CN210142338U - Optical fingerprint identification module and electronic equipment - Google Patents
Optical fingerprint identification module and electronic equipment Download PDFInfo
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- CN210142338U CN210142338U CN201921388816.0U CN201921388816U CN210142338U CN 210142338 U CN210142338 U CN 210142338U CN 201921388816 U CN201921388816 U CN 201921388816U CN 210142338 U CN210142338 U CN 210142338U
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Abstract
The utility model provides an optical fingerprint identification module and an electronic device, wherein the module is arranged below a substrate provided with a light-emitting unit; the module comprises a light sensing chip for acquiring fingerprint information, and the light sensing chip at least can receive signal light which is emitted from the substrate and reflected by an identified object; set up light sense chip with module diaphragm unit and collimation structure between the base plate, module diaphragm unit includes: a module 1/4 wave plate and a module linear polarizer, the module 1/4 wave plate being above the module linear polarizer; and the module 1/4 wave plate, the module linear polarizer, the collimating structure and the outline projection of the light sensing chip are at least partially overlapped. The utility model provides an optics fingerprint identification module and electronic equipment when not influencing signal light intensity, can reduce the luminance of non-reflection noise light to obtain the imaging quality of preferred.
Description
Technical Field
The utility model relates to a fingerprint identification technical field under the screen, concretely relates to optics fingerprint identification module and electronic equipment.
Background
The statements in this section merely provide background information related to the present disclosure and may not constitute prior art.
The technology of optical fingerprint recognition under screen is rapidly developed and applied because it does not occupy the surface space of electronic devices (e.g., smart phones). The optical fingerprint identification technology is adopted, light reflected by human fingerprints needs to be collected, and optical signals are converted into electric signals to generate fingerprint images.
The prior art provides an optical fingerprint identification module under screen, is applied to under the display screen that uses OLED screen as the representative. As shown in fig. 1, a substrate 3 configured with an OLED light source is generally provided with a display screen film unit 1, and the film unit 1 includes a display screen 1/4 wave plate 1a and a display screen linear polarizer 1 b. When the light source is used, light emitted by the OLED light source sequentially passes through the display screen 1/4 wave plate 1a and the display screen linear polarizer 1b to reach a finger, and light reflected by the finger sequentially passes through the display screen linear polarizer 1b and the display screen 1/4 wave plate 1a, then penetrates through the light-permeable area of the substrate 3, and reaches the light sensing chip 4 below the substrate 3, so that imaging is achieved.
Thus, the light reaching the light sensing chip 4 includes two parts, respectively: signal light carrying fingerprint information after reflection by a finger, and noise light emitted directly downward from the OLED light source in the substrate 3. The noise light does not carry fingerprint information because it is not reflected by the finger, resulting in poor imaging quality.
It should be noted that the above background description is only for the sake of clarity and complete description of the technical solutions of the present invention, and is set forth for facilitating understanding of those skilled in the art. These solutions are not considered to be known to the person skilled in the art merely because they have been set forth in the background section of the present invention.
SUMMERY OF THE UTILITY MODEL
In order to realize the above-mentioned purpose, this application provides an optics fingerprint identification module and electronic equipment, can attenuate non-reflection noise light to can improve imaging quality. The technical scheme is as follows:
an optical fingerprint identification module is arranged below a substrate provided with a light-emitting unit; the module includes:
the light sensing chip is used for acquiring fingerprint information and at least can receive signal light which is emitted from the substrate and reflected by an identified object;
set up light sense chip with module diaphragm unit and collimation structure between the base plate, module diaphragm unit includes: a module 1/4 wave plate and a module linear polarizer, the module 1/4 wave plate being above the module linear polarizer;
and the module 1/4 wave plate, the module linear polarizer, the collimating structure and the outline projection of the light sensing chip are at least partially overlapped.
As a preferred embodiment, a display screen film unit is disposed on the substrate, and the display screen film unit includes: display screen 1/4 wave plate and display screen linear polarizer, the optical axis of display screen 1/4 wave plate with be first angle between the polarization direction of display screen linear polarizer, the optical axis of module 1/4 wave plate with be the second angle between the polarization direction of module linear polarizer, first angle with second angle is one for +45 ° ± 5 °, and another is-45 ° ± 5 °.
In a preferred embodiment, the signal light generated by the light source emitted from the substrate after being reflected by the identified object propagates in the directions of the display panel linear polarizer, the display panel 1/4 wave plate, the module 1/4 wave plate, and the module linear polarizer in sequence.
