WO2020006706A1

WO2020006706A1 - Fingerprint module and electronic device

Info

Publication number: WO2020006706A1
Application number: PCT/CN2018/094495
Authority: WO
Inventors: 郭益平; 李林欣
Original assignee: 深圳市汇顶科技股份有限公司
Priority date: 2018-07-04
Filing date: 2018-07-04
Publication date: 2020-01-09
Also published as: CN109074488A; CN210155676U; WO2020006976A1; CN109074488B

Abstract

The present application provides a fingerprint module and an electronic device. The fingerprint module comprises a housing, a reflecting unit, a transmissive unit, and a sensor module; the reflecting unit, the transmissive unit, and the sensor module are located in the housing; the reflecting surface of the reflecting unit reflects to the transmissive unit light rays incident from a light entrance hole in the housing; and the sensor module receives an optical signal passing through the transmissive unit and performs fingerprint recognition according to the optical signal. The present application can improve the accuracy of fingerprint recognition.

Description

Fingerprint module and electronic equipment

Technical field

The embodiments of the present application relate to fingerprint identification technology, and more particularly, to a fingerprint module and an electronic device.

Background technique

With the development of fingerprint recognition technology, traditional physical capacitive fingerprint recognition has gradually been replaced, and screen fingerprint recognition has become a technological trend. At the same time, an increasing screen ratio can also improve the aesthetic appearance of electronic devices and the visual experience of users. .

In the screen optical fingerprint recognition scheme, the emitted light from the light source is emitted to the finger, and the peaks and troughs of the fingerprint on the finger due to the difference in absorption of the emitted light, form bright and dark stripes with different brightness on the fingerprint sensor, that is, the fingerprint image. At present, optical fingerprint recognition schemes based on collimated light have been developed to some extent.

However, the resolution of the fingerprint image obtained by the above-mentioned collimated light-based optical fingerprint recognition scheme is low, thereby affecting the accuracy and accuracy of fingerprint recognition.

Summary of the invention

The embodiments of the present application provide a fingerprint module and an electronic device to improve the accuracy and precision of fingerprint recognition.

An embodiment of the present application provides a fingerprint module including: a housing, a reflection unit, a transmission unit, and a sensor module;

The reflection unit, the transmission unit, and the sensor module are located in the housing;

The housing has a light entrance hole; the reflection surface of the reflection unit reflects the light incident from the light entrance hole to the transmission unit; and the sensor module is located at a portion of the transmission unit facing away from the reflection unit. side;

The sensor module is configured to receive a light signal passing through the transmission unit, and perform fingerprint recognition according to the light signal.

In an implementation manner, the reflection unit includes a reflection unit;

The reflection surface of the reflection unit faces the light entrance hole and the transmission unit, and the light entrance hole and the transmission unit are located in different directions of the reflection surface of the reflection unit so that the reflection surface of the reflection unit Reflecting the light incident from the light entrance hole to the transmission unit.

In another implementation manner, the reflection unit includes a first reflection unit and a second reflection unit;

The reflection surface of the first reflection unit faces the reflection surface of the light entrance hole and the second reflection unit, so that the reflection surface of the first reflection unit reflects the light incident from the light entrance hole to the light reflection hole. A reflecting surface of the second reflecting unit;

The reflection surface of the second reflection unit faces the transmission unit, so that the reflection surface of the second reflection unit reflects the light passing through the second reflection unit to the transmission unit;

The sensor module is located on a side of the transmission unit facing away from the second reflector.

In another implementation, the fingerprint module further includes: a bracket; the bracket is located at an end of the transmission unit; and the bracket is used for fixing the position of the transmission unit so that the transmission The relative position of the unit and the sensor module is fixed.

In yet another implementation, the sensor module includes: a fingerprint sensor, a chip, and a printed circuit board PCB;

The fingerprint sensor is located on a side of the transmission unit facing away from the reflection unit, and is configured to receive a light signal passing through the transmission unit and convert the light signal into an electrical signal;

The chip is connected to the fingerprint sensor; the PCB is connected to a circuit on the chip and other processing circuits of an electronic device;

The circuit on the chip is used for transmitting the processing result to the other processing circuits through the PCB after processing according to the electrical signal output by the fingerprint sensor.

In another implementation manner, the PCB is a flexible circuit board FPCB, and the sensor module further includes: a reinforcing plate;

The reinforcing plate is attached to a side of the PCB facing away from the chip.

In another implementation manner, the PCB is a rigid PCB, and the PCB is connected to other parts of the casing as a part of the casing.

In yet another implementation manner, the sensor module further includes: an IR cut filter IRCF;

The IRCF is located between the transmission unit and the fingerprint sensor, so that the IRCF filters out infrared light from the light emitted by the transmission unit, and then emits the light to the fingerprint sensor.

In another implementation manner, an air medium or a glass medium is filled between the transmission unit and the reflection surface of the reflection unit.

In yet another implementation manner, the casing includes a first casing and a second casing; one of the first casing and the second casing facing a reflective surface of the reflection unit Having the light entrance hole;

The first casing and the second casing cover to form a casing of the fingerprint module.

In another implementation manner, the casing has a through hole; the through hole is used for fixing the fingerprint module.

An embodiment of the present application may further provide an electronic device including a housing, a cover plate, a display module, and a fingerprint module; the cover plate, the display module, and the fingerprint module are located in the housing;

The cover is attached to one side of the display module, and the other side of the display module faces the light-incident surface of the fingerprint module; the fingerprint module is any of the fingerprint modules described above.

