JP2001185406A - Rotary electronic component, substrate with case and manufacturing method thereof - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a rotary electronic component, in which waterproof for the component can be easily and surely realized, and also a substrate with case be easily and surely manufacture without any defectives and the methods of manufacturing the rotary electronic component and the substrate with case. SOLUTION: In the rotary electronic component, a rotor 40 is mounted turnably on a substrate 20, and a slider 45 mounted on the rotor 40 is slid on conductive patterns 21, 23 mounted on the substrate 20 by turning the rotor 40. An elastic body 70 is arranged around the portion of the substrate 20 mounting the patterns 21, 23. The rotor 40 brings an abutting part 47 mounted around the slider 45 to abut on the elastic body, 70 so inside of the body 70 is waterproofed.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a rotary electronic component, a substrate with a case, and a method of manufacturing the same.

[0002]

2. Description of the Prior Art FIG. 6 is a side sectional view of a conventional hermetic rotary electronic component. As shown in the figure, in this rotary electronic component, a case 120 made of synthetic resin is provided around an outer periphery of a ceramic substrate 110 having a conductive pattern (resistor pattern or common pattern) 111 provided on the surface thereof. The rotor 130 is rotatably housed in the case 120, and the lower surface of the substrate 110 is sealed with the resin 150.
The space between the case 120 and the rotor 130 is sealed with an O-ring 160.

Here, a metal terminal plate 113 protruding from the lower surface of the substrate 110 is fixed to the substrate 110 by means such as eyelets. A slider 140 is attached to the lower surface of the rotor 130, and a sliding booklet at the tip of the slider 140 is in contact with the conductive pattern 111.

When the rotor 130 is rotated, the slider 1
40 slides on the conductive pattern 111, and the resistance value changes.

[0005] However, the waterproof structure of the above-mentioned rotary electronic component is complicated and complicated to manufacture. Therefore, there has been a demand for a rotary electronic component that can be more simply, easily and reliably waterproofed.

[0006]

SUMMARY OF THE INVENTION The present invention has been made in view of the above-mentioned points, and an object of the present invention is to easily and reliably waterproof a rotary electronic component, and to manufacture a substrate with a case with a defective product. It is an object of the present invention to provide a rotary electronic component, a case-mounted substrate, and a method of manufacturing the same, which can be easily and reliably performed without any occurrence.

[0007]

According to the present invention, a rotor is rotatably mounted on a substrate, and an electric function portion provided between the rotor and the substrate is rotated by the rotor. In the rotary electronic component having a structure operated by the above, an elastic body is attached so as to surround the electric function portion around the portion where the electric function portion is provided on the substrate, while the rotor surrounds the outer periphery of the slider. The electrical function unit has a waterproof structure by abutting an abutting contact unit provided on the elastic body. A case was formed around the substrate so as to be integral with the substrate, and the case was provided with a storage portion for rotatably storing the rotor. Further, the substrate with a case according to the present invention is characterized in that a case is formed around a rigid substrate including a portion to which the terminal plate is connected, with the terminal plate being connected to a terminal pattern formed on the surface of the rigid substrate. I do. Further, according to the present invention, a substrate having a conductive pattern formed on its surface is sandwiched by a mold, and the conductive pattern facing surface provided on the mold is provided around the conductive pattern facing surface in a state facing the conductive pattern forming surface of the substrate. In a method of manufacturing a substrate with a case, a molten mold resin is press-fitted into a cavity, and a mold is removed after cooling to form a case around the exposed conductive pattern of the substrate. The substrate is sandwiched by a mold in a state where the elastic body is placed on a part surrounding the periphery of the case, and the case is formed in a state where the mold and the elastic body are in contact with each other.

[0008]

Embodiments of the present invention will be described below in detail with reference to the drawings. FIG. 1 is a schematic side sectional view showing a rotary electronic component according to one embodiment of the present invention. As shown in the figure, this rotary electronic component is made of a synthetic resin case 30 surrounding the outer periphery of a ceramic substrate 20 provided with conductive patterns (common pattern 21 and resistor pattern 23) on the surface thereof. A case-molded substrate 10, a rotor 40 rotatably accommodated in a circular accommodating portion 31 provided above the case 30, and a cover 60 for preventing the rotor 40 from coming off. ,
Further, an elastic body 70 is attached around the conductive patterns 21 and 23 of the substrate 20 so as to surround the conductive patterns 21 and 23. Hereinafter, each component will be described together with its manufacturing method.

