CN213423972U - Fingerprint identification device and electronic equipment - Google Patents

Fingerprint identification device and electronic equipment Download PDF

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Publication number
CN213423972U
CN213423972U CN202022094227.0U CN202022094227U CN213423972U CN 213423972 U CN213423972 U CN 213423972U CN 202022094227 U CN202022094227 U CN 202022094227U CN 213423972 U CN213423972 U CN 213423972U
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China
Prior art keywords
circuit board
fingerprint
fingerprint sensor
processing unit
window
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CN202022094227.0U
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Chinese (zh)
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王仁峰
黄新利
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Shenzhen Goodix Technology Co Ltd
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Shenzhen Goodix Technology Co Ltd
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Priority to CN202022094227.0U priority Critical patent/CN213423972U/en
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Abstract

The utility model provides a fingerprint identification device and electronic equipment, fingerprint identification device has ultra-thin thickness and has good fingerprint identification performance, can be applicable to the electronic equipment in space under the ultra-thin screen. The fingerprint identification device includes: a fingerprint sensor; the optical assembly is arranged above the fingerprint sensor and used for guiding the fingerprint optical signal to enter the fingerprint sensor; the processing unit is arranged on one side of the fingerprint sensor; a circuit board provided with at least one circuit board window, at least one of the fingerprint sensor and the processing unit being disposed in the circuit board window; the stiffening plate sets up in the circuit board below for the supporting circuit board, and the marginal kickup of stiffening plate forms the structure of falling the step, and the upper surface downwardly extending of electronic equipment's center forms the holding region, and the structure of falling the step of stiffening plate is used for installing the edge in the holding region, so that fingerprint sensor, processing unit and circuit board pass through the stiffening plate and install in the holding region of center.

Description

Fingerprint identification device and electronic equipment
Technical Field
The present application relates to the field of optical fingerprint technology, and more particularly, to a fingerprint identification device and an electronic apparatus.
Background
With the development of biometric identification technology, fingerprint identification technology is widely applied to the fields of mobile terminal design, automotive electronics, smart home and the like. Consumers demand the product size to be as thin as possible while increasing the functional demand of various electronic terminal products, so the internal structure of electronic products is increasingly compact, the design difficulty of the fingerprint identification device is increased, the miniaturization and the ultra-thin thickness of the fingerprint identification device are more urgent, and the fingerprint identification device is required to realize more accurate functions under the condition of occupying smaller volume space of the electronic products.
SUMMERY OF THE UTILITY MODEL
The embodiment of the application provides a fingerprint identification device and electronic equipment, and the fingerprint identification device has ultra-thin thickness and good fingerprint identification performance, and can be suitable for electronic equipment in space under an ultra-thin screen.
In a first aspect, a fingerprint identification device is provided for a center disposed below a display screen of an electronic device, the fingerprint identification device including: a fingerprint sensor; the optical assembly is arranged above the fingerprint sensor and used for guiding a fingerprint optical signal which passes through the display screen to enter the fingerprint sensor after being reflected or scattered by a finger above the display screen; the processing unit is arranged on one side of the fingerprint sensor and used for processing a fingerprint image signal acquired by the fingerprint sensor, and the processed fingerprint image signal is used for fingerprint identification; the fingerprint sensor comprises a circuit board, a fingerprint sensor and a processing unit, wherein at least one circuit board window is arranged in the circuit board, at least one of the fingerprint sensor and the processing unit is arranged in the at least one circuit board window, and the circuit board is used for transmitting signals of the fingerprint sensor and the processing unit; the reinforcing plate is arranged below the circuit board and used for supporting the circuit board, the edge of the reinforcing plate bends upwards to form a reversed step structure, the upper surface of the middle frame of the electronic equipment extends downwards to form a containing area, and the reversed step structure of the reinforcing plate is used for being installed on the edge of the containing area, so that the fingerprint sensor, the processing unit and the circuit board are installed in the containing area of the middle frame through the reinforcing plate.
Adopt the technical scheme of this application embodiment, through windowing the circuit board, set up processing unit and fingerprint sensor in the circuit board windowing of circuit board, and carry out signal transmission through the circuit board, when reducing fingerprint identification device's thickness, can reduce the signal transmission distance between processing unit and the fingerprint sensor, improve the signal quality between the two, improve the fingerprint identification effect. Further, processing unit and fingerprint sensor together, set up in the center through the stiffening plate, and lie in the display screen below, need not set up the stiffening plate alone to this processing unit, also need not encapsulate this processing unit, consequently, the thickness space that processing unit occupy is less to can reduce whole fingerprint identification device's thickness. In addition, cooperate this application embodiment, the less optical assembly of thickness to with the stiffening plate design of circuit board below for the dysmorphism stiffening plate, its marginal area is formed with the structure of falling the step, through this structure of falling the step with fingerprint identification device sets up in the holding area of center, the thickness space that whole fingerprint identification device that can be further occupy below the screen, make fingerprint identification device can be more convenient and nimble install in electronic equipment.
In a possible implementation manner, a step structure is formed on the upper surface of the middle frame at the edge of the accommodating area, and the inverted step structure of the reinforcing plate is in lap joint with the upper surface of the step structure.
