CN220731715U - Battery and electronic equipment - Google Patents

Abstract

The utility model provides a battery and electronic equipment, and relates to the technical field of batteries. The battery comprises a battery core and a battery protection board, wherein the battery protection board comprises a printed circuit board, a flexible circuit board and a plurality of first electronic devices, the battery protection board comprises the printed circuit board and the flexible circuit board, the printed circuit board is connected with the flexible circuit board, the printed circuit board comprises a first surface and a second surface which are opposite to each other in a first direction, the first surface faces the battery core, the second surface comprises a first forbidden coverage area and a mounting area, the first forbidden coverage area is positioned at the end part of the second surface, and the plurality of first electronic devices are arranged in the mounting area; the first end of the flexible circuit board is connected with the first surface, and the flexible circuit board is bent, so that the second end of the flexible circuit board extends to the first forbidden region. The battery provided by the utility model can solve the problem that the occupied space of the battery core in the conventional battery is reduced, so that the capacity density of the battery is influenced.

Description

Battery and electronic equipment

Technical Field

The present disclosure relates to battery technologies, and in particular, to a battery and an electronic device.

Background

With the advent of the 5G era, the display size of the mobile phone is increased, the mobile phone is photographed with high definition by a plurality of cameras, 4K/8K high definition video is played, the multi-communication frequency band is compatible, high-speed communication and operation and other hardware and functions are promoted again, and higher requirements are put forward on the cruising ability of the battery in the mobile phone.

In the existing battery, a battery protection plate is disposed at an end of a battery cell, the battery protection plate includes a printed circuit board and a flexible circuit board connected to each other, an injection molding member coats the printed circuit board, and the injection molding member is connected with the end of the battery cell. One end of the injection molding piece far away from the battery cell is provided with a fixing plane, and a part of the flexible circuit board extends to one side of the fixing plane far away from the battery cell.

However, the flexible circuit board is located outside the entire injection molded part, and the flexible circuit board requires additional space, which reduces the space occupied by the battery cells in the limited space, thereby affecting the capacity density of the battery.

Disclosure of Invention

In view of this, the present application provides a battery and an electronic device, so as to solve the problem that the space occupied by the battery core in the existing battery is reduced, and thus the capacity density of the battery is affected.

According to an aspect of the present application, there is provided a battery including a battery cell and a battery protection board including a printed circuit board, a flexible circuit board, and a plurality of first electronic devices, the printed circuit board being connected to the flexible circuit board, the printed circuit board including a first surface and a second surface opposite to each other in a first direction, the first surface facing the battery cell, the second surface including a first distribution inhibition area and a mounting area, the first distribution inhibition area being provided at an end of the printed circuit board, the plurality of first electronic devices being provided at the mounting area;

the first end of the flexible circuit board is connected with the first surface, and the flexible circuit board is bent, so that the second end of the flexible circuit board extends to the first forbidden region.

Preferably, the battery protection plate further includes a second electronic device, the thickness of the first electronic device is smaller than a predetermined value, the thickness of the second electronic device is greater than or equal to the predetermined value, and the second electronic device is disposed on the first surface.

Preferably, the battery further comprises an injection molding piece, the injection molding piece is connected with the battery cell, the injection molding piece is coated with the battery protection board, the flexible circuit board extends out of the injection molding piece, a concave part is formed in a part of the injection molding piece corresponding to the first forbidden cloth area, and a part of the flexible circuit board is located in the concave part.

Preferably, the number of the first forbidden regions is two, and the two first forbidden regions are respectively positioned at two ends of the mounting region in a second direction, and the second direction intersects with the first direction;

the number of the flexible circuit boards is two, the two flexible circuit boards are respectively connected with two ends of the first surface, and the flexible circuit boards extend to the first forbidden coverage area which is positioned at the same end with the flexible circuit boards.

Preferably, the thickness of the first electronic device is smaller than or equal to the distance between the end surface of the flexible circuit board facing away from the first surface and the first surface;

the thickness of the second electronic device is smaller than the thickness of a portion of the injection-molded piece corresponding to the mounting region.

