CN109508607A - Optical finger print recognizer component and electronic device - Google Patents
Optical finger print recognizer component and electronic device Download PDFInfo
- Publication number
- CN109508607A CN109508607A CN201710850419.XA CN201710850419A CN109508607A CN 109508607 A CN109508607 A CN 109508607A CN 201710850419 A CN201710850419 A CN 201710850419A CN 109508607 A CN109508607 A CN 109508607A
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- China
- Prior art keywords
- optical
- finger print
- layer
- recognizer component
- optical finger
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Classifications
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
- G06V40/00—Recognition of biometric, human-related or animal-related patterns in image or video data
- G06V40/10—Human or animal bodies, e.g. vehicle occupants or pedestrians; Body parts, e.g. hands
- G06V40/12—Fingerprints or palmprints
- G06V40/13—Sensors therefor
- G06V40/1318—Sensors therefor using electro-optical elements or layers, e.g. electroluminescent sensing
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
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- Engineering & Computer Science (AREA)
- Human Computer Interaction (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Multimedia (AREA)
- Theoretical Computer Science (AREA)
- Image Input (AREA)
- Measurement Of The Respiration, Hearing Ability, Form, And Blood Characteristics Of Living Organisms (AREA)
Abstract
The invention discloses a kind of optical finger print recognizer component and electronic devices.Optical finger print recognizer component includes display screen, optical finger print identification mould group, optical cement and layer structure.Optical finger print identifies that mould group includes optical fingerprint sensor；Optical fingerprint sensor is fitted in the lower surface of display screen by optical cement；Layer structure is fitted in the lower surface of display screen, and layer structure is formed with through-hole, and optical cement is fitted in the lower surface of display screen by through-hole, and the thickness of optical cement is greater than the thickness of layer structure.The optical finger print recognizer component of above embodiment can make the area of the through-hole in layer structure reduce in this way since the thickness of optical cement is greater than the thickness of the layer structure, in this way, facilitating the color difference for reducing display screen from the front of electronic device.
Description
Technical field
The present invention relates to technical field of biometric identification, more particularly, to a kind of optical finger print recognizer component and electronic device.
Background technique
In the related art, the function that optical finger print identification mould group realizes fingerprint recognition can be used in electronic device.Optics
Fingerprint recognition mould group includes display screen, and the back side of display screen is provided with lighttight foam.Borehole on foam is so that optical finger print
Identification mould group can receive light.From the front of electronic device, the area of borehole then will affect greatly the color difference of display screen.
Summary of the invention
Embodiments of the present invention provide a kind of optical finger print recognizer component and electronic device.
A kind of optical finger print recognizer component of embodiment of the present invention, comprising:
Display screen；
Optical finger print identifies mould group, and the optical finger print identification mould group includes optical fingerprint sensor；
Optical cement, the optical fingerprint sensor are fitted in the lower surface of the display screen by the optical cement；
Layer structure, the layer structure are fitted in the lower surface of the display screen, and the layer structure is formed with through-hole, the light
The lower surface that glue is fitted in the display screen by the through-hole is learned, the thickness of the optical cement is greater than the thickness of the layer structure
Degree.
The optical finger print recognizer component of above embodiment, since the thickness of optical cement is greater than the thickness of layer structure, in this way
The area of the through-hole in layer structure can be made to reduce, in this way, helping to reduce display screen from the front of electronic device
Color difference.
In some embodiments, the layer structure is foamed cotton layer；Or the layer structure includes foamed cotton layer and formation foam
Diffusion layer on layer, the through-hole run through the foamed cotton layer and the diffusion layer, and the layer structure is bonded by the diffusion layer
In the lower surface of the display screen.
In this way, diffusion layer can play the role of buffering and heat dissipation, foamed cotton layer can play cushioning and protection, so that light
It learns fingerprint recognition component to be hardly damaged, ensure that optical finger print recognizer component service life.
