CN110036396A

CN110036396A - Fingerprint identification device and electronic equipment

Info

Publication number: CN110036396A
Application number: CN201980000286.4A
Authority: CN
Inventors: 郭益平
Original assignee: Shenzhen Huiding Technology Co Ltd
Current assignee: Shenzhen Goodix Technology Co Ltd
Priority date: 2019-03-01
Filing date: 2019-03-01
Publication date: 2019-07-19
Anticipated expiration: 2039-03-01
Also published as: WO2020177032A1; CN110036396B

Abstract

It provides a kind of fingerprint identification device and electronic equipment, fingerprint identification device is applied in the electronic equipment with display screen, the fingerprint identification device includes: circuit board；The top of the circuit board is arranged at least one fingerprint sensor chip, at least one described fingerprint sensor chip；At least one described fingerprint sensor chip is connected with the circuit board；Wherein, the circuit board is used to be mounted on the lower section of the display screen, so that at least one described fingerprint sensor chip is located at the lower section of the display screen.In the embodiment of the present application, the installation cost and complexity of at least one fingerprint sensor chip can reduce by the circuit board, and improve its maintenanceability.Particularly directed under the scene of multiple fingerprint sensor chips, installation complexity can be effectively reduced, and improve the installation effectiveness of fingerprint sensor chip.

Description

Fingerprint identification device and electronic equipment

Technical field

The present embodiments relate to electronic fields, and more particularly, to fingerprint identification device and electronic equipment.

Background technique

Optics or ultrasonic fingerprint identification mould group are fitted in organic light-emitting diodes currently, shielding lower fingerprinting scheme and referring to The bottom of (Organic Light-Emitting Diode, OLED) screen is managed, that is, also regardless of optical finger print identification mould group It is that ultrasonic fingerprint identification mould group requires together with bottom of screen luminescent layer tight bond.

But it directly fits since OLED screen curtain cost is very high and very fragile, therefore by fingerprint recognition mould group to OLED screen It is easy to make a mess of OLED screen curtain when curtain.Further, since fingerprint recognition mould group and OLED screen curtain are fully adhered to together, fingerprint such as occur It identifies the damage of mould group, damage OLED screen curtain is easy to when dismantling fingerprint recognition mould group.Moreover, fingerprint recognition mould group is directly pasted The attaching process for closing OLED screen curtain is also more complicated.

Due to problem above, the cost and complexity of electronic equipment are considerably increased, maintenanceability is low.

Summary of the invention

A kind of fingerprint identification device and electronic equipment are provided, can reduce the cost and complexity of electronic equipment, is improved Maintenanceability.Particularly directed under the scene of multiple fingerprint sensor chips, can be effectively reduced electronic equipment cost and Complexity substantially increases maintenanceability.

In a first aspect, providing a kind of fingerprint identification device, apply in the electronic equipment with display screen, the fingerprint is known Other device includes:

Circuit board；

The upper of the circuit board is arranged at least one fingerprint sensor chip, at least one described fingerprint sensor chip Side；

At least one described fingerprint sensor chip is connected with the circuit board；

Wherein, the circuit board is used to be mounted on the lower section of the display screen, so that at least one described fingerprint sensor Chip is located at the lower section of the display screen, at least one described fingerprint sensor chip is for receiving via above the display screen Human finger reflection or scattering and the fingerprint detection signal that returns, the fingerprint detection signal be used to detect the finger of the finger Line information.

It, can be with after at least one described fingerprint sensor chip is fixedly installed in the circuit board in the embodiment of the present application At least one described fingerprint sensor chip is fixedly installed in the lower section of the display screen of electronic equipment by the circuit board, is kept away Exempt from least one described fingerprint sensor chip to be directly attached on the display screen of the electronic equipment, can reduce described The installation difficulty and complexity of at least one fingerprint sensor chip, and improve maintenanceability.In addition, for it is described at least one Fingerprint sensor chip includes that can one-time fix the multiple chip under the scene of multiple chips and be installed on display screen Lower section can reduce installation complexity, and improve installation effectiveness.

In some possible implementations, the circuit board is in the periphery of at least one fingerprint sensor chip position It installs and is equipped at least one installation part, the installation part is used to for the circuit board being fixedly mounted on the lower section of the display screen.

In some possible implementations, the thickness of the installation part makes at least one described fingerprint sensor chip The distance between lower surface of luminescent layer apart from the display screen is less than or equal to 600um.

In some possible implementations, the installation part is adhesive tape.

In some possible implementations, the fingerprint identification device further include:

Support plate；

At least part setting of the circuit board at least one described fingerprint sensor chip and the support plate it Between.

In some possible implementations, at least one described fingerprint sensor chip and the fixed company of the support plate It connects.

In some possible implementations, the support plate is thick for the surface of metal reinforcement plate and/or the support plate It is 0.15mm~0.3mm that rugosity, which is greater than 0.25um and/or the thickness range of the support plate,.

Bending part；

The both ends of the bending part are respectively used to connect the display screen and the circuit board, so that the circuit board is parallel The lower section of the display screen is set.

In some possible implementations, the bending part includes:

COF layers of flip chip；

The drive integrated circult IC chip of the display screen, described COF layers for being fixed to the electricity for the IC chip Road plate.

In some possible implementations, the bending part further include:

COF layers of the shielded layer；

COF layers of the outside is arranged in the shielded layer, and the IC chip is arranged in described COF layers and the shielded layer Between close to the circuit board position.

In some possible implementations, the bending part further include:

Fixing piece；

Described COF layers of the position close to the IC chip is arranged in the fixing piece, and the fixing piece is used for will be described COF layers one end for connecting the circuit board is fixed on the lower section of the display screen.

In some possible implementations, there is interval between the fixing piece and the driving IC chip.

In some possible implementations, at least one described fingerprint sensor chip includes multiple optical finger print sensings Device chip, the multiple optical fingerprint sensor chip is by being disposed side by side on the upper surface of the support plate, to be spliced into one A optical fingerprint sensor chip component.

In some possible implementations, lenticule battle array is provided with above at least one described fingerprint sensor chip Column.

The top of at least one fingerprint sensor chip is arranged in optical filter, the optical filter.

In some possible implementations, the entering light face of the optical filter is provided with optical inorganic plated film or organic melanism Coating.

In some possible implementations, the optical filter and at least one described fingerprint sensor chip it is described extremely The non-photo-sensing region of a few fingerprint sensor chip carries out dispensing and fixes, and the optical filter and at least one described fingerprint pass There are gaps between the photosensitive region of sensor chip；Or the lower surface of the optical filter is lower than default refractive index by refractive index Glue be fixed on the upper surface of at least one fingerprint sensor chip.

Dispensing is carried out in some possible implementations, between the periphery of the optical filter and the circuit board to fix.

In some possible implementations, the circuit board passes through gold thread and at least one described fingerprint sensor chip It is connected, the height of the sealing of the height of the gold thread and the gold thread is respectively lower than the height of the optical filter.

The connector of the display screen；

The connector is connected with the circuit board, and the connector includes at least one pin, at least one described pipe Foot includes the pin of the fingerprint identification device.

