CN109074488A - Fingerprint mould group and electronic equipment - Google Patents
Fingerprint mould group and electronic equipment Download PDFInfo
- Publication number
- CN109074488A CN109074488A CN201880000958.7A CN201880000958A CN109074488A CN 109074488 A CN109074488 A CN 109074488A CN 201880000958 A CN201880000958 A CN 201880000958A CN 109074488 A CN109074488 A CN 109074488A
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- China
- Prior art keywords
- reflector element
- mould group
- transmission units
- fingerprint
- shell
- Prior art date
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Classifications
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
- G06V40/00—Recognition of biometric, human-related or animal-related patterns in image or video data
- G06V40/10—Human or animal bodies, e.g. vehicle occupants or pedestrians; Body parts, e.g. hands
- G06V40/12—Fingerprints or palmprints
- G06V40/13—Sensors therefor
- G06V40/1324—Sensors therefor by using geometrical optics, e.g. using prisms
Abstract
The application provides a kind of fingerprint mould group and electronic equipment.The fingerprint mould group includes shell, reflector element, transmission units and sensor module；Reflector element, transmission units and sensor module are located in shell；The reflecting surface of reflector element will reflex to transmission units by the light of the light well incidence on shell；Sensor module receives the optical signal by transmission units, and carries out fingerprint recognition according to optical signal.The accuracy of fingerprint recognition can be improved in the application.
Description
Technical field
The invention relates to fingerprint identification technology more particularly to a kind of fingerprint mould group and electronic equipments.
Background technique
With the development of fingerprint identification technology, traditional physical capacitors formula fingerprint recognition is gradually substituted, and screen fingerprint is known
Not Cheng Wei a kind of technological trend, while higher and higher screen accounting can also be promoted electronic equipment aesthetic appearance and user view
Feel experience.
In screen optics fingerprinting scheme, the transmitting light of light source is emitted to finger, the peaks and troughs of fingerprint on finger
Due to forming the different light and shade striped of brightness, i.e. fingerprint image on fingerprint sensor to transmitting light absorption difference.Currently, base
Certain development has been obtained in the optical finger print identifying schemes of collimated light.
However, the resolution ratio of the above-mentioned obtained fingerprint image of optical finger print identifying schemes based on collimated light is lower, from
And influence the precision and accuracy of fingerprint recognition.
Summary of the invention
The embodiment of the present application provides a kind of fingerprint mould group and electronic equipment, to improve the accuracy and precision of fingerprint recognition.
The embodiment of the present application provides a kind of fingerprint mould group, comprising: shell, reflector element, transmission units and sensor module；
The reflector element, the transmission units and the sensor module are located in the shell；
There is light well on the shell；The reflecting surface of the reflector element reflexes to the light of the light well incidence
The transmission units；The sensor module is located at the side that the transmission units deviate from the reflector element；
The sensor module is carried out for receiving the optical signal by the transmission units, and according to the optical signal
Fingerprint recognition.
In one implementation, the reflector element includes a reflector element；
The reflecting surface of the reflector element is towards the light well and the transmission units, the light well and the transmission
Unit is located at the different directions of the reflecting surface of the reflector element, so that the reflecting surface of the reflector element enters the light well
The light penetrated reflexes to the transmission units.
In another implementation, the reflector element includes the first reflector element and the second reflector element；
The reflecting surface of first reflector element towards the light well and second reflector element reflecting surface so that
The light of the light well incidence is reflexed to the reflecting surface of second reflector element by the reflecting surface of first reflector element；
The reflecting surface of second reflector element is towards the transmission units, so that the reflecting surface of second reflector element
The transmission units will be reflexed to by the light of second reflector element；
The sensor module is located at the side away from second reflecting mirror of the transmission units.
In another implementation, the fingerprint mould group further include: bracket；The bracket is located at the transmission units
End；The bracket is for being fixed the position of the transmission units, so that the transmission units and the sensor die
The relative position of group is fixed.
In another implementation, the sensor module includes: fingerprint sensor, chip and printed circuit board
PCB；
The fingerprint sensor is located at the side that the transmission units deviate from the reflector element, to receive by described
The optical signal of transmission units, and the optical signal is converted into electric signal；
The chip is connect with the fingerprint sensor；Its of the PCB and circuit and electronic equipment on the chip
The connection of its processing circuit；
Circuit on the chip is for after being handled according to the electric signal that the fingerprint sensor exports, processing to be tied
Fruit is transmitted to other processing circuits by the PCB.
In another implementation, the PCB is flexible circuit board FPCB, the sensor module further include: reinforcement
Plate；
The stiffening plate is bonded with the PCB away from the one side of the chip.
In another implementation, the PCB be hard PCB, the PCB as the shell a part with it is described
The other parts of shell connect.
In another implementation, the sensor module further include: cutoff filter IRCF；
The IRCF is between the transmission units and the fingerprint sensor, so that the IRCF filters out the transmission
After infrared light in unit emergent ray, by beam projecting to the fingerprint sensor.
In another implementation, it is situated between the transmission units and the reflecting surface of the reflector element filled with air
Matter or glass medium.
In another implementation, the shell includes first shell and second shell；The first shell and described
Towards having the light well on a shell of the reflecting surface of the reflector element in second shell；
The first shell and the second shell coat the shell to form the fingerprint mould group.
In another implementation, there is through-hole on the shell；The through-hole is used to carry out the fingerprint mould group
It is fixed.
A kind of electronic equipment can also be provided in the embodiment of the present application, comprising: shell, cover board, display module and fingerprint mould group；Institute
Cover board, the display module and the fingerprint mould group is stated to be located in the shell；
The cover board is bonded with the one side of the display module, and the another side of the display module is towards the fingerprint mould group
Entering light face；The fingerprint mould group is upper any fingerprint mould group.
Fingerprint mould group provided by the embodiments of the present application and electronic equipment, wherein fingerprint mould group may include shell, reflection list
Member, transmission units and sensor module, wherein the reflector element, the transmission units and the sensor module can be located at the shell
It is interior, there is light well, the reflecting surface of the reflector element is simultaneously towards light well and transmission units, to by the entering light on the shell
The light of hole incidence reflexes to the transmission units, the sensor module be located at the transmission units away from the one of the reflector element
Side, which can receive the optical signal by the transmission units, and carry out fingerprint recognition according to the optical signal.Refer at this
In line mould group, the reflection of light can be carried out by the reflecting surface of reflector element, realizes the folding of optical path, the light after the reflection can
It is focused in sensor module by transmission units, reduces the size of imaging facula in sensor module, improve fingerprint image
The resolving power of picture effectively increases the precision and accuracy of fingerprint recognition.