Preferably, the printed circuit board further comprises a second cloth forbidden region, and the second cloth forbidden region is arranged on the mounting region;

the injection molding part is provided with a plurality of first limiting holes, orthographic projections of the first limiting holes on the second surface are located in the first cloth forbidden area or the second cloth forbidden area, one of the first limiting holes and other first limiting holes are located at different positions in a third direction, and the third direction is intersected with the first direction and the second direction.

Preferably, the printed circuit board further comprises a third forbidden coverage area, and the third forbidden coverage area is positioned on the first surface;

the injection molding piece is provided with a second limiting hole and a third limiting hole, the second limiting hole and the third limiting hole extend from two ends of the injection molding piece in the third direction to the inside of the injection molding piece respectively, and orthographic projections of the second limiting hole and the third limiting hole on the first surface are located in the third cloth forbidden area.

Preferably, the depth of the second limiting hole is 0.3mm-1mm, and the distance between the second limiting hole and any one of the second electronic devices in the third direction is greater than or equal to 0.4mm;

the depth of the third limiting hole is 0.3mm-1mm, and the distance between the third limiting hole and any one of the second electronic devices in the third direction is greater than or equal to 0.4mm.

Preferably, the printed circuit board further comprises a fourth cloth forbidden region, and the fourth cloth forbidden region is arranged on the mounting region;

the injection molding piece comprises a notch, the orthographic projection of the notch on the first surface is positioned in the fourth forbidden region, and the distance between the edge of the notch and any one of the first electronic devices in the second direction is greater than or equal to 0.5mm.

According to another aspect of the present application, an electronic device is provided, where the electronic device includes the battery described above, and the technical effects of the battery are the same as those of the battery, and are not described herein.

In the battery of this application, flexible circuit board first end is connected with the first surface towards the electric core, and flexible circuit board is buckled for on flexible circuit board's the second end extends to the first forbidden area on the second surface, electronic device sets up on the installation region, this makes flexible circuit board that is located on the first forbidden area occupy the same space in the third direction with the first electronic device that sets up on the installation region, and flexible circuit board need not to occupy extra space, can promote the size of electric core in limited space, and then promotes the capacity density of battery.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings that are needed in the embodiments will be briefly described below, it being understood that the following drawings only illustrate some embodiments of the present application and therefore should not be considered limiting the scope, and that other related drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.

Fig. 1 is a schematic view showing a structure of a battery according to an embodiment of the present utility model at a view angle;

FIG. 2 is a schematic plan view of a printed circuit board from a view angle;

FIG. 3 shows a schematic plan view of a printed circuit board from another perspective;

fig. 4 is a schematic view showing the structure of a battery according to another embodiment of the present utility model;

fig. 5 is a schematic view showing a partial structure of a battery according to an embodiment of the present utility model;

fig. 6 is a sectional view showing a part of the structure of a battery according to an embodiment of the present utility model;

FIG. 7 shows a cross-sectional view of the location of the notch;

fig. 8 shows a cross-sectional view of the location of the second and third limiting holes.

Icon: 1-an electric core; 2-a battery protection plate; 21-a printed circuit board; 211-a first forbidden region; 212-a second keep-out area; 213-a third keep-out area; 214-a fourth keep-out area; 215-mounting area; 216-nickel pad; 217-flexible circuit board pads; 22-flexible circuit board; 23-a first electronic device; 24-a second electronic device; 3-injection molding; 31-a recess; 32-a cutout; 33-a first limiting hole; 34-a second limiting hole; 35-a third limiting hole; l1-a first direction; l2-a second direction; l3-third direction.

Detailed Description

The following detailed description is provided to assist the reader in obtaining a thorough understanding of the methods, apparatus, and/or systems described herein. However, various changes, modifications, and equivalents of the methods, apparatuses, and/or systems described herein will be apparent after an understanding of the present disclosure. For example, the order of operations described herein is merely an example, and is not limited to the order set forth herein, but rather, obvious variations may be made upon an understanding of the present disclosure, other than operations that must occur in a specific order. In addition, descriptions of features known in the art may be omitted for the sake of clarity and conciseness.

The features described herein may be embodied in different forms and should not be construed as limited to the examples described herein. Rather, the examples described herein have been provided solely to illustrate some of the many possible ways of implementing the methods, devices, and/or systems described herein that will be apparent after a review of the disclosure of the present application.

