TWI758549B - Substrate laminate, and imaging device - Google Patents
Substrate laminate, and imaging device Download PDFInfo
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/12—Mountings, e.g. non-detachable insulating substrates
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
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Abstract
本發明之基板積層體具備:攝像元件安裝基板,其用以安裝攝像元件;及軟性配線電路基板,其可與致動器模組電性連接,且與攝像元件安裝基板電性連接;且攝像元件安裝基板具有金屬配線,金屬配線之厚度為12 μm以下,攝像元件安裝基板之總厚度為60 μm以下;軟性配線電路基板之一部分係於攝像元件安裝基板中配置於安裝攝像元件之安裝區域以外之區域。The substrate laminate of the present invention includes: an imaging element mounting substrate on which the imaging element is mounted; and a flexible wiring circuit substrate which can be electrically connected to the actuator module and electrically connected to the imaging element mounting substrate; The component mounting substrate has metal wiring, the thickness of the metal wiring is 12 μm or less, and the total thickness of the imaging element mounting substrate is 60 μm or less; a part of the flexible wiring circuit board is arranged in the imaging element mounting substrate outside the mounting area where the imaging element is mounted area.
Description
本發明係關於一種基板積層體、及具備基板積層體之攝像裝置。The present invention relates to a substrate laminate and an imaging device including the substrate laminate.
自先前以來,搭載於行動電話等之相機模組等攝像裝置一般具備:光學透鏡;殼體,其收容及保持光學透鏡;CMOS(Complementary Metal Oxide Semiconductor,互補金氧半導體)感測器或CCD(Charge Coupled Device,電荷耦合元件)感測器等攝像元件;及攝像元件安裝基板,其用以安裝攝像元件,並將攝像元件電性連接於外部配線。於攝像元件安裝基板之大致中央部之上,安裝有攝像元件,以包圍攝像元件之方式,於攝像元件安裝基板之周端部之上配置有殼體。於專利文獻1中,揭示了此種基板。 先前技術文獻 專利文獻Conventionally, imaging devices such as camera modules mounted on mobile phones and the like generally include: an optical lens; a housing that accommodates and holds the optical lens; a CMOS (Complementary Metal Oxide Semiconductor) sensor or a CCD ( An imaging element such as a Charge Coupled Device (Charge Coupled Device) sensor; and an imaging element mounting substrate, which is used to mount the imaging element and electrically connect the imaging element to external wiring. The imaging element is mounted on a substantially central portion of the imaging element mounting board, and a housing is disposed on the peripheral end portion of the imaging element mounting board so as to surround the imaging element. In
專利文獻1:日本專利特開2005-210628號公報Patent Document 1: Japanese Patent Laid-Open No. 2005-210628
[發明所欲解決之問題][Problems to be Solved by Invention]
隨著行動電話之小型化之要求,行動電話等中所使用之攝像裝置被要求更進一步薄型化(低高度化)。作為攝像裝置之低高度化之手段之一,可列舉使攝像元件安裝基板薄型化。With the demand for miniaturization of mobile phones, camera devices used in mobile phones and the like are required to be further thinned (reduced in height). As one of means for reducing the height of the imaging device, there is a reduction in the thickness of the imaging element mounting substrate.
另,於攝像元件安裝基板中,一般使用利用金屬板加強整個背面之較厚之剛性型配線電路基板、及未利用金屬板加強整個背面之較薄之軟性型配線電路基板(FPC)2種。In addition, as the imaging element mounting board, generally two types are used: a rigid type printed circuit board (FPC), which is thick, and the entire back surface is reinforced with a metal plate, and a thin flexible printed circuit board (FPC), which is not reinforced with a metal plate.
FPC因未利用金屬板予以加強,故能較剛性型配線電路基板更為薄型化。然而,另一方面,因攝像元件與攝像元件安裝基板之材料互不相同,故存在如下情形,即,若將具備攝像元件及攝像元件安裝基板之攝像單元置於反覆出現高溫及低溫之外部環境下,則會發生熱應變,而使攝像單元發生翹曲。其結果,攝像元件與光學透鏡之位置發生偏移,而發生像失真之故障。Since the FPC is not reinforced with a metal plate, it can be thinner than a rigid printed circuit board. However, on the other hand, since the materials of the imaging element and the imaging element mounting board are different from each other, there are cases where the imaging unit including the imaging element and the imaging element mounting board is placed in an external environment where high temperature and low temperature are repeated repeatedly. If it falls, thermal strain will occur, and the camera unit will warp. As a result, the positions of the imaging element and the optical lens are shifted, resulting in a malfunction of image distortion.
因此,對使用FPC之總厚度或金屬配線之厚度非常薄之FPC進行研究。此種FPC因熱應力已被大幅降低,故能抑制翹曲之發生。Therefore, the use of an FPC in which the total thickness of the FPC or the thickness of the metal wiring is very thin is studied. Such an FPC can suppress the occurrence of warpage because the thermal stress has been greatly reduced.
另,於攝像裝置,亦配置有自動調焦元件或手振修正機構等致動器模組。因此,作為攝像裝置整體,需流通更多電流。In addition, the imaging device is also provided with an actuator module such as an automatic focusing element or a manual vibration correction mechanism. Therefore, as a whole of the imaging device, more current needs to flow.
然而,於該攝像元件安裝基板中,因使金屬配線變薄,故難以流通更多電流。其結果,會發生無法配置(安裝)致動器模組之故障。However, in this imaging element mounting board, since the metal wiring is thinned, it is difficult to flow more current. As a result, a failure in which the actuator module cannot be arranged (mounted) occurs.
本發明提供一種能抑制翹曲之發生且能配置致動器模組之基板積層體及攝像裝置。 [解決問題之技術手段]The present invention provides a substrate laminate and an imaging device capable of suppressing the occurrence of warpage and arranging an actuator module. [Technical means to solve problems]
本發明[1]包含一種基板積層體,其具備:攝像元件安裝基板,其用以安裝攝像元件;及軟性配線電路基板,其可與較上述攝像元件需要更多電流之致動器模組電性連接,且與上述攝像元件安裝基板電性連接;且上述攝像元件安裝基板具有金屬配線,上述金屬配線之厚度為12 μm以下,上述攝像元件安裝基板之總厚度為60 μm以下;上述軟性配線電路基板之一部分係於上述攝像元件安裝基板中,配置於安裝上述攝像元件之安裝區域以外之區域。The present invention [1] includes a substrate laminate comprising: an imaging element mounting substrate on which an imaging element is mounted; and a flexible wiring circuit board capable of being electrically connected to an actuator module that requires more current than the imaging element. and electrically connected to the imaging element mounting board; and the imaging element mounting board has metal wiring, the thickness of the metal wiring is 12 μm or less, and the total thickness of the imaging element mounting board is 60 μm or less; the flexible wiring A part of the circuit board is arranged in the image pickup element mounting board in an area other than the mounting area where the image pickup element is mounted.
根據該基板積層體,攝像元件安裝基板之金屬配線之厚度為12 μm以下,攝像元件安裝基板之總厚度為60 μm以下,故而攝像元件安裝基板及其金屬配線非常薄。因此,隨著攝像元件之熱膨脹,攝像元件安裝基板靈活地變形,從而能抑制熱應力之發生。結果,能抑制翹曲之發生。According to this substrate laminate, the thickness of the metal wiring of the imaging element mounting board is 12 μm or less, and the total thickness of the imaging element mounting board is 60 μm or less, so the imaging element mounting board and its metal wiring are very thin. Therefore, the imaging element mounting substrate is flexibly deformed according to the thermal expansion of the imaging element, and the occurrence of thermal stress can be suppressed. As a result, the occurrence of warpage can be suppressed.
又,軟性配線電路基板之一部分配置於攝像元件安裝基板中安裝攝像元件之安裝區域以外之區域。因此,致動器模組能不經由攝像元件安裝基板而直接電性連接於軟性配線電路基板。故而,能將致動器模組配置於基板積層體及能使之運行。Moreover, a part of the flexible wiring circuit board is arrange|positioned in the area|region other than the mounting area|region in which the imaging element is mounted in the imaging element mounting board|substrate. Therefore, the actuator module can be directly electrically connected to the flexible wiring circuit board without going through the imaging element mounting board. Therefore, the actuator module can be arranged in the substrate laminate and can be operated.
本發明[2]包含如[1]所記載之基板積層體,其中上述軟性配線電路基板之上述一部分配置於安裝上述攝像元件之側之區域。The present invention [2] includes the substrate laminate according to [1], wherein the part of the flexible printed circuit board is disposed in a region on the side where the imaging element is mounted.
根據該基板積層體,能實現於攝像元件安裝基板安裝攝像元件所成之攝像裝置之低高度化。According to this board|substrate laminated body, the height reduction of the imaging device which mounts an imaging element on an imaging element mounting board|substrate can be achieved.
本發明[3]包含如[1]或[2]所記載之基板積層體,其中上述軟性配線電路基板之上述一部分係沿著上述攝像元件安裝基板之至少一端部而配置。The present invention [3] includes the board laminate according to [1] or [2], wherein the part of the flexible printed circuit board is arranged along at least one end of the imaging element mounting board.