Second aspect provides a kind of electronic equipment, comprising:

Fingerprint identification device and display screen described in possible implementation in first aspect or the first aspect；

Wherein, the lower section of the display screen is arranged in realize fingerprint detection under screen in the fingerprint identification device.

In some possible implementations, the display screen includes:

Display component；

Light shield layer, the light shield layer are set to the lower section of the display component, and the light shield layer is provided with windowing, the finger Line identification device by the windowing receive that the display component issues reflected via human finger after the optical signal that is formed, institute Optical signal is stated for fingerprint recognition；

Wherein, at least one fingerprint sensor chip in the fingerprint identification device is contacted under the display component Surface, alternatively, there are gaps for the lower surface of at least one described fingerprint sensor chip and the display component.

The electronic equipment of the embodiment of the present application, at least one fingerprint that can not only be reduced in the fingerprint identification device pass The installation difficulty and complexity of sensor chip, and can be improved maintenanceability.In addition, at least one described fingerprint sensing Device chip includes that the multiple chip can be one-time fixed to the lower section for being installed on display screen, energy under the scene of multiple chips It is enough to reduce installation complexity, and improve installation effectiveness.

Detailed description of the invention

Fig. 1 is the floor map for the electronic equipment that the application can be applicable in.

Fig. 2 is the side diagrammatic cross-section of electronic equipment shown in FIG. 1.

The display screen and the schematic structure before fingerprint identification device assembly that Fig. 3 is the electronic equipment of the embodiment of the present application Figure.

Fig. 4 is the schematic diagram of the bending part of electronic equipment shown in Fig. 3.

Fig. 5 is the schematic diagram of the fingerprint identification device of electronic equipment shown in Fig. 3.

The display screen and the schematic structure after fingerprint identification device assembly that Fig. 6 is the electronic equipment of the embodiment of the present application Figure.

Specific embodiment

Below in conjunction with attached drawing, technical solutions in the embodiments of the present application is described.

The technical solution of the embodiment of the present application can be applied to various electronic equipments.

For example, the portable or mobiles such as smart phone, laptop, tablet computer, game station calculate equipment, and Other electronic equipments such as electronic databank, automobile, ATM (automatic teller machine) (Automated Teller Machine, ATM).But The embodiment of the present application does not limit this.

The technical solution of the embodiment of the present application can be used for biometrics identification technology.Wherein, biometrics identification technology The including but not limited to identification technologies such as fingerprint recognition, personal recognition, iris recognition, recognition of face and vivo identification.In order to just In explanation, hereafter it is illustrated by taking fingerprint identification technology as an example.

The technical solution of the embodiment of the present application can be used for shielding lower fingerprint identification technology and shield interior fingerprint identification technology.

Fingerprint identification technology, which refers to, under shielding is mounted on fingerprint recognition mould group below display screen, to realize in display screen Fingerprint recognition operation is carried out in display area, does not need the region setting fingerprint collecting in electronic equipment front in addition to display area Region.Specifically, fingerprint recognition mould group carries out fingerprint induction using the light that the top surface of the display component from electronic equipment returns With other inductive operations.The light of this return carries the information of the object (such as finger) contacted with the top surface of display component, position Fingerprint recognition mould group below display component by acquisition and detects the light of this return to realize the lower fingerprint recognition of screen.Its In, the design of fingerprint recognition mould group can be for by being configured to acquire and detect the optical element of the light returned properly come real Existing desired optical imagery.

Correspondingly, (In-display) fingerprint identification technology refers to fingerprint recognition mould group or partial fingerprints identification in screen Mould group is mounted on inside display screen, is carried out fingerprint recognition operation in the display area of display screen to realize, is not needed in electricity Fingerprint collecting region is arranged in region of the sub- equipment front in addition to display area.

Figures 1 and 2 show that shielding the schematic diagram for the electronic equipment 100 that lower fingerprint identification technology can be applicable in, wherein Fig. 1 is The front schematic view of electronic equipment 100, Fig. 2 are the cut-away section structural schematic diagram of electronic equipment 100 shown in FIG. 1.

As depicted in figs. 1 and 2, electronic equipment 100 may include display screen 120 and fingerprint recognition mould group 140.

Display screen 120 can be self light emitting display panel, use with self luminous display unit as display pixel.Than As display screen 120 can for Organic Light Emitting Diode (Organic Light-Emitting Diode, OLED) display screen or Micro-led (Micro-LED) display screen.In other alternate embodiments, display screen 120 or liquid crystal Display screen (Liquid Crystal Display, LCD) or other passive light emitting displays, the embodiment of the present application do not limit this System.

In addition, display screen 120 can also be specially touching display screen, it can not only carry out picture and show, can also examine Touch or the pressing operation for surveying user, to provide a personal-machine interactive interface for user.For example, in one embodiment, Electronic equipment 100 may include touch sensor, the touch sensor can be specially touch panel (Touch Panel, TP), it can be set on 120 surface of display screen, partially can also integrate or be monolithically integrated into the display screen 120 Portion, to form the touching display screen.

Fingerprint recognition mould group 140 can identify mould group, such as optical fingerprint sensor for optical finger print.

Specifically, fingerprint recognition mould group 140 may include having the fingerprint sensor chip (back of optical sensor array Also referred to as optical fingerprint sensor).Wherein, optical sensor array includes multiple optical sensor units, each optical sensor unit Optical detector or photoelectric sensor can be specifically included.In other words, fingerprint recognition mould group 140 may include optical detector (Photo detector) array (or being photodetector array, photosensor arrays) comprising multiple is in array The optical detector of distribution.

As shown in Figure 1, the regional area in the lower section of the display screen 120 can be set in fingerprint recognition mould group 140, thus So that the fingerprint collecting region (or detection zone) 130 of fingerprint recognition mould group 140 is at least partially disposed at the aobvious of the display screen 120 Show in region 102.

Certainly, in other alternate embodiments, fingerprint recognition mould group 140 also be can be set in other positions, such as aobvious The non-transparent region in edge of the side or electronic equipment 100 of display screen 120.In this case, it can will be shown by light path design The optical signal of at least partly display area of display screen 120 directs into fingerprint recognition mould group 140, so that the fingerprint collecting area Domain 130 is physically located in the display area of the display screen 120.

In some embodiments of the present application, fingerprint recognition mould group 140 can only include a fingerprint sensor chip, this When fingerprint recognition mould group 140 fingerprint collecting region 130 area it is smaller and position is fixed, therefore user is carrying out fingerprint input When need for finger to be pressed into the specific position in the fingerprint collecting region 130, otherwise fingerprint recognition mould group 140 possibly can not adopt Collect fingerprint image and causes user experience bad.

