WO2019077990A1 - Substrate laminate, and imaging device - Google Patents

Abstract

This substrate laminate is provided with: an imaging element mounting substrate for mounting an imaging element; and a flexible wiring circuit board which is capable of being electrically connected to an actuator module, and which is electrically connected to the imaging element mounting substrate. The imaging element mounting substrate is provided with metal wiring. The thickness of the metal wiring is 12 µm or lower. The total thickness of the imaging element mounting substrate is 60 µm or lower. A portion of the flexible wiring circuit board is provided in a region of the imaging element mounting substrate other than a mounting region where the imaging element is mounted.

Description

Substrate laminate and imaging device

The present invention relates to a substrate laminate and an imaging device including the substrate laminate.

2. Description of the Related Art Conventionally, an imaging device such as a camera module mounted on a cellular phone or the like generally includes an optical lens, a housing for housing and holding the optical lens, an imaging element such as a CMOS sensor or a CCD sensor, and an imaging element And an imaging element mounting substrate for electrically connecting to external wiring. The imaging element is mounted on a substantially central portion of the imaging element mounting substrate, and the housing is disposed on the peripheral end of the imaging element mounting substrate so as to surround the imaging element. Patent Document 1 discloses such a substrate.

JP 2005-210628 A

With the demand for downsizing of a mobile phone, an imaging device used for a mobile phone or the like is required to be further reduced in thickness (reduced in height). One way to reduce the height of the imaging device is to reduce the thickness of the imaging element mounting substrate.

By the way, in the image pickup element mounting substrate, generally, a thick rigid wired circuit board in which the entire back surface is reinforced with a metal plate, and a thin flexible wired circuit board (FPC) in which the entire back surface is not reinforced with a metal plate. Two types are used.

Since the FPC is not reinforced by a metal plate, it can be thinner than a rigid wired circuit board. However, since the materials of the imaging device and the imaging device mounting substrate are different from each other, thermal distortion occurs when the imaging unit including the imaging device and the imaging device mounting substrate is placed in an external environment in which high temperature and low temperature are repeated. In some cases, a warp may occur in the imaging unit. As a result, a shift occurs in the position of the imaging element and the optical lens, causing a problem that the image is distorted.

Therefore, it is considered to use an FPC in which the total thickness of the FPC and the thickness of the metal wiring are extremely reduced. Such an FPC can suppress the occurrence of warpage because the thermal stress is significantly reduced.

Incidentally, in the imaging device, actuator modules such as an auto-focusing element and a camera shake correction mechanism are also disposed. For this reason, it is necessary to supply more current as the entire imaging device.

However, in the imaging element mounting substrate, it is difficult to flow more current because the metal wiring is made thinner. As a result, the actuator module can not be disposed (mounted).

The present invention is to provide a substrate laminate and an imaging device in which occurrence of warpage can be suppressed and an actuator module can be disposed.

The present invention [1] can be electrically connected to an imaging element mounting substrate for mounting an imaging element, and an actuator module requiring a larger amount of current than the imaging element, and the imaging element mounting substrate And a flexible printed circuit board electrically connected, the imaging element mounting board has a metal wiring, the thickness of the metal wiring is 12 μm or less, and the total thickness of the imaging element mounting board is 60 μm It is the following, and a part of the flexible printed circuit board includes a substrate laminate disposed in an area other than a mounting area where the imaging element is mounted on the imaging element mounting board.

According to this substrate laminate, since the thickness of the metal wiring of the imaging device mounting substrate is 12 μm or less and the total thickness of the imaging device mounting substrate is 60 μm or less, the imaging device mounting substrate and the metal wiring thereof are very thin. Therefore, in accordance with the thermal expansion of the imaging device, the imaging device mounting board can be flexibly deformed to suppress the generation of thermal stress. As a result, the occurrence of warpage can be suppressed.

Further, a part of the flexible printed circuit board is disposed in an area other than the mounting area where the imaging element is mounted on the imaging element mounting board. Therefore, the actuator module can be electrically connected directly to the flexible printed circuit board without passing through the imaging device mounting board. Therefore, the actuator module can be arranged and operated on the substrate stack.

The present invention [2] includes the substrate laminate according to [1], wherein the part of the flexible printed circuit board is disposed in a region on which the imaging device is mounted.

According to this substrate laminate, the height of the imaging device in which the imaging device is mounted on the imaging device mounting substrate can be reduced.

The present invention [3] is the substrate laminate body according to [1] or [2], wherein the part of the flexible printed circuit board is disposed along at least one end of the imaging element mounting substrate Contains.

According to this substrate laminate, since the contact area between the imaging element mounting substrate and the flexible printed circuit board is large, the bonding strength is high. As a result, even when the substrate stack is bent, separation and breakage of the imaging device mounting substrate and the flexible printed circuit board can be suppressed.

The present invention [4] is the substrate laminate according to any one of [1] to [3], wherein the part of the flexible printed circuit board is disposed so as to surround four sides of the mounting area. Contains.

According to this substrate laminate, since the contact area between the imaging element mounting substrate and the flexible printed circuit board is larger, the bonding strength is further enhanced. As a result, even if the substrate stack is bent, separation and breakage of the imaging device mounting substrate and the flexible printed circuit can be more reliably suppressed.

The present invention [5] includes the substrate laminate according to any one of [1] to [4], further including a rigid substrate disposed in the region on the side where the imaging device is mounted.

According to this substrate laminate, since the rigid rigid substrate is disposed on the imaging device mounting substrate, it is possible to more reliably suppress the warping of the imaging device mounting substrate.

The present invention [6] includes the substrate laminate according to [5], wherein the rigid substrate can be electrically connected to the actuator module.

According to this substrate laminate, since the actuator module can be directly mounted on a hard rigid substrate, the actuator module can be stably disposed on the substrate laminate with the rigid substrate, and as a result, it can be easily mounted. be able to.

The present invention [7] is any one of [1] to [6], wherein in the imaging element mounting substrate, the equivalent elastic modulus of the wiring area in which the metal wiring is disposed is 5 GPa or more and 55 GPa or less It contains the substrate laminate of the description.

According to this substrate laminate, since the elastic modulus of the wiring region is small and flexible, it is possible to suppress the warp of the imaging element mounting substrate well and reliably.

The present invention [8] comprises the substrate laminate according to any one of [1] to [7], an imaging device mounted on the substrate laminate, and the imaging device mounted on the substrate laminate. And an imaging device comprising an actuator module that requires more current.

According to this imaging device, warpage of the imaging device can be suppressed, and the actuator module can be operated.

The substrate laminate and the imaging device of the present invention can suppress the occurrence of warpage of the imaging element mounting substrate. In addition, since more current can flow, the actuator module can be mounted and operated.