In a possible embodiment, the inverted step structure of the reinforcing plate is overlapped and attached to the edge of the accommodating area.
In one possible embodiment, a local area of the edge of the reinforcing plate is warped upwards to form the inverted step structure.
In a possible embodiment, the reinforcing plate is a quadrilateral, the edge regions of two opposite sides of the reinforcing plate are warped upwards to form the inverted step structure, and the edge regions of the other two sides of the reinforcing plate and the central region of the reinforcing plate are in the same horizontal plane.
In a possible embodiment, the central region of the reinforcing plate is located in the accommodating region of the middle frame, and the upper surface of the inverted step structure of the reinforcing plate is not higher than the upper surfaces of other regions of the middle frame except the accommodating region.
In a possible embodiment, the lower surface of the central area of the reinforcing plate is not lower than the lower surfaces of the other areas of the middle frame except the accommodating area.
In one possible embodiment, the receiving area is a through hole.
In a possible implementation manner, the at least one circuit board window is a first circuit board window and a second circuit board window, the fingerprint sensor is disposed in the first circuit board window, and the processing unit is disposed in the second circuit board window.
In one possible embodiment, each side of the first circuit board open window is parallel or perpendicular to each side of the fingerprint sensor; and/or each side of the second circuit board open window is parallel or vertical to each side of the processing unit.
In a possible implementation mode, the circuit board is provided with a first bonding pad connected with the fingerprint sensor on a first edge of the first circuit board windowing; the circuit board is provided with a second bonding pad connected with the processing unit on the first edge of the second circuit board windowing; the thickness of the circuit board in the area where the first edge of the first circuit board windowing is located, and/or the thickness of the circuit board in the area where the first edge of the second circuit board windowing is located is smaller than the thickness of the circuit board in other areas.
In one possible embodiment, the first edge of the first circuit board opening window is adjacent to the first edge of the second circuit board opening window.
In a possible embodiment, the at least one circuit board window is a first circuit board window, the fingerprint sensor is disposed in the first circuit board window, and the processing unit is disposed above the circuit board.
In one possible embodiment, each side of the first circuit board opening window is parallel or perpendicular to each side of the fingerprint sensor.
In a possible implementation mode, the circuit board is provided with a first bonding pad connected with the fingerprint sensor on a first edge of the first circuit board windowing; the thickness of the circuit board in the area where the first edge of the first circuit board windowing is located is smaller than the thickness of the circuit board in other areas.
In a possible embodiment, the circuit board is adjacent to the processing unit at the first edge of the first circuit board opening window, and the circuit board is further provided with a second pad connected with the processing unit at the first edge of the first circuit board opening window.
In a possible embodiment, the at least one circuit board window is a second circuit board window, the processing unit is disposed in the second circuit board window, and the fingerprint sensor is disposed above the circuit board.
In one possible embodiment, each side of the second circuit board opening window is parallel or perpendicular to each side of the processing unit.
In a possible implementation manner, the circuit board is provided with a second pad connected with the processing unit at the first edge of the second circuit board windowing window, and the thickness of the circuit board in the area where the first edge of the second circuit board windowing window is located is smaller than the thickness of the circuit board in other areas.
In a possible implementation manner, the circuit board is adjacent to the fingerprint sensor on the first edge of the second circuit board windowing, and the circuit board is further provided with a first bonding pad connected with the fingerprint sensor on the first edge of the second circuit board windowing.
In a possible implementation, the fingerprint identification device further includes: and the shading layer is formed with a first window, the first window is arranged above the fingerprint sensor, and the first window is used for receiving the fingerprint sensor through the fingerprint optical signal.
In one possible embodiment, the optical component is located in the first window.
In a possible embodiment, a second window is further formed in the light shielding layer, and both the top area of the first lead of the fingerprint sensor connected to the circuit board and the top area of the second lead of the processing unit connected to the circuit board are located in the second window.
In a possible embodiment, the first lead is provided at a first side of the fingerprint sensor, the second lead is provided at a first side of the processing unit, and the first side of the fingerprint sensor is adjacent to the first side of the processing unit.
In a possible embodiment, the first side of the fingerprint sensor and the first side of the processing unit are parallel to each other.
In one possible embodiment, the first lead and/or the second lead are coated with a lead protection paste, and the height of the lead protection paste is not more than 150 μm.
In a possible embodiment, the upper surface of the light shielding layer is not higher than the highest point of the upper surface of the lead protection paste, and/or the upper surface of the light shielding layer is not higher than the highest point of the upper surface of the optical component.
In a possible implementation, the fingerprint identification device further includes: the supporting layer is arranged between the circuit board and the shading layer and used for supporting the shading layer; a third opening window is arranged in the supporting layer, and the fingerprint sensor and the processing unit are arranged in the third opening window.
In a possible embodiment, the upper surface of the supporting layer is not higher than the highest point of the upper surface of the optical element, and the upper surface of the supporting layer is not higher than the upper surface of the processing unit.
In a possible implementation, the fingerprint identification device further includes: the cotton layer of bubble, wherein be formed with the fourth windowing, this fourth windowing sets up in this fingerprint sensor top, and this fourth windowing is used for passing through this fingerprint optical signal in order to be received by this fingerprint sensor, and the area of this fourth windowing is not less than the area of this first windowing in this light shield layer.