In other embodiments of the application, fingerprint recognition mould group 140 can specifically include multiple fingerprint sensor cores Piece；The multiple fingerprint sensor chip can be disposed side by side on the lower section of the display screen 120 by connecting method, and described The induction region of multiple fingerprint sensor chips collectively forms the fingerprint collecting region 130 of the fingerprint recognition mould group 140.Namely It is to say, the fingerprint collecting region 130 of the fingerprint recognition mould group 140 may include multiple subregions, and each subregion is right respectively It should be in the induction region of one of fingerprint sensor chip, thus by the fingerprint collecting region of the optical finger print mould group 130 130 can extend to the main region of the lower half portion of the display screen, that is, the usual pressing area of finger be expanded to, to realize It is blind to be operated by the input of formula fingerprint.Alternatively, when the fingerprint sensor chip quantity is enough, the fingerprint detection region 130 can be extended to half of display area even entire display area, to realize half screen or full frame fingerprint detection.

It should be understood that the embodiment of the present application to the concrete form of the multiple fingerprint sensor chip without limitation.

It, can also be with for example, the multiple fingerprint sensor chip can be the fingerprint sensor chip of individual packages respectively The multiple chips (Die) being packaged in the same chip package body.

In another example can also be made in the different zones of the same chip (Die) by semiconductor technology described in formation Multiple fingerprint sensor chips.

As shown in Fig. 2, the region of the optical sensor array of fingerprint recognition mould group 140 or photoinduction range correspond to institute State the fingerprint collecting region 130 of fingerprint recognition mould group 140.Wherein, the fingerprint collecting region 130 of fingerprint recognition mould group 140 can be with Equal or different to the area or photoinduction range of the region of the optical sensor array of fingerprint recognition mould group 140, this Shen Please embodiment be not specifically limited in this embodiment.

For example, the light path design collimated by light, the fingerprint collecting region 130 of fingerprint recognition mould group 140 can be designed Area at the induction arrays with the fingerprint recognition mould group 140 is almost the same.

In another example the fingerprint can be made by the light path design of the light path design or reflection light that converge light Identify that the area in the fingerprint collecting region 130 of mould group 140 is greater than the area of 140 induction arrays of fingerprint recognition mould group.

The light path design of fingerprint recognition mould group 140 is illustrated below.

With the light path design of fingerprint recognition mould group 140 use with high-aspect-ratio through-hole array optics collimator for Example, the optics collimator can be specially collimator (Collimator) layer being made in semi-conductor silicon chip, have Multiple collimation units or micropore, the collimation unit can be specially aperture, from the reflected reflected light of finger, vertically The light for being incident on the collimation unit can be passed through and be received by fingerprint sensor chip below, and incident angle is excessive Light be attenuated inside the collimation unit by multiple reflections, therefore each fingerprint sensor chip substantially can only The reflected reflected light of fingerprint lines right above it is received, image resolution ratio can be effectively improved, and then improve fingerprint Recognition effect.

It further, can be each fingerprint sensing when fingerprint recognition mould group 140 includes multiple fingerprint sensor chips An optical sensor unit in the optical sensor array of device chip configures a collimation unit, and it is corresponding at its to be bonded setting The top of optical sensor unit.Certainly, the multiple optical sensor unit can also share a collimation unit, i.e., one Collimation unit has sufficiently large aperture to cover multiple optical sensor units.Since a collimation unit can correspond to multiple light Sensing unit is learned, the correspondence of the space periodic of display screen 120 and the space periodic of fingerprint sensor chip is destroyed, therefore, Even if the space structure of the optical sensor array of the space structure and fingerprint sensor chip of the luminescence display array of display screen 120 It is similar, it also can effectively avoid fingerprint recognition mould group 140 from carrying out fingerprint imaging using the optical signal by display screen 120 and generate not That striped, effectively increases the fingerprint recognition effect of fingerprint recognition mould group 140.

By taking light path design of the light path design of fingerprint recognition mould group 140 using optical lens as an example, the optical lens can To include optical lens (Lens) layer, there is one or more lens units, such as one or more non-spherical lens compositions Lens group, be used to that the induction battle array of fingerprint sensor chip below will to be converged to from the reflected reflected light of finger Column, so that the induction arrays can be imaged based on the reflected light, to obtain the fingerprint image of the finger.Institute Pin hole can also be formed in the optical path of the lens unit by stating optical lens mirror layer, and the pin hole can cooperate the optical lens Mirror layer expands the visual field of fingerprint recognition mould group 140, to improve the fingerprint imaging effect of the fingerprint recognition mould group 140.

Further, it when fingerprint recognition mould group 140 includes multiple fingerprint sensor chips, can be passed for each fingerprint Sensor chip configures an optical lens and carries out fingerprint imaging, or configures an optical lens for multiple fingerprint sensor chips To realize light convergence and fingerprint imaging.Even, when there are two induction arrays (Dual for a fingerprint sensor chip tool Array) or when multiple induction arrays (Multi-Array), or the configuration of this fingerprint sensor chip is two or more Optical lens cooperates described two induction arrays or multiple induction arrays to carry out optical imagery, to reduce image-forming range and enhance Imaging effect.

By taking light path design of the light path design of fingerprint recognition mould group 140 using lenticule (Micro-Lens) layer as an example, institute Stating microlens layer can have the microlens array formed by multiple lenticules, can by semiconductor growing process or its His technique is formed in above the induction arrays of the fingerprint sensor chip, and each lenticule can correspond respectively to institute State one of sensing unit of induction arrays.Other optics can also be formed between the microlens layer and the sensing unit Film layer, such as dielectric layer or passivation layer, more specifically, can also include tool between the microlens layer and the sensing unit There is the light blocking layer of micropore, wherein the micropore is formed between its corresponding lenticule and sensing unit, the light blocking layer can be with Stop the optical interference between contiguous microlens and sensing unit, and converges to light in the micropore by the lenticule Portion is simultaneously transferred to the corresponding sensing unit of the lenticule via the micropore, to carry out optical finger print imaging.

It should be appreciated that several implementations of above-mentioned optical path guide structure can be used alone and can also be used in combination, than Such as, microlens layer can be further set below the collimator layer or the optical lens mirror layer.Certainly, in the collimation Device layer when perhaps the optical lens mirror layer is used in combination with the microlens layer its specific laminated construction or optical path may need It is adjusted according to actual needs.

Fingerprint recognition mould group 140 can be used for acquiring the finger print information (such as information in fingerprint) of user.

By taking display screen 120 is using OLED display screen as an example, display screen 120 can be using aobvious with spontaneous light display unit Display screen, such as Organic Light Emitting Diode (Organic Light-Emitting Diode, OLED) display screen or miniature luminous Diode (Micro-LED) display screen.Fingerprint recognition mould group 140 can use OLED display screen be located at fingerprint collecting region The excitation light source that 130 display unit (i.e. OLED light source) detects as optical finger print.

When finger touch, press or close to (for ease of description, referred to collectively herein as pressing) in fingerprint collecting area When domain 130, display screen 120 issues light beam to the finger of 130 top of fingerprint collecting region, this light beam is sent out on the surface of finger It is raw to reflect to form reflected light or form scattering light after the scattering-in of finger, in the related patent applications, for convenient for Description, above-mentioned reflected light and scattering light are referred to as reflected light.Due to fingerprint ridge (ridge) with valley (vally) for the anti-of light Ability difference is penetrated, therefore, reflected light from fingerprint ridge and was occurred from fingerprint valley with different light intensity, reflected light passes through After crossing display screen 120, corresponding electric signal is received and converted to by the fingerprint sensor chip in fingerprint recognition mould group 140, That is fingerprint detection signal；Fingerprint image data can be obtained based on the fingerprint detection signal, and can be with further progress Fingerprint matching verifying, to realize optical finger print identification function in the electronic equipment 100.