As a preferred embodiment, a projection of the display screen membrane unit towards the modular membrane unit at least partially covers the modular membrane unit.
As a preferred embodiment, the collimating structure is located between the module diaphragm unit and the light sensing chip, the collimating structure is provided with a collimating hole for passing through the signal light, and an opening area of the collimating hole is at least partially located on a propagation path of the signal light.
As a preferred embodiment, the collimating structure is located between the substrate and the module membrane unit, the collimating structure is provided with a collimating hole for passing the signal light, and an opening area of the collimating hole is at least partially located on a propagation path of the signal light.
In a preferred embodiment, the collimating structure is located between the module 1/4 wave plate and the module linear polarizer, and the collimating structure is provided with a collimating hole for passing the signal light, and an opening area of the collimating hole is at least partially located on a propagation path of the signal light.
As a preferred embodiment, the optical fingerprint identification module further includes an IR filter layer, and the IR filter layer is located between the substrate and the photo sensor chip.
As a preferred embodiment, the IR filter layer is disposed above the module film unit; or the IR filter layer is arranged between the module 1/4 wave plate and the module linear polarizer; or the IR filter layer is arranged between the module membrane unit and the light sensing chip.
As a preferred embodiment, the collimating structure has opposite upper and lower surfaces, the IR filter layer being disposed on the upper surface of the collimating structure; or the IR filter layer is arranged on the lower surface of the collimation structure; or, the IR filter layer and the collimation structure are arranged at intervals.
An electronic equipment, electronic equipment disposes the optics fingerprint identification module.
Has the advantages that:
the module is provided with a module die unit including a module 1/4 wave plate and a module linear polarizer, so that the non-reflected noise light emitted downward from the substrate is attenuated in brightness after passing through a module 1/4 wave plate and a module linear polarizer. Thereby reducing the brightness of the non-reflected noise light and improving the imaging quality on the light sensing chip.
In addition, the module 1/4 wave plate is located the top of module linear polaroid to signal light energy after the finger reflection incides to the light sense chip on through display screen linear polaroid, display screen 1/4 wave plate, module 1/4 wave plate, module linear polaroid propagation direction in proper order, thereby can carry out the design that suits through the angle that becomes between display screen 1/4 wave plate and the display screen linear polaroid and the angle that becomes between module 1/4 wave plate and the module linear polaroid, when attenuating non-reflection noise light, do not attenuate or less attenuation target signal light. This application embodiment sets up through the cooperation with module diaphragm unit and collimation structure, can improve the SNR of the light that the light sense chip received, promotes the imaging quality greatly.
Specific embodiments of the present application are disclosed in detail with reference to the following description and drawings, indicating the manner in which the principles of the application may be employed. It should be understood that the embodiments of the present application are not so limited in scope.
Features that are described and/or illustrated with respect to one embodiment may be used in the same way or in a similar way in one or more other embodiments, in combination with or instead of the features of the other embodiments.
It should be emphasized that the term "comprises/comprising" when used herein, is taken to specify the presence of stated features, integers, steps or components but does not preclude the presence or addition of one or more other features, integers, steps or components.
Drawings
In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings needed to be used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present application, and other drawings can be obtained by those skilled in the art without inventive labor.
Fig. 1 is a schematic structural diagram of an underscreen fingerprint identification module provided in the prior art;
fig. 2 is a schematic structural diagram of a fingerprint identification module according to a first embodiment of the present invention;
fig. 3 is a schematic structural diagram of a fingerprint identification module according to a second embodiment of the present invention;
fig. 4 is a schematic structural diagram of a fingerprint identification module according to a third embodiment of the present invention;
FIG. 5A is a schematic view of a display screen 1/4 having an optical axis at-45 degrees to the polarization direction of the linear polarizer;
FIG. 5B is a schematic view of the module 1/4 having an angle of +45 ° between the optical axis of the wave plate and the polarization direction of the modular linear polarizer;
FIG. 6A is a schematic view of a display screen 1/4 having an optical axis at +45 ° to the polarization direction of the linear polarizer;
FIG. 6B is a diagram illustrating the relationship between the optical axis of the module 1/4 wave plate and the polarization direction of the module linear polarizer at-45 °.
