JPH053721B2 - - Google Patents

Info

Publication number
JPH053721B2
JPH053721B2 JP60110981A JP11098185A JPH053721B2 JP H053721 B2 JPH053721 B2 JP H053721B2 JP 60110981 A JP60110981 A JP 60110981A JP 11098185 A JP11098185 A JP 11098185A JP H053721 B2 JPH053721 B2 JP H053721B2
Authority
JP
Japan
Prior art keywords
tape material
resin member
knob
hole
resin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP60110981A
Other languages
Japanese (ja)
Other versions
JPS61268002A (en
Inventor
Fumitoshi Masuda
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Murata Manufacturing Co Ltd
Original Assignee
Murata Manufacturing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Murata Manufacturing Co Ltd filed Critical Murata Manufacturing Co Ltd
Priority to JP60110981A priority Critical patent/JPS61268002A/en
Publication of JPS61268002A publication Critical patent/JPS61268002A/en
Publication of JPH053721B2 publication Critical patent/JPH053721B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Apparatuses And Processes For Manufacturing Resistors (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
  • Adjustable Resistors (AREA)

Description

【発明の詳細な説明】 (発明の分野) 本発明は、生産性にすぐれた、樹脂部材を有す
る電子部品の製造方法に関する。
DETAILED DESCRIPTION OF THE INVENTION (Field of the Invention) The present invention relates to a method of manufacturing an electronic component having a resin member, which is highly productive.

(従来の技術) 従来より、樹脂部材を有する電子部品、たとえ
ば樹脂で形成されたツマミを有する可変抵抗器
は、第4図に示すような方法で、矢印Xの方向に
順に製造されていた。
(Prior Art) Conventionally, electronic components having resin members, such as variable resistors having knobs made of resin, have been manufactured sequentially in the direction of arrow X by a method as shown in FIG.

第4図中、1は絶縁基板であり、表面に円弧状
の抵抗体1aが形成され、中心部に設けられた孔
に集電電極1b形成され、また抵抗体1aの一端
と電気的に接続されたリード端子2a、抵抗体1
aの他端と電気的に接続されたリード端子2b、
集電電極1bと電気的に接続されたリード端子2
cがそれぞれ埋設されている。
In Fig. 4, reference numeral 1 denotes an insulating substrate, on which an arc-shaped resistor 1a is formed, a current collecting electrode 1b is formed in a hole provided in the center, and is electrically connected to one end of the resistor 1a. lead terminal 2a, resistor 1
a lead terminal 2b electrically connected to the other end of a;
Lead terminal 2 electrically connected to current collecting electrode 1b
c are buried respectively.

3は摺動子であり、抵抗体1a上を摺動する接
点3aと、後述するツマミ5との位置決め用の突
起3bと、複数のツメ3cが形成されており、ツ
メ3cを集電電極1bの孔に係止することによつ
て集電電極1b上に回動自在に取り付けられてい
る。
Reference numeral 3 denotes a slider, which has a contact 3a that slides on the resistor 1a, a projection 3b for positioning with a knob 5, which will be described later, and a plurality of claws 3c. It is rotatably mounted on the current collecting electrode 1b by being locked in the hole.

複数の絶縁基板1はそれぞれ、リード端子2
a,2bとつながつたフープ端子4a、およびリ
ード端子2cとつながつたフープ端子4bによつ
て供給され、複数の摺動子3はそれぞれフープ端
子4cによつて供給されている。
Each of the plurality of insulating substrates 1 has a lead terminal 2.
a and 2b, and a hoop terminal 4b connected to the lead terminal 2c, and the plurality of sliders 3 are each supplied by the hoop terminal 4c.

5は樹脂で形成されたツマミであり、上面にド
ライバー溝5aが形成され、また第5図に示すよ
うに、軸5bと凹部5cが形成されており、凹部
5cに摺動子3の突起3bが嵌合させて軸5bを
集電電極1bの孔にかしめることにより、摺動子
3とともに回動するようになつている。このツマ
ミ5は樹脂でてきているため、それぞれ1個づつ
供給する必要がある。
Reference numeral 5 designates a knob made of resin, and has a driver groove 5a formed on its upper surface, and, as shown in FIG. 5, a shaft 5b and a recess 5c. By fitting the shaft 5b into the hole of the current collecting electrode 1b, the shaft 5b rotates together with the slider 3. Since the knobs 5 are made of resin, it is necessary to supply one each.