1A-B show a first embodiment of a substrate laminate according to the present invention, FIG. 1A is a plan view, and FIG. 1B is a cross-sectional view taken along AA in FIG. 1A. FIG. 2 shows a plan view of a mounting substrate of the substrate laminate shown in FIG. 1A. FIG. 3 shows a cross-sectional view taken along the line AA of FIG. 2A. 4A-B are cross-sectional views of the substrate laminate shown in FIG. 1A, FIG. 4A is a cross-sectional view of B-B, and FIG. 4B is a cross-sectional view of C-C. 5A-B show an imaging unit provided with the substrate laminate shown in FIG. 1A, FIG. 5A is a plan view, and FIG. 5B is a cross-sectional view taken along AA in FIG. 5A. 6A-B show an imaging device provided with the substrate laminate shown in FIG. 1A, FIG. 6A is a plan view, and FIG. 6B is a cross-sectional view taken along AA in FIG. 6A. 7A-B show an imaging device provided with a second embodiment of the substrate laminate of the present invention (a form in which a connection substrate is provided below the peripheral region), FIG. 7A is a plan view, and FIG. 7B is FIG. 7A. Sectional view on AA of FIG. 8A-B show an imaging device provided with a third embodiment (a form provided with a rigid substrate) of the substrate laminate of the present invention, FIG. 8A is a plan view, and FIG. 8B is a cross section taken along AA of FIG. Figure shows. FIG. 9A-B shows an imaging device provided with a modification of the third embodiment of the substrate laminate of the present invention (a form in which a rigid substrate is disposed on the upper side of a connection substrate), and FIG. 9A is a plan view, a diagram 9B shows a cross-sectional view taken along line AA of FIG. 9A. FIG. 10 is a plan view of a fourth embodiment of the substrate laminate according to the present invention (a form in which a connection substrate is disposed along one end of a mounting substrate). FIG. 11 is a plan view of a fifth embodiment of the substrate laminate according to the present invention (a form in which connection substrates are arranged along the two ends of the mounting substrate). FIG. 12 is a plan view of a sixth embodiment of the substrate laminate according to the present invention (a form in which connection substrates are arranged along the three ends of the mounting substrate).

In FIG. 1A, the left-right direction in the drawing is the front-rear direction (first direction, longitudinal direction), the left side in the drawing is the front side (one side in the first direction), and the right side in the drawing is the rear side (the other side in the first direction). The vertical direction of the drawing is the left-right direction (the second direction perpendicular to the first direction, width direction), the upper side of the drawing is the left side (one side in the second direction), and the lower side of the drawing is the right side (the other side in the second direction). . The paper thickness direction is the vertical direction (thickness direction, third direction orthogonal to the first direction and the second direction), and the paper front side is the upper side (thickness direction one side, third direction one side), and the paper rear side is It is the lower side (thickness direction other side, third direction other side). Specifically, it conforms to the directional arrow in each figure.

First Embodiment
1. Substrate Stack A first embodiment of a substrate stack according to the present invention will be described with reference to FIGS. 1A-4B.

The substrate laminate 1 of the first embodiment shown in FIG. 1A is a wired circuit board for mounting an imaging device 41 (described later), and does not have the imaging device 41 yet. The substrate laminate 1 includes an imaging element mounting substrate 2, an external device connection flexible wiring circuit substrate 3 as an example of a flexible wiring circuit substrate, and a connector 4.

(Image sensor mounting board)
The imaging device mounting board 2 (hereinafter, referred to as mounting board) is a flexible printed circuit board for mounting the imaging device 41. As shown in FIGS. 1A-B and 2, it has a flat plate shape (sheet shape) having a substantially rectangular shape in plan view extending in the front-rear direction and the left-right direction (plane direction).

The mounting board 2 is divided into a mounting area 5 and a peripheral area 6 as shown in FIG.

The mounting area 5 is an area in which the imaging device 41 is disposed. That is, the mounting area 5 is an area overlapping with the imaging element 41 when projected in the thickness direction when the imaging element 41 is disposed on the mounting substrate 2. Specifically, the mounting area 5 is divided into a substantially rectangular shape at the approximate center of the mounting substrate 2 in plan view, as indicated by the phantom line in FIG. 1. A plurality of imaging element connection terminals 12 (described later) for electrically connecting to the imaging element 41 are disposed in the outer peripheral portion of the mounting area 5. The mounting area 5 does not have a metal support plate such as stainless steel.

In the mounting substrate 2, the peripheral region 6 is a region other than the mounting region 5. The peripheral area 6 is an area in which a housing 42 (described later) and the external device connection flexible printed circuit board 3 are disposed. That is, when the housing 42 (described later) is disposed on the mounting substrate 2, the peripheral region 6 is a region overlapping the housing 42 and the external device connection flexible printed circuit board 3 when projected in the thickness direction (mounting Except area 3). Specifically, the peripheral region 6 is formed in a substantially rectangular frame shape whose outer shape and inner shape are both substantially rectangular in a plan view, and the inner end edge thereof is continuous with the outer end edge of the mounting region 5. A plurality of connection board connection terminals 13 (described later) for electrically connecting with the external device connection flexible printed circuit board 3 are arranged at the rear end edge of the peripheral region 6.

As shown in FIG. 3, the mounting substrate 2 includes the first base insulating layer 7, the first conductor pattern 8, and the first cover insulating layer 9.

The first base insulating layer 7 is disposed on the top layer of the mounting substrate 2. The first base insulating layer 7 forms the outer shape of the mounting substrate 2 and is formed in a substantially rectangular shape in plan view. The upper surface of the first base insulating layer 7 is formed to be flat. A plurality of imaging element connection terminal openings 10 and a plurality of connection board connection terminal openings 11 are formed in the first base insulating layer 7.

The plurality of imaging element connection terminal openings 10 (hereinafter, abbreviated as first openings) are openings for exposing the imaging element connection terminals 12 from the top surface. The plurality of first openings 10 are arranged at intervals along the circumferential edge of the mounting area 5 so as to form a rectangular frame. The first opening 10 penetrates the first insulating base layer 7 in the thickness direction, and has a substantially circular shape in plan view. The first opening 10 has a tapered shape in which the cross-sectional area decreases in the upward direction.

The plurality of connection substrate connection terminal openings 11 (hereinafter, abbreviated as second openings) are openings for exposing the connection substrate connection terminals 13 from the top surface. The plurality of second openings 11 are arranged at the rear end edge of the peripheral area 6 at intervals in the left-right direction. The second opening 11 penetrates the first insulating base layer 7 in the thickness direction, and has a substantially rectangular shape (rectangular shape) in plan view. The second opening 11 is formed to extend forward from the rear end edge of the peripheral region 6 in a plan view.

The first base insulating layer 7 is formed of an insulating material. Examples of the insulating material include synthetic resins such as polyimide resin, polyamideimide resin, acrylic resin, polyether nitrile resin, polyether sulfone resin, polyethylene terephthalate resin, polyethylene naphthalate resin, polyvinyl chloride resin and the like. Preferably, the first base insulating layer 7 is formed of polyimide resin.

The elastic modulus of the first insulating base layer 7 is, for example, 1 GPa or more, preferably 5 GPa or more, and for example, 20 GPa or less, preferably 15 GPa or less. The elastic modulus of a resin layer such as an insulating layer can be measured, for example, by dynamic viscoelasticity measurement, in accordance with JIS K7244 or ISO 6721.

The thermal expansion coefficient of the first base insulating layer 7 is, for example, 1 ppm / K or more, preferably 5 ppm / K or more, and for example, 50 ppm / K or less, preferably 30 ppm / K or less. The thermal expansion coefficient of the resin layer such as the insulating layer is a linear thermal expansion coefficient in the surface direction, and can be measured, for example, by thermal mechanical analysis under the condition of JIS K7197.