First, in order to manufacture this rotary electronic component,
As shown in FIG. 2, a substrate 20 and three metal terminal plates 81,
83, 85, dummy metal terminal plates 87, 89, and an elastic body 70 are prepared.

The substrate 20 is made of ceramic. A common pattern 21 made of a conductor is formed at the center of the surface of the substrate 20, and a resistor pattern 23 is formed around the common pattern 21 by screen printing or the like. Terminal patterns 24, 25, 26 are drawn out from both ends of the common pattern 21 and the resistor pattern 23, respectively. Dummy patterns 27 and 28 are printed and formed at the corners opposite to the terminal patterns 24, 25 and 26. These patterns may be formed by other methods such as etching a copper foil.

The metal terminal plates 81, 83, 85 and the dummy metal terminal plates 87, 89 are actually formed by pressing a single strip-shaped metal plate, and an end (not shown) is formed on a lead frame. It is connected.

The elastic body 70 is a flat rubber plate formed in a ring shape, and its inner diameter is substantially the same as the outer diameter of the resistor pattern 23, and its outer diameter is the same as that of the storage portion 31 of the case 30. It is formed substantially the same as the inner diameter. Further, three fixing portions 71 protrude from the outer periphery. These fixing portions 71 are positioned and fixed in the case 30 when molding the mold resin of the case 30 described below. As a material of the elastic body 70, for example, silicon rubber, Teflon rubber, NBR
It is manufactured by press cutting or molding a rubber sheet using rubber or the like.

First, each terminal pattern 2 on the substrate 20
4, 25, 26 and the dummy patterns 27, 28, the metal terminal plates 81, 83, 85 and the dummy metal terminal plate 8, respectively.
7 and 89 are brought into contact with each other. Each terminal pattern 24,
25, 26 and the dummy patterns 27, 28 and the metal terminal plates 81, 83, 85 and the dummy metal terminal plates 87, 89 are fixed by the case 30 in a later step. Although it is not necessary to fix it in advance, it is preliminarily fixed with a conductive adhesive or solder, or a hot melt type conductive adhesive is interposed between the two and melted by heat when molding the case 30 to form the two. The gap may be fixed. In addition, each terminal pattern 24, 2
5 and 26 and the dummy patterns 27 and 28 themselves are formed of an elastic conductive paint layer (for example, kneaded silver powder in a thermosetting cross-linked urethane resin), or the elastic conductive paint layer is printed on those patterns. This is preferable because the connection with the metal terminal plates 81, 83, 85, etc. is performed with elasticity without using an adhesive.

Next, the elastic body 70 is mounted on the substrate 20.
At this time, the portion of the substrate 20 where the resistor pattern 23 is formed is exposed inside the elastic body 70. Note that the elastic body 70 is not directly mounted on the substrate 20 and a step 94 around the conductive pattern facing surface 93 of the first mold 90 shown in FIG.
, And may be placed on the substrate 20 when the substrate 20 is sandwiched between the first and second molds 90 and 95.

Next, as shown in FIG. 3, the upper and lower sides of the substrate 20 are sandwiched between first and second molds 90 and 95. first,
The second molds 90 and 95 are provided with cavities 91 and 96 having the same shape as the case 30 shown in FIG. 1, and a portion protruding downward from the center of the first mold 90 is provided. A conductive pattern facing surface 93 is provided. A portion near the outer periphery of the conductive pattern facing surface 93 is in circumferential contact with the surface of the elastic body 70.

Then, a high-temperature molten molding resin is pressed into the cavities 91 and 96 and waits for the molding resin to solidify. Thereafter, the first and second dies 90 and 95 are pressed.
Is removed, the substrate with case 10 shown in FIG. 4 is completed.

