CN111801685B

CN111801685B - Fingerprint detection device and electronic equipment

Info

Publication number: CN111801685B
Application number: CN202080001525.0A
Authority: CN
Inventors: 王景; 刘凯; 刘相英
Original assignee: Shenzhen Goodix Technology Co Ltd
Current assignee: Shenzhen Goodix Technology Co Ltd
Priority date: 2019-05-29
Filing date: 2020-03-27
Publication date: 2024-06-04
Anticipated expiration: 2040-03-27
Also published as: CN111801685A

Abstract

The application provides a fingerprint detection device and electronic equipment, which can avoid Newton ring problem. The fingerprint detection device is arranged below the display screen of the electronic equipment, and comprises: the lower surface of the filter layer is screen printed with supporting ink, and the supporting ink is used for supporting a gap between the filter layer and the upper surface of the light path layer; the light path layer is arranged below the light filtering layer; a first sensor chip disposed below the optical path layer; a substrate, wherein a first groove is formed on the upper surface of the substrate in a downward extending manner, and at least one part of the first sensor chip is arranged in the first groove and is electrically connected to the substrate; the bracket is arranged above the substrate around the first sensor chip and is used for supporting the filter layer; the first sensor chip is used for receiving fingerprint detection signals which pass through the filter layer and the light path layer after returning through a human finger above the display screen, so as to be used for detecting fingerprint information of the finger.

Description

Fingerprint detection device and electronic equipment

Technical Field

The embodiment of the application relates to the field of fingerprint identification, and more particularly relates to a fingerprint detection device and electronic equipment.

Background

The under-screen fingerprint recognition scheme refers to attaching an optical or ultrasonic fingerprint recognition module to the bottom of a Light Emitting layer of an Organic Light-Emitting Diode (OLED) screen, that is, the optical fingerprint recognition module and the ultrasonic fingerprint recognition module need to be tightly adhered to the bottom Light Emitting layer of the Light Emitting layer.

For the under-screen optical fingerprint scheme, one is that the fingerprint identification module comprises a collimator for adjusting the light path. The period of the collimator of the fingerprint identification module is required to be kept the same as the period formed by the panel wiring of the screen display, so that the collected image can be ensured to have no mole stripes, and the normal use of the fingerprint function can not be influenced. On the other hand, the optical filter is generally filled and attached on the surface of the sensor by optical adhesive, and once the adhesive thickness covering the surface of the sensor is uneven, newton rings exist, so that the normal use of the fingerprint function is affected.

Disclosure of Invention

The embodiment of the application provides a fingerprint detection device and electronic equipment, which can avoid the problem of Newton rings.

In a first aspect, a fingerprint detection device is provided, suitable for an electronic device having a display screen, the fingerprint detection device being arranged below the display screen, the fingerprint detection device comprising: the lower surface of the filter layer is provided with silk-screen supporting ink; the light path layer is arranged below the light filtering layer, a gap is formed between the upper surface of the light path layer and the lower surface of the supporting ink, and the supporting ink is used for supporting the light filtering layer, so that a gap is kept between the upper surface of the light path layer and the lower surface of the light filtering layer; the first sensor chip is arranged below the light path layer; a substrate, wherein a first groove is formed on the upper surface of the substrate in a downward extending manner, and at least one part of the first sensor chip is arranged in the first groove and is electrically connected to the substrate; the bracket is arranged above the substrate around the first sensor chip and is used for supporting the filter layer; the first sensor chip is used for receiving fingerprint detection signals which pass through the filter layer and the light path layer after returning through a human finger above the display screen, and the fingerprint detection signals are used for detecting fingerprint information of the finger.

According to the fingerprint identification module provided by the embodiment of the application, the filter layer is arranged above the light path layer, and the external filter layer can effectively block the influence of ambient light on the fingerprint identification process, so that the image contrast is prevented from being reduced due to strong light intervention when a user performs fingerprint unlocking, and the abnormal unlocking problem is further prevented; and the middle of the lower surface of the filter layer is screen printed with supporting ink corresponding to the sensing area of the fingerprint chip, and the middle position of the filter layer is supported by the supporting ink, so that the Newton ring problem caused by deformation of the filter layer is prevented.

In addition, the optical path layer of the fingerprint detection device in the embodiment of the application is directly arranged on the upper surface of the first sensor chip, and the lower surface of the first sensor chip is fixed on the substrate, so that the situation that the optical path layer and the first sensor chip are carried with a shell independently can be avoided, and the size (such as thickness) of the fingerprint detection device is reduced; in addition, the fingerprint detection device is arranged in the groove of the substrate, so that the thickness of the fingerprint detection device can be reduced.

Again, by close fit between the layers in the thickness direction, a maximum reduction in the thickness of the fingerprint detection device is ensured.

Finally, because the light path layer is directly arranged on the upper surface of the first sensor chip, the image acquisition view field of the fingerprint detection device is only affected by the area of the light path layer and the area of the corresponding first sensor chip, based on the light path layer and the area of the corresponding first sensor chip, the area of the light path layer and the area of the corresponding first sensor chip can be reasonably designed according to actual requirements, so that the requirements of different users and different customers (for example, the requirement of a large-area image acquisition view field can be met) can be met.

In some possible implementations, gaps exist between the side walls of the first sensor chip and the side walls of the first groove, and between the side walls of the bracket near the first sensor chip and the side walls of the first sensor chip.

By designing a certain gap between the side wall of the first sensor chip and the side wall of the first groove, and providing a gap between the side wall of the holder and the side wall of the first sensor chip, even if there is a difference between the size of the manufactured product of the first sensor chip and the design size of the first sensor chip, or even if there is a difference between the actual size of the first groove and the design size of the first groove, there is a difference between the actual size of the holder and the design size of the first groove, the mounting of the first fingerprint sensor chip in the first groove is not affected.

In other words, the gap between the side wall of the first sensor chip and the side wall of the first recess may be taken as a dimensional tolerance of the first sensor chip and/or a dimensional tolerance of the first recess, as well as a mounting tolerance of the first sensor chip; accordingly, the gap between the side wall of the bracket and the side wall of the first sensor chip can be used as a dimensional tolerance of the first sensor chip and/or a dimensional tolerance of the bracket, and can also be used as a mounting tolerance of the first sensor chip, so that the yield of the fingerprint detection device can be improved.

In some possible implementations, the fingerprint detection device further includes: and the first gold wire is used for electrically connecting the first sensor chip and the conductive layer of the substrate, and is positioned in a gap between the side wall of the first sensor chip and the side wall of the first groove and between the side wall of the bracket, which is close to the first sensor chip, and the side wall of the first sensor chip.

In some possible implementations, a width of a gap between the sidewall of the first sensor chip and the sidewall of the bracket proximate to the first sensor chip is greater than or equal to a width of a gap between the sidewall of the first sensor chip and the sidewall of the first recess.

In some possible implementations, the width of the gap between the sidewall of the first sensor, which is not close to the first gold wire, and the sidewall of the first groove may be set to a value ranging from 100 um to 400um, for example, 200um, and the gap between the sidewall of the first sensor, which is not close to the first gold wire, and the sidewall support of the support, which is close to the first sensor chip, may be set to a value ranging from 100 um to 400um, for example, 270um.

In some possible implementations, one edge of the lower surface of the filter layer, which is close to the first gold wire, is fixed to the upper surface of the first sensor chip, and the other edge of the lower surface of the filter layer is fixed to the upper surface of the bracket.

For example, the lower surface of the filter layer may be rectangular, and then one side of the lower surface of the filter layer is close to the gold wire, and the other three sides are not close to the gold wire, and the three-side area not close to the gold wire may be fixed on the upper surface of the bracket, and the side close to the gold wire is fixed on the upper surface of the first sensor chip, so that the influence on the installation of the gold wire may be avoided.

In some possible implementations, one edge of the lower surface of the filter layer, which is close to the first gold wire, is fixed on the upper surface of the first sensor chip through a first back adhesive, and the other edge of the lower surface of the filter layer is fixed on the upper surface of the bracket through a second back adhesive.

One side of the lower surface of the optical filter layer, which is close to the first gold wire, is fixed on the upper surface of the first sensor chip through a first back adhesive, so that gold wire protection adhesive for fixing the gold wire can be prevented from flowing into the light path layer.

In some possible implementations, the thickness of the filter layer is less than or equal to 220um.

Thickness the thickness of the filter layer is typically chosen to be 110um, considering existing technology and mass productivity.

In some possible implementations, the center of the supporting ink coincides with the center of the sensing area of the first sensor chip in a vertical direction.

Since the center position is more balanced for the supporting force of the whole filter layer, the position of the silk-screen supporting ink is generally set to coincide with the center of the sensing area of the first sensing chip below.

In some possible implementations, the thickness of the support ink is less than or equal to 30um.

As the thickness of the supporting ink increases, the contrast of newton's inversion gradually decreases, and newton's rings substantially disappear at a distance of 25um, and therefore, the thickness of the supporting ink is generally set to 25um.

In some possible implementations, the area of the supporting ink is less than or equal to 40×40um, for example, 30um×30um may be set.

On the premise of not influencing fingerprint identification, the larger the size of the support ink for silk screen printing is, the better the support effect on the filter layer is, namely the less easy the filter layer is deformed, and the less easy the filter layer is to generate Newton rings.

In some possible implementations, the light-entering surface of the filter layer has a reflectivity of less than or equal to 1% for light.

In some possible implementations, the total thickness of the fingerprint detection device has a value in the range of 0.15-0.6mm.

In some possible implementations, the substrate includes, from top to bottom, a first cover layer, a first conductive layer, a substrate layer, a second conductive layer, and a second cover layer, the upper surface of the substrate extends downward in a first area and penetrates through the first cover layer and the first conductive layer to form the first groove, and the upper surface of the substrate extends downward in a second area connected to the first area and penetrates through the first cover layer to form a pad of the substrate; the first sensor chip is connected to a pad of the substrate through the first gold wire.

By removing the first cover layer and the first conductive layer of the substrate at the first region, forming a first recess for accommodating the first fixing paste and the first sensor chip, the thickness of the fingerprint detection device can be reduced.

Secondly, through removing the first overburden of second region department of base plate, form the base plate pad that is used for electrically connecting first sensor chip, can be for being used for electrically connecting first sensor chip with the first gold thread of base plate provides accommodation space, correspondingly, reduced first gold thread is in the occupation space of base plate top, and then can reduce fingerprint detection device's thickness.

In some possible implementations, the fingerprint detection device further includes: the lower surface of the first sensor chip is fixed into the first groove through the first fixing glue.

In some possible implementations, the thickness of the first cover layer is equal to the thickness of the second cover layer, and the thickness of the first conductive layer is the same as the thickness of the second conductive layer.

In some possible implementations, the total thickness of the substrate is less than or equal to 150um, the thickness of the first cover layer and the thickness of the second cover layer are both less than or equal to 30um, the thickness of the first conductive layer and the thickness of the second conductive layer are both less than or equal to 20um, and the thickness of the substrate is 80um.

In some possible implementations, the thickness of the first sensor chip is less than or equal to 150um, the maximum arc height of the first gold wire is less than or equal to 60um, and the thickness of the first fixing glue is less than or equal to 30um.

In some possible implementations, the outer side of the bracket is shortened by a preset distance relative to the outer side of the first cover film in a direction approaching the first sensor chip.

In some possible implementations, the preset distance may have a value ranging from 100 um to 400um, for example, may be set to 200um.

