CN112995373B

CN112995373B - Display screen assembly and electronic equipment

Info

Publication number: CN112995373B
Application number: CN202110167219.0A
Authority: CN
Inventors: 李从波; 马志廷
Original assignee: Vivo Mobile Communication Co Ltd
Current assignee: Vivo Mobile Communication Co Ltd
Priority date: 2021-02-05
Filing date: 2021-02-05
Publication date: 2023-07-07
Anticipated expiration: 2041-02-05
Also published as: CN112995373A

Abstract

The application discloses display screen subassembly and electronic equipment, wherein the display screen subassembly includes: the display screen comprises an outer screen cover plate and an inner screen assembly, and the inner screen assembly is provided with a mounting hole; the screen circuit board is arranged on one side of the display screen, which is away from the outer screen cover plate; the fingerprint identification device comprises a chip module and a control module which are electrically connected. In the application, on one hand, the chip module is arranged in the mounting hole, so that the space between the screen circuit board and the display screen is fully utilized, fingerprint identification can be completed without perforating on the middle frame, and the whole strength is improved; on the other hand, the chip and the control module are respectively positioned at the outer side and the inner side of the screen circuit board, which is beneficial to the integrated design of different parts, omits an assembly link, reduces the possibility of fingerprint identification failure caused by improper assembly, and can improve the compactness of the structure; furthermore, the space occupied by the auxiliary plate is reduced, the volume of the cavity of the loudspeaker is increased, and the tone quality of the equipment is improved.

Description

Display screen assembly and electronic equipment

Technical Field

The application belongs to the technical field of electronic equipment, and particularly relates to a display screen assembly and electronic equipment.

Background

With the increasing of mobile phone application scenes, the mobile phone security problem is getting more attention. The traditional mobile phone unlocking adopts pattern unlocking and password unlocking, and the unlocking modes are easily seen by other people, so that information leakage is caused. In recent years, fingerprint recognition and face recognition are gradually rising, and the common face recognition has potential safety hazards, and particularly, non-living bodies or people with similar faces can realize face recognition unlocking. The uniqueness of the human body fingerprint exists, so that the fingerprint identification is safer than the common facial identification technology, and the fingerprint identification is one of the root causes of wide application.

The fingerprint identification technology commonly used in the market at present comprises common fingerprints, side fingerprints, under-screen photoelectric fingerprints, ultrasonic fingerprints and the like. With the popularization of the full screen, the stacking position of the common pressing fingerprints is transferred to the side face and the back face of the mobile phone. The under-screen photoelectric fingerprint technology is mature, the cost is proper and the application is convenient, so that the under-screen photoelectric fingerprint technology gradually becomes a preferred fingerprint scheme of each mobile phone manufacturer.

In the related art, the under-screen photoelectric fingerprint mainly has two forms, namely a lens type photoelectric fingerprint and an ultrathin photoelectric fingerprint. The lens type photoelectric fingerprint is widely applied and is arranged in the area of the mobile phone auxiliary plate; the ultrathin photoelectric fingerprint is arranged in the battery compartment area. Both modes need to carry out the trompil to the center to fingerprint identification, but can cause certain influence to the intensity of center and mainboard after the trompil. In addition, the lens type photoelectric fingerprint is located in the auxiliary board area, and the volume of a mobile phone sound cavity can be influenced, so that the improvement of the overall sound quality of the mobile phone is not facilitated.

Disclosure of Invention

The application aims to provide a display screen assembly and electronic equipment, and at least one of the problems affecting strength and volume of a sound cavity is solved.

In order to solve the technical problems, the application is realized as follows:

in a first aspect, an embodiment of the present application proposes a display screen assembly, including: the display screen comprises an outer screen cover plate and an inner screen assembly arranged on the inner side of the outer screen cover plate, and mounting holes are formed in the inner screen assembly; the screen circuit board is arranged on one side of the display screen, which is far away from the outer screen cover plate; fingerprint identification device, including chip module and control module, chip module is connected with the control module electricity, and one side towards outer screen apron of screen circuit board is located to the chip module, and in the mounting hole was located to the chip module, one side that screen circuit board deviates from outer screen apron was located to the control module.

