JP2004266255A - Production method of substrate for electronic component - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a production method of a substrate for electronic components in which productivity is enhanced and the cost is reduced by facilitating the production even in the case of a substrate structure for a chip electronic components where a pattern, e.g. a terminal pattern, is formed from the upper surface of an insulating base through the outer circumferential side face to the lower surface. <P>SOLUTION: A flexible circuit board 20 provided with a resistor pattern and a terminal pattern being connected with the resistor pattern, and dies 41 and 45 having a cavity C1 formed to copy the external shape of a substrate for the electronic components are prepared. The flexible circuit board 20 is contained in the cavity C1 of the dies 41 and 45 and a part of the flexible circuit board 20 on the side provided with the terminal pattern is turned up. The turn-up part of the flexible circuit board 20 is applied tightly to the lower surface of the cavity C1 from the upper surface thereof through the outer circumferential side face by filling the cavity C1 with molten molding resin and the dies 41 and 45 are removed after curing the molding resin. <P>COPYRIGHT: (C)2004,JPO&NCIPI

Description

  The present invention relates to a method for manufacturing an electronic component substrate used for a semi-fixed variable resistor and the like.

  Conventionally, a chip-type semi-fixed variable resistor includes a ceramic substrate, a slider, and a current collector, and a slider is disposed on an upper surface of the ceramic substrate and a current collector is disposed on a lower surface of the ceramic substrate. At this time, the cylindrical projection provided on the current collector plate is inserted into the through hole provided in the ceramic substrate and the fitting insertion hole provided in the slider, and the tip of the cylindrical projection is swaged to thereby attach the slider to the ceramic substrate. It is configured to be rotatably fixed on the upper side.

  On the other hand, on the upper surface of the ceramic substrate, a horseshoe-shaped resistor pattern is formed on which the sliding contact of the slider slides when the slider is rotated. A terminal pattern is provided to extend from the outer periphery of the substrate to the lower surface via the side surface.

  However, since the semi-fixed variable resistor uses a ceramic substrate, a resistor pattern must be printed on the ceramic substrate, or a terminal pattern must be provided from the upper surface to the lower surface via the side surface. The production efficiency is low, the material cost is high, and there is a limit to reducing the price. Further, the ceramic substrate is easily broken, and it is difficult to further reduce the thickness.

  On the other hand, conventionally, an electronic component substrate in which a resistor pattern made of a resistor paste such as a carbon paste is formed on the surface of a resin mold substrate has been developed (for example, Patent Document 1). According to this electronic component substrate, since a mold resin that can be easily manufactured at low cost is used as the substrate, and an inexpensive carbon paste is used as the resistor pattern, productivity is improved as compared with the ceramic substrate. , And lower prices.

However, when the electronic component substrate is formed into a chip, similarly to the case of the ceramic substrate, the terminal patterns connected to both ends of the resistor pattern are formed so as to be drawn out from the outer periphery of the substrate to the lower surface via the side surfaces. Although it is necessary, the formation of the terminal pattern needs to be performed on two surfaces different from the surface on which the resistor pattern is formed, so that the step is required and the cost is increased.
JP-A-63-299302

  The present invention has been made in view of the above points, and has as its object a so-called chip-type electronic component substrate structure in which a pattern such as a terminal pattern is formed from the upper surface of an insulating base to the lower surface via an outer peripheral side surface. However, an object of the present invention is to provide a method for manufacturing an electronic component substrate, which can be easily manufactured, productivity is improved, and cost can be reduced.

  The invention according to claim 1 of the present application provides a flexible circuit board comprising a synthetic resin film provided with a conductor pattern on the surface of which a slider slidably contacts and a terminal pattern connected to the conductor pattern, and a board for an electronic component. A mold having a cavity formed in the outer shape of the mold is prepared, and the flexible circuit board is housed in the cavity of the mold. The flexible circuit by abutting one surface of the inside and a portion on the side provided with the terminal pattern being folded back to the other surface side of the cavity, and filling the cavity with a molten molding resin. The folded part of the substrate is brought into close contact with the lower surface of the cavity from the upper surface via the outer peripheral side surface, and the mold is removed after the filled molding resin has solidified. In addition, the portion where the conductor pattern is provided on the upper surface of the insulating base made of the molding resin is exposed, and the portion on the side where the terminal pattern is provided is exposed in a folded state from the outer peripheral side surface to the lower surface. To manufacture a substrate for electronic components.

  The invention described in claim 2 of the present application comprises a flexible circuit board provided with a conductor pattern on a surface of which a slider slides on a synthetic resin film and a terminal pattern connected to the conductor pattern, and a metal plate. A current collector plate and a mold having a cavity formed in the outer shape of the electronic component substrate are prepared, and the flexible circuit board and the current collector plate are stored in the cavity of the mold. The surface on which the conductor pattern of the flexible circuit board is provided abuts on one surface in the cavity, and the portion on the side on which the terminal pattern is provided is folded back on the other surface side of the cavity, and the inside of the cavity is By filling the molten molding resin, the folded portion of the flexible circuit board is brought into close contact with the lower surface through the outer peripheral side surface from the upper surface of the cavity, and the filled molding resin is formed. By removing the mold after solidification, the portion where the conductor pattern was provided on the upper surface of the insulating base made of the molding resin was exposed, and the portion on the side where the terminal pattern was provided was folded from the outer peripheral side surface to the lower surface. A method for manufacturing a substrate for an electronic component, wherein the substrate is exposed in a state and a current collector plate is embedded.