Detailed description of the invention
In order to illustrate the technical solutions in the embodiments of the present application or in the prior art more clearly, to embodiment or will show below
There is attached drawing needed in technical description to be briefly described, it should be apparent that, the accompanying drawings in the following description is this Shen
Some embodiments please for those of ordinary skill in the art without any creative labor, can be with
It obtains other drawings based on these drawings.
Fig. 1 is a kind of structural schematic diagram one of fingerprint mould group provided by the embodiments of the present application；
Fig. 2A is a kind of structural schematic diagram two of fingerprint mould group provided by the embodiments of the present application；
Fig. 2 B is a kind of structural schematic diagram three of fingerprint mould group provided by the embodiments of the present application；
Fig. 3 A is the schematic diagram of the pattern distortion in fingerprint mould group provided by the embodiments of the present application filled with glass medium；
Fig. 3 B is the schematic diagram of the pattern distortion in fingerprint mould group provided by the embodiments of the present application filled with air dielectric；
Fig. 4 A is the signal of the image relative illumination in fingerprint mould group provided by the embodiments of the present application filled with glass medium
Figure；
Fig. 4 B is the signal of the image relative illumination in fingerprint mould group provided by the embodiments of the present application filled with air dielectric
Figure；
Fig. 5 is a kind of structural schematic diagram four of fingerprint mould group provided by the embodiments of the present application；
Fig. 6 A is a kind of structural schematic diagram five of fingerprint mould group provided by the embodiments of the present application；
Fig. 6 B is a kind of structural schematic diagram six of fingerprint mould group provided by the embodiments of the present application；
Fig. 7 is the structural schematic diagram of a kind of electronic equipment provided by the embodiments of the present application.
Specific embodiment
To keep the purposes, technical schemes and advantages of the embodiment of the present application clearer, below in conjunction with the embodiment of the present application
In attached drawing, the technical scheme in the embodiment of the application is clearly and completely described, it is clear that described embodiment is
Some embodiments of the present application, instead of all the embodiments.Based on the embodiment in the application, those of ordinary skill in the art
Every other embodiment obtained without creative efforts, shall fall in the protection scope of this application.
Unless otherwise defined, all technical and scientific terms used herein and the technical field for belonging to the application
The normally understood meaning of technical staff is identical.The term used in the description of the present application is intended merely to description tool herein
The purpose of the embodiment of body, it is not intended that in limitation the application.Term as used herein "and/or" includes one or more phases
Any and all combinations of the listed item of pass.With reference to the accompanying drawing, some embodiments of the application are made specifically
It is bright.In the absence of conflict, the feature in following embodiment and embodiment can be combined with each other.
The fingerprint mould group that the following each embodiments of the application provide can be applied to smart phone, laptop, wearable set
Standby, household appliance etc. is any to be had in the electronic equipment for shielding lower optical finger print identification function.Shielding lower optical finger print can show
It locally realizes, full frame can also realize in the display area of screen.
Since in collimating optics fingerprint mould group, fingerprint sensor is that the collimated ray exported by collimation unit carries out
The imaging of fingerprint image, and the spacing of adjacent ray is larger in collimated ray, this makes collimated ray on fingerprint sensor
Hot spot is usually larger, so that the resolving power of fingerprint image is poor.
Based on this, the reflection that reflector element carries out light can be arranged in the following embodiments of the application in fingerprint mould group, realize light
Road folds, and makes on light focusing to fingerprint sensor by transmission units, in reduction fingerprint mould group on fingerprint sensor at
As the size of hot spot, the resolving power of fingerprint image is improved.
In fingerprint mould group provided by the embodiment of the present application, the number of reflector element can be one, or it is multiple,
First fingerprint mould group is illustrated with a reflector element in conjunction with multiple examples as follows.
Fig. 1 is a kind of structural schematic diagram one of fingerprint mould group provided by the embodiments of the present application.As shown in Figure 1, fingerprint mould group
Can include: shell 1, reflector element 2, transmission units 3 and sensor module 4.
Reflector element 2, transmission units 3 and sensor module 4 are respectively positioned in shell 1.
There is light well 5 on shell 1；For example, light well 5 can be formed in the top plate of shell 1.The setting of reflector element 2 exists
Side inside shell 1, and the other side inside shell 1 is arranged in transmission units 3 and sensor module 4.Reflector element 2 it is anti-
It penetrates face and the incident light of light well 5 is reflexed into transmission units 3；Sensor module 4 be located at transmission units 3 away from reflector element
2 side.
Sensor module 4 carries out fingerprint recognition for receiving the optical signal for passing through transmission units 3, and according to the optical signal.
Wherein, if in the fingerprint mould group, the number of reflector element 2 is one, then the reflecting surface of reflector element 2 can be phase
There is the inclined-plane of certain tilt angle for the opening direction of light well 5, and the sensitive surface of sensor module 4 can be single with transmission
Member 3 is substantially parallel, and perpendicular to the plane where the opening of light well 5.Specifically, the reflecting surface of reflector element 2 can be about
45 ° of tilt angle is towards light well 5, to receive the incident light of light well 5；Meanwhile the optical axis and entering light of transmission units 3
The opening direction in hole 3 is vertical, therefore the reflecting surface of reflector element 2 is also simultaneously with about 45 ° of tilt angle towards transmission units
3, the incident light of light well 5 is reflexed to transmission units 3.
The reflecting surface of reflector element 2 can be mirror image element with high reflectivity, usually can by aluminium film, or
Silver mirror realizes reflection.Certainly, the reflecting surface of reflector element 2 can also realize that details are not described herein by another way.Instead
Penetrating unit 2 for example can be reflecting mirror.It should be noted that the reflector element 2 can also be other components for carrying out light reflection,
And it is not limited to reflecting mirror, reflecting mirror is only a kind of possible example.The embodiment of the present application is limited not to this.
Transmission units 3 can be a kind of optical imaging element, and transmission units 3 can have spherical surface or aspherical optical transmission
Structure, to focus on incident ray to sensor module 4, in the present embodiment, which specifically be can be from entering light
Hole 5 enters fingerprint mould group and in the reflective surface of reflector element 2 to the light of transmission units 3.Transmission units 3 can be one
Lens, or the structure of multiple lens compositions.The lens of transmission units 3 usually can be by resin material or glass material
It is formed.
Based on above structure, light well 5 and transmission units 3 can be located separately the different directions of the reflecting surface of reflector element 2.