根據該基板積層體,攝像元件安裝基板與軟性配線電路基板之接觸面積較大,故而接合強度提高。其結果,即便使基板積層體彎曲,亦能抑制攝像元件安裝基板與軟性配線電路基板之分離破壞。According to this substrate laminate, since the contact area between the imaging element mounting substrate and the flexible wiring circuit substrate is large, the bonding strength is improved. As a result, even if the board laminated body is bent, the separation and destruction of the imaging element mounting board and the flexible wiring circuit board can be suppressed.
本發明[4]包含如[1]~[3]中任一項所記載之基板積層體,其中上述軟性配線電路基板之上述一部分係以包圍上述安裝區域之四面之方式配置。The present invention [4] includes the substrate laminate according to any one of [1] to [3], wherein the part of the flexible wiring circuit board is arranged so as to surround four sides of the mounting region.
根據該基板積層體,攝像元件安裝基板與軟性配線電路基板之接觸面積更大,故而接合強度更進一步提高。其結果,即便使基板積層體彎曲,亦能更確實地抑制攝像元件安裝基板與軟性配線電路基板之分離破壞。According to this substrate laminate, since the contact area between the imaging element mounting substrate and the flexible wiring circuit substrate is larger, the bonding strength is further improved. As a result, even if the board laminated body is bent, the separation and destruction of the imaging element mounting board and the flexible wiring circuit board can be suppressed more reliably.
本發明[5]包含如[1]~[4]中任一項所記載之基板積層體,其進而具備剛性基板,該剛性基板配置於安裝上述攝像元件之側之區域。The present invention [5] includes the substrate laminate according to any one of [1] to [4], further comprising a rigid substrate disposed in a region on the side where the imaging element is mounted.
根據該基板積層體,較硬之剛性基板配置於攝像元件安裝基板,故而能更確實地抑制攝像元件安裝基板之翹曲。According to this substrate laminate, since a relatively rigid rigid substrate is arranged on the imaging element mounting substrate, warpage of the imaging element mounting substrate can be suppressed more reliably.
本發明[6]包含如[5]所記載之基板積層體,其中上述剛性基板可與上述致動器模組電性連接。The present invention [6] includes the substrate laminate according to [5], wherein the rigid substrate can be electrically connected to the actuator module.
根據該基板積層體,能於較硬之剛性基板直接安裝致動器模組,故而能將致動器模組穩定地配置於附剛性基板之基板積層體,其結果,能容易地進行安裝。According to this substrate laminate, the actuator module can be directly mounted on a relatively rigid rigid substrate, so that the actuator module can be stably arranged on the substrate laminate with the rigid substrate, and as a result, the mounting can be easily performed.
本發明[7]包含如[1]~[6]中任一項所記載之基板積層體,其中於上述攝像元件安裝基板中,配置上述金屬配線之配線區域之等效彈性模數為5 GPa以上55 GPa以下。The present invention [7] includes the substrate laminate according to any one of [1] to [6], wherein in the imaging element mounting substrate, the equivalent elastic modulus of the wiring region where the metal wiring is arranged is 5 GPa Above 55 GPa or below.
根據該基板積層體,配線區域之彈性模數較小,柔軟,故而能頗確實地抑制攝像元件安裝基板之翹曲。According to this substrate laminate, the wiring region has a small elastic modulus and is flexible, so that the warpage of the imaging element mounting substrate can be suppressed with certainty.
本發明[8]包含一種攝像裝置,其具備:如[1]~[7]中任一項所記載之基板積層體;攝像元件,其安裝於上述基板積層體;及致動器模組,其安裝於上述基板積層體,較上述攝像元件需要更多電流。The present invention [8] includes an imaging device comprising: the substrate laminate according to any one of [1] to [7]; an imaging element mounted on the substrate laminate; and an actuator module, It is mounted on the above-mentioned substrate laminate and requires more current than the above-mentioned imaging element.
根據該攝像裝置,能抑制攝像裝置之翹曲,並且能使致動器模組運行。 [發明之效果]According to this imaging device, the warpage of the imaging device can be suppressed, and the actuator module can be operated. [Effect of invention]
本發明之基板積層體及攝像裝置能抑制攝像元件安裝基板之翹曲之發生。又,因能流通更多電流,故能安裝及運行致動器模組。The substrate laminate and the imaging device of the present invention can suppress the occurrence of warpage of the imaging element mounting substrate. Also, since more current can flow, the actuator module can be installed and operated.
於圖1A中,紙面左右方向為前後方向(第1方向、長度方向),紙面左側為前側(第1方向一側),紙面右側為後側(第1方向另一側)。紙面上下方向為左右方向(與第1方向正交之第2方向、寬度方向),紙面上側為左側(第2方向一側),紙面下側為右側(第2方向另一側)。紙面紙厚方向為上下方向(厚度方向、與第1方向及第2方向正交之第3方向),紙面近前側為上側(厚度方向一側、第3方向一側),紙面內裏側為下側(厚度方向另一側、第3方向另一側)。具體以各圖之方向箭頭為依據。In FIG. 1A , the left-right direction on the page is the front-rear direction (first direction, longitudinal direction), the left side of the page is the front side (one side in the first direction), and the right side of the page is the rear side (the other side in the first direction). The upper and lower directions of the paper are the left-right direction (the second direction orthogonal to the first direction, the width direction), the upper side of the paper is the left side (one side in the second direction), and the lower side of the paper is the right side (the other side of the second direction). The thickness direction of the paper is the up-down direction (thickness direction, the third direction orthogonal to the first and second directions), the front side of the paper is the upper side (thickness direction side, the third direction side), and the inner side of the paper is down. side (the other side in the thickness direction, the other side in the third direction). The specifics are based on the direction arrows in each figure.
<第1實施形態> 1.基板積層體 參照圖1A-圖4B,對本發明之基板積層體之第1實施形態進行說明。<First Embodiment> 1. Substrate laminate The first embodiment of the substrate laminate of the present invention will be described with reference to FIGS. 1A to 4B .
圖1A所示之第1實施形態之基板積層體1係用以安裝攝像元件41(下述)之配線電路基板,尚未設置攝像元件41。基板積層體1具備攝像元件安裝基板2、作為軟性配線電路基板之一例之外部機器連接軟性配線電路基板3、及連接器4。The
(攝像元件安裝基板) 攝像元件安裝基板2(以下,簡記作安裝基板)係用以安裝攝像元件41之軟性配線電路基板。如圖1A-B及圖2所示,具有沿前後方向及左右方向(面方向)延伸之俯視大致矩形之平板形狀(片狀形狀)。(Imaging element mounting board) The imaging element mounting board 2 (hereinafter, simply referred to as a mounting board) is a flexible wiring circuit board on which the
如圖2所示,安裝基板2被劃分成安裝區域5及周邊區域6。As shown in FIG. 2 , the mounting
安裝區域5係配置攝像元件41之區域。即,安裝區域5係於已將攝像元件41配置於安裝基板2之情形下,沿厚度方向投影時,與攝像元件41重疊之區域。具體而言,如圖1之假想線所示,於安裝基板2之俯視大致中央,呈大致矩形形狀劃分出安裝區域5。於安裝區域5之外周部,配置有複數個用以與攝像元件41電性連接之攝像元件連接端子12(下述)。安裝區域5不具有不鏽鋼等金屬支持板。The mounting
於安裝基板2中,周邊區域6係安裝區域5以外之區域。又,周邊區域6係配置殼體42(下述)及外部機器連接軟性配線電路基板3之區域。即,周邊區域6係於已將殼體42(下述)配置於安裝基板2之情形下,沿厚度方向投影時,與殼體42及外部機器連接軟性配線電路基板3重疊之區域(安裝區域3除外)。具體而言,周邊區域6形成為外形及內形均為俯視大致矩形形狀之大致矩形框狀,且其內端緣與安裝區域5之外端緣連續。於周邊區域6之後端緣,配置有複數個用以與外部機器連接軟性配線電路基板3電性連接之連接基板連接端子13(下述)。In the mounting
如圖3所示,安裝基板2具備第1基底絕緣層7、第1導體圖案8及第1覆蓋絕緣層9。As shown in FIG. 3 , the mounting