In one possible embodiment, the fourth window is located directly above the optical assembly.
In one possible embodiment, the optical assembly comprises: a microlens array; at least one diaphragm layer arranged below the micro lens array, wherein a plurality of light-passing small holes are formed in each diaphragm layer in the at least one diaphragm layer; the micro lens array is used for converging the fingerprint optical signal into a plurality of light-passing small holes of the at least one diaphragm layer, and the fingerprint optical signal is transmitted to the fingerprint sensor through the plurality of light-passing small holes to perform optical fingerprint imaging.
In one possible embodiment, each microlens in the microlens array corresponds to at least one light-passing aperture in each layer of the diaphragm layer, and at least one pixel unit in the fingerprint sensor; the fingerprint sensor is used for receiving fingerprint light signals of at least one direction to acquire fingerprint image signals of at least one fingerprint image.
In one possible embodiment, the fingerprint recognition device comprises: the fingerprint sensors are arranged above the circuit board side by side so as to be spliced to form a fingerprint sensor assembly; and/or a plurality of the processing units are arranged above the circuit board side by side so as to form a processing unit assembly in a splicing manner.
In a possible embodiment, the distance between the fingerprint recognition device and the luminescent layer of the display screen is less than 600 μm.
In a second aspect, an electronic device is provided, comprising: a display screen; a fingerprint identification device as in the first aspect or any possible implementation form of the first aspect; the upper surface downwardly extending of this center forms the holding region, and this holding region is located this display screen below, and this fingerprint identification device installs in this holding region to make this fingerprint identification device set up in this display screen below.
In a possible embodiment, the accommodating area of the middle frame is disposed in a middle area or a lower middle area of the middle frame, so that the fingerprint detection area of the fingerprint identification device is located in a middle position or a lower middle position of the display area of the display screen.
Drawings
Fig. 1 is a schematic cross-sectional view of a fingerprint identification device according to an embodiment of the present application.
Fig. 2 is a schematic top view of the fingerprint recognition device of fig. 1.
Fig. 3 is a schematic cross-sectional view of another fingerprint identification device provided in an embodiment of the present application.
Fig. 4 is a schematic cross-sectional view of another fingerprint identification device provided in the embodiments of the present application.
Fig. 5 is a schematic top view of a reinforcing plate according to an embodiment of the present disclosure.
Fig. 6 is a schematic top view of a reinforcing plate according to an embodiment of the present disclosure.
Fig. 7 is a schematic top view of the fingerprint recognition device of fig. 3 and 4.
Fig. 8 is a schematic cross-sectional view of another fingerprint identification device provided in the embodiments of the present application.
Fig. 9 is a schematic cross-sectional view of another fingerprint identification device provided in the embodiments of the present application.
Fig. 10 is a schematic cross-sectional view of another fingerprint identification device provided in the embodiments of the present application.
Fig. 11 is a schematic cross-sectional view of another fingerprint identification device provided in an embodiment of the present application.
Fig. 12 is a schematic cross-sectional view of another fingerprint identification device provided in the embodiments of the present application.
Fig. 13 is a schematic top view of the fingerprint recognition device of fig. 10.
Fig. 14 is another schematic top view of the fingerprint recognition device of fig. 10.
Fig. 15 is another schematic top view of the fingerprint recognition device of fig. 10.
Detailed Description
The technical solutions in the embodiments of the present application will be described below with reference to the accompanying drawings.
It should be understood that the embodiments of the present application can be applied to optical fingerprint systems, including but not limited to optical fingerprint identification systems and products based on optical fingerprint imaging, and the embodiments of the present application are only described by way of example, but not limited to any limitation, and the embodiments of the present application are also applicable to other systems using optical imaging technology, etc.
As a common application scenario, the optical fingerprint system provided by the embodiment of the application can be applied to smart phones, tablet computers and other mobile terminals or other electronic devices with display screens; more specifically, in the above electronic device, the fingerprint recognition device may be embodied as an optical fingerprint device, which may be disposed in a partial area or an entire area below the display screen, thereby forming an Under-screen (Under-display) optical fingerprint system.
Fig. 1 shows a schematic cross-sectional view of a fingerprint recognition device 100.
As shown in fig. 1, the fingerprint identification device 100 is disposed on a middle frame 101 of an electronic device where the fingerprint identification device 100 is located, a blind hole 102 is disposed in the middle frame 101, and the fingerprint identification device 100 is disposed in the blind hole 102 and located below a display screen 103 of the electronic device.
In the present application, the middle frame 101 is a frame of the electronic device disposed between the display screen 103 and the battery for carrying various internal components, including but not limited to a main board, a camera, a cable, various sensors, a microphone, an earphone, and so on.
Optionally, the middle frame 103 may be made of a metal or alloy material, or may also be made of a plastic material, which is not limited in this embodiment.
Specifically, the fingerprint recognition device 100 may include: an optical assembly 110, a fingerprint sensor 120, and a circuit board 130.