It can be seen that only being needed when user needs to carry out unlocked by fingerprint or other fingerprint authentications to electronic equipment 100 By finger pressing in the fingerprint collecting region 130 for being located at display screen 120, the input operation of fingerprint characteristic can be realized.By It can be realized in the inside of the display area of display screen 120 102 in the acquisition of fingerprint characteristic, electronic equipment using the above structure 100 are arranged fingerprint key (such as Home key) without the special reserved space in its front, thus can be using screen scheme comprehensively.Cause This, the display area 102 of the display screen 120 can extend substantially to the entire front of the electronic equipment 100.

Certainly, in other alternative solutions, fingerprint recognition mould group 140 can also using built-in light source or external light source come Optical signal for carrying out fingerprint detection identification is provided.In this case, fingerprint recognition mould group 140 not only can be adapted for as The self light emitting display panels such as OLED display screen can be applicable to non-spontaneous smooth display screen, such as liquid crystal display or others Passive light emitting display.

For applying in the liquid crystal display with backlight module and liquid crystal display panel, under the screen to support liquid crystal display Fingerprint detection, the optical fingerprint systems of electronic equipment 100 can also include the excitation light source for optical finger print detection, described to swash The light source that light source can be specially infrared light supply or specific wavelength non-visible light is encouraged, can be set in the liquid crystal display Backlight module below or the fringe region that is arranged in below the cover sheet of electronic equipment 100, and fingerprint recognition mould group 140 It can be set below the fringe region of liquid crystal display panel or cover sheet and guided by optical path so that fingerprint detection light can be with Reach the fingerprint recognition mould group 140；Alternatively, fingerprint recognition mould group 140 also can be set below the backlight module, and institute Backlight module is stated by carrying out aperture or other optical designs to film layers such as diffusion sheet, blast piece, reflector plates to allow fingerprint Detection light passes through liquid crystal display panel and backlight module and reaches fingerprint recognition mould group 140.It is adopted when using the fingerprint recognition mould group 140 When providing the optical signal for carrying out fingerprint detection with built-in light source or external light source, testing principle can be identical.

As shown in Figure 1, electronic equipment 100 can also include cover sheet 110.

Cover board 110 can be specially transparent cover plate, such as glass cover-plate or sapphire cover board, be located at display screen 120 Top and cover the front of the electronic equipment 100, and 110 surface of cover board is also provided with protective layer.Therefore, the application In embodiment, so-called finger pressing display screen 120 can actually refer to that finger presses cover board square on the display screen 120 110 or the covering cover board 110 protective layer.

As shown in Figure 1, the lower section of fingerprint recognition mould group 140 is also provided with circuit board 150, such as flexible circuit board (Flexible Printed Circuit, FPC).

Fingerprint recognition mould group 140 can by pad solder to circuit board 150, and by circuit board 150 realize and other The electrical interconnection and signal transmission of the other elements of peripheral circuit or electronic equipment 100.For example, fingerprint recognition mould group 140 can To receive the control signal of the processing unit of electronic equipment 100 by circuit board 150, and can also be incited somebody to action by circuit board 150 The processing unit of fingerprint detection signal output electron equipment 100 from fingerprint recognition mould group 140 or control unit etc..

In certain embodiments, fingerprint identification device 140 can directly fix the lower surface for being fitted in display screen 120.

But since 120 cost of display screen is very high and very fragile, therefore fingerprint recognition mould group 140 is directly fitted to aobvious It is easy to make a mess of display screen 120 when display screen 120.

Further, since fingerprint recognition mould group 140 and display screen 120 are fully adhered to together, such as there is fingerprint recognition mould group 140 Damage is easy to damage display screen 120 when dismantling fingerprint recognition mould group 140.

Also, the attaching process that fingerprint recognition mould group 140 is directly attached to display screen 120 is also more complicated.

Due to problem above, the cost and complexity of electronic equipment 100 are considerably increased, maintenanceability is low.

This application provides a kind of fingerprint identification devices, can reduce the cost and complexity of electronic equipment 100, improve Maintenanceability.

The fingerprint identification device 200 and electronic equipment 300 of the embodiment of the present application are described in detail below with reference to Fig. 3 to Fig. 6. It should be noted that for purposes of illustration only, in the embodiment of the present application, identical appended drawing reference for indicating identical component, and And for sake of simplicity, in different embodiments, omit the detailed description to same parts.

The display screen and the schematic structure before fingerprint identification device assembly that Fig. 3 is the electronic equipment of the embodiment of the present application Figure.The electronic equipment of the embodiment of the present application and fingerprint identification device are illustrated with reference to the accompanying drawing.

As shown in figure 3, the electronic equipment 200 includes display screen 210 and fingerprint identification device 220.The fingerprint recognition Device 220 includes the circuit board 240 and fingerprint sensor chip 221.The fingerprint sensor chip 221 is arranged in the electricity The top of road plate 240；The fingerprint sensor chip 221 is connected with the circuit board 240.

The fingerprint sensor chip 221 may include one or more optical fingerprint sensor chip.Each optics Fingerprint sensor chip may include one or more optical fingerprint sensor or optical fingerprint sensor array.

When the fingerprint sensor chip 221 includes multiple optical fingerprint sensor chips, the multiple optical finger print is passed Sensor chip can be by way of being arranged side by side in the upper surface of the circuit board 240, to be spliced into an optical finger print biography Sensor chip assembly.

Wherein, the circuit board 240 is used to be mounted on the lower section of the display screen 210, so that the fingerprint sensor core Piece 221 is located at the lower section of the display screen 210.The fingerprint sensor chip 221 is for receiving via the display screen 210 The human finger reflection of side or the fingerprint detection signal of scattering and return, the fingerprint detection signal are used to detect the finger Finger print information.The circuit board 240 can be the circuit board of any component, for example, the circuit board of the display screen 210 or institute State the circuit board of fingerprint sensor chip 221.In another example the circuit board 240 is display screen and the fingerprint sensor chip 221 common boards, with the structure of the simplification electronic equipment.

For example, the aobvious of electronic equipment 200 can be arranged in the fingerprint sensor chip 221 by the circuit board 240 The lower section of the intermediate region of display screen 210 is held with meeting the use habit of user convenient for user.

For example, the circuit board 240 is arranged between the display screen 210 and the fingerprint sensor chip 221.Example again Such as, the fingerprint sensor chip 221 is arranged between the circuit board 240 and the display screen 210.

Optionally, what the fingerprint sensor 221 was contactless is arranged in the lower section of the display screen 210.