Description of reference numerals:
1. a display screen membrane unit; 1a, a display screen 1/4 wave plate; 1b, a linear polarizer of the display screen; 2. a modular membrane unit; 2a, a module 1/4 wave plate; 2b, a module linear polarizer; 3. a substrate; 4. a light sensing chip; 5. a cover plate; 6. a collimating structure; 7. an IR filter layer.
Detailed Description
The technical solution of the present invention will be described in detail with reference to the accompanying drawings and specific embodiments, it should be understood that these embodiments are only for illustrating the present invention and are not intended to limit the scope, and after reading the present invention, the modifications of the various equivalent forms of the present invention by those skilled in the art will fall within the scope defined by the present application.
It will be understood that when an element is referred to as being "disposed on" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. The terms "vertical," "horizontal," "upper," "lower," "left," "right," and the like as used herein are for illustrative purposes only and do not denote a unique embodiment.
It should be noted that the fingerprint recognition described above is only a common example of using the user's biometric features. In the embodiments envisioned, those skilled in the art can extend the technical solutions of the embodiments provided in the present application to any suitable biometric authentication scenario. For example, a scene for verifying by acquiring biometric information of the iris of the user is not limited in the embodiments of the present invention.
The following is set forth in a scenario in which user fingerprint information is obtained as a main description. However, as can be seen from the above description, the scope of the embodiments of the present invention is not limited thereto. In this specification, the direction of the optical fingerprint recognition module of the embodiment of the present invention, which is directed or facing to the user in the normal use state, is defined as "up", and the opposite direction, or the direction away from the user is defined as "down".
The optical fingerprint recognition module according to an embodiment of the present invention will be explained and explained with reference to fig. 1 to 4. It should be noted that, for convenience of description, like reference numerals denote like parts in the embodiments of the present invention. And for the sake of brevity, detailed descriptions of the same components are omitted in different embodiments, and the descriptions of the same components may be mutually referred to and cited.
Specifically, an upward direction illustrated in fig. 1 to 4 is defined as "up", and a downward direction illustrated in fig. 1 to 4 is defined as "down". It should be noted that the definitions of the directions in the present specification are only for convenience of describing the technical solution of the present invention, and do not limit the directions of the optical fingerprint identification module according to the embodiments of the present invention in other scenarios, including but not limited to use, test, transportation, and manufacture, which may cause the orientation of the device to be reversed or the position of the device to be changed.
As shown in fig. 2 to 4, the present embodiment provides an optical fingerprint identification module, which is configured to be disposed below a substrate 3 configured with a light emitting unit; the module includes: the light sensing chip 4 is used for acquiring fingerprint information, and the light sensing chip 4 at least can receive signal light which is emitted from the substrate 3 and reflected by an identified object; set up light sense chip 4 with module diaphragm unit 2 and collimation structure 6 between the base plate 3, module diaphragm unit 2 includes: a module 1/4 wave plate 2a and a module linear polarizer 2b, the module 1/4 wave plate 2a being located above the module linear polarizer 2 b; and the module 1/4 wave plate 2a, the module linear polarizer 2b, the collimating structure 6 and the outline projection of the light sensing chip 4 are at least partially overlapped.
Specifically, the substrate 3 may be made of a light-transmitting material such as glass, PI resin, or the like. The light emitting unit of the substrate 3 configuration can specifically be an OLED light source or an LED light source, and the embodiment of the present invention does not limit this. In the present embodiment, the substrate 2 is a self-luminous substrate. Therefore, the light emitting unit of the substrate 3 is used not only for providing an excitation light source for fingerprint recognition but also for display. The excitation light source can form signal light carrying fingerprint information after being reflected by a finger on the outer surface of the substrate 3.
Fingerprint identification module sets up in base plate 3 below, can receive signal light to acquire fingerprint information. Fingerprint identification module includes: a light sensing chip 4 and a module diaphragm unit 2. The module membrane unit 2 is disposed between the substrate 3 and the photo sensing chip 4. The light sensing chip 4 can at least receive the signal light emitted from the substrate 3 and reflected by the identified object, and can convert the signal light into an electrical signal to generate a fingerprint image.
