JP7209476B2 - electronic components - Google Patents

Description

FIELD OF THE DISCLOSURE The present disclosure relates generally to electronic components, and more particularly to electronic components having terminals and a substrate.

Patent Literature 1 discloses a variable resistor, which is a type of electronic component. The variable resistor disclosed in Patent Document 1 includes a resistance substrate and a resin substrate. A substantially arc-shaped resistance pattern is formed on the resistance substrate. A mounting portion for mounting the resistor substrate is formed on the upper surface of the resin substrate. At least a pair of electrode terminals are embedded in the resin substrate. The resistance substrate is adhered and fixed to the mounting portion via an insulating adhesive. The edge of the resistor pattern and the edge of the electrode terminal exposed from the resin substrate are electrically connected.

JP-A-3-204903

In Patent Document 1, when the variable resistor is mounted on the circuit board by soldering, thermal stress may be applied to the connection portion between the resistance board and the electrode terminals, resulting in poor connection.

An object of the present disclosure is to provide an electronic component capable of suppressing poor connection between a substrate and a terminal.

An electronic component according to one aspect of the present disclosure includes a substrate having a conductive layer, a plurality of terminals electrically and mechanically connected to the substrate, and a case accommodating the substrate. Each of the plurality of terminals includes a circuit connecting piece electrically connected to the conductive layer, an external connecting piece, and a connecting piece connecting the circuit connecting piece and the external connecting piece. The plurality of terminals are held by the case. The case includes a plurality of holes and a pair of dowels provided on both sides of each of the plurality of connecting pieces. In the direction from the circuit connection piece toward the external connection piece, the pair of dowels are provided on the external connection piece side with respect to the plurality of holes. The connecting pieces of the plurality of terminals are exposed from the case through the plurality of holes.

According to the present disclosure, connection failure between the substrate and the terminal can be suppressed.

FIG. 1 is a perspective view of the electronic component of Embodiment 1. FIG. FIG. 2 is an exploded perspective view of the electronic component. FIG. 3 is a top view of the main body block of the electronic component. 4 is a cross-sectional view taken along line AA of FIG. 3. FIG. FIG. 5 is a partial cross-sectional view of the main body block. FIG. 6 is a partial bottom view of the main body block. FIG. 7 is a process diagram of the method for manufacturing the electronic component. FIG. 8 is a partial perspective view of the electronic component of Embodiment 2. FIG. FIG. 9 is a partial perspective view of the electronic component of Embodiment 3. FIG. 10 is an exploded perspective view of the electronic component of Embodiment 4. FIG. FIG. 11 is a top view of the main body block of the electronic component.

1. Embodiment 1.1 Embodiment 1
1.1.1 Overview FIGS. 1 and 2 show an electronic component 10 of this embodiment. The electronic component 10 is a so-called variable resistor (potentiometer). The electronic component 10 includes a substrate 30, terminals 40, a case 50, and a holding structure 56 (see FIG. 5). Terminals 40 are electrically and mechanically connected to substrate 30, as shown in FIG. The case 50 accommodates the substrate 30 as shown in FIG. The holding structure 56 holds the terminal 40 to the case 50, as shown in FIG.

Thus, in the electronic component 10 , the terminal 40 is held by the case 50 by the holding structure 56 . Therefore, when the electronic component 10 is mounted on a circuit board (not shown) by soldering, the holding structure 56 can reduce the thermal stress applied to the connecting portions between the board 30 and the terminals 40 . Therefore, poor connection between the substrate 30 and the terminal 40 can be suppressed. The circuit board on which the electronic component 10 is mounted is a flexible board such as polyimide. The method of mounting the electronic component 10 on the circuit board is insertion mounting, not surface mounting.

1.1.2 Configuration Hereinafter, the electronic component 10 will be described in more detail with reference to the drawings. The electronic component 10 includes a body block 20 (see FIG. 3) and a brush block 70 (see FIG. 2).

The body block 20 includes a substrate 30, a plurality of (three in this embodiment) terminals 40, a case 50, and a holding structure 56, as shown in FIGS. In the following description, the three terminals 40 are referred to as a first terminal 40a, a second terminal 40b and a third terminal 40c, as required.

The substrate 30 includes an insulating substrate 31 , multiple (three in this embodiment) conductive layers 33 , and multiple (two in this embodiment) contact layers 34 . The substrate 30 constitutes a circuit of a rotary potentiometer that detects the rotation angle. In addition, in FIG. 2 and the like, the conductive layers 33 (331, 332, 333) and the contact layer 34 are indicated by different shades in consideration of the clarity of the drawings.

