CN109117728A - A kind of fingerprint recognition mould group and mobile terminal - Google Patents
A kind of fingerprint recognition mould group and mobile terminal Download PDFInfo
- Publication number
- CN109117728A CN109117728A CN201810759525.1A CN201810759525A CN109117728A CN 109117728 A CN109117728 A CN 109117728A CN 201810759525 A CN201810759525 A CN 201810759525A CN 109117728 A CN109117728 A CN 109117728A
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- Prior art keywords
- mould group
- fingerprint recognition
- recognition mould
- fingerprint
- circuit board
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
- G06V40/00—Recognition of biometric, human-related or animal-related patterns in image or video data
- G06V40/10—Human or animal bodies, e.g. vehicle occupants or pedestrians; Body parts, e.g. hands
- G06V40/12—Fingerprints or palmprints
- G06V40/13—Sensors therefor
- G06V40/1324—Sensors therefor by using geometrical optics, e.g. using prisms
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
- G06V40/00—Recognition of biometric, human-related or animal-related patterns in image or video data
- G06V40/10—Human or animal bodies, e.g. vehicle occupants or pedestrians; Body parts, e.g. hands
- G06V40/12—Fingerprints or palmprints
- G06V40/13—Sensors therefor
- G06V40/1318—Sensors therefor using electro-optical elements or layers, e.g. electroluminescent sensing
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Human Computer Interaction (AREA)
- General Physics & Mathematics (AREA)
- Multimedia (AREA)
- Theoretical Computer Science (AREA)
- Optics & Photonics (AREA)
- Measurement Of The Respiration, Hearing Ability, Form, And Blood Characteristics Of Living Organisms (AREA)
- Image Input (AREA)
Abstract
The embodiment of the invention provides a kind of fingerprint recognition mould group and mobile terminals, the fingerprint recognition mould group includes fingerprint chip, filter layer, transition processing layer and flexible circuit board, the upper surface of the fingerprint chip is provided on induction region and non-inductive region, the filter layer and the transition processing layer are laminated in from top to bottom on the induction region, the outlet pad of the fingerprint chip is set to the non-inductive region towards in the one side of the transition processing layer, the flexible circuit board is provided with wiring pad, the outlet pad and wiring pad electrical connection, in the embodiment of the present invention, since the wiring pad that fingerprint chip directly passes through outlet pad and flexible circuit board is electrically connected, without being connect by substrate with flexible circuit board, it simplifies structure and reduces thickness, fingerprint recognition mould group can be arranged in mobile terminal The lower section of display screen realizes mobile terminal using lower Design of Fingerprint Recognition is shielded, improves user to the usage experience of mobile terminal.
Description
Technical field
The present invention relates to technical field of electronic products, more particularly to a kind of fingerprint recognition mould group and mobile terminal.
Background technique
With the fast development of mobile terminal technology, the requirement that user experiences mobile terminal is higher and higher, in response to
The experience requirements at family, mobile terminal, which uses, shields lower fingerprint identification technology, i.e., fingerprint recognition mould group is arranged below display screen.
If Fig. 1 is the structural schematic diagram that existing optical finger print identifies mould group, existing fingerprint recognition mould group passes through resin
Layer 6 is fixed on a substrate 2 by fingerprint chip 1, the electrical connection of fingerprint chip 1 and substrate 2 is then realized by gold thread 7, finally
Mechanical connection and the electrical connection of substrate 2 and flexible circuit board (FPC) 3 are realized using soldered ball 5 by SMT technique, and FPC is real
Flatness when existing SMT also needs below FPC plus a stiffening plate 4.In addition, fingerprint recognition mould group in order to realize optics imitate
Fruit has been bonded transition processing layer 8 and optical filter 9 above fingerprint chip 1, and optical filter 9 needs to be bonded by optical cement 10
On transition processing layer 8.
The fingerprint recognition mould group of the prior art can not be applied to refer under mobile terminal screen in the presence of structure is complicated and thickness is thicker
In the design of line identification.
Summary of the invention
The embodiment of the present invention provides a kind of fingerprint recognition mould group and mobile terminal, with solve existing fingerprint recognition mould group due to
The problem of structure is complicated and thickness is thicker, can not be applied to Design of Fingerprint Recognition under mobile terminal screen.