The fingerprint module and the electronic device provided in the embodiments of the present application, wherein the fingerprint module may include a housing, a reflection unit, a transmission unit, and a sensor module, and the reflection unit, the transmission unit, and the sensor module may be located in the Inside the housing, the housing has a light entrance hole, and the reflecting surface of the reflecting unit faces the light entrance hole and the transmission unit at the same time, for reflecting the light incident from the light entrance hole to the transmission unit, and the sensor module is located in the transmission On the side of the unit facing away from the reflection unit, the sensor module can receive a light signal passing through the transmission unit and perform fingerprint recognition based on the light signal. In this fingerprint module, light can be reflected through the reflecting surface of the reflection unit to achieve the folding of the light path. The reflected light can be focused on the sensor module through the transmission unit, reducing the imaging spot on the sensor module. The size improves the resolution of the fingerprint image and effectively improves the precision and accuracy of fingerprint recognition.

BRIEF DESCRIPTION OF THE DRAWINGS

In order to explain the technical solutions in the embodiments of the present application or the prior art more clearly, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings in the following description These are some embodiments of the present application. For those of ordinary skill in the art, other drawings can be obtained based on these drawings without paying creative labor.

FIG. 1 is a first schematic structural diagram of a fingerprint module according to an embodiment of the present application; FIG.

2A is a second schematic structural diagram of a fingerprint module according to an embodiment of the present application;

2B is a third structural schematic diagram of a fingerprint module according to an embodiment of the present application;

3A is a schematic diagram of image distortion of a fingerprint module filled with a glass medium according to an embodiment of the present application;

3B is a schematic diagram of image distortion of an air medium filled in a fingerprint module according to an embodiment of the present application;

4A is a schematic diagram of the contrast of an image filled with a glass medium in a fingerprint module provided in an embodiment of the present application;

4B is a schematic diagram of the contrast of an image filled with an air medium in a fingerprint module provided in an embodiment of the present application;

FIG. 5 is a fourth structural schematic diagram of a fingerprint module according to an embodiment of the present application; FIG.

FIG. 6A is a fifth structural schematic diagram of a fingerprint module according to an embodiment of the present application; FIG.

FIG. 6B is a sixth schematic structural diagram of a fingerprint module according to an embodiment of the present application; FIG.

FIG. 7 is a schematic structural diagram of an electronic device according to an embodiment of the present application.

detailed description

In order to make the objectives, technical solutions, and advantages of the embodiments of the present application clearer, the technical solutions in the embodiments of the present application will be clearly and completely described with reference to the accompanying drawings in the embodiments of the present application. Obviously, the described embodiments These are part of the embodiments of the present application, but not all the embodiments. Based on the embodiments in this application, all other embodiments obtained by a person of ordinary skill in the art without creative efforts shall fall within the protection scope of this application.

Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terms used herein in the specification of the present application are only for the purpose of describing specific embodiments, and are not intended to limit the present application. The term "and / or" as used herein includes any and all combinations of one or more of the associated listed items. The embodiments of the present application will be described in detail below with reference to the drawings. In the case of no conflict, the following embodiments and features in the embodiments can be combined with each other.

The fingerprint module provided in the following embodiments of the present application can be applied to any electronic device having an under-screen optical fingerprint recognition function, such as a smart phone, a notebook computer, a wearable device, and a home appliance device. The optical fingerprint under the screen can be partially implemented in the display area of the display screen, or it can be implemented in a full screen.

Because in the collimating optical fingerprint module, the fingerprint sensor uses the collimated light output by the collimation unit to image the fingerprint image, and the distance between adjacent rays of the collimated light is large, which makes the collimated light in the fingerprint sensor. The light spot on the image is usually large, which makes the resolution of the fingerprint image poor.

Based on this, the following embodiments of the present application can set a reflection unit in the fingerprint module to reflect light, realize light path folding, and focus the light onto the fingerprint sensor through the transmission unit, thereby reducing the imaging spot on the fingerprint sensor in the fingerprint module The size improves the resolution of the fingerprint image.

In the fingerprint module provided in the embodiment of the present application, the number of the reflection unit may be one or more. The following describes the fingerprint module with one reflection unit in combination with multiple examples.

FIG. 1 is a first schematic structural diagram of a fingerprint module according to an embodiment of the present application. As shown in FIG. 1, the fingerprint module may include: a housing 1, a reflection unit 2, a transmission unit 3, and a sensor module 4.

The reflection unit 2, the transmission unit 3 and the sensor module 4 are all located in the housing 1.

The housing 1 has a light entrance hole 5; for example, the light entrance hole 5 may be formed on the top plate of the housing 1. The reflection unit 2 is disposed on one side inside the casing 1, and the transmission unit 3 and the sensor module 4 are disposed on the other side inside the casing 1. The reflection surface of the reflection unit 2 reflects the light incident from the light entrance hole 5 to the transmission unit 3; the sensor module 4 is located on the side of the transmission unit 3 facing away from the reflection unit 2.

The sensor module 4 is configured to receive a light signal passing through the transmission unit 3 and perform fingerprint recognition according to the light signal.

Wherein, if the number of the reflection units 2 in the fingerprint module is one, the reflection surface of the reflection unit 2 may be an inclined surface having a certain inclination angle with respect to the opening direction of the light entrance hole 5, and the sensing of the sensor module 4 The surface may be substantially parallel to the transmission unit 3 and perpendicular to a plane where the opening of the light entrance hole 5 is located. Specifically, the reflection surface of the reflection unit 2 may face the light entrance hole 5 at an inclination angle of about 45 ° to receive the light incident from the light entrance hole 5; at the same time, the optical axis of the transmission unit 3 is perpendicular to the opening direction of the light entrance hole 3. Therefore, the reflecting surface of the reflecting unit 2 also faces the transmitting unit 3 at an inclination angle of about 45 ° at the same time, so as to reflect the light incident on the light entrance hole 5 to the transmitting unit 3.

The reflection surface of the reflection unit 2 may be a specular imaging element with a high reflectance, and usually reflection can be achieved through an aluminum film or a silver mirror. Of course, the reflection surface of the reflection unit 2 may also be implemented in other manners, and details are not described herein again. The reflection unit 2 may be, for example, a mirror. It should be noted that the reflecting unit 2 may also be other components capable of reflecting light, and is not limited to a reflecting mirror. The reflecting mirror is only one possible example. This embodiment of the present application does not limit this.