The thickness _{T 1} of the first insulating base layer 7, for example, 1 [mu] m or more, preferably not less 5μm or more, and is, for example, 30 [mu] m or less, preferably, 10 [mu] m or less, more preferably 8μm or less.

The first conductor pattern 8 is provided below the first insulating base layer 7 so as to be in contact with the lower surface of the first insulating base layer 7. The first conductor pattern 8 includes a plurality of imaging element connection terminals 12, a plurality of connection board connection terminals 13, and a plurality of first metal wires 14.

As shown in FIG. 2, the plurality of imaging element connection terminals 12 are arranged at intervals on the circumferential end of the mounting area 5 so as to form a rectangular frame. That is, the plurality of imaging element connection terminals 12 are provided to correspond to the plurality of terminals 46 (described later) of the imaging element 41 to be mounted.

The imaging element connection terminal 12 has a substantially circular shape in plan view. The imaging element connection terminal 12 is disposed in the first opening 10, and is formed to be convex upward in a side cross sectional view. The upper surface of the inner portion of the imaging element connection terminal 12 is exposed from the first opening 10 and is formed flush with the upper surface of the first insulating base layer 7.

The plurality of connection board connection terminals 13 are arranged at the rear end edge of the peripheral area 6 at intervals in the left-right direction. That is, the plurality of connection board connection terminals 13 are provided to correspond to the plurality of mounting board connection terminals 24 (described later). The connection board connection terminal 13 has a substantially rectangular shape (rectangular shape) in plan view. The connection substrate connection terminal 13 is disposed in the second opening 11, and the upper surface thereof is exposed from the second opening 11. In FIG. 2, a part of the plurality of connection board connection terminals 13 (central part in the left-right direction) is omitted.

As shown in FIG. 3, the plurality of first metal wires 14 include the plurality of first connection wires 15 and the plurality of ground wires 16.

The plurality of first connection wirings 15 are provided to correspond to the plurality of imaging element connection terminals 12 (or the plurality of connection substrate connection terminals 13). Specifically, the first connection wiring 15 is integrally formed with the imaging element connection terminal 12 and the connection substrate connection terminal 13 so as to connect them. That is, one end of the first connection wiring 15 is continuous with the imaging element connection terminal 12, and the other end of the first connection wiring 15 is continuous with the connection substrate connection terminal 13 to electrically connect them.

The plurality of ground wirings 16 are provided to correspond to the plurality of first connection wirings 15. Specifically, the plurality of ground wirings 16 are provided outside the plurality of first connection wirings 15 so as to be along them. A ground terminal (not shown) is integrally connected to one end of the ground wiring 16.

When the mounting substrate 2 is projected in the thickness direction, a region in plan view or bottom view where the first metal wiring 14 (metal wiring) exists is taken as a wiring region 17.

Examples of the material of the first conductor pattern 8 include metal materials such as copper, silver, gold, nickel or alloys containing them, and solder. Preferably, copper is mentioned.

The elastic modulus of the first conductor pattern 8 is, for example, 50 GPa or more, preferably 100 GPa or more, and for example, 200 GPa or less, preferably 150 GPa or less. The elastic modulus of a metal such as a conductor pattern can be measured, for example, by tensile test measurement in accordance with JIS Z 2241.

The thermal expansion coefficient of the first conductor pattern 8 is, for example, 1 ppm / K or more, preferably 5 ppm / K or more, and for example, 30 ppm / K or less, preferably 20 ppm / K or less. The thermal expansion coefficient of a metal such as a conductor pattern is a linear thermal expansion coefficient in the surface direction, and can be measured, for example, by a thermomechanical analyzer or an optical scanning type measuring device in accordance with JIS Z 2285.

The thickness T _{2 of} the first conductor pattern 8 (the first metal wiring 14 and each of the terminals 12 and 13) (thus, the total thickness of the metal wiring) is 12 μm or less, from the viewpoint of suppressing the warpage of the mounting substrate 2 during mounting. Preferably, it is 8 μm or less, more preferably 5 μm or less. Also, from the viewpoint of handleability, the thickness is, for example, 1 μm or more, preferably 3 μm or more.

The width of the first metal wiring 14 is, for example, 5 μm or more, preferably 10 μm or more, and for example, 100 μm or less, preferably 50 μm or less.

The first cover insulating layer 9 is provided below the first base insulating layer 7 and the first conductor pattern 8 so as to cover the first conductor pattern 8. That is, the first cover insulating layer 9 is disposed in contact with the lower surface and the side surface of the first conductor pattern 8 and the lower surface of the first base insulating layer 7 exposed from the first conductor pattern 8. The outer shape of the first cover insulating layer 9 is formed to be substantially the same as the outer shape of the first base insulating layer 7 except for the portion where the second opening 11 is formed.

The first cover insulating layer 9 is formed of an insulating material similar to the above-described insulating material in the first base insulating layer 7, and is preferably formed of a polyimide resin.

The elastic modulus of the first cover insulating layer 9 is, for example, 1 GPa or more, preferably 5 GPa or more, and for example, 20 GPa or less, preferably 15 GPa or less.

The thermal expansion coefficient of the first cover insulating layer 9 is, for example, 1 ppm / K or more, preferably 5 ppm / K or more, and for example, 50 ppm / K or less, preferably 30 ppm / K or less.

The thickness _{T 3} of the first insulating cover layer 9, for example, 1 [mu] m or more, preferably not 2μm or more, and is, for example, 30 [mu] m or less, preferably, 10 [mu] m or less, more preferably 5μm or less.

The equivalent elastic modulus in the wiring area 17 of the mounting substrate 2 is, for example, 5 GPa or more, preferably 10 GPa or more, and for example, 55 GPa or less, preferably 50 GPa or less, more preferably 40 GPa or less, more preferably, It is 30 GPa or less, particularly preferably 20 GPa or less. By making the equivalent elastic modulus of the wiring region 17 equal to or less than the above-described upper limit, the occurrence of warpage of the mounting substrate 2 can be suppressed. Further, by setting the equivalent elastic modulus of the wiring region 17 to the above lower limit or more, the handleability of the substrate laminate 1 is excellent.

The equivalent elastic modulus D is obtained by dividing the thickness fraction of each layer into the elastic modulus of each layer (for example, the first base insulating layer 7, the first metal wiring 14, and the first cover insulating layer 9) constituting the wiring region 17. They are multiplied and summed up. Specifically, for example, in the embodiment shown in FIG. 2 to FIG. 3, it can be obtained by the following formula.

D = {D ₁ × T ₁ + D ₂ × T ₂ + D ₃ × T ₃ } / {T ₁ + T ₂ + T ₃ }
D ₁ represents a modulus of elasticity of the first insulating base layer 7, T ₁ indicates the thickness of the first insulating base layer 7.
D ₂ represents the elastic modulus of the first metal wiring 14, _{T 2} indicates the thickness of the first metal interconnect 14.
D ₃ represents the elastic modulus of the first insulating cover layer 9, T ₃ represents a thickness of the first insulating cover layer 9.

