Utility model content
Embodiment of the present utility model provides a kind of optical finger print identification module and electronic installation.
A kind of optical finger print identification module of the utility model embodiment, including:
Circuit board;
Optical fingerprint sensor on the circuit board;With
Light source on the circuit board, the light of the light source transmitting is blue green light, and the light source is configured to launch
To the optical fingerprint sensor, the optical fingerprint sensor is configured to conduct the light that the light source is launched to described light
Optical finger print identifies the outside of module, and receives the light source returned by optical finger print identification module external reflection and launch
Light.
The optical finger print identification module of the utility model embodiment, as sensitive light source, is increased bluish-green using blue green light
Light ratio shared in the light that optical fingerprint sensor receives, so as to reduce the interference of ambient light so that optical finger print identifies
Module obtains clearly fingerprint image.
In some embodiments, the circuit board includes substrate and flexible PCB, and the optical fingerprint sensor is set
Put on the substrate, one end of the flexible PCB connects the lower surface of the substrate.
In this way, flexible PCB is in light weight and thickness of thin, space is saved, beneficial to optical finger print identification module miniaturization, together
When, substrate can be as support optical fingerprint sensor and the supporter of the optical finger print identification other elements of module.
In some embodiments, the optical fingerprint sensor includes:
Photosensitive layer, the photosensitive layer is formed with induction zone;With
The optical layer being arranged on the photosensitive layer, the optical layer cover the induction zone, the area of the optical layer
More than the area of the induction zone, the optical layer formed with multiple lens, the photosensitive layer be located at the optical layer with it is described
Between substrate.
In this way, optical layer can make more light converge to photosensitive layer, optical finger print identification module is set to collect more
Optical signal, more accurately to realize fingerprint recognition.
In some embodiments, the photosensitive layer includes multiple light-sensitive elements and connection line, the multiple photosensitive member
Part forms the induction zone, and the connection line connects the multiple light-sensitive element and the substrate.
Referred in this way, light-sensitive element can sense the light from optical layer convergence and optical signal is changed into electric signal with collecting
Line information.
In some embodiments, the optical finger print identification module includes stiffening plate, and the stiffening plate is arranged on described
The lower surface of one end of flexible PCB.
In this way, stiffening plate can strengthen the intensity of flexible PCB.
In some embodiments, the light source is located at the side of the optical fingerprint sensor.
In this way, light source is located at the side of optical fingerprint sensor, source emissioning light to optical fingerprint sensor.
In some embodiments, the optical finger print identification module includes light guide, and the light guide is arranged on described
The lower section of optical fingerprint sensor, the light source are arranged on the side of the light guide, and the light source is configured to launch light warp
The light guide is transmitted to the optical fingerprint sensor.
So, on the one hand, using the cooperation of light source and optical fingerprint sensor, optical finger print identification module, which can be realized, to be referred to
Line identification function, on the other hand, the light that light source is launched can be conducted using light guide to optical fingerprint sensor, light source can be made
The light sent is uniformly incident to optical fingerprint sensor.
In some embodiments, the wave-length coverage of the blue green light is 450-570nm.
In this way, blue green light frequency and infrared light frequency relatively far apart, beneficial to reduce ambient light interference.
In some embodiments, the optical finger print identification module includes optical cement and sealing, and the optical cement is set
In the upper surface of the optical fingerprint sensor, the sealing encapsulates the side of the optical fingerprint sensor and the optical cement
Side.
In this way, sealing can fix optical cement and optical fingerprint sensor, optical finger print identification module is avoided to be bonded
When rock.
In some embodiments, the optical finger print identification module includes connecting line and sealing, and the optical finger print passes
Sensor is connected by the connecting line with the circuit board, and the sealing encapsulates the connecting line, the circuit board and the company
The junction of wiring, the optical fingerprint sensor and the junction of the connecting line and the side of the optical fingerprint sensor
Side.
In this way, sealing can protect the junction of connecting line, circuit board and connecting line, optical fingerprint sensor and connecting line
Junction.
A kind of electronic installation of the utility model embodiment, including the optical finger print knowledge described in any of the above-described embodiment
Other module.
