CN112464693A - Fingerprint identification module, preparation method thereof and intelligent terminal - Google Patents
Fingerprint identification module, preparation method thereof and intelligent terminal Download PDFInfo
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- CN112464693A CN112464693A CN201910848279.1A CN201910848279A CN112464693A CN 112464693 A CN112464693 A CN 112464693A CN 201910848279 A CN201910848279 A CN 201910848279A CN 112464693 A CN112464693 A CN 112464693A
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
- G06V40/00—Recognition of biometric, human-related or animal-related patterns in image or video data
- G06V40/10—Human or animal bodies, e.g. vehicle occupants or pedestrians; Body parts, e.g. hands
- G06V40/12—Fingerprints or palmprints
- G06V40/13—Sensors therefor
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- Measurement Of The Respiration, Hearing Ability, Form, And Blood Characteristics Of Living Organisms (AREA)
Abstract
The invention relates to a fingerprint identification module, a preparation method thereof and an intelligent terminal, wherein the fingerprint identification module comprises the following components: the substrate comprises a body and a metal wire arranged in the body, wherein the body is made of engineering plastics and is provided with a first surface, and the body comprises at least one groove with an opening on the first surface; the chip sensors correspond to the grooves one by one, and one chip sensor is bound in each groove; the flexible circuit board is bound at the edge of the first surface, the projection of the area of the flexible circuit board on the first surface in the vertical direction is mutually spaced from the chip sensor, and the metal wiring is electrically connected with the chip sensor and the flexible circuit board; the body prepared by the engineering plastic can better support the chip sensor and the flexible circuit board at a thinner thickness; and bind the chip sensor and compare the setting and can reduce the thickness of binding back chip sensor department fingerprint identification module on the surface in the recess, be favorable to realizing frivolousization.
Description
Technical Field
The invention relates to the technical field of biological identification, in particular to a fingerprint identification module, a preparation method thereof and an intelligent terminal.
Background
In biological identification technical field, the especially optics fingerprint identification module of fingerprint identification module is with its penetrating power strong, characteristics such as light path stability is better are more and more welcomed, and for the ease of fingerprint identification module assembly in intelligent terminal's whole built-in, at present, the fingerprint identification module carries out circuit connection before the installation, then installs the slotted hole that sets up in advance on the complete machine again.
The existing fingerprint identification module structure mainly comprises a flexible circuit board and a chip sensor bound on the flexible circuit board, and when the fingerprint identification module structure is specifically set, the following three binding modes are available, namely a first mode: as shown in fig. 1, the chip sensor 02 is bound on a flexible board of the flexible circuit board 01 through an adhesive layer 04, and is electrically connected with the flexible circuit board 01 through a gold wire 05, and the other surface of the flexible board of the flexible circuit board 01 is fixed with a reinforcing steel plate 03 through a steel sheet adhesive 06 to improve the supporting strength; the second method comprises the following steps: as shown in fig. 2, the chip sensor 02 is bound on the rigid-flex board of the flexible circuit board 01 through an adhesive layer 04, and then electrically connected with the flexible circuit board 01 through a gold wire 05; the third method comprises the following steps: as shown in fig. 3, a hole is formed in the flexible board of the flexible circuit board 01, the sheet sensor 02 is bound on the flexible board of the flexible circuit board 01 through the glue layer 04, and then is electrically connected with the flexible circuit board 01 through the gold thread 05, and the other surface of the flexible board of the flexible circuit board 01 is fixed with the reinforcing steel plate 03 through the steel sheet glue 06 so as to improve the supporting strength. The thickness of above-mentioned three kinds of fingerprint identification modules is all thicker, needs intelligent terminal to reserve great installation space, and the size that leads to intelligent terminal is great, is unfavorable for realizing the ultra-thin volume to the great fingerprint identification module of thickness can not satisfy the more intelligent terminal's of partial size restriction structural design needs.
Disclosure of Invention
Based on this, it is necessary to provide a fingerprint identification module and preparation method, intelligent terminal to the above-mentioned problem, and this fingerprint identification module's thickness is less, is favorable to realizing intelligent terminal's frivolousization.