In order to solve the above-mentioned technical problem, present invention implementation is achieved in that
The embodiment of the invention provides a kind of fingerprint recognition mould group, including fingerprint chip, filter layer, transition processing layer and soft
Property circuit board, the upper surface of the fingerprint chip are provided on induction region and non-inductive region, the filter layer and the mistake
It crosses process layer to be laminated in from top to bottom on the induction region, the outlet pad of the fingerprint chip is set to the non-inductive area
Towards in the one side of the transition processing layer, the flexible circuit board is provided with wiring pad in domain, the outlet pad and described
The electrical connection of wiring pad.
The embodiment of the invention provides a kind of mobile terminal, the mobile terminal includes fingerprint provided in an embodiment of the present invention
Identification mould group, display screen and mainboard, the fingerprint recognition mould group are located at the lower section of the display screen, the fingerprint recognition mould group
Flexible circuit board is connect with the mainboard.
The fingerprint recognition mould group of the embodiment of the present invention, fingerprint chip directly pass through the wiring of outlet pad and flexible circuit board
Pad electrical connection simplifies structure and reduces thickness, fingerprint can be known without being connect by substrate with flexible circuit board
The lower section of mobile terminal display screen is arranged in other mould group, realizes mobile terminal using lower Design of Fingerprint Recognition is shielded, improves use
Usage experience of the family to mobile terminal.
Detailed description of the invention
In order to illustrate the technical solution of the embodiments of the present invention more clearly, below by institute in the description to the embodiment of the present invention
Attached drawing to be used is needed to be briefly described, it should be apparent that, the accompanying drawings in the following description is only some implementations of the invention
Example, for those of ordinary skill in the art, without any creative labor, can also be according to these attached drawings
Obtain other attached drawings.
Fig. 1 is the positive structure schematic of existing fingerprint recognition mould group；
Fig. 2 is the positive structure schematic of the fingerprint recognition mould group of the embodiment of the present invention one；
Fig. 3 is the overlooking structure diagram of the fingerprint recognition mould group of the embodiment of the present invention one；
Fig. 4 is the positive structure schematic of the fingerprint recognition mould group of the embodiment of the present invention two；
Fig. 5 is the positive structure schematic of the fingerprint recognition mould group of the embodiment of the present invention three；
Fig. 6 is the positive structure schematic of the fingerprint recognition mould group of the embodiment of the present invention four.
Specific embodiment
Following will be combined with the drawings in the embodiments of the present invention, and technical solution in the embodiment of the present invention carries out clear, complete
Site preparation description, it is clear that described embodiments are some of the embodiments of the present invention, instead of all the embodiments.Based on this hair
Embodiment in bright, every other implementation obtained by those of ordinary skill in the art without making creative efforts
Example, shall fall within the protection scope of the present invention.
Embodiment one
Fig. 2 is the positive structure schematic of the fingerprint recognition mould group of the embodiment of the present invention one, and Fig. 3 is the embodiment of the present invention one
Fingerprint recognition mould group overlooking structure diagram.
As shown in Figures 2 and 3, the fingerprint recognition mould group of the embodiment of the present invention includes fingerprint chip 1, filter layer, transition position
Manage layer 8 and flexible circuit board 3.
In practical applications, the upper surface of fingerprint chip 1 is provided with induction region 102 and non-inductive region 103, filter layer
It is laminated on induction region 102 from top to bottom with transition processing layer 8, i.e., is successively filter layer, 8 and of transition processing layer from top to down
Fingerprint chip 1, so that light enters the induction region 102 of fingerprint chip 1 after filter layer and transition processing.
In practical applications, the induction region 102 of fingerprint chip 1 can be light sensor, can by light sensor
It can inside induction region 102 and non-inductive region 103 to form fingerprint image data to acquire the light after fingerprint reflects
To be provided with wiring layers, non-inductive region 103 be arranged it is being connect with wiring layers, be exposed to 103 upper surface of non-inductive region
The electrical connection of fingerprint chip 1 Yu external devices, such as flexible circuit may be implemented by outlet pad 101 for outlet pad 101
One end of plate 3 is provided with the wiring pad 301 being adapted to outlet pad 101, passes through outlet pad 101 and wiring pad 301
Electrical connection, the finger print data that fingerprint chip 1 acquires can be sent to external devices by flexible circuit board 3.
