. In particular, the pair of first contacts 712 is formed in an elastic shape (for example, a leaf spring shape) so as to contact the first contact layer 341 with a predetermined contact pressure. The pair of first contacts 712 extend from the base 711 to be adjacent to each other. The pair of first contacts 712 is not linear, but is arc-shaped along the shape of the first contact layer 341. Both of the pair of second contacts 713 are used for contacting the second contact layer 342 of the circuit unit 30. In particular, the pair of second contacts 713 are formed in an elastic shape (for example, a leaf spring shape) so as to contact the second contact layer 342 with a predetermined contact pressure. The pair of second contacts 713 extend from the base 711 in line symmetry. The pair of second contacts 713 are not linear but arc-shaped along the shape of the second contact layer 342.

  The mounting plate 72 is a member for holding the brush 71. The mounting plate 72 has electrical insulation. The mounting plate 72 has a mounting portion 721 and a cylindrical portion 722. The attachment portion 721 is disk-shaped. The brush 71 is attached to the surface facing the substrate 31 in the attachment portion 721. Further, the attachment portion 721 has an opening 723 at the center. The central axis of the mounting portion 721 coincides with the central axis of the opening 723. The cylindrical portion 722 protrudes from the surface of the mounting portion 721 opposite to the substrate 31. The cylindrical portion 722 is cylindrical. The central axis of the cylindrical portion 722 and the central axis of the mounting portion 721 coincide with each other. Further, the inside of the cylindrical portion 722 is connected to the opening 723. The cylindrical portion 722 has a locking piece 724 inside. The locking piece 724 can be used for mechanical connection between the electronic component 10 and an operation component (e.g., an operation knob).

  As shown in FIG. 1, the cover 80 is attached to the main body block 20 so as to cover one surface (upper surface in FIG. 1) of the main body block 20. Therefore, the opening of each exposed hole 53 of the body block 20 is closed by the cover 80 (see FIGS. 1 and 6). As a result, as shown in FIG. 6, the cover 80 positions the pressing member 62 at a position where the pressing member 62 presses the circuit connection piece 401 against the conductive layer 33. As a result, the circuit connection piece 401 can be stably brought into contact with the conductive layer 33. In particular, the pressing member 62 is preferably compressed in the thickness direction. The cover 80 has an opening 81 in which the cylindrical portion 722 of the brush block 70 is fitted. The body block 20 and the cover 80 rotatably hold the brush block 70 between the body block 20 and the cover 80 about its central axis (see FIGS. 1 and 2). The cover 80 is made of metal, for example. However, the cover 80 may be made of an electrically insulating resin.

1.3 Manufacturing Method Next, a method of manufacturing the electronic component 10 will be described. In particular, in the following, a method of manufacturing the main body block 20 will be described with reference to FIGS.

  In manufacturing the main body block 20, a metal plate 900 (see FIG. 7) which is a plate material is prepared. The metal plate 900 is the basis of the substrate 31 and the terminals 40 (the first terminal 40 a, the second terminal 40 b, and the third terminal 40 c). The metal plate 900 is obtained, for example, by performing silver plating on a plate of iron.

  As shown in FIG. 7, the insulating layer 32 is formed in a predetermined region of the metal plate 900. In forming the insulating layer 32, an electrically insulating resin to be a material of the insulating layer 32 may be applied to a predetermined region and solidified.

  Next, as shown in FIG. 7, the first conductive layer 331, the second conductive layer 332, and the third conductive layer 333 are formed in predetermined regions on the insulating layer 32. When forming each of the first conductive layer 331, the second conductive layer 332, and the third conductive layer 333, materials of the first conductive layer 331, the second conductive layer 332, and the third conductive layer 333 are used. The conductive paste to be used may be applied to a predetermined area and solidified.

  Next, as shown in FIG. 8, the first contact layer 341 is formed on the insulating layer 32, and the second contact layer 342 is formed on the second conductive layer 332. In forming each of the first contact layer 341 and the second contact layer 342, a conductive paste to be a material of each of the first contact layer 341 and the second contact layer 342 is applied to a predetermined region and solidified. Good.