A fingerprint identification module, comprising:
the substrate comprises a body and a metal wire arranged in the body, wherein the body is provided with a first surface, and the body comprises at least one groove opened on the first surface;
the chip sensors correspond to the grooves one by one, and one chip sensor is bound in each groove;
the flexible circuit board is bound on the edge of the first surface, the projection of the area of the flexible circuit board on the first surface in the vertical direction is mutually spaced from the chip sensor, and the metal wiring is electrically connected with the chip sensor and the flexible circuit board.
In the fingerprint identification module, the chip sensor is bound in the groove, the flexible circuit board is bound at the edge of the first surface, and the metal wiring in the body is electrically connected with the chip sensor and the flexible circuit board so that the chip sensor can be connected with an external circuit; and set up the recess on the first surface of body, bind the chip sensor and compare direct setting in the recess and can reduce the thickness of binding back chip sensor department fingerprint identification module on the surface, and simultaneously, the regional projection and the chip sensor of vertical direction that the flexible circuit board is located the first surface are each other spaced, can separately set up chip sensor and flexible circuit board, avoid making thickness great because of the superpose of chip sensor and flexible circuit board, the whole thickness of current fingerprint module is the thickness of chip sensor plus the thickness of basement plus the thickness of flexible circuit board promptly, and the whole thickness of fingerprint module in this application is the thickness of chip sensor plus the thickness of basement thickness or flexible circuit board plus the thickness of basement, therefore, the thickness of above-mentioned fingerprint identification module is less, be favorable to realizing frivolousization.
In one embodiment, the first surface has a first area and a second area arranged around the first area, the groove is opened in the first area, a first connecting end is formed at the bottom of the groove, and a second connecting end is formed at the second area;
the chip sensor is fixed in the groove and electrically connected with the first connecting end, and the flexible circuit board is fixed in the second area and electrically connected with the second connecting end;
each first connecting end is electrically connected with the second connecting end through the metal wiring.
Above-mentioned fingerprint identification module sets up first link through the tank bottom at the recess, and the chip sensor is fixed in the recess and is connected in order to bind the chip sensor in the recess with first link electricity for the thickness of fingerprint identification module is less.
In one embodiment, the chip sensor is electrically connected to the first connection end through a gold wire, and the gold wire is completely covered by a first sealant. The binding setting mode of the chip sensor can be various, the electric connection between the optical sensor and the first connecting end can be better realized through the gold thread, the first sealing glue coated on the outer side of the gold thread can protect the gold thread, and the stability of the electric connection is improved.
In one embodiment, the chip sensor is fixed in the recess by a thin film adhesive. The chip sensor is fixed in the groove in various ways, and the chip sensor and the groove can be fixedly connected better by adopting a film adhesive.
In one embodiment, the body has a second surface connected to the first surface, the body further has a notch, the notch is opened in the second area and the second surface, the notch has a third surface parallel to the first surface, the third surface has the second connection end, and the flexible circuit board is fixed on the third surface and electrically connected to the second connection end. Can make things convenient for the flexible circuit board to place on the body through setting up the breach to guarantee fixed connection's between flexible circuit board and the body stability, in addition, can also reduce the thickness of flexible circuit board department fingerprint identification module.
In one embodiment, the flexible circuit board is electrically connected to the second connection terminal through an anisotropic conductive adhesive, and a second sealant covers the anisotropic conductive adhesive. The flexible circuit board and the second connecting end are electrically connected in various modes, the flexible circuit board and the second connecting end can be electrically connected better through the anisotropic conductive adhesive, the anisotropic conductive adhesive is covered with the second sealing adhesive to protect the flexible circuit board, and the stability of electrical connection is improved.
In one embodiment, the body is an engineering plastic. Because the engineering plastic has the advantages of strong rigidity, good mechanical property, strong heat resistance, good electrical insulation property, long-term use in harsh environment and the like, the body prepared by the engineering plastic can better support the chip sensor and the flexible circuit board at a thinner thickness.