The insulating substrate 31 has electrical insulation. The insulating substrate 31 has a first surface and a second surface (top surface and bottom surface in FIG. 4) in the thickness direction, and supports the conductive layer 33 and the contact layer 34 on the first surface (see FIGS. 2 and 3). That is, the conductive layer 33 and the contact layer 34 are on the insulating substrate 31 . Note that the conductive layer 33 and the contact layer 34 are actually very thin compared to the insulating substrate 31, so they are not shown in FIG.

The insulating substrate 31 has a first region portion 311 and a second region portion 312, as shown in FIGS. The first region portion 311 and the second region portion 312 are integrally formed. The first area portion 311 has a circular opening 314 . The second region portion 312 is adjacent to the first region portion 311 . In the following description, the first direction (horizontal direction in FIG. 3 ) in which the first region portion 311 and the second region portion 312 are arranged is referred to as the longitudinal direction of the insulating substrate 31 . A second direction (vertical direction in FIG. 3 ) orthogonal to the thickness direction and the longitudinal direction of the insulating substrate 31 is called the width direction of the insulating substrate 31 .

The plurality of conductive layers 33 includes a first conductive layer 331, a second conductive layer 332, and a third conductive layer 333, as shown in FIG. The first conductive layer 331 , the second conductive layer 332 , and the third conductive layer 333 are all formed on the second region portion 312 of the insulating substrate 31 . However, the first conductive layer 331, the second conductive layer 332, and the third conductive layer 333 are spatially separated from each other. All of the plurality of conductive layers 33 are conductive layers. A material for the conductive layer 33 includes a conductive paste (eg, silver ink).

The first conductive layer 331 and the third conductive layer 333 are located on the second region portion 312 of the insulating substrate 31 . As shown in FIG. 3 , the first conductive layer 331 and the third conductive layer 333 are positioned on both sides of the second region portion 312 in the width direction of the insulating substrate 31 .

The first conductive layer 331 has a terminal connection portion 3311 and an extension portion 3312 . The terminal connection portion 3311 exists between the pair of insertion holes 35a. The pair of insertion holes 35 a pass through the insulating substrate 31 in the thickness direction and are aligned in the width direction of the insulating substrate 31 . The terminal connection portion 3311 is electrically connected to the terminal 40a. The terminal connection portion 3311 is positioned at one end of the second region portion 312 in the width direction of the insulating substrate 31 . The extending portion 3312 extends from the terminal connection portion 3311 toward the center of the second region portion 312 in the width direction of the insulating substrate 31 .

The third conductive layer 333 has a terminal connection portion 3331 and an extension portion 3332 . The terminal connection portion 3331 exists between the pair of insertion holes 35c. The pair of insertion holes 35 c pass through the insulating substrate 31 in the thickness direction and are aligned in the width direction of the insulating substrate 31 . The terminal connection portion 3331 is electrically connected to the third terminal 40c. The terminal connection portion 3331 is positioned at the other end of the second region portion 312 in the width direction of the insulating substrate 31 . The extending portion 3332 extends from the terminal connection portion 3331 toward the center of the second region portion 312 in the width direction of the insulating substrate 31 .

The second conductive layer 332 has a terminal connection portion 3321, a brush connection portion 3322, and a connecting portion 3323, as shown in FIG. The terminal connection portion 3321 exists between the pair of insertion holes 35b. The pair of insertion holes 35 b penetrate the insulating substrate 31 in the thickness direction and are arranged in the width direction of the insulating substrate 31 . The terminal connection portion 3321 is electrically connected to the second terminal 40b. The terminal connection portion 3321 is located between the terminal connection portion 3311 of the first conductive layer 331 and the terminal connection portion 3331 of the third conductive layer 333 in the width direction of the insulating substrate 31 . Brush connection 3322 is used for electrical connection with brush block 70 . The brush connection portion 3322 is formed so as to surround the opening 314 in the first region portion 311 of the insulating substrate 31 . As shown in FIG. 3, the brush connection portion 3322 is annular. The connecting portion 3323 connects the terminal connecting portion 3321 and the brush connecting portion 3322 to electrically connect them.

The plurality of contact layers 34 includes a first contact layer 341 and a second contact layer 342, as shown in FIG. However, the first contact layer 341 and the second contact layer 342 are spatially separated from each other. All of the plurality of contact layers 34 are conductive layers. Also, the contact layer 34 has a higher hardness than the conductive layer 33 . As a material for such a contact layer 34, a conductive paste (carbon ink, for example) having a hardness higher than that of the conductive paste of the conductive layer 33 can be used. In this case, the contact layer 34 can be used for contact with the brushes 71 of the brush block 70, and the electronic component 10 can be easily implemented as a variable resistor or the like.

