JPH02170403A - Electronic part - Google Patents

Abstract

PURPOSE:To make an assembled body thinner for miniaturization by a method wherein a substrate comprising a thin film is inserted into a case while a thin metallic sheet sliding piece is inserted into a sliding type body. CONSTITUTION:A resin mold case 1 made of a case 11 integrated with a flexible substrate 13 is manufactured by inserting the substrate 13 comprising a flexible thin film into the synthetic resin made case 11. On the other hand, a slider 2 is manufactured by integrating a sliding piece 23 with a sliding type body 21 by inserting the metallic sliding piece 23 into the synthetic resin made sliding type body 21. Next, the slider 2 is contained in the resin mold case 1 to be covered with a cover 3 and then the cover 3 is fixed on the case 1 using the pawls 31 of the cover 3 as well as the protrusions 115 of the case 1. At this time, the contacts 231 of the slider 2 come into sliding-contact with the resin pattern 131 to produce a rotary variable resistor. In such a constitution, the case 1 and the slider 2 can be easily integrated with each other so that the mutual assembling of parts may be facilitated to produce a thin and compact resistor. In such a constitution, the case 1 and the slider 2 can easily be integrated with each other so that the mutual assembling of parts may be facilitated to produce a thin and compact resistor.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to electronic components such as variable resistors and code switches.

[Conventional technology]

Electronic components such as rotary variable resistors, sliding variable resistors, rotary code switches, and sliding foot switches used in electronic devices are printed on substrates and cases with various patterns and various patterns on the substrate. It has a structure in which a substrate is fixed to the bottom of the case, the slider is rotatably or slidably supported on the substrate, and the top is covered with a cover.

Each component such as the substrate, case, sliding body, slider attached to the sliding body, cover, etc. is manufactured as a separate component, and these components are assembled in a later assembly process to complete the electronic component.

In recent years, as electronic devices have become smaller and thinner, rotary variable resistors and sliding variable resistors, or rotary switches and slide switches attached to electronic devices have also become smaller and thinner.

[Problem to be solved by the invention]

However, in the case of such conventional rotating electronic components and sliding electronic components, it is necessary to manufacture each component separately and assemble these components individually, so it is necessary to make them smaller and thinner. There is a problem that there is a limit to the size of the device, and as the device becomes smaller and thinner, it becomes difficult to assemble each component.

The present invention has been made in view of the above-mentioned points, and an object of the present invention is to provide an electronic component that can be made smaller and thinner, and that can be easily assembled.

[Means to solve the problem]

In order to solve the above-mentioned problems, the present invention provides an electronic component by inserting a flexible substrate, which is made by forming a conductive pattern on a synthetic resin film, into a synthetic resin case so that the conductive pattern is exposed. a resin molded case that integrates the flexible substrate and the case;
A metal slider having a sliding contact that slides on the conductor pattern of the flexible substrate is inserted into a synthetic resin sliding mold so that the sliding contact is exposed to the outside. A structure comprising a sliding body that integrates a mover and a sliding type object, and the sliding body is housed in the resin molded case so that the sliding contact of the sliding body comes into sliding contact with the conductor pattern of the resin molded case. And so.

[Effect]

By configuring the electronic components as described above, it is easy to integrate the case and the board, it is also easy to integrate the sliding type and the slider, and furthermore, the integration of these integrated components is easy. Since it is easy to assemble, it is easy to manufacture.

In addition, a board made of a thin film is inserted into the case, and a slider made of a thin metal plate is inserted into the sliding type, so the overall thickness when assembled can be reduced, making it more compact. It is also possible to achieve

〔Example〕

Hereinafter, one embodiment of the present invention will be described in detail based on the drawings.

FIG. 1 is an exploded perspective view showing the case where the present invention is applied to a rotary variable resistor.

As shown in the figure, in this rotary variable resistor, the flexible substrate 13 and the case 11 are integrated by inserting the flexible substrate 13 made of a flexible thin film into the case 11 made of synthetic resin. A resin molded case 1, a sliding body 2 in which a metal slider 23 is integrated into a synthetic resin slider 21 by inserting the slider 23 into a synthetic resin slider 21, and a cover. 3, the sliding body 2 is housed in a resin molded case 1, and the upper part of the sliding body 2 is covered with a cover 3.