  According to the first aspect of the present invention, by simply insert-molding the flexible circuit board into the cavity of the mold, the conductor pattern is exposed on the upper surface of the insulating base and the terminal pattern is moved from the outer peripheral side surface to the lower surface. In this way, an electronic component substrate having a structure that is exposed and provided over a period of time can be easily manufactured, and cost reduction can be achieved. Further, the material cost can be reduced as compared with the ceramic substrate, and the thickness can be reduced easily and inexpensively. Also, a large number of sets of conductor patterns are simultaneously formed on a synthetic resin film, and then an insulating base is simultaneously formed on each of the flexible circuit boards provided with the respective sets of conductor patterns, and then the integrally connected flexible circuit boards are cut. Since it can be individualized, electronic component substrates can be easily mass-produced, and productivity is improved.

  According to the invention described in claim 2 of the present application, the conductor pattern is exposed on the upper surface of the insulating base and the terminal pattern is formed only by insert-molding the flexible circuit board and the current collector into the cavity of the mold. An electronic component substrate having a structure that is exposed from the outer peripheral side surface to the lower surface and further has a current collecting plate attached thereto can be easily manufactured, thereby improving productivity and reducing costs. Further, the material cost can be reduced as compared with the ceramic substrate, and the thickness can be reduced easily and inexpensively.

Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.
[First embodiment]
1 and 2 are views showing an electronic component substrate 1-1 manufactured using the first embodiment of the present invention. FIG. 1 is a perspective view, FIG. 2 (a) is a plan view, and FIG. 2B is a front view, FIG. 2C is a cross-sectional view taken along line AA of FIG. 2A, and FIG. 2D is a rear view. As shown in both figures, the electronic component substrate 1-1 is configured by integrally attaching a flexible circuit board 20 to the upper surface of an insulating base 10 by insert molding. Hereinafter, each component will be described.

  The insulating base 10 is a substantially rectangular and plate-shaped synthetic resin molded product. A circular through hole 11 is provided at the center, and a concave current collecting plate housing recess 15 is provided at the center of the lower surface. The insulating base 10 is made of a thermoplastic synthetic resin, such as nylon or polyphenylene sulfide (PPS).

  On the other hand, the flexible circuit board 20 is formed by providing terminal patterns 29, 29 on a thermoplastic synthetic resin film (for example, a polyimide film) and a conductor pattern 25 on the surface of which a slider slides. That is, the flexible circuit board 20 is provided with a through-hole 21 having the same inner diameter as the through-hole 11 in the center of the synthetic resin film at a position corresponding to the through-hole 11, and surrounds the through-hole 21 on the surface in a horseshoe shape. A conductor pattern (hereinafter, referred to as a “resistor pattern”) 25 is provided, and terminal patterns 29 are connected to the resistor pattern 25 at both ends of the resistor pattern 25, respectively. The side of the flexible circuit board 20 on which the terminal patterns 29, 29 are provided is folded back from the upper surface of the insulating base 10 to the lower surface via the outer peripheral side, whereby the terminal patterns 29, 29 are also formed on the insulating base. 10 extends from the outer periphery to the lower surface.

Here, the resistor pattern 25 is formed of a metal thin film formed by physical vapor deposition (PVD, physical vapor deposition) or chemical vapor deposition (CVD, chemical vapor deposition). As a method of physical vapor deposition, vacuum vapor deposition, sputtering, ion beam vapor deposition, or the like is used. As a chemical vapor deposition method, a thermal CVD method, a plasma CVD method, a light CVD method, or the like is used. As a material of the resistor pattern 25 to be deposited, a nickel-based material such as a nickel-chromium alloy, a cermet-based material made of a chromium silicate-based compound (Cr—SiO ₂ ), or a tantalum-based material such as tantalum nitride is used. . Since the chromium silicate-based compound can easily realize a large specific resistance of 2000 μΩ · cm or more, it is suitable for downsizing the electronic component substrate 1-1. According to the resistor pattern 25 formed by metal deposition of this type, it is needless to say that the entire resistor pattern 25 can be formed to have a uniform and uniform thickness. Since there is no resin inside, the resistance value does not easily change due to heat or temperature. For example, in the case of a resistor pattern obtained by printing and firing a carbon paste, the temperature coefficient of resistance was 500 ppm / ° C., whereas the temperature coefficient of resistance in the case of a metal thin film using the above-described vacuum deposition was 100 ppm / ° C. This is a good temperature characteristic equivalent to the case where the resistor pattern is printed on the ceramic substrate at a high temperature. That is, since the resistor pattern (conductor pattern) 25 is formed of a metal thin film formed by physical vapor deposition or chemical vapor deposition, good temperature and humidity characteristics equivalent to those of a conductor pattern baked on a ceramic substrate at a high temperature can be obtained. . In addition, since it is deposited, the production efficiency is higher than that of baking on a ceramic substrate.

  Next, the terminal patterns 29, 29 are formed by sequentially forming a copper layer and a gold layer on a nichrome base by vapor deposition. Since the terminal patterns 29, 29 do not directly affect the change in the resistance value, they may be formed by other means such as printing and firing of a conductive paste.

