CN111801685A

CN111801685A - Fingerprint detection device and electronic equipment

Info

Publication number: CN111801685A
Application number: CN202080001525.0A
Authority: CN
Inventors: 王景; 刘凯; 刘相英
Original assignee: Shenzhen Goodix Technology Co Ltd
Current assignee: Shenzhen Goodix Technology Co Ltd
Priority date: 2019-05-29
Filing date: 2020-03-27
Publication date: 2020-10-20
Anticipated expiration: 2040-03-27

Abstract

The application provides a fingerprint detection device and electronic equipment, can avoid newton's ring problem. This fingerprint detection device sets up the below at this display screen of electronic equipment, and this fingerprint detection device includes: the filter layer, the silk screen printing of the lower surface of the filter layer supports the ink, support the ink and is used for supporting and keeping the interval between upper surface of the filter layer and light path layer; an optical path layer disposed below the filter layer; a first sensor chip disposed below the optical path layer; the sensor chip comprises a substrate, a first chip and a second chip, wherein a first groove is formed in the upper surface of the substrate in a downward extending mode, at least one part of the first chip is arranged in the first groove, and the first chip is electrically connected to the substrate; the bracket is arranged above the substrate around the first sensor chip and used for supporting the filter layer; the first sensor chip is used for receiving fingerprint detection signals which return through the filter layer and the light path layer after passing through a human finger above the display screen, so that the fingerprint information of the finger can be detected.

Description

Fingerprint detection device and electronic equipment

Technical Field

The embodiments of the present application relate to the field of fingerprint identification, and more particularly, to a fingerprint detection apparatus and an electronic device.

Background

The scheme of fingerprint identification under the screen is to attach an optical or ultrasonic fingerprint identification module to the bottom of a Light Emitting layer of an Organic Light-Emitting Diode (OLED) screen, that is, the optical fingerprint identification module and the ultrasonic fingerprint identification module are required to be tightly bonded to the bottom Light Emitting layer of the Light Emitting layer.

To the optical fingerprint scheme under the screen, there is a kind that contains the collimater that is used for the light path adjustment to fingerprint identification module. The period of the collimator of the fingerprint identification module needs to be the same as the period formed by the panel wiring of the screen display, so that the collected image is ensured to have no moire fringes, and the normal use of the fingerprint function cannot be influenced. On the other hand, the optical filter used in the method is usually filled and adhered to the surface of the sensor by using optical cement, and once the thickness of the glue covering the surface of the sensor is uneven, a newton ring phenomenon exists, so that the normal use of the fingerprint function is influenced.

Disclosure of Invention

The embodiment of the application provides a fingerprint detection device and electronic equipment, and the Newton's ring problem can be avoided.

In a first aspect, a fingerprint detection device is provided, which is suitable for an electronic device having a display screen, the fingerprint detection device is disposed below the display screen, and the fingerprint detection device includes: the lower surface of the filter layer is provided with silk-screen support printing ink; the optical path layer is arranged below the filter layer, a gap is formed between the upper surface of the optical path layer and the lower surface of the supporting ink, and the supporting ink is used for supporting the filter layer so that a gap is kept between the upper surface of the optical path layer and the lower surface of the filter layer; a first sensor chip disposed below the optical path layer; the sensor chip comprises a substrate, a first chip and a second chip, wherein a first groove is formed in the upper surface of the substrate in a downward extending mode, at least one part of the first sensor chip is arranged in the first groove, and the first sensor chip is electrically connected to the substrate; a support disposed above the substrate around the first sensor chip for supporting the filter layer; the first sensor chip is used for receiving fingerprint detection signals which pass through the filter layer and the light path layer after the human body finger above the display screen returns, and the fingerprint detection signals are used for detecting fingerprint information of the finger.

The fingerprint identification module of the embodiment of the application arranges the filter layer above the light path layer, and the external filter layer can effectively block the influence of ambient light on the fingerprint identification process, thereby avoiding the image contrast reduction caused by the intervention of strong light when a user unlocks the fingerprint and further preventing the abnormal unlocking problem; and the middle of the lower surface of the filter layer is printed with supporting ink corresponding to the sensing area of the fingerprint chip in a silk screen mode, and the supporting ink supports the middle position of the filter layer, so that the problem of Newton's rings caused by deformation of the filter layer is solved.

In addition, the light path layer of the fingerprint detection device in the embodiment of the application is directly arranged on the upper surface of the first sensor chip, and the lower surface of the first sensor chip is fixed on the substrate, so that the situation that a shell is separately arranged for carrying the light path layer and the first sensor chip can be avoided, and the size (such as thickness) of the fingerprint detection device is reduced; and, set up fingerprint detection device in the recess of base plate, can reduce fingerprint detection device's thickness.

And thirdly, the thickness of the fingerprint detection device is reduced to the maximum extent through close fit among all the layers in the thickness direction.

Finally, because the light path layer directly sets up the upper surface of first sensor chip, fingerprint detection device's image acquisition visual field only receives the area on light path layer and the influence of the area of the first sensor chip that corresponds, based on this, can rationally design the area on light path layer and the area of the first sensor chip that corresponds according to actual demand to satisfy different users and different customers' demand (for example can satisfy the demand in large tracts of land image acquisition visual field).

In some possible implementations, there are gaps between the side wall of the first sensor chip and the side wall of the first recess, and between the side wall of the bracket near the first sensor chip and the side wall of the first sensor chip.

Through at the lateral wall of first sensor chip with design certain clearance between the lateral wall of first recess, and set up the clearance between support lateral wall and first sensor chip lateral wall, even if there is the difference between the size of the preparation product of first sensor chip with first sensor chip design size, or even if there is the difference between the actual size of first recess with the design size of first recess, there is the difference between the actual size and the design size of support, do not influence will first fingerprint sensor chip installs in first recess.

In other words, the gap between the side wall of the first sensor chip and the side wall of the first groove may be used not only as a dimensional tolerance of the first sensor chip and/or as a dimensional tolerance of the first groove, but also as a mounting tolerance of the first sensor chip; accordingly, the gap between the side wall of the bracket and the side wall of the first sensor chip can be used as the dimensional tolerance of the first sensor chip and/or the dimensional tolerance of the bracket, and can also be used as the installation tolerance of the first sensor chip, so that the yield of the fingerprint detection device can be improved.

In some possible implementations, the fingerprint detection apparatus further includes: the first gold thread is used for electrically connecting the first sensor chip and the conducting layer of the substrate, and is positioned between the side wall of the first sensor chip and the side wall of the first groove, and the support is close to the side wall of the first sensor chip and the gap between the side walls of the first sensor chip.

In some possible implementations, a width of a gap between the sidewall of the first sensor chip and the sidewall of the bracket near the first sensor chip is greater than or equal to a width of a gap between the sidewall of the first sensor chip and the sidewall of the first groove.

In some possible implementation manners, a value range of a width of a gap between the sidewall of the first sensor not close to the first gold wire and the sidewall of the first groove is 100-400um, for example, may be set to 200um, and a value range of a gap between the sidewall of the first sensor not close to the first gold wire and the sidewall of the bracket close to the first sensor chip is 100-400um, for example, may be set to 270 um.

In some possible implementations, one side of the lower surface of the filter layer close to the first gold wire is fixed to the upper surface of the first sensor chip, and the other side of the lower surface of the filter layer is fixed to the upper surface of the support.

For example, the lower surface of the filter layer may be rectangular, and then one side of the lower surface of the filter layer is close to the gold wire, and the other three sides are not close to the gold wire, and the three-side region not close to the gold wire may be fixed on the upper surface of the bracket, and one side close to the gold wire is fixed on the upper surface of the first sensor chip, so that the influence on the installation of the gold wire can be avoided.

In some possible implementation manners, one side of the lower surface of the filter layer, which is close to the first gold wire, is fixed on the upper surface of the first sensor chip through a first adhesive, and the other side of the lower surface of the filter layer is fixed on the upper surface of the support through a second adhesive.

One side of the lower surface of the filter layer, which is close to the first gold thread, is fixed on the upper surface of the first sensor chip through the first back adhesive, so that the gold thread protection adhesive for fixing the gold thread can be prevented from flowing into the light path layer.

In some possible implementations, the filter layer has a thickness less than or equal to 220 um.

The thickness of the filter layer is typically 110um, considering the existing process and the mass-producibility.

In some possible implementations, a center of the supporting ink coincides with a center of the sensing area of the first sensor chip in a vertical direction.

Since the central position is more balanced with respect to the supporting force of the whole filter layer, the position of the screen printing for supporting the ink is usually set to coincide with the center of the sensing area of the first sensor chip below.

In some possible implementations, the thickness of the supporting ink is less than or equal to 30 um.

The contrast of newton's rings gradually decreases with the increase in the thickness of the supporting ink, and the newton's rings substantially disappear when the distance is 25um, and therefore, the thickness of the supporting ink is generally set to 25 um.

In some possible implementations, the area of the supporting ink is less than or equal to 40 × 40um, for example, may be set to 30um × 30 um.

Under the prerequisite that does not influence fingerprint identification, the size of the support printing ink of silk screen printing is big more, and is better to the support effect of filter layer, that is to say the filter layer is non-deformable more, also is difficult for producing newton's ring more.

In some possible implementations, a light-entering face of the filter layer has a reflectivity of less than or equal to 1% for light.

In some possible implementations, the total thickness of the fingerprint detection device ranges from 0.15 mm to 0.6 mm.

In some possible implementation manners, the substrate sequentially includes a first covering layer, a first conductive layer, a substrate layer, a second conductive layer, and a second covering layer from top to bottom, the upper surface of the substrate extends downward in a first region and penetrates through the first covering layer and the first conductive layer to form the first groove, and the upper surface of the substrate extends downward in a second region connected with the first region and penetrates through the first covering layer to form a pad of the substrate; the first sensor chip is connected to the bonding pad of the substrate through the first gold wire.

By removing the first cover layer and the first conductive layer of the substrate at the first area to form the first groove for accommodating the first fixing adhesive and the first sensor chip, the thickness of the fingerprint detection device can be reduced.

Secondly, through getting rid of the base plate first overburden of second region department forms and is used for the electricity to connect the base plate pad of first sensor chip can provide accommodation space for being used for the electricity to connect first sensor chip with the base plate first gold thread, it is corresponding, reduced first gold thread is in the occupation space of base plate top, and then can reduce fingerprint detection device's thickness.

In some possible implementations, the fingerprint detection apparatus further includes: the lower surface of the first sensor chip is fixed in the first groove through the first fixing glue.

In some possible implementations, a thickness of the first cover layer is equal to a thickness of the second cover layer, and a thickness of the first conductive layer is the same as a thickness of the second conductive layer.

In some possible implementation manners, the total thickness of the substrate is less than or equal to 150um, the thickness of the first covering layer and the thickness of the second covering layer are both less than or equal to 30um, the thickness of the first conducting layer and the thickness of the second conducting layer are both less than or equal to 20um, and the thickness of the base material is 80 um.

In some possible implementation manners, the thickness of the first sensor chip is less than or equal to 150um, the maximum arc height of the first gold wire is less than or equal to 60um, and the thickness of the first fixing glue is less than or equal to 30 um.

In some possible implementations, the outer side of the bracket is shortened by a preset distance relative to the outer side of the first cover film in a direction approaching the first sensor chip.

In some possible implementations, the value range of the preset distance is 100-400um, for example, may be set to 200 um.