In addition, the invention also provides a preparation method of the fingerprint identification module, which comprises the following steps:
providing a substrate master, wherein the substrate master comprises a plurality of substrates distributed in an array, each substrate comprises a body and a metal wire arranged in the body, the body is prepared by engineering plastics, the body is provided with a first surface, and the body comprises at least one groove with an opening on the first surface;
binding a chip sensor in each groove;
cutting a substrate master plate bound with chip sensors to form a single grain structure, wherein the single grain structure is provided with a substrate and at least one chip sensor;
and binding a flexible circuit board at the edge of the first surface in the single-grain structure, wherein the metal wiring is electrically connected with the chip sensor and the flexible circuit board.
According to the preparation method of the fingerprint identification module, the chip sensor is bound in the groove on the substrate mother board, then the substrate mother board after the chip sensor is bound is cut to form the single grain structure, and finally the flexible circuit board is bound on each single grain structure to complete the preparation of the fingerprint identification module.
In addition, the invention also provides an intelligent terminal which comprises a display screen, a middle frame and at least one fingerprint identification module according to any one of the technical schemes, wherein the fingerprint identification module is arranged in the middle frame, and the fingerprint identification module and the display screen are arranged in a stacked mode and are fixedly connected with the display screen through a cementing layer.
Above-mentioned intelligent terminal, fingerprint identification module inlay establishes in the center to through glued layer and display screen fixed connection, with the fixed of the relative intelligent terminal of realization fingerprint identification module, because the thickness of fingerprint identification module is less, consequently, the intelligent terminal's that has this fingerprint identification module thickness is less, can realize intelligent terminal's frivolousization.
In one embodiment, the intelligent terminal further comprises a cushion layer, and the cushion layer is arranged in the second area and located outside the first area. Through setting up the center that the higher level of pad can match not unidimensional to improve the commonality of fingerprint identification module.
Drawings
FIG. 1 is a schematic structural diagram of a conventional fingerprint recognition module;
FIG. 2 is a schematic view of another conventional fingerprint recognition module;
FIG. 3 is a schematic diagram of another conventional fingerprint recognition module;
FIG. 4 is a schematic structural diagram of a fingerprint recognition module according to the present invention;
FIG. 5 is an exploded view of the fingerprint recognition module shown in FIG. 4;
FIG. 6 is a schematic flow chart illustrating a method for manufacturing a fingerprint identification module according to the present invention;
FIG. 7 is a schematic structural diagram of the substrate master provided in FIG. 6;
FIG. 8 is a schematic structural diagram of a module formed after the substrate master is bonded with the chip sensor in FIG. 6;
fig. 9 is a schematic structural diagram of an intelligent terminal provided by the present invention.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention.
The technical scheme provided by the embodiment of the invention is described below by combining the accompanying drawings.
The first embodiment;
referring to fig. 4 and 5, fig. 4 shows a specific structure of the fingerprint identification module 10, fig. 5 shows a connection relationship of each structure in the fingerprint identification module 10, and the fingerprint identification module 10 includes: substrate 100, chip sensor 200, and flexible circuit board 300.
The substrate 100 includes a body 110 and a metal trace 120 disposed inside the body 110, an end of the metal trace 120 may be located on a surface of the body 110, or may be exposed outside the surface of the body 110 for facilitating electrical connection, the body 110 has a first surface 111, the body 110 includes at least one groove 112 opened on the first surface 111, when specifically disposed, the number of the grooves 112 may be one or multiple, for any one groove 112, one end of the metal trace 120 is led out from the surface of the groove 112, or the surface of the groove 112 is exposed outside, and the other end of the metal lead is led out from the first surface 111, or the first surface 111 is exposed outside;
the chip sensors 200 are bound in the grooves 112, the chip sensors 200 correspond to the grooves 112 one by one, one chip sensor 200 is bound in each groove 112, and the chip sensor 200 is connected with one end of the metal wire 120;
the flexible circuit board 300 is bound to the edge of the first surface 111, the projection of the area of the flexible circuit board 300 on the first surface 111 in the vertical direction is spaced from the chip sensor 200, and the flexible circuit board 300 is connected to the other end of the metal trace 120, so that the metal trace 120 is electrically connected to the chip sensor 200 and the flexible circuit board 300.