Each component will be explained in detail below.

The resin molded case 1 is constructed by insert-molding a flexible substrate 13 into a case 11.

FIG. 2 is a diagram showing this resin molded case 1, and FIG. 2(a) is a plan view, and FIG. 2(b) is a sectional side view taken along the line A--A in FIG. 2(a).

As shown in the figure, this resin molded case 1 has a flexible substrate 13 inserted inside the case 11,
Further, three metal terminals 15 are protruded from the side of the case 11.

The case 11 includes a substantially disk-shaped bottom plate portion 111 and the bottom plate portion 1.
11, and a side wall portion 113 standing upright on the outer periphery of the base plate portion 11, and a column 117 that rotatably supports a sliding body 2, which will be described later, is provided at the center of the bottom plate portion 111. Furthermore, a protrusion 115 for fixing the cover 3 described below is formed on the outer side surface of the side wall portion 113.

The flexible substrate 13 has a donut-shaped resistor pattern 131 and a current collector pattern 132 printed on the upper surface of a resin film. exposed to.

Further, the metal terminal 15 is fixed to the flexible substrate 13.

Next, a method of manufacturing this resin molded case 1 will be explained.

3 and 4 show a metal terminal 1 on a flexible board 13.
5 is a diagram showing a method of connecting 5.

Here, the flexible substrate 13 has a resistor pattern 131 on a thermoplastic and heat-resistant belt-shaped synthetic resin film. Current collection pattern 132 and conductor pattern 13 connected to these
3 is printed and then cut, leaving the support portion 130. As the synthetic resin film, for example, a film of polyparabanic acid, polyetherimide, polyethylene terephthalate, etc. is used.

Next, the metal terminal/child 15 formed integrally with the support member 150
is prepared, and the tip portion of the metal terminal 15 is placed on the conductive pattern 133 of the flexible substrate 13 via a hot melt type conductive adhesive layer.

Next, a reinforcing plate 17 made of a synthetic resin film of the same quality as the flexible substrate 13 is placed on the metal terminal 15 placed on the conductor pattern 133, and then the metal terminal 1 on the reinforcing plate 17 is placed.
An ultrasonic emitting horn (not shown) is placed on the part where 5 is not located (the part 171 in FIG. By locally melting the synthetic resin films constituting the flexible substrate 13 by ultrasonic heating, the metal terminals 15 are firmly fixed onto the conductor pattern 133 by the shrinkage force of these synthetic resin films.

Next, the metal terminal 15 is heated with a heating iron from above the reinforcing plate 17 or the flexible substrate 13 to melt the conductive adhesive layer, thereby firmly fixing the metal terminal 15 on the conductor pattern 133. .

Note that, since the synthetic resin film is firmly melted and fixed by the ultrasonic heating, the conductive adhesive may not be used in some cases.

FIG. 4 is a plan view showing the state in which the metal terminals 15 are attached to the flexible substrate 13 as described above. Then, the reinforcing plate 17 is cut along the line CC shown in the figure.

The close reading structure between the flexible substrate 13 and the metal terminals 15 configured as described above not only has a high connection strength, but also has a thickness that allows the flexible substrate 13 and the metal terminals 15 to have a high connection strength.
Since the thickness is only that of the reinforcing plate 17 and the conductive adhesive layer, the terminal connection structure is extremely thin.

Next, a method for inserting the flexible substrate 13 having the above structure into the case 11 will be explained using FIG. 5.

First, as shown in FIG. 5(a), a flexible substrate 13 with metal terminals 15 attached thereto is inserted between a first mold A and a second mold B. As shown in FIG.

Here, the first mold A has a flat surface A in the center thereof.
1 is formed, a circumferential groove A2 is formed around the flat surface A1, and a cylindrical hole A3 is formed in the center of the flat surface A1.