The preset distance can be used as the dimensional tolerance of the bracket and the mounting tolerance of the bracket, and accordingly, the yield of the fingerprint detection device can be improved.

In some possible implementations, the fingerprint detection device further includes: the second sensor chip, the second fixing adhesive and the second gold wire; the upper surface of the substrate downwards extends in a third area connected with the second area and penetrates through the first covering layer and the first conducting layer to form a second groove, the second sensor chip is fixed in the second groove through second fixing glue, the second sensor chip is connected to a bonding pad of the substrate through a second gold wire, so that the second sensor chip is connected to the first sensor chip, and the second sensor chip is used for matching with the first sensor chip to perform fingerprint identification under the screen.

Through the second sensor chip that sets up, can share the processing task of first sensor chip is equivalent to, replaces the thickness that a complete and thicker sensor chip of function set up in parallel thinner first sensor chip and second sensor chip, and is corresponding, can reduce on the basis that does not influence fingerprint identification performance fingerprint detection device's thickness.

In some possible implementations, a gap exists between the sidewall of the second sensor chip and the sidewall of the second recess.

By designing a certain gap between the side wall of the second sensor chip and the side wall of the second groove, the mounting of the second fingerprint sensor chip in the second groove is not affected even if there is a difference between the size of the manufactured product of the second sensor chip and the design size of the second sensor chip, or even if there is a difference between the actual size of the second groove and the design size of the second groove.

In other words, the gap between the sidewall of the second sensor chip and the sidewall of the second groove may be used not only as a dimensional tolerance of the second sensor chip and/or as a dimensional tolerance of the second groove, but also as a mounting tolerance of the second sensor chip, and accordingly, a yield of the fingerprint detection device may be improved.

In some possible implementations, the width of the gap between the sidewall of the second sensor chip, which is not close to the first gold wire, and the sidewall of the second groove may range from 100 um to 400um, for example, 200um may be taken.

In some possible implementations, the thickness of the first sensor chip is equal to the thickness of the second sensor chip, the thickness of the first fixing glue is equal to the thickness of the second fixing glue, and the maximum arc height of the first gold wire is equal to the maximum arc height of the second gold wire.

In some possible implementations, the fingerprint detection device further includes: and the gold thread protection glue is used for packaging the first gold thread and the second gold thread.

Through gold thread protection gel can guarantee the stability of electric connection between base plate with first sensor chip, correspondingly, can guarantee fingerprint detection device's performance.

In some possible implementations, the gold thread protective gel has a height of less than or equal to 200um.

In some possible implementations, the thickness of the gold wire protective glue is less than or equal to a sum of the thickness of the optical path layer, the thickness of the first sensor chip, and the thickness of the first fixing glue.

The thickness of the gold thread protection glue is smaller than or equal to the sum of the thickness of the light path layer, the thickness of the first sensor chip and the thickness of the first fixing glue, so that the thickness of the fingerprint detection device can be reduced as much as possible while the first gold thread is effectively packaged.

In some possible implementations, the fingerprint detection device further includes: the foam layer is arranged above the bracket around the optical filter layer, an opening penetrating through the foam layer is formed in the foam layer, and the first sensor chip receives the fingerprint detection signal through the opening of the foam layer; the upper surface of the foam layer is flush with the upper surface of the filter layer.

Because the filter layer sets up in light path layer top, the height that highly is less than the upper surface of filter layer of the upper surface that probably can have the support leads to whole fingerprint detection device's upper surface height inconsistent, can be through setting up the bubble cotton this moment for fingerprint detection device's upper surface is level and smooth, and then conveniently will install this fingerprint detection device in the below of display screen.

In some possible implementations, the bracket is a polyethylene terephthalate PET glue layer for connecting the substrate and the foam layer; or the lower surface of the bracket is fixed on the upper surface of the substrate through the bracket fixing glue, and the upper surface of the bracket is fixed on the foam layer through the bracket fixing glue.

In some possible implementations, the thickness of the scaffold is less than or equal to 150um.

In some possible implementations, the display screen sequentially comprises a transparent cover plate, a display panel, a buffer layer and a copper layer from top to bottom, wherein the display screen is provided with a window penetrating through the buffer layer and the copper layer; the upper surface of the foam is fixed on the periphery area of the window on the lower surface of the copper layer through a first Pressure Sensitive Adhesive (PSA), so that the fingerprint identification module is fixed below the display screen, and the sensing area of the first sensor chip is aligned with the window, so that the first sensor chip receives the fingerprint detection signal.

In some possible implementations, an Ultraviolet (UV) curable glue is provided on the outside of the fingerprint detection device and the outside of the first PSA to fix the relative position of the fingerprint detection device with respect to the display screen.

In some possible implementations, the display screen sequentially comprises a transparent cover plate, a display panel, a buffer layer and a copper layer from top to bottom, wherein the display screen is provided with a window penetrating through the buffer layer and the copper layer, and the size of the window of the buffer layer is smaller than that of the window of the copper layer; the fingerprint detection device is located in a groove of a middle frame of the electronic device, the upper surface of the foam is fixed in a peripheral area of the window of the lower surface of the buffer layer in a window opening range of the copper layer through foam rubber, so that the fingerprint identification module is fixed below the display screen, and an induction area of the first sensor chip is aligned with the window opening of the buffer layer, so that the first sensor chip receives the fingerprint detection signals.

In some possible implementations, the bottom of the fingerprint detection device is disposed within the recess of the middle frame by a second PSA.

In some possible implementations, the optical path layer includes a lens layer and an optical path guiding layer, the micro-lens is configured to converge an optical signal returned via a human finger above the display screen to the optical path guiding layer, and the optical path guiding layer guides the optical signal converged by the micro-lens to the first sensor chip.

In some possible implementations, the thickness of the optical path layer is less than or equal to 30um.

In some possible implementations, the fingerprint detection device further includes: the flexible circuit board is provided with a golden finger of the flexible circuit board; and the golden finger of the flexible circuit board is electrically connected to the golden finger of the substrate through the anisotropic conductive adhesive film.

Through the anisotropic conductive adhesive film, the golden finger of the flexible circuit board is pressed to the golden finger of the substrate, which is equivalent to configuring flexible circuit boards with different specifications for the fingerprint detection device, so that the fingerprint detection device has universality and can meet the requirements of different users or clients correspondingly.

In addition, the finger is electrically connected with the substrate and the flexible circuit board, so that not only the insulativity between the contact pieces can be ensured, but also the conductivity between the substrate and the flexible circuit board can be ensured, and particularly, when the fingerprint sensor chip comprises a plurality of chips, the plurality of chips on the substrate can be quickly and electrically connected to the flexible circuit board through the golden finger, and then the installation complexity and the disassembly complexity can be reduced.

In a second aspect, there is provided an electronic device comprising: a display screen; the fingerprint detection device is arranged below the display screen, and the fingerprint detection device is the fingerprint detection device in the first aspect or any possible implementation manner of the first aspect, and the fingerprint acquisition area of the fingerprint detection device is at least partially located in the display area of the display screen.

In some possible implementations, the display screen sequentially comprises a transparent cover plate, a display panel, a buffer layer and a copper layer from top to bottom, wherein the display screen is provided with a window penetrating through the buffer layer and the copper layer, and an optical path layer of the fingerprint detection device is aligned with the window so that the fingerprint detection device receives a fingerprint detection signal returned by a human finger above the display screen through the window, and the fingerprint detection signal is used for detecting fingerprint information of the finger.

In some possible implementations, an edge region of the upper surface of the fingerprint detection device secures a surrounding region of the fenestration of the lower surface of the copper layer by a first PSA such that an optical path layer of the fingerprint detection device is aligned with the fenestration.

In some possible implementations, the electronic device further includes a middle frame, a third groove is formed on an upper surface of the middle frame in a downward extending mode, and a bottom of the fingerprint detection device is disposed in the third groove through a second PSA.

Drawings

Fig. 1 is a schematic plan view of an electronic device to which the present application can be applied.

Fig. 2 is a schematic side cross-sectional view of the electronic device shown in fig. 1.

Fig. 3 to 6 and fig. 8 to 9 are schematic block diagrams of a fingerprint recognition device according to an embodiment of the present application.

FIG. 7 is a diagram illustrating Newton rings at different distances between the filter layer and the sensor chip according to an embodiment of the present application.

Fig. 10 and 11 are schematic block diagrams of an electronic apparatus including a fingerprint recognition device according to an embodiment of the present application.

Detailed Description

The technical solutions in the embodiments of the present application will be described below with reference to the accompanying drawings.

The technical scheme of the embodiment of the application can be applied to various electronic equipment.

For example, smart phones, notebook computers, tablet computers, gaming devices, and other portable or mobile computing devices, as well as electronic databases, automobiles, automated teller machines (Automated TELLER MACHINE, ATM), and other electronic devices. However, the embodiment of the present application is not limited thereto.

The technical scheme of the embodiment of the application can be used for the biological characteristic recognition technology. The biometric technology includes, but is not limited to, fingerprint recognition, palm print recognition, iris recognition, face recognition, living body recognition, and the like. For ease of explanation, fingerprint recognition techniques are described below as examples.

The technical scheme of the embodiment of the application can be used for the under-screen fingerprint identification technology and the in-screen fingerprint identification technology.

The under-screen fingerprint identification technology is characterized in that the fingerprint identification module is arranged below the display screen, so that fingerprint identification operation is carried out in the display area of the display screen, and a fingerprint acquisition area is not required to be arranged in an area except the display area on the front side of the electronic equipment. Specifically, the fingerprint recognition module uses light returned from the top surface of the display assembly of the electronic device for fingerprint sensing and other sensing operations. This returned light carries information about an object (e.g., a finger) in contact with or in proximity to the top surface of the display assembly, and the fingerprint recognition module located below the display assembly performs off-screen fingerprint recognition by capturing and detecting this returned light. The fingerprint recognition module can be designed to realize expected optical imaging by properly configuring optical elements for collecting and detecting returned light, so as to detect fingerprint information of the finger.

Correspondingly, the In-screen (In-display) fingerprint identification technology refers to that a fingerprint identification module or a part of fingerprint identification modules are arranged inside a display screen, so that fingerprint identification operation is carried out In a display area of the display screen, and a fingerprint acquisition area is not required to be arranged In an area except the display area on the front side of the electronic equipment.

Fig. 1 and 2 are schematic diagrams of an electronic device 100 to which the off-screen fingerprint recognition technology may be applied, where fig. 1 is a front schematic diagram of the electronic device 100, and fig. 2 is a schematic partial cross-sectional structure of the electronic device 100 shown in fig. 1.

As shown in fig. 1 and 2, the electronic device 100 may include a display 120 and a fingerprint recognition module 140.

The display screen 120 may be a self-luminous display screen employing a display unit having self-luminescence as display pixels. For example, the display 120 may be an Organic Light-Emitting Diode (OLED) display or a Micro-LED (Micro-LED) display. In other alternative embodiments, the display 120 may be a Liquid crystal display (Liquid CRYSTAL DISPLAY, LCD) or other passive light emitting display, which is not limited in this respect.

In addition, the display screen 120 may be specifically a touch display screen, which not only can perform screen display, but also can detect touch or press operation of a user, so as to provide a personal computer interaction interface for the user. For example, in one embodiment, the electronic device 100 may include a Touch sensor, which may be specifically a Touch Panel (TP), which may be disposed on the surface of the display screen 120, or may be partially integrated or integrally integrated into the display screen 120, so as to form the Touch display screen.

The fingerprint recognition module 140 may be an optical fingerprint recognition module, for example, including an optical fingerprint sensor.