The preset distance can be used as the dimensional tolerance of the support and also can be used as the installation tolerance of the support, and accordingly, the yield of the fingerprint detection device can be improved.

In some possible implementations, the fingerprint detection apparatus further includes: the second sensor chip, the second fixing glue and the second gold thread; the upper surface of the substrate extends downwards in a third area connected with the second area and penetrates through the first covering layer and the first conducting layer to form a second groove, the second sensor chip is fixed in the second groove through the second fixing glue, the second sensor chip is connected to the bonding pad of the substrate through the second gold thread, so that the second sensor chip is connected to the first sensor chip, and the second sensor chip is used for matching with the first sensor chip to perform fingerprint identification under a screen.

Through the second sensor chip, the processing task of the first sensor chip can be shared, namely, one sensor chip with complete function and thicker is replaced by the first sensor chip and the second sensor chip which are arranged in parallel and have thinner thickness, and accordingly, the thickness of the fingerprint detection device can be reduced on the basis of not influencing the fingerprint identification performance.

In some possible implementations, a gap exists between a sidewall of the second sensor chip and a sidewall of the second recess.

By designing a certain gap between the side wall of the second sensor chip and the side wall of the second groove, even if there is a difference between the size of the product of the second sensor chip and the design size of the second sensor chip, or even if there is a difference between the actual size of the second groove and the design size of the second groove, the mounting of the second fingerprint sensor chip in the second groove is not affected.

In other words, the gap between the sidewall of the second sensor chip and the sidewall of the second groove may be used not only as the dimensional tolerance of the second sensor chip and/or the dimensional tolerance of the second groove, but also as the mounting tolerance of the second sensor chip, and accordingly, the yield of the fingerprint detection apparatus can be improved.

In some possible implementation manners, a value range of a width of a gap between the sidewall of the second sensor chip not close to the first gold wire and the sidewall of the second groove is 100-400um, for example, 200um may be used.

In some possible implementation manners, the thickness of the first sensor chip is equal to the thickness of the second sensor chip, the thickness of the first fixing glue is equal to the thickness of the second fixing glue, and the maximum arc height of the first gold wire is equal to the maximum arc height of the second gold wire.

In some possible implementations, the fingerprint detection apparatus further includes: and the gold thread protection adhesive is used for packaging the first gold thread and the second gold thread.

Through the gold thread protection glue can guarantee the base plate with the stability of the electricity connection between the first sensor chip, it is corresponding, can guarantee fingerprint detection device's performance.

In some possible implementations, the height of the gold wire protection paste is less than or equal to 200 um.

In some possible implementations, the thickness of the gold wire protection paste is less than or equal to the sum of the thickness of the optical path layer, the thickness of the first sensor chip, and the thickness of the first fixing paste.

The thickness of the gold wire protection adhesive is smaller than or equal to the sum of the thickness of the light path layer, the thickness of the first sensor chip and the thickness of the first fixing adhesive, so that the thickness of the fingerprint detection device can be reduced as much as possible while the first gold wire is effectively packaged.

In some possible implementations, the fingerprint detection apparatus further includes: the foam layer is arranged above the support around the filter layer, an opening penetrating through the foam layer is formed in the foam layer, and the first sensor chip receives the fingerprint detection signal through the opening of the foam layer; the upper surface of the foam layer is flush with the upper surface of the filter layer.

Because the filter layer sets up in light path layer top, there may be the height that highly is less than the upper surface of filter layer of the upper surface of support, lead to whole fingerprint detection device's upper surface height inconsistent, can be through setting up the bubble cotton this moment for fingerprint detection device's upper surface is level and smooth, and then conveniently will install this fingerprint detection device in the below of display screen.

In some possible implementations, the support is a polyethylene terephthalate PET glue layer for connecting the substrate and the foam layer; or the lower surface of the support is fixed on the upper surface of the substrate through support fixing glue, and the upper surface of the support is fixed on the foam layer through the support fixing glue.

In some possible implementations, the thickness of the scaffold is less than or equal to 150 um.

In some possible implementation manners, the display screen sequentially comprises a transparent cover plate, a display panel, a buffer layer and a copper layer from top to bottom, and the display screen is provided with a window penetrating through the buffer layer and the copper layer; the upper surface of the foam is fixed to the peripheral area of the window on the lower surface of the copper layer through a first pressure-sensitive adhesive (PSA), so that the fingerprint identification module is fixed below the display screen, and the sensing area of the first sensor chip is aligned to the window, so that the first sensor chip receives the fingerprint detection signal.

In some possible implementations, an outer side of the fingerprint detection device and an outer side of the first PSA are provided with an Ultraviolet (UV) curable glue to fix a relative position of the fingerprint detection device with respect to the display screen.

In some possible implementation manners, the display screen sequentially comprises a transparent cover plate, a display panel, a buffer layer and a copper layer from top to bottom, the display screen is provided with a window penetrating through the buffer layer and the copper layer, and the window of the buffer layer is smaller than the window of the copper layer in size; fingerprint detection device is located in the recess of electronic equipment's center, the cotton upper surface of bubble is in the windowing within range of copper layer is fixed through the foamed cement the surrounding area of windowing of the lower surface of buffer layer, so that the fingerprint identification module is fixed the below of display screen, the induction zone of first sensor chip aims at the windowing setting of buffer layer, so that first sensor chip receives fingerprint detection signal.

In some possible implementations, the bottom of the fingerprint detection device is disposed within the recess of the middle frame by a second PSA.

In some possible implementations, the optical path layer includes a lens layer and an optical path guiding layer, the micro lens is configured to converge an optical signal returned by a human finger above the display screen to the optical path guiding layer, and the optical path guiding layer guides the optical signal converged by the micro lens to the first sensor chip.

In some possible implementations, the thickness of the optical path layer is less than or equal to 30 um.

In some possible implementations, the fingerprint detection apparatus further includes: a flexible circuit board formed with gold fingers of the flexible circuit board; the golden fingers of the flexible circuit board are electrically connected to the golden fingers of the substrate through the anisotropic conductive adhesive film.

Through anisotropic conductive adhesive film, will the golden finger pressfitting of flexible circuit board extremely the golden finger of base plate, be equivalent to, can be for the flexible circuit board of different specifications is disposed to the fingerprint detection device, makes the fingerprint detection device has more the commonality, and is corresponding, can satisfy different users or customer's demand.

In addition, the substrate and the flexible circuit board are electrically connected through the fingers, so that the insulativity between the contact pieces can be ensured, the conductivity between the substrate and the flexible circuit board can also be ensured, particularly, under the condition that the fingerprint sensor chip comprises a plurality of chips, the plurality of chips on the substrate can be quickly and electrically connected to the flexible circuit board through the gold fingers, and then the installation complexity and the disassembly complexity can be reduced.

In a second aspect, an electronic device is provided, comprising: a display screen; the fingerprint detection device is the fingerprint detection device described in the first aspect or any one of the possible implementation manners of the first aspect, and the fingerprint acquisition area of the fingerprint detection device is at least partially located in the display area of the display screen.

In some possible implementation manners, the display screen includes transparent cover plate, display panel, buffer layer and copper layer from top to bottom in proper order, wherein, the display screen is provided with and link up the buffer layer with the windowing of copper layer, fingerprint detection device's light path layer is aimed at the windowing setting, so that fingerprint detection device passes through the windowing receives the via the fingerprint detection signal that the human finger of display screen top returned, fingerprint detection signal is used for detecting the fingerprint information of finger.

In some possible implementations, a border region of the upper surface of the fingerprint detection device secures a surrounding region of the fenestration of the lower surface of the copper layer by a first PSA such that an optical path layer of the fingerprint detection device is disposed in alignment with the fenestration.

In some possible implementations, the electronic device further includes a middle frame, an upper surface of the middle frame extends downward to form a third groove, and a bottom of the fingerprint detection device is disposed in the third groove through a second PSA.

Drawings

Fig. 1 is a schematic plan view of an electronic device to which the present application may be applied.

Fig. 2 is a schematic side cross-sectional view of the electronic device shown in fig. 1.

Fig. 3 to 6 and 8 to 9 are schematic structural diagrams of a fingerprint recognition device according to an embodiment of the present application.

Fig. 7 is a schematic diagram of a newton ring phenomenon when distances between the filter layer and the sensor chip are different according to an embodiment of the present disclosure.

Fig. 10 and 11 are schematic structural diagrams of an electronic device including a fingerprint identification device according to an embodiment of the present application.

Detailed Description

The technical solutions in the embodiments of the present application will be described below with reference to the accompanying drawings.

The technical scheme of the embodiment of the application can be applied to various electronic devices.

Such as portable or mobile computing devices, e.g., smart phones, laptops, tablets, gaming devices, etc., and other electronic devices, e.g., electronic databases, automobiles, Automated Teller Machines (ATMs), etc. However, the present embodiment is not limited thereto.

The technical scheme of the embodiment of the application can be used for the biological feature recognition technology. The biometric technology includes, but is not limited to, fingerprint recognition, palm print recognition, iris recognition, face recognition, and living body recognition. For convenience of explanation, the fingerprint identification technology is described as an example below.

The technical scheme of the embodiment of the application can be used for the under-screen fingerprint identification technology and the in-screen fingerprint identification technology.

Fingerprint identification technique is installed in the display screen below with fingerprint identification module under the screen to realize carrying out the fingerprint identification operation in the display area of display screen, need not set up the fingerprint collection region in the positive region except that the display area of electronic equipment. Specifically, the fingerprint identification module uses the light that returns from the top surface of electronic equipment's display module to carry out fingerprint response and other response operations. This returned light carries information about objects (e.g., fingers) in contact with or in proximity to the top surface of the display assembly, and the fingerprint recognition module located below the display assembly performs underscreen fingerprint recognition by capturing and detecting this returned light. The fingerprint identification module can be designed to realize desired optical imaging by properly configuring an optical element for collecting and detecting returned light, so as to detect fingerprint information of the finger.

Correspondingly, (In-display) fingerprint identification technique means installs inside the display screen fingerprint identification module or partial fingerprint identification module In the screen to realize carrying out the fingerprint identification operation In the display area of display screen, need not set up the fingerprint collection region In the positive region except that the display area of electronic equipment.

Fig. 1 and fig. 2 are schematic diagrams illustrating an electronic device 100 to which an off-screen fingerprint identification technology may be applied, where fig. 1 is a schematic diagram of a front side of the electronic device 100, and fig. 2 is a schematic diagram of a partial cross-sectional structure of the electronic device 100 shown in fig. 1.

As shown in fig. 1 and 2, the electronic device 100 may include a display 120 and a fingerprint identification module 140.

The display 120 may be a self-luminous display employing display units having self-luminous properties as display pixels. For example, the display screen 120 may be an Organic Light-Emitting Diode (OLED) display screen or a Micro-LED (Micro-LED) display screen. In other alternative embodiments, the Display 120 may also be a Liquid Crystal Display (LCD) or other passive light emitting Display, which is not limited in this embodiment of the present application.

In addition, the display screen 120 may also be specifically a touch display screen, which not only can perform image display, but also can detect a touch or pressing operation of a user, thereby providing a human-computer interaction interface for the user. For example, in one embodiment, the electronic device 100 may include a Touch sensor, which may be embodied as a Touch Panel (TP), which may be disposed on a surface of the display screen 120, or may be partially or wholly integrated within the display screen 120, so as to form the Touch display screen.

Fingerprint identification module 140 may be an optical fingerprint identification module, such as including an optical fingerprint sensor.