Wherein, the different directions of the reflecting surface of reflector element 2 can be distinguished by the optical axis of reflector element 2, i.e. the different directions
It can be the different directions of the optical axis two sides of reflector element 2.
Fingerprint mould group shown in FIG. 1 can be located at the lower section of display screen in electronic equipment.Wherein, which can be integrated
The touching display screen of touch-control and display function, for example by touch-control sensing unit part or be fully integrated into inside display screen, or
Touch-control sensing unit is arranged in display screen surface person.For the display function for realizing display screen, the luminescence unit of display screen can be made
It is transmitting light source to emit light.The transmitting light source for example can be Organic Light Emitting Diode (Organic Light-
Emitting Diode, abbreviation OLED) display pixel of display screen, liquid crystal display (Liquid Crystal Display, letter
Claim LCD) backlight or below display screen or the internal excitation light source being additionally arranged, such as light emitting diode
Any light such as (Light-Emitting Diode, abbreviation LED) or infra-red laser diode (Laser Diode, abbreviation LD)
Source.
The light that the transmitting light source issues, can penetrate the display module 10 and cover board 20 of display screen, touch and show in finger
Reflection and/or refraction occur when screen, through the light that reflects and/or reflect after successively penetrating cover board 20 and display module 10,
The reflecting surface of reflector element 2 is incident to by light well 5.
The reflecting surface of reflector element 2 can there are preset reflections between the display plane of the display module 10 of display screen
Angle, so that the reflecting surface of reflector element 2 is simultaneously with preset tilt angle towards light well 5 and transmission units 3.
The incident light of light well 5 can be reflexed to transmission units 3, the optics of transmission units 3 by the reflecting surface of reflector element 2
Curved surface makes on light focusing to sensor module 4.Sensor module 4 can be real according to the optical signal of the transmission units 3 received
Existing fingerprint recognition.
Fingerprint mould group provided by the embodiments of the present application may include shell, reflector element, transmission units and sensor module,
In, the reflector element, the transmission units and the sensor module can be located in the shell, have light well on the shell, this is anti-
The reflecting surface of unit is penetrated simultaneously towards light well and transmission units, the light of light well incidence is reflexed to the transmission list
Member, the sensor module are located at the side away from the reflector element of the transmission units, which can receive by being somebody's turn to do
The optical signal of transmission units, and fingerprint recognition is carried out according to the optical signal.In the fingerprint mould group, the anti-of reflector element can be passed through
The reflection that face carries out light is penetrated, realizes the folding of optical path, the light after the reflection can focus to sensor die by transmission units
In group, the size of imaging facula in sensor module is reduced, improves the resolving power of fingerprint image, effectively increases fingerprint knowledge
Other precision and accuracy.
Since the resolving power of fingerprint image can be improved in the fingerprint mould group, be conducive to thin on resolve low contrast and fingerprint
Elementary errors is other, has preferable recognition capability to the identification of the dry finger of low temperature.
Meanwhile in the fingerprint mould group, also light reflection can be carried out by the reflecting surface of reflector element, realize light path folding,
Right angle setting mode of the sensor module under display screen is changed, reduces the thickness of fingerprint mould group, while also increasing object
Away from improving the identification region of fingerprint recognition.
Also, in the fingerprint mould group, reflector element, transmission units and sensor module are respectively positioned in shell, may make finger
Line mould group has the characteristic of waterproof and dustproof, light leakage, each component in effective protection fingerprint mould group.
Based on above-mentioned fingerprint mould group shown in FIG. 1, a kind of fingerprint mould group is can also be provided in the embodiment of the present application.Fig. 2A is this Shen
Please embodiment provide a kind of fingerprint mould group structural schematic diagram two.Fig. 2 B is a kind of fingerprint mould group provided by the embodiments of the present application
Structural schematic diagram three.The structure of fingerprint mould group shown in Fig. 2A and Fig. 2 B is substantially similar, and difference is only that, reflector element 2
Reflecting surface it is different from the filled media between transmission units 3.Fingerprint mould group as shown in Figure 2 A and 2 B, in above-mentioned Fig. 1 institute
On the basis of the fingerprint mould group shown, it may also include that bracket 6.
Bracket 6 is located at the end of transmission units 3；Bracket 6 is for being fixed the position of transmission units 3, so that transmission
The relative position of unit 3 and sensor module 4 is fixed.
Bracket 6 can usually be formed by metal stamping.Bracket 6 can be fixed by the position to transmission units 3, be realized
Transmission units 3 are fixedly connected with sensor module 4, so that the relative position of transmission units 3 and sensor module 4 is fixed.
Based on the fingerprint mould group, the defocus and eccentric precision of sensor module can be realized by controlling the precision of bracket 6
Control.
In a kind of achievable mode, with continued reference to above-mentioned Fig. 2A and Fig. 2 B it is found that bracket 6 can pass through bracket bonder 61
It is fixed together with sensor module 4, realizes the fixation of the relative position of transmission units 3 and sensor module 4.
The fixation that bracket 6 is carried out by bracket bonder 61, may make fingerprint mould group water proof and dust proof light leakage.
In the achievable mode of another kind, with continued reference to above-mentioned Fig. 2A and Fig. 2 B it is found that end and the bracket of transmission units 3
6 gap can be sealed by transmission units sealant 31.Transmission units sealant 31 for example can be by epoxy systems, acrylic acid body
The polymer such as system, polyurethane system are made.Certainly, transmission units sealant 31 can also be made of other polymer, above-mentioned
Merely illustrative, the application limits not to this.
The end of transmission units 3 and the gap of bracket 6 can be sealed by lens seals glue 31, realize transmission units 3
End is fixedly connected with bracket 6, and fingerprint mould group may make to have the characteristic of water proof and dust proof light leakage.
Another can in realization mode, with continued reference to above-mentioned Fig. 2A and Fig. 2 B it is found that reflector element 2 can to pass through reflection single
The fixed glue 21 of member is fixed on inside shell 1.The fixed glue 21 of reflector element for example can be by epoxy systems, acrylic system, poly- ammonia
The polymer such as ester system are made.The fixed glue 21 of reflector element can also be made of other polymer, above are only example, this Shen
Please limited not to this.
Reflector element 2 can be fixed on inside shell 1 by the fixed glue 21 of reflector element, and may make the reflection of reflector element 2
There are preset angles of reflection between the display plane of the display module 10 of face and display screen.
Another can be in realization mode, with continued reference to above-mentioned Fig. 2A and Fig. 2 B it is found that sensor module 4 includes: fingerprint
Sensor 41, chip 42 and printed circuit board (Printed Circuit Board, PCB) 43.