The first contact layer 341 is formed on the insulating substrate 31 so as to surround the brush connecting portion 3322 of the second conductive layer 332 in the first region portion 311 of the insulating substrate 31 . The first contact layer 341 is arcuate. That is, the inner diameter of the first contact layer 341 is larger than the outer diameter of the brush connection portion 3322 of the second conductive layer 332 . The first contact layer 341 is coupled to the extension 3312 of the first conductive layer 331 and the extension 3332 of the third conductive layer 333 at both ends thereof. Thereby, the first contact layer 341 is electrically connected to the first conductive layer 331 and the third conductive layer 333 . In other words, the first conductive layer 331 and the third conductive layer 333 are electrically connected by the first contact layer 341 .

The second contact layer 342 is formed on the second conductive layer 332 so as to cover a portion of the second conductive layer 332 (the brush connection portion 3322). The second contact layer 342 is thereby electrically connected to the second conductive layer 332 .

A plurality of terminals 40 are used to electrically connect the substrate 30 to external circuitry. As shown in FIG. 2, the plurality of terminals 40 are a first terminal 40a, a second terminal 40b, and a third terminal 40c, all of which have the same shape. The first terminal 40 a , the second terminal 40 b and the third terminal 40 c are arranged in a line in the width direction of the insulating substrate 31 . In addition, the first terminal 40a, the second terminal 40b and the third terminal 40c are arranged in the longitudinal direction of the insulating substrate 31 such that the terminal connection portion 3311 of the first conductive layer 331, the terminal connection portion 3321 of the second conductive layer 332 and the third terminal connection portion 3321 They are located in parallel with the terminal connection portions 3331 of the conductive layer 333 .

Each terminal 40 has a pair of circuit connecting pieces 401, an external connecting piece 402, and a connecting piece 403, as shown in FIG. A pair of circuit connection pieces 401 is a portion electrically connected to the conductive layer 33 of the substrate 30 . Specifically, the pair of circuit connection pieces 401 is inserted through the pair of insertion holes 35 from the second surface (lower surface in FIG. 4) of the insulating substrate 31, and grips the portion between the pair of insertion holes 35. , to be caulked. It becomes a so-called embrace. In this way, the connecting portion between the substrate 30 and the terminal 40 is formed. This connection portion is exposed at the electronic component 10 . The external connection piece 402 is a part used for electrical connection with an external circuit. The connecting piece 403 is a portion that connects the pair of the circuit connecting piece 401 and the external connecting piece 402 . The external connection piece 402 protrudes from the tip of the connection piece 403 to the side opposite to the pair of circuit connection pieces 401 . A pair of circuit connecting pieces 401, an external connecting piece 402, and a connecting piece 403 are integrally formed. The terminal 40 can be formed by bending a metal plate.

The case 50 has electrical insulation, accommodates the substrate 30, and holds the terminals 40 (the first terminal 40a, the second terminal 40b, and the third terminal 40c). In this embodiment, the case 50 is a synthetic resin molding.

The case 50 has a housing portion 51 that exposes the first contact layer 341 and the second contact layer 342 of the substrate 30 from the bottom surface. The housing portion 51 has a circular portion that shares the central axis with the opening 314 of the insulating substrate 31 . The housing portion 51 has a circular opening 52 that shares the central axis with the opening 314 of the insulating substrate 31 , and a cylindrical portion 58 surrounding the opening 52 protrudes into the housing portion 51 . Further, the housing portion 51 has a projecting portion 59 on its bottom surface, and the insulating substrate 31 has a fitting hole 36 . The cylindrical portion 58 is inserted and fitted into the opening 314 of the insulating substrate 31 . Further, the projecting portion 59 is inserted and fitted into the fitting hole 36 of the insulating substrate 31 . Thereby, the substrate 30 is held by the case 50 . The accommodation portion 51 accommodates the brush block 70 so as to be rotatable around the central axis of the accommodation portion 51 .

The case 50 has a holding structure 56 that holds the terminals 40, as shown in FIG. This holding structure 56 can reduce the thermal stress applied to the connecting portion between the board 30 and the terminal 40 when the electronic component 10 is mounted on the circuit board by soldering. Therefore, poor connection between the substrate 30 and the terminal 40 can be suppressed.

This holding structure 56 has a structure for mechanically coupling the terminal 40 and the case 50 by a snap fit method. Specifically, the case 50 has an insertion hole 57 as shown in FIG. The insertion hole 57 is a through hole. The external connection piece 402 of the terminal 40 is inserted into the insertion hole 57 from within the accommodating portion 51 of the case 50 . The external connection piece 402 protrudes from the bottom surface of the case 50 (see FIG. 4). As shown in FIG. 5 , two projections 571 are formed on the inner surface of the insertion hole 57 in the width direction of the insulating substrate 31 so as to face each other. On the other hand, recesses 407 are formed on both sides of the external connection piece 402 . The holding structure 56 uses the elasticity of at least one of the terminal 40 and the case 50 to fit and hook the convex portion 571 of the case 50 into the concave portion 407 of the terminal 40 , thereby mechanically holding the terminal 40 and the case 50 together. bind to Thereby, the holding state of the substrate 30 and the terminals 40 can be stabilized. Further, by adopting the snap-fit method, it is possible to determine whether or not the terminal 40 and the case 50 are properly mechanically connected by the unique sound and feel when assembled by this method.