In the embodiment of the present invention, the outlet pad 101 of fingerprint chip 1 is set to non-inductive region 103 towards transition processing
In the one side of layer 8, and the same side of induction region 102 is arranged in outlet pad 101, and flexible circuit board 3 is arranged in fingerprint core
The side of the fixed transition processing layer 8 of piece 1, the wiring pad 301 and outlet pad 101 of flexible circuit board 3 are electrically connected.
In embodiments of the present invention, outlet pad 101 and wiring pad 301 can be electrically connected by electric conductor, such as
It is electrically connected by one of tin ball, gold goal, silver paste, can also be formed and be electrically connected by connector certainly.
It in embodiments of the present invention, can be in the upper surface of one end that flexible circuit board 3 is connect with fingerprint chip 1 and following table
Face is provided with reinforcement glue 11, can be up and down the two of connecting portion for example, after outlet pad 101 is connect with wiring pad 301
A face coats insulating cement to improve the reliability of connection.
In the embodiment of the present invention, filter layer can filter out the light of useless wavelength, such as filter out sightless ultraviolet
Line and the infrared ray etc. for influencing fingerprint imaging, the material of transition processing layer 8 can be opaque plastic cement or plated film etc., transition position
Reason layer 8 is that aperture is arranged in lighttight transition processing layer 8 based on pinhole imaging system principle, so that light passes through transition processing
It is imaged after the aperture of layer 8 in the induction region 102 of fingerprint chip 1, relative to by lens focusing image-forming principle, passes through transition position
Setting aperture is imaged in reason layer 8, on the one hand can significantly reduce the thickness of fingerprint recognition mould group, on the other hand, can
To avoid optical attenuation caused by lens, luminous flux is increased, improves the clarity of imaging.
As shown in Fig. 2, in one preferred embodiment of the invention, filter layer can be optical filtering coating 12, optical filtering plating
Layer 12 can be integrated on the upper surface of transition processing layer 8 by coating process, such as can be plated by evaporation coating, sputtering
The coating process such as film, ion film plating, arc coating deposition form optical filtering coating 12 on transition processing layer 8, can also be plated by nanometer
Membrane process forms the optical filtering coating 12 of Nano grade on transition processing layer 8, replaces filter in the prior art using optical filtering coating
Mating plate, it is possible to reduce optical filter and optical cement improve the intensity of the light into fingerprint chip to the transmission loss of light.
The fingerprint recognition mould group of the embodiment of the present invention can save substrate relative to fingerprint recognition mould group existing in Fig. 1
2, the thickness of tin ball 5, stiffening plate 4, flexible circuit board 3, optical cement 10 and optical filter 9.
In the embodiment of the present invention, fingerprint chip is directly electrically connected with flexible circuit board, flexible circuit board and transition processing
Layer is located at the same side of fingerprint chip, no setting is required substrate and stiffening plate, while filter layer is to be arranged on transition processing layer
Optical filtering coating simplifies the structure of fingerprint recognition mould group, drops it is not necessary that optical filter is fixed on transition processing layer by optical cement
The thickness of low fingerprint recognition mould group realizes so that fingerprint recognition mould group can be set in the lower section of mobile terminal display screen
Mobile terminal improves user to the usage experience of mobile terminal using lower Design of Fingerprint Recognition is shielded.
Embodiment two
Fig. 4 is the positive structure schematic of the fingerprint recognition mould group of the embodiment of the present invention two.
As shown in figure 4, the fingerprint recognition mould group of the embodiment of the present invention includes fingerprint chip 1, filter layer, transition processing layer 8
With flexible circuit board 3.
In the embodiment of the present invention, fingerprint chip 1, the structure of transition processing layer 8 and flexible circuit board 3 and all parts it
Between connection relationship can be with reference implementation example one, it will not be described herein.
What is different from the first embodiment is that filter layer can be optical filter in the fingerprint recognition mould group of the embodiment of the present invention two
9, optical filter 9 is set to the upper surface of transition processing layer 8 by optical cement 10.