Fingerprint sensor 41 is located at the side that transmission units 3 deviate from reflector element 2, to receive through transmission units 3
Optical signal, and the optical signal is converted into electric signal.The integrated circuit that fingerprint sensor 41 can be constituted for photoelectric sensor, can
The finger optical signal that transmission units 3 are imaged, is converted to electric signal.Fingerprint sensor 4 can be for example complementary metal oxide half
Conductor (Complementary Metal Oxide Semiconductor, CMOS) sensor.Certainly, fingerprint sensor 41 is gone back
It can be other types of fingerprint sensor, cmos sensor is only a kind of possible example, and the application limits not to this.
Chip 42 is connect with fingerprint sensor 41；For example, fingerprint sensor 41 can be set on the surface of chip 42, or
Person, fingerprint sensor 41 can also be produced on the surface of chip 42.Its of PCB 43 and circuit and electronic equipment on chip 42
The connection of its processing circuit.Other processing circuits can be the processor of electronic equipment, such as central processing unit (Central
Processing Unit, CPU).
Circuit on chip 42 is for after being handled according to the electric signal that fingerprint sensor 41 exports, processing result to be led to
It crosses PCB 43 and is transmitted to other processing circuits.
In a kind of example, with continued reference to above-mentioned Fig. 2A and Fig. 2 B it is found that the circuit on chip 42 can be according to fingerprint sensing
The electric signal that device 41 exports carries out fingerprint recognition, and fingerprint recognition result is transmitted to other processing circuits by PCB 43.
In another example, with continued reference to above-mentioned Fig. 2A and Fig. 2 B it is found that the circuit on chip 42 can be passed according to fingerprint
The electric signal that sensor 41 exports is handled, and treated electric signal by PCB 43 is transmitted to other processing circuits, by
Other processing circuits carry out fingerprint recognition.
That is, the chip 42 is transmitted to the processing result of other processing circuits, it can be the processing of fingerprint recognition
As a result, or the processing result etc. of electric signal.
Another can be in realization mode, with continued reference to above-mentioned Fig. 2A and Fig. 2 B it is found that sensor module 4 further includes substrate
44.Chip 42 can be fixed on substrate 44.
Substrate 44 can increase the mechanical performance of chip 42, improve the reliability of chip 42.
Chip 42 can be for example fixed together by chip bonder 421 and substrate 44.Chip bonder 421 for example can be with
It is made of polymer such as epoxy systems, acrylic system, polyurethane systems.Certainly, chip bonder 421 can also be by others
Polymer is made, and above are only example, and the application limits not to this.
Another can be in realization mode, with continued reference to above-mentioned Fig. 2A and Fig. 2 B it is found that sensor module 4 further include: red
Outer edge filter (Infrared Radiation-Cut filter, IRCF) 45.IRCF 45 for example can be by blue crystal
Infrared (Infrared Radiation, IR) material coating is deposited in substrate to realize.
IRCF 45 is between transmission units 3 and fingerprint sensor 41, so that IRCF 45 filters out 3 emergent light of transmission units
After infrared light in line, by beam projecting to fingerprint sensor 41.
Since IRCF 45 can filter out infrared light, can prevent infrared dry in external sunlight or other environment light
It disturbs, especially when user is in Outdoor Scene.Using the fingerprint mould group, the standard of fingerprint recognition in Outdoor Scene can be effectively improved
Exactness and precision avoid fingerprint caused by strong light that from can not identifying.
Another can be in realization mode, with continued reference to above-mentioned Fig. 2A and Fig. 2 B it is found that IRCF 45 can pass through IRCF bonding
Glue 451 is fixed together with fingerprint sensor 41.
IRCF bonder 451 has the characteristic of high transparency, such as can be by epoxy systems, acrylic system, polyurethane
The polymer such as system are made.Certainly, IRCF bonder 451 can also be made of other polymer, above are only example, this Shen
Please limited not to this.
With continued reference to above-mentioned Fig. 2A and Fig. 2 B it is found that in the sensor module 4, it can refer in realization mode at another
Line sensor 41, chip 42 can be packaged as a whole by chip plastic packaging glue 422 and IRCF 45.
Fingerprint sensor 41, chip 42 are packaged as a whole by chip plastic packaging glue 422 and IRCF 45, may make fingerprint mould
Group has the characteristic of water proof and dust proof light leakage.
Chip 42 after the encapsulation can connect the fixation, it can be achieved that chip 42 and PCB 43 by soldering 423 with PCB 43
Connection.
In above-mentioned fingerprint mould group, PCB 43 can for flexible circuit board (Flexible Printed Circuit Board,
FPCB), or hard PCB.If PCB43 is FPCB, sensor module 4 further include: stiffening plate 46.
Stiffening plate 46 is bonded with PCB 43 away from the one side of chip 43.For example, stiffening plate 46 can deviate from chip with PCB 43
43 one side is combined by gluing.
Stiffening plate 46 can effectively enhance the mechanical strength and reliability of sensor module 4.The stiffening plate 46 is typically
The composition such as steel disc or hard pcb board, this will not be repeated here by the application.
Another can be in realization mode, with continued reference to above-mentioned Fig. 2A and Fig. 2 B it is found that in above-mentioned fingerprint mould group, shell 1
It may include first shell 11 and second shell 12.Towards the reflecting surface of reflector element 2 in first shell 11 and second shell 12
There is light well 5, which specifically can be towards display module 10, to receive across display module 10 on one shell
Incident ray.
First shell 11 and second shell 12 coat the shell for forming fingerprint mould group, to by each component in fingerprint mould group
It surrounds together, effectively improves the reliability of fingerprint mould group.
It should be noted that being only a kind of possible example of shell 1 in Fig. 2 and Fig. 2 B, which also may not include first
Shell 11 and second shell 12, and the shell including other numbers, alternatively, first shell 11 and second shell included by shell 1
12 can be other layouts different from Fig. 2 and Fig. 2 B.
Optionally, with continued reference to above-mentioned Fig. 2A and Fig. 2 B it is found that can have on shell 1 in fingerprint mould group as shown above
Through-hole 13.Through-hole 13 is for being fixed fingerprint mould group.