According to the display screen assembly provided by the embodiment of the application, on one hand, the chip module is arranged in the mounting hole, so that the space between the screen circuit board and the display screen is fully utilized, fingerprint identification can be completed without perforating on the middle frame, and the integral strength of the electronic equipment is improved; on the other hand, the chip module and the control module are respectively positioned at the outer side and the inner side of the screen circuit board, so that the integrated design of different parts is facilitated, the assembly link of the fingerprint identification device is omitted, the possibility of fingerprint identification failure caused by improper assembly is greatly reduced, meanwhile, the maintenance difficulty is reduced, the compactness of the equipment structure is improved, and the cost of the whole machine is reduced; furthermore, the space occupying the auxiliary board area is reduced, which is beneficial to increasing the volume of the cavity of the loudspeaker, and further improving the tone quality and the external sound effect of the equipment.

Specifically, the display screen assembly includes a display screen, a screen circuit board, and a fingerprint recognition device. The display screen comprises an outer screen cover plate and an inner screen assembly. In the application, one side of the display screen assembly capable of presenting text or image information to a user is called an outer side, and the other side is called an inner side. Specifically, the inboard of outer screen apron is located to interior screen subassembly, in other words, interior screen subassembly compares with outer screen apron, and interior screen subassembly is closer to electronic equipment's intermediate position, through setting up outer screen apron, can play certain guard action to interior screen subassembly, after the impact that the display screen subassembly received colliding with, can reduce the possibility of interior screen subassembly direct damage. Further, the inner screen assembly comprises a first glass and a second glass which are mutually attached. The second glass is arranged on the inner side of the first glass, namely, the second glass is positioned on one side of the first glass away from the outer screen cover plate. In general, a support column and an imaging module are further arranged between the second glass and the first glass, and the imaging module comprises an optical film layer, pixels and the like.

Further, the outer screen cover in the present application may be a glass cover, and the first glass is a panel layer, where the panel layer includes a polarizer, a panel, and a p-film. The polarizer, the panel and the p-film are arranged from outside to inside, in other words, the panel is positioned between the polarizer and the p-film, the polarizer is closer to the outer screen cover plate, and the p-film is positioned at a position far from the outer screen cover plate. The first glass is bonded with the outer screen cover plate through OCA glue. Specifically, the polaroid is connected with the glass cover plate through OCA glue, and the OCA glue is OCA optical glue, so that the glass cover plate has good clarity, light transmittance and adhesive force. The OCA glue can not only enable the surface of the display screen to be smoother, but also reduce glare and loss of light emitted by the LCD, increase brightness of the LCD, provide higher transmissivity and reduce energy consumption. Further, the second glass is a cover-panel layer, and comprises an EMBO double faced adhesive tape, foam, a PET film and a copper foil, wherein the EMBO double faced adhesive tape, the foam, the PET film and the copper foil are arranged from outside to inside, namely, the EMBO double faced adhesive tape is closer to the first glass. Specifically, the EMBO double-sided adhesive tape not only plays a role in adhesion, but also can protect components.

Further, the screen circuit board is arranged on one side of the display screen, which is away from the outer screen cover plate, in other words, the screen circuit board is closer to the middle position of the electronic device. The fingerprint identification device comprises a chip module and a control module, and the control module is electrically connected with the chip module. The control module can be understood as a fingerprint master control IC module.

Under the general condition, the under-screen photoelectric fingerprints mainly comprise two types, one is a lens type photoelectric fingerprint, and the other is an ultrathin photoelectric fingerprint. The chip modules and the control modules in the two fingerprint identification devices are connected through the fingerprint FPC. The center needs to be perforated when installing the above two fingerprint identification devices so as to facilitate fingerprint identification, but the strength of the center and the main board can be influenced to a certain extent after perforation. In addition, the lens type photoelectric fingerprint is located in the auxiliary board area, and the volume of a mobile phone sound cavity can be influenced, so that the improvement of the overall sound quality of the mobile phone is not facilitated.

In the technical scheme of the application, the chip module is arranged on one side of the screen circuit board, which faces the outer screen cover plate, namely, the chip module is positioned at the position of the screen circuit board, which is close to the display screen; the control module is arranged on one side of the screen circuit board, which is away from the outer screen cover plate, namely the control module is positioned at the position of the screen circuit board, which is away from the display screen. Further, be equipped with the mounting hole on the interior screen subassembly, through setting up the chip module in the mounting hole, make full use of the space between screen circuit board and the display screen, chip module and control module are located the outside of screen circuit board respectively, inboard, do not need to open pore on the center and just can accomplish fingerprint identification, are favorable to improving electronic equipment's bulk strength, save the regional space of subplate, increase the space of speaker cavity, and then can improve electronic equipment speaker's tone quality.