In the electronic installation of the utility model embodiment, optical finger print identification module is using blue green light as sensitive light
Source, increase blue green light ratio shared in the light that optical fingerprint sensor receives, so as to reduce the interference of ambient light with
Optical finger print identification module is set to obtain clearly fingerprint image.
The additional aspect and advantage of embodiment of the present utility model will be set forth in part in the description, partly will be from
Become obvious in following description, or recognized by the practice of embodiment of the present utility model.
Embodiment
Embodiment of the present utility model is described below in detail, the example of the embodiment is shown in the drawings, wherein
Same or similar label represents same or similar element or the element with same or like function from beginning to end.Lead to below
It is exemplary to cross the embodiment being described with reference to the drawings, and is only used for explaining the utility model, and it is not intended that to this practicality
New limitation.
In description of the present utility model, it is to be understood that term " " center ", " longitudinal direction ", " transverse direction ", " length ", " width
Degree ", " thickness ", " on ", " under ", "front", "rear", "left", "right", " vertical ", " level ", " top ", " bottom ", " interior ", " outer ",
" clockwise ", the orientation of instruction " counterclockwise " or position relationship be based on orientation shown in the drawings or position relationship, merely to
It is easy to describe the utility model and simplified description, rather than indicates or imply that signified device or element must be with specifically square
Position, with specific azimuth configuration and operation, therefore it is not intended that to limitation of the present utility model.In addition, term " first ",
" second " is only used for describing purpose, and it is not intended that indicating or implying relative importance or imply the technology indicated by indicating
The quantity of feature.Thus, " first " is defined, the feature of " second " can be expressed or implicitly include one or more
The feature.In description of the present utility model, " multiple " are meant that two or more, unless otherwise clearly specific
Limit.
, it is necessary to which explanation, unless otherwise clearly defined and limited, term " are pacified in description of the present utility model
Dress ", " connected ", " connection " should be interpreted broadly, for example, it may be fixedly connected or be detachably connected, or integratedly
Connection;It can be mechanical connection or electrical connection or can mutually communicate;Can be joined directly together, can also be in
Between medium be indirectly connected, can be connection or the interaction relationship of two elements of two element internals.For this area
For those of ordinary skill, concrete meaning of the above-mentioned term in the utility model can be understood as the case may be.
In the utility model, unless otherwise clearly defined and limited, fisrt feature second feature it " on " or it
" under " can directly be contacted including the first and second features, it is not directly to contact but lead to that can also include the first and second features
The other characterisation contact crossed between them.Moreover, fisrt feature second feature " on ", " top " and " above " include the
One feature is directly over second feature and oblique upper, or is merely representative of fisrt feature level height and is higher than second feature.First is special
Sign second feature " under ", " lower section " and " below " including fisrt feature immediately below second feature and obliquely downward, or only
Represent that fisrt feature level height is less than second feature.
Following disclosure provides many different embodiments or example is used for realizing different structure of the present utility model.
In order to simplify disclosure of the present utility model, hereinafter the part and setting of specific examples are described.Certainly, they are only
Example, and purpose does not lie in limitation the utility model.In addition, the utility model can in different examples repeat reference numerals
And/or reference letter, this repetition are for purposes of simplicity and clarity, itself not indicate discussed various embodiments
And/or the relation between setting.In addition, various specific techniques and the example of material that the utility model provides, but this
Field those of ordinary skill can be appreciated that the application of other techniques and/or the use of other materials.
Fig. 1-Fig. 2 is referred to, embodiment of the present utility model provides a kind of optical finger print identification module 10.Optical finger print
Identification module 10 includes circuit board 12, optical fingerprint sensor 14 and light source 16.Optical fingerprint sensor 14 and light source 16 are located at
On circuit board 12.The light that light source 16 is launched is blue green light.Light source 16 is configured to emit light into optical fingerprint sensor 14.Optics
Fingerprint sensor 14 is configured to that the light that light source 16 is launched is conducted to the outside of optical finger print identification module 10 and received by light
Learn the light that the light source 16 that the external reflection of fingerprint recognition module 10 is returned is launched.
The optical finger print identification module 10 of the utility model embodiment, as sensitive light source, increases indigo plant using blue green light
Green glow ratio shared in the light that optical fingerprint sensor 14 receives, so as to reduce the interference of ambient light so that optical finger print
Identification module 10 obtains clearly fingerprint image.