Optical filter 9 can be added what special dye was made into plastics or sheet glass, can filter out useless wave by optical filter 9
Long light, such as filter out sightless ultraviolet light and influence the infrared ray etc. of fingerprint imaging.
Optical cement 10 can be the adhesive for cementing transparent optical element, and there is optical cement colorless and transparent, light to penetrate
Rate is high, cementing strength is good, can solidify under room temperature or medium temperature, the features such as cure shrinkage is small.Optical cement 10 can be organosilicon
The adhesive such as glue, acrylic type resin and unsaturated polyester (UP), polyurethane, epoxy resin.
The fingerprint recognition mould group of the embodiment of the present invention can save substrate relative to fingerprint recognition mould group existing in Fig. 1
2, the thickness of tin ball 5, stiffening plate 4, flexible circuit board 3.
In the embodiment of the present invention, fingerprint chip is directly electrically connected with flexible circuit board, flexible circuit board and transition processing
Layer is located at the same side of fingerprint chip, no setting is required substrate and stiffening plate, while filter layer is to be arranged on transition processing layer
Optical filter simplifies the structure of fingerprint recognition mould group, reduces the thickness of fingerprint recognition mould group, so that fingerprint recognition mould group can be with
The lower section of mobile terminal display screen is set, realizes mobile terminal using lower Design of Fingerprint Recognition is shielded, improves user to shifting
The usage experience of dynamic terminal.
Embodiment three
Fig. 5 is the positive structure schematic of the fingerprint recognition mould group of the embodiment of the present invention three.
The fingerprint recognition mould group of the embodiment of the present invention includes fingerprint chip 1, filter layer, transition processing layer 8 and flexible circuit
Plate 3.
In practical applications, the upper surface of fingerprint chip 1 is provided with induction region 102 and non-inductive region 103, filter layer
It is laminated on induction region 102 from top to bottom with transition processing layer 8, i.e., is successively filter layer, 8 and of transition processing layer from top to down
Fingerprint chip 1, so that light enters the 102 (induction region of induction region of fingerprint chip 1 after filter layer and transition processing
102 and non-inductive region 103 can refer to Fig. 3).
In practical applications, the induction region 102 of fingerprint chip 1 can be light sensor, can by light sensor
It can inside induction region 102 and non-inductive region 103 to form fingerprint image data to acquire the light after fingerprint reflects
To be provided with wiring layers, non-inductive region 103 be arranged it is being connect with wiring layers, be exposed to 103 upper surface of non-inductive region
The electrical connection of fingerprint chip 1 Yu external devices, such as flexible circuit may be implemented by outlet pad 101 for outlet pad 101
One end of plate 3 is provided with the wiring pad 301 being adapted to outlet pad 101, passes through outlet pad 101 and wiring pad 301
Electrical connection, the finger print data that fingerprint chip 1 acquires can be sent to external devices by flexible circuit board 3.
As shown in figure 5, in embodiments of the present invention, the lower surface of fingerprint chip 1 and the upper surface of flexible circuit board 3 are pasted
It closes, wiring pad 301 is located on the upper surface that flexible circuit board 3 is not bonded with fingerprint chip 1, wiring pad 301 and wire bonding out
Disk 101 is electrically connected, and specifically, fingerprint chip 1 can be fitted in the not set wiring pad of flexible circuit board 3 by insulating cement
301 region.
In embodiments of the present invention, outlet pad 101 and wiring pad 301 can be electrically connected by gold thread 7.
In practical applications, the lower surface of flexible circuit board 3 can be provided with stiffening plate 4, such as can be in flexible electrical
The lower surface that road plate 3 is bonded the part of fingerprint chip 1 is bonded a sheet metal, on the one hand can be convenient fitting fingerprint chip 1, another
Intensity can be improved in aspect.
In embodiments of the present invention, filter layer can be optical filter 9, and optical filter 9 is arranged by optical cement 10 in transition position
On the upper surface for managing layer 8.
Optical filter 9 can be added what special dye was made into plastics or sheet glass, can filter out useless wave by optical filter 9
Long light, such as filter out sightless ultraviolet light and influence the infrared ray etc. of fingerprint imaging.