  Next, a method of manufacturing the electronic component substrate 1-1 will be described. First, as shown in FIG. 3, a flexible circuit board 20 having a through-hole 21 on which a resistor pattern 25 and terminal patterns 29, 29 are formed by a metal thin film formed by physical vapor deposition or chemical vapor deposition is prepared. The flexible circuit board 20 has connecting portions 31, 31 projecting from both sides thereof, and the connecting portions 31, 31 connect the same many flexible circuit boards 20 in parallel.

  Next, as shown in FIG. 4, the flexible circuit boards 20 connected by the connecting portions 31, 31 are inserted into a first die 41 and a second die 45 composed of two dies. At this time, a cavity C1 having the same shape as the outer shape of the electronic component substrate 1-1 is formed in the first and second molds 41 and 45, but the flexible circuit board 20 has the resistor pattern 25 formed therein. The surface is brought into contact with the inner plane C11 of the cavity C1 on the side of the first mold 41, and one end provided with the terminal patterns 29, 29 is folded back to the second mold 45 side. That is, the flexible circuit board 20 is housed in the cavity C1 of the first and second molds 41 and 45, and at this time, the surface on which the resistor pattern 25 of the flexible circuit board 20 is provided is connected to one surface (in the cavity C1). The portion on the side provided with the terminal patterns 29, 29, which is in contact with the first mold 41 side, is folded back to the other surface side (the second mold 45 side) of the cavity C1. The shape of the cavity C1 is formed in the outer shape of the electronic component substrate 1-1. Specifically, the cavity C1 has a convex portion that forms a circular through hole 11 at the center. It has a substantially rectangular plate shape having a thickness of. Further, as shown in FIG. 4, the parting surface PS of the convex portion including the two dies 41 and 45 for providing the through hole 11 is located in a portion to be the through hole 11.

  Then, synthetic resin (nylon, polyphenylene) heated and melted from two resin injection ports (arrows P1, P2 shown in FIG. 1 and P1, P2 shown in FIG. 4) provided on the first mold 41 side of the cavity C1. And the cavity C1 is filled by press-fitting and filling. Then, the folded portion of the flexible circuit board 20 is pressed against the inner peripheral surface of the cavity C1 as shown by a dotted line in FIG. 4 by the press-fitting pressure of the molten resin, and is cooled and solidified in that state. That is, by filling the cavity C1 with the molten molding resin, the folded portion of the flexible circuit board 20 is brought into close contact with the lower surface via the outer peripheral side surface from the upper surface of the cavity C1, and is cooled and solidified in that state. You. Then, the first and second molds 41 and 45 are removed, and the portions of the connecting portions 31 and 31 protruding from both sides of the formed insulating base 10 are cut, so that the electronic component substrate 1 shown in FIGS. -1 is completed. That is, the flexible circuit board 20 is arranged from the upper surface of the substantially rectangular plate-shaped insulating base 10 to the lower surface via one outer peripheral side surface. A through hole 11 is provided in the center of the insulating base 10, a horseshoe-shaped resistor pattern 25 is provided on a flexible circuit board 20 on the outer periphery thereof, and terminal patterns 29, 29 are provided on both ends thereof. 29, 29 are further provided on the lower surface of the insulating base 10 via one outer peripheral side surface.

  As described above, according to this embodiment, the resistor pattern 25 is formed on the upper surface of the insulating base 10 only by insert-molding the flexible circuit board 20 into the cavity C1 of the first and second molds 41 and 45. , And the electronic component substrate 1-1 having the structure in which the terminal patterns 29, 29 are exposed from the outer peripheral side surface to the lower surface thereof can be easily manufactured, and the cost can be reduced. Further, the material cost can be reduced as compared with the ceramic substrate, and the thickness can be reduced easily and inexpensively. Also, a plurality of sets of resistor patterns 25 are simultaneously formed on the synthetic resin film, and then the insulating bases 10 are simultaneously formed on the flexible circuit board 20 on which the respective sets of resistor patterns 25 are provided. Since the circuit board 20 can be cut into individual products, the electronic component substrate 1-1 can be easily mass-produced, and the productivity is improved.

  5A and 5B are views showing a semi-fixed variable resistor 100-1 configured using the electronic component substrate 1-1, wherein FIG. 5A is a plan view, FIG. 5B is a front view, and FIG. FIG. 5C is a sectional view taken along line BB of FIG. 5A, and FIG. 5D is a rear view. As shown in the figure, the semi-fixed variable resistor 100-1 has the slider 60 disposed on the upper surface of the electronic component substrate 1-1, the current collector plate 50 disposed on the lower surface, and provided on the current collector plate 50. The cylindrical projection 51 is passed through the through holes 11 and 21, and the tip of the cylindrical projection 51 that has passed through the electronic component substrate 1-1 passes through a fitting hole 61 provided in the slider 60. The slider 60 is rotatably mounted by caulking the tip thereof. Here, the current collecting plate 50 is housed in the current collecting plate housing recess 15 provided on the lower surface of the electronic component substrate 1-1. When the slider 60 is rotated, the sliding contact 63 provided on the slider 60 is brought into sliding contact with the surface of the resistor pattern 25 (see FIG. 2) so that the terminal patterns 29, 29 and the current collector plate 50 Change the resistance value of

