Utility model content
Embodiment of the present utility model provides a kind of optical finger print recognizer component and electronic installation.
A kind of optical finger print recognizer component of the utility model embodiment includes:
Cover plate, the surface of the cover plate is formed with mesh-structured;
Optical finger print identifies module, and the optical finger print identification module includes optical fingerprint sensor, the optical finger print
Sensor includes photosensitive layer, and the photosensitive layer is fitted in the lower surface of the cover plate, and the mesh-structured formation optics refers to
Line identifies the optical layer of module, and the photosensitive layer is correspondingly arranged with the optical layer.
In above-mentioned optical finger print recognizer component, optical layer is formed in cover plate with mesh-structured, eliminates extra optical layer,
So as to be thinned the thickness of optical finger print identification module, it is easier to it is integrated in electronic installation particularly portable electron device,
It disclosure satisfy that the frivolous demand of electronic device design.
In some embodiments, the mesh-structured formation pinhole imaging system area, the photosensitive layer forms induction zone, described
Pinhole imaging system area covers the induction zone.
In this way, pinhole imaging system area covering induction zone helps to make the light of more finger reflections be projected to photosensitive area, from
And improve the data volume of the finger print information collected.
In some embodiments, the photosensitive layer includes multiple light-sensitive elements and connects the company of the multiple light-sensitive element
Link, the multiple light-sensitive element form the induction zone.
In this way, light-sensitive element can sense the light injected from pinhole imaging system area and change into electric signal to collect fingerprint
Information.
In some embodiments, the multiple light-sensitive element is distributed in array-like.
In this way, the finger print data for collecting light-sensitive element is more complete.
In some embodiments, the optical finger print identification module includes flexible PCB, the flexible PCB quilt
It is configured to connect the external circuit of the photosensitive layer and the optical finger print recognizer component.
In this way, the finger print information that photosensitive layer is got is transmitted to the external circuit of optical fingerprint sensor to realize fingerprint
Identification function.
In some embodiments, the optical finger print identification module includes pio chip and control unit, the output
Chip and described control unit are arranged on the flexible PCB, and described control unit is used to control the pio chip to read institute
State the output signal of photosensitive layer and transmit to described control unit, described control unit is additionally operable to store the output of the photosensitive layer
Signal, and transmitted the output signal of the photosensitive layer to the external circuit by the flexible PCB.
In this way, reading the electric signal with finger print information of the output of photosensitive layer by pio chip, and fingerprint will be carried
The electric signal of the photosensitive layer of information is stored in control unit, then by flexible PCB by the electricity of the photosensitive layer with finger print information
Signal is transmitted to external circuit, so that external circuit gets finger print information, and then carries out fingerprint recognition.
In some embodiments, the optical finger print identification module includes stiffening plate, and the stiffening plate connection is described soft
Property circuit board, the stiffening plate and the pio chip and described control unit be arranged on opposite two of the flexible PCB
Side.
In this way, stiffening plate can strengthen the intensity of flexible PCB, pio chip and control unit is set preferably to set
In flexible PCB.
In some embodiments, the lower surface of the cover plate is formed with touch control line, the touch control line with it is described
Photosensitive layer and the mesh-structured interval.
In this way, touch control line makes optical finger print recognizer component realize touch controllable function, when optical finger print recognizer component is applied to
, can touch control operation electronic installation during electronic installation.
In some embodiments, the optical finger print identification module includes light source, and the light source is located at the cover plate
Lower section, the light source are configured to transmitting light to the photosensitive layer, the photosensitive layer and are configured to launch the light source
Light is transmitted to the top of the cover plate, and receives the light that the light source reflected by the top of the cover plate is launched.
In this way, the light of light source transmitting is projected to photosensitive layer after handling digital reflex, so that photosensitive layer gets the finger of finger
Line information.
The optical finger print that a kind of electronic installation of the utility model embodiment includes described in any of the above-described embodiment is known
Other component.