Specifically, the fingerprint recognition module 140 may include a sensor chip (hereinafter also referred to as an optical fingerprint sensor) having an optical sensing array. The optical sensing array comprises a plurality of optical sensing units, and each optical sensing unit can specifically comprise a light detector or a photoelectric sensor. Alternatively, the fingerprint recognition module 140 may include a photodetector (Photo detector) array (or photodetector array, photosensor array) including a plurality of photodetectors distributed in an array.

As shown in fig. 1, the fingerprint recognition module 140 may be disposed in a partial area under the display screen 120, such that the fingerprint acquisition area (or detection area) 130 of the fingerprint recognition module 140 is at least partially located within the display area 102 of the display screen 120.

Of course, in other alternative embodiments, the fingerprint recognition module 140 may be disposed at other locations, such as the side of the display 120 or the edge opaque region of the electronic device 100. In this case, the optical signal of at least a portion of the display area of the display screen 120 may be guided to the fingerprint recognition module 140 through the optical path design, so that the fingerprint acquisition area 130 is actually located in the display area of the display screen 120.

In some embodiments of the present application, the fingerprint recognition module 140 may include only one sensor chip, where the area of the fingerprint collection area 130 of the fingerprint recognition module 140 is smaller and the location is fixed, so that the user needs to press the finger to a specific location of the fingerprint collection area 130 when inputting the fingerprint, otherwise, the fingerprint recognition module 140 may not collect the fingerprint image, resulting in poor user experience.

In other embodiments of the present application, the fingerprint recognition module 140 may specifically include a plurality of sensor chips; the plurality of sensor chips may be disposed side by side below the display screen 120 in a splicing manner, and the sensing areas of the plurality of sensor chips together form the fingerprint collection area 130 of the fingerprint identification module 140. That is, the fingerprint collection area 130 of the fingerprint recognition module 140 may include a plurality of sub-areas, each sub-area corresponding to a sensing area of one of the sensor chips, so that the fingerprint collection area 130 of the optical fingerprint module 130 may be extended to a main area of the lower half of the display screen, that is, to a finger usual pressing area, so as to implement a blind press type fingerprint input operation. Alternatively, when the number of the sensor chips is sufficient, the fingerprint detection area 130 may be further extended to a half display area or even the entire display area, thereby realizing half-screen or full-screen fingerprint detection.

It should be understood that the embodiment of the present application is not limited to the specific form of the plurality of sensor chips.

For example, the plurality of sensor chips may be individually packaged sensor chips, or may be a plurality of chips (Die) packaged in the same chip package.

For another example, the plurality of sensor chips may also be formed on different areas of the same chip by semiconductor processing.

As shown in fig. 2, the area or the light sensing range of the optical sensing array of the fingerprint identification module 140 corresponds to the fingerprint collection area 130 of the fingerprint identification module 140. The fingerprint collecting area 130 of the fingerprint identifying module 140 may be equal to or not equal to the area or the light sensing range of the area where the light sensing array of the fingerprint identifying module 140 is located, which is not limited in the embodiment of the present application.

For example, by light path design of light collimation, the fingerprint acquisition area 130 of the fingerprint recognition module 140 may be designed to be substantially consistent with the area of the sensing array of the fingerprint recognition module 140.

For another example, the micro lens is used to perform the light path design of the converging light or the light path design of the reflecting light, so that the area of the fingerprint collection area 130 of the fingerprint recognition module 140 is larger than the area of the sensing array of the fingerprint recognition module 140.

The following describes an exemplary design of the optical path of the fingerprint recognition module 140.

Taking the optical path design of the fingerprint identification module 140 as an example, an optical collimator with a through hole array with a high aspect ratio is adopted, the optical collimator can be specifically a collimator (Collimator) layer manufactured on a semiconductor silicon wafer, the optical collimator is provided with a plurality of collimating units or micropores, the collimating units can be specifically small holes, light vertically incident to the collimating units can pass through and be received by sensor chips below the collimating units in reflected light reflected by fingers, and light with an overlarge incident angle is attenuated in the collimating units through repeated reflection, so that each sensor chip basically only can receive the reflected light reflected by fingerprint lines right above the sensor chips, the image resolution can be effectively improved, and further the fingerprint identification effect is improved.

Further, when the fingerprint recognition module 140 includes a plurality of sensor chips, a collimation unit may be configured for one optical sensing unit in the optical sensing array of each sensor chip, and is disposed above the corresponding optical sensing unit in a fitting manner. Of course, the plurality of optical sensing units may also share one collimating unit, i.e. the one collimating unit has a sufficiently large aperture to cover the plurality of optical sensing units. Because a collimation unit can correspond to a plurality of optical sensing units, the correspondence between the space period of the display screen 120 and the space period of the sensor chip is destroyed, even if the space structure of the luminous display array of the display screen 120 is similar to that of the optical sensing array of the sensor chip, the fingerprint recognition module 140 can be effectively prevented from generating moire fringes by utilizing the optical signals passing through the display screen 120 to perform fingerprint imaging, and the fingerprint recognition effect of the fingerprint recognition module 140 is effectively improved.

Taking the optical path design of the fingerprint recognition module 140 as an example, the optical path design of the optical Lens is adopted, and the optical Lens may include an optical Lens (Lens) layer, which has one or more Lens units, such as a Lens group formed by one or more aspheric lenses, and is used for converging the reflected light reflected from the finger to the sensing array of the sensor chip below the sensor array, so that the sensing array can image based on the reflected light, and thus a fingerprint image of the finger is obtained.

The optical lens layer may further be formed with a pinhole or a microporous diaphragm in the optical path of the lens unit, for example, one or more light-shielding sheets may be formed in the optical path of the lens unit, wherein at least one light-shielding sheet may be formed with a light-transmitting micropore in the optical axis or optical center area of the lens unit, and the light-transmitting micropore may serve as the pinhole or microporous diaphragm. The pinhole or the microporous diaphragm may be matched with the optical lens layer and/or other optical film layers above the optical lens layer, so as to enlarge the field of view of the fingerprint identification module 140, so as to improve the fingerprint imaging effect of the fingerprint identification module 140.

Further, when the fingerprint recognition module 140 includes a plurality of sensor chips, an optical lens may be configured for each sensor chip to perform fingerprint imaging, or an optical lens may be configured for a plurality of sensor chips to perform light focusing and fingerprint imaging. Even when one sensor chip has two sensing arrays (Dual Array) or multiple sensing arrays (Multi-Array), two or more optical lenses may be configured for the sensor chip to perform optical imaging in cooperation with the two or more sensing arrays, so as to reduce the imaging distance and enhance the imaging effect.

Taking an optical path design of the fingerprint recognition module 140 as an example, an optical path design employing a Micro-Lens layer, the Micro-Lens layer may have a Micro-Lens array formed of a plurality of Micro-lenses, which may be formed over a sensing array of the sensor chip by a semiconductor growth process or other processes, and each Micro-Lens may correspond to one of sensing units of the sensing array, respectively. Other optical film layers, such as a dielectric layer or a passivation layer, may be further formed between the microlens layer and the sensing unit, and more particularly, a light blocking layer having a plurality of micro holes may be further included between the microlens layer and the sensing unit, wherein the micro holes are formed between the corresponding microlenses and the sensing unit, and the light blocking layer may block optical interference between adjacent microlenses and sensing units, and allow light to be converged into the inside of the micro holes by the microlenses and transmitted to the sensing units corresponding to the microlenses through the micro holes, so as to perform optical fingerprint imaging.

Optionally, a filter may be further disposed above the microlens layer or in the optical path between the microlens layer and the sensor chip (hereinafter also referred to as an optical fingerprint sensor).

As an alternative embodiment, the optical filter may be disposed above the microlens layer, for example, the optical filter may be connected to the microlens layer by a buffer layer, which may be a transparent dielectric layer, may be used to planarize the surface of the microlens layer,

Alternatively, the filter may be fixed to the microlens layer by a fixing device, for example, a frame glue or other support member is provided on the non-photosensitive region around the microlens layer to support and fix the filter.

As an alternative embodiment, the optical filter may also be disposed in the optical path between the microlens layer and the sensor chip, for example, the optical filter may be disposed above the sensor chip, in particular, the optical filter may be fixed above the sensor chip by a fixing device, for example, a frame glue or other support is disposed in a non-photosensitive area of the sensor chip to support and fix the optical filter, and an evaporation process or a sputtering process may be used to perform a film plating on the sensor chip, so as to form the optical filter, that is, the optical filter is integrated with the sensor chip. It is understood that the filter may be a film coated on other optical film layers, which is not limited herein.

It should be appreciated that several implementations of the above-described light path guiding structure may be used alone or in combination, e.g. a micro-lens layer may be further provided below the collimator layer or the optical lens layer. Of course, when the collimator layer or the optical lens layer is used in combination with the microlens layer, the specific laminated structure or the optical path thereof may need to be adjusted according to actual needs.

The fingerprint recognition module 140 may be configured to collect fingerprint information (such as fingerprint image information) of a user.

Taking the display screen 120 as an example, the display screen 120 may be a display screen having a self-luminous display unit, such as an Organic Light-Emitting Diode (OLED) display screen or a Micro-LED (Micro-LED) display screen. The fingerprint recognition module 140 may use a display unit (i.e., an OLED light source) of the OLED display screen located in the fingerprint acquisition area 130 as an excitation light source for optical fingerprint detection.

When a finger touches, presses, or approaches (collectively referred to as presses in this application for ease of description) the fingerprint acquisition area 130, the display screen 120 emits a beam of light to the finger above the fingerprint acquisition area 130, which is reflected at the surface of the finger to form reflected light or scattered light after being scattered inside the finger to form scattered light, which are collectively referred to as reflected light for ease of description in the related patent application. Because the ridge (ridge) and the valley (vally) of the fingerprint have different light reflection capacities, the reflected light from the ridge of the fingerprint and the reflected light from the valley of the fingerprint have different light intensities, and the reflected light is received by a sensor chip in the fingerprint identification module 140 and converted into corresponding electric signals, namely fingerprint detection signals after passing through the display screen 120; fingerprint image data can be obtained based on the fingerprint detection signal, and fingerprint matching verification can be further performed, so that an optical fingerprint recognition function is realized in the electronic device 100.

Thus, when a user needs to unlock the fingerprint of the electronic device 100 or perform other fingerprint verification, the user can perform the fingerprint feature input operation by pressing the finger on the fingerprint collection area 130 of the display screen 120. Because the collection of the fingerprint features can be implemented in the display area 102 of the display screen 120, the electronic device 100 adopting the above structure does not need to have a special reserved space on the front surface to set fingerprint keys (such as Home keys), so that a full-screen scheme can be adopted. Accordingly, the display area 102 of the display screen 120 may extend substantially the entire front of the electronic device 100.

Of course, in other alternatives, the fingerprint recognition module 140 may also use an internal light source or an external light source to provide the optical signal for fingerprint detection and recognition. In this case, the fingerprint recognition module 140 may be applied to not only a self-luminous display screen such as an OLED display screen, but also a non-self-luminous display screen such as a liquid crystal display screen or other passive light-emitting display screen.