Optical cement 10 can be the adhesive for cementing transparent optical element, and there is optical cement colorless and transparent, light to penetrate
Rate is high, cementing strength is good, can solidify under room temperature or medium temperature, and have the features such as cure shrinkage is small.Optical cement 10 can be
The adhesive such as machine silica gel, acrylic type resin and unsaturated polyester (UP), polyurethane, epoxy resin.
The fingerprint recognition mould group of the embodiment of the present invention can save substrate relative to fingerprint recognition mould group existing in Fig. 1
2 and tin ball 5 thickness.
In the embodiment of the present invention, fingerprint chip is directly electrically connected with flexible circuit board, and no setting is required substrate simplifies finger
Line identifies the structure of mould group, the thickness of fingerprint recognition mould group is reduced, so that fingerprint recognition mould group can be set in mobile terminal
The lower section of display screen realizes mobile terminal using lower Design of Fingerprint Recognition is shielded, improves user and use body to mobile terminal
It tests.
Example IV
Fig. 6 is the positive structure schematic of the fingerprint recognition mould group of the embodiment of the present invention four.
The fingerprint recognition mould group of the embodiment of the present invention includes fingerprint chip 1, filter layer, transition processing layer 8 and flexible circuit
Plate 3.
In the embodiment of the present invention, fingerprint chip 1, the structure of transition processing layer 8 and flexible circuit board 3 and all parts it
Between connection relationship can be with reference implementation example three, it will not be described herein.
Unlike embodiment three, in one preferred embodiment of the invention, filter layer can be optical filtering coating 12,
The optical filtering coating 12 can be integrated on the upper surface of transition processing layer 8 by coating process, for example, can by evaporation coating,
The coating process such as sputter coating, ion film plating, arc coating deposition form optical filtering coating 12 on transition processing layer 8, can also pass through
Nano-coating forms the optical filtering coating 12 of Nano grade on transition processing layer 8, is replaced using optical filtering coating in the prior art
Optical filter, it is possible to reduce optical filter and optical cement improve the intensity of the light into fingerprint chip to the transmission loss of light.
The fingerprint recognition mould group of the embodiment of the present invention can save substrate relative to fingerprint recognition mould group existing in Fig. 1
2, the thickness of tin ball 5, optical cement 10 and optical filter 9.
In the embodiment of the present invention, fingerprint chip is directly electrically connected with flexible circuit board, and no setting is required substrate filters simultaneously
Layer is the optical filtering coating being arranged on transition processing layer, it is not necessary that optical filter is fixed on transition processing layer by optical cement, letter
The structure for having changed fingerprint recognition mould group reduces the thickness of fingerprint recognition mould group, so that fingerprint recognition mould group can be set and move
The lower section of dynamic terminal display screen realizes mobile terminal using lower Design of Fingerprint Recognition is shielded, improves user to mobile terminal
Usage experience.
The embodiment of the invention also provides a kind of mobile terminal, the mobile terminal include embodiment one,
Fingerprint recognition mould group that one embodiment in embodiment two, embodiment three and example IV provides, display screen and
Mainboard, the fingerprint recognition mould group are located at the lower section of the display screen, the flexible circuit board of the fingerprint recognition mould group with it is described
Mainboard connection.
Although the preferred embodiment of the embodiment of the present invention has been described, once a person skilled in the art knows bases
This creative concept, then additional changes and modifications can be made to these embodiments.So the following claims are intended to be interpreted as
Including preferred embodiment and fall into all change and modification of range of embodiment of the invention.
Finally, it is to be noted that, herein, the terms "include", "comprise" or its any other variant are intended to
Cover non-exclusive inclusion, so that including that process, method, article or the terminal device of a series of elements not only include
Those elements, but also including other elements that are not explicitly listed, or further include for this process, method, article or
The intrinsic element of person's terminal device.In the absence of more restrictions, the element limited by sentence "including a ...",
Be not precluded is including that there is also other identical elements in the process, method of the element, article or terminal device.
The above description is merely a specific embodiment, but scope of protection of the present invention is not limited thereto, any
Those familiar with the art in the technical scope disclosed by the present invention, can easily think of the change or the replacement, and should all contain
Lid is within protection scope of the present invention.Therefore, protection scope of the present invention should be subject to the protection scope in claims.
