WO2022083498A1 - Optical lens and assembly process therefor, camera module, and electronic device - Google Patents

Abstract

The present application provides an optical lens and an assembly process therefor, a camera module, and an electronic device, used for reducing the risk that the camera module is poor in dark shadow during imaging, and improving the imaging quality of the camera module. The optical lens comprises a housing, a motor, a lens assembly, and the first adsorption structure, wherein the housing comprises a base and a cover body fixed to one side of the base, a first light-transmitting hole is formed in the cover body, and a second light-transmitting hole opposite to the first light-transmitting hole is formed in the base; the motor is disposed in the housing and comprises a carrier and a driving assembly, a mounting hole is formed at the position of the carrier corresponding to the first light-transmitting hole, and the driving assembly is used for driving the carrier to move in the housing; the lens assembly is disposed in the mounting hole; and the first adsorption structure is disposed on the inner wall of the cover body and used for adsorbing dust falling in the housing.

Description

Optical lens and assembly process method thereof, camera module, and electronic equipment

CROSS-REFERENCE TO RELATED APPLICATIONS

This application claims the priority of the Chinese patent application filed on October 22, 2020, with the application number of 202011140727.1 and the application title of "An optical lens and its assembly process, camera module, and electronic equipment", which The entire contents of this application are incorporated by reference.

technical field

The present application relates to the technical field of electronic equipment, and in particular, to an optical lens and an assembly process method thereof, a camera module, and electronic equipment.

Background technique

In order to enhance the competitiveness of terminal equipment such as mobile phones and tablet computers, camera modules with integrated autofocus function have become the standard configuration of current terminal equipment. In order to realize the auto-focusing function, a motor for driving the lens to move is usually configured in the camera module. Since the motor needs to move in the casing of the camera module, there must be a gap between the carrier and the inner wall of the casing. One end of this gap is connected to the outside of the casing, and the other end leads to the imaging area on the light-emitting side of the lens. . During the assembly process of the camera module, on the one hand, since the internal workshop of the module factory is not absolutely dust-free, some micron-sized dust will inevitably float in the air in the workshop. The repeated use of the material box in which the module is placed will also cause various particles to fall. These dust fall on the imaging area of the camera module through the gap, resulting in the phenomenon of bad shadows during the imaging of the camera module.

SUMMARY OF THE INVENTION

The present application provides an optical lens and an assembling process method thereof, a camera module, and electronic equipment, which are used to reduce the risk of bad shadows produced by the camera module during imaging, and improve the imaging quality of the camera module.

In a first aspect, the present application provides an optical lens, which includes a housing, a motor, a lens assembly, and a first adsorption structure. The housing may include a cover body and a base, the cover body is arranged on one side of the base, and the cover body and the base are fixedly connected to form a space for accommodating the motor and the lens assembly; the cover body is provided with a first light-transmitting hole, and the base A second light-transmitting hole is opened, and the first light-transmitting hole is opposite to the second light-transmitting hole. The motor is arranged in the housing and includes a carrier and a drive assembly. The carrier is provided with a mounting hole, and the two ends of the mounting hole are respectively opposite to the first light-transmitting hole and the second light-transmitting hole; the driving component can be used to drive the carrier to move in the housing. . The lens assembly is arranged in the installation hole, and the lens assembly can move synchronously with the carrier when the carrier moves. The first adsorption structure is arranged on the inner wall of the cover body and can be used to adsorb the falling dust in the housing, and when the falling dust enters the housing through the first light-transmitting hole, the first adsorption structure can align the source of the moving path of the falling dust into the optical lens. It intercepts, so it can achieve a good dust capture effect, thereby reducing the risk of dust falling on the filter, which is beneficial to improve the imaging effect of the camera module.

In a specific embodiment, the first adsorption structure is an adhesive material with better adhesion performance. In this case, the first adsorption structure may be an adhesive layer adhered to the inner wall of the casing.

In a specific embodiment, the first adsorption structure may be formed by using glue, adhesive tape, or a viscous solvent.

When the first adsorption structure is made of glue, in order to achieve better dust sticking effect, the first adsorption structure can be formed by a glue dipping process, so that the first adsorption structure has a honeycomb surface structure.

In the above solution, the first adsorption structure may specifically be a UV-curable adhesive.

In another specific embodiment, the first adsorption structure can also be made of a material with electrostatic adsorption function. In this case, the second adsorption structure can be formed separately, and then fixed on the on the base. Alternatively, the second adsorption structure and the base can also be integrally formed through a dual-camera injection molding process.

In the above solution, the material of the first adsorption structure may specifically be a polyester material with relatively large surface static electricity.

When specifically disposing the cover, the cover may include a top plate and a side plate surrounding the peripheral side of the top plate; the first adsorption structure may include a first part disposed on the inner wall of the top plate and a second part disposed on the inner wall of the side plate, Wherein, the first part can cover the inner wall of the top plate, and the second part can cover the inner wall of the side plate. With this arrangement, the first part can fully cover the path formed by the gap between the top plate and the carrier, and the second part can fully cover the path formed by the gap between the side plate and the carrier, so that the first part can be increased. The adsorption area of an adsorption structure improves the interception effect on falling dust.

In a specific embodiment, the optical lens may further include a second adsorption structure, the second adsorption structure is disposed on the side of the base facing the cover, and the second adsorption structure may cover the side of the bottom plate facing the top plate. In this way, the second adsorption structure can fully cover the path formed by the gap between the bottom plate and the carrier, and can intercept the falling dust at the end of the moving path in the optical lens, thereby reducing the transmission of the falling dust by the second light transmission. Risk of hole falling.

Similarly, the second adsorption structure is made of glue. In order to achieve better dust sticking effect, the second adsorption structure can be formed by a glue dipping process, so that the second adsorption structure has a honeycomb surface structure.

In order to reduce the movement resistance of the carrier in the housing, the carrier and the inner wall of the housing may be spaced apart. The motor may further include an elastic member, and the elastic member can connect the carrier with the housing to support the carrier so that the carrier can be floated in the housing.

In a specific embodiment, the driving assembly includes a coil and a magnet, wherein the coil is disposed on the peripheral side surface of the carrier, the magnet is disposed on the inner wall of the housing, and the magnet is disposed opposite to the coil. In this way, when outputting a current signal to the coil, the coil can generate an ampere force in the direction of the first light-transmitting hole to the second light-transmitting hole or the second light-transmitting hole is pointing to the first light-transmitting hole, thereby driving the carrier and the carrier The lens assembly on the carrier moves.

In another specific embodiment, the driving assembly includes eight wires with retractable lengths, and the two ends of the eight wires are respectively connected with the carrier and the housing. At this time, the driving assembly can drive the carrier to move when the length of the wires is retracted.

In another specific embodiment, the motor may further include a guide rail, the guide rail is fixed in the housing, and the guide rail extends along the direction from the first light-transmitting hole to the second light-transmitting hole, and the carrier can be slidably assembled on the guide rail. In this way, the carrier can also be moved reliably within the housing.

In a second aspect, the present application further provides a camera module, the camera module includes the optical lens in any of the foregoing possible embodiments, and a photosensitive chip, a support, a filter, and a third adsorption structure. Wherein, the support can be fixed on the side of the optical lens with the second light-transmitting hole, the filter is arranged on the support, and the filter is opposite to the second light-transmitting hole; the photosensitive chip is arranged on the filter away from One side of the optical lens; the third adsorption structure is arranged on the side of the support member facing the optical lens, and the third adsorption structure is arranged around the filter. In this solution, by setting the third adsorption structure, even if the dust in the housing falls on the support through the second light-transmitting hole, it can be adsorbed and fixed by the third adsorption structure, thereby reducing the movement of the dust to the filter. risk, and improve the imaging effect of the camera module.

Similarly, the third adsorption structure is made of glue. In order to achieve better dust sticking effect, the third adsorption structure can be formed by a glue dipping process, so that the third adsorption structure has a honeycomb surface structure.

In a specific embodiment, the camera module can further include a reflection component, the reflection component can be fixed on the side of the optical lens where the first light-transmitting hole is opened, and includes a prism motor and a reflector, and the reflector is rotatably assembled on the prism motor , which is used to divert the ambient light and inject it into the first light-transmitting hole. At this time, the camera module is specifically a periscope module, which can reduce the components of the camera module distributed in the thickness direction of the mobile phone, so as to make the camera module Can be applied to mobile phones with ultra-thin design.

In a third aspect, the present application also provides an electronic device, the electronic device includes a casing and the camera module in the foregoing embodiment, and the camera module is disposed in the casing. Since the shading defect of the camera module is improved, the overall performance of the electronic device is also improved.

In a fourth aspect, the present application additionally provides a method for assembling an optical lens, the method comprising:

The carrier is arranged on one side of the base, and the mounting hole of the carrier is opposite to the second light-transmitting hole of the base;

A first adsorption structure is formed on the inner wall of the cover body, the cover body is fixed on the side of the base where the carrier is arranged, and the first light-transmitting hole of the cover body is opposite to the installation hole;

Set the lens module in the mounting hole.

In the above solution, the first adsorption structure can be used to adsorb the falling dust in the housing, and when the falling dust enters the housing through the first light-transmitting hole, the first adsorption structure can intercept the source of the moving path of the falling dust entering the optical lens. Therefore, a good dust capture effect can be achieved, thereby reducing the risk of dust falling on the filter, which is beneficial to improve the imaging effect of the camera module.

In a specific embodiment, forming a first adsorption structure on the inner wall of the cover body specifically includes: sequentially performing a glue dipping operation on each area of the inner wall of the cover body to form a first adsorption structure; wherein, the glue dipping operation may include the following step:

After dipping the glue with the glue head of the glue applicator, move the glue head to the cover body so that the glue on the surface of the glue head contacts an area of the inner wall of the cover body, so that part of the glue on the surface of the glue head is transferred to the cover the inner wall of the body;

Move the glue head in a direction away from the inner wall of the cover body to form a honeycomb-shaped glue layer in the corresponding area of the inner wall of the cover body.

In the above solution, the first adsorption structure with a honeycomb surface can be formed by dipping glue, so that a better dust sticking effect can be achieved.

In a specific embodiment, the dipping head can be made of soft rubber material, so that the formed first adsorption structure can have a better honeycomb shape.

In a specific embodiment, the material of the glue can be UV-curable glue. At this time, after the first adsorption structure is formed on the inner wall of the cover body, the first adsorption structure can be cured by ultraviolet light, and the exposure energy required for curing can be 1000-3000 mJ/cm ² .

In a specific embodiment, the adhesive force of the cured first adsorption structure is not less than 0.2 mN/mm ² , so that a better dust adhesion effect can be achieved.

In a specific embodiment, before the cover body is fixed on the side of the base provided with the carrier, the assembling process method may further include: forming a second adsorption structure on the surface of the side of the base provided with the carrier. The second adsorption structure can fully cover the path formed by the gap between the bottom plate and the carrier, and can intercept the falling dust at the end of the moving path in the optical lens, thereby reducing the falling dust from the second light-transmitting hole. risk of falling.

Similarly, the second adsorption structure can also be formed on the bottom plate by dipping glue, so that the second adsorption structure also has a honeycomb surface structure, so as to achieve better dust adhesion effect.

Description of drawings

1 is a schematic structural diagram of an electronic device provided by an embodiment of the present application;

Fig. 2 is a partial exploded schematic view of the electronic device in Fig. 1;

3 is a partial cross-sectional view of the electronic device in FIG. 1 at line A-A;

4 is a schematic structural diagram of a camera module provided by an embodiment of the present application;

Fig. 5 is the partial exploded schematic diagram of the camera module in Fig. 4;

Fig. 6 is the partial exploded schematic diagram of the optical lens in Fig. 5;

Fig. 7 is the partial structure schematic diagram of the optical lens in Fig. 5;

8 is a partial cross-sectional view of a camera module provided by an embodiment of the application;

9 is another partial cross-sectional view of a camera module provided by an embodiment of the application;

FIG. 10 is a schematic structural diagram of the cover of the optical lens in FIG. 6;

11 is a schematic structural diagram of the base of the optical lens in FIG. 6;

Fig. 12 is the partial structure schematic diagram of gluing equipment;

13 is a schematic structural diagram of an optical lens of a camera module provided in another embodiment of the present application;

Fig. 14 is a partial structural schematic diagram of the optical lens in Fig. 13;

FIG. 15 is a schematic structural diagram of the drive assembly of the optical lens in FIG. 13;

16 is a partial cross-sectional view of a camera module provided by another embodiment of the application;

FIG. 17 is a schematic structural diagram of the cover of the optical lens in FIG. 13;

18 is a schematic structural diagram of the base of the optical lens in FIG. 13;

FIG. 19 is another partial cross-sectional view of the electronic device 1 in FIG. 1 at the line A-A;

FIG. 20 is a schematic structural diagram of the camera module in FIG. 19;

Fig. 21 is a kind of partial exploded schematic diagram of the camera module in Fig. 19;

Fig. 22 is another partial exploded schematic diagram of the camera module in Fig. 19;

Figure 23 is an exploded schematic view of the optical lens of the camera module shown in Figure 20;

FIG. 24 is a schematic exploded view of the partial structure of the optical lens shown in FIG. 23;

25 is a partial cross-sectional view of another camera module provided by an embodiment of the application;

FIG. 26 is a schematic structural diagram of the cover body of the optical lens shown in FIG. 23;

FIG. 27 is a schematic structural diagram of a part of the optical lens shown in FIG. 23 .