[Second embodiment]
6A and 6B are views showing an electronic component substrate 1-2 manufactured using the second embodiment of the present invention. FIG. 6A is a plan view, FIG. 6B is a front view, and FIG. FIG. 6C is a sectional view taken along line DD of FIG. 6A, and FIG. 6D is a rear view. In the electronic component substrate 1-2 shown in the figure, the same portions as those of the electronic component substrate 1-1 are denoted by the same reference numerals, and the detailed description thereof will be omitted. Also in this electronic component substrate 1-2, the flexible circuit board 20 is integrally attached to the upper surface of the insulating base 10 by insert molding, and the resistor pattern 25 formed on the flexible circuit board 20 is It is composed of a metal thin film formed by physical vapor deposition or chemical vapor deposition.

  The difference between the electronic component substrate 1-2 and the electronic component substrate 1-1 is that a current collecting plate 50-2 is further integrally formed inside the insulating base 10 on the electronic component substrate 1-1. Is a point. Here, the current collecting plate 50-2 is a tube projecting toward the surface of the electronic component substrate 1-2 on which the resistor pattern 25 is provided, at the center of a base 53-2 formed by forming a metal plate into a substantially rectangular shape. The protrusions 51-2 are provided, and are protruded outward from one side of the outer periphery of the base 53-2 in a substantially rectangular shape and bent twice at substantially right angles to form the resistor pattern 25 of the electronic component substrate 1-2. And a connecting portion 55-2 exposed on the surface opposite to the surface on which the is provided. The distal end of the connection part 55-2 is divided into three parts, and the center part thereof is bent substantially at right angles to the surface on which the resistor pattern 25 of the electronic component substrate 1-2 is provided. In the electronic component substrate 1-2, the current collector plate 50-2 is disposed such that the cylindrical projection 51-2 is located in the through hole 11 of the insulating base 10 (at the same time, the through hole 21 of the flexible circuit board 20). It is embedded by insert molding inside the insulating base 10 so as to be located at the (center). At this time, the lower surface of the connection portion 55-2 is exposed on the lower surface of the insulating base 10 as described above. The cylindrical protrusion 51-2 protrudes on the upper surface side of the flexible circuit board 20. With this configuration, when the insulating base 10 is formed, the insulating base 10, the flexible circuit board 20, and the current collector plate 50-2 can be simultaneously integrated, so that the manufacturing process can be simplified.

  Next, a method for manufacturing the electronic component substrate 1-2 will be described. First, a flexible circuit board 20 having a through hole 21 similar to that shown in FIG. 3 and having a resistor pattern 25 and terminal patterns 29, 29 formed on its surface by a metal thin film formed by physical vapor deposition or chemical vapor deposition, A current collector plate 50-2 shown in FIG. 6 is prepared. As described above, this flexible circuit board 20 has connecting portions 31 protruding from both sides thereof, and the connecting portions 31 connect a large number of the same flexible circuit boards 20 in parallel. Also, the current collector plate 50-2 is connected in parallel to the same number of current collector plates 50-2 by connecting the distal end portion of the connection portion 55-2 to a connection member (not shown).

  Next, as shown in FIG. 8, the flexible circuit boards 20 connected by the connecting portions 31 and the current collecting plates 50-2 connected by the connecting members are placed in the first and second molds 41 and 45, respectively. Insert into At this time, a cavity C1 having the same shape as the outer shape of the electronic component substrate 1-2 is formed in the first and second molds 41 and 45, but the flexible circuit board 20 has the resistor pattern 25 formed therein. The surface is brought into contact with the inner plane C11 of the cavity C1 on the side of the first mold 41, and one end provided with the terminal patterns 29, 29 is folded back to the second mold 45 side. That is, the flexible circuit board 20 is housed in the cavity C1 of the first and second molds 41 and 45, and the surface on which the resistor pattern 25 of the flexible circuit board 20 is provided is placed on one surface in the cavity C1. The portion on the side provided with the terminal patterns 29, 29 in contact with the cavity C1 is folded back toward the other surface of the cavity C1. At the same time, the base plate 53-2 of the current collector plate 50-2 is clamped by the first and second molds 41 and 45, and at the same time, the projections formed by the two molds 41 and 45 are formed in the cylindrical projection 51-2. The part is inserted, and the lower surface of the connection part 55-2 further adheres to the surface of the second mold 45.

