JPH0570286B2 - - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to an electronic component and a method for manufacturing the same.

[Conventional technology]

Conventionally, rotary code switches, sliding code switches, rotary variable resistors, and sliding variable resistors used in electronic devices consist of a board and a casing on which various patterns are formed, and contacts that slide into contact with the patterns on the board. It has a structure in which a substrate is fixed to the bottom of the casing, and the slider is rotatably or slidably supported on the substrate. Each of these components, such as the board, case, and sliding type, is manufactured as a separate component, and these components are assembled in a later assembly process to complete the electronic component.

In addition, in recent years, as electronic components have become smaller and thinner, the housings of rotary code switches, sliding code switches, rotary variable resistors, and sliding variable resistors have also become smaller and thinner. .

[Problem to be solved by the invention]

However, in the conventional rotary electronic components and sliding electronic components described above, each component is manufactured separately and these components are assembled, so there is a limit to miniaturization and thinning. Additionally, as devices become smaller and thinner, there is a problem in that it becomes difficult to assemble each component.

In addition, in recent years, a conductive pattern for an electrode is formed on a synthetic resin film, and a resistor pattern is formed by connecting to the conductive pattern for an electrode, and a metal terminal is fixed, and the fixed metal terminal part and the back side of the synthetic resin film are formed. Electronic parts whose parts are molded with synthetic resin have been developed (for example, Japanese Patent Laid-Open No. 49601/1983).

By manufacturing the casing of rotating electronic components or the casing of sliding electronic components using the technology of molding such synthetic resin film with synthetic resin, it is possible to improve the miniaturization and thinning of electronic components. However, there are various problems that need to be solved. For example, when inserting a synthetic resin film with a conductive pattern on which the contacts of the slider of an electronic component slide into a resin molded case, a gap of the same shape as the resin molded case is usually formed in the opposing parts, and the top and bottom are A pair of molds that can be separated into two molds is prepared, a synthetic resin film is inserted between the upper and lower molds, and molten resin is press-fitted into the gap. The problem is that the conductor pattern surface is covered with molten resin and the conductor pattern surface cannot be exposed inside the resin mold case.
In order to reduce the thickness of the film, it is important to decide what kind of terminal structure should be used to connect to the ends of various patterns formed on the top surface of the film.

The present invention has been made in view of the above points, and its purpose is to integrate a board and a case, eliminate the need for assembling the board and the case, and realize the small size required for electronic components in recent years. An object of the present invention is to provide an electronic component that can be significantly reduced in size and thickness, and a method for manufacturing the same.

[Means to solve the problem]

In order to solve the above-mentioned problems, the present invention provides an electronic component in which a substrate on which a conductive pattern with which a contact of a slider of the electronic component slides is housed inside a casing, wherein the substrate is made of a synthetic resin film. A flexible substrate with a conductive pattern formed thereon is used, and the conductive pattern of the flexible substrate is formed by etching a metal surface adhered or vapor-deposited on the synthetic resin film. , and a metal terminal piece is bonded to the end of the conductor pattern of the flexible substrate with its tip protruding from the edge of the flexible substrate, and a synthetic resin film is placed on the bonded metal terminal piece. A terminal portion is provided in which a terminal fixing film is placed, and the terminal fixing film and a flexible substrate are locally welded, and the flexible substrate is provided with a predetermined portion of the tip of the metal terminal piece of the terminal portion externally. It was inserted into a synthetic resin casing so as to protrude and expose the conductive pattern to the inside, and was integrated with the casing.

The present invention also provides a flexible substrate on which a conductor pattern is formed by etching a metal surface that is adhered or vapor-deposited on a synthetic resin film, and a flat surface on which the conductor pattern formed surface of the flexible substrate is in close contact. a first mold having a surface and a groove formed around the flat surface to form a side part of a synthetic resin casing; and a first mold disposed opposite to the first mold. a second mold having a flat surface and a concave portion forming the bottom of the casing in a portion corresponding to at least a portion of the groove; A metal terminal piece is bonded to the top surface of the flexible board with its tip protruding from the end of the flexible board, and a terminal fixing film made of a synthetic resin film is placed on top of the bonded metal terminal piece to fix the terminal. The metal terminal piece is fixed to the flexible substrate by locally fusing a film for use with the flexible substrate, and the conductor pattern-formed surface of the flexible substrate is placed between a first mold and a second mold. The first mold is held in contact with the flat surface of the first mold, and the molten resin material is press-fitted into the recess of the second mold to fill the space between the first mold and the second mold. As a result, electronic components were manufactured.

The present invention also provides an electronic component in which a substrate on which a conductive pattern is formed, with which at least the contacts of a slider of the electronic component slide, is housed inside a casing, in which the conductive pattern is formed on a synthetic resin film as the substrate. Using the formed flexible substrate, a conductive pattern formed by etching a metal surface adhered or vapor-deposited on the synthetic resin film is used as a conductive pattern of the flexible substrate. The conductor pattern forming surface is formed to be a predetermined size larger than the inner bottom surface of the casing, and the flexible substrate is formed such that the conductive pattern is exposed on both the inner bottom surface of the casing and the inner surface of the side wall of the casing rising from the bottom surface. It was inserted into a synthetic resin casing in a bent state and integrated with the casing.

The present invention also provides a flexible substrate on which a conductor pattern is formed by etching a metal surface adhered or vapor-deposited on a synthetic resin film, and a flat surface to which the conductor pattern-formed surface of the flexible substrate is in close contact. , a first groove is formed around the flat surface to form a side part of the synthetic resin casing.
a mold, and a recess that is arranged to face the first mold and forms the bottom of the casing in a portion corresponding to the flat surface of the first mold and a portion that includes at least a part of the groove. A second mold in which a conductor pattern is formed is prepared, the conductor pattern forming surface of the flexible substrate is formed to be larger by a predetermined size than the flat surface of the first mold, and the flexible substrate is The conductor pattern forming surface is held between a mold and a second mold by contacting the flat surface of the first mold, and a molten resin material is press-fitted into the recess of the second mold. By doing so, the conductive pattern formed surface of the flexible substrate is brought into close contact with the flat surface of the first mold by being filled between the first mold and the second mold, and the conductive material of the flexible substrate is bending a portion of the body pattern forming surface that protrudes from the flat surface along the side surface of the groove of the first mold to bring it into close contact with the side surface;
After the filled molten resin material is cooled and solidified, the first
and the second mold was removed to produce an electronic component.

[Effect]

By configuring the electronic component and its manufacturing method as described above, the flexible board and the synthetic resin casing are integrated, so the casing can be made smaller and thinner, and the assembly of the board and the casing can be made easier. becomes unnecessary.

Additionally, it can be directly surface-mounted on a printed wiring board together with various other electronic components, making it possible to automate the mounting process.

Further, when this electronic component is mounted on a printed wiring board and soldered through flux, the flux does not penetrate into the electronic component through the terminal.

In addition, the structure of the terminal part not only strengthens the connection strength between the flexible board and the metal terminal piece, but the thickness of the terminal part is only the thickness of the flexible board plus the metal terminal piece and the fixing resin film. This results in an extremely thin terminal structure, which allows the thickness of this electronic component to be reduced.

〔Example〕

DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, a case in which an embodiment of the present invention is implemented as an electronic component, particularly a code switch, will be described in detail with reference to the drawings, but the present invention is not limited to the code switch.