In the embodiment of the present application, after the fingerprint sensor chip 221 is fixedly installed in the circuit board 240, Ke Yitong The lower section that the fingerprint sensor chip 221 is fixedly installed in the display screen 210 of electronic equipment by the circuit board 240 is crossed, is kept away Exempt from for the fingerprint sensor chip 221 to be directly attached on the display screen 210, can reduce the fingerprint sensor core The installation difficulty and complexity of piece 221, and improve maintenanceability.

In addition, be directed under the scene that the fingerprint sensor chip 221 includes multiple chips, it can be by the multiple chip The lower section for being installed on display screen 210 is one-time fixed, can reduce installation complexity, and improve installation effectiveness.

Optionally, in some embodiments of the present application, the top of the fingerprint sensor chip 221 can be set micro- Lens array.The fingerprint sensor chip 221 by the microlens array receive it is that the display screen 210 issues and via The human finger reflection of 210 top of display screen or the fingerprint detection signal of scattering and return, can collect the institute of wide-angle Fingerprint detection signal is stated, and then improves fingerprint recognition efficiency.

It should be understood that fingerprint sensor chip 211 shown in Fig. 3 can be Fig. 1 and fingerprint identification device shown in Fig. 2 140 In fingerprint sensor chip 210, circuit board 240 can be Fig. 1 and circuit board shown in Fig. 2 150, correlation function and structure Illustrating can be with reference to aforementioned associated description, for sake of simplicity, details are not described herein.

It should also be understood that Fig. 3 is only a kind of example of the application, the limitation to the application should not be construed as.

For example, the fingerprint sensor chip 211 and the circuit board can be set side by side in other alternate embodiments It sets on the supporting plate.

In another example the fingerprint sensor chip 211 can also be by being fixed on electronics in other alternate embodiments On other components such as center, rear cover or the battery of equipment, so that the fingerprint sensor chip 211 is arranged in the electronic equipment Display screen lower section.

Optionally, the fingerprint identification device 220 further includes bending part.

The both ends of the bending part are respectively used to connect the display screen 210 and the circuit board 240, so that the circuit Plate 240 is arranged in parallel in the lower section of the display screen 210.The shape of the bending part can be the deformation of U-shaped or U-shaped.With The shape of the bending part is for U-shaped, the both ends of the bending part is parallel to each other, and the both ends of the bending part are distinguished as a result, When for connecting the display screen 210 and the circuit board 240, it is described aobvious can to guarantee that the circuit board 240 is arranged in parallel in The lower section of display screen 210.

As shown in figure 4, the bending part may include flip chip (Chip On FPC, COF) layer 231 and the display Drive integrated circult (Integrated Circuit, IC) chip 234 of screen 210.

The COF layer 231 can be used for the IC chip 234 being fixed to the circuit board 240.

In other words, the bending part is available with the COF layer 231 and makees carrier, and the IC chip 234 is directly encapsulated To form chip package product on the COF layer 231.The i.e. described COF layer 231 can be used for carrying the IC chip 234.Its In, the COF layer 231 is referred to as COF flexible encapsulating substrate, and COF flexible encapsulating substrate refers to non-chip, component Encapsulation type flexible base board is used as the important component of printed circuit board (Printed circuit board, PCB).

In addition, in the process of chip packaging, the COF layer 231 can be also used for the IC chip 234 being electrically connected to institute State circuit board 240.The IC chip 234 can be made to be joined to the circuit board 240 by the COF layer 231, so that institute Stating IC chip can be communicated with the circuit board 240.

It, can be using the bending part as a part of the circuit board 240 in the application.

After the fingerprint sensor chip 221 is fixed on the circuit board 240, by bending the circuit Plate 240, so that the fingerprint sensor chip 221 is capable of fixing the lower section that the display screen 210 is arranged in.For example, can lead to Cross the lower section that the circuit board 240 after bending is fitted in the display screen 210 by adhesive tape.In the embodiment of the present application, pass through electricity The fingerprint sensor chip 221 is mounted on the lower section of the display screen 210 by road plate, and installation cost and complexity are low, and Improve its maintenanceability.

Optionally, as shown in figure 4, the bending part can also include COF layers of the shielded layer 232.The shielded layer 232 are used to support the IC chip 234, and make the IC chip 234 and other components of the electronic equipment 200 exhausted Edge.

At this point, the shielded layer 232 can be set in the outside of the COF layer 231, the IC chip 234 be can be set Close to the position of the circuit board 240 between the COF layer 231 and the shielded layer 232.

It should be understood that the shielded layer 232 can be set in the position close to the IC chip 234 of the COF layer 231, The i.e. described shielded layer 232 can be set on the portion in the outside of the COF layer 231, can also be whole at described COF layers A outside is respectively provided with the shielded layer 232.The embodiment of the present application is not specifically limited in this embodiment.

Optionally, as shown in figure 4, the bending part can also include fixing piece 233.

The fixing piece 233 can be set in the position close to the IC chip 234 of the COF layer 231, the fixation Part 233 is for one end for being used to connect the circuit board 240 of the COF layer 231 to be fixed under the display screen 210 Side.

During the installation process or after being installed, by the fixing piece 233, it can guarantee the bending of the bending part Degree remains unchanged, and then ensure that the position of the relatively described display screen of the fingerprint sensor chip 221 is fixed.It keeps away as a result, Exempt from the fingerprint sensor chip 221 to change position in use, can be improved fingerprint recognition effect.

Optionally, there is interval between the fixing piece 233 and the driving IC chip 234.The fixing piece 233 can be with Including one or more component for fixing.The fixing piece 233 can will be described by way of buckling or pasting One end for connecting the circuit board 240 of COF layer 231 is fixed on the lower section of the display screen 210.For example, the fixation Part 233 can be fixed on the protective layer 217 of the display screen 210, can also be fixed on the electronic equipment 200 center or On the other components such as battery, the embodiment of the present application is not specifically limited in this embodiment.

It is described in detail below with reference to specific structure of the Fig. 4 to the display screen 210 of the embodiment of the present application.

As shown in figure 4, the display screen 210 may include display component 215 and light shield layer 216.

The light shield layer 216 is set to the lower section of the display component 215, and the light shield layer 216 is provided with windowing, described Fingerprint identification device 220 by the windowing receive that the display component 215 issues reflected via human finger after formed Optical signal, the optical signal are used for fingerprint recognition.

Wherein, the fingerprint sensor 221 in the fingerprint identification device 220 is contacted with the following table of the display component 215 Face, alternatively, there are gaps for the lower surface of the fingerprint sensor 221 and the display component 215.Its gap, which can be, to be not filled with The air gap (air gap) of any auxiliary material can guarantee when display screen is depressed or electronic equipment falls Be not in the lower surface that fingerprint sensor 221 touches display screen when falling or colliding, fingerprint sensor 221 will not be influenced Fingerprint recognition stability and performance.

The display component 215 can be the luminescent layer of the display screen 210, for example, the display component 215 can be Using OLED organic luminous panel made of low-temperature polysilicon silicon technology (Low Temperature Poly-silicon, LTPS), Its thickness ultrathin, light-weight, low power consumption, may be used to provide relatively clear image.The fingerprint sensor chip 221 and institute State between display component 215 there are when gap, the gap can be less than or equal to preset threshold, the preset threshold include but It is not limited to 600um.