The optical assembly 110 is used to guide the fingerprint light signal that passes through the display screen after being reflected or scattered by the finger above the display screen to enter the fingerprint sensor 120, so as to form a fingerprint image of the finger. In some embodiments, the Light source signal emitted to the finger above the display screen 103 may be derived from a self-Light source of the display screen 103, for example, a Light source of a display unit in an Organic Light-Emitting Diode (OLED) display screen or a Micro-LED (Micro-LED) display screen. In other embodiments, the light source signal emitted to the finger above the display screen may also be other internal or external light sources, such as an infrared light source or a light source of invisible light with a specific wavelength, and the like, in which case the display screen may be a liquid crystal display screen or other passive light emitting display screen.
By way of example, the optical assembly 110 may include: a microlens array 111 shown in fig. 1, and a stop layer 112 disposed below the microlens array 111. The microlens array 111 includes a plurality of microlenses, each microlens is used for converging an optical signal above the microlens and transmitting the converged optical signal to a diaphragm layer below the microlens. The diaphragm layer 112 is made of a light absorbing material, and a plurality of light passing small holes are formed in the diaphragm layer, and are used for selecting the direction of the light signal converged by the microlens, so that the light signal in the target direction enters the fingerprint sensor 120 through the light passing small holes, and the stray light signal in the non-target direction is absorbed by the light absorbing material in the region where the non-passing small holes are located, thereby preventing the stray light signal from interfering with fingerprint imaging.
The fingerprint sensor 120 includes a pixel array formed by a plurality of pixel units for converting the light signal passing through the aperture layer 112 into a corresponding image signal. Specifically, the fingerprint sensor 120 may be a fingerprint sensor chip manufactured by a semiconductor process, and the optical component 110 may be integrally packaged in the fingerprint sensor chip or may be independently disposed above the fingerprint sensor chip.
Further, the fingerprint sensor 120 is connected to the circuit board 130 through an electrical connector 131, so as to realize an electrical connection between the fingerprint sensor 120 and the circuit board 130, wherein the electrical connector 131 includes, but is not limited to, a Wire Bonding (WB) prepared lead wire.
In addition, the circuit board 130 includes, but is not limited to, a Printed Circuit Board (PCB), a flexible printed circuit board (FPC), a rigid-flex circuit board (FPC), and the like, which is not specifically limited in this embodiment of the application.
Fig. 2 shows a schematic top view of the fingerprint recognition apparatus 100 of fig. 1.
As shown in fig. 2, a Micro Controller Unit (MCU) 131 is disposed in the circuit board 130 for receiving and processing the fingerprint image signal of the fingerprint sensor 120 to detect and identify the fingerprint image.
Further, a connector 132 is disposed in the circuit board 130 for connecting the circuit board 130 to other electrical components of the electronic device, such as a Central Processing Unit (CPU) of the electronic device, so as to control the operation of the fingerprint identification device 100.
It is understood that, in order to implement a complete circuit function, the circuit board 130 is further provided with a capacitor, a resistor, and other related electrical components, which are not described in detail in this embodiment of the application.
In some embodiments, to facilitate the installation of the fingerprint recognition device 100 in the middle frame, the circuit board 130 is an FPC, and the MCU 131 on the FPC needs to be disposed on the reinforcing steel plate to support the MCU 131. And the MCU 131 is a packaged chip that is independently disposed at different positions of the FPC according to different design requirements. Therefore, in this embodiment, the MCU needs to additionally design a reinforcing steel plate, and the thickness of the MCU itself is large, which is not favorable for the light and thin design of the fingerprint recognition device 100, and further not favorable for the development of light and thin electronic devices. In addition, the distance between the MCU and the fingerprint sensor is long, and the transmission process of the fingerprint image signals is easily interfered, so that the quality of the fingerprint image signals is influenced, and the fingerprint identification performance is influenced.
Based on the above problem, the application provides a fingerprint identification device, can realize the design that fingerprint identification device is frivolous, and improves fingerprint identification device's wholeness ability to satisfy the installation demand of fingerprint identification device in different electronic equipment, realize electronic equipment's ultra-thin.
Hereinafter, the fingerprint recognition device according to the embodiment of the present application will be described in detail with reference to fig. 3 to 15.
It should be noted that, for the sake of understanding, the same structures are denoted by the same reference numerals in the embodiments shown below, and detailed descriptions of the same structures are omitted for the sake of brevity.
Fig. 3 is a schematic structural diagram of a fingerprint identification device 200 provided in an embodiment of the present application, where the fingerprint identification device 200 is used for a middle frame 101 disposed below a display screen 103 of an electronic device.