Reference number:

1-electronic equipment; 100-chassis; 200-screen; 300-host circuit board; 400-camera module; 110-middle frame; 120-back cover; 210-first cover; 220-display screen; 310- Avoid space; 1201-light inlet; 1202-camera decoration; 1203-second cover plate; 410-optical lens; 420-module circuit board; 430-photosensitive chip; 440-filter; 450-support; 451-through hole; 452-counter hole; 10-shell; 20-lens assembly; 11-cover body; 12-bottom plate; 13-top plate; 14-side plate; 131, 1411-first light-transmitting hole; 121, 1231-second light-transmitting hole; 30-motor; 31-carrier; 32-elastic part; 33, 36-drive assembly; 311-first end; 312-installation hole; 21-lens barrel; 22-lens; 321- 322-second connection; 323-third connection; 324-slot; 313-first protrusion; 331, 361-magnet; 332, 362-coil; 15-extension; 314- 16-extended wall; 315-limiting block; 41-first adsorption structure; 411-first part; 412-second part; 42-second adsorption structure; 43-third adsorption structure; 316-angle structure 316a-first angular structure; 316b-second angular structure; 17-limiting structure; 171-second protrusion; 17a-first limiting structure; 17b-second limiting structure; 172-first blocking wall ;173-Second wall;174-Limiting groove;317-Bump;331-Line 1;332-Line 2;333-Line 3;334-Line 4;335-Line 5;336 -Line 6; 337-Line 7; 338-Line 8; 3161-First Sidewall; 3162-Second Sidewall; 339-Fixing Sheet; 460-Reflector Assembly; 461-Motor; 462-Reflector; 4621-light entrance surface; 4622-reflection surface; 4623-light exit surface; 141-first side plate; 142-second side plate; 143-third side plate; 122-bottom plate; 123-fourth side plate; 124- 125-second connecting plate; 126-fixing carrier; 1261-first mounting hole; 21a-first lens barrel; 22a-first lens; 34-moving carrier; 35-guide rail; 1262-first Fixing hole; 341-the second mounting hole; 21b-the second lens barrel; 22b-the second lens; 421-the third part; 422-the fourth part.

Detailed ways

The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present application.

Please refer to FIG. 1 , which is a schematic structural diagram of an electronic device 1 provided by an embodiment of the present application. The electronic device 1 can be a mobile phone, a tablet personal computer, a laptop computer, a personal digital assistant (PDA), a camera, a personal computer, a notebook computer, a vehicle-mounted device, a wearable device , Augmented reality (AR) glasses, AR helmets, virtual reality (VR) glasses or VR helmets, or other forms of equipment with photography and videography functions. The electronic device 1 of the embodiment shown in FIG. 1 is described by taking a mobile phone as an example.

FIG. 2 is a partial exploded schematic view of the electronic device 1 in FIG. 1 . Please refer to FIG. 1 and FIG. 2 together, the electronic device 1 may include a casing 100 , a screen 200 , a host circuit board 300 and a camera module 400 . It should be noted that FIGS. 1, 2 and the following related drawings only schematically show some components included in the electronic device 1, and the actual shapes, actual sizes, actual positions and actual structures of these components are not affected by those shown in FIGS. 1 and 1. 2 and the accompanying drawings below. In addition, when the electronic device 1 is some other device, the electronic device 1 may also not include the screen 200 and the host circuit board 300 .

For convenience of description, the width direction of the electronic device 1 is defined as the x-axis. The longitudinal direction of the electronic device 1 is the y-axis. The thickness direction of the electronic device 1 is the z-axis. It can be understood that, the coordinate system setting of the electronic device 1 can be flexibly set according to specific actual needs.

The casing 100 includes a middle frame 110 and a back cover 120 . The back cover 120 is fixed to one side of the middle frame 110 . In one embodiment, the back cover 120 is fixedly connected to the middle frame 110 by adhesive. In another embodiment, the rear cover 120 and the middle frame 110 form an integral molding structure, that is, the rear cover 120 and the middle frame 110 are an integral structure.

In other embodiments, the chassis 100 may also include a middle plate (not shown in the figures). The middle plate is connected to the inner surface of the middle frame 110 . The middle plate is opposite to the rear cover 120 and is arranged at an interval.

Please refer to FIG. 2 again, the screen 200 is fixed on the other side of the middle frame 110 . At this time, the screen 200 is disposed opposite to the back cover 120 . The screen 200 , the middle frame 110 and the back cover 120 together enclose the interior of the electronic device 1 . The interior of the electronic device 1 can be used to place components of the electronic device 1 , such as a battery, a receiver, and a microphone.

In this embodiment, the screen 200 may be used to display images, text, and the like. The screen 200 may be a flat screen or a curved screen. The screen 200 includes a first cover 210 and a display screen 220 . The first cover plate 210 is stacked on a side of the display screen 220 away from the middle frame 110 . The first cover plate 210 may be disposed close to the display screen 220 , and may be mainly used to protect and prevent dust of the display screen 220 . The material of the first cover plate 210 may be, but not limited to, glass. The display screen 220 can be an organic light-emitting diode (organic light-emitting diode, referred to as OLED) display screen, an active matrix organic light emitting diode or an active matrix organic light emitting diode (active-matrix organic light-emitting diode, referred to as AMOLED) Display, quantum dot light emitting diode (quantum dot light emitting diodes, QLED for short) display, etc.

FIG. 3 is a partial cross-sectional view of the electronic device 1 in FIG. 1 at the line A-A. Referring to FIG. 2 and FIG. 3 together, the host circuit board 300 is fixed inside the electronic device 1 . Specifically, the host circuit board 300 may be fixed to the side of the screen 200 facing the back cover 120 . In other embodiments, when the case 100 includes a middle board, the host circuit board 300 may be fixed on the surface of the middle board facing the rear cover 120 .

It can be understood that the host circuit board 300 may be a rigid circuit board, a flexible circuit board, or a flexible-rigid circuit board. The host circuit board 300 may use an FR-4 dielectric board, a Rogers (Rogers) dielectric board, or a mixed FR-4 and Rogers dielectric board, and so on. Here, FR-4 is the code name for a flame-resistant material grade, and the Rogers dielectric board is a high-frequency board. In addition, the host circuit board 300 can be used to set a chip, and the chip can be a central processing unit (CPU for short), a graphics processing unit (GPU for short), a universal flash storage (UFS for short), etc. .

Please continue to refer to FIG. 2 and FIG. 3 , the camera module 400 is fixed inside the electronic device 1 . Specifically, the camera module 400 is fixed on the side of the screen 200 facing the back cover 120 . In other embodiments, when the casing 100 includes a middle plate, the camera module 400 can be fixed on the surface of the middle plate facing the back cover 120 .

In addition, the host circuit board 300 is provided with an escape space 310 . The shape of the avoidance space 310 is not limited to the rectangular shape shown in FIGS. 1 and 2 . At this time, the shape of the host circuit board 300 is not limited to the "┘" shape shown in FIGS. 1 and 2 . The camera module 400 is located in the avoidance space 310 . In this way, in the Z-axis direction, the camera module 400 and the host circuit board 300 have an overlapping area, so as to avoid an increase in the thickness of the electronic device 1 caused by stacking the camera module 400 on the host circuit board 300 . In other embodiments, the host circuit board 300 may not be provided with the avoidance space 310 , and in this case, the camera module 100 may be stacked on the host circuit board 300 , or be arranged spaced from the host circuit board 300 .

In this embodiment, the camera module 400 is electrically connected to the host circuit board 300 . Specifically, the camera module 400 is electrically connected to the CPU through the host circuit board 300 . When the CPU receives the user's instruction, the CPU can send a signal to the camera module 400 through the host circuit board 300 to control the camera module 400 to capture images or record videos. In other embodiments, when the electronic device 1 is not provided with the host circuit board 300 , the camera module 400 may also directly receive the user's instruction, and take images or record video according to the user's instruction.

Referring to FIG. 3 again, the back cover 120 is provided with a light inlet hole 1201 , and the light inlet hole 1201 can connect the inside of the electronic device 1 to the outside of the electronic device 1 . The electronic device 1 further includes a camera decoration 1202 and a second cover 1203 . Part of the camera decorations 1202 may be fixed on the inner surface of the back cover 120 , and some of the camera decorations 1202 are in contact with the hole wall of the light inlet hole 1201 . The second cover plate 1203 is fixedly connected to the inner wall of the camera decorative piece 1202 . The camera decoration 1202 and the second cover 1203 separate the interior of the electronic device 1 from the exterior of the electronic device 1 , so as to prevent water or dust from entering the interior of the electronic device 1 through the light inlet hole 1201 . The material of the second cover plate 1203 is a transparent material, for example, glass or plastic. At this time, ambient light outside the electronic device 1 can enter the interior of the electronic device 1 through the second cover plate 1203 . The camera module 400 captures ambient light entering the interior of the electronic device 1 .

It can be understood that the shape of the light inlet hole 1201 is not limited to the circle as shown in FIG. 1 and FIG. 2 . For example, the shape of the light inlet hole 1201 may also be an ellipse or other irregular shapes.

In other embodiments, the camera module 400 can also collect ambient light passing through the back cover 120 . Specifically, the material of the back cover 120 is a transparent material. For example, glass or plastic. The surface of the back cover 120 facing the inside of the electronic device 1 is partially coated with ink, and partially is not coated with ink. At this time, the area where the ink is not applied may form a light-transmitting area. When the ambient light enters the interior of the electronic device 1 through the light-transmitting area, the camera module 400 can collect the ambient light. That is to say, the electronic device 1 of the present embodiment does not need to open the light entrance hole 1201, and also does not need to set the camera decoration 1202 and the second cover 1203, and the electronic device 1 has better integrity and lower cost.

FIG. 4 is a schematic structural diagram of a camera module according to an embodiment of the present application, and FIG. 5 is a partial exploded schematic diagram of the camera module in FIG. 4 . Referring to FIG. 4 and FIG. 5 together, the camera module 400 may include an optical lens 410 , a module circuit board 420 , a photosensitive chip 430 and a filter 440 . It should be noted that the optical axis direction of the optical lens 410 is the same as the optical axis direction of the camera module 400 .

The module circuit board 420 is fixed on the light-emitting side of the optical lens 410 , that is, the module circuit board 420 is located on the image side of the optical lens 410 . The module circuit board 420 can be electrically connected to the host circuit board so that signals can be transmitted between the host circuit board and the module circuit board 420 .

The modular circuit board 420 may be a rigid circuit board, a flexible circuit board, or a flexible-rigid circuit board. In addition, the modular circuit board 420 may use an FR-4 dielectric board, a Rogers dielectric board, or a mixed media board of Rogers and FR-4, and so on.

Please refer to FIG. 5 again, the photosensitive chip 430 is fixed on the side of the module circuit board 420 facing the optical lens 410 . The photosensitive chip 430 is electrically connected to the module circuit board 420 , so that after the photosensitive chip 430 collects ambient light, the photosensitive chip 430 generates a signal according to the ambient light, and transmits the signal to the host circuit board through the module circuit board 420 . In specific implementation, the photosensitive chip 430 may be an image sensor such as a complementary metal-oxide-semiconductor (CMOS for short) or a charge coupled device (CCD for short).

In one embodiment, the photosensitive chip 430 may be mounted on the module circuit board 420 through a chip on board (COB for short) technology. In other embodiments, the photosensitive chip 430 may also be packaged on the module circuit board 420 by a ball grid array (BGA for short) technology or a land grid array (LGA for short) technology.

In other embodiments, electronic components or other chips (eg, driver chips) may also be mounted on the modular circuit board 420 . Electronic components or other chips are arranged around the photosensitive chip 430 . Electronic components or other chips are used to assist the photosensitive chip 430 to collect ambient light, and the auxiliary photosensitive chip 430 to perform signal processing on the collected ambient light.

In other embodiments, a reinforcing plate may be provided on a side of the module circuit board 420 away from the photosensitive chip 430 to improve the strength of the module circuit board 420 . In specific implementation, the reinforcing plate may be a steel plate.