In some embodiments, the optical finger print recognizer component includes circuit board, and the circuit board is arranged described
The lower surface of optical fingerprint sensor.
In this way, collected finger print information can be transferred to circuit board by optical fingerprint sensor.
In some embodiments, the circuit board includes substrate and flexible circuit board, and the optical fingerprint sensor is set
It sets on the substrate, one end of the flexible circuit board connects the lower surface of the substrate.
In this way, flexible circuit board is light-weight and thickness is thin, space is saved, is conducive to optical finger print recognizer component and minimizes, together
When, substrate can be used as the supporter of support optical fingerprint sensor and the optical finger print identification other elements of mould group.
In some embodiments, the optical finger print recognizer component includes stiffening plate, and the stiffening plate is arranged described
The lower surface of one end of flexible circuit board.
In this way, stiffening plate can enhance the intensity of flexible circuit board.
In some embodiments, the optical fingerprint sensor includes:
Photosensitive layer, the photosensitive layer are formed with induction zone；With
Optical layer on the photosensitive layer is set, and the optical layer covers the induction zone, the area of the optical layer
Greater than the area of the induction zone, the optical layer is formed with multiple lens, the photosensitive layer be located at the optical layer with it is described
Between substrate.
In this way, optical layer can make more light converge to photosensitive layer, optical finger print identification mould group is enable to collect more
More optical signal, more accurately to realize fingerprint recognition.
In some embodiments, the photosensitive layer includes multiple light-sensitive elements and connection line, the multiple photosensitive member
Part forms the induction zone, and the connection line connects the multiple light-sensitive element and the substrate.
In this way, light-sensitive element can incude the light converged from optical layer and optical signal is converted to electric signal to collect
Finger print information.
In some embodiments, the optical finger print recognizer component includes connecting line and sealing；The optical finger print passes
Sensor is connected by the connecting line with the circuit board, and the sealing encapsulates the connecting line, the circuit board and the company
The junction of wiring, the optical fingerprint sensor and the junction of the connecting line and the side of the optical fingerprint sensor
Side.
In this way, sealing can protect the junction of connecting line, circuit board and connecting line, optical fingerprint sensor and connecting line
Junction.
In some embodiments, the optical finger print recognizer component includes cover board, and the display screen is fitted in the lid
The lower surface of plate.
In this way, cover board can play the role of protection to display screen.
The present invention also provides a kind of electronic device, the optical finger print recognizer component including any of the above-described embodiment.
The electronic device of embodiment of the present invention can make in this way since the thickness of optical cement is greater than the thickness of layer structure
The area for obtaining the through-hole in layer structure reduces, in this way, facilitating the color difference for reducing display screen from the front of electronic device.
The additional aspect and advantage of embodiments of the present invention will be set forth in part in the description, partially will be from following
Description in become obvious, or the practice of embodiment through the invention is recognized.
Detailed description of the invention
The above-mentioned and/or additional aspect and advantage of embodiments of the present invention are from combination following accompanying drawings to embodiment
It will be apparent and be readily appreciated that in description, in which:
Fig. 1 is the structural schematic diagram for the optical finger print recognizer component that embodiment of the present invention provides；
Fig. 2 is another structural schematic diagram for the optical finger print recognizer component that embodiment of the present invention provides.
Main element symbol description:
Optical finger print recognizer component 100, display screen 10, optical finger print identify mould group 20, optical fingerprint sensor 22, light sensation
Layer 224, induction zone 2241, optical layer 226, optical cement 30, layer structure 40, through-hole 42, foamed cotton layer 44, diffusion layer 46, circuit board
60, substrate 62, flexible circuit board 64, stiffening plate 70, connecting line 80, sealing 90, cover board 110.
Specific embodiment
Embodiments of the present invention are described below in detail, the example of the embodiment is shown in the accompanying drawings, wherein from beginning
Same or similar element or element with the same or similar functions are indicated to same or similar label eventually.Below by ginseng
The embodiment for examining attached drawing description is exemplary, and for explaining only the invention, and is not considered as limiting the invention.