これらの可変抵抗器は、絶縁基板1に摺動子3
とツマミ5を取り付けたのち、フープ端子4aか
らリード端子2aおよび2b、フープ端子4bか
らリード端子2c、フープ端子4cから摺動子3
がそれぞれ切断される。
These variable resistors have a slider 3 on an insulating substrate 1.
After attaching the knob 5, connect the lead terminals 2a and 2b from the hoop terminal 4a, the lead terminal 2c from the hoop terminal 4b, and the slider 3 from the hoop terminal 4c.
are respectively cut.

(発明が解決しようとする問題点) しかしながら、上述した従来の樹脂部材を有す
る電子部品の製造方法には次のような問題点があ
つた。すなわち、せつかく絶縁基板1や摺動子3
といつた他の部材をフープ端子4a,4bおよび
4cによつて供給しても、樹脂部材であるツマミ
5をそれぞれ1個ずつ供給しなければならないた
め、一貫した自動化による組み立てができず生産
性が悪いという問題点があつた。
(Problems to be Solved by the Invention) However, the above-described conventional method for manufacturing electronic components having resin members has the following problems. In other words, the insulating substrate 1 and the slider 3
Even if the other parts such as 4a, 4b, and 4c are supplied using the hoop terminals 4a, 4b, and 4c, each knob 5, which is a resin member, must be supplied one by one, making it impossible to assemble through consistent automation, which reduces productivity. There was a problem that it was bad.

さらに樹脂部材に方向性が要求される場合、た
とえばツマミ5の凹部5cに摺動子3の突起3b
を嵌合させなければならないような場合には、樹
脂部材を1個づつ一定の方向にそろえなければな
らないため、さらに生産性が悪くなるという問題
点があつた。
Furthermore, if the resin member is required to have directionality, for example, the protrusion 3b of the slider 3 may be placed in the recess 5c of the knob 5.
When the resin members have to be fitted together, the resin members must be aligned one by one in a fixed direction, which further reduces productivity.

(問題点を解決するための手段) 本発明は、上述した従来の技術を有する問題点
を解決するためになされたものである。その手段
として本発明の樹脂部材を有する電子部品の製造
法王は、一定の間隔をおいて複数の孔が形成され
たテープ材の孔の部分に、孔の周縁の少なくとも
一部を挟持するようにして樹脂部材を金型形成
し、テープ材に樹脂部材を付けたまま、それぞれ
の樹脂部材を電子部品の他の部材に結合させ、そ
の後テープ材をはずすようにした。
(Means for Solving the Problems) The present invention has been made to solve the problems of the above-mentioned conventional techniques. As a means for manufacturing electronic components having a resin member according to the present invention, at least a part of the periphery of the hole is sandwiched between the hole portion of a tape material in which a plurality of holes are formed at regular intervals. The resin members were molded using a mold, each resin member was bonded to another member of the electronic component while the resin member was attached to the tape material, and then the tape material was removed.

(実施例の説明) 以下、図面とともに本発明の一実施例を、可変
抵抗器を例にとつて説明する。従来の技術の項で
示したものと同一の部分には同一の番号を付し、
その説明を省略する。
(Description of Embodiment) An embodiment of the present invention will be described below with reference to the drawings, taking a variable resistor as an example. The same parts as those shown in the prior art section are given the same numbers,
The explanation will be omitted.

まず、第1図AおよびBに示すように、一定の
間隔をおいて複数の略円形の孔6aが形成された
テープ材6の孔6aの部分に、テープ材6を矢印
Yの方向に移動させながら、金型7aおよび7b
によつて、孔6aの周縁を少なくとも一部を挾持
するようして樹脂部材であるツマミ5を順次形成
する。テープ材6としては、紙テープ、プラスチ
ツクテープなどを使用することができる。
First, as shown in FIGS. 1A and 1B, the tape material 6 is moved in the direction of arrow Y to the hole 6a portion of the tape material 6 in which a plurality of approximately circular holes 6a are formed at regular intervals. molds 7a and 7b while
As a result, the knob 5, which is a resin member, is sequentially formed so as to sandwich at least a portion of the periphery of the hole 6a. As the tape material 6, paper tape, plastic tape, etc. can be used.