Be provided with display screen diaphragm unit 1 on base plate 3, display screen diaphragm unit 1 includes: a display 1/4 wave plate 1a and a display linear polarizer 1 b. Display 1/4 wave plate 1a is located below display polarizer 1 b. The module diaphragm unit 2 includes: a module 1/4 wave plate 2a and a module linear polarizer 2b, and a module 1/4 wave plate 2a is disposed above the module linear polarizer 2 b. That is, the module 1/4 wave plate 2a faces the display screen 1/4 wave plate. The signal light formed by the light source emitted from the substrate 3 after being reflected by the identified object is transmitted along the directions of the display screen linear polarizer 1b, the display screen 1/4 wave plate 1a, the module 1/4 wave plate 2a and the module linear polarizer 2b in sequence.
The display 1/4 wave plate 1a and the module 1/4 wave plate 2a may be made of organic materials or inorganic materials, as long as the function of phase retardation is achieved. The display screen linear polarizer 1b and the module linear polarizer 2b may be made of organic materials or inorganic materials as long as the polarization function is realized.
The module 1/4 wave plate 2a and the module linear polarizer 2b may be stacked on each other, that is, the lower surface of the module 1/4 wave plate 2a contacts and adheres to the upper surface of the module linear polarizer 2 b. Of course, the module 1/4 wave plate 2a and the module linear polarizer 2b may be disposed at intervals, i.e. the lower surface of the module 1/4 wave plate 2a is isolated from the upper surface of the module linear polarizer 2 b.
As shown in fig. 2 to 4, the display screen membrane unit 1 and the module membrane unit 2 are both located on the propagation path of the signal light, and specifically, the signal light reflected by the finger can pass through the display screen membrane unit 1 and the module membrane unit 2, so that the effectiveness of signal light processing is ensured.
In order to achieve the above object, the projection of the display screen membrane unit 1 towards the modular membrane unit 2 at least partially covers the modular membrane unit 2. The module 1/4 wave plate 2a and the module linear polarizer 2b in the module diaphragm unit 2 can naturally attenuate the brightness of the non-reflected noise light directly emitted downward by the light emitting unit.
The module is provided with the module die unit 2 including the module 1/4 wave plate 2a and the module linear polarizer 2b, and the non-reflected noise light emitted downward from the substrate 3 is attenuated in brightness after passing through the module 1/4 wave plate 2a and the module linear polarizer 2 b. Thereby, the luminance of the non-reflected noise light can be reduced, so that the imaging quality on the photo sensor chip 4 can be improved.
In addition, the module 1/4 wave plate 2a is located above the module linear polarizer 2b, so that the signal light reflected by the finger can be incident on the light sensing chip 4 through the display screen linear polarizer 1b, the display screen 1/4 wave plate 1a, the module 1/4 wave plate 2a and the module linear polarizer 2b in sequence, and the angle formed between the display screen 1/4 wave plate 1a and the display screen linear polarizer 1b and the angle formed between the module 1/4 wave plate 2a and the module linear polarizer 2b can be adapted to each other, and the target signal light is not attenuated or less attenuated while the non-reflected noise light is attenuated.
Further, in order to attenuate the brightness of the non-reflected noise light emitted directly downward from the substrate 3 without attenuating the brightness of the signal light reflected by the finger, the angles between the optical axis of the 1/4 wave plate and the polarization direction of the polarizer included in the display screen film unit 1 and the module film unit, respectively, should have special requirements. Referring to fig. 5A to 6B, a first angle is formed between the optical axis of the display screen 1/4 wave plate 1a and the polarization direction of the display screen linear polarizer 1B, a second angle is formed between the optical axis of the module 1/4 wave plate 2a and the polarization direction of the module linear polarizer 2B, one of the first angle and the second angle is +45 ° ± 5 °, and the other is-45 ° ± 5 °.
Specifically, the first angle and the second angle each have a numerical value (absolute value) in the vicinity of 45 °. In the present embodiment, please refer to fig. 5A and 5B, the first angle is-45 °, and the second angle is +45 °. Alternatively, as shown in FIGS. 6A and 6B, the first angle is +45 and the second angle is-45.
As shown in fig. 2, light emitted from the light-emitting unit of the substrate 3 and directed to the display screen film unit 1 passes through the display screen 1/4 wave plate 1a and the display screen linear polarizer 2a in sequence, and is incident on the fingerprint identification area above the substrate 3. After being reflected by a finger, signal light carrying fingerprint information is formed, returns to pass through the display screen membrane unit 1 again, sequentially passes through the display screen linear polaroid 1b and the display screen 1/4 wave plate 1a, is changed into circularly polarized light or elliptically polarized light, and is incident to the fingerprint identification module below the substrate 3. When the signal light is transmitted in the fingerprint identification module, the signal light is changed into linearly polarized light with the same polarization direction as that of the module linear polarizer 2b after passing through the module 1/4 wave plate 2a, so that the signal light can be incident on the light sensing chip 4 for imaging through the module linear polarizer 2b without damage or low damage.