In the description of the present invention, it is to be understood that, term " center ", " longitudinal direction ", " transverse direction ", " length ", " width ",
" thickness ", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outside", " up time
Needle ", instruction " counterclockwise " orientation or positional relationship be based on the orientation or positional relationship shown in the drawings, be merely for convenience of retouching
It states the present invention and simplifies description, rather than the device or element of indication or suggestion meaning must have a particular orientation, with specific
Orientation construction and operation, therefore be not considered as limiting the invention.In addition, term " first ", " second " are only used for retouching
Purpose is stated, relative importance is not understood to indicate or imply or implicitly indicates the quantity of indicated technical characteristic.By
This defines " first ", the feature of " second " can explicitly or implicitly include one or more feature.At this
In the description of invention, the meaning of " plurality " is two or more, unless otherwise specifically defined.
In the description of the present invention, it should be noted that unless otherwise clearly defined and limited, term " installation ", " phase
Even ", " connection " shall be understood in a broad sense, for example, it may be being fixedly connected, may be a detachable connection, or be integrally connected；It can
To be mechanical connection, it is also possible to be electrically connected or can mutually communicate；It can be directly connected, it can also be by between intermediary
It connects connected, can be the connection inside two elements or the interaction relationship of two elements.For the ordinary skill of this field
For personnel, the specific meanings of the above terms in the present invention can be understood according to specific conditions.
In the present invention unless specifically defined or limited otherwise, fisrt feature second feature "upper" or "lower"
It may include that the first and second features directly contact, also may include that the first and second features are not direct contacts but pass through it
Between other characterisation contact.Moreover, fisrt feature includes the first spy above the second feature " above ", " above " and " above "
Sign is right above second feature and oblique upper, or is merely representative of first feature horizontal height higher than second feature.Fisrt feature exists
Second feature " under ", " lower section " and " following " include that fisrt feature is directly below and diagonally below the second feature, or is merely representative of
First feature horizontal height is less than second feature.
Following disclosure provides many different embodiments or example is used to realize different structure of the invention.In order to
Simplify disclosure of the invention, hereinafter the component of specific examples and setting are described.Certainly, they are merely examples, and
And it is not intended to limit the present invention.In addition, the present invention can in different examples repeat reference numerals and/or reference letter,
This repetition is for purposes of simplicity and clarity, itself not indicate between discussed various embodiments and/or setting
Relationship.In addition, the present invention provides various specific techniques and material example, but those of ordinary skill in the art can be with
Recognize the application of other techniques and/or the use of other materials.
Referring to Fig. 1, embodiment of the present invention provides a kind of optical finger print recognizer component 100.Optical finger print recognizer component
100 include display screen 10, optical finger print identification mould group 20, optical cement 30 and layer structure 40.Optical finger print identifies that mould group 20 includes
Optical fingerprint sensor 22.Optical fingerprint sensor 22 is fitted in the lower surface of display screen 10 by optical cement 30.Layer structure 40
It is fitted in the lower surface of display screen 10.Layer structure 40 is formed with through-hole 42.Optical cement 30 is fitted in display screen 10 by through-hole 42
Lower surface.The thickness of optical cement 30 is greater than the thickness of layer structure 40.
The optical finger print recognizer component 100 of above embodiment, since the thickness of optical cement 30 is greater than the thickness of layer structure 40
Degree, can make the area of the through-hole 42 formed in layer structure 40 reduce, in this way, having from the front of electronic device in this way
Help reduce the color difference of display screen 10.
Specifically, the light transmission rate of optical cement 30 is greater than 90%, there is good translucency.30 cured glue of optical cement tool
There is flexibility.Since the thickness of optical cement 30 is greater than the thickness of layer structure 40 so that through-hole 42 is all filled by optical cement 30, from
And the area of the through-hole formed in layer structure 40 42 is reduced and (is partially fill in through-hole compared to optical fingerprint sensor 22
When on 42).