In other embodiments, the module circuit board 420 may also be partially provided with a sink, and at this time, the photosensitive chip 430 may be installed in the sink. In this way, the photosensitive chip 430 and the module circuit board 420 have an overlapping area in the z-axis direction, and at this time, the camera module 400 can be set thinner in the z-axis direction.

Please refer to FIG. 5 again, the filter 440 is located on the side of the photosensitive chip 430 facing the optical lens 410 . The filter 440 can be used to filter the stray light of the ambient light passing through the optical lens 410, and make the filtered ambient light propagate to the photosensitive chip 430, thereby ensuring that the image captured by the electronic device has better clarity. The filter 440 may be, but is not limited to, a blue glass filter. For example, the filter 440 can also be a reflective infrared filter, or a double-pass filter (the double-pass filter can transmit visible light and infrared light in ambient light at the same time, or allow visible light in ambient light to pass through at the same time. It transmits light with other specific wavelengths (such as ultraviolet light) at the same time, or transmits infrared light and other specific wavelengths of light (such as ultraviolet light) at the same time).

In order to fix the position of the filter 440, the camera module 400 may further include a support member 450 disposed between the optical lens 410 and the module circuit board 420, and two sides of the support member 450 are respectively connected to the optical lens 410 and the module. The circuit board 420 is fixedly connected, and the specific fixing method may be bonding. The filter 440 may be disposed on one side of the support member 450 . A through hole 451 is formed on the support member 450 in a region corresponding to the photosensitive chip 430 , so that ambient light can smoothly enter the photosensitive chip 430 . In addition, when the filter 440 is disposed on the side of the support member 450 facing the optical lens 410 , the side of the support member 450 facing the optical lens 410 may further be provided with a counterbore 452 , and the diameter of the counterbore 452 may be slightly larger than that of the through hole 451, so that a stepped structure can be formed between the counterbore 452 and the through hole 451, and the optical filter 440 can be specifically arranged on the stepped structure, so as to reduce the difference between the optical filter 440 and the support 450 after assembling thickness, thereby helping to reduce the size of the camera module 400 in the z-axis direction.

It can be understood that in other embodiments of the present application, the optical filter 440 may also be disposed on the side of the support member 450 facing the module circuit board 420 , in this case, the filter 440 may be disposed on a side of the support member 450 facing the module circuit board 420 . A counterbore is opened on the side, and a step structure for supporting the filter 440 is formed on the side.

Please continue to refer to FIG. 5 , the optical lens 410 may include a housing 10 , a lens assembly 20 disposed in the housing 10 , and a motor. The motor can drive the lens assembly 20 to move along the z-axis direction to adjust the distance between the lens assembly 20 and the photosensitive chip 430 The distance between them, so that the camera module can realize the function of auto focus.

FIG. 6 is a partial exploded schematic diagram of the optical lens in FIG. 5 , and FIG. 7 is a partial structural schematic diagram of the optical lens in FIG. 5 . 6 and 7 together, the housing 10 includes a cover 11 and a base 12 , the cover 11 is covered on the base 12 , and the cover 11 and the base 12 are fixedly connected to form a space for accommodating the lens assembly 20 . The cover body 11 may specifically include a top plate 13 and a side plate 14 surrounding the top plate 13 . The top plate 13 is provided with a first light-transmitting hole 131 , and the first light-transmitting hole 131 can communicate the interior of the casing 10 to the casing. 10 outside. The first light-transmitting hole 131 may be approximately circular as shown in FIG. 6 , or may be a rectangle or other regular or irregular polygons, or the like. As shown in FIG. 3 , the first light-transmitting hole 131 is disposed opposite to the light-inlet hole 1201 opened on the back cover 120 , and ambient light can propagate into the casing 10 through the light-inlet hole 1201 and the first light-transmitting hole 131 in sequence.

The base 12 and the end of the side plate 14 facing away from the top plate 13 are hermetically connected. The base 12 is provided with a second light-transmitting hole 121 opposite to the first light-transmitting hole 131 . Connected to the outside of the casing 10 , the ambient light can be transmitted to the filter and the photosensitive chip in turn through the second light-transmitting hole 121 . The shape of the second light-transmitting hole 121 may be a circle, a rectangle, or other regular or irregular polygons, and the like.

Continuing to refer to FIGS. 6 and 7 , the motor 30 is disposed in the housing 10 and includes a carrier 31 , an elastic member 32 and a drive assembly 33 . The carrier 31 can be used to carry the lens assembly 20, and the carrier 31 is spaced apart from the inner wall of the housing 10; the elastic member 32 connects the carrier 31 and the housing 10 to support the carrier 31; the driving component 33 is used to drive the carrier 31 And the lens assembly carried on it moves along the z-axis direction to achieve focusing.

Along the z-axis direction, the carrier includes a first end and a second end (not shown in the figure) opposite to each other, wherein the first end 311 is disposed close to the top plate of the cover body, and the second end is disposed close to the bottom plate. The carrier 31 is provided with a mounting hole 312 for mounting the lens assembly. The mounting hole 312 penetrates from the first end 311 of the carrier 31 to the second end thereof. The light-transmitting holes 121 are located opposite to each other. The lens assembly 20 includes a lens barrel 21 and a lens 22 provided in the lens barrel 21 . The lens barrel 21 is arranged in the mounting hole 312 , the lens barrel 21 has a light entrance side 211 and a light exit side 212 along the length direction, the light entrance side 211 of the lens barrel 21 is disposed toward the first light transmission hole 131 , and the light exit side 212 of the lens barrel 21 Then, it is disposed toward the second light-transmitting hole 121 . The lens 22 is fixed in the lens barrel 21 , and two side surfaces of the lens 22 are respectively disposed toward the light entrance side 211 and the light exit side 212 of the lens barrel 21 . In addition, the number of the lenses 22 may be one or more, and when there are multiple lenses 22 , the multiple lenses 22 may be coaxially arranged and sequentially arranged along the length direction of the lens barrel 21 .

In addition, when the lens barrel 21 is arranged in the installation hole 312 , in order to realize the fixation of the lens barrel 21 , in one embodiment, the lens barrel 21 and the installation hole 312 may be interference fit. In other embodiments, the lens barrel 21 and the mounting hole 312 can also be gap-fitted, and a filler can be provided in the gap between the lens barrel 21 and the inner wall of the mounting hole 312, so that the lens barrel 21 can be fixed by bonding on carrier 31 . In specific implementation, the outer wall of the lens barrel 21 and the inner wall of the mounting hole 312 can be respectively provided with threaded structures. At this time, the filling glue can also be filled in the recesses of the threaded structure, so as to increase the distance between the lens barrel 21 and the filling glue, and the installation The bonding area between the hole 312 and the filling glue can make the lens barrel 21 more firmly fixed in the installation hole 312 .

Please continue to refer to FIGS. 6 and 7 , the elastic member 32 includes a first connecting portion 321 , a second connecting portion 322 and a third connecting portion 323 , wherein the first connecting portion 321 is connected to the carrier 31 , and the second connecting portion 322 is connected to the cover body connection, and the third connection part 323 is used to connect the first connection part 321 and the second connection part 322 . When the driving component 33 is not working, the supporting force exerted by the elastic member 32 on the carrier 31 can be balanced with the gravity of the carrier 31, so that the carrier 31 and the housing 10 are relatively fixed; when the driving component 33 is working, the driving component 33 is applied to the carrier 31z With the driving force in the axial direction, the elastic member 32 is deformed, so that the carrier 31 can move in the z direction.

When connecting the first connecting portion 321 to the carrier 31 , in order to improve the difficulty of the connection process, the first connecting portion 321 may be fixed to one end of the carrier 31 by means of bonding or the like. In some embodiments, the first connecting portion 321 may be an annular structure disposed around the mounting hole, a groove 324 may be disposed on the peripheral side of the first connecting portion 321 , and a groove 324 may be disposed on the first end 311 of the carrier 31 . The corresponding first protrusion 313 can be positioned on the carrier 31 by the cooperation of the slot 324 and the first protrusion 313 .

The second connecting portion 322 is disposed on the outer peripheral side of the first connecting portion 321 . In some embodiments, the second connecting portion 322 may also be an annular structure. When the first connecting portion 321 is connected to the first end 311 of the carrier 31 , The second connecting portion 322 can be connected with the top plate 13 of the cover body 11 , so as to reduce the overall installation difficulty of the elastic member 32 on the premise of improving the connecting strength between the second connecting portion 322 and the housing 10 .

When the carrier 31 moves in the housing 10 , the first connecting portion 321 is fixedly connected to the carrier 31 , and the second connecting portion 322 is fixedly connected to the housing 10 , so the main deformation of the elastic member 32 is concentrated on the third connecting portion 323 . In order to make the third connecting part 323 have strong deformation ability, in the embodiment of the present application, the third connecting part 323 may be a slender strip-shaped structure, and the strip-shaped structure has good bending deformation characteristics, so that the carrier can be Reliable movement along the z-axis. In addition, the third connecting portion 323 can be connected between the first connecting portion 321 and the second connecting portion 322 in a curved shape, so as to increase the length of the third connecting portion 323 , so as to ensure the deformability of the third connecting portion 323 . On the premise, the support strength of the third connecting portion 323 to the carrier 31 is improved.

Of course, in some embodiments, the second end of the carrier 31 can also be connected to the bottom plate 12 of the housing 10 through the elastic member 32 to further improve the supporting strength of the carrier 31 . At the second end of the carrier 31 , the connection method between the elastic member 32 and the second end can refer to the connection method with the first end 311 described above, which will not be repeated here.

6 and 7 together, the drive assembly 33 includes a magnet 331 and a coil 332. The magnet 331 is disposed inside the housing 10, and can be fixed on the inner wall of the side plate 14; the coil 332 is disposed on the side of the carrier facing the side plate 14. the peripheral surface, and the coil 332 is disposed opposite to the magnet 331 . The coil 332 can be electrically connected to the module circuit board. When the module circuit board outputs a current signal to the coil 332, the coil 332 can generate an ampere force along the z-axis direction, thereby driving the carrier 31 and the lens assembly carried on the carrier 31 to move .

It can be understood that, by passing current signals in different directions to the coil 332, the coil 332 can generate the ampere force in the positive direction of the z-axis and the ampere force in the negative direction of the z-axis, so that the carrier 31 can be driven along the positive direction of the z-axis or the z-axis. The axis moves in the negative direction.

Referring to FIGS. 6 and 7 , the top plate 13 is further provided with an extension portion 15 disposed toward the base, and the extension portion 15 may be disposed at the edge of the first light-transmitting hole 131 . The number of the extension parts 15 may be one or more, and when there are multiple extension parts 15 , the plurality of extension parts 15 may be arranged at the edge of the first light-transmitting hole 131 at equal intervals. The extension portion 15 and the top plate 13 may be an integral structure, and during specific implementation, the extension portion 15 may be formed by a stamping process or a bending process. The first end 311 of the carrier 31 defines a groove 314 corresponding to the extension portion 15 one-to-one, and the extension portion 15 can partially extend into the corresponding groove 314 . The cross-sectional shape of the groove 314 may be circular, rectangular, trapezoidal, etc., which is not limited in the present application. The extension 15 is spaced apart from the sidewall of the groove 314, so that when the carrier 31 rotates around the x-axis, y-axis or z-axis, or moves along the x-axis or y-axis under the impact of an external force, The extension portion 15 can be in contact with the side wall of the groove 314 to prevent the movement of the carrier 31 from being too large and affecting the structural reliability of the camera module.

In addition, the end of the extension portion 15 away from the top plate 13 and the bottom wall of the groove 314 are also spaced apart. The specific spacing distance can be designed according to the movement stroke of the carrier 31 to avoid the extension portion 15 when the carrier 31 moves in the positive direction of the z-axis. It is in contact with the bottom wall of the groove 314 , thereby restricting the continued movement of the carrier 31 and affecting the focusing effect of the camera module. Similarly, the length of the extension portion 15 extending into the groove 314 can also be designed according to the movement stroke of the carrier 31, so as to prevent the extension portion 14 from escaping from the groove 314 when the carrier 31 moves in the negative direction of the z-axis, so as to prevent the carrier 31 from moving around the groove 314. Rotation in the x-axis, y-axis or z-axis direction, or movement along the x-axis or y-axis direction loses the restriction effect.

In some embodiments, an extension wall 16 may be further provided on the side edge of the base 12 facing the top panel, the extension wall 16 is located on the inner side of the side panel 14 , and the extension wall 16 is spaced between one end of the top panel 13 and the top panel 13 . . The extension wall 16 is provided with a limit groove 161 extending along the z-axis direction, and a limit block 315 is provided on the outer peripheral side of the carrier 31. After the motor 30 is assembled in the housing 10, the limit block 315 can be slidably assembled on the limit in the groove 161. Through the cooperation of the limit block 315 and the limit slot 161 , other forms of movement of the carrier 31 other than the movement in the z-axis direction can also be restricted, thereby improving the structural reliability of the camera module.