FIG. 1 is a diagram showing an embodiment in which the electronic component according to the present invention is used in a rotary code switch, in which FIG. 1A is a back view, FIG. 1B is a side view, and FIG. 1C is a top view.

As shown in the figure, this electronic component has an external shape in which metal terminal pieces 2-1 to 2-5 constituting the terminal portion 2 protrude from the side of a resin-molded casing 1.
A flexible substrate 3 is inserted inside the casing 1.

The resin-molded casing 1 has a circular interior, side walls 1-2 are provided at the edges, and a column 1-1 rotatably supports a rotary slider, which will be described later, at the center of the bottom. is provided. Further, on the back side of the housing 1 which is resin molded, there are protrusions 1-3 and 1.
-4 is formed.

The flexible substrate 3 has five current collection patterns 3-1 formed by etching on the upper surface of a resin film, and an insulator pattern 3-2 formed at a predetermined portion on the current collection patterns 3-1. The current collection pattern 3-1 and the insulator pattern 3-2 of the flexible substrate 3 are exposed at the bottom of the casing 1.

The configuration, shape, and manufacturing method of each part of the electronic component will be described below.

FIGS. 2 and 3 are diagrams for explaining the structure of the flexible substrate 3 inserted into the housing 1 of the rotary code switch and its manufacturing method.

The flexible substrate 3 is made by first preparing a strip of thermoplastic and heat-resistant synthetic resin film, and then bonding a metal foil (for example, copper or aluminum) onto this film, or depositing such a metal onto this film. . Next, this metal layer is etched to form five current collecting patterns 3-1 in a predetermined shape and a lead pattern 3-5 continuous to the current collecting patterns 3-1.
3-9, and the current collecting pattern 3
A code pattern for the code switch is formed by printing an insulator pattern 3-2 on a predetermined portion of the code switch. After forming these patterns, the synthetic resin film is cut leaving the portion corresponding to the flexible substrate 3 and the supporting portions 10 and 11 at both upper and lower ends, and a large number of flexible substrates connected by the supporting portions 10 and 11 are cut. Make board 3.

In this case, the current collecting pattern 3-1 and the insulator pattern 3-2 are formed by placing a synthetic resin film on a portion corresponding to the flexible substrate 3 and the supporting portion 1.
It goes without saying that this may be done after cutting leaving 0 and 11. Further, as the synthetic resin film, for example, a film of polyvalabanic acid, polyetherimide, polyethylene terephthalate, etc. is used.

Next, metal terminal pieces 2-1 to 2-5 integrally formed with the support member 20 are prepared, and the tip portions of these metal terminal pieces 2-1 to 2-5 are connected to the lead pattern 3 of the flexible substrate 3. It is placed on the hot-melt type conductive adhesive layer formed on -5 to 3-9.

Next, lead pattern 3 of flexible substrate 3
-Metal terminal piece 2-1 placed on top of -5 to 3-9
A terminal fixing film 2-6 made of a synthetic resin film of the same quality as the flexible substrate 3 is placed on top of the terminal fixing film 2-5, and then a portion where the metal terminal pieces 2-1 to 2-5 are not located {Fig. A horn for emitting ultrasonic waves (not shown) is placed on the part 2-7 of A of
The synthetic resin film constituting the lead pattern 3-5 and the synthetic resin film constituting the flexible substrate 3 are locally melted by ultrasonic heating to form a lead pattern 3-5.
The metal terminal pieces 2-1 to 2-5 are firmly fixed onto the metal terminal pieces 2-1 to 3-9 by the shrinkage force of these synthetic resin films.

Next, by heating the metal terminal pieces 2-1 to 2-5 from above the terminal fixing film 2-6 or the flexible substrate 3 with a heating iron to melt the conductive adhesive layer, the metal terminal Pieces 2-1 to 2-5
are firmly fixed on the lead patterns 3-5 to 3-9.

Note that, since the synthetic resin film is firmly melted and fixed by the ultrasonic heating, the adhesion using the conductive adhesive may be omitted in some cases.

FIG. 3A is a plan view of the metal terminal pieces 2-1 to 2-5 fixed on the lead patterns 3-5 to 3-9 at the ends of the flexible substrate 3 as described above. Figure B is a sectional view taken along the line DD.

The terminal portion 2 of the flexible board 3 configured as described above is composed of the flexible board 3 and the metal terminal piece 2-
Not only the connection strength of 1 to 2-5 is high, but also the thickness is the thickness of the synthetic resin film composing the flexible substrate 3, the metal terminal pieces 2-1 to 2-5, and the terminal fixing film 2-6. By adding only a slight thickness to the conductive adhesive layer, an extremely thin terminal structure can be obtained.

Next, a method of inserting the flexible substrate 3 having the above structure into the synthetic resin casing 1 shown in FIG. 1 will be explained.

First, as shown in FIG. 4A, the flexible substrate 3 is inserted between a first mold A and a second mold B.

Here, the first mold A has a planar flat surface A1 formed at its center, a circumferential groove A2 around the flat surface A1, and a cylindrical groove A2 formed at the center of the flat surface A1. A hole A3 is formed.

Here, the flat surface A1 is the surface on which the code pattern consisting of the current collecting pattern 3-1 and the insulator pattern 3-2 on the flexible substrate 3 shown in FIG. 1-2 is a groove in which the support 1-1 of the housing 1 is formed.

A recess B1 is formed in the second mold B at a portion corresponding to the flat surface A1 and the circumferential groove A2 of the first mold A, and a predetermined portion of the recess B1 is formed at the end of the flexible substrate 3. A groove B2 of a predetermined width is formed to promote the flow of molten resin toward the formed terminal portion 2, and a through hole B3 is formed approximately in the center of the groove B1.

Here, the recess B1 is a recess for forming the bottom of the resin molded case 1, and the recess B2 is a recess for forming the bottom of the resin molded case 1, and the recess B2 is a recess for forming the terminal part 2 formed at one end of the flexible substrate 3 when the molten resin is press-fitted from the through hole B3. This is a groove for promoting the inflow of molten resin.

Next, as shown in FIG. 4B, a heated and melted resin material (for example, a resin such as polyphenylene sulfide or polyethylene terephthalate) is press-fitted from the through hole B3 of the second mold B (arrow D1).

By press-fitting this molten resin, the recess B1 and groove B2 of the second mold B and the circumferential groove A2 of the first mold A are formed.
A molten resin material is filled inside.

Also, at this time, the part of the synthetic resin film of the flexible substrate 3 corresponding to the hole A3 of the first mold A is pierced by the press-fitting pressure of the molten resin material, and the molten resin material is applied to the supports of the casing 1. 1-1 is filled into the hole A3 (arrow D2). in this way,
By breaking through the flexible substrate 3 and filling the hole A3 with the molten resin material, the synthetic resin film comes into close contact with the inner surface of the hole A3 and will not peel off from the inner surface.

On the other hand, if a hole through which the molten resin material flows is formed in advance in the portion of the flexible substrate 3 where the hole A3 is located, the molten resin material that has passed through the hole and flowed into the hole A3 will be absorbed into the hole A3. In order to press the flexible substrate 3 from the hole A3 side by hitting the inner surface and inverting the flexible substrate 3, the inverted molten resin material is pressed against the flexible substrate 3.
and the wall surface of the first mold A, the flexible substrate 3 separates from the wall surface of the first mold A, and the surfaces of the current collection pattern 3-1 and the insulator pattern 3-2 of the flexible substrate 3 There was a problem that the product was covered with resin material, resulting in a defective product. The above problem was solved by not forming holes in the flexible substrate 3 in advance as described above, but by press-fitting the molten resin material to pierce the flexible substrate 3.