As described above, the external connection piece 402 of each terminal 40 protrudes from the insertion hole 57 to the outside of the case 50 . Therefore, the external connection piece 402 of each terminal 40 allows the electronic component 10 to be mounted on a desired circuit board. At this time, even if an external force acts on the external connection piece 402 from bottom to top, the holding structure 56 can prevent the influence of the external force from reaching the connecting portion between the substrate 30 and the terminal 40 . Therefore, poor connection between the substrate 30 and the terminal 40 can be suppressed.

When the case 50 is viewed from below, the insertion hole 57 has a contact avoidance portion 570 for avoiding contact with the terminal 40, as shown in FIG. Of the two surfaces of the insertion hole 57 that face each other along the longitudinal direction of the insulating substrate 31, one is a flat surface and the other is a convex curved surface formed with ribs 572. As shown in FIG. The flat surface and the tip of the rib 572 further hold the external connection piece 402 . Contact between the flat surface and the external connection piece 402 is surface contact, and contact between the tip of the rib 572 and the external connection piece 402 is line contact. A space exists on both sides of the rib 572 , and this space constitutes the contact avoidance portion 570 . The existence of the contact avoidance portion 570 can make it difficult for the heat of the terminal 40 to be transmitted to the case 50 .

The case 50 also has a plurality of (three in this embodiment) exposure holes 53, as shown in FIG. Each exposure hole 53 is a hole for exposing the terminal 40 from the bottom surface of the case 50 (see FIG. 6). In this embodiment, each exposure hole 53 has a rounded rectangular shape. In this embodiment, the three exposure holes 53 are a first exposure hole 53a, a second exposure hole 53b, and a third exposure hole 53c, all of which have the same shape. The first exposure hole 53a exposes a portion of the connecting piece 403 of the first terminal 40a. The second exposure hole 53b exposes a portion of the connecting piece 403 of the second terminal 40b. The third exposure hole 53c exposes a portion of the connecting piece 403 of the third terminal 40c. Furthermore, in this embodiment, as shown in FIG. 1, the upper surface of the connecting piece 403 of each terminal 40 is also exposed.

Since at least a part of the connecting piece 403 is exposed from the case 50 in this manner, the heat transferred to the terminal 40 during soldering can be dissipated from the upper and lower exposed surfaces of the circuit connecting piece 401.例文帳に追加More specifically, the heat transmitted from the external connection piece 402 to the connection piece 403 can be dissipated from the top of the case 50 and from the exposure hole 53 under the case 50, and the heat conduction to the circuit connection piece 401 can be reduced. can be suppressed. Therefore, thermal stress applied to the connecting portion between the substrate 30 and the terminal 40 can be reduced.

The brush block 70 is a member for electrically connecting the second contact layer 342 to any position of the first contact layer 341 . The brush block 70 includes a brush 71 and a mounting plate 72, as shown in FIG.

The brush 71 has conductivity. The brush 71 has a base 711 , a pair of first contacts 712 and a pair of second contacts 713 . The base portion 711 is a portion fixed to the mounting plate 72 . Both of the pair of first contacts 712 are used for contacting the first contact layer 341 of the substrate 30 . The pair of first contactors 712 are formed in an elastic shape (for example, leaf spring shape) so as to contact the first contact layer 341 with a predetermined contact pressure. A pair of first contacts 712 extend from the base 711 so as to be adjacent to each other. The pair of first contacts 712 are not linear but arcuate along the shape of the first contact layer 341 . Both of the pair of second contacts 713 are used for contacting the second contact layer 342 of the substrate 30 . The pair of second contactors 713 are formed in an elastic shape (eg leaf spring shape) so as to contact the second contact layer 342 with a predetermined contact pressure. A pair of second contacts 713 extend from the base 711 so as to be adjacent to each other. The pair of second contacts 713 are not linear but arcuate along the shape of the second contact layer 342 .