In the entire specification, when an element (such as a layer, region or substrate) is described as being "on", "connected to", "bonded to", "over" or "covering" another element, it may be directly "on", "connected to", "bonded to", "over" or "covering" another element or there may be one or more other elements interposed therebetween. In contrast, when an element is referred to as being "directly on," directly connected to, "or" directly coupled to, "another element, directly on," or "directly covering" the other element, there may be no other element intervening therebetween.

As used herein, the term "and/or" includes any one of the listed items of interest and any combination of any two or more.

Although terms such as "first," "second," and "third" may be used herein to describe various elements, components, regions, layers or sections, these elements, components, regions, layers or sections should not be limited by these terms. Rather, these terms are only used to distinguish one element, component, region, layer or section from another element, component, region, layer or section. Thus, a first member, component, region, layer or section discussed in examples described herein could also be termed a second member, component, region, layer or section without departing from the teachings of the examples.

For ease of description, spatially relative terms such as "above … …," "upper," "below … …," and "lower" may be used herein to describe one element's relationship to another element as illustrated in the figures. Such spatially relative terms are intended to encompass different orientations of the device in use or operation in addition to the orientation depicted in the figures. For example, if the device in the figures is turned over, elements described as "above" or "upper" relative to another element would then be oriented "below" or "lower" relative to the other element. Thus, the term "above … …" includes both orientations "above … …" and "below … …" depending on the spatial orientation of the device. The device may also be otherwise positioned (e.g., rotated 90 degrees or at other orientations) and the spatially relative descriptors used herein interpreted accordingly.

The terminology used herein is for the purpose of describing various examples only and is not intended to be limiting of the disclosure. Singular forms also are intended to include plural forms unless the context clearly indicates otherwise. The terms "comprises," "comprising," and "having" are intended to specify the presence of stated features, integers, operations, elements, and/or groups thereof, but do not preclude the presence or addition of one or more other features, integers, operations, elements, and/or groups thereof.

Variations from the shapes of the illustrations as a result, of manufacturing techniques and/or tolerances, are to be expected. Accordingly, the examples described herein are not limited to the particular shapes shown in the drawings, but include changes in shapes that occur during manufacture.

The features of the examples described herein may be combined in various ways that will be apparent after an understanding of the disclosure of the present application. Further, while the examples described herein have a variety of configurations, other configurations are possible as will be apparent after an understanding of the present disclosure.

As shown in fig. 1, 5 and 6, the battery includes a battery cell 1 and a battery protection board 2, the battery protection board 2 includes a printed circuit board 21, a flexible circuit board 22 and a plurality of first electronic devices 23, the printed circuit board 21 is connected with the flexible circuit board 22, the printed circuit board 21 includes a first surface and a second surface opposite to each other in a first direction L1, the first surface faces the battery cell 1, the second surface includes a first forbidden region 211 and a mounting region 215, the first forbidden region 211 is located at an end of the printed circuit board in the second direction L2, and the plurality of first electronic devices 23 are disposed in the mounting region 215; the first end of the flexible circuit board 22 is connected to the first surface, and the flexible circuit board 22 is bent such that the second end of the flexible circuit board 22 extends to the first forbidden coverage area 211.

In the battery of this application, flexible circuit board 22 first end is connected towards the first surface of electric core 1 with printed circuit board 21, and flexible circuit board 22 is buckled for flexible circuit board 22's second end extends to on the first forbidden region 211 on the second surface, and the electronic component sets up on installation region 215, and this makes flexible circuit board 22 that is located on first forbidden region 211 occupy the same space in the third direction L3 with the first electronic component 23 that sets up on installation region 215, and flexible circuit board 22 need not to occupy extra space, can promote the size of electric core 1 in limited space, and then promotes the capacity density of battery.

Alternatively, the printed circuit board is a 2-10 layer printed circuit board with a thickness of 0.4-1.2 mm.