Also, when filling the molten resin, the second mold B
If the groove B2 is not formed in the groove B2, the molten resin material flows around from the groove B1 other than the groove B2 through the circumferential groove A2 and fills the upper surface of the terminal part 2 first, so that the terminal part 2 is the recess B1 of the second mold B
pushed down to the side. And in extreme case terminal part 2
There is a risk that a problem may occur where the information is exposed to the back of the case.

As a countermeasure against this, in this embodiment, a concave groove B2 is formed in the second mold B, and the flow of the molten resin material from the center of the concave part B1 toward the terminal part 2 is controlled by the concave groove B2.
The part where the water flows through (the direction shown by arrow D3) is made to be the fastest. As a result, the terminal section 2
While being pressed against the first mold A side, the periphery of the terminal portion 2 is filled with the molten resin material. That is, since the force shown by the arrow D3 acts before the force due to the inflow of the molten resin material in the direction shown by the arrow D4 in the figure acts, the terminal portion 2 is not separated from the first mold A.

As described above, after filling the gap between the first mold A and the second mold B with the molten resin material and solidifying the molten resin material, the first mold A and the second mold B Remove the flexible board 3 from A-A in Figure 3A.
By cutting along the lines B--B and C--C, an electronic component with a flexible substrate 3 inserted into a housing 1 as shown in FIG. 1 is completed. In addition, the first
The convex surface 1-5 on the back surface of the resin molded housing 1 shown in FIGS. A and B is a convex surface formed by the groove B2 of the second mold B.

Note that in the above explanation, the first
Although we have described an example in which a hole through which the molten resin material flows is not formed in the part where hole A3 of mold A is located, FIG.
Even if an inflow hole 3a for the molten resin material is formed in advance in the flexible substrate 3 as shown in FIG.
If d ₂ is less than 1/2 of the diameter d ₁ of the hole A3 for forming the support 1-1, the molten resin material flowing into the hole A3 will connect the flexible substrate 3 and the wall of the first mold A. It was confirmed that the flexible substrate 3 was not separated from the wall surface of the first mold A. In this case as well, the flexible substrate 3 in the hole A3 portion deforms as shown in the figure and comes into close contact with the inner wall of the hole A3.

FIG. 5 is a schematic side cross-sectional view showing a rotary code switch using the above-mentioned flexible substrate built-in electronic component.

In the figure, 5 is a rotor, and the rotor 5
As shown in the figure, it has a structure in which a slider 5-2 is provided on the lower surface of a disc-shaped rotor main body 5-1 made of synthetic resin. The support 1-1 of the casing 1 is connected to the rotor body 5.
-1 into the hole formed in the center of the support column 1-1.
The rotor 5 is rotatably supported inside the housing 1 by thermally caulking the tip of the rotor 5 . By rotating the rotor 5, the contact points of the slider 5-2 are formed in the current collecting pattern 3 formed on the flexible substrate 3.
-1 and slides on the insulator pattern 3-2. As a result, between each metal terminal piece 2-1 to 2-5, the first
As shown in the figure, with the metal terminal piece 2-1 as a common, the metal terminal piece 2-1 and each metal terminal piece 2-2 to
Between 2 and 5 is on or off state (H or L signal)
and changes its code signal value.

When the rotary code switch having the above configuration is mounted on the printed wiring board 100, the protrusions 1-3 and 1-4 (the first
(see figure) to position and install. At this time, the metal terminal pieces 2-1 to 2-5 are located on the wiring pattern (not shown) of the printed wiring board 100. Various other electronic components are mounted on the printed wiring board 100, and in this state, each component is mounted on the printed wiring board 100 by soldering or the like.

Note that 4 shown in FIG. 5 is a knob that rotates together with the rotor 5, and 4-1 indicates that the knob 4 is connected to the rotor 5.
This is a fixing pin that is fixed to the

As described above, the flexible board 3 of the rotary code switch is made of a synthetic resin film, and the flexible board 3 is integrated as an insert into the resin molded casing 1, so that the casing 1 and the flexible board 3 are Not only does assembly work become unnecessary, but it can also be made smaller and thinner.

In addition, as shown in Figure 5, the rotary code switch with the above configuration can be used with other capacitors, resistors, and ICs.
Like a chip or the like, it can be directly mounted on the printed wiring board 100, making it easy to automate the mounting.

Furthermore, in the rotary cord switch having the above configuration, as shown in FIG. When the switch is placed on the printed wiring board 100 and soldered using flux, the problem that the flux passes through the terminal portion 2 and enters the inside of the casing 1 is eliminated.

FIG. 6 is a diagram showing the structure of another electronic component incorporating a flexible substrate according to the present invention, in which FIG. 6A is a back view, FIG. 6B is a side view, and FIG. 6C is a top view.

In the same figure, the parts that are different from the electronic components shown in FIG. A protrusion 1-7 is formed upward from the point 6.

FIG. 7 is an exploded perspective view of a rotary code switch using the electronic components shown in FIG. 6 above. The rotary code switch includes a housing 1, a rotor 6, a cover plate 7, and a rotary knob 8.

The rotor 6 is formed of a resin material into a disk shape, and a cylindrical projection 6-4 is formed in the center of the rotor 6.
A pair of engaging claws 6-1 and 6-2 are formed to sandwich the rotary knob 8 and attach the rotary knob 8 therebetween. Further, a protrusion 6-3 is formed for regulating the rotation of the rotor 6 within a predetermined range. In addition, rotor 6
Although not shown below, the current collecting pattern 3-1 and the insulator pattern 3-2 of the flexible substrate 3 are shown below.
A slider 6-6 is attached which slides into contact with (see FIG. 8).

The cover plate 7 is made of a metal plate, and has a through hole 7- in the center thereof through which the engaging claws 6-1 and 6-2 of the rotor 6 pass.
2 is formed, and the protrusions 1-7 of the housing 1 are formed at its four corners.
A hole 7-1 is formed through which the hole 7-1 passes. Further, a piece member 7-
3 is provided. The piece member 7-3 is for fixing this rotary code switch to the printed wiring board 100.

The rotary knob 8 is composed of a disc-shaped member made of resin, and has many irregularities formed around it.
In addition, in the lower center part there is a rotor 6 as described later.
A protrusion 8-4 (see Fig. 8) is provided with a hole 8-3 (see Fig. 8) formed in the center into which the protrusion 6-4 is inserted, and the protrusion 8-4 is further inserted between the holes 8-3 (see Fig. 8) A pair of holes 8-2, 8-2 are formed into which engaging claws 6-1, 6-2 of the rotor 6 are inserted.

FIG. 8 is a side sectional view showing a state in which the rotary code switch made of the above components is assembled and mounted on a printed wiring board 100.

As shown in the figure, the rotary code switch is assembled by first inserting the support column 1-1 formed in the center of the resin molded case 1 into the hole 6-5 formed in the center of the lower part of the rotor 6. is placed on the casing 1. Next, as shown in FIG. 7, the protrusions 1-7 at the four corners of the casing 1 are inserted into the holes 7-1 at the four corners of the cover plate 7, and their tips are heat caulked and attached onto the cover plate 7. At this time, the protrusion 6-4 of the rotor 6 and the pair of engaging claws 6-1, 6-2 are inserted into the through hole 7-2 of the cover plate 7.