  Next, as shown in FIG. 9, the unnecessary part of the metal plate 900 is removed. Thus, the substrate portion 910 which is the basis of the substrate 31, the terminal portion 920 which is the basis of the terminals 40 (the first terminal 40a, the second terminal 40b, and the third terminal 40c), the substrate portion 910 and the terminal portion 920 And a frame 930 to be held. The substrate portion 910 and the terminal portion 920 are inside the frame 930. In addition, each of the terminal portions 920 is located at a gap G10 from the substrate portion 910. In addition, the method of removing the unnecessary part of the metal plate 900 may be a conventionally well-known method, such as press processing.

  When the unnecessary portion of metal plate 900 is removed, terminal 40 (terminal portion 920) is separated from circuit portion 30 (substrate portion 910), and electrically connected to conductive layer 33 of circuit portion 30. Absent. Therefore, a process (electrical connection process) of electrically connecting the terminal 40 and the conductive layer 33 of the circuit unit 30 is performed. In the electrical connection process, the conductive layer 33 and the terminal 40 (a terminal portion 920 to be the terminal 40) are disposed so that the circuit connection piece 401 overlaps the conductive layer 33. More specifically, as shown in FIG. 10, the circuit connection pieces 401 of the terminal portion 920 are superimposed on the conductive layers 331, 332 and 333 respectively. Here, by partially bending the frame 930, the position of the terminal portion 920 with respect to the substrate portion 910 is changed, and the circuit connection piece 401 is superimposed on the conductive layer 33. Further, in the electrical connection process, an adhesive agent to be the adhesive layer 63 is applied to one or both of the circuit connection piece 401 and the conductive layer 33.

  Next, as shown in FIG. 11, a case 50 is formed. In forming the case 50, insert molding is performed using the substrate portion 910 and the terminal portion 920 as inserts. In this process, the adhesive solidifies and an adhesive layer 63 can be formed.

  When the formation of the case 50 is completed, as shown in FIG. 12, the circuit connection piece 401 of the terminal 40 is in contact with the conductive layer 33 by the protrusion 405. Furthermore, the adhesive layer 63 reinforces the electrical contact between the circuit connection piece 401 and the conductive layer 33.

  Next, as shown in FIG. 13, the pressing member 62 is inserted into the exposed hole 53. Thus, the circuit connection piece 401 can be pressed against the conductive layer 33 by the pressing member 62. Here, one end portion in the thickness direction of the pressing member 62 is in contact with the circuit connection piece 401, and the other end portion in the thickness direction protrudes from the exposed hole 53. Thus, the pressing members 62 (the first pressing member 62a, the second pressing member 62b, and the second pressing member 62c) are disposed.

  After this, the substrate portion 910 and the terminal portion 920 are cut from the frame 930. Then, the base portion of the mounting portion 313 of the substrate portion 910 is bent to form the mounting portion 313. Similarly, each terminal portion 920 is bent to form a terminal 40. Thus, the body block 20 is obtained. The operation of inserting the pressing member 62 into the exposure hole 53 may be performed after the substrate portion 910 and the terminal portion 920 are cut from the frame 930 as long as the case 50 is formed. In addition, the above-described electrical connection process may be performed after the substrate portion 910 and the terminal portion 920 are cut from the frame 930 as long as the case 50 is not formed.

  The brush block 70 and the cover 80 are attached to the body block 20 obtained in this manner. As a result, the pressing member 62 is pressed toward the circuit connection piece 401 by the cover 80 (see FIG. 6). As a result, the cover 80 positions the pressing member 62 at a position where the pressing member 62 presses the circuit connection piece 301 against the conductive layer 33. Thereby, the electronic component 10 shown in FIG. 1 is obtained.

  The method of manufacturing the electronic component 10 described above includes an electrical connection process of electrically connecting the terminal 40 and the conductive layer 33 of the circuit unit 30. The electrical connection process includes the step of disposing the conductive layer 33 and the terminal 40 so that the circuit connection piece 401 overlaps the conductive layer 33.