In particular, the fingerprint identification module 140 may include a sensor chip having an optically sensitive array (hereinafter also referred to as an optical fingerprint sensor). The optical sensing array includes a plurality of optical sensing units, and each optical sensing unit may specifically include a photodetector or a photosensor. Alternatively, the fingerprint identification module 140 may include a photo detector array (or referred to as a photo detector array or a photo sensor array) including a plurality of photo detectors distributed in an array.

As shown in fig. 1, the fingerprint identification module 140 may be disposed in a local area below the display screen 120, so that the fingerprint collection area (or detection area) 130 of the fingerprint identification module 140 is at least partially located in the display area 102 of the display screen 120.

Of course, in other alternative embodiments, the fingerprint identification module 140 may be disposed at other positions, such as the side of the display screen 120 or the edge non-transparent area of the electronic device 100. In this case, the optical signal of at least a part of the display area of the display screen 120 can be guided to the fingerprint identification module 140 through the optical path design, so that the fingerprint collection area 130 is actually located in the display area of the display screen 120.

In some embodiments of the present application, the fingerprint identification module 140 may only include one sensor chip, and the area of the fingerprint collection area 130 of the fingerprint identification module 140 is small and the position is fixed, so that the user needs to press the finger to a specific position of the fingerprint collection area 130 when inputting the fingerprint, otherwise the fingerprint identification module 140 may not collect the fingerprint image and cause the user experience to be poor.

In other embodiments of the present application, the fingerprint identification module 140 may specifically include a plurality of sensor chips; the plurality of sensor chips can be arranged side by side below the display screen 120 in a splicing mode, and the sensing areas of the plurality of sensor chips jointly form the fingerprint collection area 130 of the fingerprint identification module 140. That is to say, the fingerprint collection area 130 of the fingerprint identification module 140 may include a plurality of sub-areas, each of which corresponds to the sensing area of one of the sensor chips, respectively, so that the fingerprint collection area 130 of the optical fingerprint module 130 may be extended to the main area of the lower half portion of the display screen, that is, to the area that the finger presses conventionally, thereby implementing the blind-touch fingerprint input operation. Alternatively, when the number of sensor chips is sufficient, the fingerprint detection area 130 may also be extended to half or even the entire display area, thereby enabling half-screen or full-screen fingerprint detection.

It should be understood that the embodiments of the present application do not limit the specific form of the plurality of sensor chips.

For example, the plurality of sensor chips may be sensor chips that are individually packaged, or may be a plurality of chips (Die) packaged in the same chip package.

For another example, the plurality of sensor chips may be formed on different regions of the same chip by a semiconductor process.

As shown in fig. 2, the optical sensing array of the fingerprint identification module 140 is located in an area or an optical sensing range corresponding to the fingerprint collection area 130 of the fingerprint identification module 140. The fingerprint collection area 130 of the fingerprint identification module 140 may be equal to or different from an area or a light sensing range of an area where the optical sensing array of the fingerprint identification module 140 is located, which is not specifically limited in the embodiment of the present application.

For example, through the light path design of light collimation, fingerprint identification module 140's fingerprint collection area 130 can be designed into with fingerprint identification module 140's the area of the sensing array is unanimous basically.

For another example, the macro lens is used to perform the light path design of the converged light or the light path design of the reflected light, so that the area of the fingerprint collection area 130 of the fingerprint identification module 140 is larger than the area of the sensing array of the fingerprint identification module 140.

The following is an exemplary description of the optical path design of the fingerprint identification module 140.

Take the optical path design of fingerprint identification module 140 to adopt the optical Collimator of the through-hole array that has high aspect ratio as an example, optical Collimator can be specifically at the Collimator (collimater) layer that semiconductor silicon chip made formed, and it has a plurality of collimation units or micropore, the collimation unit can specifically be the aperture, in the reverberation of following the reflection of finger reflection back, the perpendicular incidence the light of collimation unit can pass and be received by the sensor chip of its below, and the too big light of incident angle is in the collimation unit is inside through the multiple reflection and is attenuated, therefore every sensor chip can only receive the reverberation of its fingerprint line reflection directly over basically, can effectively improve image resolution, and then improve fingerprint identification effect.

Further, when the fingerprint recognition module 140 includes a plurality of sensor chips, a collimating unit may be configured for an optical sensing unit in the optical sensing array of each sensor chip, and the collimating unit is attached to and disposed above the corresponding optical sensing unit. Of course, the plurality of optical sensing units may also share one collimating unit, i.e. the one collimating unit has a sufficiently large aperture to cover the plurality of optical sensing units. Because a collimation unit can correspond a plurality of optical sensing units, has destroyed the spatial period of display screen 120 and the spatial period's of sensor chip correspondence, consequently, even the spatial structure of the luminous display array of display screen 120 and the spatial structure of the optical sensing array of sensor chip are similar, also can effectively avoid fingerprint identification module 140 to utilize the light signal through display screen 120 to carry out fingerprint imaging and generate moire fringe, effectively improved fingerprint identification module 140's fingerprint identification effect.

Taking the optical path design of the fingerprint identification module 140 as an example, the optical path design of the optical Lens may include an optical Lens (Lens) layer, which has one or more Lens units, such as a Lens group composed of one or more aspheric lenses, and is used to converge the reflected light reflected from the finger to the sensing array of the sensor chip below the Lens unit, so that the sensing array may perform imaging based on the reflected light, thereby obtaining the fingerprint image of the finger.

The optical lens layer may further have a pinhole or a pinhole diaphragm formed in the optical path of the lens unit, for example, one or more light-shielding sheets may be formed in the optical path of the lens unit, wherein at least one light-shielding sheet may have a light-transmitting micropore formed in the optical axis or the optical center region of the lens unit, and the light-transmitting micropore may serve as the pinhole or the pinhole diaphragm. The pinhole or the micro-aperture diaphragm can be matched with the optical lens layer and/or other optical film layers above the optical lens layer to enlarge the view field of the fingerprint identification module 140, so as to improve the fingerprint imaging effect of the fingerprint identification module 140.

Further, when the fingerprint recognition module 140 includes a plurality of sensor chips, an optical lens may be configured for each sensor chip to perform fingerprint imaging, or an optical lens may be configured for a plurality of sensor chips to implement light convergence and fingerprint imaging. Even when one sensor chip has two sensing arrays (Dual Array) or multiple sensing arrays (Multi-Array), two or more optical lenses can be configured for the sensor chip to cooperate with the two or more sensing arrays for optical imaging, so as to reduce the imaging distance and enhance the imaging effect.

Taking the optical path design of the fingerprint identification module 140 as an example, the optical path design employs a Micro-Lens (Micro-Lens) layer, the Micro-Lens layer may have a Micro-Lens array formed by a plurality of Micro-lenses, which may be formed above the sensing array of the sensor chip through a semiconductor growth process or other processes, and each Micro-Lens may correspond to one of the sensing units of the sensing array. Other optical film layers such as a dielectric layer or a passivation layer may be further formed between the microlens layer and the sensing units, and more particularly, a light blocking layer having a plurality of micro holes may be further included between the microlens layer and the sensing units, wherein the micro holes are formed between the corresponding microlenses and the sensing units, and the light blocking layer may block optical interference between adjacent microlenses and the sensing units, and allow light to be converged into the micro holes through the microlenses and transmitted to the sensing units corresponding to the microlenses through the micro holes, so as to perform optical fingerprint imaging.

Optionally, a filter may be further disposed above the microlens layer or in the optical path between the microlens layer and the sensor chip (hereinafter also referred to as an optical fingerprint sensor).

As an alternative embodiment, the optical filter may be disposed above the microlens layer, for example, the optical filter may be connected to the microlens layer through a buffer layer, which may be a transparent medium layer, may be used to level the surface of the microlens layer,

or the filter may be fixed above the microlens layer by a fixing device, for example, frame glue or other supporting members are disposed in a non-photosensitive region around the microlens layer to support and fix the filter.

As an optional embodiment, the optical filter may be further disposed in an optical path between the microlens layer and the sensor chip, for example, the optical filter may be disposed above the sensor chip, specifically, the optical filter may be fixed above the sensor chip by a fixing device, for example, a sealant or other supporting member is disposed in a non-photosensitive region of the sensor chip to support and fix the optical filter, and an evaporation process or a sputtering process may be further adopted to perform a film coating on the sensor chip to form the optical filter, that is, the optical filter and the sensor chip are integrated into a whole. It is understood that the filter may also be a coating on other optical film layers, and is not limited herein.

It should be understood that several implementations of the above-mentioned optical path guiding structure may be used alone or in combination, for example, a microlens layer may be further disposed below the collimator layer or the optical lens layer. Of course, when the collimator layer or the optical lens layer is used in combination with the microlens layer, the specific lamination structure or optical path thereof may need to be adjusted according to actual needs.

Fingerprint identification module 140 may be configured to collect fingerprint information (e.g., fingerprint image information) of a user.

Taking the example that the display screen 120 is an OLED display screen, the display screen 120 may be a display screen having a self-Light Emitting display unit, such as an Organic Light-Emitting Diode (OLED) display screen or a Micro-LED (Micro-LED) display screen. The fingerprint identification module 140 may utilize the display unit (i.e., the OLED light source) of the OLED display screen located in the fingerprint collection area 130 as an excitation light source for optical fingerprint detection.

When a finger touches, presses, or approaches (collectively referred to as pressing in this application for convenience of description) the fingerprint collection area 130, the display 120 emits a beam of light to the finger above the fingerprint collection area 130, and the beam of light is reflected on the surface of the finger to form reflected light or scattered light after being scattered by the inside of the finger, and the reflected light and the scattered light are collectively referred to as reflected light in the related patent application for convenience of description. Because ridges (ridges) and valleys (vally) of the fingerprint have different light reflection capacities, reflected light from the ridges and the valleys of the fingerprint have different light intensities, and the reflected light is received by the sensor chip in the fingerprint identification module 140 and converted into corresponding electric signals, namely fingerprint detection signals, after passing through the display screen 120; fingerprint image data can be obtained based on the fingerprint detection signal, and fingerprint matching verification can be further performed, so that an optical fingerprint identification function is realized in the electronic device 100.

Therefore, when the user needs to perform fingerprint unlocking or other fingerprint verification on the electronic device 100, the user only needs to press a finger on the fingerprint acquisition area 130 of the display screen 120, so that the input operation of the fingerprint feature can be realized. Since the collection of the fingerprint features can be implemented inside the display area 102 of the display screen 120, the electronic device 100 with the above structure does not need a special reserved space on the front surface thereof to set the fingerprint keys (such as Home keys), and thus a full-screen scheme can be adopted. Thus, the display area 102 of the display screen 120 may extend substantially across the entire front face of the electronic device 100.

Of course, in other alternatives, the fingerprint identification module 140 may also use an internal light source or an external light source to provide an optical signal for fingerprint detection and identification. In this case, the fingerprint identification module 140 may be suitable for not only self-luminous display screens such as OLED display screens, but also non-self-luminous display screens such as liquid crystal display screens or other passive luminous display screens.