Next, insert the protrusion 6-4 of the rotor 6 into the hole 8-3 formed by the protrusion 8-4 on the bottom of the rotary knob 8, and insert the engaging claws 6-1, 6-2 into the hole 8-2, 8-
2, the engaging claws 6-1 and 6-2 are engaged with the stepped portions formed on the walls of the holes 8-2 and 8-2, and the rotary knob 8 is attached to the rotor 6.

In the rotary code switch configured as described above, when the rotary knob 8 is rotated, the rotor 6 rotates, and the slider 6-6 attached to the lower part of the rotor 6 connects with the current collecting pattern 3-1 on the flexible substrate 3. It slides onto the insulator pattern 3-2. At this time, when the rotor 6 rotates by a predetermined amount, the protrusion 6-3 formed on the peripheral edge of the rotor 6 comes into contact with the protrusion 1-8 formed on the inner peripheral surface of the side wall 1-2. The rotation range of the rotor 6 is restricted to a predetermined range.

In the above embodiment, the electronic component with a built-in flexible board was explained using a rotary code switch as an example.
It can also be used as other rotary electronic components such as rotary variable resistors.

FIG. 21 is a plan view showing a case where this electronic component is used in a rotary variable resistor. In the figure, 3-3 is a current collection pattern formed by etching a metal foil formed on the flexible substrate 3 by adhesion or vapor deposition, and 3-4 is a current collection pattern formed by the current collection pattern 3-3. Later flexible board 3
This is a resistor pattern formed into a predetermined shape by printing or vacuum deposition of a conductive paste that becomes a resistor. The other parts have the same structure as the rotary code switch shown in FIG. 1 above, so the details will be omitted.

FIG. 9 is a diagram showing an example in which the electronic component with a built-in flexible substrate according to the present invention is used in a sliding code switch, in which FIG. 9A is a plan view, FIG. 9B is a partially sectional side view, and FIG. is a back view, and figure D is a sectional view taken along line A--A in figure A.

In this embodiment, the flexible substrate 53 and the terminal portion 5
2 is integrally formed with a thermoplastic heat-resistant film 51, and the flexible substrate 53 and terminal portion 52 are inserted into a housing 54.

A current collecting pattern 53 is provided on the flexible substrate 53.
-1 and an insulator pattern 53-2 formed at a predetermined portion on the current collecting pattern 53-1. Further, the terminal portion 52 is provided with a metal terminal piece 55. Further, a portion of the flexible substrate 53 where the current collecting pattern 53-1 and the insulating pattern 53-2 are formed is exposed at the bottom of the casing 54.

Hereinafter, the structure and shape of each part of the electronic component having the above structure and the manufacturing method thereof will be explained.

FIG. 10 shows the flexible board 53 and the terminal section 5.
2 is a diagram for explaining the manufacturing process of No. 2, in which a rectangular thermoplastic heat-resistant film 51 is attached to a supporting member 51.
-1, 51-1 are connected consecutively. Five current collection patterns 53-1 are provided at predetermined positions on the surface of the heat-resistant film 51, and insulator patterns 53- are formed at predetermined portions on the current collection patterns 53-1.
2 is formed.

To form the current collecting pattern 53-1 here,
First, a metal layer is formed by bonding a metal foil (for example, copper or aluminum) onto the heat-resistant film 51 or by vapor-depositing a metal such as copper or aluminum onto the heat-resistant film 51. Then, this metal layer is etched into the shape of the current collecting pattern 53-1 to form the current collecting pattern 53-1. At this time, a lead pattern 52-1 is formed at each end of the current collecting pattern 53-1 so as to be continuous with the current collecting pattern 53-1.

Then, by printing an insulator pattern 53-2 at a predetermined position on this current collecting pattern 53-1, a code pattern is completed.

Here, the current collection pattern 5 of the heat-resistant film 51
3-1 and the insulator pattern 53-2 are formed on the flexible substrate 53 which becomes the substrate of the sliding code switch, and the lead pattern 52
The portion where -1 is formed becomes the terminal portion 52.

Next, as shown in the figure, a plurality of metal terminal pieces 55 (two and three in the figure) are placed on the supporting part 55 at intervals corresponding to the current collecting pattern 52-1.
It is integrally formed by press working. A hot-melt type conductive adhesive layer is formed on the lead pattern 52-1 of the terminal portion 52, a metal terminal piece 55 is placed thereon, and a composite material of the same quality as the heat-resistant film 51 is placed over the metal terminal piece 55. A terminal fixing film 57 made of a resin film is placed, and ultrasonic waves are emitted from an ultrasonic emitting horn (not shown) to the portion where the metal terminal piece 55 is not located to separate the terminal fixing film 57 and the terminal portion 52. Heat resistant film 51
are melted by ultrasonic heating, and the metal terminal piece 55 is pressed and fixed onto the lead pattern 52-1. Next, if a heating iron is applied to the metal terminal piece 55 from above the terminal fixing film 57 or the heat-resistant film 51 of the terminal portion 52 and the conductive adhesive is melted by heating, the metal terminal piece 55 is placed on the lead pattern 52-1.
is firmly attached.

FIG. 11 is a diagram showing the state in which the metal terminal piece 55 is attached to the lead pattern 52-1 of the terminal portion 52 through the above process, where A is a plan view and B is a line taken along the line B-B of A in the figure. FIG. Note that the welding of the terminal fixing film 57 and the heat-resistant film 51 by the ultrasonic heating is strong, and the metal terminal piece 5
Since the pressure contact between the fifth surface and the lead pattern 52-1 surface is ensured, the step of forming the conductive adhesive layer on the lead pattern 52-1 may be omitted depending on the case.

The board with the metal terminal of the slide type cord switch formed as described above has only the thickness of the heat-resistant film 51, the metal terminal piece 55, and the terminal fixing film 57, even at the terminal part where the thickness dimension is the largest. This results in an extremely thin substrate.

After inserting the flexible substrate portion 53 of the heat-resistant film 51 to which the metal terminal pieces 55 are attached as described above into the resin molded housing 54 made of synthetic resin so that the metal terminal pieces 55 protrude outside (this insert (The method of
By cutting on the line, removing the support part 58, and further cutting on the E-E line and the F-F line in FIG. , the electronic component for the sliding code switch shown in FIG. 9 is completed.

The side portions of the resin molded housing 54 are formed to cover the outer peripheries of the flexible substrate 53 and the terminal portion 52, and on the front and rear side portions 54-1 there are four fixing protrusions for fixing a cover plate, which will be described later. part 54-2 and four guide protrusions 54- that also guide the lid plate.
3 is formed. Moreover, on the back surface thereof, two fixing protrusions 54-4 and 5 are provided for fixing the resin molded housing 54 to a printed wiring board as described below.
4-4 are integrally formed.

Next, a method of inserting the heat-resistant film 51 with the metal terminal pieces 55 attached to the terminal portions 52 into the resin molded housing 54 will be explained using FIG. 12.

That is, as shown in FIG. 12A, a heat-resistant film 51 in which a flexible substrate 53 and a terminal part 52 are integrally formed and a metal terminal piece 55 is attached to the terminal part 52 is placed between a first mold A and a second mold A. Insert with mold B.

Here, the first mold A includes a current collecting pattern 53 of the flexible substrate 53 of the heat-resistant film 51.
-1 and the insulator pattern 53-2 are formed, and a circumferential groove A2 forming the side portion 54-1 of the resin molded housing 54 is formed around the flat surface A1. There is. Although not shown, the bottom of the circumferential groove A2 includes a fixing protrusion 54-2 and a guide protrusion 54-2 of the resin molded housing 54.
A recessed portion forming a numeral 3 is formed.