As shown in fig. 3, the fingerprint recognition device 200 includes: an optical assembly 210, a fingerprint sensor 220, a circuit board 230, a processing unit 240, and a reinforcing plate 250;
the optical component 210 is disposed above the fingerprint sensor 220, and is configured to guide a fingerprint light signal that is reflected or scattered by a finger above the display screen 103 and then passes through the display screen to enter the fingerprint sensor 220;
a fingerprint sensor 220 disposed below the optical assembly 210 for receiving a fingerprint optical signal guided by the optical assembly 210 to obtain a fingerprint image signal;
a processing unit 240, disposed at one side of the fingerprint sensor 220, for processing a fingerprint image signal acquired by the fingerprint sensor 220, wherein the processed fingerprint image signal is used for fingerprint identification;
a circuit board 230, in which at least one circuit board window is disposed, in which at least one of the fingerprint sensor 220 and the processing unit 240 is correspondingly disposed, the circuit board 230 being configured to transmit signals of the fingerprint sensor 220 and the processing unit 240;
a reinforcing plate 250 disposed below the circuit board 230 for supporting the circuit board 230, wherein an edge of the reinforcing plate 250 is bent upward to form a reverse step structure 2501;
the upper surface of the middle frame 101 of the electronic device extends downward to form the receiving area 104, and the inverted step structure of the reinforcing plate 250 is used to be mounted at the edge of the receiving area 104, so that the fingerprint sensor 220 and the processing unit 240 are mounted in the receiving area 104 of the middle frame 101 through the reinforcing plate 250 and the circuit board 230.
Optionally, as shown in fig. 3, the upper surface of the middle frame 101 of the electronic device extends downward to form the receiving area 104 as a through hole, and it is understood that the receiving area 104 may be a blind hole or another type of receiving area besides a through hole, and the shape of the receiving area may be square, circular, or other regular or irregular shapes, which is not specifically limited in this embodiment of the present application. Fig. 3 and the following illustration both use the accommodating area as a through hole for explanation, and the following description can be referred to when the accommodating area is in other forms, and details are not repeated here.
Specifically, as shown in fig. 3, the inverted step structure 2501 of the reinforcing plate 250 is overlapped and attached to the edge of the through hole, so that the fingerprint sensor 220 and the processing unit 240 are mounted to the middle frame 101 through the reinforcing plate 250.
In some embodiments, the lower surface of the inverted step structure 2501 of the reinforcing plate 250 is connected to the upper surface of the middle frame 101 at the edge of the through hole through a glue layer, so as to fixedly mount the reinforcing plate 250 to the middle frame 101.
In the embodiment of the present application, the fingerprint sensor 220, the processing unit 240 and the circuit board 230 are disposed in the central region of the reinforcing plate 250, rather than the edge region, and the central region of the reinforcing plate 250 is located in the through hole of the middle frame 101.
Compare in the stiffening plate and set up in the technical scheme of center upper surface, through the technical scheme of this application embodiment, the marginal zone of stiffening plate forms and falls a platform tying and construct and be used for fixed mounting, and the central zone of stiffening plate is used for supporting circuit board, fingerprint sensor and processing unit, and the central zone of stiffening plate is located the holding region of center, can be with at least part of fingerprint identification device built-in the center, reduces the installation space of fingerprint identification device below the screen. In addition, compare in opening the blind hole in the center, set up the technical scheme in the blind hole with fingerprint identification device, the technical scheme of this application embodiment can directly form the through-hole in the center, and the at utmost places the fingerprint identification device in the center in, and further reduction fingerprint identification device is in the installation space of screen below, and reduces the processing degree of difficulty of center, and the thickness of center can accomplish minimum.
Alternatively, FIG. 4 shows a schematic block diagram of another fingerprint identification device 200.
As shown in fig. 4, in the embodiment of the present application, the middle frame 101 is formed with a step structure 1041 at an edge of the receiving area 104, and the inverted step structure 2501 of the reinforcing plate 250 is overlapped and attached on an upper surface of the step structure 1041, so that the fingerprint sensor 220 and the processing unit 240 are mounted in the receiving area 104 of the middle frame 101 through the reinforcing plate 250 and the circuit board 230.
In some embodiments, the lower surface of the inverted step structure 2501 of the reinforcing plate 250 is connected to the upper surface of the step structure 1041 of the middle frame 101 through a glue layer, so as to fixedly mount the reinforcing plate 250 to the middle frame 101.
Optionally, the upper surface of the edge region of the reinforcing plate 250, i.e. the upper surface of the inverted step structure 2501, is not higher than the upper surfaces of the other regions of the middle frame 101 except for the accommodating region 104 and the step structure 1041, for example, as shown in fig. 4, the upper surface of the inverted step structure 2501 may be located at the same level with the upper surfaces of the other regions of the middle frame 101 except for the accommodating region 104 and the step structure 1041.
Further, the lower surface of the central region of the reinforcing plate 250 is not lower than the lower surface of the other region of the middle frame 101 except the accommodating region 104. For example, as shown in fig. 4, the lower surface of the central region of the reinforcing plate 250 may be slightly higher than the lower surface of the other region of the middle frame 101 except the accommodating region 104.
Through the technical scheme of this application embodiment, the center is formed with the stair structure at the edge of accommodation area, and the laminating of the reversed stair structure overlap joint of stiffening plate is at the upper surface of stair structure, and at least part fingerprint identification device's is built-in the center, when reducing the installation space of fingerprint identification device in the screen below, further reduce the installation thickness of the reversed stair structure of stiffening plate in the center, compare in the technical scheme that fig. 3 shows, can further reduce the installation space of fingerprint identification device in the screen below.