The transmission unit 3 may be an optical imaging element, and the transmission unit 3 may have a spherical or aspherical optical transmission structure for focusing incident light onto the sensor module 4. In this embodiment, the incident light may specifically be from The light-entry hole 5 enters the fingerprint module and reflects the light from the reflection surface of the reflection unit 2 to the transmission unit 3. The transmission unit 3 may be a lens or a structure composed of a plurality of lenses. The lens of the transmission unit 3 may be generally formed of a resin material or a glass material.

Based on the above structure, the light entrance hole 5 and the transmission unit 3 can be respectively located in different directions of the reflection surface of the reflection unit 2. The different directions of the reflection surface of the reflection unit 2 can be distinguished by the optical axis of the reflection unit 2, that is, the different directions can be different directions on both sides of the optical axis of the reflection unit 2.

The fingerprint module shown in FIG. 1 may be located below a display screen in an electronic device. The display screen may be a touch display screen with integrated touch and display functions. For example, a part or all of the touch sensing unit is integrated inside the display screen, or the touch sensing unit is disposed on the surface of the display screen. In order to realize the display function of the display screen, the light-emitting unit of the display screen can be used as an emission light source to emit light. The emission light source may be, for example, a display pixel of an Organic Light-Emitting Diode (OLED) display screen, a backlight of a Liquid Crystal Display (LCD) display backlight, or an additional set below or inside the display screen. Excitation light source, such as any light source such as light-emitting diode (Light-Emitting Diode, LED for short) or infrared laser diode (Laser diode, LD).

The light emitted by the emission light source can penetrate the display module 10 and the cover plate 20 of the display screen, and is reflected and / or refracted when the finger touches the display screen, and the reflected and / or refracted light penetrates the cover plate 20 in sequence. After entering the display module 10, the light is incident on the reflection surface of the reflection unit 2 through the light-entry hole 5.

A predetermined reflection angle may exist between the reflection surface of the reflection unit 2 and the display plane of the display module 10 of the display screen, so that the reflection surface of the reflection unit 2 faces the light entrance hole 5 and the transmission unit at a preset tilt angle at the same time. 3.

The reflection surface of the reflection unit 2 can reflect the light incident from the light entrance hole 5 to the transmission unit 3. The optical curved surface of the transmission unit 3 causes the light to be focused on the sensor module 4. The sensor module 4 can realize fingerprint recognition according to the received light signal of the transmission unit 3.

The fingerprint module provided in the embodiment of the present application may include a housing, a reflection unit, a transmission unit, and a sensor module, wherein the reflection unit, the transmission unit, and the sensor module may be located in the housing, and the housing has an inlet. Light hole, the reflecting surface of the reflection unit faces the light entrance hole and the transmission unit at the same time, and is used to reflect the light incident from the light entrance hole to the transmission unit. The sensor module is located on the side of the transmission unit facing away from the reflection unit. The sensor module can receive a light signal passing through the transmission unit, and perform fingerprint recognition according to the light signal. In this fingerprint module, light can be reflected through the reflecting surface of the reflection unit to achieve the folding of the light path. The reflected light can be focused on the sensor module through the transmission unit, reducing the imaging spot on the sensor module. The size improves the resolution of the fingerprint image and effectively improves the precision and accuracy of fingerprint recognition.

Since the fingerprint module can improve the resolution of the fingerprint image, it is beneficial to distinguish low contrast and nuances on the fingerprint, and has a better recognition ability for low-temperature dry finger recognition.

At the same time, the fingerprint module can also reflect light through the reflecting surface of the reflection unit to achieve the folding of the light path, changing the vertical installation of the sensor module under the display screen, reducing the thickness of the fingerprint module, and also increasing the thickness of the fingerprint module. The object distance is increased, and the recognition area of fingerprint recognition is improved.

In addition, in the fingerprint module, the reflection unit, the transmission unit and the sensor module are all located in the housing, which can make the fingerprint module have the characteristics of waterproof, dustproof and light leakage, and effectively protect each component in the fingerprint module.

Based on the fingerprint module shown in FIG. 1 described above, an embodiment of the present application may further provide a fingerprint module. FIG. 2A is a second schematic structural diagram of a fingerprint module according to an embodiment of the present application. FIG. 2B is a third structural schematic diagram of a fingerprint module according to an embodiment of the present application. The structures of the fingerprint modules shown in FIG. 2A and FIG. 2B are substantially similar, and the only difference is that the filling medium between the reflective surface of the reflection unit 2 and the transmission unit 3 is different. The fingerprint module shown in FIG. 2A and FIG. 2B may further include a bracket 6 on the basis of the above-mentioned fingerprint module shown in FIG. 1.

The bracket 6 is located at the end of the transmission unit 3; the bracket 6 is used to fix the position of the transmission unit 3 so as to fix the relative position of the transmission unit 3 and the sensor module 4.

The bracket 6 is usually stamped from metal. The bracket 6 can fix the position of the transmission unit 3 to achieve a fixed connection between the transmission unit 3 and the sensor module 4, so that the relative positions of the transmission unit 3 and the sensor module 4 are fixed.

Based on the fingerprint module, the defocus and eccentricity accuracy of the sensor module can be controlled by controlling the accuracy of the bracket 6.

In an implementable manner, by continuing to refer to FIG. 2A and FIG. 2B above, it can be known that the bracket 6 can be fixed to the sensor module 4 through the bracket bonding glue 61 to fix the relative positions of the transmission unit 3 and the sensor module 4. .

Fixing the bracket 6 by the bracket bonding glue 61 can make the fingerprint module waterproof, dustproof and light-proof.