The light shield layer 216 is also used as screen printing (screen print) layer or embossed layers, the screen printing Layer can have picture and text, and the picture and text may be used as the mark such as pictorial trademark.The light shield layer 216 can be for covering light Black flaky layer or printing layer.

Optionally, as shown in figure 5, the display screen 210 can also include protective layer 217, for protecting the display screen 210.Similar to the light shield layer 216, the protective layer 217 is also equipped with windowing, and the fingerprint identification device 220 passes through described The optical signal formed after what windowing received that the display component 215 issues reflect via human finger, the optical signal is for referring to Line identification.In other embodiments, the protective layer 217 can also be known as buffering (cushion) layer or rear panel, Huo Zheke With the integrally-formed light shield layer 216 and the protective layer 217.

The protective layer 217 can also include heat dissipating layer.For example, the protective layer 217 may include at least part by The heat dissipating layer that metal material is formed.

It optionally, may include for described as shown in figure 4, the display screen 210 can also include wiring layer 214 The wiring of the electrical connection of fingerprint sensor chip 221 and/or the display screen 210.

Optionally, as shown in figure 4, the display screen 210 can also include being polaroid (Polarizer, POL) 213.Partially Mating plate is referred to as polarized light piece, for generating polarised light.The polarised light is imaged for optical signal.

Optionally, as shown in figure 4, the display screen 210 can also include cover-plate glass 211, the cover-plate glass 211 is used In the protection display screen 210.

Optionally, as shown in figure 4, Optical transparent adhesive can be passed through between the cover-plate glass 211 and the polarizing film 213 (Optically Clear Adhesive, OCA) 212 is bonded.The OCA 212, which can be, is made into optics acrylic glue Without substrate, a kind of two-sided fitting adhesive tape of the no basis material then formed after upper and lower bottom is respectively bonded one layer of release film, In brief, the OCA 212 can be one layer with optical clear property without substrate double-sided adhesive.

Alternatively, the OCA 212 can be any viscose glue for cementing transparent optical element (such as camera lens) Agent can be as long as it is good that there is colorless and transparent, light transmission rate to be greater than certain threshold value (such as 90% or more), cementing strength Solidify under room temperature or medium temperature, and has the features such as cure shrinkage is small.For example, the OCA 212 is substitutable for optical lens ming tree Rouge (OCR).

Fingerprint identification device shown in Fig. 3 is described in detail below.

Fig. 5 is the schematic diagram of the fingerprint identification device 220 of electronic equipment shown in Fig. 3.

As shown in figure 5, the circuit board 240 is provided at least one in the peripheral position of the fingerprint sensor chip 221 A installation part 227, the installation part 227 are used to for the circuit board 240 being fixedly mounted on the lower section of the display screen 210.

For example, the installation part 227 is adhesive tape.

The thickness of the installation part 227 makes the fingerprint sensor chip 221 apart from the luminescent layer of the display screen 210 The distance between lower surface be less than or equal to 600um.

Optionally, as shown in figure 5, the fingerprint identification device 220 can also include support plate 229.

At least part setting of the circuit board 240 the fingerprint sensor chip 221 and the support plate 229 it Between.The i.e. described fingerprint sensor chip 221 can be set in the upper surface of the circuit board 240.

Optionally, as shown in figure 5, the fingerprint sensor chip 221 can pass through chip adhesive film (Die Attach Film, DAF) 222 upper surfaces for being pasted onto the circuit board 240.Pass through between the support plate 229 and the circuit board 240 Conducting resinl (electroconductive adhesive) 228 is bonded.

The DAF 222 can be in semiconductor packaging process for connecting semiconductor chip and package substrate, chip With any ultrathin film binder of chip, the fingerprint sensor chip 221 is encapsulated with lamination, slimming.It is described to lead Electric glue 228 can be a kind of adhesive with certain electric conductivity after solidifying or being dry.

Optionally, in the present embodiment, the fingerprint sensor chip 221 can also be with the fixed company of the support plate 229 It connects.

For example, the circuit board 240 can be set through-hole, the fingerprint sensor chip 221 by the through-hole with The support plate 229 is fixedly linked.In another example the fingerprint sensor chip 221 can around the circuit board 240 with it is described Support plate 229 is fixedly connected.

The support plate 229 includes but is not limited to metal reinforcement plate, and the thickness range of the support plate 229 can be 0.075mm~0.3mm.For example, the metal reinforcement plate can be for rigid stiffening plate, the thickness range of the support plate 229 0.15mm~0.3mm, to control the thickness of the fingerprint identification device 220.

The surface roughness (Ra) of support plate 229 is greater than a certain threshold value, such as 0.25um, to improve imaging effect；Specifically For, when the surface roughness of support plate 229 is greater than a certain threshold value, optical signal can be scattered by surface, can be effective Reduce display screen 210 issue and in the optical signal that the inside of fingerprint identification device 220 is reflected, and then avoid light reflect pair Imaging impacts；In addition, when the surface roughness of support plate 229 is greater than a certain threshold value, can increase the support plate 229 with Connection reliability between other component.Such as the support plate 229 and the fingerprint sensor chip 221 and the circuit board Connection reliability and the support plate 229 between 240 and the connection between the component for fixing the support plate 229 can By degree.

The color of support plate 229 can be dark color, to increase the extinction effect of the support plate 229, and then avoid described The light that support plate 229 reflects upwards generates interference to the light that the fingerprint sensor chip 221 receives.Such as black or Dark-brown.

Optionally, as shown in figure 5, the fingerprint identification device 220 further include:

The top of the fingerprint sensor chip 221 is arranged in optical filter 223, the optical filter 223.

The optical filter 223 may include one or more optical filters, and one or more optical filters can match Be set to such as bandpass filters, with the transmission for the light for allowing OLED screen to emit, while stop infrared light in sunlight etc. other Light component.When the fingerprint identification device 220 under outdoor application screen, this optical filtering be can be effectively reduced by the sun Bias light caused by light.One or more optical filters can be implemented as such as optical filtering coating, optical filtering coating shape At on one or more continuous interfacials, or can be implemented as on one or more discrete interfaces.It should be understood that optical filter 223 It can be produced on the surface of any optical component, or along to the reflected light reflected to form via finger at the fingerprint On the optical path of sensor chip 221.

In the embodiment of the present application, optical filter 223 is used to reduce the undesirable environment light in fingerprint induction, to improve State optical sensor of the fingerprint sensor chip 221 to the light received.Optical filter 223 specifically can be used for filtering out specific wavelength Light, for example, near infrared light and partial feux rouges etc..For example, in the energy of light of human finger's absorbing wavelength lower than 580nm It is most of, if one or more optical filters or optical filter layer are designed to wavelength-filtered from 580nm to infrared light, Influence of the environment light to the optical detection in fingerprint induction can then be greatly reduced.