Taking an application to a liquid crystal display screen with a backlight module and a liquid crystal panel as an example, to support the underscreen fingerprint detection of the liquid crystal display screen, the optical fingerprint system of the electronic device 100 may further include an excitation light source for optical fingerprint detection, where the excitation light source may specifically be an infrared light source or a light source of non-visible light with a specific wavelength, and may be disposed below the backlight module of the liquid crystal display screen or in an edge area below a protective cover plate of the electronic device 100, and the fingerprint identification module 140 may be disposed below the edge area of the liquid crystal panel or the protective cover plate and guided through a light path so that the fingerprint detection light may reach the fingerprint identification module 140; alternatively, the fingerprint recognition module 140 may be disposed under the backlight module, and the backlight module is configured to allow the fingerprint detection light to pass through the liquid crystal panel and the backlight module and reach the fingerprint recognition module 140 by perforating or performing other optical designs on the diffusion sheet, the brightness enhancement sheet, the reflection sheet, and other film layers. When adopting fingerprint identification module 140 adopts built-in light source or external light source to provide the light signal that is used for carrying out fingerprint detection, its detection principle can be the same.

As shown in fig. 1, the electronic device 100 may further include a protective cover 110.

The cover plate 110 may be a transparent cover plate, such as a glass cover plate or a sapphire cover plate, which is located above the display screen 120 and covers the front surface of the electronic device 100, and a protective layer may be further disposed on the surface of the cover plate 110. Therefore, in the embodiment of the present application, the pressing of the display screen 120 by the finger may actually mean that the finger presses the cover plate 110 above the display screen 120 or a surface of a protective layer covering the cover plate 110.

As shown in fig. 1, a Circuit board 150, such as a Flexible Printed Circuit (FPC), may be disposed below the fingerprint identification module 140.

The fingerprint identification module 140 may be soldered to the circuit board 150 via the solder pads, and may be electrically interconnected and signal-transmitted with other peripheral circuits or other components of the electronic device 100 via the circuit board 150. For example, the fingerprint identification module 140 may receive a control signal of a processing unit of the electronic device 100 through the circuit board 150, and may further output a fingerprint detection signal from the fingerprint identification module 140 to the processing unit or the control unit of the electronic device 100 through the circuit board 150.

Fig. 3 to 6 are schematic structural diagrams of a fingerprint detection device 200 according to an embodiment of the present application. The fingerprint detection apparatus 200 is suitable for an electronic device having a display screen, for example, the fingerprint detection apparatus 200 may be suitable for the electronic device 100 shown in fig. 1 or fig. 2, and the fingerprint detection apparatus 200 may be disposed below the display screen of the electronic device.

It should be noted that, for convenience of description, the same reference numerals are used to designate the same components in the embodiments of the present application, and detailed description of the same components is omitted in different embodiments for the sake of brevity.

As shown in fig. 3, the fingerprint detection device 200 includes: a substrate 210, a light path layer 220, a first sensor chip 230, a support 251, and a filter layer 260. Specifically, the lower surface of the filter layer 260 is provided with a support ink 261 printed by silk screen, for example, the support ink 261 may be located in any one of the positions corresponding to the sensing regions of the first sensing chip 230 in the lower surface of the filter layer 260; the optical path layer 220 is disposed below the filter layer 260, a gap is formed between the upper surface of the optical path layer 220 and the upper surface of the supporting ink 261, and meanwhile, the supporting ink 261 can also support the filter layer 260, so that a gap is maintained between the lower surface of the filter layer 260 and the upper surface of the optical path layer; the first sensor chip 230 is disposed under the optical path layer 220; a first groove is formed on the upper surface of the substrate 210 in a downward extending manner, and at least a portion of the first sensor chip 230 is disposed in the first groove and electrically connected to the substrate 210; a support 251 is disposed above the substrate 210 around the first sensor chip 230 for supporting the filter layer 260. The first sensor chip 230 is configured to receive a fingerprint detection signal passing through the filter layer 260 and the light path layer 220 after returning back through a human finger above the display screen, where the fingerprint detection signal is used to detect fingerprint information of the finger.

The fingerprint identification module 200 of the embodiment of the application arranges the filter layer 260 above the light path layer 220, and the external filter layer 260 can effectively block the influence of ambient light on the fingerprint identification process, so that the image contrast reduction caused by the intervention of strong light when a user unlocks the fingerprint is avoided, and the abnormal unlocking problem is further prevented; and set up the support printing ink 261 of silk screen printing in the lower surface of filter layer 260 corresponds fingerprint chip's the induction zone, through the intermediate position that this support printing ink 261 supports filter layer 260, prevent fingerprint identification module 200 is in the use, when gathering fingerprint information, filter layer 260 warp and contacts light path layer 220 and produce the newton's ring problem.

In addition, the optical path layer 220 of the fingerprint detection device 200 according to the embodiment of the present application is directly disposed on the upper surface of the first sensor chip 230, and the lower surface of the first sensor chip 230 is fixed on the substrate 210, so that it is avoided that a housing is separately disposed for carrying the optical path layer 220 and the first sensor chip 230, and the size (e.g., thickness) of the fingerprint detection device 200 is reduced; further, the fingerprint detection device 200 is disposed in the groove of the substrate, so that the thickness of the fingerprint detection device 200 can be reduced.

Finally, since the optical path layer 220 is directly disposed on the upper surface of the first sensor chip 230, the image capturing field of view of the fingerprint detection apparatus 200 is only affected by the area of the optical path layer 220 and the area of the corresponding first sensor chip 230, and based on this, the area of the optical path layer 220 and the area of the corresponding first sensor chip 230 can be reasonably designed according to actual requirements, so as to meet the requirements of different users and different customers (for example, the requirement of a large-area image capturing field of view can be met).

Optionally, as shown in fig. 3, the fingerprint identification module 200 further includes a first gold wire 250 for electrically connecting the first sensor chip 230 and the substrate 210, where the first gold wire 250 is located between a sidewall of the first sensor chip and a sidewall of the first groove, and in a gap between a sidewall of the bracket close to the first sensor chip and a sidewall of the first sensor chip.

As shown in fig. 4, the substrate 210 according to the embodiment of the present disclosure may include a first cover layer 212, a first conductive layer 211 layer 212, a base material layer 213, a second conductive layer 214, and a second cover layer 215 in sequence from top to bottom, an upper surface of the substrate 210 extends downward in a first region and penetrates through the first cover layer 212 and the first conductive layer 211 to form a first groove, and an upper surface of the substrate 210 extends downward in a second region connected to the first region and penetrates through the first cover layer 212 to form a pad 2111 of the substrate 210.

Optionally, in other alternative embodiments, the substrate 210 may include a conductive layer other than the first conductive layer 211 and the second conductive layer 214. Alternatively, the first conductive layer 211 or the second conductive layer 214 may be a copper layer or a copper foil layer. Alternatively, the first cover layer 212 or the second cover layer 213 may be an insulating layer (e.g., a resin layer).

As shown in fig. 3, the light path layer 220 is disposed above the first sensor chip 230, the lower surface of the first sensor chip 230 may be fixed in the first groove by a first fixing glue 240, the first sensor chip 230 is connected to the pad 2111 of the substrate 210 by the first gold wire 250, the first sensor chip 230 is configured to receive a fingerprint detection signal returned by a human finger above the display screen and guided by the light path layer 220, and the fingerprint detection signal is configured to detect fingerprint information of the finger.

In other words, the lower surface of the first sensor chip 230 is adhered in the first groove by the first fixing glue 240, so that at least a portion of the first sensor chip 230 is disposed in the first groove and electrically connected to the substrate 210 by the first gold wire 250; the first sensor chip 230 may be disposed below a display screen of the electronic device through the substrate 210, and the first sensor chip 230 is configured to receive a fingerprint detection signal returned by reflection or scattering of a human finger above the display screen, and detect fingerprint information of the finger based on the fingerprint detection signal, so as to perform fingerprint registration or identification.

It should be understood that the first sensor chip 230 may include a plurality of chips or may include one chip, for example, the first sensor chip 230 may include a plurality of optical fingerprint sensor chips, and the plurality of optical fingerprint sensor chips are disposed side by side in the first groove to be spliced into one optical fingerprint sensor chip assembly. Optical fingerprint sensor chip subassembly can be used for acquireing many fingerprint images simultaneously, can carry out fingerprint registration or discernment as a fingerprint image after many fingerprint image concatenations.

For the fingerprint detection device 200, the light path layer 220 is directly disposed on the upper surface of the first sensor chip 230, and the lower surface of the first sensor chip 230 is fixed on the substrate 210 by the first fixing glue 240, so that it is avoided that a housing is separately disposed for carrying the light path layer 220 and the first sensor chip 230, and the size (e.g., thickness) of the fingerprint detection device 200 is reduced.

In addition, by removing the first cover layer 212 and the first conductive layer 211 of the substrate 210 at the first area to form a first groove for accommodating the first fixing glue 240 and the first sensor chip 230, the thickness of the fingerprint detection device 200 can be reduced.

Secondly, by removing the first covering layer 212 at the second area of the substrate 210, forming the substrate 210 pad 2111 for electrically connecting the first sensor chip 230, an accommodation space can be provided for the first gold wire 250 for electrically connecting the first sensor chip 230 and the substrate 210, accordingly, the occupied space of the first gold wire 250 above the substrate 210 is reduced, and the thickness of the fingerprint detection device 200 can be reduced.

Thirdly, the thickness of the fingerprint detection device 200 is guaranteed to be reduced to the maximum extent through the close fit between the layers in the thickness direction.

Finally, since the optical path layer 220 is directly disposed on the upper surface of the first sensor chip 230, the image capture field of view of the fingerprint detection device 200 is only affected by the area of the optical path layer 220 and the area of the corresponding first sensor chip 230, and based on this, the area of the optical path layer 220 and the area of the corresponding first sensor chip 230 can be reasonably designed according to actual requirements, so as to meet the requirements (for example, the requirement of a large-area image capture field of view) of different users and different customers.

To sum up, the technical scheme of this application not only can reduce fingerprint detection device 200's thickness can also guarantee to have enough big image acquisition visual field.

As shown in fig. 3 and 4, in some embodiments of the present application, a gap d1 exists between the sidewall of the first sensor chip 230 and the sidewall of the first recess.

By designing a certain gap d1 between the side wall of the first sensor chip 230 and the side wall of the first groove, even if there is a difference between the size of the prepared product of the first sensor chip 230 and the design size of the first sensor chip 230, or even if there is a difference between the actual size of the first groove and the design size of the first groove, the mounting of the first sensor chip 230 in the first groove is not affected.

In other words, the gap d1 between the side wall of the first sensor chip 230 and the side wall of the first groove can be used not only as the dimensional tolerance of the first sensor chip 230 and/or the dimensional tolerance of the first groove, but also as the mounting tolerance of the first sensor chip 230, and accordingly, the yield of the fingerprint detection apparatus 200 can be improved. The dimensional tolerance may be the magnitude of the absolute value of the difference between the maximum allowed limit dimension and the minimum limit dimension, or the dimensional tolerance may be the magnitude of the difference between the upper allowed deviation and the lower allowed deviation. The ultimate deviation is the ultimate dimension-the basic dimension, the upper deviation is the maximum ultimate dimension-the basic dimension, and the lower deviation is the minimum ultimate dimension-the basic dimension. The dimensional tolerance of the first sensor chip 230 may be an allowable variation amount in the process of cutting the first sensor chip 230. In the case where the basic size is the same, the smaller the dimensional tolerance is, the higher the dimensional accuracy is. Similarly, the mounting tolerance of the first sensor chip 230 may refer to an offset distance between a first allowable limit mounting position and a second allowable limit mounting position, the first limit mounting position may be a mounting position of a first sidewall closest to the first recess, the second limit mounting position may be a mounting position of a second sidewall closest to the first recess, the first sidewall being a sidewall opposite to the second sidewall.