The mounting plate 72 is a member that holds the brush 71 . The mounting plate 72 has electrical insulation. The mounting plate 72 has a mounting portion 721 and a tubular portion 722 . The mounting portion 721 is disc-shaped. The brush 71 is attached to the surface of the attachment portion 721 facing the substrate 30 . Also, the mounting portion 721 has an opening 723 in the center. The central axis of the mounting portion 721 and the central axis of the opening 723 are aligned. The tubular portion 722 protrudes from both surfaces of the mounting portion 721 . The cylindrical portion 722 is cylindrical. The central axis of the cylindrical portion 722 and the central axis of the attachment portion 721 are aligned. Also, the inside of the cylindrical portion 722 is connected to the opening 723 . In addition, the cylindrical portion 722 has a locking piece 724 inside. The locking piece 724 can be used for mechanical connection between the electronic component 10 and an operating component (for example, an operating knob). The cylindrical portion 722 facing the substrate 30 is inserted into the cylindrical portion 58 of the case 50 and appropriately retained.

1.1.3 Manufacturing Method Next, a manufacturing method of the electronic component 10 will be described.

A substrate 30 is prepared. The substrate 30 can be manufactured as follows. A first conductive layer 331 , a second conductive layer 332 and a third conductive layer 333 are formed on predetermined regions on the insulating substrate 31 . In forming each of the first conductive layer 331, the second conductive layer 332, and the third conductive layer 333, a conductive material that is the material of each of the first conductive layer 331, the second conductive layer 332, and the third conductive layer 333 is used. The paste may be applied to a predetermined area and allowed to solidify. Next, a first contact layer 341 is formed on the insulating substrate 31 and a second contact layer 342 is formed on the second conductive layer 332 . In forming each of the first contact layer 341 and the second contact layer 342, a conductive paste, which is the material of each of the first contact layer 341 and the second contact layer 342, is applied to a predetermined area and solidified. good.

Also, a terminal 40 is prepared. In addition, the terminal 40 can be manufactured as follows. A metal plate is punched into a T-shape, and the T-shaped plate is bent.

Next, as shown in FIG. 7, the board 30 and the terminal 40 are connected. Specifically, the pair of circuit connecting pieces 401 of the terminal 40 are inserted through the pair of insertion holes 35 of the substrate 30 from bottom to top (that is, from the second surface to the first surface). Then, the pair of circuit connection pieces 401 projecting from the first surface are crimped, and the portion between the pair of insertion holes 35 is gripped by the pair of circuit connection pieces 401 .

Also, a case 50 is prepared. The board 30 is housed in the housing portion 51 of the case 50 and fixed. Terminals 40 are retained in case 50 by retaining structures 56 . The body block 20 is thus obtained.

A brush block 70 is attached to the body block 20 thus obtained. Thus, the electronic component 10 shown in FIG. 1 is obtained.

1.1.4 Operation Next, the operation of the electronic component 10 will be briefly described. In the electronic component 10, the first contact layer 341 of the substrate 30 is interposed between the first terminal 40a and the third terminal 40c. The first contact layer 341 is electrically connected to the second contact layer 342 by the brushes 71 of the brush block 70, and the second contact layer 342 is electrically connected to the second terminal 40b. Rotating the brush block 70 changes the position (contact position) at which the pair of first contactors 712 of the brush 71 contacts the first contact layer 341 . Such a change in contact position results in a change in resistance value between the first terminal 40a or the third terminal 40c and the second terminal 40b. That is, by rotating the brush block 70, the resistance value between the first terminal 40a or the third terminal 40c and the second terminal 40b can be changed. The material of the second contact layer 342 greatly affects the resistance value between the first terminal 40a and the third terminal 40c. When the material of the second contact layer 342 is carbon ink, the resistance value between the first terminal 40a and the third terminal 40c can be changed by changing the ratio of resin to carbon in the carbon ink.

Further, in the electronic component 10, if a constant voltage is applied between the first terminal 40a and the third terminal 40c, the potential of the second terminal 40b changes according to the change in contact position. Therefore, according to the electronic component 10, the rotational position of the brush block 70 can be detected.

1.2 Embodiment 2
1.2.1 Overview As shown in FIG. 8, the electronic component 10 of the present embodiment has a structure in which the holding structure 56 mechanically couples the terminals 40 and the case 50 by resin caulking. It is different from the electronic component 10 of the first form. Hereinafter, the same components as those of the electronic component 10 of Embodiment 1 are denoted by the same reference numerals, and description thereof will be omitted as appropriate.

1.2.2 Configuration A pair of dowels 560 protrude from both sides of the insertion hole 57 of the case 50 . The dowel 560 is integrated with the case 50 . That is, the dowel 560 is made of synthetic resin. After inserting the external connection piece 402 of the terminal 40 into the insertion hole 57, the tips of the pair of dowels 560 are mechanically or thermally crushed and crimped. In this manner, the terminals 40 and the case 50 can be mechanically coupled by resin caulking. Thereby, the holding state of the substrate 30 and the terminals 40 can be stabilized. Even if an external force acts on the external connection piece 402 from bottom to top, the holding structure 56 with the dowels 560 described above can prevent the influence of this external force from reaching the connecting portion between the board 30 and the terminal 40 . Therefore, poor connection between the substrate 30 and the terminal 40 can be suppressed.