In above-mentioned electronic installation, the optical layer of optical finger print recognizer component is formed in cover plate with mesh-structured, eliminates volume
Outer optical layer, so as to be thinned the thickness of optical finger print identification module, it is easier to it is particularly portable to be integrated in electronic installation
In electronic installation, the frivolous demand of electronic device design disclosure satisfy that.
The additional aspect and advantage of embodiment of the present utility model will be set forth in part in the description, partly will be from
Become obvious in following description, or recognized by the practice of embodiment of the present utility model.
Embodiment
Embodiment of the present utility model is described below in detail, the example of the embodiment is shown in the drawings, wherein
Same or similar label represents same or similar element or the element with same or like function from beginning to end.Lead to below
It is exemplary to cross the embodiment being described with reference to the drawings, and is only used for explaining the utility model, and it is not intended that to this practicality
New limitation.
In description of the present utility model, it is to be understood that term " " center ", " longitudinal direction ", " transverse direction ", " length ", " width
Degree ", " thickness ", " on ", " under ", "front", "rear", "left", "right", " vertical ", " level ", " top ", " bottom ", " interior ", " outer ",
" clockwise ", the orientation of instruction " counterclockwise " or position relationship be based on orientation shown in the drawings or position relationship, merely to
It is easy to describe the utility model and simplified description, rather than indicates or imply that signified device or element must be with specifically square
Position, with specific azimuth configuration and operation, therefore it is not intended that to limitation of the present utility model.In addition, term " first ",
" second " is only used for describing purpose, and it is not intended that indicating or implying relative importance or imply the technology indicated by indicating
The quantity of feature.Thus, " first " is defined, the feature of " second " can be expressed or implicitly include one or more
The feature.In description of the present utility model, " multiple " are meant that two or more, unless otherwise clearly specific
Limit.
, it is necessary to which explanation, unless otherwise clearly defined and limited, term " are pacified in description of the present utility model
Dress ", " connected ", " connection " should be interpreted broadly, for example, it may be fixedly connected or be detachably connected, or integratedly
Connection;It can be mechanical connection or electrical connection or can mutually communicate;Can be joined directly together, can also be in
Between medium be indirectly connected, can be connection or the interaction relationship of two elements of two element internals.For this area
For those of ordinary skill, concrete meaning of the above-mentioned term in the utility model can be understood as the case may be.
In the utility model, unless otherwise clearly defined and limited, fisrt feature second feature it " on " or it
" under " can directly be contacted including the first and second features, it is not directly to contact but lead to that can also include the first and second features
The other characterisation contact crossed between them.Moreover, fisrt feature second feature " on ", " top " and " above " include the
One feature is directly over second feature and oblique upper, or is merely representative of fisrt feature level height and is higher than second feature.First is special
Sign second feature " under ", " lower section " and " below " including fisrt feature immediately below second feature and obliquely downward, or only
Represent that fisrt feature level height is less than second feature.
Following disclosure provides many different embodiments or example is used for realizing different structure of the present utility model.
In order to simplify disclosure of the present utility model, hereinafter the part and setting of specific examples are described.Certainly, they are only
Example, and purpose does not lie in limitation the utility model.In addition, the utility model can in different examples repeat reference numerals
And/or reference letter, this repetition are for purposes of simplicity and clarity, itself not indicate discussed various embodiments
And/or the relation between setting.In addition, various specific techniques and the example of material that the utility model provides, but this
Field those of ordinary skill can be appreciated that the application of other techniques and/or the use of other materials.
Referring to Fig. 1, the utility model embodiment provides a kind of optical finger print recognizer component 10.Optical finger print identification group
Part 10 includes cover plate 12 and optical finger print identification module 14.The surface of cover plate 12 is formed with mesh-structured 122.Optical finger print identifies
Module 14 includes optical fingerprint sensor 15, and optical fingerprint sensor 15 includes photosensitive layer 142, and photosensitive layer 142 is fitted in cover plate
12 lower surface, mesh-structured 122 form the optical layer 144 of optical finger print identification module 14, photosensitive layer 142 and optical layer 144
It is correspondingly arranged.