Here, the flat surface A1 is the surface to which the resistor pattern 131 of the flexible substrate 13 is in close contact, and the circumferential groove A2 is the surface of the case 11.
The hole A3 is a groove in which the side wall portion 113 of the case 11 is formed, and the hole A3 is a hole in which the support column 117 of the case 11 is formed.

The second mold B has the flat surface A1 and the circumferential groove A of the first mold A.
A recess B1 is formed in a portion corresponding to 2, and a through hole B2 is formed approximately in the center of the recess B1.

Next, as shown in the same figure (a), the through hole B of the second mold B
2, a heated and melted resin material (for example, mu of polyphenylene sulfide, polyethylene terephthalate, polybutylene terephthalate, liquid crystal polymer, etc.) is press-fitted (arrow Di).

This melting l! By press-fitting j4m, the inside of the recess B1 of the second mold B and the circumferential groove A2 of the first mold A is filled with the molten resin material. On the other hand, the filling of the molten resin into hole A3 is performed using the same Ug.
As shown in J(b), this is done by breaking through the synthetic resin film constituting the flexible substrate 13 by the press-fitting pressure of the molten resin material (arrow D2). In this way, by piercing the flexible substrate 13 and filling the hole A3 with the molten resin material, the synthetic resin film comes into close contact with the inner surface of the hole A3 and does not peel off from the inner surface.

After the filled molten resin material has solidified, the first mold A and the second mold B are removed, and the mold B shown in FIG.
By cutting along lines -B and DD, a resin molded case 1 with a flexible substrate 13 inserted therein as shown in FIG. 2 is completed.

Next, the sliding body 2 is constructed by inserting a metal slider 23 into a sliding mold 21, as shown in FIG.

As shown in the figure, the sliding member 21 has a substantially disk-shaped base 211.
A cylindrical knob 213 extending upward from the center of the top surface of the
It is constructed by protruding. Further, in order to reinforce the base 211, a long reinforcing protrusion 215 is provided on the upper surface of the base 211. A metal slider 23 is inserted into the base 211, and a sliding contact 231, which is a part of the slider 23, protrudes from the base 211 to the outside. Also, a click spring 23 integrally formed with the slider 23
2 also protrudes into the space provided inside the base 211.

Next, a method of manufacturing this sliding body 2 will be explained.

FIGS. 6 and 7 are diagrams for explaining a method of manufacturing the slider 2 by pouring synthetic resin into the slider 23. FIGS.

As shown in FIG. 6, first, a thin band-shaped metal plate 20 is pressed to form a slider 23 with supporting parts 201 and 201 interposed therebetween. The slider 23 is formed into a substantially disk shape, and a sliding contact 231 that slides into contact with the resistor pattern 131 of the resin molded case 1 and a click spring 232 are formed inside the slider 23 .

Next, as shown in FIG. 7, the slider 23 is placed in two molds (
(not shown), and press-fit a heated and melted resin material (for example, polyphenylene sulfide, polyethylene terephthalate, etc.). After the resin material is cured, the mold is removed. As a result, a sliding molded article 21 with a slider 23 inserted therein as shown in FIG. 7 is completed. As shown in FIG. 7(b), a cylindrical hole 217 is formed in the center of the bottom of the sliding member 21. As shown in FIG.

Then, by cutting along the line EE shown in FIG. 7, the sliding body 2 as shown in FIG. 1 is completed.

As shown in FIG. 1, the cover 3 is composed of a metal plate large enough to cover the upper surface of the resin molded case 1, and includes a locking protrusion 31 that is engaged with the case 11 from the outer periphery downward. A fixing protrusion 33 is formed for fixing this rotary variable resistor to another substrate or the like. Further, a hole 35 for inserting the knob 213 of the sliding body 2 and a click hole 37 into which the click spring 232 of the sliding body 2 is engaged are formed on the upper surface thereof.

Next, to assemble this rotary variable resistor, as shown in FIG. 1, the base 211 of the sliding body 2 is inserted into the case 11 of the resin molded case 1. At this time, the sliding contacts 231, 231 of the sliding body 2 come into sliding contact with the resistor patterns 131, 131 of the resin molded case 1. Also, at this time, the pillar 117 of the resin molded case 1 is inserted into the hole 217 of the sliding body 2 (
(see FIG. 7(b)). If the cover 3 is placed over the sliding body 2 and the locking protrusion 31 of the cover 3 is engaged between the protrusions 115 formed on the outer periphery of the case 11,
The rotary variable resistor according to the present invention is completed.