1.3 Embodiment 3
1.3.1 Overview The electronic component 10 of this embodiment differs from the electronic components 10 of Embodiments 1 and 2 in that the terminal 40 has a heat sink 406 as shown in FIG. Hereinafter, the same components as those of the electronic component 10 of Embodiments 1 and 2 are denoted by the same reference numerals, and description thereof will be omitted as appropriate.

1.3.2 Configuration The terminal 40 further has a heat sink 406 . More specifically, terminal 40 further has a pair of heat sinks 406 . Each heat sink 406 is T-shaped. A pair of heat radiating pieces 406 protrude from both sides of the connecting piece 403 to the side opposite to the external connection piece 402 . A half cut is made between the pair of heat radiating pieces 406 and the connecting piece 403 . Therefore, the pair of heat radiating pieces 406 can be cut and removed from the connecting piece 403 as needed.

When the electronic component 10 of the present embodiment is mounted on a circuit board by soldering, the heat transferred to the terminals 40 can be dissipated by the heat dissipation piece 406 . More specifically, the heat transferred from the external connection piece 402 can be dissipated from the heat radiation piece 406, and heat conduction to the circuit connection piece 401 can be suppressed. Therefore, thermal stress applied to the connecting portion between the substrate 30 and the terminal 40 can be reduced.

1.4 Embodiment 4
1.4.1 Overview The electronic component 10 of this embodiment is different from the electronic components 10 of Embodiments 1 to 3 in that it is a so-called rotary switch. In the following, configurations similar to those of the electronic component 10 of Embodiments 1 to 3 are denoted by the same reference numerals, and description thereof will be omitted as appropriate.

1.4.2 Configuration As shown in FIG. 10, the substrate 30 includes an insulating substrate 31 and a plurality of (three in this embodiment) conductive layers 37 .

The insulating substrate 31 supports the conductive layer 37 on the first surface (see FIG. 11). That is, the conductive layer 37 is on the insulating substrate 31 .

The multiple conductive layers 37 include a first conductive layer 371, a second conductive layer 372, and a third conductive layer 373, as shown in FIG. The first conductive layer 371, the second conductive layer 372, and the third conductive layer 373 are spatially separated from each other. All of the plurality of conductive layers 37 are conductive layers. A material for the conductive layer 37 includes a conductive paste (eg, silver ink).

As shown in FIG. 11, the first conductive layer 371 and the third conductive layer 373 are positioned on both sides of the insulating substrate 31 in the width direction.

The first conductive layer 371 has a first terminal connection portion 3711 , a first extension portion 3712 and a first contact portion 3713 .

The first terminal connection portion 3711 exists between the pair of insertion holes 35a. The first terminal connection portion 3711 is electrically connected to the first terminal 40a. The first terminal connection portion 3711 is positioned at one end of the second region portion 312 in the width direction of the insulating substrate 31 .

The first extension portion 3712 extends from the first terminal connection portion 3711 to the first contact portion 3713 .

The first contact portion 3713 is formed on the insulating substrate 31 so as to surround the opening 314 in the first region portion 311 of the insulating substrate 31 . The first contact portion 3713 has an arc shape of about 1/6 of the circumference. One end of the first contact portion 3713 is coupled to the first extension portion 3712 . Thereby, the first contact portion 3713 is electrically connected to the first terminal connection portion 3711 and the first extension portion 3712 .

The second conductive layer 372 has a second terminal connection portion 3721 , a second extension portion 3722 and a third contact portion 3723 .

The second terminal connection portion 3721 exists between the pair of insertion holes 35b. The second terminal connection portion 3721 is electrically connected to the second terminal 40b. The second terminal connection portion 3721 is positioned in the center of the second region portion 312 in the width direction of the insulating substrate 31 .

The second extension portion 3722 extends from the second terminal connection portion 3721 to the second contact portion 3723 .

The second contact portion 3723 is formed on the insulating substrate 31 so as to surround the opening 314 in the first area portion 311 of the insulating substrate 31 . The second contact portion 3723 has an arc shape of about half the circumference. The second contact portion 3723 is coupled to the second extension portion 3722 at its central portion. Thereby, the second contact portion 3723 is electrically connected to the second terminal connection portion 3721 and the second extension portion 3722 .

The third conductive layer 373 has a third terminal connection portion 3731 , a third extension portion 3732 and a third contact portion 3733 .