The above equivalent elastic modulus D is the Voigt rule in a parallel plate model in which the first layer and the second layer are stacked: E _y = V ₁ E ₁ + V ₂ E ₂ (E _y is the overall Young's modulus, V ₁ Is the volume of the first layer, E ₁ is the Young's modulus of the material of the first layer, V ₂ is the volume of the second layer, and E ₂ is the Young's modulus of the material of the second layer. Derived from

In the wiring region 17, the ratio of the total thickness of the metal to the total thickness of the insulating layer, ie, the ratio of the thickness of the first metal wiring 14 to the total thickness of the first base insulating layer 7 and the first cover insulating layer 9 (T ₂ / (T ₁ + T ₃ )) is, for example, 0.05 or more, preferably 0.10 or more, more preferably 0.20 or more, and for example, 0.90 or less, preferably 0.70. Hereinafter, more preferably, it is 0.50 or less, more preferably, 0.20 or less. By setting the ratio to the above range, the equivalent elastic modulus can be easily adjusted to an appropriate range (for example, 5 GPa or more and 55 GPa or less), and as a result, the occurrence of warpage can be suppressed more reliably. .

The total thickness (maximum thickness) of the mounting substrate 2 is 60 μm or less, preferably 40 μm or less, more preferably 30 μm or less, still more preferably 20 μm or less, particularly preferably 10 μm, from the viewpoint of warpage suppression and handleability. Or less, and for example, 1 μm or more, preferably 5 μm or more.

In the mounting substrate 2, for example, a step of preparing a metal supporting substrate (for example, a stainless steel substrate) having a flat upper surface, and forming the first insulating base layer 7 in which each opening (10, 11) is formed on the upper surface Forming the first conductor pattern 8 on the upper surface of the first base insulating layer 7 and the upper surface of the metal supporting substrate exposed from the openings, and covering the first base insulating layer 7 and the first conductor pattern 8 It can manufacture by the process of forming the 1st cover insulating layer 9, and the process of removing a metal support substrate. Then, the manufactured mounting substrate 2 is turned upside down to obtain the mounting substrate 2 shown in FIG.

(External device connection flexible wired circuit board)
External device connection A flexible printed circuit board 3 (hereinafter referred to as a connection board) is a flexible printed circuit board for electrically connecting the mounting board 2 and an external device (not shown) such as a motherboard, and an actuator It is a flexible printed circuit board for electrically connecting a module 45 (described later) and an external device electrically.

The connection substrate 3 is divided into a mounting substrate arrangement region 20, a connection region 21 and a connector region 22 as shown in FIGS. 1A-B.

The mounting substrate placement area 20 (hereinafter referred to as a placement area) is disposed at the front end of the connection substrate 3 and is an area overlapping the mounting substrate 2 when projected in the thickness direction. The arrangement area 20 has a substantially rectangular frame shape whose outer shape and inner shape are both substantially rectangular in a plan view. That is, the placement area 20 is formed in a substantially rectangular shape in a plan view, and a mounting area opening 23 having a substantially rectangular shape in a plan view is formed in the central portion thereof in the thickness direction. The outer shape of the placement area 20 is slightly smaller than the outer shape of the mounting substrate 2, and the inner shape thereof is slightly larger than the mounting region 5 of the mounting substrate 2. A mounting substrate connection terminal 24 (described later) for electrically connecting with the mounting substrate 2 and a module connection terminal 25 (described later) for electrically connecting with the actuator module 45 are provided at the rear end of the arrangement region 20. A plurality of each are arranged.

The connection region 21 is disposed at the center of the connection substrate 3 in the front-rear direction, and has a substantially rectangular shape in plan view extending in the front-rear direction. The front end of the connection area 21 is continuous with the rear end of the placement area 20, and the rear end of the connection area 21 is continuous with the connector area 22. In the connection region 21, a plurality of second metal connection wires 30 (described later) extending in the front-rear direction are arranged at intervals in the left-right direction.

The connector region 22 is disposed at the rear end of the connection substrate 3 and has a substantially rectangular planar shape. The front end of the connector area 22 is continuous with the rear end of the connection area 21.

A plurality of connector connection terminals 32 for electrically connecting to the connector 4 are arranged in the connector area 22.

The connection substrate 3 includes a second base insulating layer 26, a second conductor pattern 27, and a second cover insulating layer 28, as shown in FIGS. 4A-B.

The second base insulating layer 26 is disposed in the lowermost layer of the connection substrate 3. The second base insulating layer 26 has an outer shape of the connection substrate 3 and is formed in a substantially rectangular shape in plan view. A plurality of mounting substrate connection terminal openings 29 are formed in the second base insulating layer 26 in the arrangement region 20.

The plurality of mounting substrate connection terminal openings 29 (hereinafter, referred to as third openings) are openings for exposing the mounting substrate connection terminals 24 from the lower surface. The plurality of third openings 29 are aligned at intervals in the left-right direction so as to correspond to the plurality of second openings 11 at the center in the width direction of the rear end portion of the arrangement region 20. The third opening 29 penetrates the second insulating base layer 26 in the thickness direction, and has a substantially rectangular shape (rectangular shape) in plan view.

The second base insulating layer 26 is formed of an insulating material. The insulating material is formed of the same insulating material as the insulating material described above in the first base insulating layer 7, and is preferably formed of polyimide resin.

The thickness _{T 4} of the second insulating base layer 26 is, for example, 5 [mu] m or more, preferably not less 10μm or more, and is, for example, 50 [mu] m or less, preferably 30μm or less.

The second conductor pattern 27 is provided on the upper side of the second insulating base layer 26 so as to be in contact with the upper surface of the second insulating base layer 26. The second conductor pattern 27 includes a plurality of mounting substrate connection terminals 24, a plurality (two) of module connection terminals 25, a plurality of connector connection terminals 32, and a plurality of second metal connection wirings 30.

The plurality of mounting board connection terminals 24 are aligned at the center in the left-right direction of the rear end portion of the placement area 20 at intervals in the left-right direction. That is, the plurality of mounting board connection terminals 24 are provided to correspond to the plurality of connection board connection terminals 13. The mounting substrate connection terminal 24 has a substantially rectangular shape (rectangular shape) in plan view. The mounting substrate connection terminal 24 is disposed in the third opening 29, and the lower surface thereof is exposed from the third opening 29.

The plurality of (two) module connection terminals 25 are arranged at the rear end of the arrangement area 20 in the left-right direction at intervals in the left-right direction. That is, the plurality of module connection terminals 25 are provided to correspond to the plurality (two) of the housing side terminals 47 (described later) when the housing 42 (described later) is disposed in the arrangement area 20. The module connection terminal 25 has a substantially rectangular shape in plan view. The module connection terminal 25 is disposed in a module connection terminal opening 31 (described later), and the upper surface thereof is exposed from the module connection terminal opening 31.

The plurality of connector connection terminals 32 are terminals for electrically connecting each of the plurality of mounting board connection terminals 24 and the plurality of module connection terminals 25 to the connector 4, and the number thereof is the mounting board connection terminals 24 and the module connection terminals It is a total number of 25. The plurality of connector connection terminals 32 are aligned in the connector area 22 at intervals in the left-right direction. That is, they are provided to correspond to the plurality of connector terminals 38 (described later) of the connector 4. The connector connection terminal 32 is disposed in a fifth opening 33 (described later), and the upper surface thereof is exposed from the fifth opening 33.