In addition, because fingerprint identification device integrates the setting with the screen circuit board, promptly the FPC and the PCB of photoelectricity fingerprint module, the FPC and the PCB of sharing display screen are favorable to saving the material. Specifically, the FPC part is responsible for signal transmission between the screen circuit board and the display screen, and the PCB part is used for layout and wiring of components of the display screen.

It is worth to be explained that the technical scheme of the application is not limited to flexible screens, and all screens utilizing the photoelectric fingerprint identification principle can use the design mode in the scheme.

Further, the chip module comprises a fingerprint chip, a filling layer, a first colloid, a shading polyester film, a second colloid, a steel sheet and a film layer. Specifically, the filling layer, the first colloid, the shading polyester film, the second colloid, the steel sheet and the film layer are arranged from outside to inside, the fingerprint FPC is arranged between the shading polyester film and the second colloid, and the fingerprint chip is arranged inside the filling layer, the first colloid, the shading polyester film and the fingerprint FPC. It is worth noting that the steel sheet is provided with two layers, the filling layer can be of foam structure, and the film layer can be of PET film.

In a second aspect, an embodiment of the present application proposes an electronic device, including: a housing; the display screen assembly of any of the above embodiments is disposed on the housing.

According to the electronic device provided by the embodiment of the application, the electronic device comprises a shell and a display screen assembly arranged on the shell. Through setting up the display screen subassembly, after fingerprint identification, the user can normally use electronic equipment.

It should be noted that the types of electronic devices are various, such as: a mobile phone, a tablet computer, an electronic reader, etc. In other words, the technical scheme of the application is not only suitable for mobile phones, but also other kinds of electronic equipment can use the design mode in the scheme.

Further, the housing specifically includes a back cover plate and a center frame. The rear cover plate can be understood as a battery cover, the middle frame is a screen bracket part of the electronic equipment, and the rear cover plate can also be a main upper structure in the mobile phone. The middle frame is arranged on the outer side of the rear cover plate, and the display screen assembly is arranged on the outer side of the middle frame, in other words, the middle frame is arranged between the display screen assembly and the rear cover plate. Through setting up the center, not only can play the effect of supporting some spare parts in the electronic equipment, can also strengthen equipment bulk strength.

Further, a battery compartment and a loudspeaker compartment are formed between the inner side of the middle frame and the rear cover plate, and a battery can be placed in the battery compartment to supply power to all parts of the electronic equipment through the battery. In addition, speakers can be placed in the speaker chambers, which can convert electrical signals into acoustic signals.

It is worth noting that, the loudspeaker cabin still includes the sound chamber, and the sound chamber is correlated with the tone quality of electronic equipment, through with fingerprint identification device and screen circuit board integrated setting, is favorable to increasing the sound chamber volume, and then can improve the tone quality of electronic equipment.

Additional aspects and advantages of the application will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of the application.

Drawings

The foregoing and/or additional aspects and advantages of the present application will become apparent and readily appreciated from the following description of the embodiments, taken in conjunction with the accompanying drawings, wherein:

FIG. 1 is a schematic structural view of a display screen assembly according to one embodiment of the present application;

FIG. 2 is a schematic structural view of a display screen according to one embodiment of the present application;

FIG. 3 is a schematic diagram of a fingerprint recognition device according to one embodiment of the present application;

fig. 4 is a schematic structural view of a fingerprint recognition device according to another embodiment of the present application;

FIG. 5 is a schematic structural view of a display screen assembly according to another embodiment of the present application;

FIG. 6 is a schematic structural diagram of an electronic device according to one embodiment of the present application;

FIG. 7 is a schematic structural diagram of an electronic device according to another embodiment of the present application;

fig. 8 is a schematic structural view of a fingerprint recognition device according to another embodiment of the present application;

FIG. 9 is a schematic structural view of a display screen assembly according to another embodiment of the present application;

fig. 10 is a schematic structural view of a middle frame according to an embodiment of the present application.