FIG. 8 is a side sectional view of the rotary variable resistor produced in this manner. Then, when the knob 213 is rotated, the sliding contacts 231, 231 respectively move to the resistor pattern 131.
131 to change the resistance value between the three metal terminals 15.

Note that when the sliding body 2 is rotated and the tip of the click spring 232 of the sliding body 2 engages with the click hole 37 (see FIG. 1) of the cover 3, a clicking sensation occurs. In this embodiment, as shown in FIG. 7(a), synthetic resin is also attached to the metal plate constituting the click spring 232, so that the click spring 232 and the click hole 37 are not engaged with each other. - Detachment is smoother and the click sensation is better.

FIG. 9 is a diagram showing another embodiment of the resin molded case 1.

As shown in the figure, in the resin molded case 1' according to this embodiment, the metal terminal 15 is not provided, and the same film as the flexible substrate 13 is pulled out from the case 11, and the conductor patterns 19-1 to 19-1 are pulled out from the case 11. -3 and a terminal pattern 19-4 is formed at the tip thereof.

With this configuration, even if the location where the rotary variable resistor is installed is far from the location where the rotary variable resistor is electrically connected, there is no need to solder the lead wires, making the connection easy. become.

The electronic component according to the present invention can also be used as a sliding variable resistor, a sliding code switch, and the like.

FIG. 10 is a diagram showing a resin molded case 5 when the present invention is used in a sliding variable resistor, and FIG. 10(a) is a plan view and FIG. 10(b) is a partial side sectional view thereof. .

As shown in the figure, this resin molded case 5 has a flexible substrate 53 inserted inside the case 51,
Further, three metal terminals 55 are protruded from both sides of the case 51.

The case 51 includes a substantially rectangular bottom plate portion 511 and the bottom plate portion 5.
11, and a side wall portion 513 standing upright on the outer periphery of the cover 11, and a projection 515 for fixing the cover 7, which will be described below, is formed on the upper surface of the side wall portion 513.

The flexible substrate 53 has a linear resistor pattern 531 and a conductor pattern 532 printed on the upper surface of the resin film, and both patterns 531 and 532 are attached to the case 51.
It is exposed on the bottom plate part 511 of.

Three metal terminals 55 are connected and fixed to each end of the flexible substrate 53 in the same manner as the terminal connection method for the rotary variable resistor shown in FIGS. 3 and 4.

The resin molded case 5 can be manufactured in the same manner as the resin molded case 1 shown in FIG. 5 and the like.

That is, the flexible substrate 53 is sandwiched between two molds,
A synthetic resin is poured into the mold, and after solidifying, the mold is removed. As a result, the resin molded case 5 shown in FIG. 10 is completed.

Figure 11 shows the sliding body 6 used in this sliding variable resistor.
FIG.

As shown in the figure, the sliding body 6 is constructed by inserting a metal slider 63 into a sliding mold 61.

The sliding member 61 has a tab 613 projecting upward from a predetermined position on the upper surface of a flat base 611 into which a slider 63 is inserted. The slider 63 inserted into the base 611 has a sliding contact 631, which is a part of the slider 63, protruding from the base 611 to the outside. Also, a click spring 63 is integrally formed with the slider 63.
2 is formed inside the base 611, and a click resin 615 is applied to the top surface of the base 611 to provide a smooth click feeling when the click spring 632 engages the click hole 71 of the cover 7 described below. There is.

The method for manufacturing this sliding body 6 is also shown in FIGS. 6 and 7 above.
The method is similar to that shown in the figure.

That is, as shown in FIG. 12(a), by pressing the band-shaped metal plate 60, the slider 63 is formed via the support portions 601 and 601. This slider 63 is provided with a sliding contact 631 and a click spring plate 632a.