Specifically, when user unlocks electronic installation in outdoor application optical finger print identification module 10, optical finger print sensing
The light that device 14 receives includes external environmental light, and the interference of ambient light makes optical finger print identification module 10 not obtain clearly to refer to
Print image.In embodiment of the present utility model, light source 16 launches blue green light, increases blue green light in optical fingerprint sensor
Shared ratio in 14 light received, so as to reduce interference of the ambient light to optical fingerprint sensor 14, improve fingerprint recognition
Effect.Optical fingerprint sensor 14 can use cmos sensor.
It is appreciated that the utility model embodiment optical finger print identification module 10 can be applied to but be not limited to unblock,
The application scenarios such as file encryption, payment verification, authentication.
In some embodiments, circuit board 12 includes substrate 122 and flexible PCB 124.Optical fingerprint sensor 14
Set on a substrate 122, the lower surface of one end connecting substrate 122 of flexible PCB 124.
In this way, flexible PCB 124 is in light weight and thickness of thin, saving space are small-sized beneficial to optical finger print identification module 10
Change, meanwhile, substrate 122 can be as the support of support optical fingerprint sensor 14 and optical finger print identification 10 other elements of module
Thing.
Specifically, substrate 122 can be used as hardboard, and substrate 122 and flexible PCB 124 can be connected to by way of welding
Together.Flexible PCB 124 can be connected with the external circuit of optical identification fingerprint module 10 or electronic installation to carry out data biography
It is defeated.
In some embodiments, substrate 122 includes solder joint 1222, and substrate 122 passes through solder joint 1222 and flexible PCB
124 connections.Substrate 122 and flexible PCB 124 can be in communication with each other, so as to which substrate 122 can pass the optical finger print of acquisition
The electric signal transmission that sensor 14 obtains is to flexible PCB 124.
In some embodiments, processor (not shown) is provided with flexible PCB 124, processor can be used for locating
Manage the electric signal of optical fingerprint sensor 14.
Specifically, flexible PCB 124 can be provided with processor and interlock circuit structure, and processor processing includes fingerprint
The electric signal of information is to establish the model of fingerprint.
In some embodiments, optical fingerprint sensor 14 includes photosensitive layer 142 and the light being arranged on photosensitive layer 142
Learn layer 144.Photosensitive layer 142 is formed with induction zone 1422.Optical layer 144 covers induction zone 1422, and the area of optical layer 144 is more than
The area of induction zone 1422.Optical layer 144 is formed with multiple lens.Photosensitive layer 142 is between optical layer 144 and substrate 122.
In this way, optical layer 144 can make more light converge to photosensitive layer 142, optical finger print identification module 10 is set to adopt
Collect more optical signals, more accurately to realize fingerprint recognition.
Specifically, when optical finger print identification module 10 gathers fingerprint, finger acts on the dielectric surface of the top of optical layer 144
On, the light that finger reflects is converged to induction zone 1422 by multiple lens of optical layer 144 so that induction zone 1422 can obtain compared with
More light are to form finger print data.The area that the area of optical layer 144 is more than induction zone 1422 is beneficial to the light that more fingers reflect
Induction zone 1422 is projected to, increases the data volume of the finger print information collected.Photosensitive layer 142 is configured to from optical layer 144
The light of convergence is converted to electric signal and exports electric signal, and the electric signal of output forms finger print information after processing.
In some embodiments, photosensitive layer 142 includes multiple light-sensitive element (not shown) and connection line (not shown).
Multiple light-sensitive elements form induction zone 1422, and connection line connects multiple light-sensitive elements and substrate 122.
In this way, light-sensitive element can sense the light converged from optical layer 144 and optical signal is changed into electric signal to gather
To finger print information.
Specifically, multiple light-sensitive elements can convert optical signals into electric signal, when finger acts on optical finger print identification
When on the surface of module 10, the light reflected from finger convergence is projected to photosensitive layer 142, multiple light-sensitive element senses by optical layer 144
The light of finger print information should be carried and convert optical signal into electric signal, the finger print information got is transferred to substrate by connection line
122.Substrate 122 can be connected by flexible PCB 124 with external circuit, so that external circuit realizes the work(of fingerprint recognition
Energy.