The third terminal connection portion 3731 exists between the pair of insertion holes 35c. The third terminal connection portion 3731 is electrically connected to the third terminal 40c. The third terminal connection portion 3731 is positioned at the other end of the second region portion 312 in the width direction of the insulating substrate 31 .

The third extension portion 3732 extends from the third terminal connection portion 3731 to the third contact portion 3733 .

The third contact portion 3733 is formed on the insulating substrate 31 so as to surround the opening 314 in the first area portion 311 of the insulating substrate 31 . The third contact portion 3733 has an arc shape of about 1/6 of the circumference. One end of the third contact portion 3733 is coupled to the third extension portion 3732 . Thereby, the third contact portion 3733 is electrically connected to the third terminal connection portion 3731 and the third extension portion 3732 .

The first contact portion 3713, the second contact portion 3723, and the third contact portion 3733 existing around the opening 314 are spatially separated from each other. In this case, the first to third contact portions 3713 to 3733 can be used for contact with the brush 71, making it easier to implement the electronic component 10 as a rotary switch or the like.

The brush 71 has a base 711 and three pairs of contacts 714, as shown in FIG. The three pairs of contacts 714 are evenly spaced around the base 711 . A pair of contacts 714 are used to contact the first to third contact portions 3713 to 3733 of the substrate 30 . The pair of contacts 714 are formed in an elastic shape (for example, leaf spring shape) so as to contact the first to third contact portions 3713 to 3733 of the substrate 30 with a predetermined contact pressure. A pair of contacts 714 extend from the base 711 so as to be adjacent to each other. The pair of contacts 714 are not linear but arcuate along the shape of the opening 314 .

1.4.3 Operation Next, the operation of the electronic component 10 will be briefly described. By rotating the brush block 70, it is possible to switch between the ON state and the OFF state. For example, the ON state can be achieved by connecting the first terminal 40a and the second terminal 40b, or by connecting the second terminal 40b and the third terminal 40c. Alternatively, none of the first to third terminals 40a to 40c can be connected to the OFF state.

2. Modifications The embodiment described above is merely one of various embodiments of the present disclosure. Further, the above-described embodiment can be modified in various ways according to the design and the like, as long as the object of the present disclosure can be achieved. Modifications of the above embodiment are listed below.

The electronic component 10 is not limited to a variable resistor (potentiometer), and may be any electronic component that requires a substrate and terminals. Examples of such electronic components include variable resistors (potentiometers), rotary encoders and rotary switches.

The shape of the insulating substrate 31 is merely an example and is not particularly limited. The shape of the insulating substrate 31 may be changed depending on the type and application of the electronic component.

In the above embodiment, the substrate 30 has three conductive layers 33, but the number of conductive layers 33 is not particularly limited. Substrate 30 may have at least one conductive layer 33 . Also, the conductive layer 33 may have a single-layer structure or a multilayer structure.

Also, the number of contact layers 34 is not particularly limited. The substrate 30 may have one or more contact layers 34 or no contact layers 34 . Considering the use of the contact layer 34, the contact layer 34 as a whole need not have higher hardness than the conductive layer 33. In other words, the contact layer 34 should have hardness higher than that of the conductive layer 33 at least at the portion forming the surface (the portion in contact with the brush 71).

In the above embodiment, the electronic component 10 has three terminals 40, but the number of terminals 40 is not particularly limited. Substrate 30 may have at least one terminal 40 . Also, the shape of the terminal 40 may be changed depending on the type and application of the electronic component.

In the above embodiment, the terminal 40 is held in the case 50 by a snap fit method or a resin caulking method, but the terminal 40 may be held in the case 50 by press fitting.

In the above embodiment, when connecting the terminal 40 and the case 50 by the snap-fit method, the recess 407 is formed in the terminal 40 and the protrusion 571 is formed in the case 50, but the unevenness may be reversed.

In the above-described embodiment, a pair of dowels 560 are formed on both sides of the insertion hole 57 of the case 50 when the terminal 40 and the case 50 are joined by the resin caulking method. not.

In the above embodiment, the shape of the heat radiating piece 406 is T-shaped, but the shape is not particularly limited.

In the above embodiment, the case 50 has three exposure holes 53, but the number of exposure holes 53 is not particularly limited. Moreover, although one exposure hole 53 exposes one terminal 40 in the above embodiment, one exposure hole 53 may expose a plurality of terminals 40 . For example, case 50 may have larger exposure holes 53 including three exposure holes 53 (53a, 53b, 53c). Also, the exposure hole 53 may be circular, elliptical, polygonal, or any other shape.

Note that the shape of the case 50 is merely an example and is not particularly limited. The shape of the case 50 may be changed depending on the type and application of the electronic component.

The rotary switch may be either shorting type or non-shorting type.