The surface of the display screen membrane unit 1 departing from the substrate 3 is provided with a cover plate 5, the cover plate 5 is provided with a light transmission area, and an identification area pressed by a user is formed on the light transmission area. The light-transmitting region may occupy an upper surface of the cover plate 5, and the cover plate 5 may be entirely made of a light-transmitting material, without a light-impermeable region on the upper surface.
In this embodiment, as shown in fig. 2, the module may further include an IR filter layer 7, and the IR filter layer 7 is located between the substrate 3 and the photo chip 4.
The IR filter layer 7 is used to at least partially filter out noise light mixed in the signal light, so as to improve the sensing of the light sensing chip 4 on the received light and improve the imaging quality. Specifically, the excitation light emitted by the light-emitting unit disposed on the substrate 3 is generally visible light, and the signal light reflected by the finger is also visible light. The noise light may be invisible light in the ambient light, such as infrared light, near-infrared light, or the like, and the IR filter layer 7 is used to filter out the invisible light in the ambient light. In other embodiments, when the excitation light emitted by the light emitting unit disposed on the substrate 3 is an infrared light source, the noise light may be visible light in the ambient light, and the filter layer 7 is used for filtering out the visible light in the ambient light.
The IR-filter layer 7 may be arranged above the modular membrane unit 2, i.e. the IR-filter layer 7 is located between the modular membrane unit 2 and the substrate 3. Alternatively, the IR filter layer 7 may be disposed between the module 1/4 wave plate 2a and the module linear polarizer 2b, and the module 1/4 wave plate 2a and the module linear polarizer 2b are disposed at an interval. Alternatively, the IR filter layer 7 is disposed between the module film unit 2 and the light-sensing chip 4.
The IR-filter layer 7 may be provided in the form of a film. When the IR filter layer 7 is located above the module diaphragm unit 2, the lower surface of the IR filter layer 7 is attached to the upper surface of the module 1/4 wave plate 2a in the module diaphragm unit 2. When the IR filter layer 7 is located between the module 1/4 wave plate 2a and the module linear polarizer 2b, the module 1/4 wave plate 2a may be attached to the upper surface of the IR filter layer 7, and the module linear polarizer 2b may be attached to the lower surface of the IR filter layer 7. When the IR filter layer 7 is located between the module film unit 2 and the photo sensing chip 4, the lower surface of the IR filter layer 7 may be attached to the photo sensing chip 4, and the upper surface of the IR filter layer 7 may be attached to the module line polarizer 2b in the module film unit 2.
That is, as long as the IR filter layer 7 is located between the substrate 3 and the photo chip 4, the relative positional relationship and the contact relationship between the IR filter layer 7 and the module film unit 2 and the photo chip 4 may be set without limitation.
In this embodiment, in order to make the projection of the module film unit 2 along the propagation direction of the signal light at least partially cover the light sensing chip 4, so as to perform brightness attenuation on the non-reflected noise light (generally, the light emitted from the substrate 3 of the electronic device directly towards the lower side of the electronic device and not reflected by a finger, so that the light sensing chip 4 reaches light saturation in advance, and the amount of the signal light reflected by the finger received by the light sensing chip 4 is reduced, thereby reducing the signal-to-noise ratio of the light received by the light sensing chip 4, and having poor imaging quality) directed to the light sensing chip 4 as much as possible, the collimating structure 6 may be adopted to realize the convergence of the wide-angle light before the light reaches the light sensing chip 4.
This collimation structure 6 is used for assembling light to the fingerprint identification of light sense chip 4 is convenient for. The collimating structure 6 is provided with a collimating hole for passing the signal light, and an open area of the collimating hole is at least partially located on a propagation path of the signal light. For example, two adjacent rays within the reflected light are initially divergent and become parallel as the hand reflected light passes through the collimating aperture. That is, after the reflected light passes through the collimating hole, the distance between two adjacent light rays in the collimating hole is kept unchanged during propagation. Thereby make more reflection light energy get into light sense chip 4 through collimation hole, the fingerprint information that light sense chip 4 gathered is comparatively complete, so be convenient for discern the fingerprint. The collimating structure 6 may be a collimating lens, a fiber collimator, a tungsten alloy collimator, etc., and the present application is not limited thereto.