第1基底絕緣層7配置於安裝基板2之最上層。第1基底絕緣層7構成安裝基板2之外形,且形成為俯視大致矩形形狀。第1基底絕緣層7之上表面形成為平坦狀。於第1基底絕緣層7,形成有複數個攝像元件連接端子開口部10及複數個連接基板連接端子開口部11。The first
複數個攝像元件連接端子開口部10(以下,簡記作第1開口部)係用以使攝像元件連接端子12自上表面露出之開口部。複數個第1開口部10係以形成矩形框狀之方式,相互隔開間隔而整齊排列地配置於安裝區域5之周端部。第1開口部10於厚度方向上貫通第1基底絕緣層7,且具有俯視大致圓形形狀。第1開口部10具有越朝上側截面面積越小之錐形形狀。The plurality of imaging element connection terminal openings 10 (hereinafter, simply referred to as first openings) are openings for exposing the imaging
複數個連接基板連接端子開口部11(以下,簡記作第2開口部)係用以使連接基板連接端子13自上表面露出之開口部。複數個第2開口部11沿左右方向相互隔開間隔而整齊排列地配置於周邊區域6之後端緣。第2開口部11於厚度方向上貫通第1基底絕緣層7,且具有俯視大致矩形形狀(長方形形狀)。第2開口部11於俯視下,形成為自周邊區域6之後端緣向前側延伸。The plurality of connection board connection terminal openings 11 (hereinafter, simply referred to as second openings) are openings for exposing the connection
第1基底絕緣層7由絕緣性材料形成。作為絕緣性材料,例如可列舉聚醯亞胺樹脂、聚醯胺醯亞胺樹脂、丙烯酸樹脂、聚醚腈樹脂、聚醚碸樹脂、聚對苯二甲酸乙二酯樹脂、聚萘二甲酸乙二酯樹脂、聚氯乙烯樹脂等合成樹脂等。較佳為第1基底絕緣層7由聚醯亞胺樹脂形成。The first
第1基底絕緣層7之彈性模數例如為1 GPa以上,較佳為5 GPa以上,又,例如為20 GPa以下,較佳為15 GPa以下。絕緣層等之樹脂層之彈性模數例如可藉由動態黏彈性測定,以JIS K7244或ISO 6721為依據而測定。The elastic modulus of the first insulating
第1基底絕緣層7之熱膨脹係數例如為1 ppm/K以上,較佳為5 ppm/K以上,又,例如為50 ppm/K以下,較佳為30 ppm/K以下。絕緣層等之樹脂層之熱膨脹係數係面方向之線熱膨脹係數,例如可藉由熱機械分析,於JIS K7197之條件下測定。The thermal expansion coefficient of the first insulating
第1基底絕緣層7之厚度T1
例如為1 μm以上,較佳為5 μm以上,又,例如為30 μm以下,較佳為10 μm以下,更佳為8 μm以下。The thickness T1 of the first insulating
第1導體圖案8係以與第1基底絕緣層7之下表面接觸之方式,設置於第1基底絕緣層7之下側。第1導體圖案8具備複數個攝像元件連接端子12、複數個連接基板連接端子13及複數根第1金屬配線14。The
如圖2所示,複數個攝像元件連接端子12係以形成矩形框狀之方式,相互隔開間隔而整齊排列地配置於安裝區域5之周端部。即,複數個攝像元件連接端子12係以與所安裝之攝像元件41之複數個端子46(下述)對應之方式設置。As shown in FIG. 2 , the plurality of imaging
攝像元件連接端子12具有俯視大致圓形形狀。攝像元件連接端子12配置於第1開口部10內,於側剖視下,形成為向上側凸起。攝像元件連接端子12之內側部之上表面自第1開口部10露出,且形成為與第1基底絕緣層7之上表面處於同一平面。The imaging
複數個連接基板連接端子13沿左右方向相互隔開間隔而整齊排列地配置於周邊區域6之後端緣。即,複數個連接基板連接端子13係以與複數個安裝基板連接端子24(下述)對應之方式設置。連接基板連接端子13具有俯視大致矩形形狀(長方形形狀)。連接基板連接端子13配置於第2開口部11內,且其上表面自第2開口部11露出。再者,於圖2中,省略了複數個連接基板連接端子13之一部分(左右方向中央部)。A plurality of connection
如圖3所示,複數根第1金屬配線14具備複數根第1連接配線15及複數根接地配線16。As shown in FIG. 3 , the plurality of first metal wirings 14 include a plurality of first connection wirings 15 and a plurality of
複數根第1連接配線15係以與複數個攝像元件連接端子12(或複數個連接基板連接端子13)對應之方式設置。具體而言,第1連接配線15係以將攝像元件連接端子12與連接基板連接端子13連接之方式,與其等構成一體而形成。即,第1連接配線15之一端與攝像元件連接端子12連續,第1連接配線15之另一端與連接基板連接端子13連續,而將其等電性連接。The plurality of first connection wires 15 are provided so as to correspond to the plurality of imaging element connection terminals 12 (or the plurality of connection board connection terminals 13 ). Specifically, the first connection wiring 15 is formed integrally with the image pickup
複數根接地配線16係以與複數根第1連接配線15對應之方式設置。具體而言,複數根接地配線16係以沿著複數根第1連接配線15之方式,設置於複數根第1連接配線15之外側。於接地配線16之一端,與之構成一體地連接有未圖示之接地端子。The plurality of
再者,於沿厚度方向投影安裝基板2時,將第1金屬配線14(金屬配線)所處之俯視或仰視之區域設定為配線區域17。Furthermore, when the mounting
作為第1導體圖案8之材料,例如可列舉銅、銀、金、鎳或包含其等之合金、焊料等金屬材料。較佳可列舉銅。As a material of the
第1導體圖案8之彈性模數例如為50 GPa以上,較佳為100 GPa以上,又,例如為200 GPa以下,較佳為150 GPa以下。導體圖案等之金屬之彈性模數例如可藉由拉伸試驗測定,以JIS Z2241為依據而測定。The elastic modulus of the
第1導體圖案8之熱膨脹係數例如為1 ppm/K以上,較佳為5 ppm/K以上,又,例如為30 ppm/K以下,較佳為20 ppm/K以下。導體圖案等之金屬之熱膨脹係數係面方向之線熱膨脹係數,例如可藉由熱機械分析裝置或光掃描式測定裝置,以JIS Z2285為依據而測定。The thermal expansion coefficient of the
第1導體圖案8(第1金屬配線14、各端子12、13)之厚度T2
(乃至金屬配線之總厚度)自抑制安裝時之安裝基板2翹曲之觀點而言,為12 μm以下,較佳為8 μm以下,更佳為5 μm以下。又,自處理性之觀點而言,例如為1 μm以上,較佳為3 μm以上。The thickness T 2 of the first conductor pattern 8 (the first metal wiring 14 and each of the
第1金屬配線14之寬度例如為5 μm以上,較佳為10 μm以上,又,例如為100 μm以下,較佳為50 μm以下。The width of the first metal wiring 14 is, for example, 5 μm or more, preferably 10 μm or more, and, for example, 100 μm or less, or preferably 50 μm or less.
第1覆蓋絕緣層9係以被覆第1導體圖案8之方式,設置於第1基底絕緣層7及第1導體圖案8之下側。即,第1覆蓋絕緣層9係以與第1導體圖案8之下表面及側面、以及自第1導體圖案8露出之第1基底絕緣層7之下表面接觸之方式配置。第1覆蓋絕緣層9之外形,除了第2開口部11之形成部分以外,形成為與第1基底絕緣層7之外形大致相同。The first insulating cover layer 9 is provided on the lower side of the first insulating
第1覆蓋絕緣層9由與上文中針對第1基底絕緣層7所敍述之絕緣性材料相同之絕緣性材料形成,較佳為由聚醯亞胺樹脂形成。The first insulating cover layer 9 is formed of the same insulating material as the insulating material described above for the first insulating
第1覆蓋絕緣層9之彈性模數例如為1 GPa以上,較佳為5 GPa以上,又,例如為20 GPa以下,較佳為15 GPa以下。The elastic modulus of the first insulating cover layer 9 is, for example, 1 GPa or more, preferably 5 GPa or more, and, for example, 20 GPa or less, or preferably 15 GPa or less.
第1覆蓋絕緣層9之熱膨脹係數例如為1 ppm/K以上,較佳為5 ppm/K以上,又,例如為50 ppm/K以下,較佳為30 ppm/K以下。The thermal expansion coefficient of the first insulating cover layer 9 is, for example, 1 ppm/K or more, preferably 5 ppm/K or more, and, for example, 50 ppm/K or less, or preferably 30 ppm/K or less.
第1覆蓋絕緣層9之厚度T3 例如為1 μm以上,較佳為2 μm以上,又,例如為30 μm以下,較佳為10 μm以下,更佳為5 μm以下。The thickness T3 of the first insulating cover layer 9 is, for example, 1 μm or more, preferably 2 μm or more, and, for example, 30 μm or less, preferably 10 μm or less, and more preferably 5 μm or less.
安裝基板2之配線區域17之等效彈性模數例如為5 GPa以上,較佳為10 GPa以上,又,例如為55 GPa以下,較佳為50 GPa以下,更佳為40 GPa以下,進而更佳為30 GPa以下,尤佳為20 GPa以下。藉由將配線區域17之等效彈性模數設定為上述上限以下,能抑制安裝基板2之翹曲之發生。又,藉由將配線區域17之等效彈性模數設定為上述下限以上,能使基板積層體1之處理性優異。The equivalent elastic modulus of the
等效彈性模數D係使構成配線區域17之各層(例如,第1基底絕緣層7、第1金屬配線14、第1覆蓋絕緣層9)之彈性模數各自乘以所述各層之厚度分率,再將所得之值相加而獲得。具體而言,例如,於圖2~圖3所示之實施形態中,利用下述計算式而獲得。The equivalent elastic modulus D is obtained by multiplying the elastic modulus of each layer (for example, the first insulating
D={D1
×T1
+D2
×T2
+D3
×T3
}/{T1
+T2
+T3
} D1
表示第1基底絕緣層7之彈性模數,T1
表示第1基底絕緣層7之厚度。 D2
表示第1金屬配線14之彈性模數,T2
表示第1金屬配線14之厚度。 D3
表示第1覆蓋絕緣層9之彈性模數,T3
表示第1覆蓋絕緣層9之厚度。D={D 1 ×T 1 +D 2 ×T 2 +D 3 ×T 3 }/{T 1 +T 2 +T 3 } D 1 represents the elastic modulus of the first insulating
再者,上述等效彈性模數D係從由第1層及第2層積層而成之平行平板模型之佛克特(Voigt)函數:Ey =V1 E1 +V2 E2 (Ey 表示整體之楊氏模數,V1 表示第1層之體積,E1 表示第1層之材料之楊氏模數,V2 表示第2層之體積,E2 表示第2層之材料之楊氏模數)近似導出。In addition, the above-mentioned equivalent elastic modulus D is obtained from the Voigt function of the parallel plate model formed by laminating the first layer and the second layer: E y =V 1 E 1 +V 2 E 2 (E y Represents the overall Young's modulus, V 1 represents the volume of the first layer, E 1 represents the Young's modulus of the material of the first layer, V 2 represents the volume of the second layer, E 2 represents the Young's modulus of the material of the second layer Modulus) is approximated.