On the other hand, in the second mold B, a recess B1 that forms the bottom of the resin mold case 54 is formed in a portion corresponding to the flat surface A1 and the circumferential groove A2 of the first mold A, and a heat-resistant film is formed. Terminal section 52 of 51
A concave groove B2 of a predetermined width is formed in the longitudinal direction approximately at the center of the concave portion B1 to promote the inflow of the resin material in the direction of the portion where the metal terminal piece 55 penetrates the side portion 54-1. A long protrusion 54-5 is formed on the back surface of the molded case 54). Further, in order to form the fixing protrusions 54-4, 54-4 on the back surface of the resin molded housing 54, a cylindrical recess B3 is formed at a predetermined position in the center longitudinal direction of the recess B1. Although not shown, a protrusion 54-6 of the resin molded housing 54 is located around the bottom of the recess B1.
A recessed portion is also formed.

Next, as shown in FIG. 12B, the heated and melted resin material (for example, polyphenylene sulfide, polyethylene terephthalate, etc.) is inserted into the hole B4 formed at the top of the recess B3 of the second mold B by arrow D. ₁
Press in as shown. By press-fitting the molten resin material, the heat-resistant film 51 of the flexible substrate 53 is pressed against the flat surface A1 of the first mold A.

Also, when press-fitting this molten resin material, the second mold B
If there is no groove B2 that is long in the longitudinal direction of the center of the groove B1, the molten resin material will wrap around from the groove B1 other than the groove B2 through the surrounding circumferential groove A2 and the periphery of the flexible substrate 53 and the terminal portion 52. Since it is filled from the upper surface side of the part as shown by the arrow D2, the peripheral edge of the flexible substrate 53 and the terminal part 52 is
is pushed down toward the concave portion B1 side of the mold B, and in extreme cases, there is a risk that the peripheral edge portion may be exposed to the back side of the resin mold casing 54.

On the other hand, in this embodiment, since a long groove B2 is formed in the central longitudinal direction of the recess B1 of the second mold B, the groove B2 has the effect of promoting the flow of the molten resin material. The molten resin material is press-fitted in the central longitudinal direction of the recess B1 (direction indicated by arrow D3).
It is filled first and then gradually spread to the surrounding area, and finally the flexible substrate 53 and the terminal part 52 are filled.
Since the circumferential groove A2 where the peripheral edge of is located is filled,
Since the flexible substrate 53 and the terminal portion 52 are pushed toward the first mold A during the filling process, the flexible substrate 53 and the terminal portion 52 are not separated from the flat surface A1 of the first mold A. That is, since the molten resin material does not flow between the flat surface A1 of the first mold A and the flexible substrate 53, after the molten resin material has hardened as described later, the first mold A
When the second mold B is removed, the surface of the flexible substrate 53 is completely exposed at the bottom inside the resin molded housing 54.

After filling the molten resin material between the first mold A and the second mold B as described above, after the resin material has solidified, the first mold A and the second mold B are Once removed, the electronic component for the sliding code switch shown in FIG. 9 is completed.

FIG. 13 is a side sectional view showing the structure of a sliding code switch using electronic components for the sliding code switch.

As shown in the figure, a sliding body 59 is placed on a flexible substrate 53 of a heat-resistant film 51 inserted into a resin molded housing 54. A current collecting pattern 53-1 and an insulator pattern 5 formed on the flexible substrate 53 are provided at the bottom of the sliding body 59.
A slider 60 that slides into contact with the slider 3-2 is provided, and an operating lever 59a is integrally formed on the upper part of the slider 60. The sliding body 59 is connected to the lid plate 61 and the flexible substrate 53 by placing the lid plate 61 on top of the side portion 54-1 of the resin molded housing 54 and thermally caulking the tip of the fixing protrusion 54-2. hold between. This completes the sliding code switch.

In the slide type cord switch having the above structure, when the operating lever 59a is operated and the slider 59 is moved, the slider 60 slides on the current collection pattern 53-1 and the insulator pattern 53-2. The contact position between the contact point of the child 60 and the current collecting pattern 53-1 changes, and the metal terminal pieces 55 connected to each current collecting pattern 53-1 are turned on or off, and the signal changes to H or L. is output.

As described above, the flexible substrate part 53 on which the current collecting pattern 53-1 and the insulator pattern 53-2 are formed and the terminal part 52 on which the lead pattern 52-1 is formed are connected to a heat-resistant film 5 made of thermoplastic synthetic resin.
1 and insert-molding the heat-resistant film 51 into the resin mold housing 54 made of synthetic resin not only eliminates the need for assembling the flexible substrate 53 and the resin mold housing 54;
The slide type code switch can be made smaller and thinner.

Although the above embodiment has been explained using a sliding type cord switch as an example, the electronic component built into the flexible substrate is not limited to this, and may be used in a sliding type switch. By changing the etched pattern into a current collecting pattern formed by etching and a resistor pattern formed by printing or vacuum deposition, it can also be used as a sliding variable resistor.

Further, in the above embodiment, the metal terminal pieces 55 are provided at both ends of the resin molded housing 54, but the metal terminal pieces 55 may be provided only at one end.

FIGS. 14 and 15 are diagrams showing the structure of another electronic component incorporating a flexible substrate according to the present invention,
Fig. 14 is a perspective view, Fig. 15A is a plan view, Fig. 15
Figure B is a partially sectional side view, Figure 15C is a back view, Figure 15D is a sectional view taken along line A-A in Figure A, and Figure 15E is a view taken along line B-B in Figure B. FIG. In this embodiment, a sliding code switch will be explained as an example of an electronic component.

As shown in the figure, this electronic component includes a flexible substrate 73 having five current collecting patterns 73-1 and an insulator pattern 73-2 formed at a predetermined portion on the current collecting patterns 73-1; Lead pattern 72- continuous with the end of electrical pattern 73-1
1 (see FIG. 16).
-3 is integrally formed with a heat-resistant film 71, a metal terminal piece 75 is abutted and fixed on the lead pattern 72-1 of the board extension part 73-3 to form the terminal part 72, and the flexible Board 7
3 and a terminal portion 72 are inserted into a housing 74. Further, a part of the current collecting pattern 73-1 of the heat-resistant film 71 is exposed on the bottom surface of the housing, and a remaining part of the current collecting pattern 73-1 is exposed on the inner surfaces of both side walls. Hereinafter, the structure of each part of the electronic component having the above structure and the manufacturing method thereof will be explained in detail.

FIG. 16 shows the flexible board 73 and the terminal section 7.
2, a rectangular thermoplastic heat-resistant film 71 is continuously connected by support parts 71-1, 71-1, which are frames. As the material of the heat-resistant film 71, for example, polyparabanic acid, polyetherimide, polyethylene terephthalate, etc. are used.

To form the current collecting pattern 73-1 here,
First, a metal layer is formed by bonding a metal foil (for example, copper or aluminum) onto the heat-resistant film 71 or by vapor-depositing a metal such as copper or aluminum onto the heat-resistant film 71. This metal layer is then etched into the shape of the current collecting pattern 73-1 to form the current collecting pattern 73-1. At this time, a lead pattern 72-1 is formed at each end of the current collecting pattern 73-1 so as to be continuous with the current collecting pattern 73-1.