Further, photosensitive layer 142 includes substrate, and multiple light-sensitive elements and connection line are formed in substrate.At some
In example, substrate can be semiconductor base.Light-sensitive element and connection line can be formed in substrate by photoetching process.Multiple light
Quick element forms induction zone 1422 (active area, AA areas), and other regions form (the non-AA of non-inductive area 1424 in substrate
Area), non-inductive area is provided with connection line.Light-sensitive element is, for example, photodiode.
In other examples, light shield layer is may be provided between the substrate of photosensitive layer 142 and each light-sensitive element, light source 16 is sent out
The incident ray penetrated is emitted to optical layer 144 through the gap between multiple light shield layers and optical finger print identifies the outside of module 10.
In this way, processor can directly handle the electric signal of light-sensitive element output to obtain the finger print information of finger.
In some embodiments, optical finger print identification module 10 includes stiffening plate 18, and stiffening plate 18 is arranged on flexible electrical
The lower surface of one end of road plate 124.
In this way, stiffening plate 18 can strengthen the intensity of flexible PCB 124.
It is appreciated that due to the flexible nature of flexible PCB 124, cause the stress of flexible PCB 124 easily to produce and split
Seam, that is, be difficult to connecting substrate 122 and flexible PCB 124 or the installation elements on flexible PCB 124, therefore will can mend
Strong plate 18 is arranged on the lower surface of flexible PCB 124, so that the intensity foot of the flexible PCB 124 with reference to stiffening plate 18
It is enough, and then facilitate connecting substrate 122 and flexible PCB 124 or the operation such as installation elements is carried out on flexible PCB 124.
Stiffening plate 18 can be made up of metal material, such as stainless steel.
In some embodiments, referring to Fig. 1, light source 16 is located at the side of optical fingerprint sensor 14.
In this way, light source 16 is located at the side of optical fingerprint sensor 14, light source 16 emits light into optical fingerprint sensor 14.
It is appreciated that light source 16 launches incident light to photosensitive layer 142, after incident light passes through photosensitive layer 142 and optical layer 144
It is projected to the region of the top of optical layer 144.When finger is applied to the position of face induction zone 1422, the light of the transmitting of light source 16
Reflected light is reflected to form on the rough strain line of finger surface fingerprint, reflected light is projected to light after optical layer 144
Feel the light-sensitive element of layer 142, the incident light being projected on light-sensitive element and reflected light are changed into electric signal and defeated by light-sensitive element
Go out.The process circuit that connection line is connected with light-sensitive element is formed through on circuit board 12, process circuit can filter off incident light
Electric signal and handle the electric signal of reflected light to obtain the finger print information of finger.
Further, in one example, light source 16 can be LED light source.It is appreciated that LED light source small volume and section
Can be environmentally friendly, minimized beneficial to optical finger print identification module 10.
In some embodiments, referring to Fig. 2, optical finger print identification module 10 includes light guide 11.Light guide 11 is set
Put in the lower section of optical fingerprint sensor 14.Light source 16 is arranged on the side of light guide 11.Light source 16 is configured to launch light warp
Light guide 11 is transmitted to optical fingerprint sensor 14.
So, on the one hand, using the cooperation of light source 16 and optical fingerprint sensor 14, optical finger print identification module 10 can be with
Fingerprint identification function is realized, on the other hand, the light that light source 16 is launched can be conducted to optical finger print and sensed using light guide 11
Device 14, the light that light source 16 is sent can be made uniformly to be incident to optical fingerprint sensor 14.
Specifically, light source 16 can be point source of light, and point source of light is converted to flat light source by light guide 11.Point source of light example
LED light source in this way.Light guide 11 is, for example, light guide plate.
In some embodiments, the wave-length coverage of blue green light is 450-570nm.
In this way, blue green light frequency and infrared light frequency relatively far apart, beneficial to reduce ambient light interference.
It is appreciated that the wavelength for the blue green light that light source 16 is launched is located in 450-570nm wave-length coverage.For example, wavelength
It can be any number between 450nm, 570nm or 450-570nm.
In some embodiments, optical finger print identification module 10 includes optical cement 13 and sealing 15.Optical cement 13 is set
In the upper surface of optical fingerprint sensor 14.The side of the encapsulating optical fingerprint sensor 14 of sealing 15 and the side of optical cement 13.