於配線區域17中,金屬之合計厚度相對於絕緣層之合計厚度之比率,即,第1金屬配線14之厚度相對於第1基底絕緣層7及第1覆蓋絕緣層9之合計厚度之比率(T2
/(T1
+T3
))例如為0.05以上,較佳為0.10以上,更佳為0.20以上,又,例如為0.90以下,較佳為0.70以下,更佳為0.50以下,進而更佳為0.20以下。藉由將上述比率設定為上述範圍,能容易地將等效彈性模數調整至合適之範圍(例如,5 GPa以上55 GPa以下)內,其結果,能更確實地抑制翹曲之發生。In the
安裝基板2之總厚度(最大厚度)自翹曲之抑制及處理性之觀點而言,為60 μm以下,較佳為40 μm以下,更佳為30 μm以下,進而更佳為20 μm以下,尤佳為10 μm以下,又,例如為1 μm以上,較佳為5 μm以上。The total thickness (maximum thickness) of the mounting
安裝基板2例如可藉由如下各步驟而製造:準備上表面平坦之金屬支持基板(例如,不鏽鋼基板);於該上表面,形成具有各開口部(10、11)之第1基底絕緣層7;於該第1基底絕緣層7之上表面、及自各開口部露出之金屬支持基板之上表面,形成第1導體圖案8;以被覆第1基底絕緣層7及第1導體圖案8之方式,形成第1覆蓋絕緣層9;及將金屬支持基板去除。然後,藉由將所製造出之安裝基板2上下反轉,而獲得圖3所示之安裝基板2。The mounting
(外部機器連接軟性配線電路基板) 外部機器連接軟性配線電路基板3(以下,簡記作連接基板)係用以將安裝基板2與母板等外部機器(未圖示)電性連接之軟性配線電路基板,且係用以將致動器模組45(下述)與外部機器與電性電性連接之軟性配線電路基板。(External device connection flexible wiring circuit board) The external device connecting flexible wiring circuit board 3 (hereinafter, abbreviated as "connecting board") is a flexible wiring circuit for electrically connecting the mounting
如圖1A-B所示,連接基板3被劃分成安裝基板配置區域20、連接區域21及連接器區域22。As shown in FIGS. 1A-B , the
安裝基板配置區域20(以下,簡記作配置區域)配置於連接基板3之前端部,係沿厚度方向投影時,與安裝基板2重疊之區域。配置區域20具有外形及內形均為俯視大致矩形形狀之大致矩形框狀。即,配置區域20形成為俯視大致矩形形狀,且於其中央部,形成有於厚度方向上貫通之俯視大致矩形形狀之安裝區域開口部23。配置區域20之外形較安裝基板2之外形略小,配置區域20之內形較安裝基板2之安裝區域5略大。於配置區域20之後端部,分別配置有複數個用以與安裝基板2電性連接之安裝基板連接端子24(下述)、及用以與致動器模組45電性連接之模組連接端子25(下述)。The mounting board arrangement region 20 (hereinafter, abbreviated as "arrangement region") is arranged at the front end of the
連接區域21配置於連接基板3之前後方向中央,具有沿前後方向延伸之俯視大致矩形形狀。連接區域21之前端與配置區域20之後端相連,連接區域21之後端與連接器區域22相連。於連接區域21,沿左右方向隔開間隔而配置有沿前後方向延伸之複數根第2金屬連接配線30(下述)。The
連接器區域22配置於連接基板3之後端部,具有俯視大致矩形形狀。連接器區域22之前端與連接區域21之後端相連。The
於連接器區域22,配置有複數個用以與連接器4電性連接之連接器連接端子32。In the
如圖4A-B所示,連接基板3具備第2基底絕緣層26、第2導體圖案27及第2覆蓋絕緣層28。As shown in FIGS. 4A-B , the
第2基底絕緣層26配置於連接基板3之最下層。第2基底絕緣層26構成連接基板3之外形,且形成為俯視大致矩形形狀。於第2基底絕緣層26之配置區域20,形成有複數個安裝基板連接端子開口部29。The second
複數個安裝基板連接端子開口部29(以下,簡記作第3開口部)係用以使安裝基板連接端子24自下表面露出之開口部。複數個第3開口部29係以與複數個第2開口部11對應之方式,沿左右方向相互隔開間隔而整齊排列地配置於配置區域20之後端部之寬度方向中央。第3開口部29於厚度方向上貫通第2基底絕緣層26,且具有俯視大致矩形形狀(長方形形狀)。The plurality of mounting board connecting terminal openings 29 (hereinafter, simply referred to as third openings) are openings for exposing the mounting
第2基底絕緣層26由絕緣性材料形成。作為絕緣性材料,由與上文中針對第1基底絕緣層7所敍述之絕緣性材料相同之絕緣性材料形成,較佳為由聚醯亞胺樹脂形成。The second
第2基底絕緣層26之厚度T4
例如為5 μm以上,較佳為10 μm以上,又,例如為50 μm以下,較佳為30 μm以下。The thickness T 4 of the second insulating
第2導體圖案27係以與第2基底絕緣層26之上表面接觸之方式,設置於第2基底絕緣層26之上側。第2導體圖案27具備複數個安裝基板連接端子24、複數個(2個)模組連接端子25、複數個連接器連接端子32及複數根第2金屬連接配線30。The second
複數個安裝基板連接端子24沿左右方向相互隔開間隔而整齊排列地配置於配置區域20之後端部之左右方向中央。即,複數個安裝基板連接端子24係以與複數個連接基板連接端子13對應之方式設置。安裝基板連接端子24具有俯視大致矩形形狀(長方形形狀)。安裝基板連接端子24配置於第3開口部29內,且其下表面自第3開口部29露出。The plurality of mounting
複數個(2個)模組連接端子25沿左右方向相互隔開間隔而整齊排列地配置於配置區域20之後側之左右方向端部。即,複數個模組連接端子25係以於已將殼體42(下述)配置於配置區域20時,與複數個(2個)殼體側端子47(下述)對應之方式設置。模組連接端子25具有俯視大致矩形形狀。模組連接端子25配置於模組連接端子開口部31(下述)內,且其上表面自模組連接端子開口部31露出。A plurality of (two)
複數個連接器連接端子32係將複數個安裝基板連接端子24及複數個模組連接端子25各自電性連接於連接器4之端子,其數量為安裝基板連接端子24及模組連接端子25之合計數量。複數個連接器連接端子32沿左右方向相互隔開間隔而整齊排列地配置於連接器區域22。即,以與連接器4之複數個連接器側端子38(下述)對應之方式設置。連接器連接端子32配置於第5開口部33(下述)內,且其上表面自第5開口部33露出。The plurality of
複數根第2金屬連接配線30係以與複數個安裝基板連接端子24及複數個模組連接端子25對應之方式設置。具體而言,複數根第2金屬連接配線30之一部分係以將安裝基板連接端子24與連接器連接端子32沿前後方向連接之方式,與其等構成一體而形成。即,第2金屬連接配線30之一端與安裝基板連接端子24連續,第2金屬連接配線34之另一端與連接器連接端子32連續,而將其等電性連接。又,複數根第2金屬連接配線30之一部分(2個)係以將模組連接端子25與連接器連接端子32沿前後方向連接之方式,與其等構成一體而形成。即,第2金屬連接配線30之一端與模組連接端子25連續,第2金屬連接配線34之另一端與連接器連接端子32連續,而將其等電性連接。The plurality of second
作為第2導體圖案27之材料,由與上文中針對第1導體圖案8所敍述之金屬材料相同之金屬材料形成,較佳可列舉銅。As the material of the
第2導體圖案27(第2金屬連接配線30、各端子24、25)之厚度T5
(乃至金屬配線之總厚度)自可流通之電流之大小之觀點而言,較第1導體圖案8之厚度T2
厚,例如超過12 μm,較佳為15 μm以上,又,例如為40 μm以下,較佳為25 μm以下。又,第2導體圖案27之厚度T5
相對於第1導體圖案8之厚度T2
之比(T5
/T2
)(乃至連接基板3之金屬配線之總厚度相對於安裝基板2之金屬配線之總厚度之比)例如為1.2以上,較佳為1.5以上,又,例如為10以下,較佳為5以下。The thickness T 5 of the second conductor pattern 27 (the second
第2金屬連接配線30之寬度例如為15 μm以上,較佳為25 μm以上,又,例如為1000 μm以下,較佳為500 μm以下。The width of the second
第2覆蓋絕緣層28係以被覆第2導體圖案27之方式,設置於第2基底絕緣層26及第2導體圖案27之上側。即,第2覆蓋絕緣層28係以與第2導體圖案27之上表面及側面、以及自第2導體圖案27露出之第2基底絕緣層26之上表面接觸之方式配置。第2覆蓋絕緣層28之外形形成為與第2基底絕緣層26相同。The second
於第2覆蓋絕緣層28,形成有複數個模組連接端子開口部31及複數個連接器連接端子開口部33。A plurality of module
複數個模組連接端子開口部31(以下,簡記作第4開口部)係用以使模組連接端子25自上表面露出之開口部。複數個第4開口部31與複數個模組連接端子25對應,沿左右方向相互隔開間隔而整齊排列地配置於配置區域20之後部之寬度方向外側。複數個第4開口部31於厚度方向上貫通第2覆蓋絕緣層28,且具有俯視大致矩形形狀。The plurality of module connection terminal openings 31 (hereinafter, simply referred to as fourth openings) are openings for exposing the
複數個連接器連接端子開口部33(以下,簡記作第5開口部)係用以使連接器連接端子32自上表面露出之開口部。複數個第5開口部33與複數個連接器連接端子32對應,沿左右方向相互隔開間隔而整齊排列地配置於連接器區域22。The plurality of connector connection terminal openings 33 (hereinafter, simply referred to as fifth openings) are openings for exposing the
第2覆蓋絕緣層28由與上文中針對第2基底絕緣層26所敍述之絕緣性材料相同之絕緣性材料形成,較佳為由聚醯亞胺樹脂形成。The second
第2覆蓋絕緣層28之厚度T6
例如為10 μm以上,較佳為15 μm以上,又,例如為50 μm以下,較佳為30 μm以下。The thickness T 6 of the second insulating