Since the thickness of optical cement 30 will affect the transmitance of light, the thickness of optical cement 30 can be slightly larger than layer knot
The thickness of structure 40.That is, the thickness setting of optical cement 30 needs to guarantee, optical cement 30 fits to optical fingerprint sensor 22
When the lower surface of display screen 10, there is the position of protrusion relative to the lower surface of layer structure 40 in optical cement 30.
In addition, the thickness due to optical cement 30 is greater than the thickness of layer structure 40, optical fingerprint sensor 22 can be made in this way
It is flattened on the back side of display screen 10, to facilitate the identification of fingerprint.
Display screen 10 can be OLED display screen, liquid crystal display or plasma display etc..
In one embodiment, display screen 10 can be touch display screen.
In one embodiment, cmos sensor can be used in optical fingerprint sensor 22.It is appreciated that the present invention is implemented
The optical finger print recognizer component 100 of mode can be applied to but be not limited to unlock, file encryption, payment verification, authentication etc. answer
Use scene.
Please join Fig. 1 again, in some embodiments, layer structure 40 is foamed cotton layer.Foamed cotton layer can play buffering and protection
Effect, so that optical finger print recognizer component 100 is hardly damaged, ensure that 100 service life of optical finger print recognizer component.
It please join Fig. 2, in some embodiments, layer structure 40 includes the diffusion on foamed cotton layer 44 and the foamed cotton layer 44 formed
Layer 46.Through-hole 42 runs through foamed cotton layer 44 and diffusion layer 46.Layer structure 40 is fitted in the lower surface of display screen 10 by diffusion layer 46.
In this way, diffusion layer 46 can play the role of buffering and heat dissipation, foamed cotton layer 44 can play cushioning and protection, make
It obtains optical finger print recognizer component 100 to be hardly damaged, ensure that 100 service life of optical finger print recognizer component.
In some embodiments, optical finger print recognizer component 100 includes circuit board 60.The setting of circuit board 60 refers in optics
The lower surface of line sensor 22.
In this way, collected finger print information can be transferred to circuit board 60 by optical fingerprint sensor 22, and by circuit board
Finger print information is transferred to external circuit by 60.
In some embodiments, circuit board 60 includes substrate 62 and flexible circuit board 64.Optical fingerprint sensor 22 is set
It sets on the substrate 62.The lower surface of one end connecting substrate 62 of flexible circuit board 64.
In this way, flexible circuit board 64 is light-weight and thickness is thin, space is saved, it is small-sized to be conducive to optical finger print recognizer component 100
Change, meanwhile, substrate 62 can be used as the supporter of support optical fingerprint sensor 22 and the optical finger print identification other elements of mould group 20.
Specifically, substrate 62 can be used as hardboard, and substrate 62 and flexible circuit board 64 can be connected to one by welding
It rises.Flexible circuit board 64 can be connect with the external circuit of optical finger print recognizer component 100 or electronic device to carry out data transmission.
In some embodiments, substrate 62 includes solder joint 622, and substrate 622 is connected by solder joint 622 and flexible circuit board 64
It connects.Substrate 62 and flexible circuit board 64 can be in communication with each other, so that substrate 622 can obtain the optical fingerprint sensor 22 of acquisition
The electric signal transmission taken is to flexible circuit board 64.
In some embodiments, processor (not shown) is provided on flexible circuit board 64, processor can be used for locating
Manage the electric signal of optical fingerprint sensor 22.
Specifically, processor and interlock circuit structure has can be set in flexible circuit board 64, and processor processing includes fingerprint
The electric signal of information is to establish the model of fingerprint.
In some embodiments, optical finger print recognizer component 100 includes stiffening plate 70.Stiffening plate 70 is arranged in flexible electrical
The lower surface of one end of road plate 64.