Further, a connector is arranged on the flexible circuit board 22, the connector is attached to the flexible circuit board in an SMT (Surface Mounted Technology surface mount technology) mode, the battery protection board 2 can be fixed on the battery cell 1 in a laser welding mode, the battery protection board 2 is located at the top of the battery cell 1, and insulating gummed paper is arranged between the battery protection board 2 and the top seal of the battery cell 1, so that short circuit of the battery is avoided.

In the embodiment of the application, as shown in fig. 2, the number of the first forbidden regions 211 is two, the two first forbidden regions 211 are respectively located at two ends of the first surface in the second direction L2, the second forbidden regions 212 and the fourth forbidden regions 214 which are arranged at intervals along the second direction L2 are arranged on the mounting region 215, and the first electronic device 23 is not arranged on the first forbidden region 211, the second forbidden regions 212 and the fourth forbidden regions 214. When the low-pressure injection molding is performed, the first positioning columns in the injection mold respectively correspond to the first forbidden cloth region 211 and the second forbidden cloth region 212, and the first electronic device 23 is not arranged on the first forbidden cloth region 211 and the second forbidden cloth region 212, so that the occupied space when the low-pressure injection molding is performed can be reduced. In addition, in the process of low pressure injection molding, the injection molding glue inlet is formed in the position corresponding to the fourth forbidden region 214, and the first electronic device 23 is not arranged in the fourth forbidden region 214, so that the stress damage of the electronic device caused by the injection molding pressure and the injection molding temperature in the injection molding process can be avoided. Other positions on the mounting area 215 are provided with pads for soldering the first electronic device 23, on which the first electronic device 23 is soldered, that is, the middle portion of the printed circuit board 21 protrudes with respect to both ends of the printed circuit board 21.

In fig. 1 to 8, an example of a first direction L1, a second direction L2, and a third direction L3 is shown, wherein the first direction L1 and the second direction L2 intersect, and the third direction L3 intersects the first direction L1 and the second direction L2. Preferably, the first direction L1 is a length direction of the battery cell 1, the second direction L2 is a width direction of the battery cell 1, and the third direction L3 is a thickness direction of the battery cell 1, and at this time, the first direction L1, the second direction L2 and the third direction L3 are perpendicular to each other.

Further, as shown in fig. 3, the second surface has flexible circuit board pads 217 at both ends, and the flexible circuit board pads 217 are used for soldering with the flexible circuit board 22 to realize connection of the printed circuit board 21 and the flexible circuit board 22. The second surface is provided with a nickel tab pad 216 in the middle, the nickel tab pad 216 being for soldering with a nickel tab. The second surface is provided with a third forbidden region 213, a pad for soldering the second electronic device 24 is arranged on a part of the second surface except the third forbidden region 213, the second electronic device 24 is soldered on the pad, no pad is arranged on the third forbidden region 213, i.e. no second electronic device 24 is arranged on the third forbidden region 213. In the low-pressure injection molding process, the third forbidden coverage areas 213 on two sides respectively correspond to the second positioning columns and the third positioning columns in the injection mold, and the second electronic device 24 is not arranged on the third forbidden coverage areas 213, so that the occupied space in the low-pressure injection molding process can be reduced.

Alternatively, two third forbidden regions 213 opposite to each other in the third direction L3 are defined as one group, the number of the third forbidden regions 213 is one or more groups, and when the number of the third forbidden regions 213 is more groups, the plurality of third forbidden regions 213 are arranged at intervals along the second direction L2.

Further, the thickness of the first electronic device 23 is smaller than a predetermined value, and the thickness of the second electronic device 24 is larger than or equal to the predetermined value. By soldering the electronic device having a larger thickness and the flexible circuit board 22 on the same side of the printed circuit board 21, the electronic device having a larger thickness and the flexible circuit board 22 occupy the same space in the third direction L3, the size of the battery cell 1 in the first direction L1 can be further reduced.

Preferably, electronic devices in which the predetermined value is 0.5mm, i.e. the thickness is greater than or equal to 0.2mm and less than 0.5mm, are provided on the first surface, and electronic devices in which the thickness is greater than or equal to 0.5mm and less than or equal to 1mm are provided on the second surface.

In addition, the first electronic device 23, the second electronic device 24 and the nickel sheet can be attached to the corresponding bonding pads in an SMT manner, and after the electronic device is divided into the first electronic device 23 and the second electronic device 24, the first electronic device and the second electronic device are respectively arranged on the first surface and the second surface, and compared with the electronic device arranged on the same side, the width of the printed circuit board 21 can be reduced.