In the fingerprint identification module 10, the chip sensor 200 is bound in the groove 112, the flexible circuit board 300 is bound at the edge of the first surface 111, and the metal trace 120 in the body 110 is electrically connected with the chip sensor 200 and the flexible circuit board 300, so that the chip sensor 200 can be connected with an external circuit; the groove 112 is formed on the first surface 111 of the body 110, the thickness of the fingerprint identification module 10 at the position of the chip sensor 200 after binding can be reduced by binding the chip sensor 200 in the groove 112 and directly arranging the chip sensor on the surface, meanwhile, the flexible circuit board 300 is bound on the edge of the first surface 111, the projection of the area of the flexible circuit board 300 on the first surface 111 in the vertical direction is mutually separated from the chip sensor 200, the chip sensor 200 and the flexible circuit board 300 can be separately arranged, the phenomenon that the thickness is larger due to the superposition of the chip sensor 200 and the flexible circuit board 300 is avoided, namely, the whole thickness of the existing fingerprint module is the thickness of the chip sensor plus the thickness of the substrate plus the thickness of the flexible circuit board, but the whole thickness of the fingerprint module in the application is the thickness of the chip sensor 200 plus the thickness of the substrate 100 or the thickness of the flexible circuit board 300 plus, therefore, the thickness of the fingerprint identification module 10 is small, which is beneficial to realizing lightness and thinness.
With continued reference to fig. 5, in order to facilitate the bonding between the chip sensor 200 and the flexible circuit board 300, in a preferred embodiment, the first surface 111 has a first area 113 and a second area 114 disposed around the first area 113, the groove 112 is opened in the first area 113, one end of the metal trace 120 is led out from or exposed out of the groove bottom 115, the other end of the metal trace 120 is led out from or exposed out of the second area 114 to the second area 114, the groove bottom 115 is formed with a first connection end 116, the first connection end 116 is exposed out of the groove bottom 115, and the first connection end 116 is electrically connected to one end of the metal trace 120, the second area 114 is formed with a second connection end 117, the second connection end 117 is exposed out of the second area 114, and the second connection end 117 is electrically connected to the other end of the metal trace 120;
each first connection end 116 and the second connection end 117 are electrically connected through a metal trace 120, that is, the second connection end 117 is a common connection object of the first connection ends 116 and is electrically connected to the flexible circuit board 300. The chip sensor 200 is fixed in the groove 112 by a glue layer, the chip sensor 200 is electrically connected with the first connection end 116, the flexible circuit board 300 is fixed in the second area 114, and the gold finger 310 of the flexible circuit board 300 is electrically connected with the second connection end 117;
according to the fingerprint identification module 10, the first connection end 116 is arranged at the groove bottom 115 of the groove 112, the first connection end 116 is connected with the metal wiring 120, the chip sensor 200 can be conveniently and quickly bound in the groove 112 by directly connecting the chip sensor 200 with the first connection end 116, and the chip sensor 200 is directly connected with the metal wiring 120 relative to the chip sensor 200, so that the binding effect is good by adopting a connection mode of the chip sensor 200 and the first connection end 116, and the product yield is high; similarly, the second connection end 117 is disposed in the second region 114, the second connection end 117 is connected to the metal trace 120, the flexible circuit board 300 can be conveniently and quickly bound to the second region 114, and is directly connected to the metal trace 120 relative to the flexible circuit board 300, the binding effect is good by using the connection mode of the flexible circuit board 300 and the second connection end 117, the product yield is high, meanwhile, because the first region 113 of the second region 114 is disposed, the chip sensor 200 is bound to the groove 112 of the first region 113, the flexible circuit board 300 is bound to the second region 114, the chip sensor 200 and the flexible circuit board 300 are staggered, and the non-overlapping disposing mode can make the thickness of the fingerprint identification module 10 smaller.