For example, the width d1 of the gap between the sidewall of the first sensor chip 230 and the sidewall of the first groove may range from 100-. Of course, alternatively, the width of the gap d1 between the sidewall of the first sensor chip 230 and the sidewall of the first groove may also be other values or fall within another preset value range, which is not specifically limited in this application. For example, the width of the gap d1 between the sidewall of the first sensor chip 230 and the sidewall of the first groove may also be 100um or 300um, and for example, the width of the gap d1 between the sidewall of the first sensor chip 230 and the sidewall of the first groove may also be within 100um to 300 un.

It should be noted that, the thickness of each component or layer in the fingerprint detection device 200 is not specifically limited, and the fingerprint detection device is controlled by closely matching the thickness of each component or layer as long as the structural relationship between the components or layers adopts the design scheme of the present application, which all falls within the protection scope of the present application.

For example, the thickness of the substrate 210 in the embodiment of the present application is less than or equal to 150um, and for example, the thickness of the substrate 210 may be set to 130 um. Here, the thickness of the first cover layer 212 and the thickness of the second cover layer may be set to be the same, and the thickness of the first conductive layer 211 and the thickness of the second conductive layer may be set to be the same.

As an example, the thickness of the first cover layer 212 and the thickness of the second cover layer may be set to be both less than or equal to 30um, for example, may be both set to 20um, the thickness of the first conductive layer 211 and the thickness of the second conductive layer may be set to be both less than or equal to 20um, for example, may be both set to 13um, the thickness of the substrate may be set to be less than or equal to 80um, for example, may be set to 64 um.

For another example, the thickness of the first sensor chip 230 may be set to be less than or equal to 150um, for example, may be specifically set to 60 um; the thickness of the light path layer 220 is less than or equal to 30um, for example, it can be set to 16um or 15.7 um; the maximum arc height d6 of the first gold wire 250 can be set to be less than or equal to 60um, for example, can be set to be 40um, and the thickness of the first fixing glue 240 can be set to be less than or equal to 30um, for example, can be set to be 15 um.

Of course, the thickness of the first covering layer 212, the thickness of the first conductive layer 211, the thickness of the substrate layer 213, the thickness of the second conductive layer 214, the thickness of the second covering layer 215, the thickness of the first sensor chip 230, the thickness of the first fixing glue 240, or the maximum arc height d6 of the first gold wire 250 may also be other values or within a preset value range, which is not specifically limited in this application.

It should be understood that the bracket 251 in the embodiment of the present application is disposed on the upper surface of the first cover layer 212 and outside the first sensor chip 230, and can also be used for fixing the filter layer 260.

Optionally, the bracket 251 is fixed on the upper surface of the first cover layer 212 and located outside the first sensor chip 230 by a bracket fixing adhesive 253. For example, the material of the bracket 251 includes, but is not limited to, metal, resin, glass fiber composite board, and glue layer. For example, the support 251 is a polyethylene terephthalate (PET) adhesive layer. As another example, the holder 251 may be a holder formed of a foam material. Alternatively, the bracket fixing adhesive may be a double-sided adhesive tape.

In other words, the bracket 251 may be disposed above the substrate 210 and located at an outer side or a surrounding area of the first groove and the pad (for electrically connecting the first sensor chip 230) of the substrate 210.

Alternatively, as shown in fig. 3 or fig. 4, the thickness of the bracket 251 (including the bracket fixing glue 253) may be set according to practical applications, for example, may be set to be less than or equal to 150um, for example, the thickness of the bracket 251 may be set to be 70um, that is, the thicknesses at C in fig. 3 to fig. 6 may include, in order from top to bottom: the thickness (e.g., 70um) of the bracket 251 (including the bracket fixing glue 253) and the thickness of the substrate 210, wherein the thickness of the substrate 210 includes the thickness (e.g., 20um) of the first cover layer 212, the thickness (e.g., 13um) of the first conductive layer 211, the thickness (e.g., 64um) of the base material, the thickness (e.g., 13um) of the second conductive layer, and the thickness (e.g., 20um) of the second cover layer.

As shown in fig. 3, in some embodiments of the present application, a width of a gap d2 formed between the first sensor chip 230 and the bracket 251 is greater than or equal to a width of a gap d1 formed between a sidewall of the first sensor chip 230 and a sidewall of the first groove, and an outer side of the bracket 251 is shortened by a predetermined distance d3 toward a direction approaching the first sensor chip 230 with respect to an outer side of the first cover layer 212. As an example, the value range of the width of the gap d2 formed by the first sensor chip 230 and the bracket 251 may be set to 100-.

In addition, the gap d2 formed between the first sensor chip 230 and the support 251 can be used as not only the dimensional tolerance of the support 251 but also the installation tolerance of the support 251, and accordingly, the yield of the fingerprint detection apparatus 200 can be improved. Similarly, the preset distance d3 can be used not only as a dimensional tolerance of the bracket 251 but also as an installation tolerance of the bracket 251, and accordingly, the yield of the fingerprint detection apparatus 200 can be improved.

Of course, in other alternative embodiments, the gap d2 formed between the first sensor chip 230 and the support 251, the predetermined distance d3, or the thickness of the support 251 may have other specific values or may be within a predetermined range of values. The thickness of the holder 251 may also be 80um, for example.

As shown in fig. 3, in some embodiments of the present application, the fingerprint detection device 200 may further include a gold wire protection adhesive 252; the gold wire protection paste 252 is used to encapsulate the first gold wire 250. By the gold wire protection glue 252, the stability of the electrical connection between the substrate 210 and the first sensor chip 230 can be ensured, and accordingly, the performance of the fingerprint detection device 200 can be ensured.

In some embodiments of the present application, the thickness of the gold wire protection paste 252 may be greater than or less than or equal to the sum of the thickness of the optical path layer 220, the thickness of the first sensor chip 230, and the thickness of the first fixing paste 240. For example, as shown in fig. 3, the thickness of the gold wire protection paste 252 may be equal to the sum of the maximum arc height of the first gold wire 250, the thickness of the first sensor chip 230, and the thickness of the first fixing paste 240. Alternatively, the thickness of the gold wire protection paste 252 may be set according to the application, for example, may be set to be less than or equal to 200um, or other values.

For example, as shown in fig. 3 to 6, the thickness at B may include, in order from top to bottom: a maximum arc height of the first gold wire 250 (e.g., 40um), a thickness of the first sensor chip 230 (e.g., 60um), a thickness of the first die attach adhesive 230 (e.g., 15um), a thickness of the base material (e.g., 64um), a thickness of the second conductive layer (e.g., 13um), and a thickness of the second cover layer (e.g., 20 um).

Of course, other parameters may be designed for the holder 251 to guide the preparation and installation of the holder 251. For example, as shown in fig. 3 and 4, in some embodiments of the present application, a width of a gap d4 between a side of the first sensor chip 230 close to the pad 2111 (for electrically connecting the first sensor chip 230) of the substrate 210 and the bracket 251 is greater than a width of a gap d2 between a side of the first sensor chip 230 facing away from the pad 2111 (for electrically connecting the first sensor chip 230) of the substrate 210 and the bracket 251, so as to reserve a sufficient accommodating space for the bracket fixing adhesive 252. Alternatively, the width of the gap d4 between the side of the first sensor chip 230 near the pad 2111 of the substrate 210 and the bracket 251 may be 300um or other values.

As shown in fig. 5 and 6, in some embodiments of the present application, the fingerprint detection device 200 may further include a second sensor chip 280, a second fixing glue 281, and a second gold wire 282.

The upper surface of the substrate 210 extends downward in a third region connected to the second region and penetrates through the first covering layer 212 and the first conductive layer 211 to form a second groove, the second sensor chip 280 is fixed in the second groove by a second fixing adhesive 281, the second sensor chip 280 is connected to the pad 2111 of the substrate 210 by the second gold wire 282, so that the second sensor chip 280 is connected to the first sensor chip 230, and the second sensor chip 280 is used for performing underscreen fingerprint identification by matching with the first sensor chip 230.

The second sensor chip 280 can share the processing task of the first sensor chip 230, that is, one functionally complete and thick sensor chip is replaced by the first sensor chip 230 and the second sensor chip 280 which are arranged in parallel and have a thinner thickness, so that the thickness of the fingerprint detection apparatus 200 can be reduced without affecting the fingerprint identification performance.

In some embodiments of the present application, a gap d7 exists between a sidewall of the second sensor chip 280 and a sidewall of the second groove. Optionally, the width of the gap d7 between the sidewall of the second sensor chip 280 and the sidewall of the second groove ranges from 100um to 400um, and may be set to 200um, for example.

Optionally, the thickness of the second sensor chip 280 may range from 100-; similarly, the maximum arc height of the second gold wire 282 may be set to be less than or equal to 60um, or may be set to be the same as the arc height of the first gold wire 250, for example, may be set to be 40 um; the thickness of the second fixing glue 281 may be set to be less than or equal to 30um, or may be set to be the same as the first fixing glue 240, for example, both set to be 15 um.

Of course, alternatively, the width of the gap d7 between the sidewall of the second sensor chip 280 and the sidewall of the second groove, the thickness of the second sensor chip 280, the maximum arc height of the second gold wire 282, or the thickness of the second fixing glue 281 may also be other specific values or within a preset value range, which is not specifically limited in the embodiment of the present application.

By designing a certain gap d7 between the side wall of the second sensor chip 280 and the side wall of the second groove, even if there is a difference between the size of the manufactured product of the second sensor chip 280 and the design size of the second sensor chip 280, or even if there is a difference between the actual size of the second groove and the design size of the second groove, the mounting of the second sensor chip 280 in the second groove is not affected.

In other words, the gap between the sidewall of the second sensor chip 280 and the sidewall of the second groove can be used not only as the dimensional tolerance of the second sensor chip 280 and/or the dimensional tolerance of the second groove, but also as the mounting tolerance of the second sensor chip 280, and accordingly, the yield of the fingerprint detection apparatus 200 can be improved.

It should be understood that the filter layer 260 is disposed above the optical path layer 220 regardless of the above-described fingerprint detection device including one sensor chip as shown in fig. 3 and 4 or the fingerprint detection device including two sensor chips as shown in fig. 5 and 6.

It should be appreciated that the filter layer 260 of the present embodiment is used to reduce undesired ambient light in fingerprint sensing to improve the optical sensing of the received light by the first sensor chip 230. For example, the filter layer 260 may be used to filter out light with specific wavelengths, such as near infrared light and part of red light. For example, a human finger absorbs most of the energy of light with a wavelength below 580nm, based on which the filter can be designed to filter light with a wavelength from 580nm to infrared to reduce the influence of ambient light on the optical detection in fingerprint sensing.

In particular implementations, the filter layer 260 may include one or more optical filters, which may be configured, for example, as band pass filters to allow transmission of light emitted by the OLED screen while blocking other light components, such as infrared light, in sunlight.

Specifically, as shown in fig. 3 to 6, the filter layer 260 of the embodiment of the present application may be fixed above the support 251. Specifically, one of the lower surfaces of the filter layer 260 near the first gold wire 250 may be fixed on the upper surface of the first sensor chip 230, and the other one of the lower surfaces of the filter layer 260 may be fixed on the upper surface of the support 251.