Reference numerals:

100: a display screen assembly; 110: a display screen; 111: an outer screen cover plate; 112: an inner screen assembly; 1121: a first glass; 1122: a second glass; 1123: a polarizer; 1124: a panel;1125: a p-film; 1126: EMBO double faced adhesive tape; 1127: soaking cotton; 1128: a PET film; 1129: copper foil; 113: a mounting hole; 114: OCA glue; 120: a screen circuit board; 130: a fingerprint identification device; 131: a chip module; 1311: a fingerprint chip; 1312: a filling layer; 1313: a first colloid; 1314: a light-shielding polyester film; 1315: a second colloid; 1316; a steel sheet; 1317: a film layer; 132: a control module; 133: fingerprint FPC;140: a receiving chamber; 150: a gap; 160: an adhesive; 170: a protective film; 200: an electronic device; 210: a housing; 211: a back cover plate; 212: a middle frame; 220: a battery compartment; 230: and (5) a loudspeaker cabin.

Detailed Description

Reference will now be made in detail to embodiments of the present application, examples of which are illustrated in the accompanying drawings, wherein like or similar reference numerals refer to like or similar elements or elements having like or similar functionality throughout. The embodiments described below by referring to the drawings are exemplary only for the purpose of explaining the present application and are not to be construed as limiting the present application. All other embodiments, which can be made by one of ordinary skill in the art based on the embodiments herein without making any inventive effort, are intended to be within the scope of the present application.

The features of the terms "first", "second", and the like in the description and in the claims of this application may be used for descriptive or implicit inclusion of one or more such features. In the description of the present application, unless otherwise indicated, the meaning of "a plurality" is two or more. Furthermore, in the description and claims, "and/or" means at least one of the connected objects, and the character "/", generally means that the associated object is an "or" relationship.

In the description of the present application, it should be understood that the terms "center," "longitudinal," "transverse," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," "circumferential," etc. indicate orientations or positional relationships based on the orientations or positional relationships illustrated in the drawings, are merely for convenience in describing the present application and simplifying the description, and do not indicate or imply that the device or element being referred to must have a particular orientation, be configured and operated in a particular orientation, and therefore should not be construed as limiting the present application.

In the description of the present application, it should be noted that, unless explicitly specified and limited otherwise, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be either fixedly connected, detachably connected, or integrally connected, for example; can be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium, and can be communication between two elements. The specific meaning of the terms in this application will be understood by those of ordinary skill in the art in a specific context.

The display screen assembly 100 and the electronic device 200 according to the embodiment of the present application are described below with reference to fig. 1 to 10.

As shown in fig. 1, a display screen assembly 100 according to some embodiments of the present application includes a display screen 110, a screen circuit board 120, and a fingerprint recognition device 130. The display screen 110 includes an outer screen cover 111 and an inner screen assembly 112. The side of the display screen assembly 100 that is capable of presenting text or image information to a user is referred to herein as the outside, and the other side is the inside. Specifically, the inner screen assembly 112 is disposed on the inner side of the outer screen cover 111, in other words, the inner screen assembly 112 is closer to the middle position of the electronic device 200 than the outer screen cover 111, and by disposing the outer screen cover 111, a certain protection effect can be achieved on the inner screen assembly 112, and when the display screen assembly 100 is impacted by the bump, the possibility of direct damage of the inner screen assembly 112 can be reduced. Further, the inner screen assembly 112 includes a first glass 1121 and a second glass 1122 that are bonded to each other. The second glass 1122 is provided on the inner side of the first glass 1121, i.e., the second glass 1122 is on the side of the first glass 1121 remote from the outer screen cover 111. Typically, a support column and an imaging module are further disposed between the second glass 1122 and the first glass 1121, and the imaging module includes an optical film layer, pixels, and the like.

Further, as shown in fig. 2, the outer screen cover 111 in the present application may be a glass cover, and the first glass 1121 is a panel layer including a polarizer 1123, a panel1124, and a p-film 1125. The polarizer 1123, the panel1124 and the p-film 1125 are disposed from outside to inside, in other words, the panel1124 is located between the polarizer 1123 and the p-film 1125, the polarizer 1123 is closer to the outer panel cover 111, and the p-film 1125 is located away from the outer panel cover 111. The first glass 1121 is bonded to the outer screen cover 111 by OCA glue 114. Specifically, the polarizer 1123 is connected to the glass cover plate through the OCA adhesive 114, and the OCA adhesive 114 is an OCA optical adhesive, and has good clarity, light transmittance and adhesive force. The OCA 114 not only can make the surface of the display 110 smoother, but also can reduce glare, reduce light loss of the LCD, increase brightness of the LCD, provide higher transmittance, and reduce energy consumption. Further, the second glass 1122 is a cover-panel layer including an EMBO double-sided tape 1126, foam 1127, PET film 1128, and copper foil 1129, and the EMBO double-sided tape 1126, foam 1127, PET film 1128, and copper foil 1129 are disposed outside-in, that is, the EMBO double-sided tape 1126 is closer to the first glass 1121 among the four. Specifically, the EMBO double-sided adhesive 1126 not only plays a role in adhesion, but also can protect components.