The through-hole 13 being arranged on shell 1 can be to fixed in the electronic device by fingerprint mould group.In the specific implementation, through-hole 13
It can be such as threaded hole, can be connect by bolt penetrated through via holes 13 and with the other devices in electronic equipment outside display module 10,
Realize the fixation of fingerprint mould group.It penetrates the through-hole 13 of shell 1 for example, the fingerprint mould group can use bolt and is mounted on electronic equipment
Center, and center is arranged in the lower section of display module 10, and has opening, the opening in 5 position of light well of fingerprint mould group
Incident ray can be made to enter the fingerprint mould group by light well 5；It can make display module in such a way that center assembles
There is gap between 10 and fingerprint mould group, display module 10 is made consequently facilitating being replaced without in the damage of fingerprint mould group
At influence.Alternatively, the fingerprint mould group can also by glue material be bonded or other be fixedly mounted to center, this Shen
It please be without limitation.
The fingerprint mould group can be realized the fixation of fingerprint mould group by the through-hole 13 being arranged on shell 1, reduce fingerprint mould group
With being associated with for display module 10, fingerprint mould group is improved for the adaptability of display module 10.
Another can be in realization mode, can between transmission units 3 and the reflecting surface of reflector element 2 referring to above-mentioned Fig. 2A
Filled with air dielectric 7.
Referring to above-mentioned Fig. 2 B, glass medium 8 can also be filled between transmission units 3 and the reflecting surface of reflector element 2.Glass
Medium 8 can be the ontology glass of reflector element 2.
Different filled medias can have different refractive index, it can be achieved that different imaging effect.In the application, it can lead to
The medium for being filled with different refractivity between transmission units 3 and the reflecting surface of reflector element 2 is crossed, optical path difference is adjusted, to have
Effect adjusts the imaging parameters of fingerprint image, such as the distortion and relative illumination parameter of fingerprint image.It illustratively, can be in the application
The material of high reflectance is filled between the reflecting surface and transmission units 3 of reflector element 2, to reduce pattern distortion and contrast
Degree.
Illustratively, Fig. 3 A is showing for the pattern distortion in fingerprint mould group provided by the embodiments of the present application filled with glass medium
It is intended to.Fig. 3 B is the schematic diagram of the pattern distortion in fingerprint mould group provided by the embodiments of the present application filled with air dielectric.
According to Fig. 3 A and Fig. 3 B it is found that under the visual field that identical visual field such as width and height are 4.95mm, in fingerprint
In mould group between the reflecting surface of reflector element 2 and light well 5 filled with glass medium may make image maximum distortion be-
0.5173%, and it is filled with air dielectric, it may make that the maximum distortion of image is -14.6574%.Fill the glass of high refractive index
Medium can effectively reduce the distortion of image.
Fig. 4 A is the signal of the image relative illumination in fingerprint mould group provided by the embodiments of the present application filled with glass medium
Figure.Fig. 4 B is the schematic diagram of the image relative illumination in fingerprint mould group provided by the embodiments of the present application filled with air dielectric.
According to Fig. 4 A and Fig. 4 B it is found that under identical visual field, the reflecting surface and entering light of reflector element 2 in fingerprint mould group
It may make that the relative illumination of image is 38% filled with glass medium between hole 5, and be filled with air dielectric, may make image
Relative illumination is 67%.The glass medium for filling high refractive index, also can effectively reduce the relative illumination of image, and fill low refraction
The air interception of rate can effectively increase the relative illumination of image.
It is illustrated as follows in conjunction with multiple examples with structure of two reflector elements to fingerprint mould group.It needs to illustrate
It is, in the fingerprint mould group that following embodiments provide, and in the fingerprint mould group that is provided in above-mentioned Fig. 1, Fig. 2A and Fig. 2 B, identical or phase
As component introduction can be found in it is above-mentioned, it is following to repeat no more.
Fig. 5 is a kind of structural schematic diagram four of fingerprint mould group provided by the embodiments of the present application.As shown in figure 5, fingerprint mould group
Can include: shell 1, the first reflector element 22, the second reflector element 23, transmission units 3 and sensor module 4.
First reflector element 22, the second reflector element 23, transmission units 3 and sensor module 4 are respectively positioned in shell 1.
There is light well 5 on shell 1, for example, the top plate of shell 1 may include adjacent first area and second area,
Light well 5 can be formed in the first area of 1 top plate of shell, and the second area of 1 top plate of shell still retains.First reflector element
22 and second reflector element 23 be arranged at enclosure interior, wherein 5 phase of light well with top plate is arranged in the first reflector element 22
Corresponding side, and the side covered by the second area of top plate is arranged in the second reflector element 23.Sensor module 4 can be with
The top of second reflector element 23 is set, for example is fixed on the second area of 1 top plate of shell.
The reflecting surface of first reflector element 22 towards light well 5 and the second reflector element 23 reflecting surface so that first is anti-
The reflecting surface for penetrating unit 22 receives the incident light of light well 5, and the incident light of light well 5 is reflexed to the second reflector element
23 reflecting surface.
In the present embodiment, the first reflector element 22 is similar with the reflector element 2 in embodiment shown in Fig. 2；Specifically
Ground, the reflecting surface of the first reflector element 22 can be the inclined-plane for having certain tilt angle relative to the opening direction of light well 5.
For example, the reflecting surface of the first reflector element 22 can enter with about 45 ° of tilt angle towards light well 5 to receive light well 5
The light penetrated.
The reflecting surface of second reflector element 23 is towards transmission units 3, so that the reflecting surface of the second reflector element 23 will pass through
The light of second reflector element 23 reflexes to transmission units 3.
The reflecting surface of second reflector element 23 can be opposite with the reflecting surface inclined direction of the first reflector element 22 oblique
Face, and it is towards the reflecting surface of the first reflector element 22, and has certain inclination angle with transmission units 3 and sensor module 4
Degree.For example, the reflecting surface of the second reflector element 23 may be substantially perpendicular to the reflecting surface of the first reflector element 22, and with about
45 ° of tilt angle is towards transmission units 3.
Sensor module 4 is located at the side that transmission units 3 deviate from the second reflector element 23, passes through transmission units for receiving
3 optical signal, and fingerprint recognition is carried out according to the optical signal.For example, the sensitive surface of transmission units 3 and sensor module 4 is basic
In parallel, and it is vertical with the opening direction of light well 5, i.e., it is parallel with the top plate of shell 1.
First reflector element 22 and the second reflector element 23 can with shown in Fig. 1, Fig. 2A and Fig. 2 B in above-described embodiment
Reflector element 2 in fingerprint mould group is same or like, and referring in particular to above-mentioned, details are not described herein.
Transmission units 3 can be with the transmission units 3 in fingerprint mould group shown in Fig. 1, Fig. 2A and Fig. 2 B in above-described embodiment
Same or like, referring in particular to above-mentioned, details are not described herein.