  Further, the method of manufacturing the electronic component 10 further includes the steps (first and second steps) performed before the electrical connection process and the steps (third step) performed after the electrical connection process. Including. The first step is a step of forming the insulating layer 32 and the conductive layer 33 on the metal plate 900. The second step is to remove the unnecessary portion of the metal plate 900 to form the substrate portion 910, the terminal portion 920, and the frame 930 holding the substrate portion 910 and the terminal portion 920. The third step is a step of forming the case 50 by performing insert molding with the substrate portion 910 and the terminal portion 920 as inserts.

  According to the method of manufacturing such an electronic component 10, the terminal 40 and the substrate 31 can be formed using the same metal plate 900. Therefore, the electronic component 10 which can achieve thickness reduction can be manufactured efficiently. Further, since the circuit connection piece 401 only needs to be stacked on the conductive layer 33, the influence of the circuit portion 30 on the conductive layer 33 (for example, the influence of heat or the like) can be reduced. In particular, the influence of the circuit portion 30 on the conductive layer 33 can be further reduced as compared to the case of using wire bonding or the like.

1.4 Operation Next, the operation of the electronic component 10 will be briefly described. In the electronic component 10, the first contact layer 341 of the circuit unit 30 is interposed between the first terminal 40a and the third terminal 40c. The first contact layer 341 is electrically connected to the second contact layer 342 by the brush 71 of the brush block 70, and the second contact layer 342 is electrically connected to the second terminal 40b. When the brush block 70 is rotated, the position (contact position) at which the pair of first contacts 712 of the brush 71 contact the first contact layer 341 changes. Such a change in contact position results in a change in resistance between the first terminal 40a or the third terminal 40c and the second terminal 40b. That is, by rotating the brush block 70, the resistance value between the first terminal 40a or the third terminal 40c and the second terminal 40b can be changed. The resistance value between the first terminal 40 a and the third terminal 40 c is largely influenced by the material of the second contact layer 342. When the material of the second contact layer 342 is carbon ink, the resistance value between the first terminal 40 a and the third terminal 40 c can be changed by changing the ratio of the resin of carbon ink to carbon.

  Further, in the electronic component 10, when a constant voltage is applied between the first terminal 40a and the third terminal 40c, the potential of the second terminal 40b changes due to the change of the contact position. Therefore, according to the electronic component 10, the rotational position of the brush block 70 can be detected.

2. Modified Example The above-described embodiment described above is only one of various embodiments of the present disclosure. Further, various changes can be made to the above-described embodiment according to the design and the like as long as the object of the present disclosure can be achieved. Below, the modification of the said embodiment is enumerated.

  The electronic component 10 is not limited to a variable resistor (potentiometer), and may be any electronic component that requires a circuit unit and a terminal. Examples of such electronic components include variable resistors (potentiometers), rotary encoders, and switches.

  The shape of the substrate 31 is merely an example and is not particularly limited. The shape of the substrate 31 can be changed according to the type and application of the electronic component. In particular, the shape of the mounting portion 313 is arbitrary, and in some cases, the mounting portion 313 may be omitted.

  Although the circuit unit 30 includes one insulating layer 32 in the above embodiment, the number of the insulating layers 32 is not particularly limited. The circuit unit 30 may have at least one insulating layer 32. The insulating layer 32 may have a single layer structure or a multilayer structure.

  Although the circuit unit 30 includes the three conductive layers 33 in the above embodiment, the number of the conductive layers 33 is not particularly limited. The circuit unit 30 may have at least one conductive layer 33. The conductive layer 33 may have a single layer structure or a multilayer structure.

  Also, the number of contact layers 34 is not particularly limited. Circuitry 30 may have one or more contact layers 34 and may not have contact layers 34. In addition, in consideration of the application of the contact layer 34, the contact layer 34 does not have to be higher in hardness than the conductive layer 33 as a whole. That is, the hardness of the contact layer 34 may be higher than that of the conductive layer 33 at least in the portion that constitutes the surface (the portion in contact with the brush 71).