In another implementable manner, it can be known from the above-mentioned FIGS. 2A and 2B that the gap between the end of the transmission unit 3 and the bracket 6 can be sealed by the transmission unit sealant 31. The transmission unit sealant 31 can be made of a polymer such as an epoxy system, an acrylic system, or a urethane system, for example. Of course, the translucent unit sealant 31 may also be made of other polymers. The above is merely an example, and this application does not limit this.

The lens sealant 31 can seal the gap between the end of the transmission unit 3 and the bracket 6 to achieve a fixed connection between the end of the transmission unit 3 and the bracket 6, so that the fingerprint module has the characteristics of waterproof, dustproof and light leakage.

In yet another implementation manner, it can be known that referring to FIG. 2A and FIG. 2B described above, the reflection unit 2 can be fixed inside the casing 1 by the reflection unit fixing glue 21. The reflection unit fixing adhesive 21 may be made of a polymer such as an epoxy system, an acrylic system, or a polyurethane system. The reflection unit fixing glue 21 may also be made of other polymers. The above is merely an example, and this application does not limit this.

The reflection unit fixing glue 21 can fix the reflection unit 2 inside the housing 1, and can cause a preset reflection angle between the reflection surface of the reflection unit 2 and the display plane of the display module 10 of the display screen.

In yet another implementable manner, it can be known from the above-mentioned FIG. 2A and FIG. 2B that the sensor module 4 includes a fingerprint sensor 41, a chip 42, and a printed circuit board (PCB) 43.

The fingerprint sensor 41 is located on the side of the transmission unit 3 facing away from the reflection unit 2 and is used to receive the optical signal passing through the transmission unit 3 and convert the optical signal into an electrical signal. The fingerprint sensor 41 may be an integrated circuit composed of a photoelectric sensor, and may convert a finger light signal imaged by the transmission unit 3 into an electrical signal. The fingerprint sensor 4 may be, for example, a complementary metal oxide semiconductor (Complementary Metal Oxide Semiconductor) sensor. Of course, the fingerprint sensor 41 may also be other types of fingerprint sensors, and the CMOS sensor is only one possible example, which is not limited in this application.

The chip 42 is connected to the fingerprint sensor 41; for example, the fingerprint sensor 41 may be disposed on the surface of the chip 42, or the fingerprint sensor 41 may be fabricated on the surface of the chip 42. The PCB 43 is connected to the circuit on the chip 42 and other processing circuits of the electronic device. The other processing circuit may be a processor of an electronic device, such as a central processing unit (Central Processing Unit).

The circuit on the chip 42 is used for processing according to the electric signal output by the fingerprint sensor 41, and then transmitting the processing result to the other processing circuit through the PCB 43.

In one example, it can be known from the above-mentioned FIG. 2A and FIG. 2B that the circuit on the chip 42 can perform fingerprint recognition according to the electrical signal output by the fingerprint sensor 41, and transmit the fingerprint recognition result to the other processing circuit through the PCB 43.

In another example, continuing to refer to FIG. 2A and FIG. 2B above, it can be known that the circuit on the chip 42 can be processed according to the electrical signal output by the fingerprint sensor 41, and the processed electrical signal is transmitted to the other processing circuit through the PCB 43. Fingerprint recognition is performed by this other processing circuit.

That is, the processing result transmitted from the chip 42 to the other processing circuits may be a processing result of fingerprint recognition, or a processing result of an electrical signal.

In yet another implementation manner, it can be seen from the above-mentioned FIG. 2A and FIG. 2B that the sensor module 4 further includes a substrate 44. The chip 42 may be fixed on the substrate 44.

The substrate 44 can increase the mechanical performance of the chip 42 and improve the reliability of the chip 42.

The chip 42 may be fixed to the substrate 44 by, for example, a chip bonding adhesive 421. The chip bonding glue 421 can be made of, for example, an epoxy system, an acrylic system, or a polyurethane system. Of course, the chip bonding glue 421 may also be made of other polymers. The above is merely an example, and this application does not limit this.

In still another implementation manner, it can be known that the sensor module 4 further includes an infrared cut-off filter (IRCF) 45 by referring to FIG. 2A and FIG. 2B. IRCF45 can be achieved, for example, by depositing a coating of infrared (IR) material on a sapphire substrate.

IRCF 45 is located between the transmission unit 3 and the fingerprint sensor 41, so that IRCF 45 filters out the infrared light from the light emitted by the transmission unit 3, and then emits the light to the fingerprint sensor 41.

Because IRCF45 can filter out infrared light, it can prevent infrared interference from external sunlight or other ambient light, especially when the user is in an outdoor scene. Using the fingerprint module can effectively improve the accuracy and precision of fingerprint recognition in outdoor scenes, and prevent fingerprints from being unrecognizable due to strong light.

In yet another implementation manner, it can be known from the above-mentioned FIG. 2A and FIG. 2B that the IRCF 45 can be fixed to the fingerprint sensor 41 through the IRCF bonding glue 451.

IRCF bonding glue 451 has high light transmittance characteristics, for example, it can be made of polymers such as epoxy system, acrylic system, and polyurethane system. Of course, IRCF bonding glue 451 can also be made of other polymers. The above is only an example, and this application does not limit this.

In yet another implementation manner, it can be known from the above-mentioned FIG. 2A and FIG. 2B that in the sensor module 4, the fingerprint sensor 41 and the chip 42 can be packaged into an IRCF 45 by a chip molding compound 422.

The fingerprint sensor 41 and the chip 42 are packaged with the IRCF 45 through the chip plastic sealant 422, which can make the fingerprint module waterproof, dust-proof and light-proof.

The packaged chip 42 can be connected to the PCB 43 by soldering 423, so that the chip 42 and the PCB 43 can be fixedly connected.

In the above fingerprint module, the PCB 43 may be a flexible printed circuit board (FPCB) or a rigid PCB. If the PCB 43 is an FPCB, the sensor module 4 further includes a reinforcing plate 46.

The reinforcing plate 46 and the PCB 43 face away from the chip 43. For example, the reinforcing plate 46 may be glued together with the side of the PCB 43 facing away from the chip 43.