Then, by printing an insulator pattern 73-2 at a predetermined position on this current collecting pattern 73-1, a code pattern is completed.

Here, the width dimension of the flexible substrate 73 of the heat-resistant film 71 is formed to be larger than the width dimension of the substrate extension part 73-3 by a predetermined dimension.

As shown in the figure, a plurality of metal terminal pieces 75 (two and three pieces at the top and bottom in the figure) are integrally formed with the support portion 78 .

Here, the substrate extending portion 73- of the heat-resistant film 71
A hot melt type conductive adhesive layer is formed on the lead pattern 72-1 of No. 3, and a metal terminal piece 75 is formed.
Place the end of the Next, a terminal fixing film 77 made of the same synthetic resin as the heat-resistant film 71 is placed on top of the metal terminal pieces 75 of the terminal portion 72, and the parts where the metal terminal pieces 75 are not located, that is, the metal terminal pieces 75 and 75 are placed. Ultrasonic waves are emitted from an ultrasonic emitting horn (not shown) between the terminal fixing film 77 and the heat-resistant film 71 at both ends thereof.
3-3 is melted by ultrasonic heating, and the metal terminal piece 75 is fixed onto the lead pattern 72-1 {see FIG. 15E}.

Next, the terminal fixing film 77 or the board extension part 7
3-3 If the hot melt type conductive adhesive layer is melted by heating it with a heating iron from above, the metal terminal piece 7 is formed on the lead pattern 72-1.
5 is firmly adhered. As a result, the terminal portion 72 is formed in the substrate extension portion 73-3 of the heat-resistant film 71.

The board with the metal terminal of the slide type cord switch formed as described above has only the thickness of the heat-resistant film 71, the metal terminal piece 75, and the terminal fixing film 77, even at the terminal portion with the largest thickness dimension. This results in an extremely thin substrate.

The flexible substrate 73 of the heat-resistant film 71 to which the metal terminal piece 75 is attached as described above,
After inserting the metal terminal piece 75 into the housing 74 made of synthetic resin (described later) so as to protrude to the outside, it is cut along the line C-C and the line D-D in FIG. and support parts 71-1, 7
By removing 1-1, the electronic component for the sliding code switch is completed.

The side portion 74-1 of the housing 74 is formed to cover the outer periphery of the flexible substrate 73 and the terminal portion 72, and has a protrusion 7 for a stopper on both sides of one end.
4-3 is formed. Further, an inclined surface 74-2 inclined inward of the housing 74 is formed at a predetermined position on the top of the side portion 74-1.

Next, a first method of inserting the flexible board 73 having the terminal portion 72 into the housing 74 will be described.
This will be explained using FIG.

That is, first, as shown in FIG. 17A, the flexible substrate 73 and the terminal portion 72 are sandwiched between a first mold A and a second mold B.

Here, the first mold A includes the current collection pattern 73-1 of the flexible substrate 73 and the insulator pattern 7.
3-2, a flat surface A3 where the surface of the terminal portion 72 comes into close contact, and a side portion 7 of the housing 74 around the flat surface A1 and the flat surface A3.
A circumferential groove A2 forming a circumferential groove 4-1 is formed.

On the other hand, the second mold B is formed with a recess B1 that forms the bottom of the casing 74 at a portion corresponding to the flat surface A1, flat surface A3, and circumferential groove A2 of the first mold A. Convex portions B2, B2 are formed within the recessed portion B1 at a predetermined interval to obstruct the flow of the molten resin material in the longitudinal direction of the heat-resistant film 71 and promote the flow in the width direction. In addition, the recess B1
A filling hole B3 for filling with molten resin material is formed in the center of the hole B3.

A resin material made by heating and melting polyphenylene sulfide, polyethylene terephthalate, etc., for example, is press-fitted from the filling hole B3 as shown by arrow _D1 .

By press-fitting the molten resin material, the molten resin material flows into the recess B1 of the second mold B.
17C due to the convex portions B2 and B2 formed in 1.
As shown in Figure B, the inflow of the heat-resistant film 71 in the width direction is promoted, and as shown in Figure B, the current collector pattern 73-1 and the insulator pattern 73-2 portions of the heat-resistant film 71 on both sides of the flexible substrate 73 are is pressed by this molten resin material and bent along one side of the circumferential groove A2, and is brought into close contact with the one side.

If, during this filling, the recess B1 of the second mold B
If the convex portions B2 and B2 are not present, the molten resin material flows radially from the filling hole B3, and the molten resin material flowing in the longitudinal direction of the concave portion B1 flows from the side of the terminal portion 72 into the circumferential groove A2, and a part of it flows into the circumferential groove A2. is the current collecting pattern 73 on the side surface of the circumferential groove A2 and on both sides of the flexible substrate 73.
-1 and the insulator pattern 73-2 are formed, and the current collector pattern 73-1 and the insulator pattern 73-2 are not sufficiently bent, and the current collector pattern 73-1 and the insulator pattern 73-2 are not bent sufficiently. Insulator pattern 73-2
There is a problem that the surface is covered with resin material.

However, in the above embodiment, since the convex portions B2, B2 are formed at the bottom of the concave portion B1, the convex portion B2 is formed at the bottom of the concave portion B1.
Since the flow of the molten resin material in the longitudinal direction of the heat-resistant film 71 is obstructed, and the flow of the molten resin material in the width direction of the heat-resistant film 71 is promoted and flows into the circumferential groove A2, the surface of the flexible substrate 73 of the heat-resistant film 71 is Circumferential groove A
It is bent along the side of 2 and is in close contact with the side. Therefore, the surfaces of the current collecting pattern 73-1 and the insulating pattern 73-2 on both sides of the flexible substrate 73 are not covered with the resin material. That is, the first
Since the molten resin material does not flow between the side surface of the flat surface A1 of the first mold A and the flexible substrate 73, after the molten resin material hardens as described later, the first mold A and the first mold A When mold B of 2 is removed, the housing 7
Flexible substrate 73 on the inner bottom and inner surfaces of both side walls of 4
Current collection pattern 73-1 and insulator pattern 73-
2 will be exposed.

After filling the molten resin material between the first mold A and the second mold B as described above, after the resin material has solidified, the first mold A and the second mold B are Once removed, an electronic component for a sliding code switch as shown in FIG. 14 will be completed.

FIG. 18 is a diagram showing the structure of a sliding code switch made using the above-mentioned housing 74.
FIG. 8A is a partial side sectional view {a sectional view taken along the line E--E in FIG. 18B}, and FIG. 18B is a cross-sectional view {a sectional view taken along the line FF in FIG.

As shown in the figure, a sliding body 80 is attached to the outer periphery of the housing 74 of the sliding code switch having the above structure. The sliding body 80 is made of a resin material, and an operating knob 81 is integrally formed on the side thereof.
Reference numeral 83 denotes a contact point that comes into sliding contact with the current collecting pattern 73-1 and the insulator pattern 73-2 on the inner bottom surface of the flexible substrate 73, and 84 refers to a contact point that comes into sliding contact with the current collecting pattern 73-1 on both inner side surfaces of the flexible substrate 73. be. These contacts 83 and 84 are connected to the contact member 8.
5, and the contact member 85 is inserted into the main body of the sliding body 80. Further, a pair of claw members 82, 82 are formed on both sides of the sliding body 80, respectively, to engage with both sides of the bottom outer surface of the housing 74.