  Although the electronic component 10 has the three terminals 40 in the said embodiment, the number in particular of the terminals 40 is not limited. The circuit unit 30 may have at least one terminal 40. Further, the shape of the terminal 40 may also be changed depending on the type and application of the electronic component. For example, the terminal 40 may be linear instead of being cranked. Further, in the terminal 40, the retaining piece 404 is not essential. Further, the number of the protrusions 405 is not particularly limited, and the protrusions 405 may be omitted. Moreover, the terminal 40 does not necessarily have to have a spring property as a whole, and at least a part has to be a spring property so that the circuit connection piece 401 can be brought into contact with the conductive layer 33 by an elastic force. . Moreover, the terminal 40 may not have a spring property.

  In the above embodiment, the case 50 is formed by insert molding, but may be formed by another molding method. For example, the case 50 may be prepared separately from the terminal 40 and the circuit unit 30, and the terminal 40 and the circuit unit 30 may be attached to the case 50.

  In the above embodiment, the case 50 has three exposed holes 53, but the number of exposed holes 53 is not particularly limited. Further, in the above embodiment, although one exposed hole 53 exposes one set of terminal 40 and conductive layer 33, one exposed hole 53 exposes multiple sets of terminal 40 and conductive layer 33. You may For example, the case 50 may have a larger exposure hole 53 including three exposure holes 53 (53a, 53b, 53c). In addition, the exposure hole 53 may have a circular shape, an elliptical shape, a polygonal shape, or any other shape. That is, the positioning structure is an arbitrary configuration. In addition, when the pressing member 62 is not provided, the exposure hole 53 may not be provided in the case 50.

  The shape of the case 50 is merely an example and is not particularly limited. The shape of the case 50 may be changed according to the type and application of the electronic component.

  The pressing member 62 may not necessarily have elasticity. In addition, the pressing member 62 may not necessarily have electrical insulation. However, if the pressing member 62 has electrical insulation, the metal cover 80 can be used. Although the electronic component 10 has the three pressing members 62 in the above embodiment, the number of the pressing members 62 is not particularly limited. For example, the circuit connection pieces 401 of the plurality of terminals 40 may be pressed by a single pressing member 62. Further, the shape of the pressing member 62 is not particularly limited, and may be an elliptical or polygonal columnar shape. Also, the pressing member 62 is not essential.

  Also, the electronic component 10 does not necessarily have to have the adhesive layer 63.

  In the said embodiment, although the board | substrate 31 and the terminal 40 are formed from the same metal plate 900, this is not essential. The substrate 31 and the terminals 40 may be formed of separate metal plates 900.

  In the above embodiment, the method of forming the layer such as the insulating layer 32 is not limited to the method of using application and solidification of the material of the layer, and a layer forming technique known in the related art can be used. In addition, examples of the method of solidification of the material include drying (including natural drying), heating, light irradiation, and the like. The method of solidification can be selected appropriately depending on the material of the layer. In addition, the conductive paste used for the conductive layer 33 and the contact layer 34 is not limited to the examples mentioned in the above embodiment, and may be selected from various conductive pastes known in the related art. That is, the conductive paste may contain a resin (for example, epoxy type and phenol type) and conductive particles (for example, copper, silver and carbon).

3. Aspect As is clear from the above-described embodiment and modification, the electronic component (10) of the first aspect includes a circuit portion (30), terminals (40; 40a to 40c), the circuit portion (30), and the above And an electrically insulating case (50) for holding the terminals (40; 40a to 40c). The circuit portion (30) has an insulating layer (32) and a conductive layer (33; 331 to 333) on the insulating layer (32). The terminal (40; 40a to 40c) is a circuit connection piece (401) which is overlapped with the conductive layer (33; 331 to 333) in the thickness direction of the conductive layer (33; Have. According to the first aspect, thinning of the electronic component (10) can be achieved.