As shown in fig. 2, the alignment structure 6 may be located between the module film unit 2 and the photo sensor chip 4. That is, the collimating structure 6 is disposed on the light sensing chip 4, so that the light sensing chip 4 provides a position and a support for the collimating structure 6. The collimating structure 6 may be attached to the surface of the light sensing chip 4 by a light-transmissive adhesive. The signal light and the non-reflected noise light are processed by the module diaphragm unit 2 and then converged by the collimating structure 6, so that the signal light and the non-reflected noise light are incident on the light sensing chip 4 as much as possible.
As shown in fig. 3, the collimating structure 6 may also be located between the substrate 3 and the modular membrane unit 2. Thus, the signal light and the non-reflected noise light can be converged by the collimating structure 6 and then processed by the module diaphragm unit 2. As shown in fig. 4, the alignment structure 6 may also be located between the module 1/4 wave plate 2a and the module linear polarizer 2 b. Thus, the module 1/4 wave plate 2a is spaced apart from the module linear polarizer 2b, i.e., the lower surface of the module 1/4 wave plate 2a is isolated from the upper surface of the module linear polarizer 2 b.
In this embodiment, through the cooperation setting with module diaphragm unit 2 and collimation structure 6, can improve the SNR of the light that light sense chip 4 received, promote the imaging quality greatly.
In the present embodiment, the IR filter layer 7 and the collimating structure 6 may be both disposed above the module membrane unit 2. The IR filter layer 7 may be arranged on an upper surface of the collimating structure 6. Alternatively, the IR filter layer 7 may be arranged on the lower surface of the collimating structure 6. The IR filter layer 7 and the collimating structure 6 may also be disposed between the module 1/4 wave plate 2a and the module linear polarizer 2b, so as to space the module 1/4 wave plate 2a from the module linear polarizer 2b, and the relative position relationship between the IR filter layer 7 and the collimating structure 6 may also be relatively free. The IR filter layer 7 and the collimating structure 6 may be both disposed between the module film unit 2 and the light sensing chip 4, i.e., disposed below the module film unit 2, and the relative position relationship between the IR filter layer 7 and the collimating structure 6 may also be relatively free.
In particular, when the IR filter layer 7 is provided in the form of a film, the IR filter layer 7 may be attached to the upper or lower surface of the collimating structure 6. The IR-filter layer 7 may also be applied to the upper or lower surface of the collimating structure 6 in the form of an optical filter coating, and the position of the optical filter coating corresponds to the collimating aperture of the collimating structure 6.
Of course, the IR filter layer 7 may also be arranged at a distance from the collimating structure 6, and a modular membrane unit 2 or a part of the modular membrane unit 2 may be arranged between the IR filter layer 7 and the collimating structure 6. Similarly, as long as the IR filter layer 7 is located between the substrate 3 and the photo chip 4, the relative positional relationship and the contact relationship between the IR filter layer 7 and the module film unit 2, the collimating structure 6, and the photo chip 4 may not be limited.
The embodiment of the application also provides electronic equipment, and the electronic equipment is provided with the optical fingerprint identification module. In order to realize the basic functions of the electronic device, the electronic device in the embodiments of the present invention may further include other necessary modules or components. Taking a mobile smart phone as an example, it may further include a communication module, a battery, and the like.
It should be noted that any other necessary modules or components included in the electronic device may be used in any suitable existing configuration. In order to clearly and briefly explain the technical solutions provided by the present invention, the above parts will not be described again, and the drawings in the specification are also simplified correspondingly. It will nevertheless be understood that no limitation of the scope of the invention is thereby intended.
Specifically, when the utility model discloses fingerprint identification device is disposed in electronic equipment, electronic equipment can acquire user's fingerprint characteristic information based on this fingerprint identification device for match with the fingerprint information of storage, with the realization to current user's authentication, thereby confirm whether it has corresponding authority to carry out relevant operation to electronic equipment.
The utility model discloses fingerprint identification device can be used in including but not limited to electronic equipment such as mobile smart mobile phone, dull and stereotyped electronic equipment, computer, GPS navigator, personal digital assistant, the wearable equipment of intelligence.