The conductive pattern facing surface 93 is
The elastic body 70 is designed to have such a size that it comes into contact with the surface of the elastic body 70 and is slightly crushed. Therefore, even if the thickness of the substrate 20 has a dimensional tolerance, the conductive pattern facing surface 93 can be reliably pressed against the elastic body 70.

If the elastic body 70 is not provided, when a substrate with a case is manufactured by the above-described manufacturing method, as shown in FIG. 7, the conductive patterns 21, 23 are exposed to expose the conductive patterns 21, 23. First mold 90
The conductive pattern facing surface 93 must be securely contacted. However, the thickness of the substrate 20 is 0.05
mm, a slight gap is formed between the surface on which the conductive patterns 21 and 23 are formed and the surface 93 facing the conductive pattern due to the above-mentioned tolerance. Pattern facing surface 9
3 is strongly pressed against the surface on which the conductive patterns 21 and 23 are formed, and there is a problem that the hard and brittle ceramic substrate 20 is broken.

Since the conductive patterns 21 and 23 are formed on the conductive pattern forming surface, when the conductive pattern facing surface 93 is brought into contact therewith, the conductive patterns 21 and 23 are formed.
Due to the thickness (15 to 20 μm), the conductive pattern facing surface 93 floats from the surface of the substrate 20, and the injection-molded molten resin may flow into the floating gap.

On the other hand, if the elastic body 70 is installed as in the present invention, the conductive pattern facing surface 93 is directly connected to the substrate 2.
0 can be prevented from being broken by strongly pressing the surface of the conductive pattern.
When a gap is formed between the mold resin and the mold resin, there is no inconvenience that the mold resin covers the pattern forming surface due to the molten resin entering the gap.

Next, as shown in FIG.
A substantially cylindrical rotor 40 is rotatably housed in a housing portion 31 formed at the center of the "0". The rotor 40 is made of a synthetic resin, and has a slider 45 mounted in a recess 46 provided on the lower surface thereof as shown in FIG. , And the other sliding booklet 45b contacts the resistor pattern 23.

A plus groove 41 for inserting a rotary jig (not shown) is provided on the upper surface of the rotor 40, and a stopper abutting portion 43 for abutting a stopper 65 provided on a cover 60 described below is provided on the outer peripheral side surface thereof. Is provided. Further, a contact portion 47 that protrudes in a circular shape is provided at a lower end side of the outer periphery of the rotor 40, that is, a portion surrounding the outer periphery of the slider 45.

Then, the cover 60 is put on the substrate 10 with the case in which the rotor 40 is stored. The cover 60 is made of a metal plate, is formed in a shape that covers the upper surface of the case 30, has a through portion 61 projecting from the upper portion of the rotor 40 in the center thereof, and has arms 63 projecting from the four corners. I have. A tongue-shaped stopper 65 is provided on one side of the cover 60 and bent downward.

The rotary electronic component is completed by bending and integrating the tip of each arm 63 into the concave portion 29 provided on the side surface of the case 20.

At this time, the rotor 40 is pushed by the cover 60, and the contact portion 47 thereof comes into contact with the upper surface of the elastic body 70 and is slightly pressed.

When the rotor 40 is rotated, as shown in FIG. 1, the sliding booklet 45b slides on the resistor pattern 23 to change the resistance value between the three metal terminal plates 81, 83, 85. I do.

Since the contact portion 47 of the rotor 40 is in elastic contact with the elastic member 70, the space inside the contact portion 47, that is, the space of the electrical function portion including the slider 45, the common pattern 21, and the resistor pattern 23 is provided. Is sealed from the outside and waterproof.

Although the embodiments of the present invention have been described above, the present invention is not limited to the above-described embodiments, and various modifications are possible within the scope of the claims and the technical idea described in the specification and the drawings. Is possible. It should be noted that any shape or material not directly described in the specification and the drawings is within the scope of the technical idea of the present invention as long as the effects and effects of the present invention are exhibited.

For example, in the above embodiment, a variable resistor is configured, but a rotary switch may be configured by changing the resistor pattern 23 to a switch pattern.

In the above embodiment, the pattern is attached to the substrate 20 and the slider is attached to the rotor 40.
A slider may be provided on the side, and a pattern may be provided on the rotor 40 side. Further, it may be an electric function part having various structures other than the electric function part constituted by the slider and the pattern.