With reference to fig. 5, the chip sensor 200 may be bound in various ways, specifically, the chip sensor 200 is electrically connected to the first connection end 116 through the gold wire 400, and the gold wire 400 is completely covered by the first encapsulant 500.
Above-mentioned fingerprint identification module 10, the connection between chip sensor 200 and the first connection end 116 can be realized through gold thread 400, and as the connected mode commonly used, gold thread 400 can realize the connection between chip and the first connection end 116 convenient and fast to the reliability of electricity connection between chip sensor 200 and the first connection end 116 can be guaranteed in the connection of gold thread 400, consequently, can realize the electricity connection between optical sensor and the first connection end 116 better through gold thread 400. Because unavoidable meeting exists pollutions such as steam in the use of fingerprint identification module 10, probably have the condition of collision or even striking moreover, can protect gold thread 400 through covering first glue 500 on gold thread 400, avoid corroding gold thread 400 such as steam, guarantee the stability of assembly, improve the stability of electricity connection.
The chip sensor 200 is fixed in the groove 112 in various ways, and may be fixedly connected by a glue layer, and more specifically, the chip sensor 200 is fixed in the groove 112 by a thin film adhesive 600.
In the fingerprint identification module 10, the chip sensor 200 is fixed in the groove 112 in various ways, not limited to the fixing way of the cementing agent, but also in other fixing connection ways which can meet the requirements; the cementing agent can be a film adhesive 600, and as a cementing agent in the common semiconductor industry, the film adhesive 600 has a good bonding effect, the chip sensor 200 and the groove 112 can be well fixedly connected by adopting the film adhesive 600 with a relatively thin thickness, the fixing effect is good, and the product yield is improved.
For convenience of understanding, the fingerprint identification module in the prior art is compared with the fingerprint identification module 10 provided by the embodiment of the invention, the fingerprint identification module 10 is suitable for the same intelligent terminal, and the thickness of different fingerprint identification modules 10 is shown in table 1 by referring to table 1 together.
TABLE 1
| Size/mm | In a first mode | Mode two | Mode III | Examples of the invention |
| Chip sensor thickness | 0.106 | 0.106 | 0.106 | 0.106 |
| Thickness of flexible circuit board | 0.11 | 0.35 | 0.11 | 0.11 |
| Thickness of glue layer | 0.02 | 0.02 | 0.02 | 0.02 |
| Thickness of reinforced steel plate | 0.2 | / | 0.2 | / |
| Thickness of steel sheet rubber | 0.04 | / | 0.02 | / |
| Thickness of substrate | / | / | / | 0.137 |
| Depth of groove | / | / | / | 0.03 |
| Thickness of fingerprint identification module | 0.476 | 0.476 | 0.35 | 0.233 |
As can be seen from table 1, compared with the first and second fingerprint identification modules, the thickness of the fingerprint identification module 10 provided in the embodiment of the present invention is reduced by more than 50%, and compared with the third fingerprint identification module, the thickness of the fingerprint identification module 10 provided in the embodiment of the present invention is reduced by more than 30%, so that compared with the fingerprint identification module in the prior art, the thickness of the fingerprint identification module 10 provided in the embodiment of the present invention is significantly reduced. It is noted that the depth of the groove 112 in table 1 is set to 0.03mm, whereas in the limit case, the depth of the groove 112 is close to 0mm, the thickness of the fingerprint identification module 10 is close to 0.263mm, at this time, compared with the fingerprint identification module of the first mode and the second mode, the thickness of the fingerprint identification module 10 provided by the embodiment of the invention is reduced by more than 40%, compared with the fingerprint identification module of the third mode, the thickness of the fingerprint identification module 10 provided by the embodiment of the invention is reduced by more than 20%, therefore, compared with the fingerprint identification module in the prior art, the thickness of the fingerprint identification module 10 provided by the embodiment of the invention is also obviously reduced even when the depth of the groove 112 is smaller, and the thickness of the fingerprint identification module 10 can be controlled by changing the depth of the groove 112, and the specific depth of the groove 112 is selected according to the actual situation of the fingerprint identification module 10.