Fingerprint mould group shown in fig. 5 may be alternatively located at the lower section of display screen in electronic equipment.Wherein, which can be collection
At the touching display screen of touch-control and display function, for example by touch-control sensing unit part or it is fully integrated into inside display screen,
Or touch-control sensing unit is arranged in display screen surface.For the display function for realizing display screen, the luminescence unit of display screen can
As transmitting light source to emit light.The transmitting light source may be the display pixel of OLED display screen, the backlight of LCD display
Source or perhaps inside is additionally arranged below display screen excitation light source such as light emitting diode or infra-red laser diode
Etc. any light source.
The light that the transmitting light source issues, can penetrate the display module 10 and cover board 20 of display screen, touch and show in finger
Reflection and/or refraction occur when screen, through the light that reflects and/or reflect after successively penetrating cover board 20 and display module 10,
The reflecting surface of the first reflector element 22 is incident to by light well 5.
The reflecting surface of first reflector element 22 can there are preset between the display plane of the display module 10 of display screen
Angle of reflection, so that the reflecting surface of the first reflector element 22 can be towards the reflecting surface of the second reflector element 23.
The light that first reflector element 22 is reflected can be reflexed to transmission units 3 by the reflecting surface of the second reflector element 23,
The optical surface of transmission units 3 makes on light focusing to sensor module 4.Sensor module 4 can be according to the transmission received
The optical signal of unit 3 realizes fingerprint recognition.
Fingerprint mould group provided by the embodiments of the present application may include shell, the first reflector element, the second reflector element, transmission list
Member and sensor module, wherein first reflector element, second reflector element, the transmission units and the sensor module can
In the shell, there is light well on the shell, the reflecting surface of first reflector element is anti-simultaneously towards light well and second
The reflecting surface for penetrating unit, the light of light well incidence is reflexed to the second reflector element, by the anti-of the second reflector element
Penetrate face and light reflexed into the transmission units, the sensor module be located at the transmission units away from the one of second reflector element
Side, which can receive the optical signal by the transmission units, and carry out fingerprint recognition according to the optical signal.Refer at this
In line mould group, the reflection of light can be carried out by the reflecting surface of two reflector elements, realizes the folding of optical path, the light after the reflection
Line can be focused in sensor module by transmission units, can effectively reduce the size of imaging facula in sensor module, be improved
The resolving power of fingerprint image, effectively increases the precision and accuracy of fingerprint recognition.
Since the resolving power of fingerprint image can be improved in the fingerprint mould group, be conducive to thin on resolve low contrast and fingerprint
Elementary errors is other, has preferable recognition capability to the identification of the dry finger of low temperature.
Meanwhile in the fingerprint mould group, the reflection of light can be also carried out by the reflecting surface of two reflector elements, realizes optical path
It folds, changes right angle setting mode of the sensor module under display screen, reduce the thickness of fingerprint mould group, while also increasing
Object distance, improves the identification region of fingerprint recognition.
Also, in the fingerprint mould group, the first reflector element, the second reflector element, transmission units and the equal position of sensor module
Each component in the characteristic that in shell, may make fingerprint mould group that there is waterproof and dustproof, light leakage, effective protection fingerprint mould group.
Based on above-mentioned fingerprint mould group shown in fig. 5, a kind of fingerprint mould group is can also be provided in the embodiment of the present application.Fig. 6 A is this Shen
Please embodiment provide a kind of fingerprint mould group structural schematic diagram five.Fig. 6 B is a kind of fingerprint mould group provided by the embodiments of the present application
Structural schematic diagram six.The structure of fingerprint mould group shown in Fig. 6 A and Fig. 6 B is substantially similar, and difference is only that, the first reflection is single
The reflecting surface of member 22 is different from the filled media between transmission units 3.Fingerprint mould group as shown in Figure 6 A and 6 B, in above-mentioned figure
On the basis of fingerprint mould group shown in 6, it may also include that bracket 6.
Bracket 6 can be located at the end of transmission units 3；Bracket 6 is for being fixed the position of transmission units 3, so that thoroughly
The relative position for penetrating unit 3 and sensor module 4 is fixed.It should be noted that fingerprint shown in Fig. 6 A and Fig. 6 B
The material of bracket 6 in mould group is similar with the material of bracket 6 in fingerprint mould group shown in above-mentioned Fig. 2A and Fig. 2 B, specific to tie
The difference of details may be present in structure, and details are not described herein.
Bracket 6 can be fixed on shell 1, and the end of transmission units 3 is fixed on bracket 6, to realize 6 pairs of bracket transmissions
The fixation of the position of unit 3 then realizes being fixedly connected for transmission units 3 and sensor module 4, so that 3 He of transmission units
The relative position of sensor module 4 is fixed.
Based on the fingerprint mould group, the defocus and eccentric precision of sensor module can be realized by controlling the precision of bracket 6
Control.
In a kind of achievable mode, with continued reference to above-mentioned Fig. 6 A and Fig. 6 B, bracket 6 can be fixed by the bracket glue 62 and shell
Body 1 is fixed together, and realizes that the position of transmission units 3 is fixed.
It is fixed by the bracket the fixation that glue 62 carries out bracket 6 and bracket, may make each more reliable property of component in fingerprint mould group,
It also may make fingerprint mould group water proof and dust proof light leakage.
In the achievable mode of another kind, with continued reference to above-mentioned Fig. 6 A and Fig. 6 B, end and the bracket 6 of transmission units 3
Gap can be sealed by transmission units sealant 31.The description of transmission units sealant 31 can be found in above-mentioned, and details are not described herein.
The end of transmission units 3 and the gap of bracket 6 can be sealed by lens seals glue 31, realize transmission units 3
End is fixedly connected with bracket 6, and fingerprint mould group may make to have the characteristic of water proof and dust proof light leakage.
Can be in realization mode, referring to above-mentioned Fig. 6 A at another, the first reflector element 22 can be solid by the first fixed glue 221
It is scheduled on inside shell 1.Second reflector element 23 can be fixed on inside shell 1 by the second fixed glue 231.
First fixed glue 221 and the second fixed glue 231 can be with fixed 21 classes of glue of the reflector element described in above-described embodiment
Seemingly, referring in particular to above-mentioned, details are not described herein.
First reflector element 22 can be fixed on inside shell 1 by the first fixed glue 221, and may make the first reflector element 22
Reflecting surface and display screen display module 10 display plane between there are preset angle of reflection so that the first reflection is single
Member 22 reflecting surface can simultaneously the reflecting surface towards light well 5 and the second reflector element 23.