Taking the application to a liquid crystal display having a backlight module and a liquid crystal panel as an example, to support the under-screen fingerprint detection of the liquid crystal display, the optical fingerprint system of the electronic device 100 may further include an excitation light source for optical fingerprint detection, where the excitation light source may be specifically an infrared light source or a light source of non-visible light with a specific wavelength, which may be disposed below the backlight module of the liquid crystal display or an edge region below a protective cover plate of the electronic device 100, and the fingerprint recognition module 140 may be disposed below the edge region of the liquid crystal panel or the protective cover plate and guided through an optical path so that fingerprint detection light may reach the fingerprint recognition module 140; or the fingerprint recognition module 140 may also be disposed below the backlight module, and the backlight module may be configured to allow the fingerprint detection light to pass through the liquid crystal panel and the backlight module and reach the fingerprint recognition module 140 by making holes or other optical designs on the film layers such as the diffusion sheet, the brightness enhancement sheet, the reflection sheet, etc. When the fingerprint recognition module 140 uses an internal light source or an external light source to provide an optical signal for fingerprint detection, the detection principle may be the same.

As shown in fig. 1, the electronic device 100 may further include a protective cover plate 110.

The cover plate 110 may be a transparent cover plate, such as a glass cover plate or a sapphire cover plate, which is located above the display screen 120 and covers the front surface of the electronic device 100, and the surface of the cover plate 110 may be further provided with a protective layer. Thus, in embodiments of the present application, a so-called finger-press display screen 120 may actually refer to a cover plate 110 pressed by a finger over the display screen 120 or a protective layer surface covering the cover plate 110.

As shown in fig. 1, a circuit board 150, such as a flexible circuit board (Flexible Printed Circuit, FPC), may be further disposed under the fingerprint recognition module 140.

The fingerprint recognition module 140 may be soldered to the circuit board 150 through pads, and electrically interconnected and signal-transmitted with other peripheral circuits or other elements of the electronic device 100 through the circuit board 150. For example, the fingerprint recognition module 140 may receive a control signal of the processing unit of the electronic device 100 through the circuit board 150, and may also output a fingerprint detection signal from the fingerprint recognition module 140 to the processing unit or the control unit of the electronic device 100 through the circuit board 150, and so on.

Fig. 3 to 6 are schematic block diagrams of a fingerprint detection device 200 according to an embodiment of the present application. The fingerprint detection device 200 is suitable for use in an electronic apparatus having a display screen, for example, the fingerprint detection device 200 may be suitable for use in an electronic apparatus 100 as shown in fig. 1 or fig. 2, and the fingerprint detection device 200 may be disposed below the display screen of the electronic apparatus.

It should be noted that, for convenience of description, in the embodiment of the present application, the same reference numerals are used to denote the same components, and for brevity, detailed description of the same components is omitted in different embodiments.

As shown in fig. 3, the fingerprint detection device 200 comprises: the substrate 210, the light path layer 220, the first sensor chip 230, the holder 251, and the filter layer 260. Specifically, the lower surface of the filter layer 260 is provided with a silk-screened supporting ink 261, for example, the supporting ink 261 may be located at any one of the positions corresponding to the sensing regions of the first sensing chip 230 in the lower surface of the filter layer 260; the light path layer 220 is disposed below the filter layer 260, and a gap is formed between the upper surface of the light path layer 220 and the upper surface of the supporting ink 261, and at the same time, the supporting ink 261 can also support the filter layer 260, so that a gap is maintained between the lower surface of the filter layer 260 and the upper surface of the light path layer; the first sensor chip 230 is disposed under the optical path layer 220; the upper surface of the substrate 210 is downwardly extended to form a first recess, and at least a portion of the first sensor chip 230 is disposed in the first recess and electrically connected to the substrate 210; the holder 251 is disposed above the substrate 210 around the first sensor chip 230 for supporting the filter layer 260. The first sensor chip 230 is configured to receive a fingerprint detection signal returned by a finger of a human body above the display screen and passing through the filter layer 260 and the optical path layer 220, where the fingerprint detection signal is configured to detect fingerprint information of the finger.

According to the fingerprint identification module 200 provided by the embodiment of the application, the filter layer 260 is arranged above the light path layer 220, and the external filter layer 260 can effectively block the influence of ambient light on the fingerprint identification process, so that the image contrast is prevented from being reduced due to strong light intervention when a user performs fingerprint unlocking, and the abnormal unlocking problem is further prevented; and a silk-screen supporting ink 261 is disposed in the lower surface of the filter layer 260 in the sensing area corresponding to the fingerprint chip, and the middle position of the filter layer 260 is supported by the supporting ink 261, so as to prevent the filter layer 260 from deforming and contacting the light path layer 220 to generate newton ring problem during the use process of the fingerprint identification module 200, such as fingerprint information collection.

In addition, the optical path layer 220 of the fingerprint detection device 200 according to the embodiment of the present application is directly disposed on the upper surface of the first sensor chip 230, and the lower surface of the first sensor chip 230 is fixed on the substrate 210, so that it is possible to avoid providing a housing for carrying the optical path layer 220 and the first sensor chip 230 separately, and reduce the size (e.g., thickness) of the fingerprint detection device 200; further, the fingerprint detection device 200 is provided in the recess of the substrate, and the thickness of the fingerprint detection device 200 can be reduced.

Finally, since the optical path layer 220 is directly disposed on the upper surface of the first sensor chip 230, the image acquisition field of view of the fingerprint detection device 200 is only affected by the area of the optical path layer 220 and the area of the corresponding first sensor chip 230, based on this, the area of the optical path layer 220 and the area of the corresponding first sensor chip 230 can be reasonably designed according to the actual requirements, so as to meet the requirements of different users and different customers (for example, the requirement of a large-area image acquisition field of view can be met).

Optionally, as shown in fig. 3, the fingerprint recognition module 200 further includes a first gold wire 250 for electrically connecting the first sensor chip 230 and the substrate 210, where the first gold wire 250 is located in a gap between a sidewall of the first sensor chip and a sidewall of the first groove, and between a sidewall of the bracket adjacent to the first sensor chip and a sidewall of the first sensor chip.

As shown in fig. 4, the substrate 210 according to the embodiment of the present application may include, from top to bottom, a first cover layer 212, a first conductive layer 211 layer 212, a base material layer 213, a second conductive layer 214, and a second cover layer 215, where the upper surface of the substrate 210 extends downward in a first area and penetrates through the first cover layer 212 and the first conductive layer 211 to form a first groove, and the upper surface of the substrate 210 extends downward in a second area connected to the first area and penetrates through the first cover layer 212 to form a pad 2111 of the substrate 210.

Alternatively, in other alternative embodiments, the substrate 210 may include conductive layers other than the first conductive layer 211 and the second conductive layer 214. Alternatively, the first conductive layer 211 or the second conductive layer 214 may be a copper layer or a copper foil layer. Alternatively, the first cover layer 212 or the second cover layer 213 may be an insulating layer (e.g., a resin layer).

As shown in fig. 3, an optical path layer 220 is disposed above the first sensor chip 230, a lower surface of the first sensor chip 230 may be fixed into the first groove by a first fixing adhesive 240, the first sensor chip 230 is connected to a pad 2111 of the substrate 210 by the first gold wire 250, and the first sensor chip 230 is used to receive a fingerprint detection signal returned via a human finger above the display screen and guided by the optical path layer 220, the fingerprint detection signal being used to detect fingerprint information of the finger.

In other words, the lower surface of the first sensor chip 230 is stuck in the first groove by the first fixing adhesive 240, so that at least a portion of the first sensor chip 230 is disposed in the first groove and electrically connected to the substrate 210 by the first gold wire 250; the first sensor chip 230 may be disposed below a display screen of the electronic device through the substrate 210, and the first sensor chip 230 is configured to receive a fingerprint detection signal returned by reflection or scattering of a human finger above the display screen, and detect fingerprint information of the finger based on the fingerprint detection signal, so as to perform fingerprint registration or identification.

It should be understood that the first sensor chip 230 may include a plurality of chips or may include one chip, for example, the first sensor chip 230 may include a plurality of optical fingerprint sensor chips, and the plurality of optical fingerprint sensor chips are disposed in the first groove side by side to be spliced into one optical fingerprint sensor chip assembly. The optical fingerprint sensor chip assembly can be used for simultaneously acquiring a plurality of fingerprint images, and the fingerprint images can be used as a fingerprint image for fingerprint registration or identification after being spliced.

For the fingerprint detection device 200, the optical path layer 220 is directly disposed on the upper surface of the first sensor chip 230, and the lower surface of the first sensor chip 230 is fixed on the substrate 210 by the first fixing adhesive 240, so that it is possible to avoid providing a housing for carrying the optical path layer 220 and the first sensor chip 230 separately, and reduce the size (e.g., thickness) of the fingerprint detection device 200.

Further, by removing the first cover layer 212 and the first conductive layer 211 of the substrate 210 at the first region, forming a first recess for accommodating the first fixing compound 240 and the first sensor chip 230, the thickness of the fingerprint detection device 200 can be reduced.

Next, by removing the first cover layer 212 at the second region of the substrate 210 to form the substrate 210 pad 2111 for electrically connecting the first sensor chip 230, it is possible to provide an accommodation space for the first gold wires 250 for electrically connecting the first sensor chip 230 and the substrate 210, and accordingly, an occupied space of the first gold wires 250 above the substrate 210 is reduced, and thus the thickness of the fingerprint detection device 200 can be reduced.

Again, by close fitting between the layers in the thickness direction, a maximum reduction in the thickness of the fingerprint detection device 200 is ensured.

Finally, since the optical path layer 220 is directly disposed on the upper surface of the first sensor chip 230, the image acquisition field of view of the fingerprint detection device 200 is only affected by the area of the optical path layer 220 and the area of the corresponding first sensor chip 230, and based on this, the area of the optical path layer 220 and the area of the corresponding first sensor chip 230 can be reasonably designed according to the actual requirements, so as to meet the requirements of different users and different customers (such as the requirement of a large-area image acquisition field of view).

In summary, the technical solution of the present application not only can reduce the thickness of the fingerprint detection device 200, but also can ensure a sufficiently large image acquisition field of view.

As shown in fig. 3 and 4, in some embodiments of the present application, a gap d1 exists between the sidewall of the first sensor chip 230 and the sidewall of the first groove.

By designing a certain gap d1 between the side wall of the first sensor chip 230 and the side wall of the first groove, the mounting of the first sensor chip 230 in the first groove is not affected even if there is a difference between the size of the manufactured product of the first sensor chip 230 and the design size of the first sensor chip 230 or even if there is a difference between the actual size of the first groove and the design size of the first groove.

In other words, the gap d1 between the sidewall of the first sensor chip 230 and the sidewall of the first groove may be used not only as a dimensional tolerance of the first sensor chip 230 and/or as a dimensional tolerance of the first groove, but also as a mounting tolerance of the first sensor chip 230, and accordingly, a yield of the fingerprint detection device 200 may be improved. The dimensional tolerance may be the magnitude of the absolute value of the difference between the allowable maximum limit dimension and the minimum limit dimension, or the dimensional tolerance may be the magnitude of the difference between the allowable upper deviation and the lower deviation. Limit deviation = limit size-base size, upper deviation = maximum limit size-base size, and lower deviation = minimum limit size-base size. The dimensional tolerance of the first sensor chip 230 may be a variation amount allowed during cutting processing of the first sensor chip 230. When the basic dimensions are the same, the smaller the dimensional tolerance, the higher the dimensional accuracy. Similarly, the mounting tolerance of the first sensor chip 230 may refer to an offset distance between an allowable first limit mounting position, which may be an allowable mounting position of a first sidewall closest to the first recess, and a second limit mounting position, which may be an allowable mounting position of a second sidewall closest to the first recess, the first sidewall being an opposite sidewall to the second sidewall.