In the embodiment of the application, as shown in fig. 1 and 5, the battery further includes an injection molding member 3, the injection molding member 3 is connected with the battery core 1, the injection molding member 3 encapsulates the battery protection board 2, the flexible circuit board 22 extends from the injection molding member 3, a recess 31 is formed at a portion of the injection molding member 3 corresponding to the first forbidden coverage area 211, and a portion of the flexible circuit board 22 is located in the recess 31. By utilizing the height difference formed between the electronic device and the first forbidden coverage area 211 to manufacture an active space for the flexible circuit board 22, the waste of battery space caused by separately reserving space for the flexible circuit board 22 is reduced, and the capacity density of the battery is improved.

Preferably, the distance between the end surface of the injection molding 3 facing away from the battery cell 1 and the end surface of the second electronic device 24 having the greatest thickness facing away from the battery cell is greater than or equal to 0.4mm, that is, the distance between the upper end surface of the injection molding 3 and the upper end surface of the second electronic device 24 having the greatest thickness is greater than or equal to 0.4mm in the view of fig. 5, so that external impact on the second electronic device 24 can be avoided.

In the embodiment of the present application, the thickness of the first electronic device 23 is smaller than or equal to the distance between the end surface of the flexible circuit board 22 facing away from the first surface and the first surface; the thickness of the second electronic device 24 is smaller than the thickness of the portion of the injection molding 3 corresponding to the mounting region 215, and the size of the entirety of the injection molding 3 and the battery protection plate 2 in the first direction L1 can be further reduced.

Further, the number of the first forbidden coverage areas 211 is two, the two first forbidden coverage areas 211 are respectively located at two ends of the mounting area 215 in the second direction L2, so that the two ends of the injection molding part in the second direction L2 are both formed with the concave parts 31, and the flexible circuit board 22 extends to the first forbidden coverage area 211 located at the same end with the flexible circuit board 22. Therefore, the parts of the two flexible circuit boards 22 extending from the injection molding piece 3 can be respectively arranged in the two concave parts 31, the flexible circuit boards 22 cannot protrude relative to the end face of the injection molding piece 3, which is far away from the battery cell 1, the flexible circuit boards 22 cannot occupy extra space, the size of the battery cell 1 in the second direction L2 can be increased, and then the capacity density of the battery is increased.

In addition, the flexible circuit board 22 is welded on the first surface close to the battery core 1, after the flexible circuit board 22 is bent, the part of the flexible circuit board 22 is located in the concave part 31, the bending diameter of the flexible circuit board 22 is at least the thickness of the printed circuit board and the wall thickness of the injection molding part 3, the risks of film opening, copper layer breakage and the like of a covering film of the flexible circuit board 22 caused by the fact that the bending diameter of the flexible circuit board 22 is too small are avoided, and the service life of the battery protection board 2 is prolonged. Meanwhile, the flexible circuit board 22 is located in the recess 31, so that the length occupied by the injection molding 3 and the battery protection plate 2 as a whole in the first direction L1 can be reduced by 0.5mm or more.

In the embodiment of the present application, as shown in fig. 4, the injection molding piece 3 is provided with a plurality of first limiting holes 33, and orthographic projections of the first limiting holes 33 on the second surface are located in the first forbidden region 211 or the second forbidden region 212. When carrying out low pressure injection molding, injection mold includes a plurality of first reference columns, and first reference column is located one side of first surface, and a plurality of first reference columns correspond respectively with first forbidden region 211 and second forbidden region 212, do not set up first electronic device 23 on first forbidden region 211 and the second forbidden region 212, can reduce the space that occupies when low pressure injection molding. The support to battery protection board 2 can be realized through first reference column, connects hot melt adhesive, battery protection board 2 and electric core 1 as an organic whole through low pressure injection molding technology, and hot melt adhesive forms into injection molding 3, and wherein the position that corresponds with first reference column forms first spacing hole 33.