連接基板3之總厚度(最大厚度)自可流通之電流之大小之觀點及處理性之觀點而言,較安裝基板2厚,例如超過60 μm,較佳為80 μm以上,又,例如為200 μm以下,較佳為120 μm以下。連接基板3之總厚度相對於安裝基板2之總厚度之比例如為1.5以上,較佳為2.0以上,又,例如為10以下,較佳為5以下。The total thickness (maximum thickness) of the
連接基板3例如可藉由如下各步驟而製造:形成第2基底絕緣層26;於第2基底絕緣層26之上表面,形成第2導體圖案27;及以被覆第2導體圖案27及第2基底絕緣層26之方式,形成第2覆蓋絕緣層28。The
(連接器) 連接器4係用以將連接基板3與外部機器(未圖示)電性連接之連接元件。如圖1A-B所示,連接器4具有沿左右方向延伸之俯視大致矩形形狀。連接器4具備複數個用以與複數個連接器連接端子32電性連接之連接器側端子38。(Connector) The
(基板積層體) 如圖1A-B所示,基板積層體1具備安裝基板2、配置於安裝基板2之上側之連接基板3、及配置於連接基板3之上側之連接器4。(Substrate Laminated Product) As shown in FIGS. 1A-B , the
連接基板3係以配置區域20(連接基板3之一部分)之下表面與安裝基板2之周邊區域6之上表面接觸之方式,配置於安裝基板2之周邊區域6之上側。即,沿厚度方向投影時,連接基板3係以配置區域20與安裝基板2重疊,但連接區域21及連接器區域22不與安裝基板2重疊之方式,配置於安裝基板2之上側。沿厚度方向投影時,安裝基板2包含連接基板3之配置區域20。即,於俯視下,安裝基板2較連接基板3之配置區域20略大。The connecting
配置區域20係沿著安裝基板2之4個端部(前端部、後端部、左端部及右端部)而配置。具體而言,配置區域20係以將安裝區域5配置於安裝區域開口部23內,且包圍安裝區域5之四面之方式配置。即,安裝區域開口部23於俯視下,包含安裝區域5之全域,安裝區域開口部23之周端緣與安裝區域5之周端緣隔開間隔。The
連接基板3經由未圖示之絕緣性接著劑等,固定於周邊區域6之上表面。又,連接基板3與安裝基板2電性連接,具體而言,參照圖4B,經由焊料、導電性接著劑等導電性接合材35,將連接基板連接端子13與安裝基板連接端子24接合。The
連接器4係以連接器4之下表面與連接基板3之連接器區域22之上表面接觸之方式,配置於連接基板3之連接器區域22之上側。沿厚度方向投影時,連接器4配置於連接器區域22之俯視大致中央。The
連接器4經由未圖示之絕緣性接著劑等,固定於連接器區域22之上表面。又,連接器4與連接基板3電性連接,具體而言,經由導電性接合材35,將連接器連接端子32與連接器側端子38接合。The
此種基板積層體1例如用於用以安裝攝像元件41(下述)之配線電路基板。即,基板積層體1用於相機模組等攝像裝置。Such a
2.攝像裝置 參照圖5A-圖6B,對具備基板積層體1之攝像裝置40進行說明。2. Imaging device Referring to FIGS. 5A to 6B , an
攝像裝置40具備基板積層體1、攝像元件41、殼體42、光學透鏡43、濾波器44及致動器模組45。The
攝像元件41係將光轉換成電氣信號之半導體元件,例如可列舉CMOS感測器、CCD感測器等固體攝像元件。使攝像元件41運行所需之電流例如為500 mA以下,較佳為未達300 mA,又,例如為50 mA以上。The
攝像元件41形成為俯視大致矩形之平板形狀,且具備Si基板等矽、配置於其上之光電二極體(光電轉換元件)及彩色濾光片,對此並未圖示。於攝像元件41之下表面,設置有複數個與安裝基板2之攝像元件連接端子12對應之端子46。The
攝像元件41(尤其是Si基板)之彈性模數例如為100 GPa以上,較佳為120 GPa以上,又,例如為200 GPa以下,較佳為150 GPa以下。攝像元件41之彈性模數例如可藉由拉伸試驗測定,以JIS Z2241為依據而測定。The elastic modulus of the imaging element 41 (especially the Si substrate) is, for example, 100 GPa or more, preferably 120 GPa or more, and, for example, 200 GPa or less, preferably 150 GPa or less. The elastic modulus of the
攝像元件41(尤其Si基板)之熱膨脹係數例如為1 ppm/K以上,較佳為2 ppm/K以上,又,例如為10 ppm/K以下,較佳為5 ppm/K以下。攝像元件41之熱膨脹係數係面方向之線熱膨脹係數,例如可藉由熱機械分析裝置或光掃描式測定裝置,以JIS Z2285為依據而測定。The thermal expansion coefficient of the imaging element 41 (especially the Si substrate) is, for example, 1 ppm/K or more, preferably 2 ppm/K or more, and, for example, 10 ppm/K or less, preferably 5 ppm/K or less. The thermal expansion coefficient of the
攝像元件41之厚度例如為10 μm以上,較佳為50 μm以上,又,例如為1000 μm以下,較佳為500 μm以下。The thickness of the
攝像元件41安裝於安裝基板2之安裝區域5。即,攝像元件41之端子46經由焊料等導電性接合材35等,與對應之安裝基板2之攝像元件連接端子12覆晶安裝。藉此,攝像元件41配置於安裝基板2之安裝區域5之上表面,且與安裝基板2之攝像元件連接端子12電性連接。The
攝像元件41藉由安裝於安裝基板2之安裝區域5,而如圖5A-B所示,構成攝像單元49。即,攝像單元49具備基板積層體1、及安裝於基板積層體1之攝像元件41。The
殼體42係以與攝像元件41沿面方向隔開間隔而將其包圍之方式,配置於周邊區域6之上表面。殼體42具有俯視大致矩形形狀之筒狀。於殼體42之上端,設置有用以固定光學透鏡43之固定部。The
又,於殼體42具備設置於殼體42之下端(端部)之殼體側端子47、及自致動器模組45延伸至殼體側端子47之模組連接配線48。殼體側端子47經由導電性接合材35,與模組連接端子25接合。藉此,致動器模組45不經由安裝基板2,而與連接基板3直接電性連接。Further, the
光學透鏡43係與安裝基板2及攝像元件41隔開間隔而配置於安裝基板2之上側。光學透鏡43形成為俯視大致圓形形狀,且以來自外部之光到達攝像元件41之方式,藉由固定部而固定。The
濾波器44與攝像元件41及光學透鏡43隔開間隔而配置於攝像元件41及光學透鏡43之上下方向中央,並固定於殼體42。The
致動器模組45係將來自外部機器之電氣信號轉換成物理運動之元件,例如可舉出自動調焦元件(autofocus)、手振修正機構(optical image stabilizer)等。使致動器模組45運行所需之電流例如為200 mA以上,較佳為300 mA以上,又,例如為1000 mA以下。The
致動器模組45固定於光學透鏡43之周邊之殼體42。The
而且,基板積層體1具備安裝基板2及連接基板3,安裝基板2具有第1金屬配線14,第1金屬配線14之厚度為12 μm以下,安裝基板2之總厚度為60 μm以下。又,連接基板3之配置區域20配置於安裝基板2之周邊區域6。Furthermore, the
於該基板積層體1中,安裝基板2及第1金屬配線14非常薄。因此,隨著攝像元件41之熱膨脹,安裝基板2之安裝區域5靈活地變形,從而能抑制熱應力之發生。結果,能於反覆出現高溫及低溫之環境下,抑制安裝基板2之安裝區域5、乃至攝像裝置40之翹曲之發生。In this
又,連接基板3之配置區域20配置於安裝基板2之周邊區域6之上側。因此,致動器模組45能不經由安裝基板2,而直接電性連接於連接基板3。故而,能將致動器模組45配置於基板積層體1,並使之電性連接,且能使致動器模組45運行。In addition, the
又,於基板積層體1中,連接基板3之配置區域20配置於周邊區域6之上側(安裝攝像元件41之側)。Moreover, in the board|substrate laminated
因此,能實現攝像裝置40之低高度化。即,能縮小攝像裝置40之上端與下端之上下方向距離(於圖6B中,為殼體42之上端與安裝基板2之下表面之上下方向距離)。具體而言,於連接基板3配置於周邊區域6之下側之圖7B所示之第2實施形態(下述)中,攝像裝置40之上端與下端之上下方向距離成為殼體42與連接基板3之下表面之上下方向距離,因此圖6B所示之第1實施形態與圖7B所示之第2實施形態相比,能依連接基板3之厚度,相應地低高度化。再者,於第1實施形態及第2實施形態中,均為光學透鏡43之中心與攝像元件41之上表面之上下方向距離(即,焦點距離,圖7B所示之D1
)相同,故而殼體42之上端與安裝基板2之上表面之上下方向距離(圖7B所示之D2
)亦彼此相同。Therefore, the height of the
又,於基板積層體1中,連接基板3之配置區域20係沿著安裝基板2之4個端部而配置。即,配置區域20係以包圍安裝區域5之四面之方式配置。Moreover, in the board|substrate laminated
因此,安裝基板2與連接基板3之接觸面積變大,故而其等之接合強度更進一步提高。其結果,即便使基板積層體1沿上下方向彎曲,亦能於安裝基板2與連接基板3之接合點,確實地抑制分離破壞。Therefore, since the contact area of the mounting
又,於基板積層體1中,安裝基板2之配線區域17之等效彈性模數為5 GPa以上55 GPa以下。Moreover, in the board|substrate laminated
因此,配線區域17之彈性模數較小,柔軟。故而,能頗確實地抑制安裝基板2之翹曲。Therefore, the elastic modulus of the
又,攝像裝置40具備基板積層體1、攝像元件41及致動器模組45。Further, the
因此,能抑制攝像裝置40之翹曲,並且能使致動器模組45運行。Therefore, the warpage of the
3.變化例 (1)圖3所示之安裝基板2沿厚度方向依序具備第1基底絕緣層7、第1導體圖案8及第1覆蓋絕緣層9,即,安裝基板2之導體層(導體圖案)為單層,但例如,安裝基板2之導體層亦可為複數層(例如,2層以上,較佳為2~4層),對此並未圖示。即,例如,安裝基板2亦可沿厚度方向依序具備第1基底絕緣層7、第1導體圖案8、第1覆蓋絕緣層9、第3導體圖案及第3覆蓋絕緣層(導體層雙層構成),又,安裝基板2亦可沿厚度方向依序具備第1基底絕緣層7、第1導體圖案8、第1覆蓋絕緣層9、第3導體圖案、第3覆蓋絕緣層、第4導體圖案及第4覆蓋絕緣層(導體層三層構成)。3. Variation (1) The mounting