For example, the width d1 of the gap between the sidewall of the first sensor chip 230 and the sidewall of the first groove may have a value ranging from 100 to 400um, for example d1=200um. Of course, alternatively, the width of the gap d1 between the sidewall of the first sensor chip 230 and the sidewall of the first groove may also be other values, or fall within a range of other preset values, which is not specifically limited by the present application. For example, the width of the gap d1 between the sidewall of the first sensor chip 230 and the sidewall of the first groove may be 100um or 300um, and for example, the width of the gap d1 between the sidewall of the first sensor chip 230 and the sidewall of the first groove may be within 100um to 300 un.

It should be noted that, the thickness of each component or layer in the fingerprint detection device 200 is not specifically limited, so long as the structural relationship between the components or layers adopts the design scheme of the present application, and the thickness of the fingerprint detection device is controlled by a tight fit manner, which is all within the scope of the present application.

For example, the thickness of the substrate 210 in the embodiment of the present application is less than or equal to 150um, and for example, the thickness of the substrate 210 may be set to 130um. Wherein the thickness of the first cover layer 212 and the thickness of the second cover layer may be set to be the same, and the thickness of the first conductive layer 211 and the thickness of the second conductive layer may be set to be the same.

As an example, the thickness of the first cover layer 212 and the thickness of the second cover layer may be set to be each less than or equal to 30um, for example, may be each set to 20um, the thickness of the first conductive layer 211 and the thickness of the second conductive layer may be each set to be each less than or equal to 20um, for example, may be each set to 13um, and the thickness of the substrate may be set to be each less than or equal to 80um, for example, may be set to 64um.

As another example, the thickness of the first sensor chip 230 may be set to be less than or equal to 150um, for example, may be specifically set to be 60um; the thickness of the optical path layer 220 is less than or equal to 30um, for example, may be set to 16um or 15.7um; the maximum arc height d6 of the first gold wire 250 may be set to be less than or equal to 60um, for example, may be set to 40um, and the thickness of the first fixing glue 240 may be set to be less than or equal to 30um, for example, may be set to 15um.

Of course, the thickness of the first cover layer 212, the thickness of the first conductive layer 211, the thickness of the substrate layer 213, the thickness of the second conductive layer 214, the thickness of the second cover layer 215, the thickness of the first sensor chip 230, the thickness of the first fixing glue 240, or the maximum arc height d6 of the first gold wire 250 may also be other values or be within a preset range of values, which is not particularly limited in the present application.

It should be understood that the bracket 251 in the embodiment of the present application is disposed on the upper surface of the first cover layer 212 and outside the first sensor chip 230, and may also be used to fix the filter layer 260.

Alternatively, the bracket 251 is fixed to the upper surface of the first cover layer 212 by a bracket fixing adhesive 253 and is located outside the first sensor chip 230. For example, the material of the holder 251 includes, but is not limited to, metal, resin, glass fiber composite board, glue layer, etc. For example, the holder 251 is a polyethylene terephthalate (polyethylene glycol terephthalate, PET) adhesive layer. For another example, the holder 251 may be a holder formed of a foam material. Optionally, the bracket fixing glue may be double sided glue.

In other words, the holder 251 may be disposed above the substrate 210 and located at an outer side or a surrounding area of the first recess and a pad (for electrically connecting the first sensor chip 230) of the substrate 210.

Alternatively, as shown in fig. 3 or fig. 4, the thickness of the bracket 251 (including the bracket fixing adhesive 253) may be set according to practical applications, for example, may be set to be less than or equal to 150um, for example, the thickness of the bracket 251 may be set to be 70um, that is, the thickness at C in fig. 3 to fig. 6 may include, in order from top to bottom: the thickness of the bracket 251 (including the bracket fixing glue 253) (e.g., 70 um) and the thickness of the substrate 210, wherein the thickness of the substrate 210 includes the thickness of the first cover layer 212 (e.g., 20 um), the thickness of the first conductive layer 211 (e.g., 13 um), the thickness of the substrate (e.g., 64 um), the thickness of the second conductive layer (e.g., 13 um), and the thickness of the second cover layer (e.g., 20 um).

As shown in fig. 3, in some embodiments of the present application, a width of a gap d2 formed between the first sensor chip 230 and the holder 251 is greater than or equal to a width of a gap d1 formed between a sidewall of the first sensor chip 230 and a sidewall of the first recess, and an outer side of the holder 251 is shortened by a preset distance d3 in a direction approaching the first sensor chip 230 with respect to an outer side of the first cover layer 212. As an example, the range of the width of the gap d2 formed by the first sensor chip 230 and the holder 251 may be set to 100-400um, for example, d2 may be 270um, and the preset distance d3 may be set to 100-400um, for example, d3 may be 200um.

In addition, the gap d2 formed by the first sensor chip 230 and the bracket 251 may be used not only as a dimensional tolerance of the bracket 251 but also as an installation tolerance of the bracket 251, and accordingly, a yield of the fingerprint detection device 200 may be improved. Similarly, the preset distance d3 may be used not only as a dimensional tolerance of the bracket 251 but also as an installation tolerance of the bracket 251, and accordingly, the yield of the fingerprint detection device 200 may be improved.

Of course, in other alternative embodiments, the gap d2 formed by the first sensor chip 230 and the bracket 251, the preset distance d3, or the thickness of the bracket 251 may be other specific values, or may be within a preset range of values. For example, the thickness of the holder 251 may also be 80um.

As shown in fig. 3, in some embodiments of the present application, the fingerprint detection device 200 may further comprise a gold thread protective gel 252; wherein, the gold wire protection glue 252 is used for packaging the first gold wire 250. By the gold wire protective tape 252, stability of electrical connection between the substrate 210 and the first sensor chip 230 can be ensured, and accordingly, performance of the fingerprint detection device 200 can be ensured.

In some embodiments of the present application, the thickness of the gold wire protective paste 252 may be greater than or less than or equal to the sum of the thickness of the optical path layer 220, the thickness of the first sensor chip 230, and the thickness of the first fixing paste 240. For example, as shown in fig. 3, the thickness of the gold wire protective paste 252 may be equal to the sum of the maximum arc height of the first gold wire 250, the thickness of the first sensor chip 230, and the thickness of the first fixing paste 240. Alternatively, the thickness of the gold wire protective paste 252 may be set according to practical applications, for example, may be set to be less than or equal to 200um, or other values.

For example, as shown in fig. 3 to 6, the thickness at B may include, in order from top to bottom: the maximum arc height of the first gold wire 250 (e.g., 40 um), the thickness of the first sensor chip 230 (e.g., 60 um), the thickness of the first chip fixing paste 230 (e.g., 15 um), the thickness of the base material (e.g., 64 um), the thickness of the second conductive layer (e.g., 13 um), and the thickness of the second cover layer (e.g., 20 um).

Of course, other parameters may be designed for the holder 251 to guide the preparation and installation of the holder 251. For example, as shown in fig. 3 and 4, in some embodiments of the present application, a width of a gap d4 between a side of the first sensor chip 230 adjacent to the pad 2111 of the substrate 210 (for electrically connecting the first sensor chip 230) and the bracket 251 is larger than a width of a gap d2 between a side of the first sensor chip 230 facing away from the substrate 210 (for electrically connecting the first sensor chip 230) and the bracket 251 to reserve a sufficient accommodation space for the bracket fixing paste 252. Alternatively, the width of the gap d4 between the side of the first sensor chip 230 near the pad 2111 of the substrate 210 and the holder 251 may be 300um or other values.

As shown in fig. 5 and 6, in some embodiments of the present application, the fingerprint detection device 200 may further include a second sensor chip 280, a second fixing adhesive 281, and a second gold wire 282.

The upper surface of the substrate 210 extends downward in a third area connected to the second area and penetrates through the first cover layer 212 and the first conductive layer 211 to form a second groove, the second sensor chip 280 is fixed in the second groove by a second fixing adhesive 281, and the second sensor chip 280 is connected to a bonding pad 2111 of the substrate 210 by the second gold wire 282, so that the second sensor chip 280 is connected to the first sensor chip 230, and the second sensor chip 280 is used for matching with the first sensor chip 230 to perform fingerprint identification under screen.

Through the second sensor chip 280, the processing task of the first sensor chip 230 may be shared, which is equivalent to replacing a sensor chip with a complete function and a thicker sensor chip with a first sensor chip 230 and a second sensor chip 280 with thinner thicknesses, which are arranged in parallel, and accordingly, the thickness of the fingerprint detection device 200 may be reduced without affecting the fingerprint recognition performance.

In some embodiments of the present application, a gap d7 exists between the sidewall of the second sensor chip 280 and the sidewall of the second recess. Alternatively, the width of the gap d7 between the sidewall of the second sensor chip 280 and the sidewall of the second groove may be in the range of 100-400um, for example, 200um.

Alternatively, the thickness of the second sensor chip 280 may have a value ranging from 100 um to 400um, may be equal to that of the first sensor chip 230, and may be, for example, 60um; similarly, the maximum arc height of the second gold wires 282 may be set to be less than or equal to 60um, or may be set to be the same as the arc height of the first gold wires 250, for example, may be set to be 40um each; the thickness of the second fixing glue 281 may be set to be less than or equal to 30um, or may be set to be the same as the first fixing glue 240, for example, all set to be 15um.

Of course, alternatively, the width of the gap d7 between the sidewall of the second sensor chip 280 and the sidewall of the second groove, the thickness of the second sensor chip 280, the maximum arc height of the second gold wire 282, or the thickness of the second fixing glue 281 may be other specific values or be within a preset range of values, which is not specifically limited in the embodiment of the present application.

By designing a certain gap d7 between the side wall of the second sensor chip 280 and the side wall of the second groove, the mounting of the second sensor chip 280 in the second groove is not affected even if there is a difference between the size of the manufactured product of the second sensor chip 280 and the design size of the second sensor chip 280 or even if there is a difference between the actual size of the second groove and the design size of the second groove.

In other words, the gap between the sidewall of the second sensor chip 280 and the sidewall of the second groove may be used not only as a dimensional tolerance of the second sensor chip 280 and/or a dimensional tolerance of the second groove, but also as a mounting tolerance of the second sensor chip 280, which can accordingly improve the yield of the fingerprint detection device 200.

It should be understood that the filter layer 260 is disposed above the optical path layer 220, whether the fingerprint detection device including one sensor chip as shown in fig. 3 and 4 or the fingerprint detection device including two sensor chips as shown in fig. 5 and 6 is described above.

It should be appreciated that the filter layer 260 of embodiments of the present application is used to reduce unwanted ambient light in fingerprint sensing to enhance optical sensing of the received light by the first sensor chip 230. For example, the filter layer 260 may be used to filter out specific wavelengths of light, such as near infrared light and some red light, among others. For example, a human finger absorbs a substantial portion of the energy of light having a wavelength below 580nm, based on which the filter may be designed to filter light having a wavelength from 580nm to infrared to reduce the effect of ambient light on optical detection in fingerprint sensing.

In a specific implementation, the filter layer 260 may include one or more optical filters, which may be configured as, for example, bandpass filters, to allow transmission of light emitted by the OLED screen while blocking other light components, such as infrared light, in sunlight.

Specifically, as shown in fig. 3 to 6, the filter layer 260 of the embodiment of the present application may be fixed above the holder 251. Specifically, one side of the lower surface of the filter layer 260, which is close to the first gold wire 250, may be fixed to the upper surface of the first sensor chip 230, while the other sides of the lower surface of the filter layer 260 are fixed to the upper surface of the holder 251.