  Then, synthetic resin (nylon, polyphenylene sulfide, etc.) heated and melted from two resin injection ports P1 and P2 (see FIG. 6A) provided on the first mold 41 side of the cavity C1. Fill to fill cavity C1. Then, the folded portion of the flexible circuit board 20 is pressed against the inner peripheral surface of the cavity C1 as shown by a dotted line in FIG. 8 by the press-fitting pressure of the molten resin, and is cooled and solidified in that state. That is, by filling the cavity C1 with the molten molding resin, the folded portion of the flexible circuit board 20 is brought into close contact with the lower surface via the outer peripheral side surface from the upper surface of the cavity C1, and is cooled and solidified in that state. You. Then, the first and second molds 41 and 45 are removed, and the connecting portions 31 and 31 protruding from both sides of the molded insulating base 10 and the tip of the connecting portion 55-2 of the current collecting plate 50-2 protruding. By cutting the portion, the electronic component substrate 1-2 shown in FIG. 6 is completed. That is, the flexible circuit board 20 is arranged from the upper surface of the substantially rectangular plate-shaped insulating base 10 to the lower surface via one outer peripheral side surface. A through hole 11 is provided in the center of the insulating base 10, a horseshoe-shaped resistor pattern 25 is provided on a flexible circuit board 20 on the outer periphery thereof, and terminal patterns 29, 29 are provided on both ends thereof. 29, 29 are further provided on the lower surface of the insulating base 10 via one outer peripheral side surface. Further, the current collecting plate 50-2 is integrally embedded in the insulating base 10, and a through-hole 11 provided in the insulating base 10 is provided with a cylindrical projection 51-2 of the current collecting plate 50-2. The base 53-2 is embedded in the insulating base 10, and the connecting portion 55-2 is connected to the lower surface of the insulating base 10 (however, the terminal patterns 29, 29 exposed on the lower surface). (The lower surface on the outer peripheral side facing the surface).

  As described above, according to this embodiment, the flexible circuit board 20 and the current collector plate 50-2 are simply insert-molded into the cavities C1 of the molds 41 and 45, so that the upper surface of the insulating base 10 has a resistance. The body pattern 25 is exposed, the terminal patterns 29, 29 are exposed from the outer peripheral side surface to the lower surface, and the electronic component substrate 1-2 having a structure to which the current collecting plate 50-2 is further attached can be easily manufactured. Thus, productivity can be improved and cost can be reduced. Further, the material cost can be reduced as compared with the ceramic substrate, and the thickness can be reduced easily and inexpensively.

  7A and 7B are views showing a semi-fixed variable resistor 100-2 configured by using the electronic component substrate 1-2, wherein FIG. 7A is a plan view, FIG. 7B is a front view, and FIG. FIG. 7C is a sectional view taken along the line EE of FIG. 7A, and FIG. 7D is a rear view. As shown in the figure, the semi-fixed variable resistor 100-2 is a cylindrical projection 51-2 provided on the current collecting plate 50-2 when the slider 60 is arranged on the upper surface of the electronic component substrate 1-2. Is penetrated into a fitting hole 61 provided in the slider 60, and the slider 60 is rotatably mounted by caulking the tip. When the slider 60 is rotated, the sliding contact 63 provided on the slider 60 slides on the surface of the resistor pattern 25 (see FIG. 6), and the terminal patterns 29, 29 and the current collector 50 -2 changes the resistance value.

[Third embodiment]
9 and 10 are views showing an electronic component substrate 1-3 manufactured using the third embodiment of the present invention. FIG. 9 (a) is a perspective view seen from above, and FIG. ) Is a perspective view as viewed from below, FIG. 10A is a plan view, FIG. 10B is a front view, FIG. 10C is a cross-sectional view taken along line E-E of FIG. () Is a back view. In the electronic component substrate 1-3 shown in the figure, the same parts as those of the electronic component substrates 1-1 and 1-2 are denoted by the same reference numerals, and detailed description thereof will be omitted. Also in this electronic component substrate 1-3, the flexible circuit board 20 is integrally attached to the upper surface of the insulating base 10 by insert molding, and the resistor pattern 25 formed on the flexible circuit board 20 is It is composed of a metal thin film formed by physical vapor deposition or chemical vapor deposition. The material of each member constituting the electronic component substrate 1-3 and the manufacturing method thereof are the same as the material of the corresponding member of the first and second embodiments and the manufacturing method thereof.

  Also in this embodiment, the insulating base 10 is a plate-like synthetic resin molded product having a substantially rectangular shape, and the current collecting plate 50-3 is connected to the insulating base 10 in the same manner as the electronic component substrate 1-2. It is integrally insert molded inside. The current collecting plate 50-3 has the same shape as the current collecting plate 50-2, and a resistor 53 of the electronic component substrate 1-3 is provided at the center of a base 53-3 formed by forming a metal plate into a substantially rectangular shape. By providing a cylindrical projection 51-3 protruding on the surface side on which the pattern 25 is provided, and protruding outward from one side of the outer periphery of the base 53-3 in a substantially rectangular shape and bending twice at a substantially right angle, The connecting board 55-3 is provided to be exposed on the surface of the component substrate 1-3 opposite to the surface on which the resistor pattern 25 is provided. The distal end of the connection part 55-3 is divided into three parts, and the center part thereof is bent substantially at right angles to the surface on which the resistor pattern 25 of the electronic component substrate 1-3 is provided. Also in the electronic component substrate 1-3, the current collector plate 50-3 is disposed such that the cylindrical projections 51-3 thereof are in the through holes 11 of the insulating base 10 (at the same time, the through holes 21 of the flexible circuit board 20). It is embedded by insert molding inside the insulating base 10 so as to be located at the (center). At this time, the lower surface of the connection portion 55-3 is exposed on the lower surface of the insulating base 10 as described above. The inner diameters of the through-hole 11 and the through-hole 21 are larger than the outer diameter of the cylindrical protrusion 51-3, and the cylindrical protrusion 51-3 protrudes toward the upper surface of the flexible circuit board 20. With this configuration, as in the second embodiment, the insulating base 10, the flexible circuit board 20, and the current collector 50-3 can be simultaneously integrated, so that the manufacturing process can be simplified.