In addition, the upper surface of the highest position in the reinforcing plate 250, i.e. the upper surface of the inverted step structure 2501, is not higher than the upper surface of the middle frame 101, and the lower surface of the lowest position in the reinforcing plate 250, i.e. the lower surface of the middle area, is not lower than the lower surface of the middle frame 101, so that the thickness of the middle frame is fully utilized by the installation of the reinforcing plate 250 in the middle frame 101, and the thickness occupied by the whole fingerprint identification device in the electronic setting is reduced.
Optionally, as shown in fig. 3 and 4, the length of the inverted step structure 2501 is greater than a certain threshold to achieve stable support of the fingerprint recognition device 200, for example, the length of the inverted step structure 2501 may be greater than 0.5mm, for example, the length of the inverted step structure 2501 is 1 mm.
Specifically, the length of the inverted step structure 2501 is related to the thickness and material strength of the stiffener 250 in the actual product, and the inverted step structure 2501 is designed to stably support the stiffener 250 and the at least one fingerprint sensor 220 thereon on the middle frame 101. Alternatively, the length of the inverted step structure 2501 may be longer as the thickness of the stiffener 250 is greater, in order to provide more stable support. Alternatively, when the strength of the reinforcing plate 250 is stronger, the length of the inverted step structure 2501 can be reduced appropriately, so as to further reduce the occupied space while providing stable support.
Alternatively, in the embodiment of the present application, the entire region of the peripheral edge of the reinforcing plate 250 is warped upward to form the inverted step structure 2501, or a partial region of the peripheral edge of the reinforcing plate 250 is warped upward to form the inverted step structure 2501.
Fig. 5 and 6 show two schematic top views of the reinforcing plate 250. As shown in fig. 5, when the reinforcing plate 250 has a rectangular shape, the edges of the four sides are all warped to form an inverted step structure 2501. Alternatively, in this case, the accommodating area in the middle frame 101 corresponds to a quadrilateral area, and the step structure 1041 of the middle frame 101 may also be correspondingly formed in the area around four sides of the accommodating area.
As shown in FIG. 6, the opposite edges of the reinforcing plate 250 are warped upwards to form an inverted step 2501, while the other edges are not shaped, so as to ensure that the other edges are at the same level with the center of the reinforcing plate. Alternatively, in this case, the accommodating area in the middle frame 101 corresponds to a quadrilateral area, and the step structure 1041 of the middle frame 101 may be formed in the area around four sides of the accommodating area, or may also be formed in the area on two sides of the accommodating area, corresponding to the inverted step structure in the receiving reinforcing plate.
In the above-described embodiment shown in fig. 5 and 6, the entire region in one side of the reinforcing plate 250 is formed in the inverted step structure. It is understood that, in addition to the above embodiments, in other embodiments, a local area in one side of the reinforcing plate 250 is warped upwards to form a plurality of local inverted step structures 2501. The reinforcing plate 250 has a partial region that is located at the same level as the center of the reinforcing plate except for a partial region where the inverted step structure 2501 is formed. In this case, the step structure 1041 in the middle frame 101 may be formed at the peripheral edge of the quadrangular accommodation area, or may be correspondingly formed at a partial edge area of the quadrangular accommodation area, for receiving the inverted step structure in the reinforcing plate.
Alternatively, in the embodiment of the present application, as shown in fig. 3 and fig. 4, the optical assembly 210 may be similar to the optical assembly 110 in fig. 1, and includes a microlens array 211 and a diaphragm layer 212 disposed below the microlens array 211, and the related technical solutions may be referred to the above detailed description.
Further, in addition to the one-layer diaphragm layer 212 scheme shown in fig. 3 and 4, in the embodiment of the present application, the optical assembly 210 may also include multiple layers of diaphragm layers 212. The fingerprint sensor 220 comprises a pixel array consisting of a plurality of pixel units, each microlens in the microlens array 211 corresponds to at least one light-passing aperture in each layer of the diaphragm layer 212, and at least one pixel unit in the pixel array, and each microlens transmits a converged light signal to the inside of the corresponding light-passing aperture and transmits the converged light signal to the corresponding pixel unit through the light-passing aperture to perform optical fingerprint imaging.
Alternatively, a plurality of pixel cells in the fingerprint sensor 220 may be used to receive fingerprint light signals in the same direction, for example, a plurality of pixel cells each receive fingerprint light signals perpendicular to the display screen, or a plurality of pixel cells each receive fingerprint light signals oblique to a particular direction of the display screen.
Optionally, the plurality of pixel units in the fingerprint sensor 220 may also be configured to receive fingerprint light signals in different directions to form fingerprint image signals of a plurality of fingerprint images, for example, a first portion of the plurality of pixel units receives fingerprint light signals in a first direction to form fingerprint image signals of a first fingerprint image; the second part of pixel units receive the fingerprint light signals in the second direction and form fingerprint image signals of a second fingerprint image.
In some embodiments, the stop layer 212 may be formed on the fingerprint sensor 220 by semiconductor process growth or other processes, for example, a non-transparent material film is formed on the fingerprint sensor 220 by atomic layer deposition, sputtering, electron beam evaporation, ion beam deposition, etc., and then the aperture pattern is etched and etched to form a plurality of light-passing apertures. It will be appreciated that where the optical assembly 210 includes multiple layers of stop layers 212, the lowermost stop layer 212 may be isolated from the fingerprint sensor 220, as well as adjacent stop layers 212, by transparent dielectric layers.