第3導體圖案及第4導體圖案之構成分別與第1導體圖案8之構成相同,又,第3覆蓋絕緣層及第4覆蓋絕緣層之構成分別與第1覆蓋絕緣層9之構成相同。The configurations of the third conductor pattern and the fourth conductor pattern are respectively the same as those of the
安裝基板2之總厚度亦與圖3所示之實施形態相同(例如,60 μm以下等)。The total thickness of the mounting
關於安裝基板2之金屬配線之總厚度(例如,第1導體圖案所具備之第1金屬配線14、第3導體圖案所具備之金屬配線、及第4導體圖案所具備之金屬配線之合計厚度),例如,自翹曲之抑制之觀點而言,例如為12 μm以下,較佳為10 μm以下,更佳為8 μm以下,又,自處理性之觀點而言,例如為1 μm以上,較佳為3 μm以上。連接基板3之金屬配線之總厚度相對於安裝基板2之金屬配線之總厚度之比亦與圖1所示之實施形態相同(例如,1.2以上等)。又,配線區域(各導體層之金屬配線所處之區域)之等效彈性模數D、及所有金屬之合計厚度相對於所有絕緣層之合計厚度之比率等亦與圖1所示之實施形態相同。About the total thickness of the metal wiring of the mounting board 2 (for example, the total thickness of the first metal wiring 14 included in the first conductor pattern, the metal wiring included in the third conductor pattern, and the metal wiring included in the fourth conductor pattern) For example, from the viewpoint of suppressing warpage, it is, for example, 12 μm or less, preferably 10 μm or less, more preferably 8 μm or less, and from the viewpoint of handling properties, for example, 1 μm or more, preferably Preferably, it is 3 μm or more. The ratio of the total thickness of the metal wirings of the
(2)圖4A-B所示之連接基板3沿厚度方向依序具備第2基底絕緣層26、第2導體圖案27及第2覆蓋絕緣層28,即,連接基板3之導體層(導體圖案)為單層,但例如,連接基板3之導體層亦可為複數層(例如,2層以上,較佳為2~4層),對此並未圖示。即,例如,連接基板3亦可沿厚度方向依序具備第2基底絕緣層26、第2導體圖案27、第2覆蓋絕緣層28、第5導體圖案及第5覆蓋絕緣層(導體層雙層構成),又,連接基板3亦可沿厚度方向依序具備第2基底絕緣層26、第2導體圖案27、第2覆蓋絕緣層28、第5導體圖案、第5覆蓋絕緣層、第6導體圖案及第6覆蓋絕緣層(導體層三層構成)。(2) The connecting
第5導體圖案及第6導體圖案之構成分別與第2導體圖案27相同,第5覆蓋絕緣層及第6覆蓋絕緣層之構成分別與第2覆蓋絕緣層28之構成相同。The configurations of the fifth conductor pattern and the sixth conductor pattern are respectively the same as those of the
連接基板3之總厚度亦與圖4A-B所示之實施形態相同(例如,超過60 μm等)。The total thickness of the
金屬配線之總厚度(具體而言,第2導體圖案所具備之第2金屬連接配線30、第5導體圖案所具備之金屬連接配線、及第6導體圖案所具備之金屬連接配線之合計厚度)例如自流通更多電流之觀點而言,例如超過12 μm,較佳為15 μm以上,又,例如為40 μm以下,較佳為25 μm以下。又,連接基板3之金屬配線之總厚度相對於安裝基板2之金屬配線之總厚度之比亦與圖1所示之實施形態相同(例如,1.2以上等)。The total thickness of the metal wiring (specifically, the total thickness of the second
(3)於圖6B所示之攝像裝置40中,攝像元件41覆晶安裝於安裝基板2,但例如,攝像元件41亦可藉由線接合而安裝於安裝基板2,對此並未圖示。(3) In the
(4)於圖6所示之攝像裝置40中,模組連接端子25經由導電性接合材35,與殼體側端子47電性連接,但例如,模組連接端子25亦可藉由線接合而與殼體側端子47電性連接,對此並未圖示。(4) In the
<第2實施形態> 參照圖7A-B,對基板積層體1及攝像裝置40之第2實施形態進行說明。再者,於第2實施形態之基板積層體1及攝像裝置40中,對與上述圖中所示之第1實施形態相同之構件標註相同之符號,並將其說明省略。<Second Embodiment> Referring to FIGS. 7A-B, a second embodiment of the
於第1實施形態之安裝基板2中,連接基板3之配置區域20配置於周邊區域6之上側,於第2實施形態之安裝基板2中,如圖7A-B所示,連接基板3之配置區域20配置於周邊區域6之下側。In the mounting
於第2實施形態中,安裝基板2之連接基板連接端子13係以於下側露出之方式配置,連接基板3之安裝基板連接端子24係以於上側露出之方式配置,且其等經由導電性接合材35而電性連接。In the second embodiment, the connection
又,於安裝基板2之與殼體側端子47及模組連接端子25對應之位置,設置有貫通孔36。殼體42之殼體側端子47經由貫通孔36及模組連接端子開口部31內部之導電性接合材35,與模組連接端子25電性連接。In addition, through
關於第2實施形態之基板積層體1及攝像裝置40,亦發揮與第1實施形態之基板積層體1及攝像裝置40相同之作用效果。自攝像裝置40之低高度化之觀點而言,較佳可列舉第1實施形態。又,關於第2實施形態,亦能應用與第1實施形態相同之變化例。Also about the board|substrate laminated
<第3實施形態> 參照圖8A-B,對基板積層體1及攝像裝置40之第3實施形態進行說明。再者,於第3實施形態之基板積層體1及攝像裝置40中,對與上述圖中所示之第1實施形態相同之構件標註相同之符號,並將其說明省略。<3rd Embodiment> With reference to FIGS. 8A-B, the 3rd Embodiment of the board|substrate laminated
第1實施形態之基板積層體1具備安裝基板2、連接基板3及連接器4,如圖8A-B所示,第3實施形態之基板積層體1具備安裝基板2、連接基板3、連接器4及剛性基板50。The
剛性基板50係不具有可撓性之剛性之配線基板,例如由陶瓷基板、玻璃環氧基板等構成。The
剛性基板50於上下方向上,配置於安裝基板2與連接基板3之間。具體而言,剛性基板50係以其下表面與安裝基板2之周邊區域6之上表面接觸,其上表面與連接基板3之配置區域20之下表面接觸之方式,配置於周邊區域6之上側及配置區域20之下側。剛性基板50形成為外形及內形均為俯視大致矩形形狀之大致矩形框狀,且沿厚度方向投影時,與連接基板3之配置區域20一致。即,剛性基板50之形狀於俯視下,與連接基板3之配置區域20之形狀大致相同。The
於剛性基板50之後端部,設置有複數個將連接基板連接端子13與安裝基板連接端子24沿厚度方向電性連接之導通部(未圖示)。At the rear end portion of the
剛性基板50之厚度例如為20 μm以上,較佳為30 μm以上,又,例如為300 μm以下,較佳為200 μm以下。The thickness of the
連接基板3配置於剛性基板50之上側。具體而言,連接基板3係以其下表面與剛性基板50之上表面接觸之方式,配置於剛性基板50之上側。The
又,於圖8A-B所示之實施形態中,剛性基板50配置於安裝基板2之上側及連接基板3之下側,例如,如圖9A-B所示,剛性基板50亦可配置於連接基板3之上側。即,剛性基板50亦可配置於連接基板3之上側及殼體42之下側。該情形時,於剛性基板50之後端部,設置有複數個將模組連接端子25與殼體側端子47沿厚度方向電性連接之通孔導通部51。藉此,剛性基板50能與致動器模組45直接電性連接。8A-B, the
關於第3實施形態(圖8~圖9)之基板積層體1及攝像裝置40,亦發揮與第1實施形態之基板積層體1及攝像裝置40相同之作用效果。自藉由剛性基板50,加強安裝基板2之周邊區域6,從而能更確實地抑制安裝基板2之翹曲之觀點而言,較佳可列舉第3實施形態之基板積層體1及攝像裝置40。進而,於圖9A-B所示之實施形態中,能於較硬之剛性基板50,直接安裝固定於致動器模組45之殼體42。因此,能將致動器模組45及殼體42穩定地配置於圖9A所示之基板積層體1,從而能容易地進行安裝。又,關於第3實施形態,亦能應用與第1實施形態相同之變化例。Also about the board|substrate laminated
<第4實施形態> 參照圖10,對基板積層體1之第4實施形態進行說明。再者,於第4實施形態之基板積層體1中,對與上述圖中所示之第1實施形態相同之構件標註相同之符號,並將其說明省略。<4th Embodiment> With reference to FIG. 10, the 4th Embodiment of the board|substrate laminated
於第1實施形態之基板積層體1中,連接基板3之配置區域20係沿著安裝基板2之4個端部而配置,於第4實施形態之基板積層體1中,如圖10所示,連接基板3之配置區域20係沿著安裝基板2之1個端部(後端部)而配置。In the
於第4實施形態中,連接基板3之配置區域20形成為沿左右方向延伸之俯視大致矩形形狀。In the fourth embodiment, the
關於第4實施形態之基板積層體1及攝像裝置40,亦發揮與第1實施形態之基板積層體1及攝像裝置40相同之作用效果。自安裝基板2與連接基板3之接合強度較高,從而能確實地抑制安裝基板2與連接基板3之分離破壞之觀點而言,較佳可列舉第1實施形態。又,關於第4實施形態,亦能應用與第1實施形態相同之變化例。Also about the board|substrate laminated
<第5~6實施形態> 參照圖11~圖12,對基板積層體1之第5~6實施形態進行說明。再者,於第5~6實施形態之基板積層體1中,對與上述圖中所示之第1實施形態相同之構件標註相同之符號,並將其說明省略。<Fifth to Sixth Embodiments> Referring to FIGS. 11 to 12 , the fifth to sixth embodiments of the