The plurality of second metal connection wirings 30 are provided to correspond to the plurality of mounting substrate connection terminals 24 and the plurality of module connection terminals 25. Specifically, some of the plurality of second metal connection wires 30 are integrally formed with the mounting substrate connection terminals 24 and the connector connection terminals 32 in the front-rear direction. That is, one end of the second metal connection wiring 30 is continuous with the mounting substrate connection terminal 24, and the other end of the second metal connection wiring 34 is continuous with the connector connection terminal 32 to electrically connect them. . Further, some (two) of the plurality of second metal connection wires 30 are integrally formed with the module connection terminals 25 and the connector connection terminals 32 so as to connect them in the front-rear direction. That is, one end of the second metal connection wiring 30 is continuous with the module connection terminal 25, and the other end of the second metal connection wiring 34 is continuous with the connector connection terminal 32 to electrically connect them.

The material of the second conductor pattern 27 is formed of the same metal material as that described above for the first conductor pattern 8, and preferably includes copper.

The thickness T _{5 of} the second conductor pattern 27 (the second metal connection wire 30 and each of the terminals 24 and 25) (thus, the total thickness of the metal wires) is the thickness of the first conductor pattern 8 from the viewpoint of the magnitude of the current flowed. It is thicker than T ₂ , for example, more than 12 μm, preferably 15 μm or more, and for example, 40 μm or less, preferably 25 μm or less. Further, the ratio (T ₅ / T ₂ ) of the thickness T ₅ of the second conductor pattern 27 to the thickness T ₂ of the first conductor pattern 8 (thus, the metal wiring of the connection substrate 3 with respect to the total thickness of the metal wiring of the mounting substrate 2) The ratio of the total thickness) is, for example, 1.2 or more, preferably 1.5 or more, and for example, 10 or less, preferably 5 or less.

The width of the second metal connection wiring 30 is, for example, 15 μm or more, preferably 25 μm or more, and for example, 1000 μm or less, preferably 500 μm or less.

The second cover insulating layer 28 is provided on the second base insulating layer 26 and the upper side of the second conductor pattern 27 so as to cover the second conductor pattern 27. That is, the second cover insulating layer 28 is disposed in contact with the upper surface and the side surface of the second conductive pattern 27 and the upper surface of the second base insulating layer 26 exposed from the second conductive pattern 27. The outer shape of the second cover insulating layer 28 is formed to be the same as the second base insulating layer 26.

A plurality of module connection terminal openings 31 and a plurality of connector connection terminal openings 33 are formed in the second cover insulating layer 28.

The plurality of module connection terminal openings 31 (hereinafter, referred to as fourth openings) are openings for exposing the module connection terminals 25 from the top surface. The plurality of fourth openings 31 are aligned at intervals in the left-right direction corresponding to the plurality of module connection terminals 25 on the outside in the width direction of the rear portion of the arrangement area 20. The plurality of fourth openings 31 penetrate the second cover insulating layer 28 in the thickness direction, and have a substantially rectangular shape in plan view.

The plurality of connector connection terminal openings 33 (hereinafter, referred to as fifth openings) are openings for exposing the connector connection terminals 32 from the top surface. The plurality of fifth openings 33 are aligned in the connector area 22 at intervals in the left-right direction corresponding to the plurality of connector connection terminals 32.

The second cover insulating layer 28 is formed of an insulating material similar to the above-described insulating material of the second base insulating layer 26, and is preferably formed of a polyimide resin.

The thickness T ₆ of the second cover insulating layer 28 is, for example, 10 μm or more, preferably 15 μm or more, and for example, 50 μm or less, preferably 30 μm or less.

The total thickness (maximum thickness) of the connection substrate 3 is thicker than the mounting substrate 2 from the viewpoint of the magnitude of the flowable current and the handleability, for example, exceeds 60 μm, preferably 80 μm or more, For example, it is 200 μm or less, preferably 120 μm or less. The ratio of the total thickness of the connection substrate 3 to the total thickness of the mounting substrate 2 is, for example, 1.5 or more, preferably 2.0 or more, and for example, 10 or less, preferably 5 or less.

For example, the connection substrate 3 includes a step of forming the second base insulating layer 26, a step of forming the second conductor pattern 27 on the upper surface of the second base insulating layer 26, a second conductor pattern 27 and a second base insulating layer 26. It can manufacture by the process of forming the 2nd cover insulating layer 28 so that it may coat | cover.

(connector)
The connector 4 is a connection element for electrically connecting the connection substrate 3 and an external device (not shown). The connector 4 has a generally rectangular shape in plan view extending in the left-right direction, as shown in FIGS. 1A-B. The connector 4 includes a plurality of connector terminals 38 for electrically connecting with the plurality of connector connection terminals 32.

(Board laminate)
The substrate laminate 1 includes a mounting substrate 2, a connection substrate 3 disposed on the upper side of the mounting substrate 2, and a connector 4 disposed on the upper side of the connection substrate 3 as shown in FIG. 1A-B.

The connection substrate 3 is disposed on the upper side of the peripheral region 6 of the mounting substrate 2 so that the lower surface of the arrangement region 20 (a part of the connection substrate 3) contacts the upper surface of the peripheral region 6 of the mounting substrate 2. That is, when projected in the thickness direction, the connection substrate 3 overlaps the mounting substrate 2 in the arrangement region 20 but does not overlap the connection region 21 and the connector region 22 with the mounting substrate 2. It is arranged. When projected in the thickness direction, the mounting substrate 2 includes the arrangement region 20 of the connection substrate 3. That is, in plan view, the mounting substrate 2 is slightly larger than the arrangement region 20 of the connection substrate 3.

The placement area 20 is disposed along the four ends (the front end, the rear end, the left end, and the right end) of the mounting substrate 2. Specifically, the mounting area 20 is arranged so that the mounting area 5 is arranged in the mounting area opening 23 and surrounds four sides of the mounting area 5. That is, the mounting area opening 23 includes the entire area of the mounting area 5 in a plan view, and the peripheral edge of the mounting area opening 23 is separated from the peripheral edge of the mounting area 5.

The connection substrate 3 is fixed to the upper surface of the peripheral region 6 via an insulating adhesive or the like (not shown). The connection substrate 3 is electrically connected to the mounting substrate 2. Specifically, as shown in FIG. 4B, the connection substrate 3 is electrically connected via a conductive bonding material 35 such as solder or conductive adhesive. The connection board connection terminal 13 and the mounting board connection terminal 24 are joined.

The connector 4 is disposed on the upper side of the connector area 22 of the connection substrate 3 so that the lower surface of the connector 4 is in contact with the upper surface of the connector area 22 of the connection substrate 3. When projected in the thickness direction, the connector 4 is disposed substantially in the center of the connector area 22 in plan view.

The connector 4 is fixed to the upper surface of the connector area 22 via an insulating adhesive or the like (not shown). Further, the connector 4 is electrically connected to the connection substrate 3. Specifically, the connector connection terminal 32 and the connector side terminal 38 are bonded via the conductive bonding material 35.

Such a substrate laminate 1 is used, for example, as a printed circuit board for mounting an imaging device 41 (described later). That is, the substrate laminate 1 is used for an imaging device such as a camera module.

2. Imaging Device With reference to FIGS. 5A-6B, an imaging device 40 comprising the substrate stack 1 will be described.