Since the carrier 31 of the motor needs to move in the housing 10, there must be a gap between the carrier 31 and the inner wall of the housing 10, and one end of the gap is connected to the first light-transmitting hole 131, and the other end is connected to the second light-transmitting hole 131. The holes 121 communicate with each other, and since the second light-transmitting holes 121 and the filter 440 are disposed opposite to each other, the gap also leads to the plane where the filter 440 is located through the second light-transmitting holes 121 . During the assembly process of the camera module 400, on the one hand, since the internal workshop of the module factory is not absolutely dust-free, some micron-sized dust will inevitably float in the air in the workshop. During the repeated use of the material box in which the module is placed, there will also be various particles of dust falling. These falling dust will enter the gap between the carrier 31 and the inner wall of the housing 10 through the first light-transmitting hole 131 , and then follow the The gap falls onto the filter through the second light-transmitting hole 121 , thereby causing the camera module 400 to produce bad shadows during imaging.

Referring to FIG. 8 , FIG. 8 is a partial cross-sectional view of a camera module provided by an embodiment of the present application, and the figure illustrates a specific path of the falling dust A falling on the filter 440 . It can be seen that the falling dust A first enters the housing 10 through the first light-transmitting hole 131 and moves from the first gap a between the first end of the carrier 31 and the top plate 13 to the space between the peripheral side of the carrier 31 and the side plate 14 Then move along the second gap b to the second end of the carrier 31 and the third gap c of the base 12, and finally move from the third gap c to the second light-transmitting hole 121, and pass through the third gap c. The two light-transmitting holes 121 fall on the support member 450 and are finally rolled onto the filter 440 by the support member 450 .

In order to improve the shading defect, during the assembly process of the camera module and the functional testing process, the gap in the casing 10 should be exposed to the minimum as much as possible. At present, the mainstream dust-proof design used by module factories in the industry is generally by controlling the dust-free conditions in the dust-free workshop, adding a foam protective film to the surface of the module, and burning the module with film. and other functional tests to reduce the dust falling into the camera module. However, in the process of transporting the camera module from the module factory to the whole machine factory, some protective films on the surface of the module will fall off due to vibration and bumps; The second repair or the second film will also cause the protective film to fall off or be misaligned. In addition, since the dust-free conditions of the whole machine factory are far less than that of the module factory, these situations will increase the risk of exposing the gaps in the casing.

In view of the above problems, in the embodiment of the present application, the camera module further includes a dust-catching structure, and the dust-catching structure can be used to adhere to the falling dust in the housing, so as to intercept the falling dust before it falls on the optical filter, thereby reducing the The risk of bad shadows of the small camera module improves the imaging quality of the camera module. The setting method of the dust catching structure will be described in detail below.

FIG. 9 is a partial cross-sectional view of a camera module provided by an embodiment of the present application, and FIG. 10 is a schematic structural diagram of a cover of the optical lens in FIG. 6 . Referring to FIG. 9 and FIG. 10 together, in the embodiment of the present application, the dust capturing structure includes a first adsorption structure 41 disposed on the inner wall of the cover body 11 and used for adsorbing falling dust. The first adsorption structure 41 includes a first part 411 arranged on the inner wall of the top plate 13 and a second part 412 arranged on the inner wall of the side plate 14 . The full coverage of the part of the path formed by the slit a; the second part 412 can cover the inner wall of the side plate 14, so as to achieve full coverage of the part of the path formed by the second slit b. When the falling dust enters the housing 10 through the first light-transmitting hole 131 and moves in the direction of the second light-transmitting hole 121 , the first part 411 can initially adsorb the falling dust passing through the first gap a, and then if there is a part that is not adsorbed The falling dust can be supplemented and adsorbed by the second part 412 after entering the second gap b. Since the first slit a and the second slit b are disposed close to the first light-transmitting hole 121 , the first adsorption structure 41 can intercept the dust falling into the optical lens at the source of its moving path, and due to the adsorption of the first adsorption structure 41 The area is relatively large, so a good dust capture effect can be achieved, thereby reducing the risk of dust falling on the filter 440 , which is beneficial to improve the imaging effect of the camera module 400 .

It should be noted that when the carrier 31 collides with the casing 10 under the impact of external force, some granular dust will also be generated, and these dust may be distributed in various gaps in the casing 10, such as the first gap a, the second gap slit b or third slit c. In the embodiment of the present application, in addition to the falling dust entering the housing 10 through the first light-transmitting hole 131 , the first adsorption structure 41 also has an adsorption effect on the falling dust caused by the movement and impact of the carrier 31 , thereby reducing the The risk of this part of the falling dust falling on the filter 440 through the second light-transmitting hole 121 .

In some embodiments, the first adsorption structure 41 may be made of a material with electrostatic adsorption capability, such as a polyester material with relatively high surface static electricity. At this time, the first adsorption structure 41 can be formed separately, and then fixed to the inner wall of the cover body 11 by means of bonding or clipping. Alternatively, the first adsorption structure 41 and the cover body 11 can also be integrally formed by a dual-camera injection molding process.

In other embodiments, the first adsorption structure 41 may use adhesive with better adhesion properties, such as glue, tape, adhesive solvent, and the like. In specific implementation, the first adsorption structure 41 may be formed on the inner wall of the cover body 11 by various methods such as gluing, gluing, printing, and attaching.

FIG. 11 is a schematic structural diagram of the base of the optical lens in FIG. 6 . Referring to FIGS. 9 , 10 and 11 together, the dust-catching structure may further include a second adsorption structure 42 disposed on the bottom 12 . During specific implementation, the second adsorption structure 42 may cover the side of the base 12 facing the top plate 13 , In this way, the full coverage of the partial path formed by the third slit c is achieved. The second adsorption structure 42 can adsorb the falling dust entering the third gap c. The falling dust includes the falling dust that enters the casing 10 from the outside and is not adsorbed by the first adsorption structure 41, and the carrier 31 is impacted during the movement process. of dust. Since the third slit c is disposed close to the second light-transmitting hole 121 , the second adsorption structure 42 can intercept the falling dust at the end of its moving path in the optical lens, thereby further reducing the amount of dust falling from the second light-transmitting hole 121 . Risk of falling.

In addition, when the base 12 is provided with the extension wall 16 , the second adsorption structure 42 may be specifically arranged on the base 12 avoiding the extension wall 16 and covering the base 12 avoiding the extension wall 16 . At this time, the extension wall 16 can be made of a material that is not easy to generate dust, such as liquid crystal polymer (LCP) or plastic, so as to reduce the dust falling when it collides with the carrier 31 .

In some embodiments, the second adsorption structure 42 may be made of a material with electrostatic adsorption capability, such as a polyester material with relatively large surface static electricity. At this time, the second adsorption structure 42 can be separately fabricated and formed, and then fixed on the base 12 by means of bonding or clipping. Alternatively, the second adsorption structure 42 and the base 12 can also be integrally formed by a dual-camera injection molding process.

In other embodiments, the second adsorption structure 42 may use an adhesive with better adhesion properties, such as glue, adhesive tape, viscous solvent, and the like. During specific implementation, the second adsorption structure 42 may be formed on the base 12 by various methods such as gluing, gluing, printing, and attaching.

Please refer to FIG. 9 again, the dust capturing structure may further include a third adsorption structure 43 , the third adsorption structure 43 is disposed on the side of the support member 450 facing the optical lens, and the third adsorption structure is disposed around the filter 440 . With this arrangement, even if the dust in the housing 10 falls on the support member 450 through the second light-transmitting hole 121 , it can be adsorbed and fixed by the third adsorption structure 43 , thereby reducing the movement of the dust to the filter 440 risk, and the imaging effect of the camera module 400 is improved. The materials and manufacturing methods of the third adsorption structure 43 are similar to those of the first adsorption structure 41 and the second adsorption structure 42 , which will not be repeated here.

5 , FIG. 6 and FIG. 9 together, take the first adsorption structure 41 , the second adsorption structure 42 and the third adsorption structure 43 as glue as an example, combined with the assembly process of the camera module 400 The formation steps of the adsorption structure will be described in detail.

Step 1, the assembly and technological process of the optical lens 410 . First, the carrier 31 is set on the base 12 , then the second adsorption structure 42 is formed on the side surface of the base 12 where the carrier 31 is set, and the first adsorption structure 41 is formed on the inner wall of the cover 11 , and then the cover 11 and the base are formed. 12 is fixed, and the assembly of the housing 10 and the motor 30 is completed; the combined structure of the housing 10 and the motor 30 is vibrated and washed to remove the dirt on the surface of the combined structure; the lens assembly 20 is installed into the mounting hole opened on the carrier 31 In 312, the assembly of the optical lens 410 is completed; the plasma cleaning is performed on the optical lens 410 to remove the dirt on the surface of the optical lens 410;

Step 2, assembling and processing of the filter 440 and the support 450 . The filter 440 is installed on the support 450, and the combined structure of the filter 440 and the support 450 is washed with water to remove the contamination on the surface of the combined structure; then plasma cleaning is performed to further remove the contamination on the surface of the combined structure ; The third adsorption structure 43 is formed on the side of the support 450 for bonding with the optical lens 410, and the third adsorption structure 43 is set around the filter 440; the support 450 is bonded and fixed with the optical lens 410;

In step 3, the module circuit board 420 encapsulated with the photosensitive chip 430 is fixed on the side of the support member 450 away from the optical lens 410 .

Wherein, the first adsorption structure 41 may specifically adopt ultraviolet curing glue (ultraviolet rays glue, UV glue for short). The viscosity of UV glue at room temperature is between 1000-6000Pa·s. After the first adsorption structure 41 is formed on the inner wall of the cover body 12 , the first adsorption structure 41 needs to be cured by ultraviolet light. The exposure energy required for curing is between 1000-3000 mJ/cm ² . The adhesion of the structure 41 can reach 0.2 mN/mm ² .

Similarly, UV glue can also be used for the second adsorption structure 42 and the third adsorption structure 43. The exposure energy and the adhesive force of the second adsorption structure 42 and the third adsorption structure 43 can refer to the description of the first adsorption structure 41 above. It is not repeated here.

In the above steps, when the first adsorption structure 41 is formed on the inner wall of the cover body 11 , it can be realized by dipping glue. Specifically, please refer to the gluing device 500 shown in FIG. 12 . The gluing device 500 includes a support rod 510 and a glue dipping head 520 disposed at one end of the support rod 510 . The glue dipping head 520 may be soft glue. material. During the glue dipping operation, the cover body 11 is turned upside down (the inner wall of the top plate 13 is placed upward), so that the glue dipping head 520 of the glue application equipment 500 is dipped in the glue contained in the container, and then the glue dipping head 520 is moved. into the cover body 11, make the glue on the surface of the glue dipping head 520 contact a certain area of the inner wall of the cover body 11, at this time, part of the glue on the surface of the glue dipping head 520 will be transferred to the inner wall of the cover body 11, and then keep away from the cover body 11. By moving the glue dipping head 520 in the direction of the inner wall of the cover body 11 , a glue layer can be formed in this area of the inner wall of the cover body 11 . Then, a glue dipping operation is performed on different regions of the inner wall of the cover body 11 by the same process, and finally the first adsorption structure 41 is formed.

Continuing to refer to FIG. 12 , the dipping head 520 may have a substantially cuboid structure, including a first surface 521 away from the support rod 510 and four side surfaces 522 surrounding the first surface 521 . 10, the first surface 521 of the dipping head 520 can be used for dipping the inner wall of the top plate 13 of the cover 11, and the side 522 of the dipping head 520 can be used for the side plate of the cover 11. The inner wall of 14 is dipped in glue, which can reduce the difficulty of operation.

It should be noted that the gluing device 500 may further include a robotic arm and a visual inspection device, and the support rod 510 may be connected to the robotic arm. With the aid of the visual inspection equipment, the movement of the glue dipping head 520 is controlled by the mechanical arm, which can not only improve the operation accuracy of glue dipping, but also reduce the risk of glue leakage on the inner wall of the cover body 11 .

It can be understood that when the glue dipping head 520 is moved in a direction away from the inner wall of the cover body 11, due to the relatively high viscosity of the glue, the glue attached to the inner wall of the cover body 11 will be subjected to the pulling force of the glue dipping head 520. Under the action of the pulling force and the gravity of the glue itself, the glue layer finally formed on the inner wall of the cover body 11 exhibits an uneven shape. Therefore, after all regions of the inner wall of the cover body 11 are dipped in glue, the formed first adsorption structure 41 is a honeycomb glue layer with irregularities. Compared with the adhesive layer with higher flatness formed by spraying or scribing, the honeycomb-shaped first adsorption structure 41 can achieve better dust sticking effect.