For example, as shown in fig. 3, one side of the lower surface of the filter layer 260 close to the first gold wire may be fixed on the upper surface of the first sensor chip 230 by a first adhesive 262, and the other side of the lower surface of the filter layer 260 may be fixed on the upper surface of the support 251 by a second adhesive 263. The thicknesses of the first adhesive and the second adhesive may be set according to practical applications to ensure that the filter layer 260 is parallel to the optical path layer 220, or that the filter layer 260 is parallel to a plane where the sensing area on the upper surface of the first sensor chip 230 is located. For example, the thickness of the first adhesive 262 may be set to be less than or equal to 60, for example, 48um, and the thickness of the second adhesive may be set to be less than or equal to 60, for example, 20um, depending on the size of the other portion.

Specifically, assuming that the lower surface of the filter layer 260 is rectangular, one side of the lower surface of the filter layer 260 is close to the first gold wire 250, the other three sides are not close to the first gold wire 250, the three-side regions not close to the gold wires can be fixed on the upper surface of the support 251, and one side close to the first gold wire 250 is fixed on the upper surface of the first sensor chip 230, so as to avoid affecting the installation of the first gold wire 250; meanwhile, one side of the lower surface of the filter layer 260 close to the first gold wire 250 is fixed on the upper surface of the first sensor chip 230 by a first adhesive 262, and the first adhesive 262 can also prevent the gold wire protective adhesive for fixing the gold wire from flowing into the optical path layer.

The thickness of the filter layer 260 may be set according to practical applications, for example, the thickness of the filter layer 260 may be set to be less than or equal to 220 um; for example, the thickness of the filter layer is typically selected to be 110um in view of the existing process and the mass producibility.

Alternatively, the supporting ink 261 may be located at any position in the lower surface of the filter layer 260 corresponding to the position of the sensing area of the first sensor chip 230. For example, since the center position is more uniform with respect to the supporting force of the entire filter layer 260, the position of the screen-printed supporting ink 261 is generally set to coincide with the center of the sensing area of the underlying first sensor chip 230, that is, the center of the supporting ink 261 is set to coincide with the center of the sensing area of the first sensor chip 230 in the vertical direction.

It is to be understood that the supporting ink 261 is located between the filter layer 260 and the optical path layer 220, and is used for supporting the filter layer 200, so that a gap is maintained between the filter layer 260 and the optical path layer 220, and meanwhile, a gap may also be maintained between the lower surface of the supporting ink 261 and the upper surface of the optical path layer 220. The newton's contrast gradually decreases as the thickness of the supporting ink 261 increases, i.e., the distance between the upper surface of the optical path layer 220 and the lower surface of the filter layer 260 increases. Fig. 7 shows several newton ring effect diagrams, as shown in fig. 7, h represents the distance between the filter layer and the upper surface of the optical path layer above the sensor chip, and in the present embodiment, based on the above-mentioned setting of the dimensions, the newton ring substantially disappears when the distance is 25um, so the thickness of the supporting ink is usually set to be less than or equal to 30um, for example, 25um may be set, that is, the distance between the filter layer 260 and the upper surface of the optical path layer 220 below is 25um, so as to avoid the newton ring. It is understood that the distance h is not limited to 25um, which can be adjusted according to the actual situation.

Optionally, the area of the supporting ink may be set according to practical applications, and on the premise of not affecting fingerprint identification, the larger the size of the supporting ink 261 for silk-screen printing is, the better the supporting effect on the filter layer 260 is, that is, the more difficult the filter layer is to deform, the less the newton ring is to be generated. However, since the supporting ink 261 may block the returned fingerprint detection signal, the area of the supporting ink is not too large, for example, the area of the supporting ink 261 may be generally set to be less than or equal to 40 × 40um, for example, may be set to be a square of 30um × 30 um.

In the embodiment of the present application, the material of the filter layer 260 may be glass, crystal, resin film, or other materials. In order to ensure that the filter layer 260 can transmit the fingerprint detection signal returned by the finger to the first sensor chip 230 below, and ensure that the first sensor chip 230 can receive enough optical signals, thereby ensuring that the fingerprint identification effect is improved, the light entering surface of the filter layer 260 needs to realize ultra-low reflection of light through an optical inorganic coating or an organic black coating, for example, the reflectivity is usually set to be less than 1%.

Optionally, in the embodiment of the present application, there is a gap between the lower surface of the supporting ink 261 and the upper surface of the optical path layer 220, and the size d5 of the gap may be set according to practical applications and may be adjusted according to the sizes of other components. For example, as shown in fig. 3 to 6, the thickness at a may include, in order from top to bottom: a thickness of the filter layer 260 (e.g., 110um), a thickness of the supporting ink 261 (e.g., 25um), a gap d5 (e.g., 7.3um) between a lower surface of the supporting ink 261 and an upper surface of the optical path layer 220, a thickness of the optical path layer 220 (e.g., 15.7), a thickness of the first sensor chip 230 (e.g., 60um), a thickness of the first die attach adhesive 230 (e.g., 15um), a thickness of the substrate (e.g., 64um), a thickness of the second conductive layer (e.g., 13um), and a thickness of the second cover layer (e.g., 20 um).

It should be understood that as can be seen from fig. 3 to 6, the total thickness at a is the total thickness of the fingerprint detection device 200, and the total thickness of the fingerprint detection device 200 may be set within the range of 0.15-0.6mm according to the above description of the respective embodiments.

The optical path layer 220 of the embodiment of the present application may include a lens layer 221 and an optical path guiding layer 222, the lens layer 221 is configured to converge an optical signal returned by a human finger above the display screen to the optical path guiding layer 222, and the optical path guiding layer 222 guides the optical signal converged by the lens layer 221 to the first sensor chip 230.

Considering that the filter layer 260 of the fingerprint detection device 200 is disposed above the light path layer 220, there may be a situation that the height of the upper surface of the support 251 is less than the height of the upper surface of the filter layer 260, for example, as shown in fig. 3 to 6, which results in inconsistent height of the upper surface of the entire fingerprint detection device, and at this time, the upper surface of the fingerprint detection device 200 may be made flat by disposing foam, thereby facilitating the installation of the fingerprint detection device 200 below the display screen. Specifically, the fingerprint detection device may further include: a foam layer surrounding the filter layer 260 and disposed above the bracket 251, wherein the foam layer is provided with an opening penetrating through the foam layer, and the first sensor chip 230 receives the fingerprint detection signal through the opening of the foam layer; the upper surface of the foam layer is flush with the upper surface of the filter layer 260, so that the upper surface of the fingerprint detection device 200 is flat.

Optionally, the arc height position of the first gold wire 250 may be designed to be embedded into the foam layer; alternatively, a foam layer may be provided above the first gold wire 250 at the arc height thereof.

It should be noted that, when the fingerprint detection device 200 is mounted to an electronic device, it may be connected to a main board of the electronic device through an additional flexible circuit board. For example, as shown in fig. 8, the substrate 210 may further include a gold finger 2122 of the substrate 210, the gold finger 2122 of the substrate 210 is used for connecting to a flexible circuit board, and accordingly, the substrate 210 is connected to a motherboard of an electronic device through the flexible circuit board.

Fig. 9 is a schematic structural view of a fingerprint sensing device 200 provided with a flexible circuit board according to an embodiment of the present application, and as shown in fig. 9, in some embodiments of the present application, the fingerprint sensing device 200 may further include a flexible circuit board 290 and An (ACF) 292, the flexible circuit board 290 being formed with a gold finger 291 of the flexible circuit board 290; the gold finger 291 of the flexible circuit board 290 is electrically connected to the gold finger 2122 of the substrate 210 through the anisotropic conductive film 292.

Through the anisotropic conductive film 292, the gold finger 291 of the flexible circuit board 290 can be pressed to the gold finger 2122 of the substrate 210, which is equivalent to that, flexible circuit boards with different specifications can be configured for the fingerprint detection device 200, so that the fingerprint detection device 200 has more versatility, and accordingly, the requirements of different users or customers can be met.

As shown in fig. 9, in some embodiments of the present application, the fingerprint detection device 200 may further include a protection adhesive 293 of an anisotropic conductive film 292, and the protection adhesive 293 may be located at two ends of the anisotropic conductive film 292 to protect the anisotropic conductive film 292, so as to protect the gold finger 291 of the flexible circuit board 290 and the gold finger 2122 of the substrate 210. As shown in fig. 9, in some embodiments of the present application, the fingerprint detection device 200 may further include an image processor 296, and the image processor 296 is disposed at one end of the flexible circuit board 290. For example, the image processor 296 may be a Micro Processing Unit (MCU) for receiving a fingerprint detection signal (e.g., a fingerprint image) from the first sensor chip 230 via the flexible circuit board 290 and performing simple Processing on the fingerprint detection signal. As shown in fig. 9, in some embodiments of the present application, the fingerprint detection device 200 may further include at least one capacitor 295 disposed at one end of the flexible circuit board 290, wherein the at least one capacitor 295 is used for optimizing (e.g., filtering) the fingerprint detection signal collected by the first sensor chip 230. Optionally, each of the first sensor chips 230 corresponds to one or more capacitors. As shown in fig. 9, in some embodiments of the present application, the fingerprint detection apparatus 200 may further include a connector 294 disposed at one end of the flexible circuit board 290, and the connector 294 may be used to connect with an external device or other components of the electronic device (e.g., a motherboard), so as to achieve communication with the external device or other components of the electronic device. For example, the connector 294 may be used to connect a processor of the electronic device, so that the processor of the electronic device receives the fingerprint detection signal processed by the image processor 296 and performs fingerprint identification based on the processed fingerprint detection signal.

It should be understood that fig. 3-9 are merely examples of embodiments of the present application and should not be construed as limiting the present application.

For example, in fig. 3 to 6, the lens layer 221 is used as a device for converging light signals in the optical path layer 220, and alternatively, the lens layer 221 may also use an optical collimator. The related description of the optical collimator can refer to the related description of the optical path design of the fingerprint detection device 130 in the foregoing.

For another example, the lens layer 221 may have a microlens array formed by a plurality of microlenses, the optical path guiding layer 222 may be a light blocking layer having a plurality of micro holes and disposed below the microlens layer 221, the micro holes correspond to the microlenses in a one-to-one manner, and the one or more optical sensing units in the first sensor chip 230 correspond to one microlens in the lens layer 221. Optionally, the optical path layer 220 may further include other optical film layers, such as a dielectric layer or a passivation layer.

The fingerprint detection device 200 according to the embodiment of the present application is described above with reference to fig. 3 to 9, and the electronic device to which the fingerprint detection device 200 is mounted is described below.

Fig. 10 is a schematic configuration diagram of an electronic device 300 mounted with the fingerprint detection device 200 shown in fig. 4 according to an embodiment of the present application.

As shown in fig. 10, the electronic device 300 includes a display screen, a middle frame 360 located below the display screen, a battery 370 located below the middle frame 360, and a battery easy-pulling adhesive 380 located below the battery, wherein the display screen sequentially includes a transparent cover plate 310, a display panel 320, a buffer (cushion) layer 330, and a copper layer 340 from top to bottom, and the display screen is provided with a window penetrating through the buffer layer 330 and the copper layer 340. In other words, the buffer layer 330 may be provided with a first window 331 penetrating the buffer layer 330, and the copper layer 340 may be provided with a second window 341 penetrating the copper layer 340. Alternatively, the display screen may be an OLED organic light emitting panel manufactured by Low Temperature Polysilicon (LTPS) technology, which has an ultra-thin thickness, a light weight, and Low power consumption, and may be used to provide a relatively clear image. The middle frame 360 may be used to carry or support various devices or components in the electronic device 300. The devices or components include, but are not limited to, a battery, a camera, an antenna, a motherboard, and the display screen.