It is to be understood that the above description is intended to be illustrative, and not restrictive. Many embodiments and many applications other than the examples provided will be apparent to those of skill in the art upon reading the above description. The disclosures of all articles and references, including patent applications and publications, are hereby incorporated by reference for all purposes.
Claims (11)
1. The optical fingerprint identification module is characterized in that the module is arranged below a substrate provided with a light-emitting unit; the module includes:
the light sensing chip is used for acquiring fingerprint information and at least can receive signal light which is emitted from the substrate and reflected by an identified object;
set up light sense chip with module diaphragm unit and collimation structure between the base plate, module diaphragm unit includes: a module 1/4 wave plate and a module linear polarizer, the module 1/4 wave plate being above the module linear polarizer;
and the module 1/4 wave plate, the module linear polarizer, the collimating structure and the outline projection of the light sensing chip are at least partially overlapped.
2. The optical fingerprint identification module of claim 1 wherein a display screen membrane unit is disposed on the substrate, the display screen membrane unit comprising: display screen 1/4 wave plate and display screen linear polarizer, the optical axis of display screen 1/4 wave plate with be first angle between the polarization direction of display screen linear polarizer, the optical axis of module 1/4 wave plate with be the second angle between the polarization direction of module linear polarizer, first angle with second angle is one for +45 ° ± 5 °, and another is-45 ° ± 5 °.
3. The optical fingerprint identification module of claim 2 wherein the signal light from the light source from the substrate after being reflected by the identified object propagates in the direction of the display panel linear polarizer, the display panel 1/4 wave plate, the module 1/4 wave plate, and the module linear polarizer.
4. The optical fingerprint recognition module of claim 3 wherein a projection of the display screen film unit toward the modular film unit at least partially covers the modular film unit.
5. The optical fingerprint recognition module of claim 3 wherein the collimating structure is located between the module membrane unit and the photo sensor chip, the collimating structure is provided with a collimating hole for passing the signal light, and an opening area of the collimating hole is at least partially located on a propagation path of the signal light.
6. The optical fingerprint recognition module of claim 3 wherein the collimating structure is located between the substrate and the module membrane unit, the collimating structure is provided with a collimating hole for passing the signal light, and an opening area of the collimating hole is at least partially located on a propagation path of the signal light.
7. The optical fingerprint recognition module of claim 3 wherein said collimating structure is located between said module 1/4 wave plate and said module linear polarizer, said collimating structure being provided with a collimating aperture for passing said signal light, an open area of said collimating aperture being at least partially located in a propagation path of said signal light.
8. The optical fingerprint identification module of claim 1 further comprising an IR filter layer between the substrate and the photo-sensing die.
9. The optical fingerprint recognition module of claim 8 wherein said IR filter layer is disposed over said module membrane unit; or the IR filter layer is arranged between the module 1/4 wave plate and the module linear polarizer; or the IR filter layer is arranged between the module membrane unit and the light sensing chip.
10. The optical fingerprint identification module of claim 8 wherein said collimating structure has opposing upper and lower surfaces, said IR filter layer being disposed on the upper surface of said collimating structure; or the IR filter layer is arranged on the lower surface of the collimation structure; or, the IR filter layer and the collimation structure are arranged at intervals.
11. An electronic device, characterized in that the electronic device is provided with an optical fingerprint recognition module according to any one of claims 1 to 10.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921388816.0U CN210142338U (en) | 2019-08-26 | 2019-08-26 | Optical fingerprint identification module and electronic equipment |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921388816.0U CN210142338U (en) | 2019-08-26 | 2019-08-26 | Optical fingerprint identification module and electronic equipment |
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| CN210142338U true CN210142338U (en) | 2020-03-13 |
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| CN201921388816.0U Active CN210142338U (en) | 2019-08-26 | 2019-08-26 | Optical fingerprint identification module and electronic equipment |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111964778A (en) * | 2020-08-21 | 2020-11-20 | 深圳市汇顶科技股份有限公司 | Under-screen environment optical sensor and terminal equipment |
| CN114671144A (en) * | 2020-12-27 | 2022-06-28 | 华为技术有限公司 | Screen protection film, preparation method thereof and electronic equipment |
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2019
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111964778A (en) * | 2020-08-21 | 2020-11-20 | 深圳市汇顶科技股份有限公司 | Under-screen environment optical sensor and terminal equipment |
| CN114671144A (en) * | 2020-12-27 | 2022-06-28 | 华为技术有限公司 | Screen protection film, preparation method thereof and electronic equipment |
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