The reinforcing plate 46 can effectively enhance the mechanical strength and reliability of the sensor module 4. The reinforcing plate 46 may generally be composed of a steel sheet or a rigid PCB board, which is not described in this application.

In yet another implementation manner, it can be known from the above-mentioned FIG. 2A and FIG. 2B that in the fingerprint module, the casing 1 may include a first casing 11 and a second casing 12. One of the first casing 11 and the second casing 12 facing the reflective surface of the reflection unit 2 has a light-entry hole 5, and the light-entry hole 5 may specifically face the display module 10 to receive the display module 10 incident rays.

The first casing 11 and the second casing 12 form a cover of the fingerprint module, which is used to enclose the components in the fingerprint module together to effectively improve the reliability of the fingerprint module.

It should be noted that FIG. 2 and FIG. 2B are only one possible example of the casing 1. The casing 1 may not include the first casing 11 and the second casing 12, but includes other casings. Alternatively, the first casing 11 and the second casing 12 included in the casing 1 may have other layouts than those in FIGS. 2 and 2B.

Optionally, by continuing to refer to FIG. 2A and FIG. 2B, it can be known that, in the fingerprint module shown above, the housing 1 may have a through hole 13. The through hole 13 is used for fixing the fingerprint module.

The through hole 13 provided on the casing 1 can fix the fingerprint module in the electronic device. In a specific implementation, the through hole 13 may be a threaded hole, for example, and the bolt 13 may be penetrated through the through hole 13 and connected to other devices outside the display module 10 in the electronic device to fix the fingerprint module. For example, the fingerprint module can be installed in the middle frame of the electronic device by using the through hole 13 of the casing 1 through the bolt, and the middle frame is disposed below the display module 10 and has a position at the light entrance hole 5 of the fingerprint module. An opening, which allows incident light to enter the fingerprint module through the light entrance hole 5; a gap between the display module 10 and the fingerprint module can be provided by the middle frame assembly method, thereby facilitating replacement when the fingerprint module is damaged Without affecting the display module 10. Alternatively, the fingerprint module may also be mounted to the middle frame by adhesive bonding or other fixing methods, which is not limited in this application.

The fingerprint module can fix the fingerprint module through the through hole 13 provided on the housing 1, which weakens the association between the fingerprint module and the display module 10 and improves the adaptability of the fingerprint module to the display module 10.

In still another implementation manner, referring to FIG. 2A described above, an air medium 7 may be filled between the reflection unit 3 and the reflection surface of the reflection unit 2.

Referring to FIG. 2B described above, a glass medium 8 may be further filled between the reflection unit 3 and the reflection surface of the reflection unit 2. The glass medium 8 may be the body glass of the reflection unit 2.

Different filling media can have different refractive indices and can achieve different imaging effects. In this application, a medium with a different refractive index can be filled between the reflective surface of the transmission unit 3 and the reflection unit 2 to adjust the optical path difference, thereby effectively adjusting the imaging parameters of the fingerprint image, such as the distortion and relative contrast of the fingerprint image. parameter. By way of example, in the present application, a material with a higher reflectivity may be filled between the reflection surface of the reflection unit 2 and the transmission unit 3 to reduce image distortion and relative contrast.

For example, FIG. 3A is a schematic diagram of image distortion in a fingerprint module filled with a glass medium provided in an embodiment of the present application. FIG. 3B is a schematic diagram of image distortion of a fingerprint module filled with an air medium according to an embodiment of the present application.

According to FIG. 3A and FIG. 3B, under the same field of view, such as a field of view having a width and a height of 4.95 mm, filling the glass medium between the reflection surface of the reflection unit 2 and the light entrance hole 5 in the fingerprint module can make the The maximum distortion of the image is -0.5173%, and the maximum distortion of the image can be -14.6574% when filled with air medium. Filled with a high refractive index glass medium can effectively reduce image distortion.

FIG. 4A is a schematic diagram of the contrast of an image filled with a glass medium in a fingerprint module provided in an embodiment of the present application. FIG. 4B is a schematic diagram of the contrast of an image filled with an air medium in a fingerprint module provided in an embodiment of the present application.

According to FIG. 4A and FIG. 4B, under the same field of view, the glass module is filled between the reflective surface of the reflection unit 2 and the light entrance hole 5 in the fingerprint module, so that the contrast of the image is 38%, and it is filled with The air medium can make the contrast of the image 67%. Filling a high-refractive-index glass medium can also effectively reduce the contrast of an image, while filling a low-refractive air cut-off can effectively increase the contrast of an image.

The following describes the structure of the fingerprint module with two reflection units in combination with multiple examples. It should be noted that, in the fingerprint module provided in the following embodiments, the introduction of the same or similar components as those in the fingerprint module provided in FIG. 1, FIG. 2A and FIG. 2B can be referred to above, and the details will not be described below. .

FIG. 5 is a fourth structural schematic diagram of a fingerprint module according to an embodiment of the present application. As shown in FIG. 5, the fingerprint module may include: a housing 1, a first reflection unit 22, a second reflection unit 23, a transmission unit 3, and a sensor module 4.

The first reflection unit 22, the second reflection unit 23, the transmission unit 3, and the sensor module 4 are all located in the housing 1.

The housing 1 has a light entrance hole 5, for example, the top plate of the housing 1 may include adjacent first and second areas, the light entrance hole 5 may be formed in the first area of the top plate of the housing 1, and the housing 1 The second area of the roof remains. The first reflection unit 22 and the second reflection unit 23 are both disposed inside the housing, wherein the first reflection unit 22 is disposed on a side corresponding to the light entrance hole 5 of the top plate, and the second reflection unit 23 is disposed on the top plate. The second area covers the side. The sensor module 4 may be disposed above the second reflection unit 23, for example, fixed to the second region of the top plate of the casing 1.