It can be understood that when the second adsorption structure 42 is formed on the base and the third adsorption structure 43 is formed on the support 450, it can also be realized by dipping glue. The specific operation process can refer to the above description, which is not repeated here. More to say.

Experiments show that when the camera module 400 uses the traditional coating process to form the dust-catching structure, after 500 roller tests, the incidence of bad shadows is as high as 13/20, of which 20 are the camera modules participating in the test. The number of samples in a group, 13 is the number of camera modules 400 with shading defects among the 20 camera modules 400; in addition, in the case of mass production of the production line, the probability of shading defects in products is as high as 7%.

When the camera module 400 adopts the dust-catching structure formed by the above-mentioned glue dipping process, after 500 times of roller tests, the occurrence rate of shading defects is 0/20. In the case of mass production of the production line, the products have shading defects. The probability is only 0.2%.

It can be seen that the camera module 400 provided by the embodiment of the present application forms the uneven first adsorption structure 41, the second adsorption structure 42 and the third adsorption structure 43 through the glue dipping process, which can effectively intercept the falling dust, Reduce the risk of dust falling on the filter and improve the imaging quality of the camera module.

According to different motor driving modes, the embodiment of the present application further provides a camera module. FIG. 13 is a partial exploded schematic diagram of an optical lens of the camera module, and FIG. 14 is a partial structural schematic diagram of the optical lens in FIG. 13 . Referring to FIG. 13 and FIG. 14 together, in addition to the optical mirror 410 , the camera module may further include a module circuit board, a photosensitive chip, an optical filter, and a reflection component. The structure and relative positional relationship of the module circuit board, the photosensitive chip and the optical filter can refer to the setting method of the above-mentioned embodiment, which will not be repeated here.

In the embodiment of the present application, the optical lens may also include a housing 10, a lens assembly 20 and a motor 30 disposed in the housing 10, wherein the structure of the housing 10 and the lens assembly 20 can be referred to the arrangement of the above-mentioned embodiments, I won't go into details here. The difference is that the motor 30 in the optical lens can not only drive the lens assembly 20 to move along the z-axis direction, but also drive the lens assembly 20 to rotate, so as to adjust the imaging position on the surface of the photosensitive chip, so that the camera module can realize automatic Focus function, but also realize the optical image stabilization function.

Continuing to refer to FIGS. 13 and 14 , the motor 30 is disposed in the housing 10 and includes a carrier 31 , an elastic member 32 and a drive assembly. The carrier 31 can be used to carry the lens assembly 20, and the carrier 31 is spaced from the inner wall of the housing 10; the elastic member 32 connects the carrier 31 and the base 12 to support the carrier 31; the driving component is used to drive the carrier 31 and carry The lens assembly 20 thereon moves or rotates to achieve focusing and anti-shake.

Similarly, along the z-axis direction, the carrier 31 includes a first end 311 and a second end (not shown in the figure) opposite to each other, wherein the first end 311 is disposed close to the top plate 13 of the cover body 11 , and the second end is close to the base 12 settings. The carrier 31 is provided with a mounting hole 312 for mounting the lens assembly. The mounting hole 312 penetrates from the first end 311 of the carrier 31 to the second end thereof. The light-transmitting holes 121 are located opposite to each other. For the specific manner of disposing the lens assembly in the mounting hole, reference may be made to the relevant descriptions in the above-mentioned embodiments, which will not be repeated here.

The elastic member 32 has a substantially annular structure and includes a first connecting portion 321 , a second connecting portion 322 and a third connecting portion 323 , wherein the first connecting portion 321 is connected to the carrier 31 , the second connecting portion 322 is connected to the base, and the third connecting portion 322 is connected to the base. The connecting portion 323 is used to connect the first connecting portion 321 and the second connecting portion 322 .

The first connecting portion 321 may specifically be a shrapnel-like structure. During specific implementation, the first connecting portion 321 may be a circle, a triangle, a rectangle, or other regular or irregular shapes, which are not limited in this application. When connecting the first connecting portion 321 to the carrier 31 , the first connecting portion 321 may be fixed to the first end of the carrier 31 by bonding or the like, so as to reduce the difficulty of connecting the first connecting portion 321 and the carrier 31 . In addition, the first connecting portion 321 may also be provided with a slot 324 , the first end 311 of the carrier 31 is provided with a first protrusion 313 corresponding to the slot 321 , and the slot 324 cooperates with the first protrusion 313 The positioning of the first connecting portion 321 on the carrier 31 can be achieved.

The number of the first connecting portions 321 may be two, and the positions on the carrier 31 corresponding to the two first connecting portions 321 may be respectively provided with angular structures 316 extending toward the outer peripheral side thereof, and the two angular structures 316 are respectively first angular structures The structure 316a and the second angular structure 316b, the first angular structure 316a and the second angular structure 316b may be arranged symmetrically around the mounting hole. The two first connecting portions 321 are respectively fixed on the end faces of the corresponding angular structures, so that on the one hand, the contact area between the first connecting portion 321 and the carrier 31 can be increased, the connection strength between the first connecting portion 321 and the carrier 31 can be improved, and the other In one aspect, the force uniformity of the carrier 31 can also be improved.

The second connecting portion 322 may also be a shrapnel-like structure. In specific implementation, the second connecting portion 322 may be a circle, a triangle, a rectangle, and other regular or irregular shapes, which are not limited in this application. When connecting the second connecting portion 322 to the base 12 , a limiting structure 17 is further provided on the side of the base 12 facing the top plate. The limiting structure 17 is located on the inner side of the side plate 14 . The top plates 13 are spaced apart. Specifically, the second connecting portion 322 can be fixed to the end of the limiting structure 17 facing the top plate 13 by means of bonding or the like. At this time, the shape of the second connecting portion 322 can be designed according to the cross-sectional shape of the limiting structure 17 to maximize the The contact area between the second connection portion 322 and the limiting structure 17 is increased, so that the connection strength of the two can be improved. Similarly, the second connecting portion 322 may be provided with an opening, and the limiting structure 17 is provided with a second protrusion 171 corresponding to the opening (not shown in the figure), and the second protrusion 171 is connected to the second protrusion 171 through the opening. The matching can realize the positioning of the second connecting portion 322 on the limiting structure 17 .

The number of the second connecting portions 322 may be two, and correspondingly, the number of the limiting structures 17 is also two, and the two limiting structures 17 are the first limiting structure 17a and the second limiting structure 17b respectively. The first limiting structure 17 a and the second limiting structure 17 b may be arranged symmetrically around the second light-transmitting hole 121 . The two second connecting portions 322 are respectively fixed on the corresponding limiting structures 17 to improve the connection strength of the base 12 of the second connecting portions 322 and the uniformity of the force on the base.

The third connecting portion 323 may be an elongated bar-shaped structure, and the bar-shaped structure has good bending deformation characteristics, so that the carrier can move reliably. In addition, the third connecting part 323 can be connected between the first connecting part 321 and the second connecting part 322 in a curved shape, so that the length of the third connecting part 323 can be increased, on the premise of ensuring the deformability of the third connecting part 323 Next, the support strength of the third connecting portion 323 to the carrier 31 is improved.

13 and 14, the first limiting structure 17a and the second limiting structure 17b may include a first blocking wall 172 and a second blocking wall 173, respectively, and the space between the first blocking wall 172 and the second blocking wall 173 may be Set at a certain angle, the angle can be an acute angle, a right angle or an obtuse angle, and the opening direction of the angle is toward one side of the carrier 31, so that the angle between the first blocking wall 172 and the second blocking wall 173 can be formed. A limiting groove 174 . The outer peripheral side of the carrier 31 is further provided with bumps 317 at positions corresponding to the limiting grooves 174 . With this structure, when the carrier 31 moves or rotates to a large extent under the impact of the external force, the bumps 317 can abut against the inner wall of the limiting groove 174, thereby restricting the further movement of the carrier 31 and improving the camera mode. Group structural reliability.

In some embodiments, the included angle between the first blocking wall 172 and the second blocking wall 173 is a right angle, that is, the first blocking wall 172 and the second blocking wall 173 are perpendicular to each other. Extending along the x-axis direction, the second blocking wall 173 may extend along the y-axis direction.

In some embodiments, the two bumps 317 and the two angular structures 316 can be evenly distributed on the peripheral side of the carrier 31 , and at this time, the carrier 31 is approximately a center-symmetric structure. In this way, after the carrier 31 and the base 12 are assembled, the carrier 31 and the first limiting structure 17a and the second limiting structure 17b on the peripheral side of the carrier 31 can form a roughly cuboid structure, the first angular structure 316a, the first The limiting structure 17a, the second angular structure 316b, and the second limiting structure 17b can be regarded as the four corners of the cuboid, respectively.

FIG. 15 is a schematic structural diagram of the driving assembly of the optical lens in FIG. 13 . 13 , 14 and 15 together, the drive assembly 33 can control the movement of the carrier 31 through eight telescopic wires, which are the first line 331 , the second line 332 , the third line 333 , Line four 334, line five 335, line six 336, line seven 337 and line eight 338, each of the wires may include a first end and a second end, the first end may be used to connect with the carrier 31, the second The ends can be used to connect with the base 12 , so that the stress state of the carrier 31 can be adjusted by controlling the telescopic states of the eight wires respectively, so that the carrier 31 can move accordingly.

In the embodiment of the present application, in order to reduce the difficulty of realizing the stretchability of the wire, the eight wires may be respectively prepared from shape memory alloys. Shape memory alloy is a general term for a class of metals with shape memory effect. Its shape memory effect is specifically: when the shape memory alloy is below the memory temperature, it can show a structural form, and when the memory temperature is above, its internal crystal structure. Changes will occur, prompting the shape memory alloy to deform, and the shape memory alloy can exhibit a structural form at this time. Specifically applied to the embodiments of the present application, the wire rod is in a relatively relaxed state when the temperature is below its memory temperature, and the length is shortened when the memory temperature is above the wire rod, showing a state of shrinkage and deformation; in addition, it should be understood that the wire rod is in a relatively relaxed state. , when subjected to a certain external force, it can also be stretched and deformed, so that the length of the wire rod increases, so the wire rod in the embodiments of the present application can also be stretched and deformed. In addition, in order to control the temperature of the wire rods, each wire rod can be connected to the module circuit board, so that the wires can be heated by energizing them, thereby causing them to shrink and deform.

The setting method of the eight wires is described in detail below.

In specific implementation, the first ends of the first line 331 and the second line 332 are respectively connected to the first side wall 3161 of the first angular structure 316a, and the second ends of the first line 331 and the second line 332 are respectively connected to the first side wall 3161 of the first angular structure 316a. On the first blocking wall 172 of a limiting structure 17a, wherein the first side wall 3161 of the first angular structure 316a is a side wall disposed on the same side as the first blocking wall 172 of the first limiting structure 17a, it can be understood , the first sidewall 3161 of the first angular structure 316a also extends along the x-axis direction. The projections of the first line 331 and the second line 332 on the xz plane are crossed. In addition, in order to enable the carrier 31 to bear the force more uniformly, the first end of the first line 331 can be connected to the first end of the first angular structure 316a. the side close to the first end 311 on the side wall 3161, and the side close to the second end on the first side wall 3161 of the first angular structure 316a connecting the first end of the second wire 332;

The first ends of the third line 333 and the fourth line 334 are respectively connected to the first side wall 3161 of the second angular structure 316b, and the second ends of the third line 333 and the fourth line 334 are respectively connected to the second limiting structure 17b, wherein the first side wall 3161 of the second angular structure 316b is a side wall disposed on the same side as the first blocking wall 172 of the second limiting structure 17b, it can be understood that the second angular structure The first sidewall 3161 of the structure 316b also extends in the x-axis direction. The projections of the third line 333 and the fourth line 334 on the xz plane are intersected. Similarly, the first end of the third line 333 is connected to the side of the first side wall 3161 of the second angular structure 316b that is close to the first end 311 , the first end of the fourth line is connected to the side close to the second end on the first side wall 3161 of the second angular structure 316b;

The first ends of the fifth line 335 and the sixth line 336 are respectively connected to the second side wall 3162 of the second angular structure 316b, and the second ends of the fifth line 335 and the sixth line 336 are respectively connected to the first limiting structure 17a, wherein the second side wall 3162 of the second angular structure 316b is a side wall arranged on the same side as the second blocking wall 173 of the first limiting structure 17a. The second sidewall 3162 of the structure 316b also extends in the y-axis direction. The projection of the fifth line 335 and the sixth line 336 on the yz plane intersects. The first end of the fifth line 335 is connected to the side of the second side wall 3162 of the second angular structure 316b that is close to the first end 311. The first end of the line 336 is connected to the side of the second side wall 3162 of the second angular structure 316b close to the second end;

The first ends of the seventh line 337 and the eighth line 338 are respectively connected to the second side wall 3162 of the first angular structure 316a, and the second ends of the seventh line 337 and the eighth line 338 are respectively connected to the second limiting structure 17b, wherein the second side wall 3162 of the first angular structure 316a is a side wall disposed on the same side as the second blocking wall 173 of the second limiting structure 17b. The second sidewall 3162 of the structure 316a also extends in the y-axis direction. The projection of the seventh line 337 and the eighth line 338 on the yz plane is intersected, and the first end of the seventh line 337 is connected to the side close to the first end 311 on the second side wall 3162 of the first angular structure 316a. The first end of the wire 338 is connected to the side of the second side wall 3162 of the first angular structure 316a close to the second end.