於第1實施形態之基板積層體1中,連接基板3之配置區域20係沿著安裝基板2之4個端部而配置,於第5實施形態之基板積層體1中,如圖11所示,連接基板3之配置區域20係沿著安裝基板2之2個端部(後端部及右端部)而配置。即,於第5實施形態中,連接基板3之配置區域20形成為沿左右方向及前後方向延伸之俯視大致倒L字狀。In the
又,於第6實施形態之基板積層體1中,如圖12所示,連接基板3之配置區域20係沿著安裝基板2之3個端部(後端部、右端部及左端部)而配置。即,於第6實施形態中,連接基板3之配置區域20形成為前端部開放之俯視大致コ字狀。Furthermore, in the
關於第5~6實施形態之基板積層體1及攝像裝置40,亦發揮與第1實施形態之基板積層體1及攝像裝置40相同之作用效果。自安裝基板2與連接基板3之接合強度較高,從而能確實地抑制安裝基板2與連接基板3之分離破壞之觀點而言,較佳可列舉第1實施形態。又,關於第5~6實施形態,亦能應用與第1實施形態相同之變化例。About the board|substrate laminated
再者,上述發明係作為本發明之例示之實施形態而提供,其僅為單純之例示,不可限定性地進行解釋。該技術領域之業者所能理解之本發明之變化例包含於下述申請專利範圍內。 [產業上之可利用性]It should be noted that the above-mentioned invention is provided as an exemplary embodiment of the present invention, which is merely an illustration and should not be construed in a limited way. Variations of the present invention that can be understood by those skilled in the art are included within the scope of the following claims. [Industrial Availability]
本發明之基板積層體及攝像裝置可應用於各種工業製品,例如適宜用於相機模組等。The substrate laminate and the imaging device of the present invention can be applied to various industrial products, for example, suitable for use in camera modules and the like.
1‧‧‧基板積層體2‧‧‧攝像元件安裝基板(安裝基板)3‧‧‧外部機器連接軟性配線電路基板(連接基板)4‧‧‧連接器5‧‧‧安裝區域6‧‧‧周邊區域7‧‧‧第1基底絕緣層8‧‧‧第1導體圖案9‧‧‧第1覆蓋絕緣層10‧‧‧攝像元件連接端子開口部(第1開口部)11‧‧‧連接基板連接端子開口部(第2開口部)12‧‧‧攝像元件連接端子13‧‧‧連接基板連接端子14‧‧‧第1金屬配線15‧‧‧第1連接配線16‧‧‧接地配線17‧‧‧配線區域20‧‧‧安裝基板配置區域(配置區域)21‧‧‧連接區域22‧‧‧連接器區域23‧‧‧安裝區域開口部24‧‧‧安裝基板連接端子25‧‧‧模組連接端子26‧‧‧第2基底絕緣層27‧‧‧第2導體圖案28‧‧‧第2覆蓋絕緣層29‧‧‧安裝基板連接端子開口部(第3開口部)30‧‧‧第2金屬連接配線31‧‧‧模組連接端子開口部(第4開口部)32‧‧‧連接器連接端子33‧‧‧連接器連接端子開口部(第5開口部)34‧‧‧第2金屬連接配線35‧‧‧導電性接合材36‧‧‧貫通孔38‧‧‧連接器側端子40‧‧‧攝像裝置41‧‧‧攝像元件42‧‧‧殼體43‧‧‧光學透鏡44‧‧‧濾波器45‧‧‧致動器模組46‧‧‧端子47‧‧‧殼體側端子48‧‧‧模組連接配線49‧‧‧攝像單元50‧‧‧剛性基板D1‧‧‧上下方向距離D2‧‧‧上下方向距離T1‧‧‧厚度T2‧‧‧ 厚度T3‧‧‧厚度T4‧‧‧厚度T5‧‧‧厚度T6‧‧‧厚度1‧‧‧Substrate laminate 2‧‧‧Image pickup element mounting board (mounting board) 3‧‧‧External device connection flexible wiring circuit board (connecting board) 4‧‧‧Connector 5‧‧‧Mounting area 6‧‧‧ Peripheral region 7‧‧‧First insulating base layer 8‧‧‧First conductor pattern 9‧‧‧First insulating cover layer 10‧‧‧Camera element connection terminal opening (first opening) 11‧‧‧Connecting substrate Connection terminal opening (second opening) 12‧‧‧Image pickup element connecting terminal 13‧‧‧Connecting board connecting terminal 14‧‧‧First metal wiring 15‧‧‧First connecting wiring 16‧‧‧Ground wiring 17‧ ‧‧Wiring area 20‧‧‧Mounting board layout area (arrangement area) 21‧‧‧Connection area 22‧‧‧Connector area 23‧‧‧Mounting area opening 24‧‧‧Mounting board connecting terminal 25‧‧‧Mold Set of connecting terminals 26‧‧‧Second insulating base layer 27‧‧‧Second conductor pattern 28‧‧‧Second insulating cover layer 29‧‧‧Mounting board connecting terminal openings (third openings) 30‧‧‧The first 2 Metal connecting wires 31‧‧‧Module connecting terminal opening (4th opening) 32‧‧‧Connecting terminal 33‧‧‧Connecting terminal opening (5th opening) 34‧‧‧Second Metal connecting wire 35‧‧‧Conductive bonding material 36‧‧‧Through hole 38‧‧‧Connector side terminal 40‧‧‧Camera device 41‧‧‧Camera element 42‧‧‧Case 43‧‧‧optical lens 44 ‧‧‧Filter 45‧‧‧Actuator module 46‧‧‧Terminal 47‧‧‧Case side terminal 48‧‧‧Module connection wiring 49‧‧‧Camera unit 50‧‧‧Rigid substrate D 1 ‧ ‧‧Distance in vertical direction D 2 ‧‧‧Distance in vertical direction T 1 ‧‧‧Thickness T 2 ‧‧‧ Thickness T 3 ‧‧‧Thickness T 4 ‧‧‧Thickness T 5 ‧‧‧Thickness T 6 ‧‧‧Thickness
圖1A-B表示本發明之基板積層體之第1實施形態,圖1A表示俯視圖,圖1B表示圖1A之A-A線之剖視圖。 圖2表示圖1A所示之基板積層體之安裝基板之俯視圖。 圖3表示圖2A之A-A線之剖視圖。 圖4A-B係圖1A所示之基板積層體之剖視圖,圖4A表示B-B線之剖視圖,圖4B表示C-C線之剖視圖。 圖5A-B係具備圖1A所示之基板積層體之攝像單元,圖5A表示俯視圖,圖5B表示圖5A之A-A線之剖視圖。 圖6A-B係具備圖1A所示之基板積層體之攝像裝置,圖6A表示俯視圖,圖6B表示圖6A之A-A線之剖視圖。 圖7A-B表示具備本發明之基板積層體之第2實施形態(於周邊區域之下側具備連接基板之形態)之攝像裝置,圖7A表示俯視圖,圖7B表示圖7A之A-A線之剖視圖。 圖8A-B表示具備本發明之基板積層體之第3實施形態(具備剛性基板之形態)之攝像裝置,圖8A表示俯視圖,圖8B表示圖8A之A-A線之剖視圖。 圖9A-B表示具備本發明之基板積層體之第3實施形態之變化例(剛性基板配置於連接基板之上側之形態)之攝像裝置,圖9A表示俯視圖,圖9B表示圖9A之A-A線之剖視圖。 圖10表示本發明之基板積層體之第4實施形態(沿著安裝基板之1個端部配置有連接基板之形態)之俯視圖。 圖11表示本發明之基板積層體之第5實施形態(沿著安裝基板之2個端部配置有連接基板之形態)之俯視圖。 圖12表示本發明之基板積層體之第6實施形態(沿著安裝基板之3個端部配置有連接基板之形態)之俯視圖。1A-B show a first embodiment of the substrate laminate of the present invention, FIG. 1A is a plan view, and FIG. 1B is a cross-sectional view taken along the line A-A in FIG. 1A . FIG. 2 is a plan view of a mounting substrate of the substrate laminate shown in FIG. 1A . Fig. 3 is a cross-sectional view taken along line A-A of Fig. 2A. 4A-B are cross-sectional views of the substrate laminate shown in FIG. 1A , FIG. 4A is a cross-sectional view taken along line B-B, and FIG. 4B is a cross-sectional view taken along line C-C. 5A-B are image pickup units provided with the substrate laminate shown in FIG. 1A , FIG. 5A is a plan view, and FIG. 5B is a cross-sectional view taken along the line A-A in FIG. 5A . 