In the above-described embodiment, the method of forming layers such as the conductive layer 33 is not limited to the method of applying and solidifying the material of the layer, and conventionally known layer forming techniques can be used. Examples of methods for solidifying materials include drying (including natural drying), heating, light irradiation, and the like. A solidification method can be appropriately selected according to the material of the layer. Also, the conductive paste used for the conductive layer 33 and the like is not limited to the examples given in the above embodiments, and can be selected from various conventionally known conductive pastes. That is, the conductive paste may contain resin (eg, epoxy-based and phenol-based) and conductive particles (eg, copper, silver, and carbon).

3. Aspects As is clear from the above embodiments and modifications, the present disclosure includes the following first to sixth aspects. In the following, reference numerals are attached with parentheses only for the purpose of clarifying correspondence with the embodiments.

An electronic component (10) according to a first aspect comprises a substrate (30), terminals (40; 40a to 40c) electrically and mechanically connected to the substrate (30), and the substrate (30). It comprises a case (50) for housing, and a holding structure (56) for holding the terminals (40; 40a to 40c) in the case (50).

According to this aspect, since the terminals (40; 40a to 40c) are held by the case (50), connection failure between the board (30) and the terminals (40; 40a to 40c) can be suppressed.

In the electronic component (10) according to a second aspect, in the first aspect, the holding structure (56) mechanically snap-fits the terminals (40; 40a to 40c) and the case (50) together. has a structure that binds to

According to this aspect, the holding state between the substrate (30) and the terminals (40; 40a to 40c) can be stabilized.

In the electronic component according to a third aspect, in the first or second aspect, the holding structure (56) mechanically connects the terminals (40; 40a to 40c) and the case (50) by a resin caulking method. It has a binding structure.

According to this aspect, the holding state between the substrate (30) and the terminals (40; 40a to 40c) can be stabilized.

An electronic component (10) according to a fourth aspect is the electronic component (10) according to any one of the first to third aspects, wherein the case (50) has insertion holes (57) into which the terminals (40; 40a to 40c) are inserted. have. The insertion hole (57) has a contact avoidance portion (570) for avoiding contact with the terminals (40; 40a-40c).

According to this aspect, the contact avoidance portion (570) can make it difficult for the heat of the terminals (40; 40a to 40c) to be conducted to the case (50).

An electronic component (10) according to a fifth aspect is the electronic component (10) according to any one of the first to fourth aspects, wherein the terminals (40; 40a to 40c) have heat sinks (406).

According to this aspect, the heat transferred to the terminals (40; 40a to 40c) during soldering or the like can be dissipated by the heat sink (406).

An electronic component (10) according to a sixth aspect is the electronic component (10) according to any one of the first to fifth aspects, wherein the terminals (40; 40a to 40c) are circuit connection pieces (401) connected to the substrate (30). , and an external connection piece (402) connected to an external circuit. The external connection piece (402) protrudes from the case (50). At least part of the circuit connection piece (401) is exposed from the case (50).

According to this aspect, the heat transmitted to the terminals (40; 40a to 40c) during soldering or the like can be dissipated from the exposed surface of the circuit connection piece (401).

REFERENCE SIGNS LIST 10 electronic component 30 substrate 40, 40a to 40c terminal 401 circuit connection piece 402 external connection piece 406 heat dissipation piece 50 case 56 holding structure 57 insertion hole 570 contact avoidance part

Claims (6)

a substrate having a conductive layer;
a plurality of terminals electrically and mechanically connected to the substrate;
and a case that accommodates the substrate,
each of the plurality of terminals includes a circuit connecting piece electrically connected to the conductive layer, an external connecting piece, and a connecting piece connecting the circuit connecting piece and the external connecting piece;
The plurality of terminals are held by the case,
The case includes a plurality of holes and a pair of dowels provided on both sides of each of the plurality of connecting pieces,
The pair of dowels are provided on the external connection piece side with respect to the plurality of holes in the direction from the circuit connection piece toward the external connection piece,
The connecting pieces of the plurality of terminals are exposed from the case through the plurality of holes,
electronic components. The holding structure for holding the plurality of terminals in the case has a structure for mechanically coupling the plurality of terminals and the case by a snap-fit method.
The electronic component according to claim 1. The holding structure for holding the plurality of terminals in the case has a structure for mechanically coupling the plurality of terminals and the case by a resin caulking method.
The electronic component according to claim 1 or 2. The case has insertion holes into which the plurality of terminals are inserted,
The insertion hole has a contact avoidance portion that avoids contact with the plurality of terminals,
The electronic component according to any one of claims 1 to 3. The connection piece has a heat dissipation piece,
The electronic component according to any one of claims 1-4. The external connection piece protrudes from the case,
The electronic component according to any one of claims 1-5.

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