The imaging device 40 includes the substrate stack 1, an imaging element 41, a housing 42, an optical lens 43, a filter 44, and an actuator module 45.

The imaging device 41 is a semiconductor device that converts light into an electrical signal, and examples thereof include solid-state imaging devices such as a CMOS sensor and a CCD sensor. The current required to operate the imaging device 41 is, for example, 500 mA or less, preferably less than 300 mA, and for example, 50 mA or more.

The imaging device 41 is formed in a flat plate shape substantially rectangular in plan view, and includes silicon such as a Si substrate, and a photodiode (photoelectric conversion device) and a color filter disposed thereon, although not shown. A plurality of terminals 46 corresponding to the imaging element connection terminals 12 of the mounting substrate 2 are provided on the lower surface of the imaging element 41.

The elastic modulus of the imaging device 41 (in particular, the Si substrate) is, for example, 100 GPa or more, preferably 120 GPa or more, and for example, 200 GPa or less, preferably 150 GPa or less. The elastic modulus of the imaging device 41 can be measured, for example, by tensile test measurement in accordance with JIS Z 2241.

The thermal expansion coefficient of the imaging device 41 (in particular, the Si substrate) is, for example, 1 ppm / K or more, preferably 2 ppm / K or more, and for example, 10 ppm / K or less, preferably 5 ppm / K or less. The thermal expansion coefficient of the imaging device 41 is a linear thermal expansion coefficient in the surface direction, and can be measured, for example, by a thermomechanical analyzer or an optical scanning measurement device in accordance with JIS Z 2285.

The thickness of the imaging device 41 is, for example, 10 μm or more, preferably 50 μm or more, and for example, 1000 μm or less, preferably 500 μm or less.

The imaging element 41 is mounted on the mounting area 5 of the mounting substrate 2. That is, the terminals 46 of the imaging device 41 are flip chip mounted via the imaging device connection terminals 12 of the corresponding mounting substrate 2 and the conductive bonding material 35 such as solder. Thus, the imaging element 41 is disposed on the upper surface of the mounting area 5 of the mounting substrate 2 and is electrically connected to the imaging element connection terminal 12 of the mounting substrate 2.

The imaging element 41 is mounted on the mounting area 5 of the mounting substrate 2 to configure an imaging unit 49 as shown in FIG. 5A-B. That is, the imaging unit 49 includes the substrate laminate 1 and the imaging device 41 mounted thereon.

The housing 42 is disposed on the top surface of the peripheral region 6 so as to be spaced apart from the imaging device 41 in the surface direction. The housing 42 has a cylindrical shape substantially rectangular in plan view. At the upper end of the housing 42, a fixing portion for fixing the optical lens 43 is provided.

The housing 42 further includes a housing side terminal 47 provided at the lower end (end portion) of the housing 42 and a module connection wiring 48 extending from the actuator module 45 to the housing side terminal 47. The housing side terminal 47 is bonded to the module connection terminal 25 via the conductive bonding material 35. Thus, the actuator module 45 is directly electrically connected to the connection substrate 3 without the mounting substrate 2.

The optical lens 43 is disposed on the upper side of the mounting substrate 2 at a distance from the mounting substrate 2 and the imaging device 41. The optical lens 43 is formed in a substantially circular shape in a plan view, and is fixed by the fixing portion so that light from the outside reaches the imaging element 41.

The filter 44 is disposed at the center in the vertical direction of the imaging device 41 and the optical lens 43 at a distance from them, and is fixed to the housing 42.

The actuator module 45 is an element that converts an electrical signal from an external device into physical motion, and includes, for example, an autofocus element, an optical image stabilizer, and the like. The current required to operate the actuator module 45 is, for example, 200 mA or more, preferably 300 mA or more, and for example, 1000 mA or less.

The actuator module 45 is fixed to the housing 42 around the optical lens 43.

The substrate laminate 1 includes the mounting substrate 2 and the connection substrate 3. The mounting substrate 2 has the first metal wiring 14, and the thickness of the first metal wiring 14 is 12 μm or less. The total thickness of 2 is 60 μm or less. Further, the arrangement area 20 of the connection substrate 3 is arranged in the peripheral area 6 of the mounting substrate 2.

In the substrate laminate 1, the mounting substrate 2 and the first metal wiring 14 are very thin. Therefore, according to the thermal expansion of the imaging element 41, the mounting area 5 of the mounting substrate 2 can be flexibly deformed to suppress the generation of thermal stress. As a result, under the environment where high temperature and low temperature are repeated, it is possible to suppress the occurrence of warpage of the mounting area 5 of the mounting substrate 2 and hence the imaging device 40.

Further, the arrangement area 20 of the connection substrate 3 is arranged on the upper side of the peripheral area 6 of the mounting substrate 2. Therefore, the actuator module 45 can be electrically connected directly to the connection substrate 3 without the mounting substrate 2. Therefore, the actuator module 45 can be disposed on the substrate stack 1 to be electrically connected, and the actuator module 45 can be operated.

Further, in the substrate laminate 1, the arrangement region 20 of the connection substrate 3 is arranged on the upper side of the peripheral region 6 (the side on which the imaging device 41 is mounted).

Therefore, the height of the imaging device 40 can be reduced. That is, the vertical distance between the upper end and the lower end of the imaging device 40 (the vertical distance between the upper end of the housing 42 and the lower surface of the mounting substrate 2 in FIG. 6B) can be reduced. Specifically, in the second embodiment (described later) shown in FIG. 7B in which the connection substrate 3 is disposed below the peripheral region 6, the vertical distance between the upper end and the lower end of the imaging device 40 is the housing 42. The first embodiment shown in FIG. 6B is reduced in height by a thickness of the connection substrate 3 compared to the second embodiment shown in FIG. Can. In both of the first embodiment and the second embodiment, the vertical distance between the center of the optical lens 43 and the upper surface of the imaging device 41 (ie, the focal length, D ₁ shown in FIG. 7B) is the same. The vertical distance (D ₂ shown in FIG. 7B) between the upper end of the upper surface of the mounting substrate 2 and the upper surface of the mounting substrate 2 is also the same.

Further, in the substrate laminate 1, the arrangement region 20 of the connection substrate 3 is arranged along the four end portions of the mounting substrate 2. That is, the arrangement area 20 is arranged to surround four sides of the mounting area 5.

For this reason, since the contact area of the mounting substrate 2 and the connection substrate 3 is large, the bonding strength of these is further increased. As a result, even when the substrate stack 1 is bent in the vertical direction, separation and breakage can be reliably suppressed at the junction between the mounting substrate 2 and the connection substrate 3.

In the substrate laminate 1, in the mounting substrate 2, the equivalent elastic modulus of the wiring region 17 is 5 GPa or more and 55 GPa or less.

Therefore, the elastic modulus of the wiring area 17 is small and flexible. Therefore, the warpage of the mounting substrate 2 can be well and surely suppressed.

The imaging device 40 also includes the substrate stack 1, the imaging device 41, and the actuator module 45.

Therefore, the warp of the imaging device 40 can be suppressed, and the actuator module 45 can be operated.