It can be seen that in the above embodiment, the first line 331 and the third line 333, the second line 332 and the fourth line 334, the fifth line 335 and the seventh line 337, the sixth line 336 and the eighth line 338 are respectively Taking the center of the carrier 31 as a symmetrical point, the center is symmetrically arranged. When the motor is not working, the forces of the eight wires on the carrier 31 can be balanced with each other. Therefore, the carrier 31 can be reliably stabilized in this state.

It should be noted that, in order to improve the reliability of the connection between each wire rod and the carrier 31 and the base 12, in the embodiment of the present application, the motor may further include fixing pieces respectively disposed on the first end and the second end of each wire rod 339, so that the two ends of the wire can be connected to the carrier 31 and the base 12 respectively through the fixing pieces 339, so that the connection strength between the wire and the carrier 31 and the base 12 can be improved, thereby improving the structural reliability of the motor.

As mentioned above, the drive assembly 33 can drive the carrier 31 to move through eight wires, and then drive the lens assembly 20 disposed on the carrier 31 to move, so as to realize the functions of auto focus and optical image stabilization. The following describes the drive of the drive assembly 33 in detail. principle. For the convenience of description, a three-dimensional coordinate system abz is established for the carrier, and in a plane perpendicular to the z-axis, the direction of the center line connecting the first angular structure 316a and the second angular structure 316b is defined as the a-axis direction, and the first limiting structure 17a and the The central connecting direction of the two limiting structures 17b is the b-axis direction.

When power is supplied to Line 1 331, Line 3 333, Line 5 335 and Line 7 337, the four wires shrink and deform, which can respectively exert a pulling force on the carrier along its extension direction. The resultant direction of the pulling force generated by these four lines is the negative direction of the z-axis, so the carrier 31 can be driven to move in the negative direction of the z-axis; The wire 334, the sixth wire 336 and the eighth wire 338 can be stretched and deformed to match the movement of the carrier 31;

When the second line 332, the fourth line 334, the sixth line 336 and the eighth line 338 are respectively energized, the four lines shrink and deform, which can respectively exert a pulling force on the carrier 31 along the extending direction thereof. It can be seen from the force analysis that , the resultant direction of the pulling force generated by these four lines is the positive direction of the z-axis, so the carrier 31 can be driven to move in the positive direction of the z-axis;

In the above two power-on modes, the motor can drive the lens assembly 20 to move along the z-axis direction, so that the distance between the lens assembly 20 and the photosensitive chip can be adjusted to achieve focusing.

When power is applied to the third line 333, the fourth line 334, the fifth line 335 and the sixth line 336, the four lines shrink and deform, and the resultant direction of the pulling force on the carrier 31 is the negative direction of the a-axis, so the carrier can be driven 31 translates in the positive direction of the a-axis; when the first line 331, the second line 332, the seventh line 337 and the eighth line 338 are energized, the four lines shrink and deform, and the resultant direction of the pulling force generated on the carrier 31 is a The axis is in the positive direction, so the carrier 31 can be driven to translate in the negative direction of the a-axis;

In the above two power-on modes, the motor can drive the lens assembly 20 to move along the a-axis direction. At this time, the imaging position on the surface of the photosensitive chip can be adjusted in the a-axis direction, thereby realizing mobile anti-shake in the a-axis direction.

When the first line 331, the second line 332, the fifth line 335 and the sixth line 336 are respectively energized, the four lines shrink and deform, and the resultant direction of the pulling force on the carrier 31 is the positive direction of the b-axis, so the carrier can be driven 31 translates in the positive direction of the b-axis; when power is supplied to the third line 333, the fourth line 334, the seventh line 337 and the eighth line 338, the four lines shrink and deform, and the resultant direction of the pulling force on the carrier is the b-axis Negative direction, so the carrier can be driven to translate in the negative direction of the b-axis;

In the above two power-on modes, the motor can drive the lens assembly 20 to move along the b-axis direction. At this time, the imaging position on the surface of the photosensitive chip can be adjusted in the b-axis direction, thereby realizing mobile anti-shake in the b-axis direction.

When the second line 332, the sixth line 336, the third line 333 and the seventh line 337 are respectively energized, the four lines shrink and deform, and the resultant force of the pulling force on the carrier 31 is a clockwise moment centered on the a-axis, Therefore, the carrier 31 can be driven to rotate clockwise around the a-axis; when the first line 331, the fifth line 335, the fourth line 334 and the eighth line 338 are energized respectively, the four lines shrink and deform, and the pulling force generated by the carrier 31 has no effect. The resultant force is a counterclockwise moment centered on the a-axis, so the carrier 31 can be driven to rotate counterclockwise around the a-axis;

In the above two power-on modes, the motor can drive the lens assembly 20 to rotate along the a-axis direction. At this time, the imaging position on the surface of the photosensitive chip can be adjusted in the b-axis direction, thereby realizing the tilt-type anti-shake in the a-axis direction.

When the second line 332, the eighth line 338, the third line 333 and the fifth line 335 are respectively energized, the four lines shrink and deform, and the resultant force of the pulling force on the carrier 31 is the counterclockwise moment centered on the b-axis, Therefore, the carrier can be driven to rotate counterclockwise around the b-axis; when the first line 331, the seventh line 337, the fourth line 334 and the sixth line 336 are respectively energized, the four lines shrink and deform, and the resultant force of the pulling force generated by the carrier 31 Since it is a clockwise moment centered on the b-axis, the carrier 31 can be driven to rotate clockwise around the b-axis.

Based on the above analysis, it can be seen that by energizing the corresponding wires of the motor, the carrier 31 can be translated along the z-axis direction, the a-axis direction, the b-axis direction, the a-axis direction, and the b-axis direction. Various motion forms such as rotation are used to realize the auto-focusing and optical anti-shake functions of the optical lens 410 .

Similarly, since the carrier 31 moves in the housing 10, there will also be a gap between the carrier 31 and the inner wall of the housing 10. One end of the gap is communicated with the first light-transmitting hole 131, and the other end is connected with the second light-transmitting hole. 121 is connected, and the dust that enters the housing 10 from the first light-transmitting hole 131 can fall on the filter through the second light-transmitting hole 121 along the gap, thereby causing the camera module to produce bad shadows during imaging. . The moving path of the falling dust in the casing 10 is basically the same as that of the camera module in the previous embodiment. First, the dust enters the casing 10 through the first light-transmitting hole 131 , and passes through the first end of the carrier 31 and the top plate 13 . A gap moves into the second gap between the peripheral side of the carrier 31 and the side plate 14, then moves along the second gap to the third gap between the second end of the carrier 31 and the base 12, and finally moves from the third gap to The second light-transmitting hole 121 falls onto the support through the second light-transmitting hole 121, and finally rolls onto the filter by the support.

In view of the above problems, in the embodiment of the present application, the camera module may also include a dust-catching structure for adhering to the falling dust in the housing 10, so as to reduce the risk of bad shadows of the camera module and improve the imaging of the camera module quality. The setting method of the dust catching structure will be described in detail below.

FIG. 16 is a partial cross-sectional view of a camera module provided by another embodiment of the present application, and FIG. 17 is a schematic structural diagram of a cover of the optical lens in FIG. 13 . Referring to FIG. 16 and FIG. 17 together, similar to the foregoing embodiments, in the embodiment of the present application, the dust capturing structure includes a first adsorption structure 41 disposed on the inner wall of the cover body 11 . The first adsorption structure 41 includes a first part 411 arranged on the inner wall of the top plate 13 and a second part 412 arranged on the inner wall of the side plate 14 . The full coverage of the part of the path formed by the slit a; the second part 412 can cover the inner wall of the side plate 14, so as to achieve full coverage of the part of the path formed by the second slit b. When the falling dust enters the housing 10 through the first light-transmitting hole 131 and moves in the direction of the second light-transmitting hole 121 , the first part 411 can initially adsorb the falling dust passing through the first gap a, and then if there is a part that is not adsorbed The falling dust can be supplemented and adsorbed by the second part 412 after entering the second gap b. Since the first slit a and the second slit b are disposed close to the first light-transmitting hole 131 , the first adsorption structure 41 can intercept the dust falling into the optical lens at the source of its moving path, and due to the The adsorption area is relatively large, so a good dust capture effect can be achieved, thereby reducing the risk of dust falling on the optical filter 440 , thereby helping to improve the imaging effect of the camera module 400 .

In addition, in addition to the falling dust entering the housing 10 through the first light-transmitting hole 131, the first adsorption structure 41 also has an adsorption effect on the falling dust generated due to the movement and impact of the carrier 31, so that this part of the falling dust can be reduced. The risk of the two light-transmitting holes 121 falling on the filter 440 .

In some embodiments, the first adsorption structure 41 may be made of a material with electrostatic adsorption capability, such as a polyester material with relatively high surface static electricity. At this time, the first adsorption structure 41 can be formed separately, and then fixed to the inner wall of the cover body 11 by means of bonding or clipping. Alternatively, the first adsorption structure 41 and the cover body 11 can also be integrally formed by a dual-camera injection molding process.

In other embodiments, the first adsorption structure 41 may use adhesive with better adhesion properties, such as glue, tape, adhesive solvent, and the like. In specific implementation, the first adsorption structure 41 may be formed on the inner wall of the cover body 11 by various methods such as gluing, gluing, printing, and attaching.

FIG. 18 is a schematic structural diagram of the base of the optical lens in FIG. 13 . 16 , 17 and 18 together, the dust-catching structure further includes a second adsorption structure 42 disposed on the base 12 . During specific implementation, the second adsorption structure 42 can cover the side of the base 12 facing the top plate 13 to This achieves full coverage of the part of the path formed by the third slit c. The second adsorption structure 42 can adsorb the falling dust entering the third gap c. The falling dust includes the part of the falling dust that enters the casing 10 from the outside and is not adsorbed by the first adsorption structure 41, and the carrier 31 is impacted during the movement process. Part of the dust produced. Since the third slit c is disposed close to the second light-transmitting hole 121 , the second adsorption structure 42 can intercept the falling dust at the end of its moving path in the optical lens, thereby further reducing the falling dust falling from the second light-transmitting hole 121 . Risk on filter 440.

In addition, when the base 12 is provided with the first limiting structure 17a and the second limiting structure 17b, the second adsorption structure 42 can be specifically arranged on the base 12 to avoid the first limiting structure 17a and the second limiting structure 17b area, and cover the area on the base 12 that avoids the first limiting structure 17a and the second limiting structure 17b. At this time, the first limiting structure 17a and the second limiting structure 17b can be respectively made of materials that are not easy to generate dust, such as LCP or plastic, so as to reduce the dust falling when they collide with the carrier 31 .

In some embodiments, the second adsorption structure 42 may be made of a material with electrostatic adsorption capability, such as a polyester material with relatively large surface static electricity. At this time, the first adsorption structure 42 can be separately fabricated and formed, and then fixed on the base 12 by means of bonding or clipping. Alternatively, the first adsorption structure and the base 12 can also be integrally formed by a dual-camera injection molding process.

In other embodiments, the second adsorption structure 42 may use an adhesive with better adhesion properties, such as glue, adhesive tape, viscous solvent, and the like. During specific implementation, the second adsorption structure 42 may be formed on the base 12 by various methods such as gluing, gluing, printing, and attaching.

Similar to the foregoing embodiments, the dust-catching structure may further include a third adsorption structure 43 , the third adsorption structure 43 is disposed on the side of the support 450 facing the optical lens, and the third adsorption structure 43 is disposed around the filter 440 . In this way, even if the dust in the housing 10 falls on the support member 450 through the second light-transmitting hole 121, it can be adsorbed and fixed by the third adsorption structure 43, thereby reducing the risk of the dust moving to the filter 440. The imaging effect of the camera module 400 is improved. The materials and manufacturing methods of the third adsorption structure 43 are similar to those of the first adsorption structure 41 and the second adsorption structure 42 , which will not be repeated here.