In above-mentioned optical finger print recognizer component 10, optical layer 144 is formed in cover plate 12 with mesh-structured 122, eliminates volume
Outer optical layer 144, so as to be thinned the thickness of optical finger print identification module 14, it is easier to be integrated in electronic installation particularly just
In portable electronic apparatus, the frivolous demand of electronic device design disclosure satisfy that.
It is appreciated that the optical finger print recognizer component 10 of the utility model embodiment can be applied to but be not limited to unblock,
The application scenarios such as file encryption, payment verification, authentication.
In the related art, optical fingerprint sensor includes optical layer, for converging light to photosensitive layer, makes more hands
The light of digital reflex is projected to photosensitive layer, so as to improve the data volume of the finger print information collected.The utility model embodiment
Optical finger print recognizer component 10 in, using mesh-structured 122 as optical finger print identify module 14 optical layer 144, formed
Cover plate 12, therefore extra optical layer 144 is eliminated, so as to be thinned the thickness of optical finger print identification module 14.
In the example of fig. 1, the lower surface of cover plate 12 is formed with mesh-structured 122.
In some embodiments, mesh-structured 122 pinhole imaging system area is formed, photosensitive layer 142 forms induction zone 1422, small
Borescopic imaging area covers induction zone 1422.
In this way, to help to make the light of more fingers reflections to be projected to photosensitive for pinhole imaging system area covering induction zone 1422
Area, so as to improve the data volume of the finger print information collected.
Specifically, when optical finger print recognizer component 10 gathers fingerprint, finger is placed in the upper surface of cover plate 12, from finger reflection
Light is projected to induction zone 1422 behind pinhole imaging system area so that induction zone 1422 can obtain more light to form fingerprint number
According to being favorably improved the degree of accuracy of optical finger print recognizer component 10.
Light can be projected photosensitive layer by pinhole imaging system area formed with multiple apertures, each aperture with pinhole imaging system principle
142.In some embodiments, aperture can be blind hole or through hole.Through hole runs through the upper and lower surface of cover plate 12.Blind hole is passed through
Wear the upper surface or lower surface of cover plate 12.In the example of fig. 1, blind hole runs through the lower surface of cover plate 12.
In one embodiment, optical fingerprint sensor 15 can use cmos sensor.
In some embodiments, photosensitive layer 142 includes multiple light-sensitive element (not shown) and connects multiple light-sensitive elements
Connection line (not shown), multiple light-sensitive elements form induction zones (active area, AA areas) 1422.
In this way, light-sensitive element can sense the light injected from pinhole imaging system area and change into electric signal to collect fingerprint
Information.
Specifically, multiple light-sensitive elements can convert optical signals into electric signal, when finger acts on the surface of cover plate 12
When upper, the light collection reflected from finger is projected to photosensitive layer 142 by pinhole imaging system area, and multiple light-sensitive element sensings carry fingerprint
The light of information is simultaneously converted into electric signal.
Further, photosensitive layer 142 includes substrate, and multiple light-sensitive elements and connection line are formed in substrate.At some
In example, substrate can be semiconductor base.Light-sensitive element and connection line can be formed in substrate by photoetching process.It is multiple
Light-sensitive element can form the induction zone 1422 of array, and other regions form non-inductive area (non-AA areas) in substrate, non-inductive area
It is provided with connection line.Light-sensitive element is, for example, photodiode.
In some embodiments, multiple light-sensitive elements are distributed in array-like.
In this way, the finger print data for collecting light-sensitive element is more complete.
Specifically, the different positions of photosensitive layer 142 are projected to behind pinhole imaging system area from the light of finger diverse location reflection
Put, sense the light of diverse location in multiple light-sensitive elements of array-like distribution to form finger print data.