6A-B are image pickup devices provided with the substrate laminate shown in FIG. 1A , FIG. 6A is a plan view, and FIG. 6B is a cross-sectional view taken along the line A-A in FIG. 6A . 7A-B show an imaging device provided with the second embodiment of the substrate laminate of the present invention (a form in which a connecting substrate is provided on the lower side of the peripheral region), FIG. 7A shows a plan view, and FIG. 7B shows a cross-sectional view taken along the line A-A in FIG. 7A . 8A-B show an imaging device provided with a third embodiment of the substrate laminate of the present invention (a form with a rigid substrate), FIG. 8A is a plan view, and FIG. 8B is a cross-sectional view taken along the line A-A in FIG. 8A . 9A-B show an imaging device provided with a modification of the third embodiment of the substrate laminate of the present invention (a form in which the rigid substrate is arranged on the upper side of the connection substrate), FIG. 9A is a plan view, and FIG. 9B is a line A-A in FIG. 9A . Cutaway view. Fig. 10 is a plan view showing a fourth embodiment of the substrate laminate of the present invention (a form in which a connection substrate is arranged along one end of the mounting substrate). Fig. 11 is a plan view showing a fifth embodiment of the substrate laminate of the present invention (a form in which a connection substrate is arranged along two ends of the mounting substrate). Fig. 12 is a plan view showing a sixth embodiment of the substrate laminate of the present invention (a form in which connecting substrates are arranged along three ends of the mounting substrate).
1‧‧‧基板積層體 1‧‧‧Substrate laminate
2‧‧‧攝像元件安裝基板(安裝基板) 2‧‧‧Image sensor mounting board (mounting board)
3‧‧‧外部機器連接軟性配線電路基板(連接基板) 3‧‧‧External device connection flexible wiring circuit board (connection board)
4‧‧‧連接器 4‧‧‧Connector
5‧‧‧安裝區域 5‧‧‧Installation area
6‧‧‧周邊區域 6‧‧‧ Surrounding area
10‧‧‧攝像元件連接端子開口部(第1開口部) 10‧‧‧Camera element connection terminal opening (first opening)
12‧‧‧攝像元件連接端子 12‧‧‧Camera element connection terminal
20‧‧‧安裝基板配置區域(配置區域) 20‧‧‧Mounting board arrangement area (arrangement area)
21‧‧‧連接區域 21‧‧‧Connection area
22‧‧‧連接器區域 22‧‧‧Connector area
23‧‧‧安裝區域開口部 23‧‧‧Opening part of installation area
25‧‧‧模組連接端子 25‧‧‧Module connection terminal
30‧‧‧第2金屬連接配線 30‧‧‧Second metal connecting wire
31‧‧‧模組連接端子開口部(第4開口部) 31‧‧‧Module connection terminal opening (4th opening)
32‧‧‧連接器連接端子 32‧‧‧Connector terminal
33‧‧‧連接器連接端子開口部(第5開口部) 33‧‧‧Connecting terminal opening of connector (5th opening)
35‧‧‧導電性接合材 35‧‧‧Conductive bonding material
38‧‧‧連接器側端子 38‧‧‧Connector side terminal
Claims (8)
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JP2017201998A JP6998725B2 (en) | 2017-10-18 | 2017-10-18 | Substrate stack and image pickup device |
JP2017-201998 | 2017-10-18 |
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Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TW200922291A (en) * | 2007-11-09 | 2009-05-16 | Hon Hai Prec Ind Co Ltd | Camera module |
US20160323486A1 (en) * | 2014-01-09 | 2016-11-03 | Fujifilm Corporation | Imaging module, manufacturing method of imaging module, and electronic device |
TW201725413A (en) * | 2016-01-12 | 2017-07-16 | 致伸科技股份有限公司 | Camera module and method for assembling camera module |
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JP2631548B2 (en) * | 1989-03-15 | 1997-07-16 | 日本シイエムケイ株式会社 | Printed wiring board with shield layer |
JP4405062B2 (en) * | 2000-06-16 | 2010-01-27 | 株式会社ルネサステクノロジ | Solid-state imaging device |
CN1236498C (en) * | 2002-05-17 | 2006-01-11 | 台湾积体电路制造股份有限公司 | CMUS image sensing element |
JP4919755B2 (en) * | 2006-10-02 | 2012-04-18 | 日東電工株式会社 | Wiring circuit board and electronic equipment |
JP2008312104A (en) | 2007-06-18 | 2008-12-25 | Panasonic Corp | Solid-state imaging apparatus, and method for manufacturing the same |
EP1983742A1 (en) * | 2007-04-16 | 2008-10-22 | STMicroelectronics (Research & Development) Limited | Image sensor power distribution |
JP2009081351A (en) * | 2007-09-27 | 2009-04-16 | Sanyo Electric Co Ltd | Semiconductor device, and manufacturing method thereof |
JP2015038908A (en) | 2012-03-06 | 2015-02-26 | イビデン株式会社 | Flex-rigid wiring board |
JP6169370B2 (en) * | 2013-02-26 | 2017-07-26 | 京セラ株式会社 | Imaging device and imaging apparatus |
JP2014175423A (en) * | 2013-03-07 | 2014-09-22 | Sharp Corp | Flexible substrate and mounting method thereof |
CN104995906B (en) | 2013-04-26 | 2018-01-26 | 株式会社村田制作所 | The manufacture method of camera module |
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Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TW200922291A (en) * | 2007-11-09 | 2009-05-16 | Hon Hai Prec Ind Co Ltd | Camera module |
US20160323486A1 (en) * | 2014-01-09 | 2016-11-03 | Fujifilm Corporation | Imaging module, manufacturing method of imaging module, and electronic device |
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