Can be in realization mode at another, with continued reference to above-mentioned Fig. 6 A and Fig. 6 B, sensor module 4 includes: fingerprint sensing
Device 41, chip 42 and PCB 43.
Fingerprint sensor 41 is located at the side that transmission units 3 deviate from the second reflector element 23, single by transmission to receive
The optical signal of member 3, and the optical signal is converted into electric signal.The description of fingerprint sensor 41 can be with class in above-described embodiment
Seemingly, referring specifically to above-mentioned, details are not described herein.
Chip 42 is connect with fingerprint sensor 41；For example, fingerprint sensor 41 can be set on the surface of chip 42, or
Person, fingerprint sensor 41 can also be produced on the surface of chip 42.Its of PCB 43 and circuit and electronic equipment on chip 42
The connection of its processing circuit.Other processing circuits can be the processor of electronic equipment, such as CPU.The description of chip 42 can be with
Similar in above-described embodiment, referring specifically to above-mentioned, details are not described herein.
Another can be in realization mode, with continued reference to above-mentioned Fig. 6 A and Fig. 6 B, sensor module 4 further include: IRCF
45.IRCF 45 can for example be realized by the way that IR material coating is deposited on blue crystal base bottom.
IRCF 45 is between transmission units 3 and fingerprint sensor 41, so that IRCF 45 filters out 3 emergent light of transmission units
After infrared light in line, by beam projecting to fingerprint sensor 41.
Since IRCF 45 can filter out infrared light, can prevent infrared dry in external sunlight or other environment light
It disturbs, especially when user is in Outdoor Scene.Using the fingerprint mould group, the standard of fingerprint recognition in Outdoor Scene can be effectively improved
Exactness and precision avoid fingerprint caused by strong light that from can not identifying.
It can pass through IRCF bonder with continued reference to above-mentioned Fig. 6 A and Fig. 6 B, IRCF 45 in realization mode at another
451 are fixed together with fingerprint sensor 41.The description of IRCF bonder 451 can be similar with above-described embodiment, specific to join
See above-mentioned, details are not described herein.
Can be in realization mode at another, with continued reference to above-mentioned Fig. 6 A and Fig. 6 B, chip 42 can pass through chip bonder 421
It is fixedly connected with PCB 43, it can be achieved that chip 42 and PCB's 43 is fixedly connected.
In above-mentioned fingerprint mould group, PCB 43 can be FPCB, or hard PCB.If PCB 43 is hard PCB,
Chip 42 can be directly fixedly connected with PCB 43 by chip bonder 421.If 43 FPCB of PCB, chip 42 can pass through core
Piece bonder 421 is fixedly connected with the stiffening plate of FPCB, and realization is fixedly connected with FPCB's.
If PCB 43 is hard PCB, a part that PCB 43 can be used as shell 1 is connect with the other parts of shell 1.
It can be fixedly connected by the fixed glue 14 of shell between PDB 43 and the other parts of shell 1, so that PCB43 and shell
1 other parts constitute complete shell 1.
The shell to form fingerprint mould group is coated by the rest part of PCB 43 and shell 1, to will be in fingerprint mould group
Each component is enclosed in the reliability for effectively improving fingerprint mould group together.
It should be noted that shell 1 shown in Fig. 6 A and Fig. 6 B, only a kind of possible example of shell 1, can be other
Different from the layout in Fig. 6 A and Fig. 6 B.
Optionally, with continued reference to above-mentioned Fig. 6 A and Fig. 6 B, in fingerprint mould group as shown above, there can be through-hole on shell 1
13.Through-hole 13 is for being fixed fingerprint mould group.
The through-hole 13 being arranged on shell 1 can be to fixed in the electronic device by fingerprint mould group.The description of through-hole 13 can be with
Similar in above-described embodiment, referring specifically to above-mentioned, details are not described herein.
The fingerprint mould group can be realized the fixation of fingerprint mould group by the through-hole 13 being arranged on shell 1, reduce fingerprint mould group
With being associated with for display module 10, fingerprint mould group is improved for the adaptability of display module 10.
Can be in realization mode, referring to above-mentioned Fig. 6 A at another, the reflecting surface of the first reflector element 21 and the second reflection are single
It can be filled with air dielectric 7 between the reflecting surface of member 23.
Referring to above-mentioned Fig. 6 B, can also be filled out between the reflecting surface of the first reflector element 22 and the reflecting surface of the second reflector element 23
Filled with glass medium 8.Glass medium 8 can be the ontology glass of the first reflector element 22.
Different filled medias can have different refractive index, it can be achieved that different imaging effect.In the application, it can lead to
The medium that different refractivity is filled between the reflecting surface of the first reflector element 22 and the reflecting surface of the second reflector element 23 is crossed,
Optical path difference is adjusted, to effectively adjust the imaging parameters of fingerprint image, such as the distortion and relative illumination parameter of fingerprint image.Show
Example, it can be between the reflecting surface of the first reflector element 22 and the reflecting surface of the second reflector element 23 filled with higher in the application
The material of reflectivity, to reduce pattern distortion and relative illumination.
It can also be filled with air dielectric 7 between the reflecting surface of first reflector element 22 and the reflecting surface of the second reflector element 23
Or to can be found in above-mentioned Fig. 3 A, Fig. 3 B, Fig. 4 A and Fig. 4 B corresponding for the corresponding pattern distortion of glass medium 8 and the description of relative illumination
Description, details are not described herein.
It should be noted that the above embodiments of the present application are also only some possible of fingerprint mould group provided herein
Example, fingerprint mould group provided herein can also include the reflector element of other numbers, correspondingly, the position of reflector element
Relationship does adaptation adjustment, as long as the light for being incident to transmission units 3 is the light after reflector element reflects, just belongs to this Shen
Please embodiment protection scope.
The electronic equipment with above-mentioned fingerprint mould group can also be provided in the embodiment of the present application.Fig. 7 provides for the embodiment of the present application
A kind of electronic equipment structural schematic diagram.As shown in fig. 7, the electronic equipment can include: shell 71, cover board 72, display module
73 and fingerprint mould group 74.Cover board 72, display module 73 and fingerprint mould group 74 are located in shell 71.
Cover board 71 is bonded with the one side of display module 72, the entering light of the another side of display module 72 towards fingerprint mould group 74
Face.Fingerprint mould group 74 can be fingerprint mould group shown in any in above-mentioned Fig. 1-Fig. 6.
The electronic equipment may include any of the above-described fingerprint mould group, since fingerprint mould group can pass through the anti-of reflector element
The reflection that face carries out light is penetrated, realizes the folding of optical path, the light after the reflection can focus to sensor die by transmission units
In group, the size of imaging facula in sensor module is reduced, improves the resolving power of fingerprint image, effectively increases fingerprint knowledge
Other precision and accuracy.