In some embodiments, optical finger print identification module 14 includes flexible PCB 146, the quilt of flexible PCB 146
It is configured to connect the external circuit of photosensitive layer 142 and optical fingerprint sensor 15.
In this way, the finger print information that photosensitive layer 142 is got is transmitted to optical finger print identification group by flexible PCB 146
The external circuit of part 10 is to realize fingerprint identification function.
In some embodiments, optical finger print identification module 14 includes pio chip 147 and control unit 148, exports
Chip 147 and control unit 148 are arranged on flexible PCB 146, and control unit 148 is used to control pio chip 147 to read light
Feel the output signal of layer 142 and transmit to control unit 148, control unit 148 is additionally operable to store the output letter of photosensitive layer 142
Number, and transmitted the output signal of photosensitive layer 142 to external circuit by flexible PCB 146.
In this way, the electric signal with finger print information of the output of photosensitive layer 142 is read by pio chip 147, and by band
The electric signal for having finger print information is stored in control unit 148, then by flexible PCB 146 by the electric signal with finger print information
Transmit to external circuit, so that external circuit gets finger print information, and then realize fingerprint recognition.
In some embodiments, optical finger print identification module 14 includes stiffening plate 149, and stiffening plate 149 connects flexible electrical
Road plate 146, stiffening plate 149 and pio chip 147 and control unit 148 are arranged on the opposite both sides of flexible PCB 146.
In this way, stiffening plate 149 can strengthen the intensity of flexible PCB 146, make pio chip 147 and control unit 148 can
To be preferably arranged on flexible PCB 146.
Specifically, in the utility model embodiment, pio chip 147 and control unit 148 pass through SMT processing procedures, warp
Soldering is soldered on flexible PCB 146, and piece is needed during SMT, because the temperature of welding is higher, and flexible PCB
146 is softer, therefore sets stiffening plate 149 at the back side of flexible PCB 146, to avoid pio chip 147 and control unit 148
There is the bad problem such as rosin joint with flexible PCB 146.Stiffening plate 149 can be made up of metal material, such as stainless steel.
In some embodiments, the lower surface of cover plate 12 is formed with touch control line (not shown), and touch control line is and light
Feel layer 142 and mesh-structured 122 interval.
In this way, touch control line makes optical finger print recognizer component 10 realize touch controllable function, when optical finger print recognizer component 10 should
, can touch control operation electronic installation during for electronic installation.
It is appreciated that touch control line is spaced with photosensitive layer 142, and in the lower surface of cover plate 12, position corresponding to the top of photosensitive layer 142
Place is put, without touch control line.In other words, position can not carry out touch-control on cover plate 12 and corresponding to photosensitive layer 142.In this way,
User can be avoided to cause false touch when carrying out fingerprint recognition.
Referring to Fig. 2, in some embodiments, optical finger print recognizer component 10 includes display screen 16, display screen 16 pastes
Close in the lower surface of photosensitive layer 142 and the lower surface of cover plate 12.
In this way, display screen 16, which is optical finger print recognizer component 10, provides light source, so that optical finger print identification module 14 is realized
Optical finger print identification function.
Specifically, display screen 16 includes OLED or AMOLED.In the utility model embodiment, display screen 16 includes
AMOLED。
Further, display screen 16 can be touch display screen 16.
It is appreciated that when display screen 16 is fitted in the lower surface of photosensitive layer 142, display screen 16 can be active luminescence display
Shield 16 (such as OLED or AMOLED), the field emission light that display screen 16 can be as light source to the top of induction zone 1422 so that
When the upper surface position that finger is placed on the cover plate 12 corresponding with induction zone 1422 carries out fingerprint recognition, induction zone 1422 can
Enough light is received to form finger print information.In this way, the light source of module 14 is identified by the use of display screen 16 as optical finger print,
The component of electronic installation can be reduced, helps to reduce the volume of electronic installation, so that electronic installation is lightening.
Further, display screen 16 is fitted in the lower surface of cover plate 12 by optical cement 17 (OCA).