For example, as shown in fig. 3, one side of the lower surface of the filter layer 260, which is close to the first gold wire, may be fixed to the upper surface of the first sensor chip 230 by a first back adhesive 262, and the other side of the lower surface of the filter layer 260 may be fixed to the upper surface of the holder 251 by a second back adhesive 263. The thicknesses of the first and second adhesive tapes may be set according to practical applications, so as to ensure that the optical filter layer 260 is parallel to the optical path layer 220, or that the optical filter layer 260 is parallel to a plane where the sensing region on the upper surface of the first sensor chip 230 is located. For example, the thickness of the first back adhesive 262 may be set to be less than or equal to 60, for example, 48um, and the thickness of the second back adhesive may be set to be less than or equal to 60, for example, 20um, depending on the size of the other portions.

Specifically, assuming that the lower surface of the filter layer 260 is rectangular, one side of the lower surface of the filter layer 260 is close to the first gold wire 250, the other three sides are not close to the first gold wire 250, the three-side region not close to the gold wire may be fixed on the upper surface of the holder 251, and one side close to the first gold wire 250 is fixed on the upper surface of the first sensor chip 230, so that it is possible to avoid affecting the mounting of the first gold wire 250; meanwhile, one side of the lower surface of the filter layer 260, which is close to the first gold wire 250, is fixed on the upper surface of the first sensor chip 230 by a first back adhesive 262, and the first back adhesive 262 may also prevent a gold wire protective adhesive for fixing the gold wire from flowing into the optical path layer.

The thickness of the filter layer 260 may be set according to practical applications, for example, the thickness of the filter layer 260 may be set to be less than or equal to 220um; for example, the thickness of the filter layer is typically 110um, considering existing processes and mass productivity.

Alternatively, the supporting ink 261 may be located at an arbitrary position in the lower surface of the filter layer 260 corresponding to the position of the sensing region of the first sensor chip 230. For example, since the center position is more uniform for the supporting force of the entire filter layer 260, the position of the silk-screened supporting ink 261 is generally set to coincide with the center of the sensing region of the underlying first sensor chip 230, that is, the center of the supporting ink 261 is set to coincide with the center of the sensing region of the first sensor chip 230 in the vertical direction.

It should be understood that the supporting ink 261 is located between the filter layer 260 and the optical path layer 220 for supporting the filter layer 200 such that a gap is maintained between the filter layer 260 and the optical path layer 220, and at the same time, a gap may be maintained between the lower surface of the supporting ink 261 and the upper surface of the optical path layer 220. As the thickness of the supporting ink 261 increases, that is, the distance between the upper surface of the light path layer 220 and the lower surface of the filter layer 260 increases, the newton's contrast gradually decreases. Fig. 7 shows several newton ring effect graphs, and h represents the distance between the filter layer and the upper surface of the optical path layer above the sensor chip, and in this embodiment, newton rings substantially disappear when the distance is 25um based on the above-mentioned setting of the dimensions, so the thickness of the supporting ink is typically set to be less than or equal to 30um, and may be set to 25um, for example, the distance between the filter layer 260 and the upper surface of the optical path layer 220 below is 25um, so as to avoid newton rings. It is understood that the distance h is not limited to 25um, and can be adjusted according to practical situations.

Alternatively, the area of the supporting ink may be set according to practical applications, and on the premise of not affecting fingerprint identification, the larger the size of the supporting ink 261 for silk screen printing, the better the supporting effect on the filter layer 260, that is, the less deformable the filter layer, that is, the less prone to newton rings. However, since the supporting ink 261 blocks the returned fingerprint detection signal, the area of the supporting ink is not too large, and for example, the area of the supporting ink 261 may be set to 40um or less, for example, 30um or 30um square.

In the embodiment of the present application, the material of the filter layer 260 may be glass, crystal, resin film, or other materials. In order to ensure that the filter layer 260 can transmit the fingerprint detection signal returned by the finger to the first sensor chip 230 below, and ensure that the first sensor chip 230 can receive enough light signals, thereby ensuring that the fingerprint recognition effect is improved, the light incident surface of the filter layer 260 needs to be subjected to ultra-low reflection of light by an optical inorganic coating or an organic blackening coating, for example, the reflectivity is generally set to be <1%.

Alternatively, in the embodiment of the present application, a gap is formed between the lower surface of the supporting ink 261 and the upper surface of the optical path layer 220, and the gap size d5 may be set according to the actual application and may be adjusted according to the size of other components. For example, as shown in fig. 3 to 6, the thickness at a may include, in order from top to bottom: the thickness of the filter layer 260 (e.g., 110 um), the thickness of the supporting ink 261 (e.g., 25 um), the gap d5 (e.g., 7.3 um) between the lower surface of the supporting ink 261 and the upper surface of the optical path layer 220, the thickness of the optical path layer 220 (e.g., 15.7), the thickness of the first sensor chip 230 (e.g., 60 um), the thickness of the first die attach adhesive 230 (e.g., 15 um), the thickness of the substrate (e.g., 64 um), the thickness of the second conductive layer (e.g., 13 um), and the thickness of the second cover layer (e.g., 20 um).

It should be understood that, as shown in fig. 3 to 6, the total thickness at a is the total thickness of the fingerprint detection device 200, and the total thickness of the fingerprint detection device 200 may be set in the range of 0.15-0.6mm according to the description of the above embodiments.

The optical path layer 220 of the embodiment of the present application may include a lens layer 221 and an optical path guiding layer 222, wherein the lens layer 221 is configured to converge an optical signal returned via a human finger above the display screen to the optical path guiding layer 222, and the optical path guiding layer 222 guides the optical signal converged by the lens layer 221 to the first sensor chip 230.

Considering that the filter layer 260 of the fingerprint sensing device 200 is disposed above the light path layer 220, there may be a case where the height of the upper surface of the holder 251 is smaller than the height of the upper surface of the filter layer 260, for example, as shown in fig. 3 to 6, resulting in inconsistent height of the upper surface of the entire fingerprint sensing device, the upper surface of the fingerprint sensing device 200 may be flattened by disposing foam, thereby facilitating the installation of the fingerprint sensing device 200 under a display screen. Specifically, the fingerprint detection device may further include: a foam layer disposed above the holder 251 around the filter layer 260, the foam layer being provided with an opening penetrating the foam layer, the first sensor chip 230 receiving the fingerprint detection signal through the opening of the foam layer; the upper surface of the foam layer is flush with the upper surface of the filter layer 260, thereby flattening the upper surface of the fingerprint detection device 200.

Alternatively, the arc height of the first gold wire 250 may be designed to be embedded in the foam layer; or a foam layer may be disposed above the first gold wire 250 according to the arc height position thereof.

It should be noted that, when the fingerprint detection device 200 is mounted to an electronic apparatus, it may be connected to a motherboard of the electronic apparatus through an additional flexible circuit board. For example, as shown in fig. 8, the substrate 210 may further include a gold finger 2122 of the substrate 210, where the gold finger 2122 of the substrate 210 is used for being connected to a flexible circuit board, and accordingly, the substrate 210 is connected to a motherboard of an electronic device through the flexible circuit board.

FIG. 9 is a schematic block diagram of a fingerprint detection device 200 provided with a flexible circuit board according to an embodiment of the present application, as shown in FIG. 9, in some embodiments of the present application, the fingerprint detection device 200 may further comprise a flexible circuit board 290 and an (Anisotropic Conductive Film, ACF) 292, the flexible circuit board 290 being formed with a golden finger 291 of the flexible circuit board 290; the golden finger 291 of the flexible circuit board 290 is electrically connected to the golden finger 2122 of the substrate 210 through the anisotropic conductive film 292.

Through the anisotropic conductive film 292, the golden finger 291 of the flexible circuit board 290 can be pressed onto the golden finger 2122 of the substrate 210, which is equivalent to configuring flexible circuit boards with different specifications for the fingerprint detection device 200, so that the fingerprint detection device 200 has more versatility, and accordingly, the requirements of different users or clients can be satisfied.

As shown in fig. 9, in some embodiments of the present application, the fingerprint detection device 200 may further include a protective adhesive 293 of the anisotropic conductive adhesive film 292, wherein the protective adhesive 293 may be located at two ends of the anisotropic conductive adhesive film 292 to protect the anisotropic conductive adhesive film 292, and thus the golden fingers 291 of the flexible circuit board 290 and the golden fingers 2122 of the substrate 210. As shown in fig. 9, in some embodiments of the present application, the fingerprint detection device 200 may further comprise an image processor 296, the image processor 296 being disposed at one end of the flexible circuit board 290. For example, the image processor 296 may be a microprocessor (Micro Processing Unit, MCU) for receiving a fingerprint detection signal (e.g., a fingerprint image) transmitted from the first sensor chip 230 through the flexible circuit board 290 and simply processing the fingerprint detection signal. As shown in fig. 9, in some embodiments of the present application, the fingerprint detection device 200 may further include at least one capacitor 295 disposed at one end of the flexible circuit board 290, where the at least one capacitor 295 is used to optimize (e.g., filter) the fingerprint detection signal collected by the first sensor chip 230. Optionally, each of the first sensor chips 230 corresponds to one or more capacitors. As shown in fig. 9, in some embodiments of the present application, the fingerprint detection device 200 may further include a connector 294 disposed at one end of the flexible circuit board 290, where the connector 294 may be used to connect with an external device or other component of the electronic apparatus (e.g., a motherboard) to thereby enable communication with the external device or other component of the electronic apparatus. For example, the connector 294 may be used to connect to a processor of the electronic device such that the processor of the electronic device receives the fingerprint detection signal processed by the image processor 296 and performs fingerprint recognition based on the processed fingerprint detection signal.

It should be understood that fig. 3-9 are only examples of embodiments of the present application and should not be construed as limiting the application.

For example, in fig. 3 to 6, the lens layer 221 is used as a device for converging light signals in the optical path layer 220, and alternatively, the lens layer 221 may also use an optical collimator. The description of the optical collimator may refer to the description of the optical path design of the fingerprint detection device 130 described above.

For another example, the lens layer 221 may have a microlens array formed of a plurality of microlenses, the optical path guiding layer 222 may be a light blocking layer having a plurality of micro holes and disposed under the microlens layer 221, and the micro holes are in one-to-one correspondence with the microlenses, and one or more optical sensing units in the first sensor chip 230 correspond to one microlens in the lens layer 221. Optionally, the optical path layer 220 may further include other optical film layers, such as a dielectric layer or passivation layer.

The fingerprint detection device 200 according to an embodiment of the present application has been described above with reference to fig. 3 to 9, and an electronic apparatus having the fingerprint detection device 200 mounted thereon will be described below.

Fig. 10 is a schematic structural view of an electronic device 300 mounted with the fingerprint detection device 200 shown in fig. 4 according to an embodiment of the present application.

As shown in fig. 10, the electronic device 300 includes a display screen, a middle frame 360 located below the display screen, a battery 370 located below the middle frame 360, and a battery easy-to-draw adhesive 380 located below the battery, where the display screen sequentially includes, from top to bottom, a transparent cover plate 310, a display panel 320, a buffer (cushioned) layer 330, and a copper layer 340, and the display screen is provided with a window penetrating through the buffer layer 330 and the copper layer 340. In other words, the buffer layer 330 may be provided with a first opening 331 penetrating the buffer layer 330, and the copper layer 340 may be provided with a second opening 341 penetrating the copper layer 340. Optionally, the display screen may be an OLED organic light emitting panel made by low temperature polysilicon (Low Temperature Poly-silicon, LTPS) technology, which has an ultra-thin thickness, light weight, and low power consumption, and may be used to provide a clearer image. The center 360 may be used to carry or support various devices or components in the electronic device 300. The device or component includes, but is not limited to, a battery, a camera, an antenna, a motherboard, and the display screen.