In this embodiment, the first adsorption structure 41 , the second adsorption structure 42 and the third adsorption structure 43 can also be formed by using UV glue. At this time, the assembly process of the camera module and the first adsorption structure 41 and the second adsorption structure The formation steps of the structure 42 and the third adsorption structure 43 are basically the same as those in the foregoing embodiments, and will not be repeated here.

In addition, the first adsorption structure 41 , the second adsorption structure 42 and the third adsorption structure 43 can be formed by dipping glue. For the specific operation process, please refer to the relevant descriptions of the foregoing embodiments, which will not be repeated here. The uneven first adsorption structure 41, the second adsorption structure 42 and the third adsorption structure 43 are formed by the dipping process, which can effectively intercept the falling dust, reduce the risk of falling dust falling on the filter, and improve the camera mode. group imaging quality.

Referring to FIG. 19 , FIG. 19 is another partial cross-sectional view of the electronic device 1 in FIG. 1 at the line A-A. In some embodiments of the present application, in order to reduce the size of the mobile phone in the thickness direction, the camera module 400 can also be designed with a periscope structure. This structure can reduce the components of the camera module 400 distributed in the thickness direction of the mobile phone, so that the The camera module 400 can be applied to a mobile phone with an ultra-thin design.

FIG. 20 is a schematic structural diagram of the camera module in FIG. 19 , and FIG. 21 is a partial exploded schematic view of the camera module in FIG. 19 . The camera module 400 may include an optical lens 410 , a module circuit board 420 , a photosensitive chip 430 , a filter 440 and a reflection component 460 . It should be noted that the optical axis direction of the optical lens 410 is the same as the optical axis direction of the camera module 400 . The structure and relative positional relationship of the module circuit board, the photosensitive chip and the optical filter can refer to the setting method of the above-mentioned embodiment, which will not be repeated here.

FIG. 22 is another partial exploded schematic view of the camera module in FIG. 19 . Referring to FIG. 21 and FIG. 22 together, the reflection component 460 is fixed on the light incident side of the optical lens 410 . The reflection component 460 is used for reflecting ambient light, so as to transmit the ambient light into the optical lens 410 . In this embodiment, the reflection component 460 may be used to reflect ambient light propagating along the z-axis direction to ambient light propagating along the x-axis direction. In other embodiments, the reflection component 460 may also be used to reflect ambient light propagating in the z-axis direction to ambient light propagating in other directions.

The reflecting component 460 includes a prism motor 461 and a reflecting member 462 . The prism motor 461 is fixed on the light incident side of the optical lens 410 , the prism motor 461 is provided with a mount 463 , and the reflector 462 is mounted on the mount 463 . The reflector 462 may be a triangular prism or a reflector. The reflecting member 462 in this embodiment is described by taking a triangular prism as an example. It should be noted that the reference numerals of the triangular prisms below are the same as the reference numerals of the reflector 462 .

The triangular prism 462 includes a light incident surface 4621 , a reflective surface 4622 and a light emitting surface 4623 , and the reflective surface 4622 is connected between the light incident surface 4621 and the light emitting surface 4623 . The light incident surface 4621 is disposed opposite to the light entrance hole, and the light exit surface 4623 is disposed opposite to the light incident side of the optical lens 410 . At this time, when the ambient light enters the interior of the casing through the light inlet hole, the ambient light enters the triangular prism 462 through the light incident surface 4621 and is reflected at the reflective surface 4622 of the triangular prism 462 . At this time, ambient light propagating in the z-axis direction is reflected to propagate in the x-axis direction. Finally, the ambient light is transmitted to the outside of the triangular prism 462 through the light emitting surface 4623 of the triangular prism 462 and enters the optical lens.

It can be understood that, by arranging the triangular prism 462 on the prism motor 461, the triangular prism 462 is used to reflect the ambient light propagating in the z-axis direction to propagating in the x-axis direction. In this way, the components of the camera module 400 that receive ambient light propagating along the x-axis direction can be arranged along the x-axis direction. Since the size of the electronic device in the x-axis direction is relatively large, the arrangement of the components in the camera module 400 in the x-axis direction is more flexible and simple. In this embodiment, the optical axis direction of the camera module 400 is the x-axis direction. In other embodiments, the optical axis direction of the camera module 400 may also be the y-axis direction.

Please refer to FIG. 22 again, in conjunction with FIG. 19 , the triangular prism 462 can be rotatably assembled to the prism motor 461 . In this embodiment, the triangular prism 462 can rotate on the xz plane with the y-axis as the rotation axis. In addition, the triangular prism 462 can also be rotated in the xy plane with the z axis as the rotation axis. When the transmission path of the ambient light is deflected, the prism motor 461 can drive the triangular prism 462 to rotate, so that the triangular prism 462 can be used to adjust the transmission path of the ambient light, reduce or avoid the deflection of the transmission path of the ambient light, thereby ensuring the camera module 400 Have better shooting effect. Therefore, the reflection component 460 can play an optical anti-shake effect.

In other embodiments, the triangular prism 462 can also be fixedly connected to the prism motor 461 or can also be slidably connected to the prism motor 461 .

FIG. 23 is an exploded schematic diagram of the optical lens of the camera module shown in FIG. 20 , and FIG. 24 is an exploded schematic diagram of a partial structure of the optical lens shown in FIG. 23 . 23 and 24 together, the optical lens 410 includes a housing 10, a lens assembly 20 disposed in the housing 10, and a motor 30. The motor 30 can drive the lens assembly 20 to move along the x-axis direction to adjust the lens assembly 20 The distance between it and the photosensitive chip, so that the camera module can realize the function of automatic focusing.

23 and 24 , the housing 10 includes a cover 11 and a base 12 , the cover 11 is covered on the base 12 , and the cover 11 and the base 12 are fixedly connected to form a space for accommodating the above-mentioned lens assembly 20 . The cover body 11 includes a top plate 13 , a first side plate 141 , and a second side plate 142 and a third side plate 143 arranged opposite to each other. The first side plate 141 is located on the side of the cover body 11 facing the reflector assembly. Connected to the second side plate 142 and the third side plate 143 , the top plate 13 is connected to the second side plate 142 and the third side plate 143 , respectively.

The first side plate 141 is provided with a first light-transmitting hole 131 , and the first light-transmitting hole 1411 can communicate the inside of the casing 10 to the outside of the casing 10 . The first light-transmitting hole 1411 may be approximately rectangular as shown in FIG. 23 , or may be a circle or other regular or irregular polygons, or the like. As shown in FIG. 22 , the first light-transmitting hole 1411 is disposed opposite to the light-emitting surface 4623 of the triangular prism 462 , and the ambient light is transmitted into the housing 10 through the first light-transmitting hole 1411 after being turned by the triangular prism 462 .

The base 12 includes a bottom plate 122 and a fourth side plate 123, the bottom plate 122 and the top plate 13 are arranged opposite to each other, and the bottom plate 122 is sealed with the second side plate 142 and the end of the third side plate 143 away from the top plate 13; One side plate 141 is arranged opposite to each other, and the fourth side plate 123 is provided with a second light transmission hole 1231 opposite to the first light transmission hole 1411 , and the second light transmission hole 1231 can also communicate the inside of the casing 10 to the casing Outside 10 , ambient light can be transmitted to the filter and the photosensitive chip in turn through the second light-transmitting hole 1231 . The shape of the second light-transmitting hole 1231 may be a rectangle, a circle, or other regular or irregular polygons, and the like.

In addition, the base 12 may further include a first connecting plate 124 and a second connecting plate 125 disposed opposite to each other. The first connecting plate 124 and the second connecting plate 125 are respectively connected to the fourth side plate 123 , wherein the first connecting plate 124 is connected to the fourth side plate 123 . The second side plate 142 is disposed on the same side, and the first connecting plate 124 is located on the inner side of the second side plate 142; the second connecting plate 125 and the third side plate 143 are disposed on the same side, and the second connecting plate 125 is located on the third side plate Inside of 143. With this arrangement, when the cover body 11 and the base 12 are assembled, the first connecting plate 124 and the second side plate 142 and between the second connecting plate 125 and the third side plate 143 can be bonded and fixed. Therefore, the bonding area between the cover body 11 and the base 12 can be increased, and the structural reliability of the camera module can be improved.

In some embodiments, the base 12 is further provided with a fixed carrier 126 , the fixed carrier 126 is fixed on the bottom plate 122 at an end close to the first side plate 141 , and the fixed carrier 126 is connected to the first connecting plate 124 and the second connecting plate 125 respectively. interval setting. The fixing carrier 126 is provided with a first mounting hole 1261 , and two ends of the first mounting hole 1261 are respectively opposite to the first light-transmitting hole 1411 and the second light-transmitting hole 1231 . The lens assembly 20 includes a first lens barrel 21a and a first lens 22a disposed in the first lens barrel 21a, the first lens barrel 21a is disposed in the first mounting hole 1261, and the light entrance side of the first lens barrel 21a faces the first lens barrel 21a. A light-transmitting hole 1411 is provided, and the light-emitting side of the first lens barrel 21 a is provided toward the second light-transmitting hole 1231 . The two side surfaces of the first lens 22a are respectively disposed toward the light entrance side and the light exit side of the first lens barrel 21a. At this time, the first lens 22a is a fixed-focus lens. In addition, the number of the first lenses 22a may be one or more. When there are multiple first lenses 22a, the multiple first lenses 22a may be coaxially arranged and sequentially arranged along the length direction of the first lens barrel 21a.

Continuing to refer to FIGS. 23 and 24 , the motor 30 is disposed within the housing and includes a moving carrier 34 , a guide rail 35 and a drive assembly 36 . The number of the guide rails 35 may be two, and the two guide rails 35 are respectively extended in the housing 10 along the optical axis direction (ie, the x-axis direction). During specific implementation, first fixing holes 1262 are respectively formed on both sides of the fixing carrier 126 , and second fixing holes (not shown in the figure) which are respectively opposite to the two first fixing holes 1262 are formed on the fourth side plate 123 , One ends of the two guide rails 35 are respectively fixed in the corresponding first fixing holes 1262, and the other ends are respectively fixed in the corresponding second fixing holes.

The moving carrier 34 is slidably assembled on the guide rails 35. Specifically, sliding holes (not shown in the figure) are respectively opened on both sides of the moving carrier 34. 34 is slidable relative to the guide rail 35 . The moving carrier 34 is further provided with a second installation hole 341 , and two ends of the second installation hole 341 are respectively opposite to the first light-transmitting hole 1411 and the second light-transmitting hole 1231 . The lens assembly 20 further includes a second lens barrel 21b and a second lens 22b disposed in the second lens barrel 21b, the second lens barrel 21b is disposed in the second mounting hole 341, and the light entrance side of the second lens barrel 21b faces The first light-transmitting hole 1411 is disposed, and the light-emitting side of the second lens barrel 21b is disposed toward the second light-transmitting hole 231 . The two side surfaces of the second lens 22b are respectively disposed toward the light entrance side and the light exit side of the second lens barrel 21b. When the moving carrier 34 slides relative to the guide rail 35, the second lens 22b carried thereon can also move in the x-axis direction, thereby enabling the camera module to realize the automatic focusing function.

When the drive assembly 36 is specifically disposed, the drive assembly 36 may include a magnet 361 and a coil 362. The magnet 361 is disposed inside the housing 10, and may be fixed on the inner wall of the second side plate 142. The coil 362 is disposed on the moving carrier 34 toward the first On one side surface of the two side plates 143 , the coil 362 is disposed opposite to the magnet 361 . The coil 362 can be electrically connected to the module circuit board. When the module circuit board outputs a current signal to the coil 362, the coil 362 can generate an ampere force along the x-axis direction, thereby driving the moving carrier 34 and the first carrier carried on the moving carrier 34. The second lens 22b moves.

It can be understood that, by passing current signals in different directions to the coil 362, the coil 362 can generate an ampere force in the positive direction of the x-axis and an ampere force in the negative direction of the x-axis, so that the carrier 31 can be driven along the positive direction of the x-axis or x-axis. The axis moves in the negative direction.

In addition, in other embodiments, the magnet 361 may also be disposed on the inner wall of the third side plate 143 , and the coil 362 is disposed on the side surface of the moving carrier 34 facing the third side plate 143 in this case. Of course, in order to improve the driving capability of the drive assembly 36 , the drive assembly 36 may further include two sets of magnet-coil structures, in which case the two sets of magnet-coil structures may be disposed on both sides of the moving carrier 34 respectively.

Similarly, since the moving carrier 34 moves in the housing 10, there will also be a gap between the moving carrier 34 and the inner wall of the housing 10. One end of the gap is connected to the first light-transmitting hole 1411, and the other end is connected to the second light-transmitting hole 1411. The light hole 1231 is connected, and the dust that enters the housing 10 from the first light transmission hole 1411 can fall on the filter through the second light transmission hole 1231 along the gap, thereby causing the camera module to produce bad shadows during imaging. The phenomenon. After the falling dust enters the casing 10 through the first light-transmitting hole 1411 , it moves from the gap between the cover 11 and the fixed carrier 126 to the cavity behind the fixed carrier 126 , and the cavity is the moving space of the mobile carrier 34 . After entering the cavity, the falling dust can continue to move towards the direction of the second light-transmitting hole 1231 through the gap between the mobile carrier 34 and the cover body 11 and the base 12, and fall on the support through the second light-transmitting hole 1231, Finally, the support is rolled onto the filter.