It is understood that the optical assembly 210 may be other light guiding structures, such as a collimator (collimater) layer having a plurality of collimating cells or a micro-hole array, in addition to the structures shown in fig. 3 and 4; alternatively, the optical Lens (Lens) layer has one or more Lens units, such as a Lens group consisting of one or more aspheric lenses, and the specific structure of the optical assembly 210 is not limited in the embodiments of the present application.
In the embodiment of the present application, the optical component 210 with the above structure is not limited by the imaging optical path of the lens, and reduces the thickness of the optical component, which is beneficial to implementing the light and thin fingerprint identification device, compared with the fingerprint identification device based on optical lens layer imaging. In addition, compared with a fingerprint identification device based on collimator layer imaging, the light signal is converged by utilizing the micro-lens array, and the direction of the light signal is guided by utilizing one or more layers of diaphragm layers, so that the quality of the fingerprint light signal can be further improved, and the fingerprint identification performance of the fingerprint identification device is improved.
As an example, fig. 7 shows a schematic top view of the fingerprint identification device 200 of fig. 3 and 4.
As shown in fig. 3 and 4, as an example, the circuit board 230 is disposed above the reinforcing plate 250, and as shown in fig. 3, 4 and 7, two circuit board windows penetrating through the circuit board 230 are formed in the circuit board 230, wherein the fingerprint sensor 220 is disposed in the first circuit board window 2301, the processing unit 240 is disposed in the second circuit board window 2302, and the fingerprint sensor 220 and the processing unit 240 are disposed side by side above the reinforcing plate 250 and connected to the circuit board 230 through the electrical connector.
In particular, a related technical solution of the electrical connector can be seen from the related description in fig. 1. In some embodiments, the electrical connector may be a wire, such as a gold wire, which is bonded by a wire, wherein a first wire 2311 connects the pad of the fingerprint sensor 220 and the pad of the circuit board 230, and a second wire 2312 connects the pad of the processing unit 240 and the pad of the circuit board 230.
Referring to fig. 7, the first circuit board opening window 2301 may have substantially the same shape as that of the fingerprint sensor 220 to accommodate the fingerprint sensor 220. Each side of the first circuit board opening window 2301 is parallel or perpendicular to each side of the fingerprint sensor 220. Similarly, the second circuit board opening window 2302 may have substantially the same shape as the processing unit 240 to accommodate the processing unit 240, and each side of the second circuit board opening window 2302 is parallel or perpendicular to each side of the processing unit 240.
It is understood that the shapes of the first circuit board opening window 2301 and the second circuit board opening window 2302 include, but are not limited to, the shapes shown in fig. 7, which may be other regular or irregular shapes as well, and are intended to accommodate the fingerprint sensor 220 and the processing unit 240.
Preferably, the shape of the window shown in fig. 7 is adopted, which can accommodate the fingerprint sensor 220 and the processing unit 240 without consuming a circuit board area, and at the same time, the substantially regular shape of the window has a more mature processing condition than the irregular shape of the window, thereby improving productivity and yield.
Further, as shown in fig. 7, taking the first circuit board opening window 2301 as an example, if the first pad connected to the fingerprint sensor 220 is disposed on one side of the first circuit board opening window 2301 of the circuit board 230, the thickness of the first pad, or the thickness of the circuit board 230 in the area on one side of the first circuit board opening window 2301, may be smaller than the thickness of the circuit board 230 in other areas. Similarly, the circuit board 230 is provided with a second pad connected to the processing unit 240 on one side of the second circuit board opening window 2302, and the thickness of the circuit board in the area where the second pad is located, that is, the area where the circuit board 230 is located on one side of the second circuit board opening window 2302, may also be smaller than the thickness of the circuit board 230 in other areas.
In other words, optionally, the thickness of the circuit board 230 is reduced in at least a portion of the edge area of the first circuit board opening window 2301 and/or the second circuit board opening window 2302, only one layer of metal pads and metal traces may be disposed in the edge area, and multiple layers of metal traces may be disposed in other areas of the circuit board 230. By adopting the design mode, the bonding pads on the circuit board and the bonding pads on the fingerprint sensor can be increased, the section difference between the bonding pads on the circuit board and the bonding pads on the processing unit can be increased, the lead connection between the bonding pads is facilitated, the arc height of the lead is reduced, and the thickness of the whole fingerprint identification device is favorably reduced.
As an example, in fig. 7, a first side (left side) of the first board opening window 2301 is adjacent to a first side (right side) of the second board opening window 2302, and the board 230 has pads formed in regions where the first side of the first board opening window 2301 and the first side of the second board opening window 2302 are located, so that the thickness of the region may be smaller than that of other regions of the board. In some embodiments, as shown in fig. 7, an area between the first board opening window 2301 and the second board opening window 2302 is smaller, and a thickness of an entire area between the first board opening window 2301 and the second board opening window 2302 is smaller than thicknesses of other areas of the board.