The reflection surface of the first reflection unit 22 faces the reflection surfaces of the light entrance hole 5 and the second reflection unit 23, so that the reflection surface of the first reflection unit 22 receives the light incident from the light entrance hole 5, and the light incident from the light entrance hole 5 The light is reflected to the reflection surface of the second reflection unit 23.

In this embodiment, the first reflection unit 22 is similar to the reflection unit 2 in the embodiment shown in FIG. 2. Specifically, the reflection surface of the first reflection unit 22 may have a direction relative to the opening direction of the light entrance hole 5. A bevel with a certain inclination. For example, the reflection surface of the first reflection unit 22 may be oriented toward the light entrance hole 5 at an inclination angle of about 45 ° to receive light incident from the light entrance hole 5.

The reflection surface of the second reflection unit 23 faces the transmission unit 3 so that the reflection surface of the second reflection unit 23 reflects the light passing through the second reflection unit 23 to the transmission unit 3.

The reflection surface of the second reflection unit 23 may be an inclined surface opposite to the inclination direction of the reflection surface of the first reflection unit 22, and it faces the reflection surface of the first reflection unit 22, and has a certain degree with the transmission unit 3 and the sensor module 4. slope. For example, the reflection surface of the second reflection unit 23 may be substantially perpendicular to the reflection surface of the first reflection unit 22 and may face the transmission unit 3 at an inclination angle of about 45 °.

The sensor module 4 is located on a side of the transmission unit 3 facing away from the second reflection unit 23, and is configured to receive a light signal passing through the transmission unit 3 and perform fingerprint recognition according to the light signal. For example, the sensing surfaces of the transmission unit 3 and the sensor module 4 are substantially parallel and perpendicular to the opening direction of the light entrance hole 5, that is, parallel to the top plate of the housing 1.

The first reflection unit 22 and the second reflection unit 23 may be the same as or similar to the reflection unit 2 in the fingerprint module shown in FIG. 1, FIG. 2A, and FIG. 2B in the foregoing embodiment. For details, refer to the foregoing, and details are not described herein again.

The transmission unit 3 may be the same as or similar to the transmission unit 3 in the fingerprint module shown in FIG. 1, FIG. 2A and FIG. 2B in the above embodiment.

The fingerprint module shown in FIG. 5 may also be located below the display screen in the electronic device. The display screen may be a touch display screen with integrated touch and display functions. For example, a part or all of the touch sensing unit is integrated inside the display screen, or the touch sensing unit is disposed on the surface of the display screen. In order to realize the display function of the display screen, the light-emitting unit of the display screen can be used as an emission light source to emit light. The emission light source may also be a display pixel of the OLED display, a backlight of the LCD display, or an excitation light source additionally provided below or inside the display, such as any light source such as a light emitting diode or an infrared laser diode.

The light emitted by the emission light source can penetrate the display module 10 and the cover plate 20 of the display screen, and is reflected and / or refracted when a finger touches the display screen. The reflected and / or refracted light penetrates the cover plate 20 in sequence After entering the display module 10, the light is incident on the reflection surface of the first reflection unit 22 through the light entrance hole 5.

A predetermined reflection angle may exist between the reflection surface of the first reflection unit 22 and the display plane of the display module 10 of the display screen, so that the reflection surface of the first reflection unit 22 may face the reflection surface of the second reflection unit 23.

The reflection surface of the second reflection unit 23 can reflect the light reflected by the first reflection unit 22 to the transmission unit 3. The optical curved surface of the transmission unit 3 enables the light to be focused on the sensor module 4. The sensor module 4 can realize fingerprint recognition according to the received light signal of the transmission unit 3.

The fingerprint module provided in the embodiment of the present application may include a housing, a first reflection unit, a second reflection unit, a transmission unit, and a sensor module, wherein the first reflection unit, the second reflection unit, the transmission unit, and the sensor module The sensor module may be located in the housing. The housing has a light entrance hole. The reflection surface of the first reflection unit faces the light entrance hole and the reflection surface of the second reflection unit at the same time. Reflected to the second reflection unit, the light is reflected to the transmission unit by the reflection surface of the second reflection unit, the sensor module is located on the side of the transmission unit facing away from the second reflection unit, and the sensor module can receive and pass through the The optical signal of the transmission unit is transmitted, and fingerprint recognition is performed based on the optical signal. In this fingerprint module, light can be reflected through the reflective surfaces of the two reflecting units to fold the light path. The reflected light can be focused on the sensor module through the transmitting unit, which can effectively reduce the sensor module. The size of the imaging light spot improves the resolution of the fingerprint image and effectively improves the accuracy and accuracy of fingerprint recognition.

At the same time, in the fingerprint module, light can be reflected through the reflecting surfaces of the two reflecting units to fold the light path. The vertical installation of the sensor module under the display screen has been changed to reduce the thickness of the fingerprint module. At the same time, the object distance is also increased, and the recognition area of fingerprint recognition is improved.

In addition, in the fingerprint module, the first reflection unit, the second reflection unit, the transmission unit and the sensor module are located in the housing, which can make the fingerprint module have the characteristics of waterproof, dustproof and light leakage, and effectively protect the fingerprint module. Within the components.

Based on the fingerprint module shown in FIG. 5 described above, an embodiment of the present application may further provide a fingerprint module. FIG. 6A is a fifth structural schematic diagram of a fingerprint module according to an embodiment of the present application. FIG. 6B is a sixth schematic diagram of the structure of a fingerprint module according to an embodiment of the present application. The structures of the fingerprint modules shown in FIG. 6A and FIG. 6B are substantially similar, and the difference is only that the filling medium between the reflection surface of the first reflection unit 22 and the transmission unit 3 is different. The fingerprint module shown in FIG. 6A and FIG. 6B, in addition to the fingerprint module shown in FIG. 6, may further include a bracket 6.