Referring to Fig. 1, in some embodiments, optical finger print identification module 14 includes light source 141, and light source 141 is located at
The lower section of cover plate 12, light source 141 are configured to launch light to photosensitive layer 142, and photosensitive layer 142 is configured to send out light source 141
The light penetrated is transmitted to the top of cover plate 12, and receives the light that the light source 141 reflected by the top of cover plate 12 is launched.
In this way, the light that light source 141 is launched is projected to photosensitive layer 142 after handling digital reflex, so that photosensitive layer 142 is got
The finger print information of finger.
In one example, light source 141 launches incident ray to photosensitive layer 142, and incident ray passes through photosensitive layer 142 and net
The region that mesh-structured 122 top is projected to after pore structure 122 reaches the top of cover plate 12.When finger is applied on cover plate 12 just
During to the position of induction zone 1422, reflection light, reflection light warp are reflected to form from the incident ray that light source 141 is sent by finger
Mesh-structured 122 are projected to the light-sensitive element of photosensitive layer 142, and light-sensitive element is by the incident ray being projected on light-sensitive element and instead
Penetrate light and change into the electric signal with finger print information and output, pio chip 147 reads the electric signal of light-sensitive element output simultaneously
Transmit to control unit 148, control unit 148 filters off the electric signal of incident ray and handles the electric signal of reflection light to obtain
The finger print information of finger.
In other examples, light shield layer, light source 141 are may be provided between the substrate of photosensitive layer 142 and each light-sensitive element
The incident ray of transmitting through the gap between multiple light shield layers be emitted to mesh-structured 122 and optical finger print recognizer component 10 it is outer
Portion.In this way, control unit 148 can directly handle the electric signal of light-sensitive element output to obtain the finger print information of finger.
The optics that a kind of electronic installation (not shown) of the utility model embodiment includes any of the above-described embodiment refers to
Line recognizer component 10.
In above-mentioned electronic installation, the optical layer 144 of optical finger print recognizer component 10 is formed in cover plate with mesh-structured 122
12, extra optical layer 144 is eliminated, so as to be thinned the thickness of optical finger print identification module 14, it is easier to be integrated in electronics
In device particularly portable electron device, the frivolous demand of electronic device design disclosure satisfy that.
Specifically, cover plate 12 is cover-plate glass, in this way, electronic installation can form UNDER GLASS optical finger prints identification side
Case.
Electronic installation includes but is not limited to mobile phone, tablet personal computer, wearable device, entrance guard device, ATM etc. and uses optics
The electronic installation of fingerprint recognition.
For example, when electronic installation is mobile phone, optical finger print identification module 14 can be used for mobile phone unblock, file encryption, payment
The application scenarios such as checking.
In the description of this specification, reference term " some embodiments ", " embodiment ", " some embodiment party
The description of formula ", " exemplary embodiment ", " example ", " specific example " or " some examples " means to combine embodiment or shown
Specific features, structure, material or the feature of example description are contained at least one embodiment or example of the present utility model.
In this manual, identical embodiment or example are not necessarily referring to the schematic representation of above-mentioned term.Moreover, description
Specific features, structure, material or feature can be in any one or more embodiments or example with suitable side
Formula combines.
In addition, term " first ", " second " are only used for describing purpose, and it is not intended that instruction or hint relative importance
Or the implicit quantity for indicating indicated technical characteristic.Thus, define " first ", the feature of " second " can be expressed or
Implicitly include at least one feature.In description of the present utility model, " multiple " are meant that at least two, such as two,
Three, unless otherwise specifically defined.
Although embodiment of the present utility model has been shown and described above, it is to be understood that above-described embodiment is
Exemplary, it is impossible to it is interpreted as to limitation of the present utility model, one of ordinary skill in the art is in the scope of the utility model
Interior above-described embodiment to be changed, changed, replaced and modification, the scope of the utility model is by claim and its equivalent
Thing limits.