In this way, stiffening plate 70 can enhance the intensity of flexible circuit board 64.
It is appreciated that cause 64 stress of flexible circuit board to be easy to produce crack due to the flexible nature of flexible circuit board 64,
Connecting substrate 62 and flexible circuit board 64 or the installation elements on flexible circuit board 64 are difficult to, therefore can be by stiffening plate 70
The lower surface of flexible circuit board 64 is set, so that the intensity in conjunction with the flexible circuit board 64 of stiffening plate 70 is enough, in turn
Facilitate connecting substrate 62 and flexible circuit board 64 or carries out the operation such as installation elements on flexible circuit board 64.
Stiffening plate 70 can be made of metal material, such as stainless steel.
In some embodiments, optical fingerprint sensor 22 includes photosensitive layer 224 and the light being arranged on photosensitive layer 224
Learn layer 226.Photosensitive layer 224 is formed with induction zone 2241.Optical layer 226 covers induction zone 2241.The area of optical layer 226 is greater than
The area of induction zone 2241.Optical layer 226 is formed with multiple lens (not shown).Photosensitive layer 224 is located at optical layer 226 and substrate
Between 62.
In this way, optical layer 226 can make more light converge to photosensitive layer 224, optical finger print is enable to identify mould group 20
More optical signals are collected, more accurately to realize fingerprint recognition.
Specifically, when optical finger print identification mould group 20 acquires fingerprint, finger acts on the dielectric surface of 226 top of optical layer
On, the light that finger reflects is converged to induction zone 2241 by multiple lens of optical layer 226, and induction zone 2241 is obtained
More light is to form finger print data.The area of optical layer 226 is greater than the area of induction zone 2241 conducive to the reflection of more fingers
Light be projected to induction zone 2241, increase the data volume of collected finger print information.Photosensitive layer 224 is configured to will be from optics
The light of 226 convergence of layer is converted to electric signal and exports electric signal, and the electric signal of output forms finger print information after processing.
Specifically, display screen 10 can be active when optical fingerprint sensor 22 is fitted in the lower surface of display screen 10
Light emitting display (such as OLED or AMOLED), display screen 10 can be used as light source to the field emission light of 2241 top of induction zone
Line, so that finger is placed on when carrying out fingerprint recognition with the upper surface position of the display screen 10 of 2241 face of induction zone, induction zone
2241 can receive enough light to form finger print information.
In some embodiments, photosensitive layer 224 includes multiple light-sensitive element (not shown) and connection line (not shown),
Multiple light-sensitive elements form induction zone 2241.Connection line connects multiple light-sensitive elements and substrate 62.
In this way, light-sensitive element can incude the light converged from optical layer 226 and optical signal is converted to electric signal to adopt
Collect finger print information.
Specifically, multiple light-sensitive elements can convert optical signals into electric signal, when finger acts on optical finger print identification
When on the dielectric surface of 100 top of component, the light reflected from finger convergence is projected to photosensitive layer 224 by optical layer 226, multiple
Light of the light-sensitive element induction with finger print information simultaneously converts optical signal into electric signal, the fingerprint letter that connection line will acquire
Breath is transferred to substrate 62.Substrate 62 can be connect by flexible circuit board 64 with external circuit, so that external circuit be made to realize fingerprint
The function of identification.
Further, photosensitive layer 224 includes substrate, and multiple light-sensitive elements and connection line are formed in substrate.Some
In example, substrate can be semiconductor base.Light-sensitive element and connection line can be formed in substrate by photoetching process.Multiple light
Quick element can form the induction zone 2241 (area active area, AA) of array, other regions form non-inductive area in substrate
(the non-area AA), non-inductive area is provided with connection line.Light-sensitive element is, for example, photodiode.