  Next, the flexible circuit board 20 has a substantially rectangular shape (the width is substantially the same as the width of the insulating base 10 and the length is a predetermined length longer than the length of the insulating base 10) as shown in FIG. A through-hole 21 having the same inner diameter as the through-hole 11 is provided at a position corresponding to the through-hole 11 in the center of the film, and a horseshoe-shaped conductor pattern (hereinafter referred to as a "resistor pattern" ”), And terminal portions 29 (29) of a substantially rectangular shape along the length direction (A) are connected to end portions (25e, 25e) of the resistor pattern 25. The flexible circuit board 20 has its side on which the terminal patterns 29, 29 are provided folded from the upper surface of the insulating base 10 to the lower surface via the outer peripheral side, whereby the flexible circuit board 20 is connected to the upper surface of the insulating base 10. It is attached to the insulating base 10 in a state of being bent so that the surface is exposed on the outer peripheral side surface and the lower surface. Therefore, the resistor pattern 25 is exposed on the upper surface of the insulating base 10, and the terminal patterns 29, 29 are exposed from the upper surface of the insulating base 10 and the outer peripheral side to the lower surface.

  In the electronic component substrate 1-3, an arc covering an end 71 on one side in the length direction (A) (the resistor pattern 25 side) outside the resistor 25 of the flexible circuit board 20. A holding portion 17a having a shape (however, it does not cover the resistor pattern 25) and two terminal patterns 29, 29 are provided at a portion near the outer periphery of the ends (25e, 25e) of the resistor pattern 25 of the flexible circuit board 20. And a lower surface of the insulating base 10 covering an end 73 of the flexible circuit board 20 disposed on the lower surface of the insulating base 10 on the side where the terminal patterns 29, 29 are provided. Are provided by insert molding resin integrally with the insulating base 10, whereby the flexible circuit board 20 is firmly fixed to the insulating base 10. .

  The end 71 of the flexible circuit board 20 is formed in an arc shape in accordance with the arc shape of the resistor pattern 25, and the holding portion 17a is also formed in an arc shape in accordance with the arc shape.

  A pair of concave cutouts are formed on both outer peripheral sides (ie, both ends in the width direction (B) of the flexible circuit board 20) of a portion where the terminal patterns 29, 29 of the resistor pattern 25 of the flexible circuit board 20 are connected. Resin insertion portions 75a, 75a are provided, and a resin insertion portion 75b formed of a through hole is provided between the two terminal patterns 29, 29. The resin insertion portions 75a, 75a, 75b The pressing portion 17b is formed in an arc shape in accordance with the arc shape of the pattern 25. The holding portion 17b is connected to the molding resin constituting the insulating base 10 below the resin insertion portions 75a, 75a, 75b at the portions thereof.

  An end side 73 of the other side in the length direction (A) (terminal pattern 29, 29 side) folded back on the lower surface side of the insulating base 10 of the flexible circuit board 20 has a substantially linear shape. A concave portion 77 (see FIG. 11) that is concave in an arc shape is provided at the center. A pressing portion 17c is formed on one end 73 so as to press the end 73 at a plurality of places (five places). The surface of the flexible circuit board 20 near the end side 73 is further separated from the surface immediately after the flexible circuit board 20 is folded back to the lower surface side of the insulating base 10 (the lower surface located on the side surface side of the insulating base 10). The recesses 78 are recessed toward the inside of the circuit board 10. However, since the surface of the holding portion 17c is flush with the exposed surfaces of the terminal patterns 29, 29, the flexible circuit is formed by the thickness of the holding portion 17c. This is because the surface of the substrate 20 needs to be kept low.

  Next, a method of manufacturing the electronic component substrate 1-3 will be described. First, as shown in FIG. 11, a through hole 21 and resin insertion portions 75a, 75a, 75b are provided, and a resistor pattern 25 and terminal patterns 29, 29 are formed on the surface thereof by a metal thin film by physical vapor deposition or chemical vapor deposition. The prepared flexible circuit board 20 and the current collector 50-3 shown in FIG. 10 are prepared. The flexible circuit board 20 has connecting portions 31, 31 protruding from both sides of the portion where the resistor pattern 25 is provided, and these connecting portions 31, 31 enable the same large number of flexible circuit boards 20 (not shown). They are connected in parallel. The same number of current collectors 50-3 are also connected in parallel by connecting the tip of the connection part 55-3 to a connection member (not shown).