次に、第2図に示すように、テープ材6によつ
てツマミ5を供給し、ツマミ5の軸5bを集電電
極1bの孔にかしめたのち、テープ材6を上に引
つ張ることによつて、テープ材6をツマミ5から
順次はずす。テープ材6をはずしたあとのツマミ
5には、孔6aの周縁を挾持していた溝5dがの
こる。この工程は、テープ材6、フープ端子4
a,4bおよび4cを矢印Zの方向に移動させな
がら順次におこなう。
Next, as shown in FIG. 2, the knob 5 is supplied using the tape material 6, the shaft 5b of the knob 5 is caulked into the hole of the current collecting electrode 1b, and then the tape material 6 is pulled upward. Remove the tape material 6 from the knob 5 one by one. After the tape material 6 is removed, the groove 5d that held the periphery of the hole 6a remains on the knob 5. This process consists of tape material 6, hoop terminal 4
This is performed sequentially while moving a, 4b and 4c in the direction of arrow Z.

最後に、従来と同様に、フープ端子4aからリ
ード端子2aおよび2b、フープ端子4bからリ
ード端子2c、フープ端子4cから摺動子3をそ
れぞれ切断する。
Finally, as in the conventional case, the lead terminals 2a and 2b are cut from the hoop terminal 4a, the lead terminal 2c is cut from the hoop terminal 4b, and the slider 3 is cut from the hoop terminal 4c.

以上は、本発明の樹脂部材を有する電子部品の
製造方法の一実施例であり、本発明の趣旨を損な
わない範囲内で設計変更をなしうることはいうま
でもない。たとえばテープ材6によつてツマミ5
を供給し、ツマミ5の軸5bを集電電極1bの孔
にかしめたのち、テープ材6をツマミ5からはず
さずに、フープ端子4aからリード端子2aおよ
び2b、フープ端子4bからリード端子2c、フ
ープ端子4cから摺動子3をそれぞれ切断し、テ
ープ材6を完成した可変抵抗器群の保持材として
利用してもよい。
The above is an example of the method for manufacturing an electronic component having a resin member according to the present invention, and it goes without saying that the design can be changed within the scope of the invention. For example, the tape material 6 may cause the knob 5 to
After supplying and caulking the shaft 5b of the knob 5 into the hole of the current collecting electrode 1b, without removing the tape material 6 from the knob 5, connect the lead terminals 2a and 2b from the hoop terminal 4a, the lead terminal 2c from the hoop terminal 4b, The sliders 3 may be cut from the hoop terminals 4c, and the tape material 6 may be used as a holding material for the completed variable resistor group.

また、テープ材6に形成されている孔6aの形
状は任意であり、上記の実施例のように略円形に
限定されることはない。さらに、第3図に示すよ
うに、孔6aから放射状の切り込み6bを設け、
テープ材6からツマミ5が用意にはずせるように
してもよい。
Further, the shape of the hole 6a formed in the tape material 6 is arbitrary, and is not limited to a substantially circular shape as in the above embodiment. Furthermore, as shown in FIG. 3, radial cuts 6b are provided from the hole 6a,
The knob 5 may be easily removed from the tape material 6.

(発明の効果) 以上の説明からも明らかなように、本発明の樹
脂部材を有する電子部品の製造方法によれば、樹
脂部材をテープ材によつて供給することができる
ため、一貫した自動組み立てが可能であり生産性
が高い。また、樹脂部材に方向性が要求される場
合であつても、樹脂部材を1個づつ一定の方向に
そろえる必要がないため、さらに生産性が高くな
つている。
(Effects of the Invention) As is clear from the above explanation, according to the method for manufacturing electronic components having resin members of the present invention, since the resin members can be supplied by tape material, consistent automatic assembly is possible. is possible and highly productive. Further, even if the resin members are required to have directionality, there is no need to align the resin members one by one in a fixed direction, further increasing productivity.

【図面の簡単な説明】[Brief explanation of the drawing]