With reference to fig. 5, the flexible circuit board 300 can be disposed in a plurality of binding manners, specifically, the body 110 has a second surface 118 connected to the first surface 111, the body 110 further has a notch 130, the notch 130 is opened in the second region 114 and the second surface 118, the notch 130 has a third surface 119 parallel to the first surface 111, the metal trace 120 is led out from the second region 114 or exposed out of the second region 114, a second connection end 117 is formed on the third surface 119, the second connection end 117 is electrically connected to the metal trace 120, the flexible circuit board 300 is fixed on the third surface 119, and the gold finger 310 of the flexible circuit board 300 is electrically connected to the second connection end 117.
In the fingerprint identification module 10, the flexible circuit board 300 is placed on the body 110, the gold finger 310 of the flexible circuit board 300 is placed on the third surface 119, and the notch 130 is arranged to facilitate the placement of the flexible circuit and position the flexible circuit board 300, so that the gold finger 310 of the flexible circuit board 300 can be well matched with the second connecting end 117, and the stability of the fixed connection between the flexible circuit board 300 and the body 110 is ensured; in addition, the notch 130 reduces the thickness of the flexible circuit board 300 and the substrate 100, so that the thickness of the fingerprint identification module 10 at the flexible circuit board 300 can be reduced.
Referring to fig. 5, there are various ways of electrically connecting the flexible circuit board 300 to the second connection terminal 117, and more specifically, the flexible circuit board 300 is electrically connected to the second connection terminal 117 through the anisotropic conductive adhesive 700, and the anisotropic conductive adhesive 700 is covered with the second sealant 800.
In the fingerprint identification module 10, the electrical connection between the flexible circuit board 300 and the second connection terminal 117 can be achieved by the anisotropic conductive adhesive 700, as a special conductive adhesive, the anisotropic conductive adhesive 700 can prevent two close-range conductive connection points from generating short circuit between circuits, thereby ensuring the stability of the electrical connection, and can conveniently and quickly achieve the electrical connection between the flexible circuit board 300 and the second connection terminal 117, therefore, the electrical connection between the flexible circuit board 300 and the second connection terminal 117 can be better achieved by the anisotropic conductive adhesive 700, because the inevitable contamination such as moisture exists during the use of the fingerprint identification module 10, and the collision or even the collision can exist, the second sealant 800 covering on the anisotropic conductive adhesive 700 can protect the golden finger 310 of the flexible circuit board 300, and prevent the golden finger 310 from being corroded by the moisture, the flexible circuit board 300 is protected, the stability of assembly is guaranteed, and the stability of electrical connection is improved.
In a preferred embodiment, the body 110 is an engineering plastic. Since the engineering plastic has the advantages of strong rigidity, good mechanical properties, strong heat resistance, good electrical insulation properties, long-term use in a harsh environment, and the like, the body 110 made of the engineering plastic can better support the chip sensor 200 and the flexible circuit board 300 at a thinner thickness.
In some preferred embodiments, the engineering plastic may be high molecular polypropylene.
The fingerprint identification module 10 is used as a common engineering material, and the body 110 made of high polymer polypropylene has the advantages of strong rigidity, good mechanical property, good electrical insulation property, long-term use in a harsh environment and the like, so that the body 110 can better support the chip sensor 200 and the flexible circuit board 300 at a thinner thickness; the engineering plastic may be high molecular polypropylene, or may be other materials that can meet the requirements, such as PE (polyethylene), PVC (polyvinyl chloride), ABS (acrylonitrile-butadiene-styrene), etc., and when specifically configured, the specific engineering material for preparing the body 110 is selected according to the mechanical properties of the various materials and the corresponding costs.
Example two;
based on the first embodiment, the second embodiment of the present invention further provides a method for manufacturing the fingerprint identification module 10, for manufacturing the fingerprint identification module 10 of the first embodiment, the method for manufacturing the fingerprint identification module 10 is shown in fig. 6, fig. 6 shows a process for manufacturing the fingerprint identification module 10, and the method for manufacturing the fingerprint identification module 10 includes:
step S601: as shown in fig. 7, a substrate master 20 is provided.