In addition, optical inorganic plated film or organic melanism coating has can be set in the entering light face of the optical filter 223, so that The reflectivity in the entering light face of optical filter 223 is lower than first threshold, such as 1%, so as to guarantee the fingerprint sensor chip 221 can receive enough optical signals, and then promote fingerprint recognition effect.

The optical filter 223 and the fingerprint sensor chip 221 are in the non-photo-sensing area of the fingerprint sensor chip 221 Domain carries out dispensing and fixes, and there are gaps between the optical filter 223 and the photosensitive region of the fingerprint sensor chip 221. Or the lower surface of the optical filter 223 is fixed on the fingerprint sensor core by the glue that refractive index is lower than default refractive index The upper surface of piece 221, for example, the default refractive index includes but is not limited to 1.3.Or periphery and the institute of the optical filter 223 Progress dispensing between circuit board 240 is stated to fix.

It should be noted that optical filter 223 is fitted in the upper surface of fingerprint sensor chip 221 by optical cement filling When, once the glue thickness ununiformity that the upper surface of fingerprint sensor chip 221 covers is even, there can be Newton's ring phenomenon, to influence to refer to Line recognition effect.In the embodiment of the present application, the optical filter 223 can be fitted in the fingerprint sensor by overhead mode The upper surface of chip 221, and then can ensure to be air layer between fingerprint sensor chip 221, it avoids the occurrence of Newton's ring and asks Topic, to improve fingerprint recognition effect.

Optionally, as shown in figure 5, the circuit board 240 is connected by gold thread 226 with the fingerprint sensor chip 221, The height of the sealing 225 of the height and gold thread 226 of the gold thread 226 is respectively lower than the height of the optical filter 223.

Specifically, the gold thread 226 is for realizing logical between the fingerprint sensor chip 221 and circuit board 240 Letter, and realized and the other elements in other peripheral circuits or electronic equipment as shown in Figure 1 or 2 by circuit board 220 Electrical interconnection and signal transmission.It is set for example, the fingerprint sensor chip 221 can receive electronics by the gold thread 226 The control signal of standby processing unit, and can also be by the gold thread 226 by fingerprint detection signal (such as fingerprint image) Export the processor of the image processor or electronic equipment 300 to the fingerprint identification device 220.

In the present embodiment, the gold thread 226 is encapsulated by the sealing 225, can effectively ensure that 240 He of circuit board Connection reliability between the fingerprint sensor chip 221.

As shown in fig. 6, the display screen 210 can be soft screen and be also possible to so that the display screen 210 is OLED screen as an example Hard screen, the display screen may include the laminations such as screen printing (screen print) layer 216, protective layer 217.It is above-mentioned each folded After layer aperture, OLED screen can reveal light downward.When finger is put in above the OLED screen of bright screen, finger will reflect OLED screen hair Light out, this reflected light can penetrate OLED screen below OLED screen.Filter plate 223 below OLED screen can be used in by Infrared signal ingredient in light leakage filters out.Since fingerprint is a diffuse reflector, formation is reflected or diffused via finger Optical signal can all exist in all directions.The microlens array being arranged between fingerprint sensor chip 221 below OLED screen (Micro lens Array) can collect the optical signal of coming that leaks down above OLED screen.The fingerprint sensor chip as a result, 221 filter out the optical signal of red light by receiving, and carry out the imaging of fingerprint image.

It should be noted that the optical signal come that leaks down above OLED screen includes fingerprint signal and shields internal structure signal, and Architecture signals can have an impact the imaging of fingerprint image in shielding, for example, generating mole item when carrying out the imaging of fingerprint image Line.In the present embodiment, pass through control installation part 227 (such as joint adhesive for being bonded fingerprint identification device) and each part ruler It is very little, so that the distance of the fingerprint sensor chip 221 and OLED screen (for example, lower surface of the display component 215) exists Within 600um, and then the image blur of the screen structure made, but the imaging of the structure of fingerprint is unaffected.Since the fingerprint passes The distance between sensor chip 221 and OLED screen are smaller, and fingerprint recognition performance is better, therefore allow in reliability and process capability Under the premise of, the distance between the fingerprint sensor chip 221 and OLED screen can be reduced as far as possible.

Optionally, as shown in fig. 6, the fingerprint identification device 220 further includes the connector 250 of the display screen 210；Institute It states connector 250 to be connected with the circuit board 240, the connector 250 includes at least one pin, at least one described pin Pin including the fingerprint identification device 220.Thereby, it is possible to effectively reduce the quantity of the connector of electronic equipment internal, into And simplify the internal structure of the electronic equipment.

It should be understood that Fig. 3 to Fig. 6 is only the example of the application, the limitation to the application should not be construed as.

For example, the fingerprint identification device 220 can also include including image procossing in other alternate embodiments Device, described image processor can be set on circuit board 240.Described image processor can be specially microprocessor (Micro Processing Unit, MCU), pass through the circuit board 240 transmission from the fingerprint sensor chip 221 for receiving Fingerprint detection signal (such as fingerprint image), and fingerprint recognition is carried out based on fingerprint detection signal.

Specifically, the fingerprint sensor chip 221 is received from the reflected reflected light of user's finger first and is based on Received optical signal is imaged, to generate fingerprint image；Then, fingerprint image is sent to figure by the circuit board 240 As processor, so that image processor carries out image procossing and obtains fingerprint signal；Finally, being carried out by algorithm to fingerprint signal Fingerprint recognition.

In another example the fingerprint identification device 220 can also include at least one capacitor, at least one described capacitor It can be set on the circuit board 220, the fingerprint detection signal acquired for optimizing the fingerprint sensor chip 221.Example Such as, the fingerprint detection signal that at least one described capacitor is used to acquire the fingerprint sensor chip 221 is filtered place Reason.

It should be understood that the specific example in the embodiment of the present application is intended merely to that those skilled in the art is helped to more fully understand The embodiment of the present application, rather than limit the range of the embodiment of the present application.

It should be understood that the term used in the embodiment of the present application and the appended claims is only merely for the specific reality of description The purpose for applying example, is not intended to be limiting the embodiment of the present application.For example, being made in the embodiment of the present application and the appended claims The "an" of singular, " above-mentioned " and " described " are also intended to including most forms, unless context clearly shows that it His meaning.

Those of ordinary skill in the art may be aware that list described in conjunction with the examples disclosed in the embodiments of the present disclosure Member can be realized with electronic hardware, computer software, or a combination of the two, can in order to clearly demonstrate hardware and software Interchangeability generally describes each exemplary composition and step according to function in the above description.These functions are actually It is implemented in hardware or software, the specific application and design constraint depending on technical solution.Professional technician Each specific application can be used different methods to achieve the described function, but this realization is it is not considered that exceed Scope of the present application.

In several embodiments provided herein, it should be understood that arriving, disclosed system, device can pass through Other modes are realized.For example, the apparatus embodiments described above are merely exemplary, for example, the division of the unit, Only a kind of logical function partition, there may be another division manner in actual implementation, such as multiple units or components can be with In conjunction with or be desirably integrated into another system, or some features can be ignored or not executed.In addition, shown or discussed Mutual coupling, direct-coupling or communication connection can be through some interfaces, the INDIRECT COUPLING of device or unit or logical Letter connection is also possible to electricity, mechanical or other form connections.