In this way, sealing 15 can fix optical cement 13 and optical fingerprint sensor 14, optical finger print is avoided to identify module
10 rocking in fitting.
Specifically, optical finger print identification module 10 generally requires the lower surface for using optical cement 13 to be fitted in cover plate 20 with shape
Into optical finger print recognizer component and it is applied to electronic installation.Fitted to by the optical finger print identification module 10 with optical cement 13
During the lower surface of cover plate 20, the quality of optical cement 13 belongs to semi-cured state, so causes to paste by optical cement 13 than relatively soft
The optical finger print identification module 10 of conjunction easily rocks, therefore the side using the encapsulating optical fingerprint sensor 14 of sealing 15 and optics
The side of glue 13 can fix optical fingerprint sensor 14 and optical cement 13.Sealing 15 is configured to limit optical cement 13
Displacement.After the completion of fitting, then optical cement 13 is solidified.In addition, sealing 15 can be coloured and lighttight, therefore sealing
15 can play interception, prevent ambient light from entering in optical fingerprint sensor 14 and disturbing optical fingerprint sensor 14 to identify
Fingerprint.Sealing 15 includes the glue such as low temperature hot-setting adhesive, moisture-curable glue, is not specifically limited herein.
In addition, when optical cement 13 and optical fingerprint sensor 14 are square, sealing 15 can be with the three of encapsulating optical glue 13
While or when four, and optical fingerprint sensor 14 three while or when four.
In some embodiments, optical finger print identification module 10 includes connecting line 17 and sealing 15.Optical finger print senses
Device 14 is connected by connecting line 17 and circuit board 12.Sealing 15 encapsulate connecting line 17, circuit board 12 and connecting line 17 junction,
Optical fingerprint sensor 14 and the junction of connecting line 17 and the side of optical fingerprint sensor 14.
In this way, sealing 15 can protect the junction of connecting line 17, circuit board 12 and connecting line 17, optical fingerprint sensor 14
With the junction of connecting line 17.
Specifically, the sealing of lighttight sealing, e.g. black may be selected in sealing 15.The sealing shaded effect of black
It is good, interference of the ambient light to optical fingerprint sensor 14 is reduced, and then the degree of accuracy of optical finger print identification module 10 can be improved.
It is appreciated that connecting line 17 can engage (wire bonding) technique connection optical fingerprint sensor 14 by routing
With circuit board 12.
A kind of electronic installation of the utility model embodiment, include the optical finger print identification mould of any of the above-described embodiment
Group 10.
In the electronic installation of the utility model embodiment, optical finger print identification module 10 is using blue green light as sensitive light
Source, blue green light ratio shared in the light that optical fingerprint sensor 14 receives is increased, so as to reduce the interference of ambient light
So that optical finger print identification module 10 obtains clearly fingerprint image.
Electronic installation can be the terminals such as mobile phone, tablet personal computer, ATM, vehicular touch screen, fingerprint gate lock.
In the description of this specification, reference term " some embodiments ", " embodiment ", " some embodiment party
The description of formula ", " exemplary embodiment ", " example ", " specific example " or " some examples " means to combine embodiment or shown
Specific features, structure, material or the feature of example description are contained at least one embodiment or example of the present utility model.
In this manual, identical embodiment or example are not necessarily referring to the schematic representation of above-mentioned term.Moreover, description
Specific features, structure, material or feature can be in any one or more embodiments or example with suitable side
Formula combines.
In addition, term " first ", " second " are only used for describing purpose, and it is not intended that instruction or hint relative importance
Or the implicit quantity for indicating indicated technical characteristic.Thus, define " first ", the feature of " second " can be expressed or
Implicitly include at least one feature.In description of the present utility model, " multiple " are meant that at least two, such as two,
Three, unless otherwise specifically defined.
Although embodiment of the present utility model has been shown and described above, it is to be understood that above-described embodiment is
Exemplary, it is impossible to it is interpreted as to limitation of the present utility model, one of ordinary skill in the art is in the scope of the utility model
Interior above-described embodiment to be changed, changed, replaced and modification, the scope of the utility model is by claim and its equivalent
Thing limits.