By abutting the upper part of the housing 74 between the claw members 82, 82 of the sliding body 80 having the above structure and pressing the sliding body 80, the claw members 82, 82 open on both sides and extend along the outer surface of the housing 74. Then, the projections of the claw members 82, 82 engage with the bottom surface of the casing 74 at the bottom surface of the casing 74. As a result, a sliding code switch using the housing 74 is completed.

When the operating knob 81 of the sliding code switch configured as described above is operated and the sliding body 80 is moved in the longitudinal direction of the housing 74, the contacts 83 and 84 are moved to the current collecting pattern 73-1 and the insulating pattern 73-2, respectively.
The on/off state between the five metal terminal pieces 75 changes by sliding on the top surface of the terminal.

In addition, in the above embodiment, the flexible substrate 73
Current collection pattern 73-1, insulator pattern 73-
Although the current collecting pattern 73 - 1 and the insulating pattern 73 - 2 may be exposed on the inner wall of one side of the housing 74 , the current collecting pattern 73 - 1 and the insulating pattern 73 - 2 may be exposed on the inner wall of one side of the housing 74 . In addition, current collection pattern 73-1
It goes without saying that the number of insulator patterns 73-2, etc. may also be changed as necessary.

The flexible substrate 73 and the lead pattern 7 on which the code pattern consisting of the current collecting pattern 73-1 and the insulator pattern 73-2 are formed as described above.
2-1 is formed with a heat-resistant film 71 made of thermoplastic synthetic resin. Since the inner bottom surface of the flexible board 73 and the inner wall surfaces of both sides of the casing 74 are exposed, the inner surface of the casing 74 can be effectively used, and the slide type cord switch can be made smaller and thinner. No assembly work with 74 is required.

Furthermore, although the above embodiment has been explained using a sliding type cord switch as an example, the electronic component built into the flexible substrate is not limited to this, and can also be used as a sliding type cord switch or a sliding type variable resistor. For example, a current collecting pattern is formed on the inner bottom surface and both inner side surfaces of the casing 74 by etching conductive foil such as copper or aluminum, and a resistor pattern of a predetermined shape is further vacuum deposited or a resistor pattern is formed. The sliding variable resistor may be formed by printing a conductive paste.

FIG. 19 is a perspective view showing the structure of another electronic component incorporating a flexible substrate according to the present invention. In this embodiment, the flexible substrate 93 is connected to the inner bottom surface of the casing 91, the inner surface of the side wall 91-2 of the casing 91, and the support 91.
-1 is inserted so as to be exposed on the outer peripheral surface. The housing 91 of this flexible board 93
Since the inserting method is substantially the same as the method shown in FIGS. 4 and 17, the explanation thereof will be omitted.

With the above configuration, the current collection pattern 93-1 and the insulator pattern 93-2 are exposed on the inner bottom surface of the casing 91, the inner surface of the side wall 91-2, and the outer peripheral surface of the support column 91-1.

Further, the terminal portion 92 has approximately the same structure as the terminal portion 2 of the electronic component housing shown in FIG.
~92-5.

FIG. 20 is a sectional view showing a state in which a rotary code switch using the housing 91 having the above structure is mounted on a printed wiring board 100, and is approximately the same in structure as the rotary code switch shown in FIGS. 7 and 8. be.

As shown in the figure, the rotary code switch is assembled by first inserting the support 91-1 formed in the center of the housing 91 into the hole 96-5 formed in the center of the lower part of the rotor 96, and then 96 is placed on the housing 91. Then, insert the engaging claws 96-1 and 96-2 into the holes 9.
8-2, 98-2, hole 98-2, 98-
Engaging claws 96-1, 9 are provided on the stepped portion formed on the wall surface of 2.
6-2, and rotate the rotary knob 98 to the rotor 96.
Attach to.

In the rotary code switch configured as described above, when the rotary knob 98 is rotated, the rotor 96 rotates, and the slider 96 attached to the bottom of the rotor 96 rotates.
-6 is in sliding contact with the current collector pattern 93-1 and insulator pattern 93-2 exposed on the inner bottom surface of the casing 91, and the slider 96 is attached to the inner peripheral surface of the rotor 96.
-7 is in sliding contact with the top of the current collection pattern 93-1 exposed on the outer peripheral surface of the support column 91-1, and furthermore, the sliding contact 96-8 attached to the outer peripheral surface of the rotor 96 is in sliding contact with the top of the current collecting pattern 93-1 exposed on the outer peripheral surface of the support column 91-1.
The current collecting pattern 93-1 and the insulating pattern 93-2 exposed on the inner surface of the electrode 2 are brought into sliding contact. As a result, the code signals between the metal terminal pieces 92-1 to 92-5 change.

By configuring the electronic components built into the flexible substrate as described above, the inner surface of the casing 91 can be effectively used, and the rotary code switch can be made extremely compact.

In the above embodiment, a rotary code switch was explained as an example, but the pattern formed on the flexible substrate 93 can be changed to a current collecting pattern formed by etching and a resistor pattern formed by vacuum deposition or printing. Therefore, it can be used as a rotary variable resistor, etc.

Although the embodiments of the electronic component and the method for manufacturing the same according to the present invention have been described above in detail, it goes without saying that the present invention is not limited thereto and that various modifications can be made within the scope of the present invention.

〔Effect of the invention〕

As described above in detail, the electronic component and method for manufacturing the same according to the present invention have the following effects.

A flexible substrate on which a conductor pattern is formed by etching a metal surface adhered or vapor-deposited on a synthetic resin film is used as the substrate, and a metal terminal piece is bonded to the upper surface of the end of the conductor pattern of the flexible substrate. A fixing resin film made of a synthetic resin film of the same quality as the flexible substrate is placed thereon, and a terminal portion having a structure in which the fixing resin film and the film of the flexible substrate are locally welded is provided. Further, the flexible board is inserted into a synthetic resin casing so that a predetermined portion of the flexible board protrudes from the tip of the metal terminal piece of the terminal portion to the outside of the casing, and the conductive pattern is exposed inside the casing, and the flexible board and Since the synthetic resin casing is integrated, the casing can be made smaller and thinner, and there is no need to assemble the board and the casing.

Furthermore, the electronic component according to the present invention can be directly surface-mounted on a printed wiring board together with various other electronic components, making it possible to automate the mounting.

Further, according to the electronic component according to the present invention, a metal terminal piece is bonded to the upper surface of the end of the conductor pattern of the flexible substrate, and a fixing resin film made of a synthetic resin film of the same quality as the flexible substrate is placed thereon. A terminal portion having a structure in which the fixing resin film and the film of the flexible substrate are locally welded is provided, and a predetermined portion protrudes from the tip of the metal terminal piece of the terminal portion of the flexible substrate to the outside of the casing. The flexible board was inserted into a synthetic resin casing so that the flexible board and the synthetic resin casing were integrated, and the electronic component was placed on the printed wiring board and connected via flux. During soldering, the flux will not penetrate into the electronic component through the terminal.

Further, according to the electronic component according to the present invention, a metal terminal piece is bonded to the upper surface of the end of the conductor pattern of the flexible substrate, and a fixed film made of a synthetic resin of the same quality as the flexible substrate is fixed thereon. The fixing resin film and the film of the flexible board are locally welded together, which not only strengthens the connection strength between the flexible board and the metal terminal piece, but also allows the metal terminal to be attached to the flexible board. I just added the thickness of the piece and the fixing resin film,
This results in an extremely thin terminal structure, which allows the thickness of the electronic component housing to be reduced.