Further, the screen circuit board 120 is disposed on a side of the display screen 110 facing away from the outer screen cover 111, in other words, the screen circuit board 120 is closer to an intermediate position of the electronic device 200. The fingerprint identification device 130 includes a chip module 131 and a control module 132, and the control module 132 is electrically connected to the chip module 131. The control module 132 may be understood as a fingerprint master IC module.

In general, the under-screen photo-fingerprint mainly includes two types, one is a lens type photo-fingerprint (as shown in fig. 3), and the other is an ultra-thin photo-fingerprint (as shown in fig. 4). The chip module 131 and the control module 132 in the fingerprint identification device 130 are connected through the fingerprint FPC 133. Referring to fig. 5, 6 and 10, the center 212 needs to be perforated when the above two fingerprint recognition devices 130 are installed, so that fingerprint recognition can be performed, but after perforation, the strength of the center 212 and the motherboard can be affected to some extent. In addition, the lens type photoelectric fingerprint is located in the auxiliary board area, and the volume of a mobile phone sound cavity can be influenced, so that the improvement of the overall sound quality of the mobile phone is not facilitated.

In the technical solution of the present application, as shown in fig. 1 and fig. 7, the chip module 131 is disposed on a side of the screen circuit board 120 facing the outer screen cover 111, that is, the chip module 131 is located at a position of the screen circuit board 120 near the display screen 110; the control module 132 is disposed on a side of the screen circuit board 120 away from the outer screen cover 111, i.e. the control module 132 is located at a position of the screen circuit board 120 away from the display screen 110. Further, the mounting hole 113 is formed in the inner screen assembly 112, the chip module 131 is arranged in the mounting hole 113, the space between the screen circuit board 120 and the display screen 110 is fully utilized, the chip module 131 and the control module 132 are respectively located on the outer side and the inner side of the screen circuit board 120, fingerprint identification can be completed without forming holes in the middle frame 212, the integral strength of the electronic device 200 is improved, the space of the auxiliary board area is saved, the space of the speaker cavity is increased, and the sound quality of a speaker of the electronic device 200 can be improved.

In addition, since the fingerprint recognition device 130 and the screen circuit board 120 are integrated, that is, the FPC and the PCB of the optoelectronic fingerprint module share the FPC and the PCB of the display screen 110, the material is saved. Specifically, the FPC portion is responsible for transmitting signals between the screen circuit board 120 and the display screen 110, and the PCB portion is used for layout and wiring of components of the display screen 110.

Generally, as shown in fig. 8, the chip module 131 includes a fingerprint chip 1311, a filling layer 1312, a first gel 1313, a light-shielding mylar 1314, a second gel 1315, a steel sheet 1316, and a film layer 1317. Specifically, the filling layer 1312, the first colloid 1313, the light-shielding mylar 1314, the second colloid 1315, the steel sheet 1316 and the film layer 1317 are disposed from outside to inside, and the fingerprint FPC133 is disposed between the light-shielding mylar 1314 and the second colloid 1315, and the fingerprint chip 1311 is disposed inside the filling layer 1312, the first colloid 1313, the light-shielding mylar 1314 and the fingerprint FPC 133. It should be noted that the steel sheet 1316 has two layers, the filling layer 1312 may be a foam 1127 structure, and the film layer 1317 may be a PET film 1128.

Further, the mounting hole 113 is disposed on the second glass 1122, and a receiving cavity 140 is formed between the screen circuit board 120 and the second glass 1122, so that the space between the display screen 110 and the screen circuit board 120 can be fully utilized by disposing the chip module 131 in the receiving cavity 140. The chip module 131 and the control module 132 are respectively located at the outer side and the inner side of the screen circuit board 120, in other words, the fingerprint recognition device 130 is combined with the screen circuit board 120, so that fingerprint recognition can be realized without opening holes in the middle frame 212.