The bracket 6 may be located at the end of the transmission unit 3; the bracket 6 is used to fix the position of the transmission unit 3 so as to fix the relative position of the transmission unit 3 and the sensor module 4. It should be noted that the material of the bracket 6 in the fingerprint module shown in FIG. 6A and FIG. 6B is similar to that of the bracket 6 in the fingerprint module shown in FIG. 2A and FIG. 2B described above, and its specific structure may exist The differences in details are not repeated here.

The bracket 6 can be fixed on the housing 1, and the end of the transmission unit 3 is fixed on the bracket 6, so that the position of the transmission unit 3 is fixed by the bracket 6, and the fixed connection between the transmission unit 3 and the sensor module 4 is achieved. The relative position of the transmission unit 3 and the sensor module 4 is fixed.

In an implementable manner, referring to FIG. 6A and FIG. 6B described above, the bracket 6 may be fixed to the housing 1 through the bracket fixing glue 62 to achieve the fixed position of the transmission unit 3.

Fixing the bracket 6 and the bracket by the bracket fixing glue 62 can make the components in the fingerprint module more reliable, and also make the fingerprint module waterproof, dustproof and light-proof.

In another implementable manner, referring to FIG. 6A and FIG. 6B described above, the gap between the end of the transmission unit 3 and the bracket 6 may be sealed by the transmission unit sealant 31. For the description of the translucent unit sealant 31, refer to the above description, which will not be repeated here.

In another implementable manner, referring to FIG. 6A described above, the first reflection unit 22 may be fixed inside the casing 1 through the first fixing glue 221. The second reflection unit 23 can be fixed inside the casing 1 by a second fixing glue 231.

The first fixing glue 221 and the second fixing glue 231 may be similar to the reflection unit fixing glue 21 described in the above embodiment. For details, refer to the foregoing, and details are not described herein again.

The first fixing glue 221 can fix the first reflection unit 22 inside the housing 1, and can cause a preset reflection angle between the reflection surface of the first reflection unit 22 and the display plane of the display module 10 of the display screen. Therefore, the reflection surface of the first reflection unit 22 can face the reflection surface of the light entrance hole 5 and the second reflection unit 23 at the same time.

In still another implementation manner, referring to FIG. 6A and FIG. 6B described above, the sensor module 4 includes a fingerprint sensor 41, a chip 42, and a PCB 43.

The fingerprint sensor 41 is located on the side of the transmission unit 3 facing away from the second reflection unit 23, and is used for receiving the optical signal passing through the transmission unit 3 and converting the optical signal into an electrical signal. The description of the fingerprint sensor 41 may be similar to that in the foregoing embodiment. For details, refer to the foregoing, and details are not described herein again.

The chip 42 is connected to the fingerprint sensor 41; for example, the fingerprint sensor 41 may be disposed on the surface of the chip 42, or the fingerprint sensor 41 may be fabricated on the surface of the chip 42. The PCB 43 is connected to the circuit on the chip 42 and other processing circuits of the electronic device. The other processing circuit may be a processor of an electronic device, such as a CPU. The description of the chip 42 may be similar to that in the foregoing embodiment. For details, refer to the foregoing, and details are not described herein again.

In yet another implementable manner, referring to FIG. 6A and FIG. 6B described above, the sensor module 4 further includes: IRCF 45. IRCF 45 can be achieved, for example, by depositing a coating of IR material on a sapphire substrate.

In yet another implementation manner, with continued reference to FIG. 6A and FIG. 6B, the IRCF 45 may be fixed to the fingerprint sensor 41 through the IRCF bonding glue 451. The description of the IRCF bonding glue 451 may be similar to that in the above embodiments, and specific reference is made to the above, which will not be repeated here.

In yet another implementable manner, referring to FIG. 6A and FIG. 6B described above, the chip 42 may be fixedly connected to the PCB 43 through the chip bonding glue 421, and the chip 42 and the PCB 43 may be fixedly connected.

In the above fingerprint module, the PCB 43 may be an FPCB or a rigid PCB. If the PCB 43 is a rigid PCB, the chip 42 can be directly fixedly connected to the PCB 43 through the chip bonding glue 421. If the PCB is a 43-bit FPCB, the chip 42 can be fixedly connected to the FPCB's reinforcing plate through the chip bonding glue 421 to achieve a fixed connection to the FPCB.

If the PCB 43 is a rigid PCB, the PCB 43 can be connected to other parts of the casing 1 as a part of the casing 1.

The PDB 43 and the other parts of the housing 1 can be fixedly connected by the housing fixing glue 14 so that the PCB 43 and the other parts of the housing 1 form a complete housing 1.

The shell of the fingerprint module is formed by covering the PCB 43 and the rest of the housing 1 to surround the components in the fingerprint module together, effectively improving the reliability of the fingerprint module.

It should be noted that the casing 1 shown in FIGS. 6A and 6B is only one possible example of the casing 1, and may be other layouts different from those in FIGS. 6A and 6B.

Optionally, referring to FIG. 6A and FIG. 6B described above, in the fingerprint module shown above, the housing 1 may have a through hole 13. The through hole 13 is used for fixing the fingerprint module.

The through hole 13 provided on the casing 1 can fix the fingerprint module in the electronic device. The description of the through hole 13 may be similar to that in the foregoing embodiment. For details, refer to the foregoing, and details are not described herein again.

In still another implementation manner, referring to FIG. 6A described above, an air medium 7 may be filled between the reflection surface of the first reflection unit 21 and the reflection surface of the second reflection unit 23.

Referring to FIG. 6B described above, a glass medium 8 may be further filled between the reflection surface of the first reflection unit 22 and the reflection surface of the second reflection unit 23. The glass medium 8 may be a body glass of the first reflection unit 22.