Further, as shown in fig. 4, the number of the first limiting holes 33 is greater than or equal to three, and one first limiting hole 33 of the plurality of first limiting holes 33 and the other first limiting holes 33 are located at different positions in the third direction L3, that is, the plurality of first limiting holes 33 are staggered. In the low-pressure injection molding process, the first positioning columns are positioned at different positions on the first surface, so that the inclination of the printed circuit board 21 caused by the hot melt adhesive in the low-pressure injection molding process can be avoided.

In the embodiment of the application, as shown in fig. 8, the injection molding piece 3 is further provided with a second limiting hole 34 and a third limiting hole 35, the second limiting hole 34 and the third limiting hole 35 extend from two ends of the injection molding piece 3 in a third direction L3 to the inside of the injection molding piece 3 respectively, orthographic projections of the second limiting hole 34 and the third limiting hole 35 on the first surface are located in the third forbidden coverage area 213, and the second limiting hole 34 and the third limiting hole 35 are located between the first surface and the battery cell 1.

When carrying out low pressure injection molding, injection mold includes second reference column and third reference column, before carrying out low pressure injection molding, second reference column and third reference column are located between first surface and the electric core 1, second reference column and third reference column extend along third direction L3, the position of second reference column and third reference column corresponds with a plurality of third forbidden cloth areas 213 respectively, do not set up first electronic device 23 on the third forbidden cloth area 213, can reduce the space that occupies in the low pressure injection molding process. After the low pressure injection molding is completed, the parts of the injection molding 3 corresponding to the second positioning and third positioning posts are formed into the second positioning post and the third positioning post, respectively. Through the second positioning column and the third positioning column, the situation that the printed circuit board 21 moves towards the battery core 1 to mount the battery core 1 due to injection molding pressure in the low-pressure injection molding process can be avoided. Meanwhile, the second positioning column and the third positioning column are located on different sides, so that the parallelism of the printed circuit board 21 can be guaranteed, and further the stress damage of the electronic device caused by bending deformation of the printed circuit board 21 is avoided.

Optionally, one second positioning column and one third positioning column form a set of positioning assemblies, the second positioning column and the third positioning column in one positioning assembly being opposite to each other in the third direction L3. The number of the positioning components can be multiple, and the positioning components are arranged at intervals along the second direction L2, and at this time, a plurality of second positioning holes and a plurality of third positioning holes are formed in the injection molding piece 3 at positions corresponding to the second positioning columns and the third positioning columns.

Preferably, the number of the positioning assemblies is two, and at this time, the injection molding piece 3 is provided with two second limiting holes 34 and two third limiting holes 35.

Preferably, the depth of the second limiting hole 34 is 0.3mm-1mm, and the distance between the second limiting hole 34 and any second electronic device 24 in the third direction L3 is greater than or equal to 0.4mm; the depth of the third limiting hole 35 is 0.3mm-1mm, and the distance between the third limiting hole 35 and any one of the second electronic devices 24 in the third direction L3 is greater than or equal to 0.4mm, so that the second electronic devices 24 can be prevented from being crushed by the second positioning column and the third positioning column.

Through setting up the first spacing hole 33, the spacing hole of second 34 and the spacing hole of third 35 that form in the injection molding process, can avoid the printed circuit board warp deformation that the pressure caused of moulding plastics in the low pressure injection molding process, and then avoid the electronic device stress damage that printed circuit board warp deformation leads to, promote battery protection shield 2 life.

Furthermore, as shown in fig. 7, the injection molding 3 includes a cutout 32, and an orthographic projection of the cutout 32 on the first surface is located in the fourth forbidden region 214. In the low-pressure injection molding process, an injection molding glue inlet is formed at a position corresponding to the fourth forbidden region 214, and the injection molding glue inlet is a glue reducing region.

Further, the distance between the edge of the cutout 32 and any one of the first electronic devices 23 in the second direction L2 is greater than or equal to 0.5mm, specifically, the distance A1 between the right edge of the cutout 32 and the adjacent first electronic device 23 in the second direction L2 is greater than or equal to 0.5mm, and the distance A2 between the left edge of the cutout 32 and the adjacent first electronic device 23 in the second direction L2 is greater than or equal to 0.5mm, under the view of fig. 7. The method can avoid the stress damage of the electronic device caused by injection molding pressure and injection molding temperature when the hot melt adhesive directly impacts the electronic device in the low-pressure injection molding process.