Further, the chip module 131 and the control module 132 are electrically connected to the screen circuit board 120. The basic working principle of the photoelectric fingerprint is as follows: the finger touches the fingerprint identification area, and the light that the screen sent reaches the finger surface back reflection to fingerprint chip 1311, and the light intensity of different positions is different to the charge distribution after photoelectric effect conversion is also different, can acquire the fingerprint image from this, compares the matching with the fingerprint image of preceding input again. Further, the chip module 131 is electrically connected to the control module 132 through the screen circuit board 120, in other words, the fingerprint recognition device 130 is combined with the screen circuit board 120, and fingerprint recognition can be completed without opening holes.

Further, the fingerprint recognition device 130 is integrated on the screen circuit board 120, which means that the screen circuit board 120 and the fingerprint recognition device 130 are integrated. Specifically, the chip module 131 and the control module 132 are located at the outer side and the inner side of the screen circuit board 120, respectively, in other words, the chip module 131 and the control module 132 are combined with the screen circuit board 120. Further, by connecting the peripheral portion of the screen circuit board 120 with the peripheral portion of the mounting hole 113 on the second glass 1122, the space between the display screen 110 and the screen circuit board 120 can be fully utilized after the chip module 131 is disposed in the mounting hole 113.

Further, a gap 150 exists between the chip module 131 and the inner sidewall of the first glass 1121. Through being equipped with clearance 150 between the inside wall with chip module 131 and first glass 1121, chip module 131 does not contact with first glass 1121 direct contact, and the user touches the fingerprint identification district with the finger, and the light that the screen sent out can reflect to chip module 131 after reaching the finger surface, consequently, set up chip module 131 in the mounting hole 113 of second glass 1122, can make full use of the space between screen circuit board 120 and the display screen 110 when can not influencing the normal use of fingerprint identification function.

Further, as shown in fig. 9, the outer panel 111 is bonded to the first glass 1121, and the screen circuit board 120 is bonded to the second glass 1122. By adopting the bonding mode, the outer screen cover plate 111 is connected with the first glass 1121 or the screen circuit board 120 is connected with the second glass 1122, so that the installation is convenient and quick, and the space utilization rate and the compactness of the whole equipment are improved. Specifically, the second glass 1122 is connected to the screen circuit board 120 through the adhesive 160.

Further, the protection film 170 is disposed on one side of the control module 132 facing the outer screen cover 111, and the protection film 170 is connected to the screen circuit board 120, so that the control module 132 can be protected by the protection film 170.

In another embodiment, only the outer screen cover 111 is bonded to the first glass 1121; alternatively, only the screen circuit board 120 and the second glass 1122 are bonded.

In another embodiment, as shown in fig. 6, 7 and 10, an electronic device 200 is provided in the embodiments of the present application, which includes a housing 210 and a display screen assembly 100 in any of the embodiments, where the display screen assembly 100 is disposed on the housing 210. By providing the display screen assembly 100, the user can normally use the electronic device 200 after fingerprint recognition.

It should be noted that the types of the electronic devices 200 are various, such as: a mobile phone, a tablet computer, an electronic reader, etc. In other words, the technical scheme of the application is not only applicable to mobile phones, but also other kinds of electronic devices 200 can use the design mode in the scheme.

Further, the housing 210 specifically includes a back cover 211 and a middle frame 212. The back cover 211 may be understood as a battery cover, and the middle frame 212 is a screen bracket of the electronic device 200, or may be a main upper structure inside the mobile phone. The middle frame 212 is disposed on the outer side of the rear cover 211, and the display screen assembly 100 is disposed on the outer side of the middle frame 212, in other words, the middle frame 212 is located between the display screen assembly 100 and the rear cover 211. By arranging the middle frame 212, not only can the function of supporting some parts in the electronic equipment 200 be achieved, but also the overall strength of the equipment can be enhanced.

Further, by forming the battery compartment 220 and the speaker compartment 230 between the inner side of the center frame 212 and the back cover 211, the battery compartment 220 can hold a battery, and power is supplied to each part of the electronic device 200 by the battery. In addition, a speaker can be placed in the speaker box 230, which can convert an electrical signal into an acoustic signal.

It should be noted that, the speaker cabin 230 further includes a sound cavity, and the sound cavity is related to the sound quality of the electronic device 200, and the fingerprint recognition device 130 is integrated with the screen circuit board 120, so that the volume of the sound cavity is increased, and the sound quality of the electronic device 200 can be improved.

Further, in the thickness direction of the housing 210, at least a part of the chip module 131 of the display screen assembly 100 coincides with the speaker cabin 230, which means that at least a part of the chip module 131 is located in the speaker cabin 230; alternatively, at least a portion of the chip module 131 of the display assembly 100 coincides with the battery compartment 220, and it is understood that at least a portion of the chip module 131 is located in the battery compartment 220; alternatively, some of the chip modules 131 are located in the speaker compartment 230, while some are located in the battery compartment 220. In general, the speaker cabin 230 and the battery cabin 220 do not overlap in the thickness direction of the housing 210, and by locating a part of the chip module 131 in the speaker cabin 230 or the battery cabin 220, the compactness of the overall structure of the device is improved.

According to the display screen assembly and the electronic device, on one hand, the chip module is arranged in the mounting hole, so that the space between the screen circuit board and the display screen is fully utilized, fingerprint identification can be completed without perforating on the middle frame, and the integral strength of the electronic device is improved; on the other hand, the chip module and the control module are respectively positioned at the outer side and the inner side of the screen circuit board, so that the integrated design of different parts is facilitated, the assembly link of the fingerprint identification device is omitted, the possibility of fingerprint identification failure caused by improper assembly is greatly reduced, meanwhile, the maintenance difficulty is reduced, the compactness of the equipment structure is improved, and the cost of the whole machine is reduced; furthermore, the space occupying the auxiliary board area is reduced, which is beneficial to increasing the volume of the cavity of the loudspeaker, and further improving the tone quality and the external sound effect of the equipment.

In the description of the present specification, reference to the terms "one embodiment," "some embodiments," "illustrative embodiments," "examples," "specific examples," or "some examples," etc., means that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the present application. In this specification, schematic representations of the above terms do not necessarily refer to the same embodiments or examples. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.

While embodiments of the present application have been shown and described, it will be understood by those of ordinary skill in the art that: many changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the application, the scope of which is defined by the claims and their equivalents.

Claims

1. A display screen assembly, comprising:

the display screen comprises an outer screen cover plate and an inner screen assembly arranged on the inner side of the outer screen cover plate, and mounting holes are formed in the inner screen assembly;

the screen circuit board is arranged on one side of the display screen, which is away from the outer screen cover plate;

fingerprint identification device, including chip module and control module, the chip module with the control module electricity is connected, the chip module is located the orientation of screen circuit board the one side of outer screen apron, just the chip module is located in the mounting hole, in order to utilize screen circuit board with space between the display screen, control module locates screen circuit board deviates from one side of outer screen apron.

2. The display screen assembly of claim 1, wherein the inner screen assembly comprises a first glass and a second glass which is arranged on the inner side of the first glass and is attached to the first glass, the second glass is provided with a mounting hole, a containing cavity is formed between the screen circuit board and the second glass, and the chip module is arranged in the containing cavity.

3. The display screen assembly of claim 1, wherein the chip module is electrically connected to the screen circuit board, the control module is electrically connected to the screen circuit board, and the chip module is electrically connected to the control module through the screen circuit board.

4. The display screen assembly according to claim 1, wherein a protective film is arranged on one side of the control module, which faces the outer screen cover plate, and the protective film is connected with the screen circuit board.

5. The display screen assembly of claim 2, wherein a gap exists between the chip module and an inner sidewall of the first glass.

6. The display screen assembly of claim 2, wherein the display screen assembly comprises,

the outer screen cover plate is bonded with the first glass; and/or

The screen circuit board is adhered to the second glass.

7. An electronic device, comprising:

a housing;

a display screen assembly according to any one of claims 1 to 6, provided on the housing.

8. The electronic device of claim 7, wherein the housing specifically comprises:

a back cover plate;

the middle frame is arranged on the outer side of the rear cover plate, and the display screen assembly is arranged on the outer side of the middle frame.

9. The electronic device of claim 8, wherein a battery compartment and a speaker compartment are formed between the inner side of the center frame and the back cover plate,

the battery compartment is used for placing a battery, and the loudspeaker compartment is used for placing a loudspeaker.

10. The electronic device of claim 9, wherein at least part of the die set of the display screen assembly coincides with the speaker chamber and/or at least part of the die set of the display screen assembly coincides with the battery chamber in a thickness direction of the housing.