The buffer layer 330 may also be referred to as a screen printed (SCREEN PRINT) layer or an embossed layer, which may carry graphics, which may be used as logos such as brand patterns. The buffer layer 330 may be a black sheet layer or a printed layer for shielding light. For example, the buffer layer 330 may be a layer structure formed of a foam material. Copper layer 340 may also be referred to as a heat sink layer (which serves to reduce the temperature of the display screen) or a radiation protective layer. The buffer layer 330 and the copper layer 340 may be combined as a rear panel of the display screen, or the copper layer 340 may be referred to as a rear panel of the display screen.

Wherein the specific functions and structures of the fingerprint detection device 200 may be understood with reference to the reference numerals of fig. 5 and 6.

In other words, the fingerprint detection device 200 comprises a substrate 210, an optical path layer 220, a filter layer 260, a first sensor chip 230, a first fixing glue 240, a holder 251 and a first gold wire 250. The substrate 210 includes, from top to bottom, a first cover layer 212, a first conductive layer 211, a substrate layer 213, a second conductive layer 214, and a second cover layer 215. Optionally, the optical path layer 220 includes a lens layer 221 and an optical path guiding layer 222 thereunder. Optionally, the fingerprint detection device 200 may further comprise a gold thread protective gel 252. The fingerprint detection device 200 may further comprise a foam layer 270 such that the surface of the fingerprint detection device 200 is flush. Optionally, the fingerprint detection device 200 may further comprise a second sensor chip 280, a second fixing glue 281 and a second gold wire 282.

Based on the above-described structure, a detailed description will be given herein with respect to an installation scheme of the fingerprint detection device 200. As shown in fig. 10, the foam 270 of the upper surface of the fingerprint detection device 200 is fixed to the peripheral area of the fenestration (i.e., the first fenestration 331 and the second fenestration 341) of the lower surface of the copper layer 340 by a first PSA 391 so that the first sensor chip 230 is disposed in alignment with the fenestration for receiving a fingerprint detection signal returned via a human finger above the display screen through the fenestration and guided through the optical path layer, the fingerprint detection signal being for detecting fingerprint information of the finger.

Taking the display screen as an OLED screen as an example, the display screen can be a soft screen or a hard screen. When a finger is placed over the OLED screen, the finger will reflect light from the OLED screen, which will penetrate the OLED screen until it is below the OLED screen. The light path layer below the OLED screen can be used for filtering out infrared signal components in light leakage. Since the fingerprint is a diffuse reflector, the optical signal formed by reflection or diffusion from the finger exists in all directions. The fingerprint detection device 200 collects the light signal leaked above the OLED screen and performs imaging of a fingerprint image based on the received light signal.

In addition, by using the foam on the upper surface of the substrate 210 by the first PSA, the fingerprint detection device 200 is adhered to the copper layer 340 of the display screen, so that compared with directly adhering the fingerprint detection device 200 to the display panel (i.e., the OLED layer) of the display screen, the performance of the display screen is prevented from being affected after adhering the fingerprint detection device 200 to the display screen, the difficulty level of installing the fingerprint detection device 200 can be reduced, and accordingly, the installation complexity of the fingerprint detection device 200 can be reduced and the yield of the electronic device 300 can be improved. In addition, the fingerprint detection device 200 is adhered to the copper layer 340 of the display screen, so that the display screen can be prevented from being damaged in the process of disassembling the fingerprint detection device 200, and accordingly, the disassembly complexity of the fingerprint detection device 200 can be reduced and the yield of the electronic equipment 300 can be improved. In addition, when the display screen is pressed or the electronic device falls or collides, the buffer layer 330 and the copper layer 340 are disposed between the display panel 320 and the fingerprint detection device 200, so that it is possible to prevent the display panel 320 and the fingerprint detection device 200 from being pressed to affect the performance of the display panel 320 and the fingerprint detection device 200.

In addition, compared with the case where the fingerprint detection device 200 is directly attached to the display panel 320 of the display screen, the fingerprint detection device 200 is attached to the copper layer 340 of the display screen, so that the size of the window can be prevented from being too large, and accordingly, the visibility of the user looking at the fingerprint detection device 200 from the front surface of the display screen can be reduced, and further, the appearance of the electronic device 300 can be beautified.

As shown in fig. 10, in some embodiments of the present application, UV curable adhesive 392 is provided on the outer side of the foam layer 270, on the outer side of a portion of the holder 251, and on the outer side of the first PSA 391 to fix the fingerprint detection device 200 with respect to the display screen.

The fingerprint detection device 200 can be fixed relative to the display screen through the UV curing adhesive 392, and the difficulty level of installing the fingerprint detection device 200 can be reduced by utilizing the characteristics of the UV curing adhesive 392.

It should be understood that fig. 10 is merely an example of adhering the fingerprint detection device 200 to a display screen of an electronic apparatus, and should not be construed as limiting the present application.

For example, in fig. 10, the middle frame 360 is formed with a third window below the fingerprint detection device 200. In other words, the fingerprint detection device 200 is attached to the copper layer 340 of the display screen in a hanging manner. For example, a gap exists between the fingerprint detection device 200 and the display screen. However, the above solution is only one implementation, and in another implementation, the upper surface of the middle frame extends downward to form a third groove, and the bottom of the fingerprint detection device 200 contacts the middle frame. In other words, the fingerprint detection device 200 is attached to the copper layer 340 of the display screen by hanging, but there is no gap between the fingerprint detection device 200 and the display screen. In other words, the third recess is only used to provide a receiving location for the fingerprint detection device 200, and is not used to fix the fingerprint detection device 200.

By designing the fingerprint detection device 200 in a laminated structure, each component is tightly matched in the thickness direction (i.e. each component is tightly matched in the thickness direction without reserving a gap), based on the thickness of the middle frame, even if the buffer layer 330 and the copper layer 340 in the display screen are reserved, a gap of at least about 200um is reserved between the bottom of the fingerprint detection device 200 and the battery 370, which is sufficient for arranging the fingerprint detection device 200 between the display screen and the battery 370.

Accordingly, the fingerprint detection device 200 is disposed between the display screen and the battery 370, so that the original internal structure of the electronic device 300 does not need to be adjusted, and the utilization rate of the internal space of the electronic device 300 can be improved. For example, the volume of the battery 370 may be increased and the saved space used to accommodate the increased volume of the battery 370, and accordingly, the lifetime and user experience of the electronic device 300 may be increased without increasing the volume of the electronic device 300.

The scheme of mounting the fingerprint detection module 200 on the copper layer 340 of the display screen is described above with reference to fig. 10, but the embodiment of the application is not limited thereto. For example, in other alternative embodiments, the fingerprint detection device 200 may also be configured to be mounted and secured to the bezel 380.

Fig. 11 is another schematic structural view of an electronic device 300 mounted with the fingerprint detection device 200 shown in fig. 5 and 6 according to an embodiment of the present application. The specific functions and structures of the fingerprint detection device 200 may be understood with reference to fig. 5 and 6, and the functions and structures of the various components in the electronic device 300 may be understood with reference to fig. 10, and for avoiding repetition, a detailed description thereof will be omitted herein.

As shown in fig. 11, the upper surface of the middle frame 380 extends downward to form a third recess, and the bottom of the fingerprint detection device 200 is disposed in the third recess through the second PSA 393. In other words, the third recess is only used for providing a receiving position for the fingerprint detection device 200, and also for fixing the fingerprint detection device 200.

As shown in fig. 11, in some embodiments of the present application, a gap exists between the fingerprint detection device 200 and the sidewall of the third groove, and the gap formed between the fingerprint detection device and the sidewall of the third groove may be used as a dimensional tolerance or an installation tolerance of the fingerprint detection device 200, and may also be used as a dimensional tolerance of the third groove.

As shown in fig. 11, in some embodiments of the present application, the buffer layer 330 may be provided with a first opening 331 penetrating the buffer layer 330, and the copper layer 340 may be provided with a second opening 341 penetrating the copper layer 340, wherein a size of the first opening 331 is smaller than a size of the second opening 341, such that the buffer layer 220 and the fingerprint detection device 200 form a buffer space. Alternatively, as shown in FIG. 11, the buffer space may be provided with a buffer material 396, the buffer material 396 including, but not limited to, foam. In other words, the upper surface of the fingerprint detection device 200 is abutted to the buffer layer 330 by the buffer material 396, for example, the foam 270 on the upper surface of the fingerprint detection device 200 is abutted to the buffer layer 330 by the buffer material 396, and the buffer material 396 can be used to not only prevent the detection performance of the fingerprint detection device 200 from being affected by the contact of the fingerprint detection device 200 with the display screen, but also seal dust-proof to ensure the detection performance of the fingerprint detection device 200 and improve the service life of the fingerprint detection device 200. In addition, the buffer material 396 may reduce the visibility of the fingerprint sensing device 200 when viewed from the front of the display screen, thereby improving the appearance of the electronic apparatus 300. In addition, by arranging the buffer material 396 in the buffer space, the internal space of the electronic device 300 can be reasonably utilized, so that the thickness of the electronic device is reduced, and the user experience is improved.

It should be understood that fig. 10 and 11 are only examples of the present application and should not be construed as limiting the present application.

For example, in other alternative embodiments, the fingerprint detection device may also be attached to the display screen and the center frame simultaneously. For another example, to maximize the use of the internal space of the electronic device, the fingerprint sensing device 300 may be attached to the side of the recess of the middle frame 380.

It should be understood that the specific examples of the embodiments of the present application are intended to facilitate a better understanding of the embodiments of the present application by those skilled in the art, and are not intended to limit the scope of the embodiments of the present application.

It is to be understood that the terminology used in the embodiments of the application and in the appended claims is for the purpose of describing particular embodiments only, and is not intended to be limiting of the embodiments of the application. For example, as used in embodiments of the application and in the appended claims, the singular forms "a," "an," and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise.

Those of ordinary skill in the art will appreciate that the elements of the examples described in connection with the embodiments disclosed herein may be implemented as electronic hardware, computer software, or combinations of both, and that the elements of the examples and steps are generally described as functional in the foregoing description to clearly illustrate the interchangeability of hardware and software. Whether such functionality is implemented as hardware or software depends upon the particular application and design constraints imposed on the solution. Skilled artisans may implement the described functionality in varying ways for each particular application, but such implementation decisions should not be interpreted as causing a departure from the scope of the present application.

In the several embodiments provided in the present application, it should be understood that the disclosed system and apparatus may be implemented in other manners. For example, the apparatus embodiments described above are merely illustrative, e.g., the division of elements is merely a logical functional division, and there may be additional divisions when actually implemented, e.g., multiple elements or components may be combined or integrated into another system, or some features may be omitted or not performed. In addition, the coupling or direct coupling or communication connection shown or discussed with each other may be an indirect coupling or communication connection via some interfaces, devices, or elements, or may be an electrical, mechanical, or other form of connection.