3. Modifications (1) The mounting substrate 2 shown in FIG. 3 includes the first base insulating layer 7, the first conductor pattern 8 and the first cover insulating layer 9 in the thickness direction in order. Although the conductor layer (conductor pattern) is a single layer, for example, although not shown, the conductor layer of the mounting substrate 2 may be a multilayer (for example, two or more layers, preferably 2 to 4 layers) . That is, for example, the mounting substrate 2 sequentially includes the first base insulating layer 7, the first conductor pattern 8, the first cover insulating layer 9, the third conductor pattern, and the third cover insulating layer in the thickness direction. The mounting substrate 2 may include the first base insulating layer 7, the first conductor pattern 8, the first cover insulating layer 9, the third conductor pattern, and the third base pattern. A cover insulating layer, a fourth conductor pattern, and a fourth cover insulating layer may be provided in order in the thickness direction (conductor layer 3-layer configuration).

The configurations of the third conductor pattern and the fourth conductor pattern are respectively the same as the configuration of the first conductor pattern 8, and the configurations of the third cover insulating layer and the fourth cover insulating layer are respectively the first cover insulation It is similar to the configuration of layer 9.

The total thickness of the mounting substrate 2 is also the same as that of the embodiment shown in FIG. 3 (for example, 60 μm or less).

The total thickness of the metal wiring in the mounting substrate 2 (for example, the total thickness of the first metal wiring 14 provided in the first conductor pattern, the metal wiring provided in the third conductor pattern, and the metal wiring provided in the fourth conductor pattern) is, for example From the viewpoint of suppression of warpage, for example, 12 μm or less, preferably 10 μm or less, more preferably 8 μm or less, and from the viewpoint of handleability, for example, 1 μm or more, preferably 3 μm or more. The ratio of the total thickness of the metal wiring of the connection board 3 to the total thickness of the metal wiring of the mounting board 2 is also the same as in the embodiment shown in FIG. 1 (for example, 1.2 or more). Further, the equivalent elastic modulus D of the wiring area (the area where the metal wiring of each conductor layer exists), the ratio of the total thickness of all metals to the total thickness of all insulating layers, etc. are the same as the embodiment shown in FIG. .

(2) The connection substrate 3 shown in FIG. 4A-B includes the second base insulating layer 26, the second conductor pattern 27, and the second cover insulating layer 28 in the thickness direction in order. Although the conductor layer (conductor pattern) is a single layer, for example, although not shown, the conductor layer of the connection substrate 3 may be a multilayer (for example, two or more layers, preferably 2 to 4 layers) . That is, for example, the connection substrate 3 sequentially includes the second base insulating layer 26, the second conductor pattern 27, the second cover insulating layer 28, the fifth conductor pattern, and the fifth cover insulating layer in the thickness direction. The connection substrate 3 may include the second base insulating layer 26, the second conductive pattern 27, the second cover insulating layer 28, the fifth conductive pattern, and the fifth conductive pattern. A cover insulating layer, a sixth conductor pattern, and a sixth cover insulating layer may be provided in order in the thickness direction (conductor layer 3-layer configuration).

The configurations of the fifth conductor pattern and the sixth conductor pattern are the same as those of the second conductor pattern 27, respectively, and the configurations of the fifth cover insulating layer and the sixth cover insulating layer are each the configuration of the second cover insulating layer 28 Is the same as

The total thickness of the connection substrate 3 is also the same as the embodiment shown in FIG. 4A-B (for example, more than 60 μm).

The total thickness of the metal wiring (specifically, the total thickness of the second metal connection wiring 30 provided in the second conductor pattern, the metal connection wiring provided in the fifth conductor pattern, and the metal connection wiring provided in the sixth conductor pattern) is For example, from the viewpoint of passing more current, for example, it exceeds 12 μm, preferably 15 μm or more, and for example 40 μm or less, preferably 25 μm or less. Further, the ratio of the total thickness of the metal wiring of the connection substrate 3 to the total thickness of the metal wiring of the mounting substrate 2 is also the same as in the embodiment shown in FIG. 1 (for example, 1.2 or more).

(3) In the imaging device 40 shown in FIG. 6B, the imaging device 41 is flip-chip mounted on the mounting substrate 2. For example, although not shown, the imaging device 41 is mounted on the mounting substrate 2 by wire bonding. You can also.

(4) In the imaging device 40 shown in FIG. 6, the module connection terminal 25 is electrically connected to the housing side terminal 47 via the conductive bonding material 35. For example, although not shown, the module connection terminal 25 can also be electrically connected to the housing side terminal 47 by wire bonding.

Second Embodiment
A second embodiment of the substrate laminate 1 and the imaging device 40 will be described with reference to FIGS. 7A-B. In the substrate laminate 1 and the imaging device 40 according to the second embodiment, the same members as those in the first embodiment shown in the above-described drawings are denoted by the same reference numerals, and the description thereof will be omitted.

In the mounting substrate 2 of the first embodiment, the arrangement region 20 of the connection substrate 3 is arranged on the upper side of the peripheral region 6, but in the mounting substrate 2 of the second embodiment, as shown in FIG. The arrangement area 20 of the connection substrate 3 is arranged below the peripheral area 6.

In the second embodiment, the connection board connection terminals 13 of the mounting board 2 are disposed to be exposed to the lower side, and the mounting board connection terminals 24 of the connection board 3 are disposed to be exposed to the upper side. Are electrically connected via the conductive bonding material 35.

Further, through holes 36 are provided in the mounting substrate 2 at positions corresponding to the housing side terminals 47 and the module connection terminals 25. The housing side terminal 47 of the housing 42 is electrically connected to the module connection terminal 25 through the through hole 36 and the conductive bonding material 35 inside the module connection terminal opening 31.

The same effects as those of the substrate laminate 1 and the imaging device 40 of the first embodiment can be obtained for the substrate laminate 1 and the imaging device 40 of the second embodiment. From the viewpoint of reducing the height of the imaging device 40, preferably, the first embodiment can be mentioned. The same modification as the first embodiment can be applied to the second embodiment.

Third Embodiment
A third embodiment of the substrate laminate 1 and the imaging device 40 will be described with reference to FIGS. 8A-B. In the substrate laminate 1 and the imaging device 40 according to the third embodiment, the same members as those in the first embodiment shown in the above-described drawings are given the same reference numerals, and the description thereof will be omitted.

The substrate laminate 1 according to the first embodiment includes the mounting substrate 2, the connection substrate 3, and the connector 4, but the substrate laminate 1 according to the third embodiment has the mounting substrate 2 as shown in FIGS. 8A-B. , A connection board 3, a connector 4, and a rigid board 50.

The rigid substrate 50 is a hard wiring substrate having no flexibility, and is made of, for example, a ceramic substrate, a glass epoxy substrate, or the like.

The rigid substrate 50 is disposed between the mounting substrate 2 and the connection substrate 3 in the vertical direction. Specifically, the upper side of peripheral region 6 and the lower surface of rigid substrate 50 are in contact with the upper surface of peripheral region 6 of mounting substrate 2, and the upper surface is in contact with the lower surface of arrangement region 20 of connection substrate 3. It is arranged under the arrangement area 20. The rigid substrate 50 is formed in a substantially rectangular frame shape whose outer shape and inner shape are both substantially rectangular in a plan view, and when projected in the thickness direction, matches the arrangement region 20 of the connection substrate 3. That is, the shape of the rigid substrate 50 is substantially the same as the shape of the arrangement region 20 of the connection substrate 3 in a plan view.