Different filling media can have different refractive indices and can achieve different imaging effects. In this application, a medium with a different refractive index may be filled between the reflecting surface of the first reflecting unit 22 and the reflecting surface of the second reflecting unit 23 to adjust the optical path difference, thereby effectively adjusting the imaging parameters of the fingerprint image, such as a fingerprint. Image distortion and contrast. For example, in the present application, a material with a higher reflectivity may be filled between the reflection surface of the first reflection unit 22 and the reflection surface of the second reflection unit 23 to reduce image distortion and relative contrast.

For the description of the image distortion and relative contrast corresponding to the air medium 7 or the glass medium 8 between the reflection surface of the first reflection unit 22 and the reflection surface of the second reflection unit 23, please refer to FIG. 3A, FIG. 3B, FIG. 4A The description corresponding to FIG. 4B is not repeated here.

It should be noted that the above-mentioned embodiments of the present application are also only some possible examples of the fingerprint module provided by the present application, and the fingerprint module provided by the present application may further include other numbers of reflection units, and accordingly, the reflection units The positional relationship of the light source is adjusted adaptively, as long as the light incident on the transmission unit 3 is the light reflected by the reflection unit, it belongs to the protection scope of the embodiment of the present application.

An embodiment of the present application may further provide an electronic device having the fingerprint module. FIG. 7 is a schematic structural diagram of an electronic device according to an embodiment of the present application. As shown in FIG. 7, the electronic device may include a housing 71, a cover 72, a display module 73 and a fingerprint module 74. The cover plate 72, the display module 73 and the fingerprint module 74 are located in the casing 71.

The cover 71 is attached to one side of the display module 72, and the other side of the display module 72 faces the light incident surface of the fingerprint module 74. The fingerprint module 74 may be the fingerprint module shown in any one of the above FIG. 1 to FIG. 6.

The electronic device may include any one of the above-mentioned fingerprint modules. Since the fingerprint module can reflect light through the reflecting surface of the reflection unit to realize the folding of the light path, the reflected light can be focused to the sensor module through the transmission unit. In addition, the size of the imaging spot on the sensor module is reduced, the resolution of the fingerprint image is improved, and the accuracy and accuracy of fingerprint recognition is effectively improved.

Finally, it should be noted that the above embodiments are only used to describe the technical solution of the present application, rather than limiting it. Although the present application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that It is still possible to modify the technical solutions described in the foregoing embodiments, or to replace some or all of the technical features equivalently; and these modifications or replacements do not depart from the essence of the corresponding technical solutions range.

Claims

A fingerprint module, comprising: a housing, a reflection unit, a transmission unit, and a sensor module;

The reflection unit, the transmission unit, and the sensor module are located in the housing;

The housing has a light entrance hole; the reflection surface of the reflection unit reflects the light incident from the light entrance hole to the transmission unit; and the sensor module is located at a portion of the transmission unit facing away from the reflection unit. side;

The sensor module is configured to receive a light signal passing through the transmission unit, and perform fingerprint recognition according to the light signal.
The module according to claim 1, wherein the reflection unit comprises a reflection unit;

The reflection surface of the reflection unit faces the light entrance hole and the transmission unit, and the light entrance hole and the transmission unit are located in different directions of the reflection surface of the reflection unit so that the reflection surface of the reflection unit Reflecting the light incident from the light entrance hole to the transmission unit.
The module according to claim 1, wherein the reflection unit comprises a first reflection unit and a second reflection unit;

The reflection surface of the first reflection unit faces the reflection surface of the light entrance hole and the second reflection unit, so that the reflection surface of the first reflection unit reflects the light incident from the light entrance hole to the light reflection hole. A reflecting surface of the second reflecting unit;

The reflection surface of the second reflection unit faces the transmission unit, so that the reflection surface of the second reflection unit reflects the light passing through the second reflection unit to the transmission unit;

The sensor module is located on a side of the transmission unit facing away from the second reflector.
The module according to any one of claims 1-3, wherein the fingerprint module further comprises: a bracket; the bracket is located at an end of the transmission unit; and the bracket is used for the The position of the transmission unit is fixed, so that the relative position of the transmission unit and the sensor module is fixed.
The module according to any one of claims 1-3, wherein the sensor module comprises: a fingerprint sensor, a chip, and a printed circuit board (PCB);

The fingerprint sensor is located on a side of the transmission unit facing away from the reflection unit, and is configured to receive a light signal passing through the transmission unit and convert the light signal into an electrical signal;

The chip is connected to the fingerprint sensor; the PCB is connected to a circuit on the chip and other processing circuits of an electronic device;

The circuit on the chip is used for transmitting the processing result to the other processing circuits through the PCB after processing according to the electrical signal output by the fingerprint sensor.
The module according to claim 5, wherein the PCB is a flexible circuit board FPCB, and the sensor module further comprises: a reinforcing plate;

The reinforcing plate is attached to a side of the PCB facing away from the chip.
The module according to claim 5, wherein the PCB is a rigid PCB, and the PCB is connected to other parts of the case as a part of the case.
The module according to claim 5, wherein the sensor module further comprises: an IR cut filter IRCF;

The IRCF is located between the transmission unit and the fingerprint sensor, so that the IRCF filters out infrared light from the light emitted by the transmission unit, and then emits the light to the fingerprint sensor.
The module according to any one of claims 1-3, wherein an air medium or a glass medium is filled between the transmission unit and the reflection surface of the reflection unit.
The module according to any one of claims 1-3, wherein the housing comprises a first housing and a second housing; the first housing and the second housing are oriented toward each other; A housing of a reflecting surface of the reflecting unit has the light entrance hole;

The first casing and the second casing cover to form a casing of the fingerprint module.
The module according to any one of claims 1-3, wherein the housing has a through hole; the through hole is used for fixing the fingerprint module.
An electronic device, comprising: a housing, a cover plate, a display module and a fingerprint module; the cover plate, the display module and the fingerprint module are located in the housing;

The cover is attached to one side of the display module, and the other side of the display module faces the light incident surface of the fingerprint module;

The fingerprint module is the fingerprint module according to any one of claims 1-11.