KR100992953B1 - Fabricating method of connection pin block for intelligent power module - Google Patents
Fabricating method of connection pin block for intelligent power module Download PDFInfo
- Publication number
- KR100992953B1 KR100992953B1 KR20030055970A KR20030055970A KR100992953B1 KR 100992953 B1 KR100992953 B1 KR 100992953B1 KR 20030055970 A KR20030055970 A KR 20030055970A KR 20030055970 A KR20030055970 A KR 20030055970A KR 100992953 B1 KR100992953 B1 KR 100992953B1
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- South Korea
- Prior art keywords
- connection pin
- connecting pin
- assembly
- frame
- connection
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Abstract
Disclosed is a method of manufacturing a connection pin block for an intelligent power module, which is an assembly of a connection pin and a connection pin in which a signal is input and output. The manufacturing method comprises the steps of manufacturing a connecting pin assembly of the reel-shaped brass pin assembly, forming a notch in a predetermined portion of the connecting pin assembly of the connecting pin assembly, plating the connecting pin assembly, the connecting pin assembly Bending a connecting pin of the connecting pin assembly to arrange the mold in the mold, thereby forming a part of the connecting pin formed by injection molding the connecting pin assembly and the frame integrally with the outside of the frame; Cutting the notch portion of the connection pin of the connection pin assembly integrally formed in the frame so that the plating portion is present at one end of the frame to form a connection pin block in which the connection pin and the frame are integrated. In the method of manufacturing the intelligent power module connecting pin block, the plating part is formed at the end of the connecting pin to which the terminal is soldered, so that the connecting pin and the terminal are easily and firmly soldered together.
Description
1 is a view showing a manufacturing method of a connection pin block for a conventional intelligent power module.
2 is a perspective view of an intelligent power module according to an embodiment of the present invention.
Figure 3 shows a method of manufacturing a connection pin block for an intelligent power module according to an embodiment of the present invention.
Explanation of symbols on the main parts of the drawings
110: circuit board 120: heat sink
130: connecting pin block 131: frame
135: connecting pin
The present invention relates to a method of manufacturing a connection pin block for an intelligent power module, which is an assembly of a connection pin and a connection pin in which a signal is input and output.
Intelligent Power Module (hereinafter referred to as "IPM") refers to components including power switching elements such as power transistors and power FETs, protection circuits and driving circuits that protect and drive the switching elements in one package. Say. These intelligent power modules play a key role in power supply and are used in motors, PDPs, and computers.
The IPM has a heat sink, a circuit board in contact with one surface of the heat sink, and a connecting pin block integrally coupled to the circuit board and the heat sink while surrounding the circuit board. The connection pin block has a connection pin for inputting and outputting a signal and a frame into which the connection pin is press-fitted. A manufacturing method of the conventional connection pin block will be described with reference to FIG. 1.
1 is a view showing a manufacturing method of a connection pin block for a conventional intelligent power module.
As shown in step S11, the connecting
However, since the connecting pin of the conventional intelligent power module connecting pin block is made of brass, it is difficult to solder with the terminals of the circuit board. As a result, the connecting
The present invention has been made to solve the problems of the prior art as described above, an object of the present invention is to form a plated portion on the surface of the connection pin of brass to be soldered to solder the terminal of the circuit board to the connection pin firmly. The present invention provides a method of manufacturing a connection pin block for an intelligent power module.
Method of manufacturing a connection pin block for an intelligent power module according to the present invention for achieving the above object, the step of manufacturing a connection pin assembly of the reel type brass connecting pin; Forming a notch at a predetermined portion of the connection pin of the connection pin assembly; Plating the connection pin assembly; Bending the connection pins of the connection pin assembly; Arranging the connection pin assembly in a mold and integrally injection molding the connection pin assembly and the frame such that a portion of the connection pin where the notch is formed is positioned outside the frame; Cutting the notch portion of the connection pin of the connection pin assembly integrally formed in the frame such that a plating part is present at one end of the connection pin to form a connection pin block in which the connection pin and the frame are integrated. .
Hereinafter, a method of manufacturing a connection pin block for an intelligent power module according to an embodiment of the present invention will be described in detail with reference to the accompanying drawings.
2 is a perspective view of an intelligent power module according to an embodiment of the present invention.
As shown, the intelligent power module (hereinafter referred to as "IPM") 100 is a circuit in which an
The
In order to firmly solder the
2 and 3 will be described a method of manufacturing a connection pin block for an intelligent power module according to an embodiment of the present invention. 3 is a view showing a method of manufacturing a connection pin block for an intelligent power module according to an embodiment of the present invention.
As shown in step S110, the connecting
In step S130, the
Thereafter, the soldering surface side of the connecting
As described in detail above, in the method for manufacturing the intelligent power module connecting pin block according to the present invention, since the plated portion is formed at the end of the connecting pin to which the terminal is soldered, the connecting pin and the terminal are easily and firmly soldered to each other.
While the present invention has been described in connection with what is presently considered to be practical exemplary embodiments, it is to be understood that the invention is not limited to the disclosed embodiments, but, on the contrary, is intended to cover various modifications and equivalent arrangements included within the spirit and scope of the appended claims. Of course.
Claims (1)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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KR20030055970A KR100992953B1 (en) | 2003-08-13 | 2003-08-13 | Fabricating method of connection pin block for intelligent power module |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR20030055970A KR100992953B1 (en) | 2003-08-13 | 2003-08-13 | Fabricating method of connection pin block for intelligent power module |
Publications (2)
Publication Number | Publication Date |
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KR20050017340A KR20050017340A (en) | 2005-02-22 |
KR100992953B1 true KR100992953B1 (en) | 2010-11-09 |
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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KR20030055970A KR100992953B1 (en) | 2003-08-13 | 2003-08-13 | Fabricating method of connection pin block for intelligent power module |
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KR (1) | KR100992953B1 (en) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR102514340B1 (en) * | 2015-02-16 | 2023-03-27 | 주식회사 솔루엠 | Housing for power module package and a method thereof |
KR102185064B1 (en) * | 2015-06-17 | 2020-12-01 | 삼성전기주식회사 | Power module and manufacturing method thereof |
CN113458280B (en) * | 2021-06-17 | 2022-08-23 | 江苏大学 | Device is surely rolled over to axial components and parts pin in batches based on vision |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH1116937A (en) | 1997-06-24 | 1999-01-22 | Hitachi Ltd | Terminal structure of power semiconductor module |
JP2005123328A (en) | 2003-10-15 | 2005-05-12 | Denso Corp | Semiconductor device |
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2003
- 2003-08-13 KR KR20030055970A patent/KR100992953B1/en active IP Right Grant
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH1116937A (en) | 1997-06-24 | 1999-01-22 | Hitachi Ltd | Terminal structure of power semiconductor module |
JP2005123328A (en) | 2003-10-15 | 2005-05-12 | Denso Corp | Semiconductor device |
Also Published As
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KR20050017340A (en) | 2005-02-22 |
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