JPH05245853A - Production of optical module - Google Patents

Abstract

PURPOSE:To support an optical sub-mount so as not to shift and move the same even by the injection pressure of a resin material when an optical module is produced by the molding of a resin. CONSTITUTION:The support pin 21 provided on a lead frame 21 is inserted in the ferrule inserting hole 12c of an optical sub-mount 12 and the tips of a pair of the projection 21d provided on the lead frame 21 are engaged with the recessed parts 12d provided on both side surfaces of the optical sub-mount 12. The lead frame 21 having the optical sub-mount 12 mounted thereon is attached to a mold and a resin material is injected in the cavity of the mold and the optical sub-mount 12, an electronic circuit part 13 and the lead frame 21 are unified to form a package part wherein the optical sub-mount 12 is exposed on one end side thereof. Since the projections 21d are engaged with both side surfaces of the optical sub-mounts in this resin molding, the optical sub-mount 12 is not shifted and moved within the mold by the injection of the resin material and, therefore, it is prevented that a pin 12b comes into contact with the island 21a of the lead frame 21 to cause a short-circuit.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an optical module manufacturing method in which a lead frame having an optical submount is mounted on a mold.

[0002]

2. Description of the Related Art As an optical module, for example, there is an optical transmission / reception integrated data ring as shown in FIG. In the data link shown in the figure, optical submounts 2 and 3 are coupled to a package 1 made of ceramic or metal, and pins 2a and 3a of each optical submount 2 and 3 are built in the package 1. The optical transmission circuit 4 and the optical reception circuit 5 are connected by a metal wire 6. Further, the optical submounts 2 and 3 have connectors 7 and 8 of optical fibers 9 and 10, respectively.
Is detachably connected.

An optical module of the type in which a transmission / reception circuit and an optical submount are resin-molded in place of the package 1 made of ceramic or metal is known.
In this resin-molded optical module, an optical submount and a transmission / reception circuit are attached to a lead frame, the lead frame is mounted in a mold, and molded with resin.

Explaining with reference to FIG. 4 and subsequent figures, the lead frame 11 is composed of an island 11a and a lead pin 11b, and the optical submount 12 is attached to the opposite side of the lead pin 11b with the island 11a interposed therebetween. A light actuating element 12a such as a light emitting element or a light receiving element is fixed to the island 11a side of the optical submount 12, and a plurality of pins 12b are provided at the other end portion of the unland 11
It extends to the a side.

On the other hand, an electronic circuit component 13 is mounted on the unland 11a via a ceramic substrate or the like, and a transmitting circuit and a receiving circuit are formed. Optical submount 1
An insertion hole 12c into which a ferrule (not shown) of the optical connector is inserted is formed at one end of the insertion hole 12c.
A support pin 11 formed integrally with the lead frame 11
c is inserted. The pin 12b of the optical submount 12 is connected to the electronic circuit component 13 described above via the wire 14.

The lead frame 11 to which the above-mentioned optical submount 12 is attached is placed on the lower mold 15 and the lower mold 1
An upper die (not shown) forming a pair with 5 is combined with a lower die 15 to be fixed in the die. Next, a resin material is injected into the cavity 15a, and the lead frame 1
1, a package portion integrally holding the optical submount 12 and the electronic circuit component 13 is formed.

[0007]

By the way, the above-mentioned optical submount 12 is movably supported by the lead frame 11 via the support pins 11c, and therefore, when the resin material is injected into the cavity 15a, The optical submount 12 is displaced by the material injection pressure as shown in FIG.
There is a problem that the pin 12b comes into contact with the island 11a of the lead frame 11 to cause a short circuit.

Therefore, an object of the present invention is to provide a method of manufacturing an optical module in which pins of an optical connector are prevented from coming into contact with islands of a lead frame due to injection stress of a resin material during molding.

[0009]

In order to solve the above problems, the present invention provides a method for manufacturing an optical module, in which a lead frame having an optical submount is attached to a mold to manufacture an optical module. The optical submount is attached to the lead frame so that the optical submount does not move by using the locking means provided in the step, the step of positioning the lead claim in the die, and the step of placing the resin material in the die. The step of electrically insulating the optical submount and the lead frame by injecting them so that the optical submount and the lead frame are partially left, and integrally molding the resin, and the step of cutting unnecessary portions of the lead frame. It is configured to include and.

[0010]

According to the method of manufacturing the optical module of the present invention, the movement of the optical submount is restricted by the engaging means provided on the lead frame, and the optical submount is not displaced even by the injection stress of the resin material.

[0011]

An embodiment of the present invention will be described below with reference to the accompanying drawings. In the description, the same elements as those of the conventional example will be described using the same reference numerals. FIG. 1 is a plan view showing a lead frame and an optical submount that can be used in a method for manufacturing an optical module according to an embodiment, and FIG. 2 is an explanatory view of a molded optical module and an optical connector.