According to another aspect of the present application, there is provided an electronic device including the battery described above.

Finally, it should be noted that: the above embodiments are only for illustrating the technical solution of the present utility model, and not for limiting the same; although the utility model has been described in detail with reference to the foregoing embodiments, it will be understood by those of ordinary skill in the art that: the technical scheme described in the foregoing embodiments can be modified or some or all of the technical features thereof can be replaced by equivalents; such modifications and substitutions do not depart from the spirit of the utility model.

Claims (10)

1. The battery is characterized by comprising a battery core and a battery protection board, wherein the battery protection board comprises a printed circuit board, a flexible circuit board and a plurality of first electronic devices, the printed circuit board is connected with the flexible circuit board, the printed circuit board comprises a first surface and a second surface which are opposite to each other in a first direction, the first surface faces the battery core, the second surface comprises a first forbidden coverage area and a mounting area, the first forbidden coverage area is positioned at the end part of the printed circuit board, and the plurality of first electronic devices are arranged in the mounting area;

the first end of the flexible circuit board is connected with the first surface, and the flexible circuit board is bent, so that the second end of the flexible circuit board extends to the first forbidden region.

2. The battery of claim 1, wherein the battery protection plate further comprises a second electronic device, the first electronic device having a thickness less than a predetermined value, the second electronic device having a thickness greater than or equal to the predetermined value, the second electronic device being disposed on the first surface.

3. The battery of claim 2, further comprising an injection molding member, wherein the injection molding member is connected with the electric core, the injection molding member covers the battery protection plate, the flexible circuit board extends out of the injection molding member, a portion of the injection molding member corresponding to the first forbidden coverage area is formed with a concave portion, and a portion of the flexible circuit board is located in the concave portion.

4. The battery according to claim 3, wherein the number of the first prohibiting areas is two, and the two first prohibiting areas are respectively located at both ends of the mounting area in a second direction intersecting the first direction;

the number of the flexible circuit boards is two, the two flexible circuit boards are respectively connected with two ends of the first surface, and the flexible circuit boards extend to the first forbidden coverage area which is positioned at the same end with the flexible circuit boards.

5. The battery of claim 3, wherein a thickness of the first electronic device is less than or equal to a distance between an end surface of the flexible circuit board opposite the first surface and the first surface;

the thickness of the second electronic device is smaller than the thickness of a portion of the injection-molded piece corresponding to the mounting region.

6. The battery of claim 4, wherein the printed circuit board further comprises a second keep-out area disposed on the mounting area;

the injection molding part is provided with a plurality of first limiting holes, orthographic projections of the first limiting holes on the second surface are located in the first cloth forbidden area or the second cloth forbidden area, one of the first limiting holes and other first limiting holes are located at different positions in a third direction, and the third direction is intersected with the first direction and the second direction respectively.

7. The battery of claim 6, wherein the printed circuit board further comprises a third keep-out area, the third keep-out area being located on the first surface;

the injection molding piece is provided with a second limiting hole and a third limiting hole, the second limiting hole and the third limiting hole extend from two ends of the injection molding piece in the third direction to the inside of the injection molding piece respectively, and orthographic projections of the second limiting hole and the third limiting hole on the first surface are located in the third cloth forbidden area.

8. The battery according to claim 7, wherein a depth of the second stopper hole is 0.3mm to 1mm, and a distance between the second stopper hole and any one of the second electronic devices in the third direction is greater than or equal to 0.4mm;

the depth of the third limiting hole is 0.3mm-1mm, and the distance between the third limiting hole and any one of the second electronic devices in the third direction is greater than or equal to 0.4mm.

9. The battery of claim 4, wherein the printed circuit board further comprises a fourth keep-out area disposed on the mounting area;

the injection molding piece comprises a notch, the orthographic projection of the notch on the first surface is positioned in the fourth forbidden region, and the distance between the edge of the notch and any one of the first electronic devices in the second direction is greater than or equal to 0.5mm.

10. An electronic device, characterized in that it comprises a battery according to any one of claims 1-9.