At the rear end portion of the rigid substrate 50, a plurality of conductive portions (not shown) for electrically connecting the connection substrate connection terminals 13 and the mounting substrate connection terminals 24 in the thickness direction are provided.

The thickness of the rigid substrate 50 is, for example, 20 μm or more, preferably 30 μm or more, and for example, 300 μm or less, preferably 200 μm or less.

The connection substrate 3 is disposed on the upper side of the rigid substrate 50. Specifically, the connection substrate 3 is disposed on the upper side of the rigid substrate 50 such that the lower surface thereof is in contact with the upper surface of the rigid substrate 50.

Further, in the embodiment shown in FIGS. 8A-B, the rigid substrate 50 is disposed on the upper side of the mounting substrate 2 and the lower side of the connection substrate 3, but as shown in FIG. 9A-B, for example, the rigid substrate 50 is Can also be disposed on the upper side of the connection substrate 3. That is, the rigid substrate 50 can be disposed on the upper side of the connection substrate 3 and the lower side of the housing 42. In this case, a plurality of via conduction parts 51 electrically connecting the module connection terminals 25 and the housing side terminals 47 in the thickness direction are provided at the rear end of the rigid substrate 50. Thus, the rigid substrate 50 can be electrically connected directly to the actuator module 45.

The substrate laminate 1 and the imaging device 40 of the third embodiment (FIGS. 8 to 9) also exhibit the same effects as the substrate laminate 1 and the imaging device 40 of the first embodiment. From the viewpoint that the peripheral region 6 of the mounting substrate 2 is reinforced by the rigid substrate 50 and warpage of the mounting substrate 2 can be suppressed more reliably, preferably, the substrate laminate 1 and the imaging device 40 of the third embodiment. Can be mentioned. Furthermore, in the embodiment shown in FIGS. 9A-B, the housing 42 in which the actuator module 45 is fixed can be mounted directly on the hard rigid substrate 50. Therefore, the actuator module 45 and the housing 42 can be stably disposed on the substrate stack 1 shown in FIG. 9A, and can be easily mounted. The same modification as the first embodiment can be applied to the third embodiment.

Fourth Embodiment
A fourth embodiment of the substrate laminate 1 will be described with reference to FIG. In the substrate laminate 1 of the fourth embodiment, the same members as those in the first embodiment shown in the above-described drawings are denoted by the same reference numerals, and the description thereof will be omitted.

In the substrate laminate 1 of the first embodiment, the arrangement region 20 of the connection substrate 3 is disposed along the four end portions of the mounting substrate 2. However, in the substrate laminate 1 of the fourth embodiment, FIG. As shown in FIG. 2, the arrangement area 20 of the connection substrate 3 is arranged along one end (rear end) of the mounting substrate 2.

In the fourth embodiment, the arrangement region 20 of the connection substrate 3 is formed in a generally rectangular shape in plan view extending in the left-right direction.

Also in the substrate laminate 1 and the imaging device 40 of the fourth embodiment, the same effects as those of the substrate laminate 1 and the imaging device 40 of the first embodiment can be obtained. From the viewpoint of high bonding strength between the mounting substrate 2 and the connection substrate 3 and reliable suppression of separation and breakage between the mounting substrate 2 and the connection substrate 3, the first embodiment is preferably mentioned. The same modification as the first embodiment can also be applied to the fourth embodiment.

Fifth to Sixth Embodiments
Fifth to sixth embodiments of the substrate laminate 1 will be described with reference to FIGS. 11 to 12. In the substrate laminate 1 of the fifth to sixth embodiments, the same members as those of the first embodiment shown in the above-described drawings are denoted by the same reference numerals, and the description thereof will be omitted.

In the substrate laminate 1 of the first embodiment, the arrangement region 20 of the connection substrate 3 is disposed along the four end portions of the mounting substrate 2, but in the substrate laminate 1 of the fifth embodiment, FIG. As shown in FIG. 1, the arrangement area 20 of the connection substrate 3 is arranged along the two ends (rear end and right end) of the mounting substrate 2. That is, in the fifth embodiment, the arrangement region 20 of the connection substrate 3 is formed in a substantially inverted L shape in plan view extending in the left-right direction and the front-rear direction.

Further, in the substrate laminate 1 of the sixth embodiment, as shown in FIG. 12, the arrangement region 20 of the connection substrate 3 is along the three end portions (rear end portion, right end portion and left end portion) of the mounting substrate 2. Are arranged. That is, in the sixth embodiment, the arrangement region 20 of the connection substrate 3 is formed in a substantially U shape in plan view in which the front end portion is opened.

Also in the substrate laminate 1 and the imaging device 40 of the fifth to sixth embodiments, the same function and effect as the substrate laminate 1 and the imaging device 40 of the first embodiment can be obtained. From the viewpoint of high bonding strength between the mounting substrate 2 and the connection substrate 3 and reliable suppression of separation and breakage between the mounting substrate 2 and the connection substrate 3, the first embodiment is preferably mentioned. The same modification as the first embodiment can be applied to the fifth to sixth embodiments.

Although the above invention is provided as an exemplary embodiment of the present invention, this is merely an example and should not be interpreted in a limited manner. Variations of the invention that are apparent to those skilled in the art are within the scope of the following claims.

The substrate laminate and the imaging device of the present invention can be applied to various industrial products, and for example, are suitably used for a camera module and the like.

DESCRIPTION OF SYMBOLS 1 substrate laminate 2 imaging element mounting substrate 3 external device connection flexible wiring circuit substrate 5 mounting region 6 peripheral region 14 first metal wiring 17 wiring region 20 mounting substrate arrangement region 40 imaging device 41 imaging device 45 actuator module 50 rigid substrate

Claims (8)

1. An imaging element mounting substrate for mounting the imaging element;
   A flexible printed circuit board electrically connectable to the actuator module and electrically connected to the imaging element mounting board;
   The imaging element mounting substrate has metal wiring,
   The thickness of the metal wiring is 12 μm or less,
   The total thickness of the imaging element mounting substrate is 60 μm or less,
   A substrate laminate, wherein a part of the flexible printed circuit board is disposed in an area other than a mounting area where the imaging element is mounted on the imaging element mounting board.
2. The substrate laminate according to claim 1, wherein the part of the flexible printed circuit board is disposed in an area on which the imaging device is mounted.
3. The substrate laminate according to claim 1, wherein the part of the flexible printed circuit board is disposed along at least one end of the imaging element mounting board.
4. The substrate laminate according to claim 1, wherein the part of the flexible printed circuit board is disposed to surround four sides of the mounting area.
5. The substrate laminate according to claim 1, further comprising a rigid substrate disposed in an area on the side where the imaging device is mounted.
6. The substrate laminate according to claim 5, wherein the rigid substrate is electrically connectable to the actuator module.
7. The substrate laminate according to claim 1, wherein, in the imaging element mounting substrate, an equivalent elastic modulus of a wiring region in which the metal wiring is disposed is 5 GPa or more and 55 GPa or less.
8. The substrate laminate according to claim 1;
   An imaging device mounted on the substrate laminate;
   And an actuator module mounted on the substrate stack.

Images