Finally, it should be noted that the above various embodiments is only to illustrate the technical solution of the application, rather than its limitations；To the greatest extent
Pipe is described in detail the application referring to foregoing embodiments, those skilled in the art should understand that: its according to
So be possible to modify the technical solutions described in the foregoing embodiments, or to some or all of the technical features into
Row equivalent replacement；And these are modified or replaceed, each embodiment technology of the application that it does not separate the essence of the corresponding technical solution
The range of scheme.
Claims (12)
1. a kind of fingerprint mould group characterized by comprising shell, reflector element, transmission units and sensor module；
The reflector element, the transmission units and the sensor module are located in the shell；
There is light well on the shell；The reflecting surface of the reflector element reflexes to the light of the light well incidence described
Transmission units；The sensor module is located at the side that the transmission units deviate from the reflector element；
The sensor module carries out fingerprint for receiving the optical signal by the transmission units, and according to the optical signal
Identification.
2. mould group according to claim 1, which is characterized in that the reflector element includes a reflector element；
The reflecting surface of the reflector element is towards the light well and the transmission units, the light well and the transmission units
Positioned at the different directions of the reflecting surface of the reflector element, so that the reflecting surface of the reflector element is by the light well incident
Light reflexes to the transmission units.
3. mould group according to claim 1, which is characterized in that the reflector element includes that the first reflector element and second are anti-
Penetrate unit；
The reflecting surface of first reflector element towards the light well and second reflector element reflecting surface so that described
The light of the light well incidence is reflexed to the reflecting surface of second reflector element by the reflecting surface of the first reflector element；
The reflecting surface of second reflector element is towards the transmission units, so that the reflecting surface of second reflector element will lead to
The light for crossing second reflector element reflexes to the transmission units；
The sensor module is located at the side away from second reflecting mirror of the transmission units.
4. mould group according to any one of claim 1-3, which is characterized in that the fingerprint mould group further include: bracket；Institute
State the end that bracket is located at the transmission units；The bracket is for being fixed the position of the transmission units, so that institute
The relative position for stating transmission units and the sensor module is fixed.
5. mould group according to any one of claim 1-3, which is characterized in that the sensor module includes: that fingerprint passes
Sensor, chip and printing board PCB；
The fingerprint sensor is located at the side that the transmission units deviate from the reflector element, to receive through the transmission
The optical signal of unit, and the optical signal is converted into electric signal；
The chip is connect with the fingerprint sensor；Other places of the PCB and circuit and electronic equipment on the chip
Manage circuit connection；
Circuit on the chip is for after being handled according to the electric signal that the fingerprint sensor exports, processing result to be led to
It crosses the PCB and is transmitted to other processing circuits.
6. mould group according to claim 5, which is characterized in that the PCB is flexible circuit board FPCB, the sensor die
Group further include: stiffening plate；
The stiffening plate is bonded with the PCB away from the one side of the chip.
7. mould group according to claim 5, which is characterized in that the PCB is hard PCB, and the PCB is as the shell
A part connect with the other parts of the shell.
8. mould group according to claim 5, which is characterized in that the sensor module further include: cutoff filter
IRCF；
The IRCF is between the transmission units and the fingerprint sensor, so that the IRCF filters out the transmission units
After infrared light in emergent ray, by beam projecting to the fingerprint sensor.
9. mould group according to any one of claim 1-3, which is characterized in that the transmission units and the reflector element
Reflecting surface between be filled with air dielectric or glass medium.
10. mould group according to any one of claim 1-3, which is characterized in that the shell includes first shell and
Two shells；Towards having institute on a shell of the reflecting surface of the reflector element in the first shell and the second shell
State light well；
The first shell and the second shell coat the shell to form the fingerprint mould group.
11. mould group according to any one of claim 1-3, which is characterized in that have through-hole on the shell；It is described logical
Hole is for being fixed the fingerprint mould group.
12. a kind of electronic equipment characterized by comprising shell, cover board, display module and fingerprint mould group；The cover board, institute
It states display module and the fingerprint mould group is located in the shell；
The cover board is bonded with the one side of the display module, the another side of the display module towards the fingerprint mould group into
Smooth surface；
The fingerprint mould group is any fingerprint mould group in the claims 1-11.
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/CN2018/094495 WO2020006706A1 (en) | 2018-07-04 | 2018-07-04 | Fingerprint module and electronic device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN109074488A true CN109074488A (en) | 2018-12-21 |
| CN109074488B CN109074488B (en) | 2022-07-08 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201880000958.7A Active CN109074488B (en) | 2018-07-04 | 2018-07-04 | Fingerprint module and electronic equipment |
| CN201822010913.8U Active CN210155676U (en) | 2018-07-04 | 2018-12-03 | Fingerprint identification device and terminal |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201822010913.8U Active CN210155676U (en) | 2018-07-04 | 2018-12-03 | Fingerprint identification device and terminal |
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| CN (2) | CN109074488B (en) |
| WO (2) | WO2020006706A1 (en) |
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| CN109711393A (en) * | 2019-02-19 | 2019-05-03 | 昆山丘钛微电子科技有限公司 | Fingerprint recognition mould group and electronic product |
| CN109886228A (en) * | 2019-02-27 | 2019-06-14 | 努比亚技术有限公司 | A kind of optical finger print tripper and mobile terminal |
| CN110062902A (en) * | 2019-03-04 | 2019-07-26 | 深圳市汇顶科技股份有限公司 | Modular structure and electronic equipment |
| CN110071994A (en) * | 2019-04-25 | 2019-07-30 | Oppo广东移动通信有限公司 | Electronic equipment |
| CN110796097A (en) * | 2019-10-30 | 2020-02-14 | Oppo广东移动通信有限公司 | Optical fingerprint module under screen, display screen assembly and electronic equipment |
| WO2021146965A1 (en) * | 2020-01-21 | 2021-07-29 | 深圳市汇顶科技股份有限公司 | Fingerprint detection device, backlight module, display screen, and electronic device |
| WO2021238553A1 (en) * | 2020-05-28 | 2021-12-02 | Oppo广东移动通信有限公司 | Under-screen recognition assembly and electronic device |
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| CN109643382A (en) * | 2018-07-04 | 2019-04-16 | 深圳市汇顶科技股份有限公司 | Fingerprint identification device and terminal |
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| WO2020006976A1 (en) | 2020-01-09 |
| WO2020006706A1 (en) | 2020-01-09 |
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