Next, the slider 63 is sandwiched between two molds (not shown), a synthetic resin is poured into the molds, and the molds are removed after solidifying, as shown in FIG. Sliding type 61
A slider 63 can be inserted inside. Then, cut along the F-F line and the G-G line shown in the same figure, and make the sliding contact 631.631.
By bending the click spring plate 632a downward and slightly upwardly bending the click spring plate 632a, the sliding body 6 as shown in FIG. 11 is completed.

FIG. 13 shows the sliding body 6 inside the resin molded case 5.
FIG. 4 is a sectional side view of a main part when the slide type variable resistor is completed by inserting the slide type variable resistor and attaching the cover 7 on the sliding body 6 so as to cover the resin molded case 5.

As shown in the figure, when the knob 613 (indicated by a virtual line) is moved in the direction of the arrow shown in the figure, the sliding contact 631 that moves together with the knob 613 moves between the resistor pattern 531 and the conductor pattern 531 on the flexible substrate 53. The resistance value between the metal terminals 55 electrically connected to the pattern is changed by sliding on the pattern.

FIG. 14 is a diagram showing another embodiment of the resin molded case 5.

As shown in the figure, in the resin molded case 5' according to this embodiment, the metal terminal 55 is not provided, and the same film as the flexible substrate 53 is pulled out from the case 51 and the tip thereof is inserted through the conductive pattern. A terminal pattern 59 is formed on the surface.

With this configuration, even if the location where the sliding variable resistor is installed and the location where the sliding variable resistor is electrically connected are far apart, there is no need to solder the lead wires, making the connection easy. become.

15 and 16 are views showing the structure of a resin molded case 8 of another sliding variable resistor according to the present invention, FIG. 16(a) is a plan view, and FIG. 16(b) is a partial view. Figure (c) is a sectional view taken along the J-J line in Figure (a), Figure (c) is a side view of the
d) is a cross-sectional view taken along the - line in FIG. 2(b).

As shown in the figure, this resin molded case 8 has a flexible substrate 83 inserted inside the case 81,
In addition, two metal terminals 85 are provided from both sides of the case 81.
It has a protruding structure. Furthermore, in this resin molded case 8, as shown in FIG. 16(C),
The flexible substrate 83 is also exposed on both side walls of the case 81.

The case 81 includes a substantially rectangular bottom plate portion 811 and the bottom plate portion 8.
11, and two protrusions 815 are formed at both ends of one side wall 813.

The flexible substrate 83 has a resistor pattern 851 and a conductor pattern 852 printed on the top surface of a resin film.
The resistor pattern 851 is exposed on the bottom plate part 811 of the case 81, and the conductor pattern 852 is exposed on the side wall part 81 of the case 81.
exposed on the inner surface of 3.

FIG. 17 is a plan view showing this flexible substrate 83. As shown in the figure, two metal terminals 85 are connected and fixed to each end of the flexible substrate 83 in the same manner as the terminal connection method for the rotary variable resistor shown in FIGS. 3 and 4. has been done. Further, as shown in the figure, conductor patterns 852 are formed on both sides of the flexible substrate 83. The conductor pattern 852 is bent by the resin material press-fitted when inserting the flexible board 83 into the case 81, and is
The structure is as shown in Figure 6.

Figure 18 shows the sliding body 9 used in this sliding variable resistor.
FIG. 3 is a diagram showing a state when the is mounted on the resin mold case 8, in which (a) is a partial side sectional view (a sectional view taken along line M-M in FIG. 3(b)), and FIG. Cross-sectional view (same figure (a)
) is a sectional view taken along line L-L of ). As shown in the figure, the sliding body 9 is composed of a sliding mold 91 and a slider 95.

The sliding molded object 91 is provided with legs 92 extending downward from both sides of the upper part of the sliding molded object main body 94 along the outer periphery of the resin molded case 8, and at the lower end thereof, the resin molded case 8
A claw 93 that engages with is attached. Furthermore, inside the sliding mold body 94 of the sliding mold 91, there is a metal slider 95.
．． 95 are inserted, and each slider 95.95 is provided with a sliding contact 97.98. The sliding contacts 97 and 98 come into sliding contact with the resistor pattern 851 and conductor pattern 852 exposed on the inner surface of the resin molded case 8, respectively. Note that 99 is a knob that protrudes from the foot 92 to the outside.