In some embodiments, optical finger print recognizer component 100 includes connecting line 80 and sealing 90.Optical finger print sensing
Device 22 is connected by connecting line 80 and circuit board 60.Sealing 90 encapsulate connecting line 80, circuit board 60 and connecting line 80 junction,
Optical fingerprint sensor 22 and the junction of connecting line 80 and the side of optical fingerprint sensor 22.
In this way, sealing 90 can protect the junction of connecting line 80, circuit board 60 and connecting line 80, optical fingerprint sensor 22
With the junction of connecting line 80.
Specifically, lighttight sealing, the e.g. sealing of black may be selected in sealing 90.The sealing shaded effect of black
It is good, interference of the environment light to optical fingerprint sensor 22 is reduced, and then the accuracy of optical finger print recognizer component 100 can be improved.
It is appreciated that connecting line 80 can engage (wire bonding) technique connection optical fingerprint sensor 22 by routing
With circuit board 60.
In some embodiments, optical finger print recognizer component 100 includes cover board 110.Display screen 10 is fitted in cover board 110
Lower surface.
In this way, cover board 110 can play the role of protection to display screen 10.
It is appreciated that cover board 110 can be cover-plate glass.When fingerprint recognition, finger can be placed in 110 upper surface of cover board and light
The corresponding position of fingerprint sensor 22 is learned, display screen 10 emits light to finger, and finger reflection light by optical finger print to be sensed
Device 22 receives, and ultimately forms finger print data.
A kind of electronic device of embodiment of the present invention, the optical finger print recognizer component including any of the above-described embodiment
100。
The electronic device of embodiment of the present invention in this way may be used since the thickness of optical cement 30 is greater than the thickness of layer structure 40
So that the area of the through-hole 42 formed in layer structure 40 reduces, in this way, helping to reduce aobvious from the front of electronic device
The color difference of display screen 10.
Electronic device includes but is not limited to that mobile phone, tablet computer, wearable device, entrance guard device, ATM machine etc. use optics
The electronic device of fingerprint identification function.
For example, optical finger print recognizer component 100 can be used for mobile phone unlock, file encryption, payment when electronic device is mobile phone
The application scenarios such as verifying.
In the description of this specification, reference term " certain embodiments ", " embodiment ", " some embodiment party
The description of formula ", " exemplary embodiment ", " example ", " specific example " or " some examples " means to combine embodiment or show
Example particular features, structures, materials, or characteristics described are contained at least one embodiment or example of the invention.At this
In specification, schematic expression of the above terms are not necessarily referring to identical embodiment or example.Moreover, the tool of description
Body characteristics, structure, material or feature can be tied in an appropriate manner in any one or more embodiments or example
It closes.
In addition, term " first ", " second " are used for descriptive purposes only and cannot be understood as indicating or suggesting relative importance
Or implicitly indicate the quantity of indicated technical characteristic.Define " first " as a result, the feature of " second " can be expressed or
Implicitly include at least one feature.In the description of the present invention, the meaning of " plurality " is at least two, such as two, three,
Unless otherwise specifically defined.
Although the embodiments of the present invention has been shown and described above, it is to be understood that above-described embodiment is example
Property, it is not considered as limiting the invention, those skilled in the art within the scope of the invention can be to above-mentioned
Embodiment is changed, modifies, replacement and variant, and the scope of the present invention is defined by the claims and their equivalents.
Claims (10)
1. a kind of optical finger print recognizer component characterized by comprising
Display screen；
Optical finger print identifies mould group, and the optical finger print identification mould group includes optical fingerprint sensor；
Optical cement, the optical fingerprint sensor are fitted in the lower surface of the display screen by the optical cement；
Layer structure, the layer structure are fitted in the lower surface of the display screen, and the layer structure is formed with through-hole, the optical cement
The lower surface of the display screen is fitted in by the through-hole, the thickness of the optical cement is greater than the thickness of the layer structure.