Further, according to the electronic component according to the present invention, the flexible substrate on which the conductive pattern is formed is formed of an extremely thin synthetic resin film, and the inner bottom surface of the casing and the inner surface of the side wall of the casing rising from the bottom surface are coated on both sides. Since the conductor pattern is exposed, not only the bottom surface of the case but also the inner surface of the side wall can be effectively used as a board, making it easy to make electronic components smaller and smaller.
It can be made thinner and thinner. Further, according to the method for manufacturing an electronic component according to the present invention, the electronic component can be easily manufactured.

[Brief explanation of the drawing]

FIG. 1 is a diagram showing the structure of an electronic component incorporating a flexible substrate according to the present invention, in which FIG. 1A is a back view, FIG. 1B is a side view, and FIG. 1C is a top view. FIG. 2 and FIGS. 3A and 3B are diagrams for explaining the structure of a flexible substrate and its manufacturing method. FIGS. 4A, B, and C are diagrams for explaining a method of inserting a flexible substrate into a resin housing.
FIG. 5 is a side sectional view showing a rotary code switch using electronic components built into a flexible substrate.
FIG. 6 is a diagram showing the structure of another electronic component incorporating a flexible substrate according to the present invention, and FIG. 6A is a back view;
Figure B is a side sectional view, and Figure C is a plan view. 7th
This figure is an exploded perspective view of a rotary code switch using the electronic components shown in FIG. 6, and FIG. 8 is a sectional view of the assembled rotary code switch. FIG. 9 is a diagram showing the structure of another electronic component incorporating a flexible substrate according to the present invention, in which FIG. 9A is a plan view, FIG. 9B is a partially sectional side view, and FIG. D is a sectional view taken along the line A--A in FIG. FIG. 10 and FIGS. 11A and 11B are diagrams for explaining the manufacturing process of the flexible substrate and the terminal portion. FIGS. 12A and 12B are diagrams for explaining a method of inserting a flexible board into a resin housing. FIG. 13 is a side sectional view showing the structure of a sliding code switch using electronic components for the sliding code switch. 14 and 15 are diagrams showing the structure of another electronic component incorporating a flexible substrate according to the present invention, in which FIG. 14 is a perspective view, FIG. 15A is a plan view, and FIG. 15B is a part thereof. A cross-sectional side view, C is a back view, D is a cross-sectional view taken along line A-A of A in the same figure,
Figure E is a sectional view taken along the line B--B of Figure B.
FIG. 16 is a diagram for explaining the manufacturing process of the flexible substrate and the terminal portion. Figure 17 A, B,
C is a diagram for explaining a method of inserting a flexible board into a resin casing. FIG. 18 is a diagram showing the structure of a sliding code switch using the electronic components shown in FIG. It is a sectional view taken along the line FF in FIG. FIG. 19 is a perspective view showing the structure of another electronic component incorporating a flexible substrate according to the present invention, and FIG. 20 is a sectional view of a rotary code switch using this electronic component.
FIG. 21 is a plan view showing a case where the electronic component according to the present invention is used in a rotary variable resistor. In the figure, 1, 54, 74, 91... housing, 3, 5
3,73,93...Flexible board, 3-1,
53-1, 73-1, 93-1... Current collection pattern (conductor pattern), 3-5 to 3-9, 52-1,
72-1...Lead pattern (conductor pattern),
3-2, 53-2, 73-2, 93-2... Insulator pattern, 2-1 to 2-5, 55, 75, 92
-1 to 92-5...metal terminal piece, 2-6, 57,
77... terminal fixing film, 2, 52, 72,
92...Terminal section, 5, 6, 96...Rotor, 1-
1,91-1...Strut, A1...Flat surface, A2...
...Groove, A...First mold, B1...Recess, B...
The second mold is A3...hole.

Claims (1)

[Scope of Claims] 1. An electronic component in which a substrate on which a conductive pattern with which at least a contact of a slider of an electronic component slides is housed inside a casing, comprising: a conductive material on a synthetic resin film as the substrate; A flexible substrate with a pattern formed thereon is used, a conductor pattern formed by etching a metal surface adhered or vapor-deposited on the synthetic resin film is used as the conductor pattern of the flexible substrate, and the flexible substrate A metal terminal piece is bonded to the end of the conductor pattern of the substrate with its tip protruding from the edge of the flexible substrate, and a terminal fixing film made of a synthetic resin film is placed on top of the bonded metal terminal piece. and a terminal portion having a structure in which the terminal fixing film and the flexible substrate are locally welded, and the flexible substrate has a predetermined portion of the tip of the metal terminal piece of the terminal portion protruding to the outside. An electronic component characterized in that the conductive pattern is inserted into a synthetic resin casing and integrated with the casing so that the conductor pattern is exposed inside. 2. A flexible substrate on which a conductive pattern is formed by etching a metal surface adhered or vapor-deposited on a synthetic resin film; a flat surface to which the surface of the flexible substrate on which the conductive pattern is formed is in close contact; a first mold in which a groove forming a side part of a synthetic resin casing is formed around a flat surface; a flat surface of the first mold disposed opposite to the first mold; and a second mold having a concave portion forming the bottom of the casing in a portion corresponding to at least a portion of the groove, A metal terminal piece is bonded with its tip protruding from the end of the flexible substrate, a terminal fixing film made of a synthetic resin film is placed on the bonded metal terminal piece, and the terminal fixing film and The metal terminal piece is fixed to the flexible substrate by locally fusion bonding to the flexible substrate, and the conductive pattern formed surface of the flexible substrate is placed between a first mold and a second mold. The mold is held in contact with a flat surface of the mold, and the molten resin material is press-fitted into the recess of the second mold to fill the space between the first mold and the second mold. Method of manufacturing electronic components. 3. An electronic component in which a substrate on which a conductive pattern is formed, with which at least the contacts of a slider of the electronic component slide, is housed inside a casing, and the substrate is a flexible substrate in which a conductive pattern is formed on a synthetic resin film. using a conductor pattern formed by etching a metal surface adhered or vapor-deposited on the synthetic resin film as the conductor pattern of the flexible substrate; is formed to have a size larger than the inner bottom surface of the casing by a predetermined dimension, and the flexible substrate is bent so that the conductive pattern is exposed on both the inner bottom surface of the casing and the inner surface of a side wall of the casing rising from the bottom surface. An electronic component characterized by being inserted and integrated into a synthetic resin casing in a state of being 4. A flexible substrate on which a conductive pattern is formed by etching a metal surface adhered or vapor-deposited on a synthetic resin film, a flat surface to which the conductive pattern-formed surface of the flexible substrate is in close contact, and the flat surface. a first mold in which a groove forming a side part of a synthetic resin casing is formed around the periphery of the casing; a second mold in which a concave portion forming the bottom of the casing is formed in a portion corresponding to a portion including a part of the groove; The size of the conductive pattern forming surface of the flexible substrate is formed to be larger by a predetermined size, and the conductive pattern forming surface is placed between a first mold and a second mold, and the conductive pattern forming surface is placed on the flat surface of the first mold. The conductor pattern of the flexible substrate is filled between the first mold and the second mold by press-fitting a molten resin material into the recessed part of the second mold. The formation surface is brought into close contact with the flat surface of the first mold, and a portion of the conductor pattern formation surface of the flexible substrate that protrudes from the flat surface is bent along the side surface of the groove of the first mold. A method of manufacturing an electronic component, characterized in that the first and second molds are removed after the molten resin material filled in the molds is cooled and solidified.