  Next, as shown in FIG. 12, the flexible circuit boards 20 connected by the connecting portions 31 and the current collector plates 50-3 connected by the connecting members are placed in the first and second molds 41 and 45 as shown in FIG. Insert. At this time, a cavity C1 having the same shape as the outer shape of the electronic component substrate 1-3 is formed in the first and second molds 41 and 45, but the flexible circuit board 20 is formed with the resistor pattern 25 thereof. The surface is brought into contact with the inner plane C11 of the cavity C1 on the side of the first mold 41, and the end portion 73 side portion on which the terminal patterns 29, 29 are provided is folded back to the second mold 45 side. That is, the flexible circuit board 20 is housed in the cavity C1 of the first and second molds 41 and 45, and at this time, the surface on which the resistor pattern 25 of the flexible circuit board 20 is provided is connected to one surface (in the cavity C1). The portion on the side provided with the terminal patterns 29, 29, which is in contact with the first mold 41 side, is folded back to the other surface side (the second mold 45 side) of the cavity C1. At the same time, the base plate 53-3 of the current collector plate 50-3 is sandwiched between the first and second molds 41 and 45, and the lower surface of the connection portion 55-3 is in close contact with the surface of the second mold 45. The reason why the concave portion 77 (see FIG. 11) is provided in the end 73 of the flexible circuit board 20 is that when the end 73 side portion of the flexible circuit board 20 is folded back to the second mold 45 side, This is because the flexible circuit board 20 escapes so that the flexible circuit board 20 does not come into contact with the projection 47 for forming the through hole 11 provided in the hole 45.

  The synthetic resin heated and melted from two resin injection ports (arrows G1 and G2 shown in FIG. 9A and G1 and G2 shown in FIG. 12) provided on the mold 41 side is pressed and filled to form a cavity. Fill in C1. At this time, the flexible circuit board 20 is pressed against the inner peripheral surface of the cavity C1 by the press-in pressure and heat of the molten resin, deforms into the inner peripheral surface shape, and is cooled and solidified in that state. That is, by filling the cavity C1 with the molten molding resin, the folded portion of the flexible circuit board 20 is brought into close contact with the lower surface via the outer peripheral side surface from the upper surface of the cavity C1, and is cooled and solidified in that state. You. Then, the first and second molds 41 and 45 are removed, and the connecting portions 31 and 31 projecting from both sides of the molded insulating base 10 and the connecting portion 55-3 of the projecting current collector plate 50-3 are formed. By cutting the tip, the electronic component substrate 1-3 shown in FIGS. 9 and 10 is completed.

  As described above, the end portion 73 and the vicinity thereof are intermittently pressed at a plurality of places by the holding portion 17c because a part of the end side 73 is brought into contact with the surface of the second mold 45. This is because the end 73 is pushed up to the surface of the second mold 45 by the press-fitting pressure of the melt-molded resin so as not to be deformed. That is, the side 73 and the vicinity thereof exposed from the lower surface of the insulating base 10 without providing the holding portion 17c are formed as a result of pressing the side 73 and the vicinity thereof by the second mold 45. is there.

  As described above, according to this embodiment, the insulating base is simply formed by insert-molding the flexible circuit board 20 and the current collecting plate 50-3 into the cavities C1 of the first and second molds 41 and 45. In addition to exposing the resistor pattern 25 on the upper surface of the substrate 10 and exposing the terminal patterns 29, 29 from the outer peripheral side surface to the lower surface, the electronic component substrate 1-3 having a structure in which the current collecting plate 50-3 is attached can be easily formed. It can be manufactured, productivity can be improved, and cost can be reduced. Further, the material cost can be reduced as compared with the ceramic substrate, and the thickness can be reduced easily and inexpensively.

  According to the electronic component substrate 1-3, the flexible circuit board 20 provided on the upper surface of the insulating base 10 and the flexible circuit board 20 provided on the lower surface of the insulating base 10 are respectively provided with the flexible circuit board 20. Since the holding portions 17a to 17c for firmly fixing to the insulating base 10 are provided, even if the flexible circuit board 20 and the insulating base 10 are made of a material which is difficult to be fixed only by heat and pressure during insert molding. However, such a problem does not occur that the flexible circuit board 20 is peeled off from the surface of the insulating base 10 and the flexible circuit board 20 can be easily and firmly fixed. In this embodiment, the holding portions 17a to 17c are provided on the side of the resistor pattern 25 provided on the upper surface side of the insulating base 10 of the flexible circuit board 20, and the ends 25e and 25e of the resistor pattern 25 are provided. 25e and the terminal patterns 29 provided on the lower surface side of the insulating base 10 and the end side 73 on the 29 side, but the flexible circuit board 20 is relatively fixed on the insulating base 10. In the case of firmness, the holding part may be provided only in one of these three places. In this case, the portion of the flexible circuit board 20 bent toward the lower surface of the insulating base 10 has the strongest stress to return to the original shape and is easily peeled off. Preferably, a portion 17c is provided.

  The electronic component substrate 1-3 manufactured as described above penetrates the cylindrical projection 51-3 into the insertion hole 61 of the slider 60 similar to that shown in FIG. By caulking, the slider 60 is rotatably mounted, thereby forming a semi-fixed variable resistor.

  Although the embodiment of the present invention has been described above, the present invention is not limited to the above embodiment, and various modifications may be made within the scope of the claims and the technical idea described in the specification and the drawings. It is possible. Note that any shape, structure, or material not directly described in the specification and drawings is within the scope of the technical idea of the present invention as long as the effects and effects of the present invention are exhibited. For example, in each of the above embodiments, a resistor pattern is used as a conductor pattern, but other various patterns such as a switch pattern may be used. When a switch pattern is provided, the switch pattern and the terminal pattern may be formed of the same material and formed in the same step. Although the resistor patterns 25 are provided on the terminal patterns 29 in the above embodiments, the terminal patterns 29 may be provided on the resistor patterns 25.