  The electronic component (10) of the second aspect can be realized by combination with the first aspect. In the second aspect, the circuit connection piece (401) has one or more protrusions (405) projecting toward the conductive layer (33; 331 to 333). According to the second aspect, the circuit connection piece (401) stably contacts the conductive layer (33; 331 to 333) easily.

  The electronic component (10) of the third aspect can be realized by the combination with the first or second aspect. In the third aspect, the terminal has a spring property, and brings the circuit connection piece (401) into contact with the conductive layer (33; 331 to 333) by an elastic force. According to the third aspect, the circuit connection piece (401) stably contacts the conductive layer (33; 331 to 333) easily.

  The electronic component (10) of the fourth aspect can be realized by combination with any one of the first to third aspects. In the fourth aspect, the electronic component (10) further includes a pressing member (62; 62a to 62c) for pressing the circuit connection piece (401) against the conductive layer (33; 331 to 333). According to the fourth aspect, the circuit connection piece (401) stably contacts the conductive layer (33; 331 to 333) easily.

  The electronic component (10) of the fifth aspect can be realized by the combination with the fourth aspect. In the fifth aspect, the electronic component (10) further includes a cover (80) attached to the case (50). The pressing members (62; 62a to 62c) have electrical insulation. The cover (80) is located at a position where the pressing member (62; 62a to 62c) presses the circuit connection piece (401) against the conductive layer (33; 331 to 333). The pressing member (62; 62a to 62c) Position the According to the fifth aspect, the circuit connection piece (401) stably contacts the conductive layer (33; 331 to 333) easily.

  The electronic component (10) of the sixth aspect can be realized by combination with any one of the first to fifth aspects. In the sixth aspect, the electronic component (10) further includes a conductive adhesive layer (63) located between the circuit connection piece (401) and the conductive layer (33; 331 to 333). According to the sixth aspect, the electrical connection between the terminals (40; 40a to 40c) and the conductive layers (33; 331 to 333) tends to be stable.

  The electronic component (10) of the seventh aspect can be realized by combination with any one of the first to sixth aspects. In the seventh aspect, the circuit unit (30) further includes a metal substrate (31). The insulating layer (32) and the conductive layers (33; 331 to 333) are on the substrate (31). According to the seventh aspect, since the insulating substrate for supporting the conductive layer (33; 331 to 333) is unnecessary, the electronic component (10) can be thinned.

  The electronic component (10) of the eighth aspect can be realized by combination with any one of the first to seventh aspects. In the eighth aspect, the electronic component (10) includes a plurality of the terminals (40; 40a to 40c). The conductive layer (33; 331 to 333) has a plurality of terminal connection parts (3311, 3321, 3331). The circuit connection pieces (401) of the plurality of terminals (40a to 40c) are respectively superimposed on the plurality of terminal connection portions (3311, 3321, 3331). According to the eighth aspect, thinning of the electronic component (10) can be achieved.

  The electronic component (10) of the ninth aspect can be realized by combination with any one of the first to eighth aspects. In the ninth aspect, the circuit portion (30) has conductivity and is electrically connected to the conductive layer (33; 331 to 333), and the hardness is higher than that of the conductive layer (33; 331 to 333). It further comprises a high contact layer (34; 341, 342). According to the ninth aspect, the contact layer (34; 341, 342) can be used for contact with the brush, and the electronic component (10) can be realized as a variable resistor or the like.

  The electronic component (10) of the tenth aspect can be realized by combination with any one of the first to ninth aspects. In a tenth aspect, the circuit connection piece (401) is plate-like. Each of the insulating layer (32) and the conductive layers (33; 331 to 333) is thinner than the circuit connection piece (401). According to the tenth aspect, thinning of the electronic component (10) can be achieved.