The substrate master 20 includes a plurality of substrates 100 distributed in an array, and when specifically configured, in order to facilitate subsequent cutting, a channel may be disposed between two adjacent substrates 100, each substrate 100 includes a body 110 and a metal trace 120 disposed inside the body 110, the body 110 is made of engineering plastic, the body 110 has a first surface 111, and the body 110 includes at least one groove 112 opened on the first surface 111;
step S602: as shown in fig. 8, a chip sensor 200 is bound in each groove 112, the chip sensor 200 is fixed in the groove 112 by a film adhesive 600, and is electrically connected to the metal trace 120 in the main body by a gold wire 400, and the outer side of the metal trace 120 is covered by a first sealant 600;
step S603: cutting the substrate master 20 bound with the chip sensors 200 along the channel to form a single grain structure, wherein the single grain structure is provided with a substrate 100 and at least one chip sensor 200;
step S604: in the single-grain structure, the flexible circuit board 300 is bound to the edge of the first surface 111, and the metal trace 120 electrically connects the chip sensor 200 and the flexible circuit board 300.
In the manufacturing method of the fingerprint identification module 10, firstly in step S602, the chip sensor 200 is bound in the groove 112 on the substrate master 20 provided in step S601, and the chip sensor 200 is connected with one end of the metal trace 120; then, in step S603, the substrate master 20 after the bonding of the chip sensors 200 is cut to form single-grain structures, each single-grain structure having one substrate 100 and at least one chip sensor 200; finally, in S604, the flexible circuit board 300 is bound to the edge of the first surface 111 in the single grain structure, and the flexible circuit board 300 is connected to the other end of the metal trace 120, so that the metal trace 120 is electrically connected to the chip sensor 200 and the flexible circuit board 300, and the preparation of the fingerprint identification module 10 is completed.
Example three;
in addition, the present invention further provides an intelligent terminal, the fingerprint identification module 10 provided in the above embodiment may be used in various intelligent terminals, the intelligent terminal may be a smart phone, a smart bracelet, etc., and no limitation is made herein, as shown in fig. 9, fig. 9 shows a specific structure of the intelligent terminal, the intelligent terminal includes a display screen 30 and a middle frame 40, the display screen 30 may be an OLED (Organic Light-Emitting Diode) display screen 30, and may also be other display screens 30, the intelligent terminal further includes at least one fingerprint identification module 10 according to any one of the technical solutions of the above embodiments, the fingerprint identification module 10 is disposed in the middle frame 40, and the fingerprint identification module 10 is fixedly connected to the display screen 30 through a glue layer 50.
Above-mentioned intelligent terminal, this glued layer 50 can be the double faced adhesive tape, also can be other adhesives that can satisfy the demands, when specifically setting up, can inlay fingerprint identification module 10 and establish in center 40, and through glued layer 50 and display screen 30 fixed connection, in order to realize fingerprint identification module 10 fixed intelligent terminal relatively, because fingerprint identification module 10's thickness is less, therefore, the intelligent terminal's that has this fingerprint identification module 10 thickness is less, can realize intelligent terminal's frivolousness, the complete machine space has been practiced thrift. When specifically setting up, can also splice a plurality of fingerprint identification modules 10, form the ultra-thin fingerprint identification module 10 of large tracts of land to improve intelligent terminal's fingerprint identification effect.
In order to accommodate the middle frames 40 with different sizes, as shown in fig. 9, in a preferred embodiment, the smart terminal further includes an elevating layer 60, and the elevating layer 60 is disposed in the second region 114 and outside the first region 113.
In the intelligent terminal, the fingerprint identification module 10 can be matched with the middle frames 40 with different sizes by adjusting the thickness and the position of the padding layer 60, so that the universality of the fingerprint identification module 10 is improved, and when the intelligent terminal is specifically arranged, the padding layer 60 is arranged in the second area 114 and is positioned outside the first area 113, so that the influence of the padding layer 60 on the chip sensor 200 and the flexible circuit board 300 is avoided; the mat-top layer 60 may be a gasket or a plurality of gaskets, adjacent gaskets are fixed by an adhesive, and the thickness of the mat-top layer 60 may be determined according to the actual situation of the intelligent terminal.