The buffer layer 330 may also be referred to as a screen print layer or an embossing layer, and the screen print layer may be provided with graphics that may be used as a logo such as a trademark pattern. The buffer layer 330 may be a black sheet layer or a printed layer for shielding light. For example, the cushioning layer 330 may be a layer structure formed of a foam material. The copper layer 340 may also be referred to as a heat sink layer (which serves to reduce the temperature of the display) or a radiation shield layer. The buffer layer 330 and the copper layer 340 may be combined into a rear panel of the display screen, or the copper layer 340 is referred to as a rear panel of the display screen.

Wherein the specific function and structure of the fingerprint detection device 200 can be understood with reference to the reference numerals of fig. 5 and 6.

In other words, the fingerprint detection device 200 includes a substrate 210, a light path layer 220, a filter layer 260, a first sensor chip 230, a first fixing glue 240, a support 251, and a first gold wire 250. The substrate 210 includes, in order from top to bottom, a first covering layer 212, a first conductive layer 211, a base material layer 213, a second conductive layer 214, and a second covering layer 215. Optionally, the optical path layer 220 includes a lens layer 221 and an optical path guiding layer 222 thereunder. Optionally, the fingerprint detection device 200 may further include a gold wire protection adhesive 252. The fingerprint sensing device 200 may further include a foam layer 270 to make the surface of the fingerprint sensing device 200 flush. Optionally, the fingerprint detection device 200 may further include a second sensor chip 280, a second fixing glue 281, and a second gold wire 282.

Based on the above structure, the installation scheme of the fingerprint detection device 200 will be described in detail. As shown in fig. 10, the foam 270 on the upper surface of the fingerprint detection device 200 is fixed to the peripheral area of the opening window (i.e., the first opening window 331 and the second opening window 341) on the lower surface of the copper layer 340 by a first PSA 391, so that the first sensor chip 230 is disposed in alignment with the opening window, and is configured to receive, through the opening window, a fingerprint detection signal returned by a human finger above the display screen and guided through the optical path layer, the fingerprint detection signal being configured to detect fingerprint information of the finger.

Taking the display screen as an OLED screen as an example, the display screen may be a soft screen or a hard screen. When a finger is placed above the OLED screen with the bright screen, the finger can reflect light emitted by the OLED screen, and the reflected light can penetrate through the OLED screen to the lower side of the OLED screen. The light path layer below the OLED screen can be used for filtering infrared signal components in the leaked light. Since a fingerprint is a diffuse reflector, light signals formed by reflection or diffusion of a finger exist in all directions. The fingerprint detection device 200 collects light signals leaked from the upper side of the OLED screen, and images a fingerprint image based on the received light signals.

In addition, through first PSA utilizes the bubble of the upper surface of base plate 210 is cotton, will fingerprint detection device 200 paste to the copper layer 340 of display screen, compare in with fingerprint detection device 200 directly laminate to the display panel (being the OLED layer) of display screen, not only can avoid with fingerprint detection device 200 laminates to influence behind the display screen the performance of display screen, can also reduce the installation fingerprint detection device 200's the degree of difficulty, correspondingly, can reduce fingerprint detection device 200's installation complexity and promote electronic equipment 300's yield. In addition, the fingerprint detection device 200 is adhered to the copper layer 340 of the display screen, so that the display screen can be prevented from being damaged in the process of disassembling the fingerprint detection device 200, accordingly, the disassembling complexity of the fingerprint detection device 200 can be reduced, and the yield of the electronic equipment 300 can be improved. In addition, when the display screen is pressed or the electronic device falls or collides, the buffer layer 330 and the copper layer 340 are arranged between the display panel 320 and the fingerprint detection device 200, so that the display panel 320 and the fingerprint detection device 200 are prevented from being squeezed to affect the performance of the display panel 320 and the fingerprint detection device 200.

In addition, the fingerprint detection device 200 is adhered to the copper layer 340 of the display screen, so that the phenomenon that the opening size is too large can be avoided compared with the case that the fingerprint detection device 200 is directly adhered to the display panel 320 of the display screen, accordingly, the visibility of the user when the user watches the fingerprint detection device 200 from the front side of the display screen can be reduced, and the appearance of the electronic device 300 can be beautified.

As shown in fig. 10, in some embodiments of the present application, UV-curable glue 392 is disposed on the outside of the foam layer 270, the outside of the portion of the holder 251 and the outside of the first PSA 391 to fix the fingerprint sensing device 200 relative to the display screen.

Through the UV curing glue 392, the fingerprint detection device 200 can be fixed relative to the display screen, and the difficulty degree of installing the fingerprint detection device 200 can be reduced by utilizing the characteristics of the UV curing glue 392.

It should be understood that fig. 10 is only an example of attaching the fingerprint detection device 200 to the display screen of the electronic device, and should not be construed as limiting the present application.

For example, in fig. 10, the middle frame 360 is formed with a third opening window below the fingerprint detection device 200. In other words, the fingerprint detection device 200 is attached to the copper layer 340 of the display screen in a hanging manner. For example, there is a gap between the fingerprint detection device 200 and the display screen. However, the above solution is only one implementation manner, and in another implementation manner, a third groove is formed in the upper surface of the middle frame in a downward extending manner, and the bottom of the fingerprint detection device 200 contacts the middle frame. In other words, the fingerprint detection device 200 is attached to the copper layer 340 of the display screen in a hanging manner, but there is no gap between the fingerprint detection device 200 and the display screen. In other words, the third recess is only used to provide a receiving position for the fingerprint detection device 200, and is not used to fix the fingerprint detection device 200.

Through the design of laminated structure fingerprint detection device 200 for each part is close fit in thickness direction (promptly each part is close fit in thickness direction and is not reserved the clearance), even keep buffer layer 330 and copper layer 340 in the display screen, also can make at least 200um clearance of left and right sides is reserved between the bottom of fingerprint detection device 200 and battery 370 based on present the thickness of center, be enough with fingerprint detection device 200 sets up the display screen with between the battery 370.

Correspondingly, the fingerprint detection device 200 is disposed between the display screen and the battery 370, which not only does not need to adjust the original internal structure of the electronic device 300, but also improves the utilization rate of the internal space of the electronic device 300, compared with the fingerprint identification device 200 disposed at other positions outside the battery 370. For example, the volume of the battery 370 may be increased, and the saved space may be used to accommodate the increased volume of the battery 370, which may correspondingly increase the service life and user experience of the electronic device 300 without increasing the volume of the electronic device 300.

The scheme of mounting the fingerprint detection module 200 on the copper layer 340 of the display screen is described above with reference to fig. 10, but the embodiment of the present invention is not limited thereto. For example, in other alternative embodiments, the fingerprint sensing device 200 may also be configured to be mounted and secured to the bezel 380.

Fig. 11 is another schematic structural diagram of an electronic device 300 mounted with the fingerprint detection device 200 shown in fig. 5 and 6 according to an embodiment of the present application. The specific functions and structures of the fingerprint detection apparatus 200 can be understood with reference to the reference numerals in fig. 5 and fig. 6, and the functions and structures of the components in the electronic device 300 can be understood with reference to fig. 10, and in order to avoid repetition, the details thereof are not repeated here.

As shown in fig. 11, a third groove is formed in the upper surface of the middle frame 380 extending downward, and the bottom of the fingerprint detection device 200 is disposed in the third groove through the second PSA 393. In other words, the third recess is only used for providing a receiving position for the fingerprint detection device 200 and also for fixing the fingerprint detection device 200.

As shown in fig. 11, in some embodiments of the present application, there is a gap between the fingerprint detection device 200 and the sidewall of the third groove, and the gap formed between the fingerprint detection device and the sidewall of the third groove may be used as a dimensional tolerance or an installation tolerance of the fingerprint detection device 200 and may also be used as a dimensional tolerance of the third groove.

As shown in fig. 11, in some embodiments of the present application, the buffer layer 330 may be provided with a first window 331 penetrating the buffer layer 330, and the copper layer 340 may be provided with a second window 341 penetrating the copper layer 340, wherein the size of the first window 331 is smaller than that of the second window 341, so that the buffer layer 220 and the fingerprint detection device 200 form a buffer space. Optionally, as shown in fig. 11, the buffer space may be provided with a buffer material 396, wherein the buffer material 396 includes, but is not limited to, foam. In other words, the upper surface of the fingerprint detection apparatus 200 abuts against the buffer layer 330 through the buffer material 396, for example, the foam 270 on the upper surface of the fingerprint detection apparatus 200 abuts against the buffer layer 330 through the buffer material 396, and the buffer material 396 not only can be used for avoiding the influence on the detection performance of the fingerprint detection apparatus 200 due to the touch of the fingerprint detection apparatus 200 on the display screen, but also can be sealed and dust-proof, so as to ensure the detection performance of the fingerprint detection apparatus 200 and prolong the service life of the fingerprint detection apparatus 200. In addition, the buffer material 396 can also reduce the visibility of the user when viewing the fingerprint detection device 200 from the front of the display screen, thereby beautifying the appearance of the electronic device 300. In addition, through will buffer material 396 sets up in the buffer space, can make reasonable use of electronic equipment 300's inner space, and then reduce electronic equipment's thickness improves user experience.

It should be understood that fig. 10 and 11 are only examples of the present application and should not be construed as limiting the present application.

For example, in other alternative embodiments, the fingerprint detection device may also be affixed to both the display screen and the bezel. For another example, to make the most of the internal space of the electronic device, the fingerprint detection device 300 may be further attached to the side of the groove of the middle frame 380.

It should be understood that the specific examples in the embodiments of the present application are for the purpose of promoting a better understanding of the embodiments of the present application and are not intended to limit the scope of the embodiments of the present application.

It is to be understood that the terminology used in the embodiments of the present application and the appended claims is for the purpose of describing particular embodiments only and is not intended to be limiting of the embodiments of the present application. For example, as used in the examples of this application and the appended claims, the singular forms "a," "an," and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise.

Those of ordinary skill in the art will appreciate that the elements of the examples described in connection with the embodiments disclosed herein may be implemented as electronic hardware, computer software, or combinations of both, and that the components and steps of the examples have been described above generally in terms of their functionality in order to clearly illustrate the interchangeability of hardware and software. Whether such functionality is implemented as hardware or software depends upon the particular application and design constraints imposed on the implementation. Skilled artisans may implement the described functionality in varying ways for each particular application, but such implementation decisions should not be interpreted as causing a departure from the scope of the present application.

In the several embodiments provided in the present application, it should be understood that the disclosed system and apparatus may be implemented in other manners. For example, the above-described apparatus embodiments are merely illustrative, and for example, the division of the elements is merely a logical division, and in actual implementation, there may be other divisions, for example, multiple elements or components may be combined or integrated into another system, or some features may be omitted, or not executed. In addition, the shown or discussed mutual coupling or direct coupling or communication connection may be an indirect coupling or communication connection through some interfaces, devices or elements, and may also be an electrical, mechanical or other form of connection.