In view of the above-mentioned problems, in the embodiment of the present application, the camera module can also include a dust-catching structure for adhering the falling dust in the housing, to reduce the risk of bad shadows of the camera module, and improve the imaging quality of the camera module. The setting method of the dust catching structure will be described in detail below.

FIG. 25 is a partial cross-sectional view of another camera module provided by an embodiment of the present application, and FIG. 26 is a schematic structural diagram of the cover of the optical lens shown in FIG. 23 . In the embodiment of the present application, the dust catching structure includes a first adsorption structure 41 disposed on the inner wall of the cover body 11 . The first adsorption structure 41 includes a first part 411 arranged on the inner wall of the top plate 13 and a second part 412 arranged on the inner wall of each side plate. In specific implementation, the first part 411 can cover the inner wall of the top plate 13, and the second part 412 can cover the inner wall of the top plate 13. The inner wall of the first side plate 141 , the inner wall of the second side plate 142 and the inner wall of the third side plate 143 . When the falling dust enters the housing 10 through the first light-transmitting hole 1411 and moves in the direction of the second light-transmitting hole 1231 , the adsorption effect of the first part 411 and the second part 412 can reduce the amount of dust entering the rear side of the fixed carrier 126 . The dust falling in the cavity can achieve a good dust capturing effect, thereby reducing the risk of falling dust falling on the optical filter 440 , which is beneficial to improve the imaging effect of the camera module 400 .

In addition, in addition to the falling dust entering the housing 10 through the first light-transmitting hole 1411 , the first adsorption structure 41 also has an adsorption effect on the falling dust caused by the movement and impact of the moving carrier 34 , thereby reducing the passage of this part of the falling dust. The risk of the second light-transmitting hole 1231 falling on the filter 440 .

In some embodiments, the first adsorption structure 41 may be made of a material with electrostatic adsorption capability, such as a polyester material with relatively high surface static electricity. At this time, the first adsorption structure 41 can be formed separately, and then fixed to the inner wall of the cover body 11 by means of bonding or clipping. Alternatively, the first adsorption structure 41 and the cover body 11 can also be integrally formed by a dual-camera injection molding process.

In other embodiments, the first adsorption structure 41 may use adhesive with better adhesion properties, such as glue, tape, adhesive solvent, and the like. In specific implementation, the first adsorption structure 41 may be formed on the inner wall of the cover body 11 by various methods such as gluing, gluing, printing, and attaching.

Referring to FIG. 27 , FIG. 27 is a schematic structural diagram of a part of the optical lens shown in FIG. 23 . The dust-catching structure may further include a second adsorption structure 42 disposed on the inner wall of the base 12 . In a specific implementation, the second adsorption structure 42 includes a third portion 421 disposed on the inner wall of the bottom plate 122 and an inner wall disposed on the fourth side plate 123 . The fourth part 422 , wherein the third part 421 can cover the inner wall of the bottom plate 122 , and the fourth part 422 can cover the inner wall of the fourth side plate 123 . In addition, when the base 12 further includes the first connecting plate 124 and the second connecting plate 125 , the second adsorption structure 42 may further include a fifth portion ( Not shown in the figure), in specific implementation, the fifth part covers the inner wall of the first connecting plate 124 and the inner wall of the second connecting plate 125 . With this arrangement, the first adsorption structure 41 and the second adsorption structure 42 can fully cover the inner wall of the cavity on the rear side of the fixed carrier 126, so that a good adsorption effect can be achieved for the falling dust entering the cavity 126, reducing the The risk of dust falling from the second light-transmitting hole 1231 .

In some embodiments, the second adsorption structure 42 may be made of a material with electrostatic adsorption capability, such as a polyester material with relatively large surface static electricity. At this time, the second adsorption structure 42 can be separately fabricated and formed, and then fixed to the inner wall of the base 12 by means of bonding or clipping. Alternatively, the second adsorption structure 42 and the base 12 can also be integrally formed by a dual-camera injection molding process.

In other embodiments, the second adsorption structure 42 may use an adhesive with better adhesion properties, such as glue, adhesive tape, viscous solvent, and the like. During specific implementation, the second adsorption structure 42 may be formed on the inner wall of the base 12 by various methods such as gluing, gluing, printing, and attaching.

25 and 27 , the dust-catching structure may further include a third adsorption structure 43 , which is disposed on the side of the support member 450 facing the optical lens, and is disposed around the filter 440 . With this arrangement, even if the dust in the housing 10 falls onto the support through the second light-transmitting hole 1231 , it can be adsorbed and fixed by the third adsorption structure 43 , thereby further reducing the movement of the dust to the filter 440 . risk, and the imaging effect of the camera module 400 is improved. The materials and manufacturing methods of the third adsorption structure 43 are similar to those of the first adsorption structure 41 and the second adsorption structure 42 , which will not be repeated here.

22 , 23 , and FIGS. 25 to 27 together, taking the first adsorption structure 41 , the second adsorption structure 42 and the third adsorption structure 43 as UV glue as an example, combined with the camera module 400 The assembly process specifically describes the formation steps of each adsorption structure.

Step 1, the assembly and process of the optical lens. First, fix the motor 30 on the base 12, then vibrate and wash the semi-finished product composed of the motor 30 and the base 12 to remove the dirt on the surface of the semi-finished product; install the lens assembly 20 on the fixed carrier 126 and the moving carrier 34, and then carry out Plasma cleaning to remove the dirt on the surfaces of each structure; forming a second adsorption structure 42 on the inner wall of the base 12, and forming a first adsorption structure 41 on the inner wall of the cover 11, and then fixing the cover 11 and the base 12 to complete the optical lens 410 assembly;

Step 2, assembling and processing of the filter 440 and the support 450 . The filter 440 is installed on the support 450, and the combined structure of the filter 440 and the support 450 is washed with water to remove the contamination on the surface of the combined structure; then plasma cleaning is performed to further remove the contamination on the surface of the combined structure ; The third adsorption structure 43 is formed on the side of the support 450 for bonding with the optical lens 410, and the third adsorption structure 43 is set around the filter 440; the support 450 is bonded and fixed with the optical lens 410;

Step 3, fixing the module circuit board 420 encapsulated with the photosensitive chip 430 on the side of the support member 450 away from the optical lens 410;

In step 4, the reflection component 460 is fixed on the light incident side of the optical lens 410 .

In the above steps, the first adsorption structure 41 , the second adsorption structure 42 and the third adsorption structure 43 can be formed by dipping glue. For the specific operation process, please refer to the relevant descriptions of the foregoing embodiments, which will not be repeated here. The uneven first adsorption structure 41, the second adsorption structure 42 and the third adsorption structure 43 are formed by the dipping process, which can effectively intercept the falling dust, reduce the risk of falling dust falling on the filter, and improve the camera mode. group imaging quality.

The above are only specific embodiments of the present application, but the protection scope of the present application is not limited to this. Any person skilled in the art can easily think of changes or replacements within the technical scope disclosed in the present application, and should cover within the scope of protection of this application. Therefore, the protection scope of the present application shall be subject to the protection scope of the claims.

Claims (22)

An optical lens, characterized in that it comprises a casing, a motor, a lens assembly and a first adsorption structure, wherein: The housing includes a base and a cover fixed on one side of the base, the cover is provided with a first light-transmitting hole, and the base is provided with a second light-transmitting hole opposite to the first light-transmitting hole. Two light-transmitting holes; The motor is arranged in the casing, and includes a carrier and a driving assembly, the carrier is provided with a mounting hole corresponding to the position of the first light-transmitting hole, and the driving assembly is used to drive the carrier to move in the casing ; the lens assembly is arranged in the mounting hole; The first adsorption structure is arranged on the inner wall of the cover body and is used for adsorbing the falling dust in the casing. The optical lens of claim 1, wherein the first adsorption structure is an adhesive layer. The optical lens of claim 2, wherein the surface of the first adsorption structure is honeycomb-shaped. The optical lens according to any one of claims 1 to 3, wherein the first adsorption structure is an ultraviolet curing adhesive. The optical lens of claim 1, wherein the material of the first adsorption structure is a material with electrostatic adsorption function. The optical lens according to any one of claims 1 to 5, wherein the cover body comprises a top plate and a side plate surrounding the peripheral side of the top plate; The first adsorption structure includes a first part arranged on the inner wall of the top plate and a second part arranged on the inner wall of the side plate, the first part covers the inner wall of the top plate, and the second part covers the inner wall of the side plate . The optical lens according to any one of claims 1 to 6, further comprising a second adsorption structure, and the second adsorption structure is disposed on a side of the base facing the cover. The optical lens according to any one of claims 1 to 7, wherein the carrier is arranged at intervals from the inner wall of the housing; The motor further includes elastic pieces, which are respectively connected with the carrier and the housing to support the carrier. 8. The optical lens of claim 8, wherein the driving component comprises a coil and a magnet, the coil is provided on the peripheral side surface of the carrier, the magnet is provided on the inner wall of the housing, and the The magnet is arranged opposite to the coil. The optical lens of claim 8, wherein the driving assembly comprises eight wires with retractable lengths, and two ends of the eight wires are respectively connected to the carrier and the housing, and the driving assembly uses The carrier is driven to move as the length of the wire extends and contracts. The optical lens according to any one of claims 1 to 7, wherein the motor further comprises a guide rail, the guide rail is fixed in the housing, and the guide rail is directed to a direction along the first light-transmitting hole. The carrier extends in the direction of the second light-transmitting hole, and the carrier is slidably assembled on the guide rail. A camera module, characterized by comprising the optical lens according to any one of claims 1 to 11, and a photosensitive chip, a support, a filter and a third adsorption structure, wherein: The support is fixed on the side of the optical lens where the second light-transmitting hole is opened, the filter is arranged on the support, and the filter and the second light-transmitting hole relative position; The photosensitive chip is arranged on the side of the filter away from the optical lens; The third adsorption structure is disposed on the side of the support member facing the optical lens, and the third adsorption structure is disposed around the filter. The camera module according to claim 12, further comprising a reflection component, the reflection component is fixed on the side of the optical lens where the first light-transmitting hole is opened; The reflecting assembly includes a prism motor and a reflecting member, the reflecting member is rotatably assembled to the prism motor, and the reflecting member is used for diverting ambient light and injecting it into the first light-transmitting hole. An electronic device is characterized by comprising a casing and a camera module according to claim 12 or 13, wherein the camera module is arranged in the casing. A method for assembling an optical lens as claimed in claim 1, characterized in that, comprising: The carrier is arranged on one side of the base, and the mounting hole of the carrier is positioned opposite to the second light-transmitting hole of the base; A first adsorption structure is formed on the inner wall of the cover body, the cover body is fixed on the side of the base where the carrier is arranged, and the first light-transmitting hole of the cover body is positioned opposite to the installation hole; Set the lens module in the mounting hole. 16. The assembly process method according to claim 15, wherein the forming the first adsorption structure on the inner wall of the cover body specifically comprises: sequentially performing a dipping operation on each area of the inner wall of the cover body to form the first adsorption structure. adsorption structure; Wherein, the dipping operation includes: After dipping the glue with the glue head of the glue applicator, move the glue head into the cover, so that the glue on the surface of the glue head contacts an area of the inner wall of the cover, so that the Part of the glue on the surface of the dipping head is transferred to the inner wall of the cover; The glue-dipping head is moved in a direction away from the inner wall of the cover body to form a honeycomb-shaped glue layer in the corresponding area of the inner wall of the cover body. The assembly process method according to claim 16, wherein the rubber dipping head is made of soft rubber. The assembly process method according to claim 16 or 17, wherein the material of the glue is ultraviolet light curing glue. The assembly process method according to claim 18, wherein after the first adsorption structure is formed on the inner wall of the cover body, the assembly process method further comprises: The first adsorption structure is cured by ultraviolet light, and the exposure energy required for the ultraviolet light curing is 1000-3000 mJ/cm ² . The assembly process method according to claim 19, wherein the adhesive force of the first adsorption structure after curing is not less than 0.2 mN/mm ² . The assembly process method according to any one of claims 16 to 20, wherein before the cover body is fixed on the side of the base where the carrier is provided, the assembly process method further comprises: A second adsorption structure is formed on the side surface of the base on which the carrier is provided. The assembly process method according to claim 21, wherein the second adsorption structure is formed by a glue dipping operation.

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