2. optical finger print recognizer component as described in claim 1, which is characterized in that the layer structure is foamed cotton layer；Or it is described
Layer structure includes foamed cotton layer and forms the diffusion layer on foamed cotton layer, and the through-hole runs through the foamed cotton layer and the diffusion layer, institute
State the lower surface that layer structure is fitted in the display screen by the diffusion layer.
3. optical finger print recognizer component as described in claim 1, which is characterized in that the optical finger print recognizer component includes electricity
The lower surface of the optical fingerprint sensor is arranged in road plate, the circuit board.
4. optical finger print recognizer component as claimed in claim 3, which is characterized in that the circuit board includes substrate and flexible electrical
Road plate, on the substrate, one end of the flexible circuit board connects under the substrate for the optical fingerprint sensor setting
Surface.
5. optical finger print recognizer component as claimed in claim 4, which is characterized in that the optical finger print recognizer component includes mending
The lower surface of one end of the flexible circuit board is arranged in strong plate, the stiffening plate.
6. optical finger print recognizer component as claimed in claim 4, which is characterized in that the optical fingerprint sensor includes:
Photosensitive layer, the photosensitive layer are formed with induction zone；With
Optical layer on the photosensitive layer is set, and the optical layer covers the induction zone, and the area of the optical layer is greater than
The area of the induction zone, the optical layer are formed with multiple lens, and the photosensitive layer is located at the optical layer and the substrate
Between.
7. optical finger print recognizer component as claimed in claim 6, which is characterized in that the photosensitive layer includes multiple light-sensitive elements
And connection line, the multiple light-sensitive element form the induction zone, the connection line connect the multiple light-sensitive element and
The substrate.
8. optical finger print recognizer component as claimed in claim 3, which is characterized in that the optical finger print recognizer component includes connecting
Wiring and sealing；The optical fingerprint sensor is connected by the connecting line with the circuit board, described in the sealing encapsulation
Connecting line, the circuit board and the junction of the connecting line, the junction of the optical fingerprint sensor and the connecting line
With the side of the optical fingerprint sensor.
9. optical finger print recognizer component as described in claim 1, which is characterized in that the optical finger print recognizer component includes lid
Plate, the display screen are fitted in the lower surface of the cover board.
10. a kind of electronic device, which is characterized in that including optical finger print recognizer component described in any one of claim 1-9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710850419.XA CN109508607A (en) | 2017-09-15 | 2017-09-15 | Optical finger print recognizer component and electronic device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710850419.XA CN109508607A (en) | 2017-09-15 | 2017-09-15 | Optical finger print recognizer component and electronic device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN109508607A true CN109508607A (en) | 2019-03-22 |
Family
ID=65745291
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710850419.XA Withdrawn CN109508607A (en) | 2017-09-15 | 2017-09-15 | Optical finger print recognizer component and electronic device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN109508607A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110738939A (en) * | 2019-10-31 | 2020-01-31 | 维沃移动通信有限公司 | Electronic device |
| WO2020237546A1 (en) * | 2019-05-29 | 2020-12-03 | 深圳市汇顶科技股份有限公司 | Fingerprint recognition device and electronic device |
-
2017
- 2017-09-15 CN CN201710850419.XA patent/CN109508607A/en not_active Withdrawn
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2020237546A1 (en) * | 2019-05-29 | 2020-12-03 | 深圳市汇顶科技股份有限公司 | Fingerprint recognition device and electronic device |
| US11062117B2 (en) | 2019-05-29 | 2021-07-13 | Shenzhen GOODIX Technology Co., Ltd. | Fingerprint identification apparatus and electronic device |
| US11663846B2 (en) | 2019-05-29 | 2023-05-30 | Shenzhen GOODIX Technology Co., Ltd. | Fingerprint identification apparatus and electronic device |
| CN110738939A (en) * | 2019-10-31 | 2020-01-31 | 维沃移动通信有限公司 | Electronic device |
| CN110738939B (en) * | 2019-10-31 | 2021-10-15 | 维沃移动通信有限公司 | Electronic device |
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