The functional elements referred to above may be integrated or may be physically separate. The functional elements may be implemented in hardware or in software functional units. If implemented as a software functional unit and sold or used as a stand-alone product, may be stored on a computer readable storage medium. Based on such understanding, the technical solution of the present application is essentially or a part contributing to the prior art, or all or part of the technical solution may be embodied in the form of a software product stored in a storage medium, comprising several instructions for causing a computer device (which may be a personal computer, a server, or a network device, etc.) to perform all or part of the steps of the method according to the embodiments of the present application. And the aforementioned storage medium includes: a usb disk, a removable hard disk, a Read-Only Memory (ROM), a random access Memory (RAM, random Access Memory), a magnetic disk, or an optical disk, or other various media capable of storing program codes.

While the application has been described with reference to certain preferred embodiments, it will be understood by those skilled in the art that various changes and substitutions of equivalents may be made and equivalents will be apparent to those skilled in the art without departing from the scope of the application. Therefore, the protection scope of the application is subject to the protection scope of the claims.

Claims

1. A fingerprint detection device, characterized in that is applicable to the electronic equipment that has the display screen, fingerprint detection device sets up the below of display screen includes:

The lower surface of the filter layer is provided with silk-screen supporting ink;

The light path layer is arranged below the light filtering layer, a gap is formed between the upper surface of the light path layer and the lower surface of the supporting ink, and the supporting ink is used for supporting the light filtering layer, so that a gap is kept between the upper surface of the light path layer and the lower surface of the light filtering layer;

The first sensor chip is arranged below the light path layer, the light path layer is arranged on the upper surface of the first sensor chip, and the center of the supporting ink is overlapped with the center of the sensing area of the first sensor chip in the vertical direction;

A substrate, wherein a first groove is formed on the upper surface of the substrate in a downward extending manner, and at least one part of the first sensor chip is arranged in the first groove and is electrically connected to the substrate;

The bracket is arranged above the substrate around the first sensor chip and is used for supporting the filter layer;

The first sensor chip is used for receiving fingerprint detection signals which pass through the filter layer and the light path layer after returning through a human finger above the display screen, and the fingerprint detection signals are used for detecting fingerprint information of the finger;

The fingerprint detection device further comprises: a first gold wire for electrically connecting the first sensor chip and the conductive layer of the substrate, located between the side wall of the first sensor chip and the side wall of the first groove, and in the gap between the side wall of the bracket, which is close to the first sensor chip, and the side wall of the first sensor chip, one side of the lower surface of the optical filter layer, which is close to the first gold wire, is fixed on the upper surface of the first sensor chip, and the other sides of the lower surface of the optical filter layer are fixed on the upper surface of the bracket;

The substrate comprises a first covering layer, a first conductive layer, a substrate layer, a second conductive layer and a second covering layer from top to bottom in sequence, wherein the upper surface of the substrate extends downwards in a first area and penetrates through the first covering layer and the first conductive layer to form the first groove, and the upper surface of the substrate extends downwards in a second area connected with the first area and penetrates through the first covering layer to form a bonding pad of the substrate; the first sensor chip is connected to a pad of the substrate through the first gold wire.

2. The fingerprint detection device according to claim 1 wherein gaps exist between the sidewalls of the first sensor chip and the sidewalls of the first recess, and between the sidewalls of the holder adjacent to the first sensor chip and the sidewalls of the first sensor chip,

The width of the gap between the side wall of the bracket, which is close to the first sensor chip, and the side wall of the first sensor chip is larger than or equal to the width of the gap between the side wall of the first sensor chip and the side wall of the first groove.

3. The fingerprint sensing device according to claim 1, wherein one side of the lower surface of the filter layer adjacent to the first gold wire is fixed to the upper surface of the first sensor chip by a first back adhesive, and the other side of the lower surface of the filter layer is fixed to the upper surface of the bracket by a second back adhesive.

4. A fingerprint detection device according to any one of claims 1 to 3 wherein the width of the gap between the side wall of the first sensor not adjacent to the first gold wire and the side wall of the first recess is in the range of 100-400um, and the gap between the side wall of the first sensor not adjacent to the first gold wire and the side wall support of the support adjacent to the first sensor chip is in the range of 100-400um.

5. A fingerprint sensing device according to any one of claims 1-3, wherein the thickness of said filter layer is less than or equal to 220um.

6. A fingerprint sensing device according to any one of claims 1-3, wherein the thickness of the supporting ink is less than or equal to 30um.

7. A fingerprint sensing device according to any one of claims 1 to 3, wherein the support ink has an area of less than or equal to 40 x 40um.

8. A fingerprint sensing device according to any one of claims 1-3, wherein the light entrance face of said filter layer has a reflectivity of less than or equal to 1% for light.

9. A fingerprint sensing device according to any one of claims 1 to 3, wherein the total thickness of the fingerprint sensing device has a value in the range of 0.15-0.6mm.

10. A fingerprint detection device according to any one of claims 1 to 3 further comprising:

the lower surface of the first sensor chip is fixed into the first groove through the first fixing glue.

11. A fingerprint sensing device according to any one of claims 1-3, wherein the thickness of said first cover layer is equal to the thickness of said second cover layer, and wherein the thickness of said first conductive layer is the same as the thickness of said second conductive layer.

12. The fingerprint sensing device according to claim 11, wherein said substrate has a total thickness of less than or equal to 150um, wherein said first cover layer and said second cover layer each have a thickness of less than or equal to 30um,

The thickness of the first conductive layer and the thickness of the second conductive layer are smaller than or equal to 20um, and the thickness of the base material is smaller than or equal to 80um.

13. The fingerprint detection device according to claim 10 wherein said first sensor chip has a thickness of less than or equal to 150um, said first gold wire has a maximum arc height of less than or equal to 60um, and said first fixing glue has a thickness of less than or equal to 30um.

14. A fingerprint detection device according to any one of claims 1 to 3 wherein the outer side of said support is shortened by a predetermined distance relative to the outer side of said first cover layer in a direction towards said first sensor chip.

15. The fingerprint detection device according to claim 14 wherein said predetermined distance has a value in the range of 100-400um.

16. A fingerprint detection device according to any one of claims 1 to 3 further comprising: the second sensor chip, the second fixing adhesive and the second gold wire;

wherein the upper surface of the substrate extends downwards in a third area connected with the second area and penetrates through the first covering layer and the first conductive layer to form a second groove,

The second sensor chip is fixed in the second groove through the second fixing glue, and is connected to the bonding pad of the substrate through the second gold wire, so that the second sensor chip is connected to the first sensor chip, and the second sensor chip is used for being matched with the first sensor chip to carry out fingerprint identification under the screen.

17. The fingerprint detection device according to claim 16, wherein a gap exists between a sidewall of said second sensor chip and a sidewall of said second recess.

18. The fingerprint detection device according to claim 17, wherein a width of a gap between a side wall of said second sensor chip not adjacent to said first gold wire and a side wall of said second recess is 100-400um.

19. The fingerprint sensing device according to claim 16, wherein a lower surface of said first sensor chip is secured within said first recess by a first securing glue, a thickness of said first sensor chip being equal to a thickness of said second sensor chip, a thickness of said first securing glue being equal to a thickness of said second securing glue, a maximum arc height of said first gold wire being equal to a maximum arc height of said second gold wire.

20. The fingerprint detection device according to claim 16, further comprising:

And the gold thread protection glue is used for packaging the first gold thread and the second gold thread.

21. The fingerprint detection device according to claim 20 wherein said gold thread protective gel has a height of less than or equal to 200um.

22. A fingerprint detection device according to any one of claims 1 to 3 further comprising:

The foam layer is arranged above the bracket around the optical filter layer, an opening penetrating through the foam layer is formed in the foam layer, and the first sensor chip receives the fingerprint detection signal through the opening of the foam layer;

the upper surface of the foam layer is flush with the upper surface of the filter layer.

23. The fingerprint detection device according to claim 22 wherein said support is a polyethylene terephthalate PET glue layer for connecting said substrate and said foam layer; or (b)

The lower surface of the support is fixed on the upper surface of the substrate through support fixing glue, and the upper surface of the support is fixed on the foam layer through support fixing glue.

24. The fingerprint detection device according to claim 22, wherein the thickness of the support is less than or equal to 150um.

25. The fingerprint detection device according to claim 22, wherein the display screen comprises a transparent cover plate, a display panel, a buffer layer and a copper layer in that order from top to bottom, the display screen being provided with a window penetrating the buffer layer and the copper layer;

The upper surface of the foam is fixed on the periphery area of the window on the lower surface of the copper layer through a first pressure-sensitive adhesive, so that the fingerprint detection device is fixed below the display screen,

The sensing area of the first sensor chip is aligned with the windowed arrangement such that the first sensor chip receives the fingerprint detection signal.

26. The fingerprint sensing device according to claim 25, wherein an outer side of said fingerprint sensing device and an outer side of said first pressure sensitive adhesive are provided with an ultraviolet curable adhesive to fix a relative position of said fingerprint sensing device with respect to said display screen.

27. The fingerprint detection device according to claim 22, wherein the display screen comprises, from top to bottom, a transparent cover plate, a display panel, a buffer layer and a copper layer, the display screen is provided with a window penetrating the buffer layer and the copper layer, and the size of the window of the buffer layer is smaller than the size of the window of the copper layer;

the fingerprint detection device is positioned in a groove of a middle frame of the electronic equipment,

The upper surface of the foam is fixed on the periphery area of the window of the lower surface of the buffer layer in the window opening range of the copper layer through foam rubber, so that the fingerprint detection device is fixed below the display screen,

The sensing area of the first sensor chip is aligned with the windowing of the buffer layer, so that the first sensor chip receives the fingerprint detection signal.

28. The fingerprint sensing device according to claim 27, wherein the bottom of said fingerprint sensing device is disposed in a recess of said center frame by a second pressure sensitive adhesive.

29. A fingerprint detection device according to any one of claims 1 to 3 wherein said optical path layer comprises a lens layer and an optical path guiding layer,

The lens layer is used for converging the optical signals returned by the fingers of the human body above the display screen to the optical path guiding layer, and the optical path guiding layer guides the optical signals converged by the lens layer to the first sensor chip.

30. The fingerprint detection device according to claim 29 wherein the optical path layer has a thickness of less than or equal to 30um.

31. A fingerprint detection device according to any one of claims 1 to 3 further comprising:

the flexible circuit board is provided with a golden finger of the flexible circuit board;

And the golden finger of the flexible circuit board is electrically connected to the golden finger of the substrate through the anisotropic conductive adhesive film.

32. An electronic device, comprising:

a display screen;

Fingerprint detection device arranged below said display screen, said fingerprint detection device being a fingerprint detection device according to any of claims 1 to 31 and having a fingerprint acquisition area at least partly within a display area of said display screen.

33. The electronic device of claim 32, wherein the display screen comprises a transparent cover plate, a display panel, a buffer layer and a copper layer from top to bottom in sequence, wherein the display screen is provided with a window penetrating through the buffer layer and the copper layer, and an optical path layer of the fingerprint detection device is aligned with the window so that the fingerprint detection device receives a fingerprint detection signal returned from a human finger above the display screen through the window, and the fingerprint detection signal is used for detecting fingerprint information of the finger.

34. The electronic device of claim 33, wherein an edge region of the upper surface of the fingerprint detection device secures a surrounding region of the fenestration of the lower surface of the copper layer by a first pressure sensitive adhesive such that an optical path layer of the fingerprint detection device is aligned with the fenestration.

35. The electronic device of claim 33, further comprising a middle frame, wherein a third groove is formed on the upper surface of the middle frame in a downward extending manner, and the bottom of the fingerprint detection device is disposed in the third groove through a second pressure-sensitive adhesive.