By moving this knob 99, the sliding body 9 moves relative to the resin molded case 8, and the resistance value between the metal terminals 85 can be changed.

Although the embodiments of the electronic component according to the present invention have been described above in detail, the present invention is not limited thereto and can be modified in various ways.

For example, the pattern formed on the flexible substrate may have various shapes and structures.For example, the pattern may be a code pattern for a code switch or a pattern for other switches. In other words, it is a resin molded case that has a structure in which a flexible substrate, which is made by forming conductor patterns such as resistor patterns and conductor patterns on a synthetic resin film, is inserted into a synthetic resin case so that the conductor patterns are exposed. Any resin molded case may be used.

Furthermore, the shape and structure of the sliding body and slider can be changed in various ways. In other words, the key is a structure in which a metal slider with a sliding contact that slides on the conductive pattern of a flexible substrate is inserted into a synthetic resin sliding mold so that the sliding contact is exposed to the outside. Any structure of the sliding body may be used as long as it is a sliding body.

〔Effect of the invention〕

As described above in detail, according to the electronic component according to the present invention, the case and the board can be easily integrated, and the sliding object and the slider can also be easily integrated, and furthermore, the case and the board can be easily integrated. Because it is easy to assemble parts that are fixed together,
Its manufacture becomes easy and costs can be reduced.

In addition, a board made of a thin film is inserted into the case, and a slider made of a thin metal plate is inserted into the sliding part, so the overall thickness when assembled can be reduced, making it more compact. It is also possible to achieve

[Brief explanation of the drawing]

Fig. 1 is an exploded perspective view showing the case where the electronic component of the present invention is used in a rotary variable resistor, and Fig. 2 is a resin molded case 1.
3 and 4 are diagrams illustrating the method of connecting the metal terminal 15 to the flexible substrate 13, FIG. 5 is a diagram illustrating the method of inserting the flexible substrate 13 into the case 11, and FIG. and FIG. 7 is a diagram for explaining the method of manufacturing the sliding body 2, FIG. 8 is a side sectional view of a rotary variable resistor, and FIG. 9 is a diagram showing another embodiment of the resin molded case 1. FIG. 10 is a diagram showing a resin molded case 5 when the present invention is used in a sliding variable resistor, FIG. 11 is a diagram showing a sliding body 6 used in a sliding variable resistor, and FIG.
FIG. 2 is a diagram for explaining the method of manufacturing the sliding body 6, FIG. 13 is a side sectional view of the main part of the sliding variable resistor, and FIG.
The figure shows another embodiment of the resin mold case 5.
5 is a perspective view showing the structure of a resin molded case 8 of another sliding variable resistor according to the present invention, and FIG.
17 is a plan view showing the flexible substrate 83, and FIG. 18 is the sliding body 9.
FIG. 2 is a diagram showing a state when the resin molded case 8 is mounted. In the figure, 1.1', 5.5', 8...Resin mold case, 11,51.81...Case, 13,5
3.83...Flexible substrate, 131.531. 851...Resistor pattern (conductor pattern), 13
3.532,852...Conductor pattern (conductor pattern), 2,6.9...Sliding body, 21,61.91...
・Sliding type object, 23.63.95...Slider, 231.
631,97.98...Sliding contact, 3,7...Cover.

Claims (1)

[Claims] A resin molded case in which the flexible substrate and the case are integrated by inserting a flexible substrate formed by forming a conductor pattern on a synthetic resin film into a case made of synthetic resin so that the conductor pattern is exposed; A metal slider having a sliding contact that slides on the conductor pattern of the flexible substrate is inserted into a synthetic resin sliding mold so that the sliding contact is exposed to the outside. It has a sliding body that integrates a mover and a sliding type object, and the sliding body is housed in the resin molded case so that the sliding contact of the sliding body comes into sliding contact with the conductor pattern of the resin molded case. Electronic components featuring: