WO2021248497A1

WO2021248497A1 - Fingerprint detection apparatus and electronic device

Info

Publication number: WO2021248497A1
Application number: PCT/CN2020/095960
Authority: WO
Inventors: 段晓锋; 刘相英
Original assignee: 深圳市汇顶科技股份有限公司
Priority date: 2020-06-12
Filing date: 2020-06-12
Publication date: 2021-12-16
Also published as: CN115088026A

Abstract

A fingerprint detection apparatus (200) and an electronic device (300), the fingerprint detection apparatus (200) being suitable for the electronic device (300) having a display screen (310). A bottom layer of the display screen (310) is a non-transparent layer. A window that penetrates the non-transparent layer is formed on the non-transparent layer. The fingerprint detection apparatus (200) comprises: an optical path layer (220) and a first sensor chip (230), the optical path layer (220) being disposed above the first sensor chip (230); a substrate (210), a fixing structure, and a pressure sensitive adhesive (391); the first sensor chip (230) and the fixing structure are arranged on the upper surface of the substrate (210), the upper surface of the fixing structure being fixed to the lower surface of the display screen (310) by means of the pressure sensitive adhesive (391); a curing adhesive (240); a side portion of the fixing structure comprises a first side portion (297) and at least one second side portion (298) other than the first side portion (297); gold fingers (2122) are provided on the substrate (210) at a position proximate to the first side portion (297); the curing adhesive (240) is disposed between the at least one second side portion (298) and the display screen (310). The present method not only reduces the thickness of the fingerprint detection apparatus (200), but also ensures the performance stability of the fingerprint detection apparatus (200).

Description

Fingerprint detection device and electronic equipment

Technical field

The embodiments of the present application relate to the field of fingerprint identification, and more specifically, to fingerprint detection devices and electronic equipment.

Background technique

At present, the under-screen fingerprint recognition solution is to attach the optical or ultrasonic fingerprint recognition module to the bottom of the Organic Light-Emitting Diode (OLED) screen, that is, regardless of the optical fingerprint recognition module or the ultrasonic fingerprint recognition module It needs to be tightly bonded to the light-emitting layer at the bottom of the screen.

However, for the existing screen-sticking solutions, when performing related mechanical reliability or thrust tests, the fingerprint identification module will be displaced as a whole, so that the thrust value of the fingerprint detection module cannot meet the thrust test requirements of the end customer.

Therefore, there is an urgent need in the art for a fingerprint identification device and electronic equipment that can meet the requirements of the thrust test.

Summary of the invention

A fingerprint detection device and electronic equipment are provided, which can not only reduce the thickness of the fingerprint detection device, but also ensure the performance stability of the fingerprint detection device.

In a first aspect, a fingerprint detection device is provided, which is suitable for electronic equipment with a display screen, the bottom layer of the display screen is an opaque layer, and an opening that penetrates the opaque layer is formed on the opaque layer;

The fingerprint detection device includes:

An optical path layer and a first sensor chip, where the optical path layer is arranged above the first sensor chip;

Substrate, fixing structure and pressure sensitive adhesive;

Wherein, the first sensor chip is fixed and electrically connected to the substrate, the fixing structure is arranged on the upper surface of the substrate and the fixing structure surrounds the first sensor chip, and the upper surface of the fixing structure passes through the The pressure-sensitive adhesive is fixed to the lower surface of the display screen, so that the first sensor chip is aligned with the window opening, and the first sensor chip is used for receiving through the window opening above the display screen. A fingerprint detection signal returned by a human finger and guided through the optical path layer, the fingerprint detection signal being used to detect fingerprint information of the finger;

Curing glue

Wherein, the side portion of the fixing structure includes the first side portion and at least one second side portion other than the first side portion, and the substrate is provided with gold at a position close to the first side portion. Finger, the gold finger of the substrate can be electrically connected to the gold finger of the flexible circuit board through an anisotropic conductive adhesive film, and the curing glue is arranged between the at least one second side and the display screen so as to face each other The display screen fixes the pressure-sensitive adhesive.

With regard to the fingerprint detection device, the optical path layer is directly arranged on the upper surface of the first sensor chip, and the lower surface of the first sensor chip is fixed on the substrate by the first fixing glue, which can avoid the optical path layer and the The first sensor chip is provided with a housing, which reduces the size (for example, the thickness) of the fingerprint detection device.

In addition, the optical path layer is directly arranged on the upper surface of the first sensor chip, and the lower surface of the first sensor chip is fixed on the substrate by the first fixing glue, so that the components are closely matched in the thickness direction (that is, the components are The tight fit in the thickness direction does not leave a gap), which reduces the size (for example, the thickness) of the fingerprint detection device.

Correspondingly, when the thickness of the fingerprint detection device is controlled, it can be placed between the display screen and the battery, and the fingerprint identification device is not required to be installed at a position other than the battery. Adjusting the original internal structure of the electronic device can also improve the utilization of the internal space of the electronic device. For example, the volume of the battery can be increased, and the space saved can be used to accommodate the increased volume of the battery. Accordingly, the service life and user experience of the electronic device can be increased without increasing the volume of the electronic device.

In addition, by disposing the curing glue between the at least one second side portion and the display screen to fix the pressure-sensitive glue relative to the display screen, the thrust value of the fingerprint detection device can meet the requirements of the terminal The customer’s thrust test requirement is that the fingerprint detection device will not be displaced during the thrust test process. Based on this, the connection stability of the fingerprint detection device during use can be ensured, and accordingly, the fingerprint detection device can be guaranteed The performance stability of the fingerprint detection device.

In summary, the technical solution of the present application can not only reduce the thickness of the fingerprint detection device, but also can ensure the performance stability of the fingerprint detection device.

In some possible implementations, the curing adhesive is ultraviolet curing adhesive or hot melt adhesive.

In some possible implementation manners, the fingerprint detection device further includes:

Limiting structure and structural fixing glue;

Wherein, the limiting structure is fixed on the outer side of the at least one second side portion of the lower surface of the display screen by the structure fixing glue, and the curing glue is disposed on the limiting structure and the at least one Between the second side.

By providing the limiting structure, not only can a storage space be provided for the curing glue, but also a storage space can be constructed for the curing glue. Correspondingly, it can be ensured that the at least one second side portion is covered with sufficient curing Glue to improve the curing effect of the cured glue.

In some possible implementation manners, the limiting structure includes a limiting plate, and the limiting plate is provided with an opening corresponding to the first side portion.

Through the opening corresponding to the first side portion, an accommodation space can be provided for the golden finger of the flexible circuit board, and accordingly, the installation complexity of the fingerprint detection device can be reduced.

In some possible implementations, at least one limiting block corresponding to the at least one second side portion is formed on the inner side of the limiting plate, and the limiting plate and the at least one limiting block are formed with A step structure, the step structure includes the lower surface of the at least one limiting block, the lower surface of the limiting plate forms a step structure and is used to connect the lower surface of the at least one limiting block and the limiting plate The lower surface of the limiting plate is fixed to the lower surface of the display screen by the structural fixing glue, and the lower surface of the at least one limiting block is in contact with the pressure-sensitive adhesive Upper surface.

Through the step structure, the limit structure can not limit the displacement of the pressure-sensitive adhesive as much as possible, and can also limit the displacement of the cured adhesive, that is, can simultaneously strengthen the sticking effect of the pressure-sensitive adhesive and the The curing effect of the cured adhesive.

In some possible implementation manners, a gap for accommodating the curing glue is formed between the at least one limiting block and the at least one second side portion, respectively.

By arranging the curing glue between each limiting block and the corresponding second side portion, not only can it be ensured that the at least one second side portion has a sufficient contact area with the curing glue to ensure the curing effect, but also A buffer space can be provided between the at least one second side portion and the at least one limiting block, and the buffer space can prevent the at least one limiting block from directly contacting the at least one side portion, correspondingly, The stability of the performance of the fingerprint detection device can be guaranteed.

In some possible implementations, a gap is formed between the vertical surface and the side wall of the pressure-sensitive adhesive for accommodating the curing adhesive.

By disposing the curing adhesive between the vertical surface and the pressure-sensitive adhesive, not only the contact area between the pressure-sensitive adhesive and the curing adhesive can be ensured to ensure the curing effect of the curing adhesive, but also A buffer space can be provided between the pressure-sensitive adhesive and the limiting plate, and the buffer space can prevent the limiting plate from directly contacting the pressure-sensitive adhesive. Accordingly, it can be avoided because of the limiting plate. The fingerprint identification device is misaligned due to squeezing the pressure-sensitive adhesive, and further, the stability of the performance of the fingerprint detection device can be ensured.

In some possible implementation manners, each limit block in the at least one limit block is a T-shaped limit block.

By designing each of the at least one limiting block as a T-shaped limiting block, it is possible to increase the force-bearing area of the limiting structure on the basis of ensuring the accommodating space of the curing glue, and correspondingly , Can improve the limiting effect of the limiting structure.

In some possible implementations, the opaque layer is a buffer layer, and the upper surface of the fixing structure is fixed to the lower surface of the buffer layer by the pressure-sensitive adhesive in the surrounding area of the window.

In some possible implementations, the opaque layer includes a buffer layer and a copper foil layer from top to bottom, and a support film is arranged above the buffer layer; wherein the upper surface of the fixing structure passes through the pressure sensitive The glue is fixed to the lower surface of the copper foil layer in the surrounding area of the window, or the upper surface of the fixing structure is fixed to the lower surface of the supporting film by the pressure-sensitive glue.

The fingerprint detection device is pasted to the bottom surface of the buffer layer, copper foil layer or support film of the display screen by using the first pressure-sensitive adhesive and the fixing structure of the substrate, which is compared with detecting the fingerprint The device is directly attached to the display panel (ie, the OLED layer) of the display screen, which not only prevents the fingerprint detection device from being attached to the display screen and affects the performance of the display screen, but also reduces the installation of the fingerprint The degree of difficulty of the detection device, correspondingly, can reduce the installation complexity of the fingerprint detection device and improve the yield of the electronic equipment. Moreover, sticking the fingerprint detection device to the bottom surface of the buffer layer, copper foil layer or support film of the display screen can also avoid damage to the display screen during the process of disassembling the fingerprint detection device. Accordingly, The disassembly complexity of the fingerprint detection device is reduced and the yield of the electronic device is improved.

In addition, the fingerprint detection device is pasted to the bottom surface of the buffer layer or the copper foil layer of the display screen by using the first pressure-sensitive adhesive and the fixing structure of the substrate. When the display screen is pressed or When the electronic device is dropped or collided, since there is a buffer layer and/or the lower surface of the copper foil layer between the display panel and the fingerprint detection device, the display panel and the fingerprint detection device can be prevented from being squeezed This affects the performance of the display panel and the fingerprint detection device. In addition, by sticking the fingerprint detection device to the bottom surface of the buffer layer or copper foil layer of the display screen, compared to directly bonding the fingerprint detection device to the display panel or support film of the display screen, It can also avoid the size of the opening window being too large, and accordingly, the visibility of the user when viewing the fingerprint detection device from the front of the display screen can be reduced, thereby beautifying the appearance of the electronic device.

In some possible implementations, the lower surface of the support film is provided with a connecting portion corresponding to the upper surface of the fixing structure in the area of the window, and the connecting portion is connected to the support film by a double-sided tape. .

Through the connecting portion, it is possible to prevent the curing adhesive or the pressure-sensitive adhesive from forming irregular sticking marks on the supporting film, and accordingly, it is possible to ensure the aesthetics of the electronic device equipped with the fingerprint detection device.

In some possible implementation manners, the connecting portion is a rigid reinforcement plate or a polyethylene terephthalate adhesive layer.

In some possible implementations, the connecting portion is an opaque medium layer.

Setting the connecting portion as an opaque medium layer is equivalent to reducing the size of the window, and accordingly, it can reduce the visibility of the fingerprint detection device when the user views the fingerprint detection device from the front of the display screen, and thus Can beautify the appearance of electronic equipment.

In some possible implementations, the substrate includes a first covering layer, a first conductive layer, a base material layer, a second conductive layer, and a second covering layer in order from top to bottom. The area extends downward and penetrates the first covering layer and the first conductive layer to form a first groove, and the upper surface of the substrate extends downward and penetrates the second area connected to the first area. The first covering layer to form a pad of the substrate;

The fingerprint detection device further includes:

The first fixing glue and the first gold wire;

Wherein, the lower surface of the first sensor chip is fixed in the first groove by the first fixing glue, and the first sensor chip is connected to the pad of the substrate by the first gold wire.

By removing the first covering layer and the first conductive layer of the substrate at the first area to form a first groove for accommodating the first fixing glue and the first sensor chip, it is possible to reduce The thickness of the fingerprint detection device.

Secondly, by removing the first covering layer at the second area of the substrate, a substrate pad for electrically connecting the first sensor chip is formed, which can be used to electrically connect the first sensor chip and the first sensor chip. The first gold wire of the substrate provides an accommodation space, and accordingly, the occupied space of the first gold wire above the substrate is reduced, thereby reducing the thickness of the fingerprint detection device.

Thirdly, the tight fit between the various layers in the thickness direction ensures that the thickness of the fingerprint detection device is reduced to the greatest extent.

Finally, since the optical path layer is directly arranged on the upper surface of the first sensor chip, the image collection field of view of the fingerprint detection device is only affected by the area of the optical path layer and the corresponding area of the first sensor chip, Based on this, the area of the optical path layer and the area of the corresponding first sensor chip can be reasonably designed according to actual needs to meet the needs of different users and different customers (for example, the needs of a large-area image acquisition field of view).

In summary, the technical solution of the present application can not only reduce the thickness of the fingerprint detection device, but also can ensure a sufficiently large image acquisition field of view.

The second sensor chip, the second fixing glue and the second gold wire;

Wherein, the upper surface of the substrate extends downward in a third area connected to the second area and penetrates the first covering layer and the first conductive layer to form a second groove, and the second sensor The chip is fixed in the second groove by a second fixing glue, and the second sensor chip is connected to the pad of the substrate by the second gold wire, so that the second sensor chip is connected to the The first sensor chip, and the second sensor chip is used to cooperate with the first sensor chip to perform under-screen fingerprint recognition.

The second sensor chip provided can share the processing tasks of the first sensor chip, which is equivalent to replacing a fully functional and thicker sensor chip with a thinner first sensor chip and a thinner sensor chip arranged side by side. The second sensor chip, correspondingly, can reduce the thickness of the fingerprint detection device without affecting the fingerprint recognition performance.

In some possible implementation manners, the fixed structure includes:

Bracket and gold wire protective glue;

Wherein, the gold wire protective glue is used to encapsulate the first gold wire, and the bracket is arranged on the upper surface of the first cover film and located outside the first sensor chip.

In some possible implementations, the bracket is a polyethylene terephthalate adhesive layer; or the bracket is fixed on the upper surface of the first cover film by a bracket fixing glue and is located on the first sensor The outside of the chip.

In some possible implementation manners, the fixed structure further includes:

Shading layer

Wherein, the optical path layer includes a lens layer and an optical path guiding layer, and the microlens is used to converge the optical signal returned via the human finger above the display screen to the optical path guiding layer, and the optical path guiding layer condenses the The light signal condensed by the microlens is guided to the first sensor chip, the light shielding layer extends from above the support to the light path guiding layer, and a gap is formed between the light shielding layer and the microlens layer, The light shielding layer is used for shielding light signals incident from other positions than the incident surface of the first sensor chip.

The light-shielding layer is structured to extend from above the support to above the light path guide layer, which not only can effectively shield the light signal incident from the non-incident surface of the first sensor chip, but also can protect the light as much as possible. The light shielding layer is tightly fixed to the optical path layer, and accordingly, the thickness of the fingerprint detection device can be reduced as much as possible.

In addition, the light-shielding layer is configured to extend from above the support to the light path guide layer, which can prevent the light-shielding layer from covering the lens layer to reduce the image capture area of the fingerprint detection device.

In some possible implementations, the light shielding layer is a shielding glue layer, and the arc height position of the first gold wire is covered by the light shielding glue layer.

In some possible implementations, the fingerprint detection device further includes the flexible circuit board, and the gold fingers of the flexible circuit board are electrically connected to the gold fingers of the substrate through the anisotropic conductive adhesive film.

In the second aspect, an electronic device is provided, including:

Display screen

The fingerprint detection device is arranged below the display screen. The fingerprint detection device is the fingerprint detection device described in the first aspect or any one of the possible implementations of the first aspect, and its fingerprint collection area is at least partially located in the In the display area of the display screen.

In some possible implementations, the electronic device further includes a middle frame, and the electronic device further includes a middle frame; wherein the upper surface of the middle frame extends downward to form a third groove, and the fingerprint detection device Extend into the third groove, or the middle frame is formed with an opening penetrating the middle frame, and the opening is used to provide a receiving space for the fingerprint detection device.

Description of the drawings

Fig. 1 is a schematic plan view of an electronic device to which the present application can be applied.

Fig. 2 is a schematic side sectional view of the electronic device shown in Fig. 1.

3 to 6 are schematic structural diagrams of a fingerprint identification device according to an embodiment of the present application.

7 and 8 are schematic structural diagrams of a display screen of an electronic device according to an embodiment of the present application.

9 to 16 are schematic structural diagrams of an electronic device equipped with a fingerprint detection device according to an embodiment of the present application.

detailed description

The technical solutions in the embodiments of the present application will be described below in conjunction with the accompanying drawings.

The technical solutions of the embodiments of the present application can be applied to various electronic devices. For example, portable or mobile computing devices such as smartphones, laptops, tablet computers, and gaming devices, as well as other electronic devices such as electronic databases, automobiles, and bank automated teller machines (ATM). However, the embodiments of the present application are not limited to this.

The technical solutions of the embodiments of the present application can be used in biometric identification technology. Among them, biometric recognition technologies include, but are not limited to, fingerprint recognition, palmprint recognition, iris recognition, face recognition, and living body recognition. For ease of description, the following uses fingerprint recognition technology as an example for description.

The technical solutions of the embodiments of the present application can be used in the under-screen fingerprint identification technology.

Under-screen fingerprint recognition technology refers to the installation of a fingerprint detection device under the display screen, so as to perform fingerprint recognition operations in the display area of the display screen, without the need to set a fingerprint collection area on the front of the electronic device except for the display area. Specifically, the fingerprint detection device uses light returned from the top surface of the display assembly of the electronic device to perform fingerprint sensing and other sensing operations. This returned light carries information about objects (such as fingers) that are in contact with or close to the top surface of the display assembly. The fingerprint detection device located below the display assembly collects and detects this returned light to realize fingerprint recognition under the screen. Wherein, the fingerprint detection device can be designed to achieve desired optical imaging by appropriately configuring optical elements for collecting and detecting the returned light, so as to detect the fingerprint information of the finger.

1 and 2 show schematic diagrams of an electronic device 100 to which under-screen fingerprint recognition technology can be applied. FIG. 1 is a front schematic diagram of the electronic device 100, and FIG. 2 is a partial cross-sectional structure diagram of the electronic device 100 shown in FIG. 1.

As shown in FIG. 2, the electronic device 100 may include a display screen 120 and a fingerprint detection device 130.

The display screen 120 may be a self-luminous display screen, which uses a self-luminous display unit as display pixels. For example, the display screen 120 may be an Organic Light-Emitting Diode (OLED) display screen or a Micro-LED (Micro-LED) display screen.

In addition, the display screen 120 may also be specifically a touch-sensitive display screen, which can not only perform screen display, but also detect a user's touch or pressing operation, thereby providing a user with a human-computer interaction interface. For example, in an embodiment, the electronic device 100 may include a touch sensor, and the touch sensor may specifically be a touch panel (TP), which may be provided on the surface of the display screen 120, or may be partially integrated or The whole is integrated into the display screen 120 to form the touch display screen.

The fingerprint detection device 130 may be an optical fingerprint detection device.

Specifically, the fingerprint detection device 130 (also referred to as a fingerprint recognition module or a fingerprint detection module) may include a sensor chip (also referred to as a fingerprint sensor) having an optical sensor array. Wherein, the optical sensing array includes a plurality of optical sensing units, and each optical sensing unit may specifically include a photodetector or a photoelectric sensor. In other words, the fingerprint detection device 130 may include a photodetector array (or called a photodetector array or a photodetector array), which includes a plurality of photodetectors distributed in an array.

As shown in FIG. 1, the fingerprint detection device 130 can be arranged in a partial area below the display screen 120, so that the fingerprint collection area (or detection area) 103 of the fingerprint detection device 130 is at least partially located on the display screen 120. Within area 102.

As shown in FIG. 2, the area or light sensing range of the optical sensing array of the fingerprint detection device 130 corresponds to the fingerprint collection area 103 of the fingerprint detection device 130. The fingerprint collection area 103 of the fingerprint detection device 130 may be equal to or not equal to the area or the light sensing range of the optical sensing array of the fingerprint detection device 130, which is not specifically limited in the embodiment of the present application.

For example, through the design of the optical path of light collimation, the fingerprint collection area 103 of the fingerprint detection device 130 can be designed to be substantially the same as the area of the sensing array of the fingerprint detection device 130.

For another example, the design of the light path for converging light or the design of the light path for reflecting light through a macro lens can make the area of the fingerprint collection area 103 of the fingerprint detection device 130 larger than the area of the sensing array of the fingerprint detection device 130.

The optical path design of the fingerprint detection device 130 is exemplified below.

Taking an optical collimator with a high-aspect-ratio through hole array in the optical path design of the fingerprint detection device 130 as an example, the optical collimator may specifically be a collimator layer made on a semiconductor silicon wafer, It has a plurality of collimating units or micro-holes. The collimating unit may be specifically a small hole. Among the reflected light reflected from the finger, the light that is perpendicularly incident on the collimating unit can pass through and be passed by the sensor below it. The chip receives, and the light whose incident angle is too large is attenuated by multiple reflections inside the collimating unit. Therefore, the sensor chip can basically only receive the reflected light reflected by the fingerprint pattern directly above it, which can effectively improve Image resolution, thereby improving the fingerprint recognition effect.

Taking the optical path design of the fingerprint detection device 130 using the optical path design of the lens (Micro-Lens) layer as an example, the lens layer may have a micro-lens array formed by a plurality of micro-lenses, which may be formed by a semiconductor growth process or other processes. Above the sensing array of the sensor chip, and each microlens may correspond to one or more sensing units of the sensing array. Other optical film layers may be formed between the lens layer and the sensing unit, such as a dielectric layer or a passivation layer. More specifically, a barrier with micro holes may also be formed between the lens layer and the sensing unit. Optical layer, wherein the micro-hole is formed between its corresponding micro lens and the sensing unit, the light blocking layer can block the optical interference between adjacent sensing units, and make light converge to the said micro lens through the micro lens The inside of the micro-hole is transmitted to the sensing unit corresponding to the micro-lens through the micro-hole, so as to perform optical fingerprint imaging.

It should be noted that several implementation solutions of the above-mentioned optical path guiding structure can be used alone or in combination. For example, a lens layer can be further provided under the collimator layer or the optical lens layer. Of course, when the collimator layer or the optical lens layer is used in combination with the lens layer, its specific laminated structure or optical path may need to be adjusted according to actual needs.

The fingerprint detection device 130 may be used to collect user fingerprint information (such as fingerprint image information).

Taking the display screen 120 adopting an OLED display as an example, the display screen 120 may adopt a display screen with a self-luminous display unit, such as an organic light-emitting diode (Organic Light-Emitting Diode, OLED) display or a micro-LED (Micro-LED) display Screen. The fingerprint detection device 130 may use the display unit (ie, the OLED light source) of the OLED display screen located in the fingerprint collection area 103 as an excitation light source for optical fingerprint detection.

When a finger touches, presses, or approaches (for ease of description, collectively referred to as pressing in this application) in the fingerprint collection area 103, the display screen 120 emits a beam of light to the finger above the fingerprint collection area 103. The surface is reflected to form reflected light or is scattered inside the finger to form scattered light. In related patent applications, for ease of description, the above-mentioned reflected light and scattered light are collectively referred to as reflected light. Because the ridge and valley of the fingerprint have different light reflection capabilities, the reflected light from the fingerprint ridge and the fingerprint ridge have different light intensities. After the reflected light passes through the display screen 120, it is affected by the fingerprint. The sensor chip in the detection device 130 receives and converts it into a corresponding electrical signal, that is, a fingerprint detection signal; based on the fingerprint detection signal, fingerprint image data can be obtained, and fingerprint matching verification can be further performed, so that the electronic device 100 Realize the optical fingerprint recognition function.

It can be seen that when the user needs to perform fingerprint unlocking or other fingerprint verification on the electronic device 100, he only needs to press his finger on the fingerprint collection area 103 located on the display screen 120 to realize the fingerprint feature input operation.

Of course, the fingerprint detection device 130 may also use a built-in light source or an external light source to provide an optical signal for fingerprint detection and identification.

As shown in FIG. 1, the electronic device 100 may further include a protective cover 110.

The cover 110 may be specifically a transparent cover, such as a glass cover or a sapphire cover, which is located above the display screen 120 and covers the front surface of the electronic device 100, and the surface of the cover 110 may also be provided with a protective layer. Therefore, in the embodiments of the present application, the so-called finger pressing the display screen 120 may actually refer to the finger pressing the cover 110 above the display 120 or covering the surface of the protective layer of the cover 110.

As shown in FIG. 1, a circuit board 140, such as a flexible printed circuit (FPC) (Flexible Printed Circuit, FPC), may also be provided under the fingerprint detection device 130.

The fingerprint detection device 130 may be electrically connected to the circuit board 140, and realize electrical interconnection and signal transmission with other peripheral circuits or other components of the electronic device 100 through the circuit board 140. For example, the fingerprint detection device 130 can receive the control signal of the processing unit of the electronic device 100 through the circuit board 140, and can also output the fingerprint detection signal from the fingerprint detection device 130 to the processing unit or the control unit of the electronic device 100 through the circuit board 140 Wait.

FIG. 3 is a schematic structural diagram of a fingerprint detection device 200 including a sensor chip according to an embodiment of the present application. The fingerprint detection device 200 is suitable for electronic equipment with a display screen. For example, the fingerprint detection apparatus 200 may be applicable to the electronic device 100 shown in FIG. 1 or FIG. 2.

It should be noted that, for ease of description, in the embodiments of the present application, the same reference numerals are used to denote the same components, and for brevity, detailed descriptions of the same components are omitted in different embodiments.

As shown in FIG. 3, the fingerprint detection device 200 includes a substrate 210, an optical path layer 220, a first sensor chip 230, a first fixing glue 240 and a first gold wire 250.

Wherein, the substrate 210 includes a first covering layer 212, a first conductive layer 211 layer 212, a base layer 213, a second conductive layer 214, and a second covering layer 215 in order from top to bottom. The upper surface of the substrate 210 Extend downward in the first area and penetrate through the first covering layer 212 and the first conductive layer 211 to form a first groove, and the upper surface of the substrate 210 is in the second area connected to the first area. Extend downward and penetrate through the first covering layer 212 to form the pad 2111 of the substrate 210. Optionally, in other alternative embodiments, the substrate 210 may include conductive layers other than the first conductive layer 211 and the second conductive layer 214. Optionally, the first conductive layer 211 or the second conductive layer 214 may be a copper layer or a copper foil layer. Optionally, the first covering layer 212 or the second covering layer 213 may be an insulating layer (for example, a resin layer).

The optical path layer 220 is disposed above the first sensor chip 230, and the lower surface of the first sensor chip 230 is fixed in the first groove by the first fixing glue 240, and the first sensor chip 230 The first sensor chip 230 is connected to the pad 2111 of the substrate 210 through the first gold wire 250, and the first sensor chip 230 is used to receive the fingerprint returned via the human finger above the display screen and guided by the optical path layer 220 A detection signal, the fingerprint detection signal is used to detect fingerprint information of the finger.

In other words, the lower surface of the first sensor chip 230 is pasted in the first groove by the first fixing glue 240, so that at least a part of the first sensor chip 230 is disposed in the first groove and passes through The first gold wire 250 is electrically connected to the substrate 210; wherein, the first sensor chip 230 can be disposed under the display screen of the electronic device through the substrate 210. The first sensor chip 230 is used to receive The fingerprint detection signal returned by the human finger above the display screen is reflected or scattered, and the fingerprint information of the finger is detected based on the fingerprint detection signal to perform fingerprint registration or identification.

It should be understood that the first sensor chip 230 may include multiple chips or one chip. For example, the first sensor chip 230 may include a plurality of optical fingerprint sensor chips, and the plurality of optical fingerprint sensor chips are arranged side by side. The first groove is spliced into an optical fingerprint sensor chip assembly. The optical fingerprint sensor chip assembly can be used to acquire multiple fingerprint images at the same time, and the multiple fingerprint images can be used as one fingerprint image for fingerprint registration or identification after being spliced.

With regard to the fingerprint detection device 200, the optical path layer 220 is directly disposed on the upper surface of the first sensor chip 230, and the lower surface of the first sensor chip 230 is fixed on the substrate 210 by the first fixing glue 240, which can avoid separate Providing a housing for the optical path layer 220 and the first sensor chip 230 reduces the size (for example, the thickness) of the fingerprint detection device 200.

In addition, by removing the first covering layer 212 and the first conductive layer 211 of the substrate 210 at the first area, a structure for accommodating the first fixing glue 240 and the first sensor chip 230 is formed The first groove can reduce the thickness of the fingerprint detection device 200.

Secondly, by removing the first covering layer 212 at the second area of the substrate 210, a pad of the substrate 210 for electrically connecting the first sensor chip 230 is formed, which can be used for electrically connecting the first sensor chip 230. The sensor chip 230 and the first gold wire 250 of the substrate 210 provide accommodating space. Correspondingly, the space occupied by the first gold wire 250 above the substrate 210 is reduced, thereby reducing the fingerprint detection device 200 thickness.

Thirdly, the tight fit between the various layers in the thickness direction ensures that the thickness of the fingerprint detection device 200 is reduced to the greatest extent.

Finally, since the optical path layer 220 is directly arranged on the upper surface of the first sensor chip 230, the image collection field of view of the fingerprint detection device 200 is only affected by the area of the optical path layer 220 and the corresponding first sensor chip 230. Based on this, the area of the optical path layer 220 and the corresponding area of the first sensor chip 230 can be reasonably designed according to actual needs to meet the needs of different users and different customers (such as the needs of large-area image acquisition field of view) ).

In summary, the technical solution of the present application can not only reduce the thickness of the fingerprint detection device 200, but also can ensure a sufficiently large image collection field of view.

As shown in FIG. 3, in some embodiments of the present application, there is a gap d1 between the sidewall of the first sensor chip 230 and the sidewall of the first groove.

By designing a certain gap d1 between the side wall of the first sensor chip 230 and the side wall of the first groove, even if the size of the prepared product of the first sensor chip 230 is the same as that of the first sensor chip There is a difference between the design dimensions of 230, or even if there is a difference between the actual size of the first groove and the design dimension of the first groove, it will not affect the installation of the first sensor chip 230 in the place. Mentioned in the first groove.

In other words, the gap d1 between the side wall of the first sensor chip 230 and the side wall of the first groove can not only be used as the dimensional tolerance of the first sensor chip 230 and/or as the first groove The dimensional tolerance can also be used as the installation tolerance of the first sensor chip 230, and accordingly, the yield rate of the fingerprint detection device 200 can be improved. The dimensional tolerance may be the size of the absolute value of the difference between the maximum allowable limit size minus the minimum limit size, or the dimensional tolerance may be the difference between the allowable upper deviation and the lower deviation. Limit deviation = limit size-basic size, upper deviation = maximum limit size-basic size, lower deviation = minimum limit size-basic size. The dimensional tolerance of the first sensor chip 230 may be an allowable amount of variation in the process of cutting the first sensor chip 230. In the case of the same basic size, the smaller the dimensional tolerance, the higher the dimensional accuracy. Similarly, the mounting tolerance of the first sensor chip 230 may refer to the allowable offset distance between the first limit mounting position and the second limit mounting position, and the first limit mounting position may be the closest allowed The installation position of the first side wall of the first groove, the second limit installation position may be the allowable installation position closest to the second side wall of the first groove, and the first side wall is the same The opposite side wall of the second side wall.

For example, the width of the gap d1 between the sidewall of the first sensor chip 230 and the sidewall of the first groove is 100-300um. For example, 200um. Of course, alternatively, the width of the gap d1 between the side wall of the first sensor chip 230 and the side wall of the first groove can also be other values, or fall within a range of other preset values. There is no specific restriction on this. For example, the width of the gap d1 between the sidewall of the first sensor chip 230 and the sidewall of the first groove may also be 100um or 250um. For another example, the sidewall of the first sensor chip 230 and The width of the gap d1 between the side walls of the first groove may also be within 100um to 400un.

It should be noted that this application does not specifically limit the thickness of each component or layer in the fingerprint detection device 200, as long as the structural relationship between the various components or layers adopts the design solution of this application and is closely matched The method to control the thickness of the fingerprint detection device falls within the protection scope of this application.

As an example, the thickness of the first covering layer 212 and the thickness of the second covering layer are both 10-30um, for example 20um; the thickness of the first conductive layer 211 and the thickness of the second conductive layer are both 10-20um, such as 13um; the thickness of the substrate is 40-80um, such as 64um; the thickness of the first sensor chip 230 is 50-150um, such as 60um; the thickness of the optical path layer 220 is 10-30um, For example, 21um; the maximum arc height d6 of the first gold wire 250 is 30-60um, such as 40um; the thickness of the first fixing glue 240 is 10-30um, such as 15um.

Of course, the thickness of the first covering layer 212, the thickness of the first conductive layer 211, the thickness of the base layer 213, the thickness of the second conductive layer 214, the thickness of the second covering layer 215, the first sensor chip 230 The thickness of, the thickness of the first fixing glue 240, or the maximum arc height d6 of the first gold wire 250 may also be other values or within a range of other preset values, which is not specifically limited in this application.

As shown in FIG. 3, in some embodiments of the present application, the fingerprint detection device 200 may further include a bracket 251 and a gold wire protective glue 252; wherein, the gold wire protective glue 252 is used to encapsulate the first gold wire. Line 250, the bracket 251 is arranged on the upper surface of the first covering layer 212 and located outside the first sensor chip 230. Optionally, the bracket 251 is fixed on the upper surface of the first covering layer 212 by a bracket fixing glue 253 and is located outside the first sensor chip 230. For example, the material of the bracket 251 includes, but is not limited to, metal, resin, glass fiber composite board, adhesive layer, and the like. For example, the bracket 251 is a polyethylene terephthalate (polyethylene glycol terephthalate, PET) glue layer. For another example, the bracket 251 may be a bracket formed of foam material. Optionally, the bracket fixing glue may be a double-sided glue.

In other words, the bracket 251 may be disposed above the substrate 210 and located at the outer side or the surrounding area of the first groove and the pad 2111 of the substrate 210 (used to electrically connect the first sensor chip 230) .

As shown in FIG. 3, in some embodiments of the present application, the width of the gap d2 formed by the first sensor chip 230 and the bracket 251 is greater than or equal to the sidewall of the first sensor chip 230 and the first sensor chip 230. With respect to the width of the gap d1 formed between the side walls of a groove, the outer side of the bracket 251 extends a predetermined distance d3 in a direction approaching the first sensor chip 230 relative to the outer side of the first covering layer 212. As an example, the width of the gap d2 formed by the first sensor chip 230 and the bracket 251 is 100-400um, such as 270um, and the preset distance d3 is 100-400um, such as 200um. Optionally, the thickness of the bracket 251 is 40-100um, such as 50um or 80um.

Of course, in other alternative embodiments, the gap d2 formed by the first sensor chip 230 and the bracket 251, the preset distance d3, or the thickness of the bracket 251 may be other specific values, or may be within one Within the range of other preset values. For example, the thickness of the bracket 251 may also be 80um.

Through the gold wire protective glue 252, the stability of the electrical connection between the substrate 210 and the first sensor chip 230 can be ensured, and accordingly, the performance of the fingerprint detection device 200 can be ensured.

In addition, the gap d2 formed by the first sensor chip 230 and the bracket 251 can be used not only as a dimensional tolerance of the bracket 251, but also as an installation tolerance of the bracket 251. Accordingly, the fingerprint detection device can be improved A yield of 200. Similarly, the preset distance d3 can be used not only as a dimensional tolerance of the bracket 251, but also as an installation tolerance of the bracket 251, and accordingly, the yield rate of the fingerprint detection device 200 can be improved.

In some embodiments of the present application, the thickness of the gold wire protective glue 252 is less than or equal to the sum of the thickness of the optical path layer 220, the thickness of the first sensor chip 230, and the thickness of the first fixing glue 240 . For example, as shown in FIG. 3, the thickness of the gold wire protective glue 252 is equal to the thickness of the light path guiding layer 222 in the light path layer 220, the thickness of the first sensor chip 230, and the thickness of the first fixing glue 240 Sum.

The thickness of the gold wire protective glue 252 is configured to be less than or equal to the sum of the thickness of the optical path layer 220, the thickness of the first sensor chip 230, and the thickness of the first fixing glue 240, which can be used in effective packaging. While the first gold wire 250 is described, the thickness of the fingerprint detection device 200 is reduced as much as possible.

Of course, for the bracket 251, other parameters can also be designed for the preparation and installation of the bracket 251. For example, as shown in FIG. 3, in some embodiments of the present application, the pad 2111 (used to electrically connect the first sensor chip 230) of the first sensor chip 230 close to the substrate 210 and The width of the gap d4 between the brackets 251 is larger than the side of the pad 2111 (used to electrically connect the first sensor chip 230) of the first sensor chip 230 away from the substrate 210 and between the bracket 251 The gap d2 is to reserve enough space for the bracket fixing glue 252. Optionally, the width of the gap d4 between the side of the pad 2111 of the first sensor chip 230 close to the substrate 210 and the bracket 251 may be 1300 um or other values.

As shown in FIG. 3, in some embodiments of the present application, the fingerprint detection device 200 further includes a light shielding layer 260.

Wherein, the optical path layer 220 includes a lens layer 221 and an optical path guiding layer 222, and the lens layer 221 is used to converge the optical signal returned via the human finger above the display screen to the optical path guiding layer 222, and the optical path The guide layer 222 guides the light signal condensed by the lens layer 221 to the first sensor chip 230, the light shielding layer 260 extends from above the bracket 251 to the light path guide layer 222, and the light shielding layer 260 A gap d5 is formed between the lens layer and the lens layer 221, and the light shielding layer 260 is used to shield light signals incident from other positions than the incident surface of the first sensor chip 230. Optionally, the thickness of the light shielding layer 260 is 10-30 um, for example, 20 um. Of course, the thickness of the light shielding layer 260 can also be other specific values or within a range of other preset values, which is not specifically limited in this application.

The light shielding layer 260 is configured to extend from above the support 251 to above the light path guide layer 222, which can not only effectively shield the light signal incident from the non-incident surface of the first sensor chip 230, but also It is possible to tightly fix the light shielding layer 260 to the optical path layer 220, and accordingly, the thickness of the fingerprint detection device 200 can be reduced as much as possible.

In addition, the light-shielding layer 260 is configured to extend from above the support 251 to above the light path guide layer 222, which can prevent the light-shielding layer 260 from covering the lens layer 221 and shrinking the fingerprint detection device. Image capture area.

As shown in FIG. 3, in some embodiments of the present application, the light shielding layer 260 is a shielding glue layer, and the arc height position of the first gold wire 250 is covered by the shielding glue layer.

Designing the arc height position of the first gold wire 250 to be covered by the blocking adhesive layer not only can effectively block the light signal incident from the non-incident surface of the first sensor chip 230, but also can use the first sensor chip 230 A gold wire protective glue of a gold wire 250 supports the shielding glue layer, and accordingly, the stability of the fingerprint detection device 200 can be improved.

Of course, in other alternative embodiments, a filter can also be used to replace the light shielding layer 260. Wherein, the optical filter is used to reduce undesired ambient light in fingerprint sensing, so as to improve the optical sensing of the first sensor chip 230 to the received light. The filter can specifically be used to filter out light of a specific wavelength, for example, near-infrared light and part of red light. For example, a human finger absorbs most of the energy of light with a wavelength below 580nm. Based on this, the filter can be designed to filter light with a wavelength from 580nm to infrared to reduce the impact of ambient light on optical detection in fingerprint sensing. Influence. In a specific implementation, the filter may include one or more optical filters, and the one or more optical filters may be configured as, for example, a band-pass filter to allow the transmission of light emitted by the OLED screen while blocking the sun. Other light components such as infrared light in the light. One or more optical filters may be implemented as, for example, an optical filter coating formed on one or more continuous interfaces, or may be implemented as one or more discrete interfaces. For example, the filter may be a coating directly designed on the lens layer to avoid Newton's rings in the fingerprint image acquired by the first sensor chip 230. Optionally, in addition, the light entrance surface of the filter may be provided with an optical inorganic coating or an organic blackened coating, so that the reflectance of the light entrance surface of the filter is lower than a first threshold, for example, 1%, Therefore, it can be ensured that the first sensor chip 230 can receive enough light signals, thereby improving the fingerprint recognition effect.

As shown in FIG. 3, in some embodiments of the present application, the gold wire protective glue 252 of the first gold wire 250 is used to support the light shielding layer 260.

In other words, the thickness of the gold wire protective glue 252 is equal to the sum of the thickness of the light path guiding layer 222 in the light path layer 220, the thickness of the first sensor chip 230, and the thickness of the first fixing glue 240, so that The gold wire protective glue 250 supports the light shielding layer 260.

As shown in FIG. 3, in some embodiments of the present application, the fingerprint detection device 200 further includes a first double-sided adhesive layer 271, a film layer 272, and a second double-sided adhesive layer 273; wherein, the first The double-sided adhesive layer 271 is arranged above the light-shielding layer 260, the film layer 272 is arranged above the first double-sided adhesive layer 271, and the second double-sided adhesive layer 273 is arranged on the film material. Above layer 272.

Before installing the fingerprint detection device 200, by setting the first double-sided adhesive layer 271, the film layer 272, and the second double-sided adhesive layer 273, the fingerprint can be effectively prevented from being damaged during transportation. The optical path layer 220 in the detection device 200.

FIG. 4 is a schematic structural diagram of a modified structure of the fingerprint detection device 200 shown in FIG. 3.

As shown in FIG. 4, the fingerprint detection device 200 may further include a second sensor chip 280, a second fixing glue 281 and a second gold wire 282.

Wherein, the upper surface of the substrate 210 extends downward in a third area connected to the second area and penetrates the first covering layer 212 and the first conductive layer 211 to form a second groove. The second sensor chip 280 is fixed in the second groove by a second fixing glue 281, and the second sensor chip 280 is connected to the pad 2111 of the substrate 210 by the second gold wire 282, so that the The second sensor chip 280 is connected to the first sensor chip 230, and the second sensor chip 280 is used to cooperate with the first sensor chip 230 to perform off-screen fingerprint recognition. Optionally, the third area and the first area are respectively located on two sides of the second area.

By providing the second sensor chip 280, the processing tasks of the first sensor chip 230 can be shared, which is equivalent to replacing a fully functional and thicker sensor chip with a thinner first sensor arranged side by side The chip 230 and the second sensor chip 280, correspondingly, can reduce the thickness of the fingerprint detection device 200 without affecting the fingerprint recognition performance.

In some embodiments of the present application, there is a gap d7 between the sidewall of the second sensor chip 280 and the sidewall of the second groove. Optionally, the width of the gap d7 between the sidewall of the second sensor chip 280 and the sidewall of the second groove is 100-300um, for example 200um. Optionally, the thickness of the second sensor chip 280 is 50-150um, such as 60um, the maximum arc height of the second gold wire 282 is 30-60um, such as 40um, and the thickness of the second fixing glue 281 is 10-30um, for example 15um. Of course, alternatively, the width of the gap d7 between the sidewall of the second sensor chip 280 and the sidewall of the second groove, the thickness of the second sensor chip 280, and the second gold wire The maximum arc height of 282 or the thickness of the second fixing glue 281 may also be other specific values or within a predetermined value range, which is not specifically limited in the embodiment of the present application.

By designing a certain gap d7 between the side wall of the second sensor chip 280 and the side wall of the second groove, even if the size of the prepared product of the second sensor chip 280 is the same as that of the second sensor chip There is a difference between the design dimensions of the 280, or even if there is a difference between the actual dimensions of the second groove and the design dimensions of the second groove, it does not affect the installation of the second sensor chip 280 on the In the second groove.

In other words, the gap between the sidewall of the second sensor chip 280 and the sidewall of the second groove can not only serve as the dimensional tolerance of the second sensor chip 280 and/or serve as the size tolerance of the second groove The dimensional tolerance can also be used as the installation tolerance of the second sensor chip 280, and accordingly, the yield rate of the fingerprint detection device 200 can be improved.

It should be noted that when the fingerprint detection device 200 is installed in an electronic device, it can be connected to the main board of the electronic device through an additional flexible circuit board. For example, as shown in FIG. 5, the substrate 210 may also include a gold finger 2122 of the substrate 210. The gold finger 2122 of the substrate 210 is used to connect to a flexible circuit board. Accordingly, the substrate 210 passes through the flexible circuit. The board is connected to the main board of the electronic device.

FIG. 6 is a schematic structural diagram of a fingerprint detection device 200 provided with a flexible circuit board according to an embodiment of the present application.

As shown in FIG. 6, in some embodiments of the present application, the fingerprint detection device 200 may further include a flexible circuit board 290 and (Anisotropic Conductive Film, ACF) 292, and the flexible circuit board 290 is formed with the flexible circuit The gold finger 291 of the board 290; the gold finger 291 of the flexible circuit board 290 is electrically connected to the gold finger 2122 of the substrate 210 through the anisotropic conductive adhesive film 292.

Through the anisotropic conductive adhesive film 292, the gold finger 291 of the flexible circuit board 290 can be pressed to the gold finger 2122 of the substrate 210, which is equivalent to that the fingerprint detection device 200 can be configured with different specifications The flexible circuit board makes the fingerprint detection device 200 more versatile, and accordingly, can meet the needs of different users or customers.

As shown in FIG. 6, in some embodiments of the present application, the fingerprint detection device 200 may further include a protective glue 293 including an anisotropic conductive adhesive film 292, and the protective glue 293 may be located on the anisotropic conductive adhesive film 292. Both ends of the adhesive film 292 are used to protect the anisotropic conductive adhesive film 292, and further protect the golden fingers 291 of the flexible circuit board 290 and the golden fingers 2122 of the substrate 210. As shown in FIG. 6, in some embodiments of the present application, the fingerprint detection device 200 may further include an image processor 296, and the image processor 296 is provided at one end of the flexible circuit board 290. For example, the image processor 296 may be a Micro Processing Unit (MCU), which is used to receive fingerprint detection signals (such as fingerprint images) sent from the first sensor chip 230 through the flexible circuit board 290, and The fingerprint detection signal is simply processed. As shown in FIG. 6, in some embodiments of the present application, the fingerprint detection device 200 may further include at least one capacitor 295 provided at one end of the flexible circuit board 290, and the at least one capacitor 295 is used for optimization ( For example, filter processing) the fingerprint detection signal collected by the first sensor chip 230. Optionally, each chip in the first sensor chip 230 corresponds to one or more capacitors. As shown in FIG. 6, in some embodiments of the present application, the fingerprint detection device 200 may further include a connector 294 provided at one end of the flexible circuit board 290, and the connector 294 may be used to communicate with an external device. Or other components of the electronic device (such as a main board) are connected to realize communication with the external device or communication with other components of the electronic device. For example, the connector 294 may be used to connect the processor of the electronic device, so that the processor of the electronic device receives the fingerprint detection signal processed by the image processor 296, and based on the processed fingerprint detection signal Fingerprint detection signal for fingerprint identification.

It should be understood that FIGS. 3 to 6 are only examples of embodiments of the present application, and should not be construed as limiting the present application.

For example, in FIGS. 3 and 4, the lens layer 221 is used as a device for condensing optical signals in the optical path layer 220. Alternatively, the lens layer 221 may also use an optical collimator. For the related description of the optical collimator, refer to the related description of the optical path design of the fingerprint detection device 130 in the foregoing content.

For another example, the lens layer 221 may have a microlens array formed by a plurality of microlenses, the light path guiding layer 222 may be a light blocking layer, and the light blocking layer has a plurality of microholes and is disposed on the microlens layer 221 , And the micro holes correspond to the micro lenses one-to-one, and one or more optical sensing units in the first sensor chip 230 correspond to one micro lens in the lens layer 221. Optionally, the optical path layer 220 may also include other optical film layers, such as a dielectric layer or a passivation layer.

The fingerprint detection device 200 of the embodiment of the present application is described above in conjunction with FIGS. 3 to 6, and the installation scheme of the fingerprint detection device 200 will be described in detail below.

It should be noted that since the bracket layer 251, the bracket fixing glue 253, and the light shielding layer 260 are all optional layers, in order to facilitate the description of the fingerprint detection device from the perspective of installation, an intermediate concept (ie, a fixed structure) is introduced below. ). That is, the fixing structure includes at least one of the bracket layer 251, the bracket fixing glue 253, and the light shielding layer 260. In other words, the fixing structure is disposed on the upper surface of the substrate 210 and located on the side of the first sensor chip 230. The fixing structure is a connecting part of the fingerprint detection device 200, which is used to connect and fix the fingerprint detection device 200 on the lower surface of the display screen.

In other words, the fingerprint detection device 200 includes a substrate 210, an optical path layer 220, a first sensor chip 230, a first fixing glue 240, and a first gold wire 250. Wherein, the substrate 210 includes a first covering layer 212, a first conductive layer 211 layer 212, a base layer 213, a second conductive layer 214, and a second covering layer 215 in order from top to bottom. Optionally, the optical path layer 220 includes a lens layer 221 and an optical path guiding layer 222 thereunder. Optionally, the fixing structure may include a bracket 251 and a gold wire protective glue 252. The fixing structure may further include a light shielding layer 260. Optionally, the fingerprint detection device 200 may further include a second sensor chip 280, a second fixing glue 281, and a second gold wire 282.

In some embodiments of the present application, the fingerprint detection device 200 may be applicable to electronic equipment with a display screen, the bottom layer of the display screen is an opaque layer, and an opening through the opaque layer is formed on the opaque layer . Optionally, the overall thickness of the fingerprint detection device is 0.15-0.6 mm. Of course, the overall thickness of the fingerprint detection device can also be other values.

Wherein, the fingerprint detection device 200 includes:

An optical path layer 220 and a first sensor chip 230, where the optical path layer 220 is disposed above the first sensor chip 230;

Substrate 210, fixing structure and pressure sensitive adhesive;

Wherein, the first sensor chip 230 is fixedly electrically connected to the substrate 210, the fixing structure is disposed on the upper surface of the substrate 210, and the fixing structure surrounds the first sensor chip 230. The upper surface is fixed to the lower surface of the display screen by the pressure-sensitive adhesive, so that the first sensor chip 230 is aligned with the window setting, and the first sensor chip 230 is used for receiving through the window A fingerprint detection signal returned via a human finger above the display screen and guided by the optical path layer 220, and the fingerprint detection signal is used to detect fingerprint information of the finger.

Taking the display screen as an OLED screen as an example, when a finger is placed above the bright OLED screen, the finger will reflect the light emitted by the OLED screen, and this reflected light will penetrate the OLED screen to the bottom of the OLED screen. Since the fingerprint is a diffuse reflector, the light signal formed by the reflection or diffusion of the finger will exist in all directions. The fingerprint detection device 200 collects the light signal leaking from the upper side of the OLED screen, and performs imaging of the fingerprint image based on the received light signal.

In addition, the optical path layer 220 is directly disposed on the upper surface of the first sensor chip 230, and the lower surface of the first sensor chip 230 is fixed on the substrate 210 by the first fixing glue 240, so that the components are closely matched in the thickness direction. (That is, the components are tightly fitted in the thickness direction without leaving a gap), which reduces the size (for example, the thickness) of the fingerprint detection device 200.

Correspondingly, when the thickness of the fingerprint detection device 200 is controlled, it can be placed between the display screen and the battery, rather than disposing the fingerprint identification device at a position other than the battery. The original internal structure of the electronic device needs to be adjusted, and the utilization rate of the internal space of the electronic device can also be improved. For example, the volume of the battery can be increased, and the space saved can be used to accommodate the increased volume of the battery. Accordingly, the service life and user experience of the electronic device can be increased without increasing the volume of the electronic device.

In some embodiments of the present application, the side portion of the fixing structure includes the first side portion and at least one second side portion other than the first side portion, and the substrate 210 is close to the first side portion. One side is provided with a gold finger, the gold finger of the substrate 210 can be electrically connected to the gold finger of the flexible circuit board through an anisotropic conductive adhesive film, and the curing glue is provided on the at least one second side and Between the display screens, the pressure-sensitive adhesive is fixed relative to the display screen.

Without loss of generality, the curing adhesive is ultraviolet curing adhesive or hot melt adhesive.

Among them, ultraviolet (UV) curing adhesive can also be called UV glue, shadowless adhesive, UV light curing adhesive, etc. The ultraviolet curing adhesive is a one-component, low-viscosity, high-strength acrylic adhesive. The ultraviolet curable adhesive can be cured by ultraviolet light irradiation. The ultraviolet curing adhesive has the characteristics of long storage period, no solvent, fast curing speed, good transparency, and good heat resistance and chemical resistance.

The hot melt adhesive (Hot Glue) is a plastic adhesive whose physical state can change with temperature changes within a certain temperature range. Based on this, the pressure sensitive adhesive is covered by the hot melt adhesive, Not only can the curing effect of the cured adhesive be ensured, during the process of disassembling the fingerprint detection device 200, the hot melt adhesive can also be heated to reduce its curing effect, thereby reducing the disassembly or replacement of the fingerprint detection device. 200 operational complexity.

By disposing the curing adhesive between the at least one second side and the display screen to fix the pressure-sensitive adhesive relative to the display screen, the thrust value of the fingerprint detection device 200 can satisfy the end user The thrust test requirement is that the fingerprint detection device 200 will not produce displacement during the thrust test process. Based on this, the connection stability of the fingerprint detection device 200 during use can be guaranteed, and accordingly, the fingerprint detection device 200 can be ensured The performance stability of the fingerprint detection device 200 is described.

In summary, the technical solution of the present application can not only reduce the thickness of the fingerprint detection device 200, but also can ensure the performance stability of the fingerprint detection device 200.

In order to facilitate the understanding of the installation scheme of the fingerprint detection device 200, the following briefly introduces the structure of the display screen suitable for the present application.

FIG. 7 is a schematic structural diagram of a display screen 310 according to an embodiment of the present application.

As shown in FIG. 7, the display screen 310 may include:

Cover glass (CG) 311, first optical clear adhesive (OCA) 312, touch screen 313, second OCA 314, polarizer (POL) 315, display panel 316, support film 317, buffer layer (cushion) 318 and a copper foil layer 319. Optionally, the touch screen 313 can also be integrated into the display panel 316, that is, the display panel 316 can also be used as a touch screen.

The display panel 316 is used to display images, and the display panel 316 may also be referred to as a liquid crystal panel or a display panel. Optionally, the display panel 316 may be made of different materials to form various types of display panels. The display panel 316 may include a liquid crystal display (LCD) panel or an organic light emitting diode (OLED) display panel. LCD panels include but are not limited to thin film transistor (TFT) display panels, in-plane switching (IPS) display panels, and super LCD (Super LCD, SLCD) display panels. Optionally, the display panel 316 may adopt different material technologies to form different panels. For example, the display panel 316 may be an OLED organic light-emitting panel made of Low Temperature Poly-silicon (LTPS) technology, which has ultra-thin thickness, light weight, low power consumption, and can be used to provide clearer images. . Of course, other material technologies can also be used to prepare the panel, the other material technologies including but not limited to amorphous silicon (A-Si) technology, indium gallium zinc oxide (IGZO) technology, and continuous granular crystalline silicon (CGS) technology.

The CG 311 is used to protect the display screen, the first OCA is used to attach the CG 311 to the touch screen 313, and the second OCA 314 is used to connect the touch screen 313 to the POL 315, the POL 315 can be a kind of optical film with the function of generating polarized light, which is composited by a multi-layer polymer material. When the non-polarized light passes through the POL 315, it is filtered into a linear parallel to the target direction. For polarized light, the target direction is the polarization direction of the POL 315. The supporting film 317 is used to support the display panel 316.

The buffer layer 318 may also be referred to as a screen print layer or an embossing layer. The screen print layer may have graphics and text, and the graphics and text can be used as logos such as trademark patterns. The buffer layer 318 may be a black flake layer or a printed layer for shielding light. For example, the buffer layer 318 may have a layer structure formed of foam material. The copper foil layer 319 may also be called a heat dissipation layer (used to reduce the temperature of the display screen) or a radiation prevention layer. The buffer layer 318 and the copper foil layer 319 may be combined into the rear panel or bottom layer of the display screen 310, or the rear panel of the display screen may further include the buffer layer 318 and the copper foil layer 319. The transparent layer or opaque layer other than that is not limited in this application.

FIG. 8 is another schematic structural diagram of the display screen 310 according to an embodiment of the present application.

As shown in FIG. 8, the display screen 310 may include:

Cover glass (CG) 321, Optical Clear Adhesive (OCA) 322, Polarizer (POL) 323, Encapsulation (Encap) layer 324, display panel 325, and cushion 326. Optionally, the display panel 325 can also be used as a touch screen.

It should be noted that the display screen 310 shown in FIG. 7 may also be referred to as a soft screen. The display screen 310 shown in FIG. 8 may also be referred to as a hard screen. In other words, the fingerprint detection device 200 of the embodiment of the present application can be applied to both a soft screen (that is, the display screen 310) and a hard screen (that is, the display screen 310).

In the following, a specific solution of applying the fingerprint detection device 200 to a display screen with a copper foil layer or a supporting film will be exemplarily described with reference to the accompanying drawings.

FIG. 9 is a schematic side cross-sectional view of an electronic device 300 with a fingerprint detection device 200 pasted on the lower surface of the buffer layer 319 according to an embodiment of the present application. FIG. 10 is a schematic bottom view of the electronic device 300 shown in FIG. 9. Among them, FIG. 9 is a schematic cross-sectional view of the electronic device 300 along the direction of the dotted line shown in FIG. 10.

As shown in FIG. 9, the upper surface of the fixing structure is fixed to the lower surface of the copper foil layer 319 by the pressure-sensitive adhesive 391 in the surrounding area of the window. At this time, from the perspective of a bottom view, as shown in FIG. 10, the curing adhesive 392 covers the pressure-sensitive adhesive 391. The side portion of the fixing structure includes the first side portion 297 and at least one second side portion 298 except for the first side portion 297, wherein the curing glue 392 can be arranged on the fixing structure At least one outside of the second side 298.

FIG. 11 is a schematic side cross-sectional view of an electronic device 300 with a fingerprint detection device 200 pasted on the lower surface of a supporting film 317 according to an embodiment of the present application. FIG. 12 is a schematic bottom view of the electronic device 300 shown in FIG. 11. 11 is a schematic cross-sectional view of the electronic device 300 along the direction of the dotted line shown in FIG. 12.

As shown in FIG. 11, the upper surface of the fixing structure is fixed to the lower surface of the supporting film 317 by the pressure-sensitive adhesive 391. The opening of the opaque layer may include the opening of the buffer layer 318 and the opening of the copper foil layer 319. The opening of the opaque layer is used to provide an accommodation space for the fingerprint detection device 200 and the curing glue 392. At this time, from the perspective of a bottom view, as shown in FIG. 12, the curing adhesive 392 covers the pressure-sensitive adhesive 391, and a part of the lower surface of the supporting film 317 can be seen. The side portion of the fixing structure includes the first side portion 297 and at least one second side portion 298 except for the first side portion 297, wherein the curing glue 392 can be arranged on the fixing structure At least one outside of the second side 298.

In other words, the fingerprint detection device 200 can be applied to electronic equipment with a soft screen. Since the bottom layer of the display screen 310 includes a buffer layer 318 and a copper foil layer 319, the opening of the opaque layer can include the opening of the buffer layer 318. The window and the opening of the copper foil layer 319. At this time, the upper surface of the fixing structure is fixed to the lower surface of the copper foil layer 319 by the pressure-sensitive adhesive in the surrounding area of the window. Alternatively, the upper surface of the fixing structure is fixed to the lower surface of the supporting film 317 by the pressure-sensitive adhesive.

In short, if the opaque layer (ie, the bottom layer) of the display screen includes a buffer layer and a copper foil layer from top to bottom, and a support film is provided above the buffer layer; wherein, the upper surface of the fixed structure The pressure-sensitive adhesive may be fixed to the lower surface of the copper foil layer in the surrounding area of the opening, or the upper surface of the fixing structure may be fixed to the lower part of the support film by the pressure-sensitive adhesive. surface.

It should be understood that FIG. 9 to FIG. 12 are only examples of the present application, and should not be construed as limiting the present application.

In other alternative embodiments, the fingerprint detection device 200 can also be applied to electronic equipment with a hard screen, that is, the fingerprint detection device can also be applied to electronic equipment with a buffer layer as the bottom layer.

With reference to FIG. 8, if the fingerprint detection device 200 can be applied to an electronic device with a hard screen, since the bottom layer of the display screen 310 is the buffer layer 326, the upper surface of the fixing structure is fixed by the pressure-sensitive adhesive The lower surface of the buffer layer 326 is located in the surrounding area of the window. At this time, the opening of the buffer layer 326 is the opening of the opaque layer.

In short, the opaque layer (ie, the bottom layer) of the display screen is a buffer layer, and the upper surface of the fixing structure is fixed to the lower surface of the buffer layer by the pressure-sensitive adhesive in the surrounding area of the window. .

The fingerprint detection device is pasted to the buffer layer of the display screen (for example, the buffer layer 326 shown in FIG. 8), the copper foil layer (for example, , The copper foil layer 319 as shown in FIG. 7) or the lower surface of the support film (for example, the support film 317 as shown in FIG. 7) is compared with the one where the fingerprint detection device is directly attached to the display screen The display panel (for example, the display panel 316 shown in FIG. 7 and another example, the display panel 325 shown in FIG. 8) can not only prevent the fingerprint detection device from being attached to the display screen to affect the display The performance of the screen can also reduce the difficulty of installing the fingerprint detection device, and accordingly, can reduce the installation complexity of the fingerprint detection device and improve the yield of the electronic equipment.

Moreover, sticking the fingerprint detection device to the bottom surface of the buffer layer, copper foil layer or support film of the display screen can also avoid damage to the display screen during the process of disassembling the fingerprint detection device, and accordingly, can reduce The disassembly complexity of the fingerprint detection device improves the yield of the electronic equipment.

In addition, the fingerprint detection device is pasted to the buffer layer (for example, the buffer layer 326 shown in FIG. 8) or the copper foil layer of the display screen by using the fixing structure of the substrate through the first pressure-sensitive adhesive (For example, the copper foil layer 319 shown in FIG. 7), when the display screen is pressed or the electronic device falls or collides, due to the presence between the display panel and the fingerprint detection device The lower surface of the buffer layer and/or the copper foil layer can prevent the display panel and the fingerprint detection device from being squeezed to affect the performance of the display panel and the fingerprint detection device.

Moreover, by sticking the fingerprint detection device to the bottom surface of the buffer layer or the copper foil layer of the display screen, compared to directly bonding the fingerprint detection device to the display panel or support film of the display screen, It can also avoid the size of the opening window being too large, and accordingly, the visibility of the user when viewing the fingerprint detection device from the front of the display screen can be reduced, thereby beautifying the appearance of the electronic device.

FIG. 13 is a schematic side cross-sectional view of an electronic device 300 provided with a positioning structure on a supporting film 317 according to an embodiment of the present application. FIG. 14 is a schematic bottom view of the electronic device 300 shown in FIG. 13. Wherein, FIG. 13 is a schematic cross-sectional view of the electronic device 300 along the direction of the dotted line shown in FIG. 14.

As shown in FIG. 13 or 14, in some embodiments of the present application, the fingerprint detection device 200 may further include:

Limiting structure 41 and structure fixing glue 42;

Wherein, the limiting structure 41 is fixed on the outside of the at least one second side of the lower surface of the display screen 310 by the structure fixing glue 42, and the curing glue 392 is disposed on the limiting structure 41. And the at least one second side.

By providing the limiting structure 41, not only can a storage space for the curing glue 392 be provided, but also a storage space for the curing glue 392 can be constructed. Accordingly, it can be ensured that the at least one second side portion is covered with Enough curing glue to improve the curing effect of the curing glue 392.

As shown in FIG. 14, in some embodiments of the present application, the limiting structure 41 includes a limiting plate 411, and the limiting plate 411 is provided with an opening corresponding to the first side portion.

As shown in FIG. 13, in some embodiments of the present application, at least one limiting block 412 corresponding to the at least one second side portion is formed on the inner side of the limiting plate 411, and the limiting plate 411 A step structure is formed with the at least one limiting block 412, and the step structure includes a lower surface of the at least one limiting block 412, a lower surface of the limiting plate 411 forming a step structure, and a step structure for connecting the at least one limiting block 412. The lower surface of a limiting block 412 and the vertical surface of the lower surface of the limiting plate 411, the lower surface of the limiting plate 411 is fixed to the lower surface of the display screen by the structural fixing glue, the at least The lower surface of a limit block 412 is arranged in contact with the upper surface of the pressure sensitive adhesive.

Through the step structure, the limiting structure 41 can not only limit the displacement of the pressure-sensitive adhesive, but also limit the displacement of the cured adhesive, that is, it can simultaneously strengthen the adhesive effect and the pressure-sensitive adhesive of the pressure-sensitive adhesive. The curing effect of the cured adhesive is described.

In other alternative embodiments, the lower surface of the at least one limiting block 412 may also be arranged on the upper surface of the pressure-sensitive adhesive through an adhesive.

As shown in FIG. 13, in some embodiments of the present application, a gap for accommodating the curing glue is formed between the vertical surface and the side wall of the pressure-sensitive adhesive.

By disposing the curing adhesive between the vertical surface and the pressure-sensitive adhesive, not only the contact area between the pressure-sensitive adhesive and the curing adhesive can be ensured to ensure the curing effect of the curing adhesive, but also A buffer space can be provided between the pressure-sensitive adhesive and the limiting plate 411. The buffering space can prevent the limiting plate 411 from directly contacting the pressure-sensitive adhesive. Accordingly, it can be avoided due to the limitation. The position plate 411 squeezes the pressure-sensitive adhesive to cause the fingerprint identification device to be misaligned, thereby ensuring the stability of the performance of the fingerprint detection device.

As shown in FIG. 14, in some embodiments of the present application, a gap for accommodating the curing glue is formed between the at least one limiting block 412 and the at least one second side portion 298 respectively.

By disposing the curing glue between each limiting block 412 and the corresponding second side portion, not only can it be ensured that the at least one second side portion 298 has a sufficient contact area with the curing glue to ensure the curing effect , It can also provide a buffer space between the at least one second side portion 298 and the at least one limiting block 412, and the buffer space can prevent the at least one limiting block 412 from directly touching the at least one side The part, correspondingly, can ensure the stability of the performance of the fingerprint detection device.

As shown in FIG. 14, in some embodiments of the present application, each of the at least one limiting block 412 is a T-shaped limiting block.

By designing each of the at least one limiting block 412 as a T-shaped limiting block 412, it is possible to increase the receiving space of the limiting structure 41 on the basis of ensuring the accommodating space of the curing glue. The force area, correspondingly, can improve the limiting effect of the limiting structure 41.

In other alternative embodiments, each of the at least one limiting block 412 may also be an L-shaped limiting block or a limiting block with a regular shape or an irregular shape.

As shown in FIG. 14, in some embodiments of the present application, the limiting plate 411 may also form an L-shaped structure in an area close to the first side portion 297 to form a constraining space for the curing glue 392.

It should be understood that FIGS. 13 to 14 are only examples of the present application, and should not be construed as limiting the present application.

For example, the fingerprint detection device 200 shown in FIG. 13 and FIG. 14 may be fixedly arranged on the lower surface of the copper foil layer 319 by the limiting structure 41 in the area surrounding the window, but the embodiment of the present application is not limited thereto. In other alternative embodiments, for example, as shown in FIG. 15 and FIG. 16, the fingerprint detection device 200 may be fixedly arranged on the lower surface of the support film 317 through a limiting structure 41. As another example, the fingerprint detection The device 200 can be fixedly arranged on the lower surface of the buffer layer 326 as shown in FIG.

For another example, the electronic device 300 involved in the embodiment of the present application may further include a middle frame. The middle frame may be used to carry or support various devices or components in the electronic device 300. The device or component includes, but is not limited to, a battery, a camera, an antenna, a main board, and the display screen.

Without loss of generality, the middle frame is formed with a groove under the fingerprint detection device 200, and the groove of the middle frame is used to accommodate the fingerprint detection device 200; or, the middle frame is formed with a through hole. The opening of the middle frame is used to provide an accommodation space for the fingerprint detection device 200. In other words, the fingerprint detection device 200 is attached to the lower surface of the display screen in a hanging manner. For example, there is a gap between the fingerprint detection device 200 and the devices below the middle frame. For another example, there may be no gap between the fingerprint detection device 200 and the components below the middle frame. For another example, the electronic device may further include a battery located below the fingerprint detection device 200, the fingerprint detection device 200 and the battery are respectively disposed on both sides of the middle frame, the middle frame and the A battery easy-pull glue is arranged between the batteries.

For another example, the lower surface of the supporting film is provided with a connecting portion corresponding to the upper surface of the fixing structure in the area of the window, and the connecting portion is connected to the supporting film by a double-sided tape. Optionally, the connecting portion is a rigid reinforcing plate or a polyethylene terephthalate glue layer. Optionally, the connecting portion is an opaque dielectric layer.

Through the connecting portion, it is possible to prevent the curing adhesive or the pressure-sensitive adhesive from forming irregular sticking marks on the supporting film, and accordingly, it is possible to ensure the aesthetics of the electronic device equipped with the fingerprint detection device. In addition, setting the connecting portion as an opaque medium layer is equivalent to reducing the size of the window, and accordingly, it can reduce the visibility of the fingerprint detection device when the user views the fingerprint detection device from the front of the display screen. , Which in turn can beautify the appearance of electronic devices.

It should be noted that the preferred embodiments of the present application are described in detail above with reference to the accompanying drawings. However, the present application is not limited to the specific details in the foregoing embodiments. Within the scope of the technical concept of the present application, the technical solutions of the present application can be implemented. Many simple variants, these simple variants all belong to the scope of protection of this application. For example, the specific technical features described in the above specific embodiments can be combined in any suitable manner without contradiction. In order to avoid unnecessary repetition, various possible combinations are not discussed in this application. Explain separately. For another example, the various implementations of the present application can also be combined arbitrarily, as long as they do not violate the idea of the present application, they should also be regarded as the content disclosed in the present application.

A person of ordinary skill in the art may be aware that the units and algorithm steps of the examples described in combination with the embodiments disclosed herein can be implemented by electronic hardware or a combination of computer software and electronic hardware. Whether these functions are executed by hardware or software depends on the specific application and design constraint conditions of the technical solution. Professionals and technicians can use different methods for each specific application to implement the described functions, but such implementation should not be considered as going beyond the scope of this application.

Those skilled in the art can clearly understand that, for the convenience and conciseness of description, the specific working process of the above-described system, device, and unit can refer to the corresponding process in the foregoing method embodiment, which will not be repeated here.

In the several embodiments provided in this application, it should be understood that the disclosed system, device, and method can be implemented in other ways. For example, the device embodiments described above are merely illustrative, for example, the division of the units is only a logical function division, and there may be other divisions in actual implementation, for example, multiple units or components can be combined or It can be integrated into another system, or some features can be ignored or not implemented. In addition, the displayed or discussed mutual coupling or direct coupling or communication connection may be indirect coupling or communication connection through some interfaces, devices or units, and may be in electrical, mechanical or other forms.

The units described as separate components may or may not be physically separated, and the components displayed as units may or may not be physical units, that is, they may be located in one place, or they may be distributed on multiple network units. Some or all of the units may be selected according to actual needs to achieve the objectives of the solutions of the embodiments.

In addition, the functional units in the various embodiments of the present application may be integrated into one processing unit, or each unit may exist alone physically, or two or more units may be integrated into one unit.

If the function is implemented in the form of a software functional unit and sold or used as an independent product, it can be stored in a computer readable storage medium. Based on this understanding, the technical solution of this application essentially or the part that contributes to the existing technology or the part of the technical solution can be embodied in the form of a software product, and the computer software product is stored in a storage medium, including Several instructions are used to make a computer device (which may be a personal computer, a server, or a network device, etc.) execute all or part of the steps of the methods described in the various embodiments of the present application. The aforementioned storage media include: U disk, mobile hard disk, read-only memory (ROM, Read-Only Memory), random access memory (RAM, Random Access Memory), magnetic disks or optical disks and other media that can store program codes. .

The above are only specific implementations of this application, but the protection scope of this application is not limited to this. Any person skilled in the art can easily think of changes or substitutions within the technical scope disclosed in this application. Should be covered within the scope of protection of this application. Therefore, the protection scope of this application shall be subject to the protection scope of the claims.

Claims

A fingerprint detection device, characterized in that it is suitable for electronic equipment with a display screen, the bottom layer of the display screen is an opaque layer, and an opening through the opaque layer is formed on the opaque layer;

The fingerprint detection device includes:

An optical path layer and a first sensor chip, where the optical path layer is arranged above the first sensor chip;

Substrate, fixing structure and pressure sensitive adhesive;

Wherein, the first sensor chip is fixed and electrically connected to the substrate, the fixing structure is arranged on the upper surface of the substrate and the fixing structure surrounds the first sensor chip, and the upper surface of the fixing structure passes through the The pressure-sensitive adhesive is fixed to the lower surface of the display screen, so that the first sensor chip is aligned with the window opening, and the first sensor chip is used for receiving through the window opening above the display screen. A fingerprint detection signal returned by a human finger and guided through the optical path layer, the fingerprint detection signal being used to detect fingerprint information of the finger;

Curing glue

Wherein, the side portion of the fixing structure includes the first side portion and at least one second side portion other than the first side portion, and the substrate is provided with gold at a position close to the first side portion. Finger, the gold finger of the substrate can be electrically connected to the gold finger of the flexible circuit board through an anisotropic conductive adhesive film, and the curing glue is arranged between the at least one second side and the display screen so as to face each other The display screen fixes the pressure-sensitive adhesive.
The fingerprint detection device according to claim 1, wherein the curing glue is ultraviolet curing glue or hot melt glue.
The fingerprint detection device according to claim 1 or 2, wherein the fingerprint detection device further comprises:

Limiting structure and structural fixing glue;

Wherein, the limiting structure is fixed on the outer side of the at least one second side portion of the lower surface of the display screen by the structure fixing glue, and the curing glue is disposed on the limiting structure and the at least one Between the second side.
The fingerprint detection device according to claim 3, wherein the limit structure comprises a limit plate, and the limit plate is provided with an opening corresponding to the first side.
The fingerprint detection device according to claim 4, wherein the inner side of the limit plate is formed with at least one limit block corresponding to the at least one second side part, and the limit plate and the At least one limit block is formed with a step structure, the step structure includes a lower surface of the at least one limit block, a lower surface of the limit plate forms a step structure, and a lower surface for connecting the at least one limit block. The surface and the vertical surface of the lower surface of the limiting plate, the lower surface of the limiting plate is fixed to the lower surface of the display screen by the structural fixing glue, and the lower surface of the at least one limiting block is arranged in contact with On the upper surface of the pressure-sensitive adhesive.
The fingerprint detection device according to claim 5, wherein a gap for accommodating the curing glue is formed between the at least one limiting block and the at least one second side portion, respectively.
The fingerprint detection device according to claim 5, wherein a gap for accommodating the curing glue is formed between the vertical surface and the side wall of the pressure-sensitive adhesive.
The fingerprint detection device according to claim 5, wherein each of the at least one limit block is a T-shaped limit block.
The fingerprint detection device according to claim 1 or 2, wherein the opaque layer is a buffer layer, and the upper surface of the fixing structure is fixed to the lower surface of the buffer layer by the pressure-sensitive adhesive. Describe the area around the window.
The fingerprint detection device according to claim 1 or 2, wherein the opaque layer includes a buffer layer and a copper foil layer from top to bottom, and a support film is arranged above the buffer layer; wherein the fixed The upper surface of the structure is fixed to the area around the opening of the lower surface of the copper foil layer by the pressure-sensitive adhesive, or the upper surface of the fixing structure is fixed to the support by the pressure-sensitive adhesive The lower surface of the membrane.
The fingerprint detection device according to claim 10, wherein the lower surface of the supporting film is provided with a connecting portion corresponding to the upper surface of the fixing structure in the area of the window, and the connecting portion is provided with a double-sided Glue is connected to the supporting film.
The fingerprint detection device according to claim 10, wherein the connecting portion is a rigid reinforcement plate or a polyethylene terephthalate glue layer.
The fingerprint detection device according to claim 10, wherein the connecting portion is an opaque medium layer.
The fingerprint detection device according to claim 1 or 2, wherein the substrate comprises a first covering layer, a first conductive layer, a base material layer, a second conductive layer, and a second covering layer in order from top to bottom, The upper surface of the substrate extends downward in the first area and penetrates the first covering layer and the first conductive layer to form a first groove, and the upper surface of the substrate is connected to the first area The second area extends downward and penetrates the first covering layer to form a pad of the substrate;

The fingerprint detection device further includes:

The first fixing glue and the first gold wire;

Wherein, the lower surface of the first sensor chip is fixed in the first groove by the first fixing glue, and the first sensor chip is connected to the pad of the substrate by the first gold wire.
The fingerprint detection device according to claim 14, wherein the fingerprint detection device further comprises:

The second sensor chip, the second fixing glue and the second gold wire;

Wherein, the upper surface of the substrate extends downward in a third area connected to the second area and penetrates the first covering layer and the first conductive layer to form a second groove, and the second sensor The chip is fixed in the second groove by a second fixing glue, and the second sensor chip is connected to the pad of the substrate by the second gold wire, so that the second sensor chip is connected to the The first sensor chip, and the second sensor chip is used to cooperate with the first sensor chip to perform under-screen fingerprint recognition.
The fingerprint detection device according to claim 14, wherein the fixed structure comprises:

Bracket and gold wire protective glue;

Wherein, the gold wire protective glue is used to encapsulate the first gold wire, and the bracket is arranged on the upper surface of the first cover film and located outside the first sensor chip.
The fingerprint detection device according to claim 16, wherein the bracket is a polyethylene terephthalate glue layer; or the bracket is fixed on the upper surface of the first cover film by a bracket fixing glue And located outside the first sensor chip.
The fingerprint detection device according to claim 16, wherein the fixing structure further comprises:

Shading layer

Wherein, the optical path layer includes a lens layer and an optical path guiding layer, and the microlens is used to converge the optical signal returned via the human finger above the display screen to the optical path guiding layer, and the optical path guiding layer condenses the The light signal condensed by the microlens is guided to the first sensor chip, the light shielding layer extends from above the support to the light path guiding layer, and a gap is formed between the light shielding layer and the microlens layer, The light shielding layer is used for shielding light signals incident from other positions than the incident surface of the first sensor chip.
18. The fingerprint detection device according to claim 18, wherein the light-shielding layer is a light-shielding glue layer, and the arc height position of the first gold wire is covered by the light-shielding glue layer.
The fingerprint detection device according to claim 1 or 2, wherein the fingerprint detection device further comprises the flexible circuit board, and the gold finger of the flexible circuit board is electrically connected to the flexible circuit board through the anisotropic conductive adhesive film. The gold finger of the substrate.
An electronic device, characterized in that it comprises:

Display screen

The fingerprint detection device is arranged below the display screen, the fingerprint detection device is the fingerprint detection device according to any one of claims 1 to 20, and the fingerprint collection area is at least partially located in the display area of the display screen Among.
22. The electronic device according to claim 21, wherein the electronic device further comprises a middle frame; wherein the upper surface of the middle frame extends downward to form a third groove, and the fingerprint detection device extends to the In the third groove, or, the middle frame is formed with an opening penetrating the middle frame, and the opening is used to provide an accommodation space for the fingerprint detection device.