FIG. 1 is a perspective view of an electronic component substrate 1-1 configured using the first embodiment of the present invention. 2A and 2B are diagrams illustrating an electronic component substrate 1-1 configured using the first embodiment of the present invention, wherein FIG. 2A is a plan view, FIG. 2B is a front view, and FIG. 2A is a sectional view taken along the line AA in FIG. 2A, and FIG. 2D is a rear view. FIG. 5 is an explanatory diagram of a method of manufacturing the electronic component substrate 1-1. FIG. 5 is an explanatory diagram of a method of manufacturing the electronic component substrate 1-1. 5A and 5B are diagrams showing a semi-fixed variable resistor 100-1 configured using the electronic component substrate 1-1, wherein FIG. 5A is a plan view, FIG. 5B is a front view, and FIG. FIG. 5A is a sectional view taken along line BB, and FIG. 5D is a rear view. FIGS. 6A and 6B are diagrams showing an electronic component substrate 1-2 configured using the second embodiment of the present invention, wherein FIG. 6A is a plan view, FIG. 6B is a front view, and FIG. FIG. 6A is a cross-sectional view taken along the line DD of FIG. 6A, and FIG. FIGS. 7A and 7B are diagrams illustrating a semi-fixed variable resistor 100-2 configured using the electronic component substrate 1-2, wherein FIG. 7A is a plan view, FIG. 7B is a front view, and FIG. FIG. 7A is a cross-sectional view taken along the line EE, and FIG. 7D is a rear view. FIG. 4 is an explanatory diagram of a method of manufacturing the electronic component substrate 1-2. It is a figure which shows the board | substrate 1-3 for electronic components comprised using 3rd Embodiment of this invention, FIG.9 (a) is a perspective view seen from the upper side, FIG.9 (b) is seen from the lower side. FIG. 10A and 10B are diagrams showing an electronic component substrate 1-3 configured using the third embodiment of the present invention, wherein FIG. 10A is a plan view, FIG. 10B is a front view, and FIG. 10A is a cross-sectional view taken along the line EE of FIG. 10A, and FIG. FIG. 4 is an explanatory diagram of a method of manufacturing the electronic component substrate 1-3. FIG. 4 is an explanatory diagram of a method of manufacturing the electronic component substrate 1-3.

Explanation of reference numerals

1-1 Substrate for Electronic Components 10 Insulation Base 11 Through Hole 15 Current Conveying Plate Recess 20 Flexible Circuit Board 21 Through Hole 25 Resistor Pattern (Conductive Pattern)
29, 29 Terminal pattern 31 Connecting part 41 First mold 45 Second mold C1 Cavity C11 Inner plane P1, P2 Resin injection port 100-1 Semi-fixed variable resistor 50 Current collector plate 51 Cylindrical protrusion 60 Slider 61 Insertion hole 63 Sliding contact 1-2 Electronic component substrate 50-2 Current collector plate 51-2 Cylindrical projection 53-2 Base 55-2 Connection 100-2 Semi-fixed variable resistor 1-3 Electronic component Substrate 17a, 17b, 17c Holding part 50-3 Current collector plate 51-3 Cylindrical projection 53-3 Base 55-3 Connection part 71 End side 73 End side 75a, 75b Resin insertion part G1, G2 Resin injection port

Claims (2)

A flexible circuit board comprising a synthetic resin film provided with a conductor pattern on which the slider slides and a terminal pattern connected to the conductor pattern, and a cavity formed in the outer shape of the electronic component substrate. Prepare a mold with
The flexible circuit board is housed in the cavity of the mold, and the surface of the flexible circuit board on which the conductor pattern is provided abuts on one surface in the cavity, and the portion on the side where the terminal pattern is provided. To the other side of the cavity,
By filling the cavity with the molten molding resin, the folded portion of the flexible circuit board is brought into close contact with the lower surface via the outer peripheral side surface from the upper surface of the cavity,
By removing the mold after the filled molding resin is solidified, the portion where the conductor pattern is provided on the upper surface of the insulating base made of the molding resin is exposed, and the portion on the side where the terminal pattern is provided is removed from the outer peripheral side surface. A method for manufacturing a substrate for an electronic component, wherein the substrate is exposed in a folded state over a lower surface. A flexible circuit board comprising a synthetic resin film provided with a conductor pattern on which the slider is in sliding contact with the surface and a terminal pattern connected to the conductor pattern, a current collector plate made of a metal plate, and a substrate for electronic components. Prepare a mold having a cavity formed in the external shape,
The flexible circuit board and the current collecting plate are housed in the cavity of the mold, and the surface on which the conductor pattern of the flexible circuit board is provided is in contact with one surface in the cavity and a terminal pattern is provided. Folded back on the other side of the cavity,
By filling the cavity with the molten molding resin, the folded portion of the flexible circuit board is brought into close contact with the lower surface via the outer peripheral side surface from the upper surface of the cavity,
By removing the mold after the filled molding resin is solidified, the portion where the conductor pattern is provided on the upper surface of the insulating base made of the molding resin is exposed, and the portion on the side where the terminal pattern is provided is removed from the outer peripheral side surface. A method for manufacturing a substrate for an electronic component, wherein the substrate is exposed in a folded state over a lower surface and a current collector plate is embedded.

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