The technical features of the embodiments described above may be arbitrarily combined, and for the sake of brevity, all possible combinations of the technical features in the embodiments described above are not described, but should be considered as being within the scope of the present specification as long as there is no contradiction between the combinations of the technical features.
The above-mentioned embodiments only express several embodiments of the present invention, and the description thereof is more specific and detailed, but not construed as limiting the scope of the invention. It should be noted that, for a person skilled in the art, several variations and modifications can be made without departing from the inventive concept, which falls within the scope of the present invention. Therefore, the protection scope of the present patent shall be subject to the appended claims.
Claims (10)
1. The utility model provides a fingerprint identification module which characterized in that includes:
the substrate comprises a body and a metal wire arranged in the body, wherein the body is provided with a first surface, and the body comprises at least one groove opened on the first surface;
the chip sensors correspond to the grooves one by one, and one chip sensor is bound in each groove;
the flexible circuit board is bound on the edge of the first surface, the projection of the area of the flexible circuit board on the first surface in the vertical direction is mutually spaced from the chip sensor, and the metal wiring is electrically connected with the chip sensor and the flexible circuit board.
2. The fingerprint identification module of claim 1, wherein the first surface has a first area and a second area surrounding the first area, the groove opens into the first area and the groove bottom forms a first connection end, the second area forms a second connection end;
the chip sensor is fixed in the groove and electrically connected with the first connecting end, and the flexible circuit board is fixed in the second area and electrically connected with the second connecting end;
each first connecting end is electrically connected with the second connecting end through the metal wiring.
3. The fingerprint identification module of claim 2, wherein the chip sensor is electrically connected to the first connection terminal through a gold wire, and the gold wire is completely covered by a first sealant.
4. The fingerprint identification module of claim 3, wherein the chip sensor is secured within the recess by a thin film adhesive.
5. The fingerprint identification module of claim 2, wherein the body has a second surface connected to the first surface, the body further has a gap, the gap is opened in the second area and the second surface, the gap has a third surface parallel to the first surface, the third surface forms the second connection terminal, and the flexible circuit board is fixed to the third surface and electrically connected to the second connection terminal.
6. The fingerprint identification module of claim 4, wherein the flexible circuit board is electrically connected to the second connection terminal through an anisotropic conductive adhesive, and a second sealant covers the anisotropic conductive adhesive.
7. The fingerprint identification module of claim 1, wherein the body is an engineering plastic.
8. The preparation method of the fingerprint identification module is characterized by comprising the following steps of:
providing a substrate master, wherein the substrate master comprises a plurality of substrates distributed in an array, each substrate comprises a body and a metal wire arranged in the body, the body is made of engineering plastics and provided with a first surface, and the body comprises at least one groove with an opening on the first surface;
binding a chip sensor in each groove;
cutting a substrate master plate bound with chip sensors to form a single grain structure, wherein the single grain structure is provided with a substrate and at least one chip sensor;
and binding a flexible circuit board at the edge of the first surface in the single-grain structure, wherein the metal wiring is electrically connected with the chip sensor and the flexible circuit board.
9. An intelligent terminal, includes display screen and center, its characterized in that, still includes at least one according to any one of claims 1-7 fingerprint identification module, the fingerprint identification module sets up in the center, the fingerprint identification module with the range upon range of setting of display screen and through glued layer with display screen fixed connection.
10. The intelligent terminal according to claim 9, further comprising a cushion layer disposed in the second zone and outside the first zone.
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| CN201910848279.1A CN112464693A (en) | 2019-09-09 | 2019-09-09 | Fingerprint identification module, preparation method thereof and intelligent terminal |
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| CN201910848279.1A CN112464693A (en) | 2019-09-09 | 2019-09-09 | Fingerprint identification module, preparation method thereof and intelligent terminal |
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Cited By (1)
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| CN113642458A (en) * | 2021-08-12 | 2021-11-12 | 业成科技（成都）有限公司 | Fingerprint identification sensor |
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