Claims (10)
1. a kind of fingerprint recognition mould group, which is characterized in that including fingerprint chip, filter layer, transition processing layer and flexible circuit board,
The upper surface of the fingerprint chip is provided on induction region and non-inductive region, and the filter layer and the transition processing layer are certainly
It is laminated on the induction region under above, the outlet pad of the fingerprint chip is set to the non-inductive region described in
In the one side of transition processing layer, the flexible circuit board is provided with wiring pad, the outlet pad and wiring pad electricity
Gas connection.
2. fingerprint recognition mould group as described in claim 1, which is characterized in that the outlet pad is set to the induction region
The same side, the flexible circuit board is set to the side of the fixed transition processing layer of the fingerprint chip.
3. fingerprint recognition mould group as claimed in claim 2, which is characterized in that the outlet pad and the wiring pad pass through
The electrical connection of one of tin ball, gold goal, silver paste electric conductor.
4. fingerprint recognition mould group as claimed in claim 3, which is characterized in that the flexible circuit board and the fingerprint chip connect
The upper and lower surfaces of the one end connect are provided with reinforcement glue.
5. fingerprint recognition mould group as described in claim 1, which is characterized in that the lower surface of the fingerprint chip and the flexibility
The upper surface of circuit board is bonded, and the wiring pad is located at the upper surface that the flexible circuit board is not bonded with the fingerprint chip
On.
6. fingerprint recognition mould group as claimed in claim 5, which is characterized in that the outlet pad and the wiring pad pass through
Gold thread electrical connection.
7. such as fingerprint recognition mould group described in claim 5 or 6, which is characterized in that the lower surface of the flexible circuit board is arranged
There is stiffening plate.
8. fingerprint recognition mould group as claimed in any one of claims 1 to 6, which is characterized in that the filter layer is optical filtering coating,
The optical filtering coating is set to the upper surface of the transition processing layer.
9. fingerprint recognition mould group as claimed in any one of claims 1 to 6, which is characterized in that the filter layer is optical filter, institute
State the upper surface that optical filter fits in the transition processing layer by optical cement.
10. a kind of mobile terminal, which is characterized in that the mobile terminal includes such as the described in any item fingerprints of claim 1-9
Identification mould group, display screen and mainboard, the fingerprint recognition mould group are located at the lower section of the display screen, the fingerprint recognition mould group
Flexible circuit board is connect with the mainboard.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810759525.1A CN109117728A (en) | 2018-07-11 | 2018-07-11 | A kind of fingerprint recognition mould group and mobile terminal |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810759525.1A CN109117728A (en) | 2018-07-11 | 2018-07-11 | A kind of fingerprint recognition mould group and mobile terminal |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN109117728A true CN109117728A (en) | 2019-01-01 |
Family
ID=64862703
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810759525.1A Pending CN109117728A (en) | 2018-07-11 | 2018-07-11 | A kind of fingerprint recognition mould group and mobile terminal |
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| CN110709860B (en) * | 2019-03-25 | 2023-12-19 | 深圳市汇顶科技股份有限公司 | Fingerprint identification device and electronic equipment |
| CN110320972A (en) * | 2019-05-20 | 2019-10-11 | 华为技术有限公司 | A kind of fingerprint recognition mould group and a kind of electronic equipment |
| CN110320972B (en) * | 2019-05-20 | 2022-05-06 | 荣耀终端有限公司 | Fingerprint identification module and electronic equipment |
| CN112464693A (en) * | 2019-09-09 | 2021-03-09 | 南昌欧菲生物识别技术有限公司 | Fingerprint identification module, preparation method thereof and intelligent terminal |
| CN112860008A (en) * | 2019-11-28 | 2021-05-28 | 北京小米移动软件有限公司 | Display screen module, terminal equipment and fingerprint identification method |
| CN112560628A (en) * | 2020-12-07 | 2021-03-26 | 东莞华贝电子科技有限公司 | Side fingerprint identification mechanism and mobile terminal |
| CN112560628B (en) * | 2020-12-07 | 2024-04-12 | 东莞华贝电子科技有限公司 | Side fingerprint identification mechanism and mobile terminal |
| CN114755856A (en) * | 2022-03-23 | 2022-07-15 | 江西科莱电子有限公司 | LCD screen structure and electronic equipment comprising same |
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Application publication date: 20190101 |