  The method of manufacturing an electronic component of the eleventh aspect is the method of manufacturing an electronic component (10) according to any one of the first to tenth aspects. The manufacturing method of the eleventh aspect includes an electrical connection process of electrically connecting the terminals (40; 40a to 40c) and the conductive layers (33; 331 to 333) of the circuit unit (30). The electrical connection process includes the conductive layers (33; 331 to 333) and the terminals (40; 40a to 40c) such that the circuit connection pieces (401) overlap the conductive layers (33; 331 to 333). Including the step of placing. According to the eleventh aspect, thinning of the electronic component (10) can be achieved.

  The method of manufacturing an electronic component of the twelfth aspect is a method of manufacturing an electronic component (10) according to a combination of the seventh aspect. The twelfth aspect includes an electrical connection process for electrically connecting the terminals (40; 40a to 40c) and the conductive layers (33; 331 to 333) of the circuit unit (30). The electrical connection process includes the conductive layers (33; 331 to 333) and the terminals (40; 40a to 40c) such that the circuit connection pieces (401) overlap the conductive layers (33; 331 to 333). Including the step of placing. A twelfth aspect further includes first and second steps performed before the electrical connection process, and a third step performed after the electrical connection process. The first step is a step of forming the insulating layer (32) and the conductive layers (33; 331 to 333) on a metal plate (900). The second step removes the unnecessary part of the metal plate (900) to hold the substrate part (910), the terminal part (920), the substrate part (910) and the terminal part (920). Forming a frame (930). The substrate portion (910) is a portion that is the basis of the substrate (31). The terminal portion (920) is a portion that is the basis of the terminal (40). The third step is a step of performing insert molding using the substrate portion (910) and the terminal portion (920) as inserts to form the case (50). According to the twelfth aspect, it is possible to efficiently manufacture the electronic component (10) which can be thinned.

DESCRIPTION OF SYMBOLS 10 Electronic components 30 Circuit part 31 Substrate 32 Insulating layer 33, 331 to 333 Conductive layer 3311, 331, 3233 Terminal connection part 34, 341, 342 Contact layer 40, 40a to 40c Terminal 401 Circuit connection piece 405 Protrusion 50 Case 62, 62a 62 62c pressing member 63 adhesive layer 80 cover

Claims (11)

A circuit portion having an insulating layer, and a conductive layer on the insulating layer;
Terminal,
An electrically insulating case for holding the circuit portion and the terminal;
Equipped with
The terminal has a circuit connection piece which is superimposed on the conductive layer in the thickness direction of the conductive layer and makes electrical contact.
Electronic parts. The circuit connection piece has one or more protrusions protruding to the conductive layer side.
The electronic component of claim 1. The terminal has a spring property to bring the circuit connection piece into contact with the conductive layer by an elastic force.
The electronic component of Claim 1 or 2. And a pressing member for pressing the circuit connection piece against the conductive layer.
The electronic component in any one of Claims 1-3. It further comprises a cover attached to the case,
The pressing member is electrically insulating.
The cover positions the pressing member at a position where the pressing member presses the circuit connection piece against the conductive layer.
The electronic component of claim 4. And a conductive adhesive layer between the circuit connection piece and the conductive layer.
An electronic component according to any one of claims 1 to 5. The circuit unit further includes a metal substrate,
The insulating layer and the conductive layer are on the substrate
An electronic component according to any one of claims 1 to 6. Equipped with a plurality of the terminals,
The conductive layer has a plurality of terminal connections,
The circuit connection pieces of the plurality of terminals are respectively superimposed on the plurality of terminal connection portions.
The electronic component in any one of Claims 1-7. The circuit portion further has a contact layer which is conductive and electrically connected to the conductive layer, and has a hardness higher than that of the conductive layer.
The electronic component in any one of Claims 1-8. The circuit connection piece is plate-like,
Each of the insulating layer and the conductive layer is thinner than the circuit connection piece,
The electronic component in any one of Claims 1-9. A method of manufacturing an electronic component according to any one of claims 1 to 10, wherein
An electrical connection process for electrically connecting the terminal and the conductive layer of the circuit unit;
The electrical connection process includes disposing the conductive layer and the terminal so that the circuit connection piece overlaps the conductive layer.
Method of manufacturing electronic parts.

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