The lead frame 21 comprises an island 21a and lead pins 21b, and is used for the optical submount 1
2 is attached to the opposite side of the lead pin 21b with the island 21a interposed therebetween. Electronic circuit components (not shown) are mounted on the island 21a via a ceramic substrate or the like, and electronic circuits such as a transmitting circuit and a receiving circuit are formed on the island 21a. An insertion hole 12c into which the ferrule 22a of the optical connector 22 is inserted is formed at one end of the optical submount 12, and the insertion hole 12c is formed.
The support pin 21c of the lead frame 21 is inserted in the. Further, a light actuating element 12a such as a light emitting element or a light receiving element is fixed to the island 21a side of the optical submount 12, and a plurality of pins 12b extend to the island 21a side at the other end. Furthermore, the lead frame 21
Are provided with a pair of protrusions 21d facing each other, and the tip ends of the protrusions 21d engage with both sides of the optical submount 12. Specifically, a concave portion 12d is formed at a position symmetrical to the outer periphery of the optical submount 12, and the tip of the protrusion 21d is inserted into the concave portion 12d so that the optical submount 1
The movement of 2 is regulated. In addition to the illustration, the protrusion 21
It is also possible to bend the tip of d into an arc shape and press the outer circumference of the optical submount 12 with this arc shape. Therefore, the movement of the optical submount 12 with the support portion by the support pin 21c as a fulcrum is restricted.

Next, an example of a method of manufacturing an optical module with a mold using the above-mentioned lead frame 21 will be described. First, the electronic circuit component 13 is mounted on the island 21a of the lead frame 21 via the ceramic substrate.
Subsequently, the optical submount 12 is attached to the lead frame 21, and the wire 14 connects the electronic circuit component 13 to the pin 12b of the optical submount 12 and the lead pin 21b.

After that, the lead frame 21 to which the optical submount 12 is attached is placed on the lower mold, and the upper mold is assembled. Furthermore, inject the resin material into the cavity of the mold,
The optical submount 12 and the lead frame 21 are electrically insulated, and the optical submount 12, the electronic circuit component 13, and the lead frame 21 are integrated. Specifically, a package portion is formed in which a part (outer lead) of the lead pin 21b on the lead frame side and one end side of the optical submount 12 are exposed. In this resin molding, since both sides of the optical submount 12 are locked by the protruding pieces 21d, the optical submount 12 is not displaced in the mold due to the injection of the resin material. Finally, unnecessary portions (tie bars, support portions, etc.) of the lead frame 21 are cut from the package portion with a comb-shaped blade, and the optical module 23 molded with the resin 23a shown in FIG. 2 is completed.

As described above, according to the method of manufacturing the optical module of the present embodiment, the optical submount 12 is locked by the protrusion 21d so as not to move in the mold, so that the injection pressure of the resin material causes the optical submount 12 to move. Optical submount 1
2 does not move and the pin 12b does not contact the island 21a of the lead frame 21.

The present invention is not limited to the above embodiment. For example, as the engaging means of the optical submount 12, a protrusion 21d protruding in a rectangular shape from the lead frame 21 is used.
However, the shape is not limited to a rectangle, as long as it has a function of preventing the displacement movement of the optical submount 12. Alternatively, the projections 21d may be curved at their tips to be applied to the outer circumference of the optical submount 12.

[0017]

As described above, according to the present invention, in resin molding of an optical module, the optical module is supported so as not to move to the lead frame, and the pins of the optical module contact the island of the lead frame. Without it, it is possible to manufacture an optical module having excellent performance.

[Brief description of drawings]

FIG. 1 is a plan view of a lead frame and an optical submount used for implementing the present invention.

FIG. 2 is an explanatory diagram showing an optical module and an optical connector.

FIG. 3 is a perspective view of an optical transmission / reception integrated data link as a specific example of an optical module.

FIG. 4 is a perspective view of a conventional lead frame and lower die supporting an optical submount.

5 is a plan view showing a state where the optical submount of FIG. 4 is displaced.

[Explanation of symbols]

12 ... Optical submount, 12b ... Pin, 21 ... Lead frame, 21c ... Support pin, 21d ... Protrusion.

Claims (2)

[Claims] 1. An optical module manufacturing method for manufacturing an optical module by mounting a lead frame having an optical submount mounted on a mold, wherein the optical submount does not move by using a locking means provided on the lead frame. As described above, a step of attaching the optical submount to the lead frame, a step of positioning the lead frame in a mold, and a step of injecting a resin material into the mold are performed to remove one of the optical submount and the lead frame. Of an optical module including a step of electrically insulating and integrally molding the optical submount and the lead frame in a state where parts are left, and a step of cutting an unnecessary portion of the lead frame. Production method. 2. The locking means is composed of projections integrally formed so as to face the lead frame, and the projections are engaged with both sides of the optical submount. Optical module manufacturing method.