第1図Aは本発明の樹脂部材を有する電子部品
の製造方法の一実施例におけるテープ材の孔の部
分に樹脂部材を形成する工程を示す平面図、第1
図Bはその側断面図、第2図は本発明の一実施例
におけるテープ材に樹脂部材を付けたまま樹脂部
材を電子部品の他の部材に結合させる工程を示す
斜視図、第3図は他の実施例を示す平面図、第4
図は従来の樹脂部材を有する電子部品の製造方法
を示す斜視図、第5図は樹脂部材の一例を示す側
断面図である。 1……絶縁基板、2a,2b,2c……リード
端子、3……摺動子、4a,4b,4c……フー
プ端子、5……ツマミ(樹脂部材)、6……テー
プ材、6a……孔、7a,7b……金型。
FIG. 1A is a plan view showing a step of forming a resin member in a hole portion of a tape material in an embodiment of the method for manufacturing an electronic component having a resin member of the present invention;
Figure B is a side sectional view thereof, Figure 2 is a perspective view showing the process of bonding the resin member to other members of the electronic component with the resin member attached to the tape material in one embodiment of the present invention, and Figure 3 is Plan view showing another embodiment, No. 4
The figure is a perspective view showing a conventional method of manufacturing an electronic component having a resin member, and FIG. 5 is a side sectional view showing an example of the resin member. 1... Insulating board, 2a, 2b, 2c... Lead terminal, 3... Slider, 4a, 4b, 4c... Hoop terminal, 5... Knob (resin member), 6... Tape material, 6a... ...hole, 7a, 7b...mold.

Claims (1)

【特許請求の範囲】[Claims] 1 一定の間隔をおいて複数の孔が形成されたテ
ープ材の孔の部分に、孔の周縁の少なくとも一部
を挟持するようにして樹脂部材を金型形成し、テ
ープ材に樹脂部材を付けたまま、それぞれの樹脂
部材を電子部品の他の部材に結合させ、その後テ
ープ材をはずすことを特徴とする電子部品の製造
方法。
1. A resin member is molded into the hole portion of the tape material in which a plurality of holes are formed at regular intervals so as to sandwich at least a part of the periphery of the hole, and the resin member is attached to the tape material. 1. A method of manufacturing an electronic component, which comprises bonding each resin member to another component of the electronic component while the tape material is being removed.
JP60110981A 1985-05-22 1985-05-22 Manufacture of electronic component having resin member Granted JPS61268002A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP60110981A JPS61268002A (en) 1985-05-22 1985-05-22 Manufacture of electronic component having resin member

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP60110981A JPS61268002A (en) 1985-05-22 1985-05-22 Manufacture of electronic component having resin member

Publications (2)

Publication Number Publication Date
JPS61268002A JPS61268002A (en) 1986-11-27
JPH053721B2 true JPH053721B2 (en) 1993-01-18

Family

ID=14549375

Family Applications (1)

Application Number Title Priority Date Filing Date
JP60110981A Granted JPS61268002A (en) 1985-05-22 1985-05-22 Manufacture of electronic component having resin member

Country Status (1)

Country Link
JP (1) JPS61268002A (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62248205A (en) * 1986-04-21 1987-10-29 アルプス電気株式会社 Electric parts composing member

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5626410A (en) * 1979-08-09 1981-03-14 Nippon Electric Co Method of manufacturing variable resistor
JPS5972102A (en) * 1982-10-18 1984-04-24 アルプス電気株式会社 Electric part

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5626410A (en) * 1979-08-09 1981-03-14 Nippon Electric Co Method of manufacturing variable resistor
JPS5972102A (en) * 1982-10-18 1984-04-24 アルプス電気株式会社 Electric part

Also Published As

Publication number Publication date
JPS61268002A (en) 1986-11-27

Similar Documents

Publication Publication Date Title
JPS6212642B2 (en)
JPS59106105A (en) Slider and method of forming same
JPS6020258Y2 (en) DIP type rotary switch
JPH053721B2 (en)
JPH01308001A (en) Variable resistor and manufacture thereof
US4688328A (en) Method for fabricating a printed circuit board assembly and method for the manufacture thereof
JPS58210603A (en) Method of producing substrate for variable resistor
JP3941148B2 (en) Manufacturing method of magnetic sensor
JPS6025695Y2 (en) Magnetoresistive magnetic head
JP4097187B2 (en) Connector and its mounting structure
JPS6140003A (en) Method of producing variable resistor
JPS6314464Y2 (en)
JPH055361B2 (en)
JPH0241881B2 (en)
JP2562721Y2 (en) Thin coil set
JPS608603B2 (en) Manufacturing method of chip resistor
JPH08255642A (en) Base-to-fpc/ffc connector
JPH0326523B2 (en)
JPH08138778A (en) Connector for mounting on substrate and its manufacture
JPH0670934B2 (en) Lead terminal frame
JPH0729606Y2 (en) Variable resistor
JPS6220968Y2 (en)
JPH0570286B2 (en)
JPS60158610A (en) Manufacture of high-frequency coil
JPH02170403A (en) Electronic part

Legal Events

Date Code Title Description
EXPY Cancellation because of completion of term