The unit as illustrated by the separation member may or may not be physically separated, aobvious as unit The component shown may or may not be physical unit, it can and it is in one place, or may be distributed over multiple In network unit.Some or all of unit therein can be selected to realize the embodiment of the present application scheme according to the actual needs Purpose.

It, can also be in addition, each functional unit in each embodiment of the application can integrate in one processing unit It is that each unit physically exists alone, is also possible to two or more units and is integrated in one unit.It is above-mentioned integrated Unit both can take the form of hardware realization, can also realize in the form of software functional units.

If the integrated unit is realized in the form of SFU software functional unit and sells or use as independent product When, it can store in a computer readable storage medium.Based on this understanding, the technical solution of the application is substantially The all or part of the part that contributes to existing technology or the technical solution can be with the shape of software product in other words Formula embodies, and the computer software product is stored in a storage medium, including some instructions are used so that a meter It calculates machine equipment (can be personal computer, server or the network equipment etc.) and executes each embodiment the method for the application All or part of the steps.And storage medium above-mentioned includes: USB flash disk, mobile hard disk, read-only memory (ROM, Read-Only Memory), random access memory (RAM, Random Access Memory), magnetic or disk etc. are various can store journey The medium of sequence code.

The above, the only specific embodiment of the application, but the protection scope of the application is not limited thereto, it is any Those familiar with the art within the technical scope of the present application, can readily occur in various equivalent modifications or replace It changes, these modifications or substitutions should all cover within the scope of protection of this application.Therefore, the protection scope of the application should be with right It is required that protection scope subject to.

Claims

1. a kind of fingerprint identification device is applied in the electronic equipment with display screen, which is characterized in that the fingerprint identification device Include:

Circuit board；

The top of the circuit board is arranged at least one fingerprint sensor chip, at least one described fingerprint sensor chip；

Wherein, the circuit board is used to be mounted on the lower section of the display screen, so that at least one described fingerprint sensor chip Positioned at the lower section of the display screen, at least one described fingerprint sensor chip is for receiving via the people above the display screen The fingerprint detection signal of the reflection of body finger or scattering and return, the fingerprint detection signal are used to detect the fingerprint letter of the finger Breath.

2. fingerprint identification device according to claim 1, which is characterized in that the circuit board is at least one described fingerprint The peripheral position of sensor chip is provided at least one installation part, and the installation part is for the circuit board to be fixedly mounted on The lower section of the display screen.

3. fingerprint identification device according to claim 2, which is characterized in that the thickness of the installation part make it is described at least The distance between the lower surface of luminescent layer of one fingerprint sensor chip apart from the display screen is less than or equal to 600um.

4. fingerprint identification device according to claim 2, which is characterized in that the installation part is adhesive tape.

5. fingerprint identification device according to any one of claim 1 to 4, which is characterized in that the fingerprint identification device Further include:

Support plate；

At least part of the circuit board is arranged between at least one described fingerprint sensor chip and the support plate.

6. fingerprint identification device according to claim 5, which is characterized in that at least one described fingerprint sensor chip with The support plate is fixedly connected.

7. fingerprint identification device according to claim 5, which is characterized in that the support plate is metal reinforcement plate, and/or It is 0.15mm~0.3mm that the surface roughness of the support plate, which is greater than 0.25um and/or the thickness range of the support plate,.

8. fingerprint identification device according to any one of claim 1 to 7, which is characterized in that the fingerprint recognition Device further include:

Bending part；

The both ends of the bending part are respectively used to connect the display screen and the circuit board, so that the circuit board is arranged in parallel In the lower section of the display screen.

9. fingerprint identification device according to claim 8, which is characterized in that the bending part includes:

COF layers of flip chip；

The drive integrated circult IC chip of the display screen, described COF layers for being fixed to the circuit board for the IC chip.

10. fingerprint identification device according to claim 9, which is characterized in that the bending part further include:

COF layers of the shielded layer；

COF layers of the outside is arranged in the shielded layer, and the IC chip is arranged at described COF layers between the shielded layer Close to the position of the circuit board.

11. fingerprint identification device according to claim 9, which is characterized in that the bending part further include:

Fixing piece；

Described COF layers of the position close to the IC chip is arranged in the fixing piece, and the fixing piece is used for will be COF layers described One end for connecting the circuit board be fixed on the lower section of the display screen.

12. fingerprint identification device according to claim 11, which is characterized in that the fixing piece and the driving IC chip Between exist interval.

13. fingerprint identification device according to any one of claim 1 to 12, which is characterized in that it is described at least one refer to Line sensor chip includes multiple optical fingerprint sensor chips, and the multiple optical fingerprint sensor chip is by being arranged side by side In the upper surface of the support plate, to be spliced into an optical fingerprint sensor chip component.

14. fingerprint identification device according to any one of claim 1 to 13, which is characterized in that it is described at least one refer to Microlens array is provided with above line sensor chip.

15. according to claim 1 to fingerprint identification device described in any one of 14, which is characterized in that the fingerprint recognition dress It sets further include:

16. fingerprint identification device according to claim 15, which is characterized in that the entering light face of the optical filter is provided with light Learn inorganic plated film or organic melanism coating.

17. fingerprint identification device according to claim 15, which is characterized in that the optical filter and it is described at least one refer to Line sensor chip carries out dispensing in the non-photo-sensing region of at least one fingerprint sensor chip and fixes, and the optical filter There are gaps between the photosensitive region of at least one fingerprint sensor chip；Or the lower surface of the optical filter passes through The glue that refractive index is lower than default refractive index is fixed on the upper surface of at least one fingerprint sensor chip.

18. fingerprint identification device according to claim 15, which is characterized in that the periphery of the optical filter and the circuit Dispensing is carried out between plate to fix.

19. according to claim 1 to fingerprint identification device described in any one of 18, which is characterized in that the circuit board passes through Gold thread is connected at least one described fingerprint sensor chip, the height difference of the sealing of the height of the gold thread and the gold thread Lower than the height of the optical filter.

20. according to claim 1 to fingerprint identification device described in any one of 19, which is characterized in that the fingerprint recognition dress It sets further include:

The connector of the display screen；

The connector is connected with the circuit board, and the connector includes at least one pin, at least one described pin packet Include the pin of the fingerprint identification device.

21. a kind of electronic equipment characterized by comprising

Fingerprint identification device described in any one of claims 1 to 20 and display screen；

22. electronic equipment as claimed in claim 21, which is characterized in that the display screen includes:

Display component；

Light shield layer, the light shield layer are set to the lower section of the display component, and the light shield layer is provided with windowing, and the fingerprint is known Other device by the windowing receive that the display component issues reflected via human finger after the optical signal that is formed, the light Signal is used for fingerprint recognition；

Wherein, at least one fingerprint sensor chip in the fingerprint identification device is contacted with the following table of the display component Face, alternatively, there are gaps for the lower surface of at least one described fingerprint sensor chip and the display component.