The functional elements referred to above may be integrated or may be physically present separately. The functional elements may be implemented in the form of hardware or software functional units. If implemented in the form of software functional units and sold or used as a stand-alone product, may be stored in a computer readable storage medium. Based on such understanding, the technical solutions of the present application may be substantially implemented or contributed to by the prior art, or all or part of the technical solutions may be implemented in a software product stored in a storage medium and including instructions for causing a computer device (which may be a personal computer, a server, or a network device) to execute all or part of the steps of the method according to the embodiments of the present application. And the aforementioned storage medium includes: various media capable of storing program codes, such as a usb disk, a removable hard disk, a Read-Only Memory (ROM), a Random Access Memory (RAM), a magnetic disk, or an optical disk.

While the invention has been described with reference to specific embodiments, the scope of the invention is not limited thereto, and those skilled in the art can easily conceive various equivalent modifications or substitutions within the technical scope of the invention. Therefore, the protection scope of the present application shall be subject to the protection scope of the claims.

Claims

1. A fingerprint detection device, is characterized in that, is applicable to the electronic equipment that has the display screen, fingerprint detection device sets up the below of display screen includes:

the lower surface of the filter layer is provided with silk-screen support printing ink;

the optical path layer is arranged below the filter layer, a gap is formed between the upper surface of the optical path layer and the lower surface of the supporting ink, and the supporting ink is used for supporting the filter layer so that a gap is kept between the upper surface of the optical path layer and the lower surface of the filter layer;

a first sensor chip disposed below the optical path layer;

the sensor chip comprises a substrate, a first chip and a second chip, wherein a first groove is formed in the upper surface of the substrate in a downward extending mode, at least one part of the first sensor chip is arranged in the first groove, and the first sensor chip is electrically connected to the substrate;

a support disposed above the substrate around the first sensor chip for supporting the filter layer;

the first sensor chip is used for receiving fingerprint detection signals which pass through the filter layer and the light path layer after the human body finger above the display screen returns, and the fingerprint detection signals are used for detecting fingerprint information of the finger.

2. The fingerprint sensing device of claim 1, wherein a center of the supporting ink coincides with a center of the sensing area of the first sensor chip in a vertical direction.

3. The fingerprint detection apparatus according to claim 1 or 2, wherein a gap exists between a side wall of the first sensor chip and a side wall of the first groove, and between a side wall of the holder near the first sensor chip and a side wall of the first sensor chip,

the width of the gap between the side wall of the bracket close to the first sensor chip and the side wall of the first sensor chip is greater than or equal to the width of the gap between the side wall of the first sensor chip and the side wall of the first groove.

4. The fingerprint detection apparatus according to claim 3, further comprising:

the first gold thread is used for electrically connecting the first sensor chip and the conducting layer of the substrate, and is positioned between the side wall of the first sensor chip and the side wall of the first groove, and the support is close to the side wall of the first sensor chip and the gap between the side walls of the first sensor chip.

5. The fingerprint sensing device of claim 4, wherein one of the lower surfaces of the filter layer adjacent to the first gold wire is fixed to the upper surface of the first sensor chip, and the other of the lower surfaces of the filter layer is fixed to the upper surface of the support.

6. The fingerprint sensing device according to claim 5, wherein one of the lower surfaces of the filter layer adjacent to the first gold wire is fixed to the upper surface of the first sensor chip by a first adhesive, and the other of the lower surfaces of the filter layer is fixed to the upper surface of the holder by a second adhesive.

7. The fingerprint detection device according to any one of claims 4 to 6, wherein the width of the gap between the sidewall of the first sensor not close to the first gold wire and the sidewall of the first groove has a value in the range of 100-.

8. The fingerprint detection apparatus according to any one of claims 1 to 7, wherein a thickness of the filter layer is less than or equal to 220 um.

9. The fingerprint detection apparatus of any one of claims 1 to 8, wherein the supporting ink has a thickness of less than or equal to 30 um.

10. The fingerprint detection apparatus of any one of claims 1 to 9, wherein the area supporting the ink is less than or equal to 40 x 40 um.

11. The fingerprint sensing device of any one of claims 1-10, wherein the light-entering surface of the filter layer has a reflectivity of less than or equal to 1% for light.

12. The fingerprint sensing device of any one of claims 1 to 11, wherein the total thickness of the fingerprint sensing device is in the range of 0.15-0.6 mm.

13. The fingerprint detection apparatus according to any one of claims 4 to 7, wherein the substrate comprises a first cover layer, a first conductive layer, a substrate layer, a second conductive layer and a second cover layer in sequence from top to bottom,

the upper surface of the substrate extends downward in a first region and penetrates the first cover layer and the first conductive layer to form the first groove,

the upper surface of the substrate extends downwards in a second area connected with the first area and penetrates through the first covering layer to form a bonding pad of the substrate; the first sensor chip is connected to the bonding pad of the substrate through the first gold wire.

14. The fingerprint detection device according to claim 13, further comprising:

the lower surface of the first sensor chip is fixed in the first groove through the first fixing glue.

15. Fingerprint detection apparatus according to claim 13 or 14 wherein the thickness of the first cover layer is equal to the thickness of the second cover layer, the thickness of the first conductive layer being the same as the thickness of the second conductive layer.

16. The fingerprint sensing device of claim 15, wherein the substrate has a total thickness of less than or equal to 150um, the first cover layer has a thickness and the second cover layer has a thickness of less than or equal to 30um,

the thickness of first conducting layer with the thickness of second conducting layer all is less than or equal to 20um, the thickness of substrate is for being less than or equal to 80 um.

17. The fingerprint detection device according to claim 14, wherein the thickness of the first sensor chip is less than or equal to 150um, the maximum arc height of the first gold wire is less than or equal to 60um, and the thickness of the first fixing glue is less than or equal to 30 um.

18. The fingerprint detection apparatus according to any one of claims 13 to 17, wherein an outer side of the holder is shortened by a preset distance in a direction approaching the first sensor chip with respect to an outer side of the first cover film.

19. The fingerprint detection device according to claim 18, wherein the predetermined distance has a value range of 100-400 um.

20. The fingerprint detection apparatus according to any one of claims 13 to 19, further comprising: the second sensor chip, the second fixing glue and the second gold thread;

wherein the upper surface of the substrate extends downward in a third region connected to the second region and penetrates the first cover layer and the first conductive layer to form a second groove,

the second sensor chip is fixed in the second groove through the second fixing glue, and is connected to the bonding pad of the substrate through the second gold thread, so that the second sensor chip is connected to the first sensor chip, and the second sensor chip is used for being matched with the first sensor chip to perform fingerprint identification under a screen.

21. The fingerprint sensing device of claim 20, wherein a gap exists between a sidewall of the second sensor chip and a sidewall of the second recess.

22. The fingerprint detection device of claim 21, wherein the width of the gap between the sidewall of the second sensor chip not close to the first gold wire and the sidewall of the second groove is 100-400 um.

23. The fingerprint detection device according to any one of claims 20 to 22, wherein the thickness of the first sensor chip is equal to the thickness of the second sensor chip, the thickness of the first fixing glue is equal to the thickness of the second fixing glue, and the maximum arc height of the first gold wire is equal to the maximum arc height of the second gold wire.

24. The fingerprint detection apparatus according to any one of claims 20 to 23, further comprising:

and the gold thread protection adhesive is used for packaging the first gold thread and the second gold thread.

25. The fingerprint detection device of claim 24, wherein the gold wire protection paste has a height of less than or equal to 200 um.

26. The fingerprint detection apparatus according to any one of claims 1 to 25, further comprising:

the foam layer is arranged above the support around the filter layer, an opening penetrating through the foam layer is formed in the foam layer, and the first sensor chip receives the fingerprint detection signal through the opening of the foam layer;

the upper surface of the foam layer is flush with the upper surface of the filter layer.

27. The fingerprint sensing device of claim 26, wherein the support is a polyethylene terephthalate (PET) glue layer for connecting the substrate and the foam layer; or

The lower surface of the support is fixed on the upper surface of the substrate through support fixing glue, and the upper surface of the support is fixed on the foam layer through the support fixing glue.

28. The fingerprint sensing apparatus of claim 26 or 27, wherein the thickness of the support is less than or equal to 150 um.

29. The fingerprint detection device according to any one of claims 26 to 28, wherein the display screen comprises a transparent cover plate, a display panel, a buffer layer and a copper layer in sequence from top to bottom, and the display screen is provided with a window penetrating through the buffer layer and the copper layer;

the upper surface of the foam is fixed in the periphery area of the windowing on the lower surface of the copper layer through a first pressure-sensitive adhesive, so that the fingerprint identification module is fixed below the display screen,

the sensing area of the first sensor chip is aligned with the windowing device, so that the first sensor chip receives the fingerprint detection signal.

30. The fingerprint sensing device of claim 29, wherein an ultraviolet curing adhesive is disposed on an outer side of the fingerprint sensing device and an outer side of the first pressure sensitive adhesive to fix a relative position of the fingerprint sensing device with respect to the display.

31. The fingerprint detection device according to any one of claims 26 to 28, wherein the display screen comprises a transparent cover plate, a display panel, a buffer layer and a copper layer in sequence from top to bottom, the display screen is provided with a window penetrating through the buffer layer and the copper layer, and the window of the buffer layer is smaller than the window of the copper layer in size;

the fingerprint detection device is positioned in a groove of a middle frame of the electronic equipment,

the upper surface of the foam is fixed in the periphery area of the window of the lower surface of the buffer layer through foam rubber within the window range of the copper layer, so that the fingerprint identification module is fixed below the display screen,

the sensing area of the first sensor chip is aligned with the windowing arrangement of the buffer layer, so that the first sensor chip receives the fingerprint detection signal.

32. The fingerprint sensing device of claim 29, wherein a bottom of the fingerprint sensing device is disposed within the recess of the bezel via a second pressure sensitive adhesive.

33. The fingerprint detection apparatus according to any one of claims 1 to 32, wherein the optical path layer includes a lens layer and an optical path guiding layer,

the micro lens is used for converging an optical signal returned by a human finger above the display screen to the optical path guiding layer, and the optical path guiding layer guides the optical signal converged by the micro lens to the first sensor chip.

34. The fingerprint sensing device of claim 33, wherein the optical path layer has a thickness less than or equal to 30 um.

35. The fingerprint detection apparatus according to any one of claims 1 to 34, further comprising:

a flexible circuit board formed with gold fingers of the flexible circuit board;

the golden fingers of the flexible circuit board are electrically connected to the golden fingers of the substrate through the anisotropic conductive adhesive film.

36. An electronic device, comprising:

a display screen;

a fingerprint detection device disposed below the display screen, the fingerprint detection device being as claimed in any one of claims 1 to 35, and a fingerprint acquisition area thereof being at least partially located within a display area of the display screen.

37. The electronic device of claim 36, wherein the display screen sequentially comprises a transparent cover plate, a display panel, a buffer layer and a copper layer from top to bottom, wherein the display screen is provided with a window penetrating through the buffer layer and the copper layer, and a light path layer of the fingerprint detection device is aligned to the window so that the fingerprint detection device receives a fingerprint detection signal returned by a human finger above the display screen through the window, and the fingerprint detection signal is used for detecting fingerprint information of the finger.

38. The electronic device of claim 37, wherein a border region of the upper surface of the fingerprint detection device secures a surrounding region of the fenestration of the lower surface of the copper layer with a first pressure sensitive adhesive such that the optical path layer of the fingerprint detection device is disposed in alignment with the fenestration.

39. The electronic device of claim 35, further comprising a middle frame, wherein a third groove is formed in the upper surface of the middle frame in a downward extending manner, and the bottom of the fingerprint detection device is disposed in the third groove through a second pressure sensitive adhesive.