In the above embodiment, the substrate 20 is made of ceramic, but may be made of other various materials.

The shape of the elastic body 70 is not limited to the shape of the above embodiment, but may be other various shapes. For example, the cross section is not limited to a rectangular shape, and may have another cross section such as a circle. In short, any shape and structure may be used as long as the electrical function portion can be waterproofed by the contact portion of the rotor being in contact with the rotor.

[0033]

As described in detail above, the present invention has the following excellent effects. Since the electrical functioning portion has a waterproof structure by abutting the contact portion of the rotor on the elastic body, the structure is simple, and the waterproofing can be performed easily and reliably.

When the substrate is sandwiched between the molds, the periphery of the conductive pattern facing surface of the mold is brought into contact with an elastic body to seal the conductive pattern forming surface of the substrate. It is possible to reliably prevent the mold resin from entering the conductive pattern and to prevent the substrate from being broken. Therefore, it is possible to easily and reliably manufacture a substrate with a case.

One elastic body attached to the substrate can have both the above effects, that is, the function of waterproofing and the function of preventing the occurrence of defective products when manufacturing a substrate with a case.

The structure of the substrate with a case is simple.

[Brief description of the drawings]

FIG. 1 is a schematic side sectional view showing a rotary electronic component according to an embodiment of the present invention.

FIG. 2 is a view illustrating a method of manufacturing the substrate with case 10;

FIG. 3 is a diagram illustrating a method of manufacturing the substrate with case 10;

FIG. 4 is a schematic side sectional view of the substrate with case 10;

FIG. 5 is a diagram illustrating a method of manufacturing a rotary electronic component.

FIG. 6 is a side sectional view of a conventional rotary electronic component.

FIG. 7 is a diagram illustrating a method of manufacturing a substrate with a case without using an elastic body 70.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 10 Substrate with a case 20 Substrate 21 Common pattern (conductive pattern) 23 Resistor pattern (conductive pattern) 30 Case 31 Storage part 40 Rotor 45 Slider 47 Contact part 60 Cover 70 Elastic body 71 Fixed part 81, 83, 85 Metal Terminal plate 87, 89 Dummy metal terminal plate 90 First mold 91 Cavity 93 Conducting pattern facing surface 95 Second mold 96 Cavity

 ──────────────────────────────────────────────────続 き Continued on the front page (72) Inventor Junichi Sakatani 335 Karijuku, Nakahara-ku, Kawasaki City, Kanagawa Prefecture Inside Imperial Communications Industry Co., Ltd. F term (reference) 5E028 BA03 BB04 EA03 EA13 EA21 5E030 BA03 CB06 CC02 CC13 FA04 FB02 FB03

Claims (4)

[Claims] 1. A rotary electronic component having a structure in which a rotor is rotatably mounted on a substrate and an electric function unit provided between the rotor and the substrate is operated by rotating the rotor. An elastic body is attached around the portion where the electric function portion is provided so as to surround the electric function portion, while the rotor has a contact portion provided so as to surround the outer periphery of the slider on the elastic body. A rotary electronic component in which the electrical function unit has a waterproof structure by being in contact with the rotary electronic component. 2. A case is formed around the substrate so as to be integral with the substrate, and the case is provided with a storage portion for rotatably storing the rotor. The rotary electronic component as described. 3. A board with a case, wherein a case is formed around the hard board including a portion to which the terminal board is connected, with the terminal board connected to a terminal pattern formed on the surface of the hard board. 4. A substrate having a conductive pattern formed on its surface is sandwiched by a mold, and a conductive pattern facing surface provided on the mold is provided around the conductive pattern facing surface in a state facing the conductive pattern forming surface of the substrate. A method for manufacturing a substrate with a case, in which a molten mold resin is press-fitted into a cavity formed and a mold is removed after cooling to form a case around the substrate in a state in which the conductive pattern is exposed, comprising: A method for manufacturing a substrate with a case, characterized in that a substrate is sandwiched by a mold in a state where an elastic body is placed on a portion surrounding the periphery of the case, and a case is formed in a state where the mold and the elastic body are in contact with each other.