Optionally, in addition to the electrical connection among the fingerprint sensor, the processing unit, and the circuit board by using the wire bonding method, the embodiment of the present application may also use other electrical connection technologies in the related art to implement the electrical connection among the fingerprint sensor, the processing unit, and the circuit board, for example, Through Silicon Vias (TSVs), and the like, which is not specifically limited in this embodiment of the present application.
In the embodiment of the present application, by disposing the circuit board opening window in the circuit board 230 and disposing the processing unit 240 and the fingerprint sensor 220 in the circuit board opening window, compared with a scheme of directly disposing the fingerprint sensor 220 and the processing unit 240 on the surface of the circuit board 230, the overall thickness of the fingerprint identification device 200 can be reduced.
Optionally, in the embodiment of the present application, reference may be made to the related description of the circuit board 130 in fig. 1 and fig. 2 for a related technical solution of the circuit board 230. Preferably, the circuit board 230 is an FPC, which facilitates the installation of the fingerprint recognition device under the display screen.
For example, if the circuit board 230 is an FPC, the stiffener 250 is a stiffener of the FPC, and the material thereof may be a stainless steel stiffener, an aluminum foil stiffener, a glass fiber stiffener or other organic material stiffener, which is not limited in the embodiments of the present application. Preferably, the reinforcing plate 250 is a reinforcing steel plate.
Optionally, in one embodiment of the present application, the surface roughness of the stiffening plate 250 is greater than a certain preset threshold, for example greater than 0.25 μm. The surface roughness of the reinforcing plate is larger than 0.25 μm, so that the optical signal can be scattered, the purpose of extinction is achieved, and the influence of light reflection on imaging is avoided.
Optionally, the reinforcing plate 250 is black or other non-reflective color, such as a gun color, and the reinforcing plate is set to be the non-reflective color, so that the light signal reflected from the surface of the reinforcing plate can be prevented from entering the fingerprint sensor, and the fingerprint detection performance can be prevented from being affected.
It is understood that, in the embodiment of the present application, the circuit board 230 may be a flexible board in a rigid-flexible board, in addition to an FPC, or may be another type of circuit board in the electrical field, and the circuit board 230 is provided with electrical connection units such as an interconnection layer and a pad for conducting electrical signals. The reinforcing plate 250 is a material layer for reinforcing and supporting the circuit board 230, and is not generally used for transmitting an electrical signal, and may be a core (core) material in a rigid-flex circuit board, in addition to a reinforcing steel plate of an FPC. In the embodiment of the present application, the combination of the circuit board 230 and the reinforcing plate 250 can support the fingerprint sensor 220 and the processing unit 240 while achieving electrical connection therebetween and reducing the installation thickness of the two.
In addition, according to this embodiment, the processing unit 240 and the fingerprint sensor 220 share one reinforcing plate, so that the cost of the fingerprint identification device can be reduced without additionally increasing the reinforcing plate of the processing unit 240 and the thickness of the entire fingerprint identification device on the premise of ensuring the installation reliability of the processing unit 240 and the fingerprint sensor 220.
Further, the processing unit 240 is electrically connected to the fingerprint sensor 220 through the electrical connector and the circuit board 230, and is configured to process the fingerprint image signal acquired by the fingerprint sensor 220, and the processed fingerprint image signal is used for fingerprint identification.
As an example, the processing unit 240 may perform signal processing such as digital synthesis (combining), filtering (filtering) and the like on the fingerprint image signal acquired by the fingerprint sensor 220, and then transmit the processed fingerprint image signal to a processor of the electronic device through the circuit board 230 and a connector on the circuit board 230, where the processor is used for performing fingerprint detection and identification on the processed fingerprint image signal. Optionally, at the same time, the processing unit 240 may be further configured to form a control signal of the fingerprint sensor to control the operation of the circuit in the fingerprint sensor to perform fingerprint image acquisition.
As another example, the processing unit 240 may be configured to process and identify a fingerprint image signal acquired by the fingerprint sensor 220 to determine whether the fingerprint image signal belongs to a fingerprint of a target user, and further, the processing unit 240 may be configured to perform a live detection on the fingerprint image signal to determine whether the fingerprint image signal belongs to a live finger.
The processing unit 240 includes, but is not limited to, an MCU, which may also be a Digital Signal Processor (DSP), an Image Signal Processor (ISP), an Application Specific Integrated Circuit (ASIC), an off-the-shelf programmable gate array (FPGA) or other programmable logic device, a discrete gate or transistor logic device, or a discrete hardware component.
In the embodiment of the present application, the processing unit 240 is disposed on one side of the fingerprint sensor 220 side by side, rather than disposed at other positions of the circuit board 230, so that the routing distance between the processing unit 240 and the fingerprint sensor 220 can be reduced, thereby preventing the signal quality from being reduced in the transmission process and affecting the fingerprint identification effect.
In addition, the processing unit 240 and the fingerprint sensor 220 are arranged side by side in the blind hole area of the middle frame, so that a reinforcing plate does not need to be arranged below the processing unit 240 separately, and the processing unit 240 does not need to be packaged, i.e. an additional packaging material layer is prepared outside the processing unit 240. Therefore, in the embodiment of the present application, compared with the setting manner of the MCU 131 in fig. 2, the setting manner of the processing unit 240 can reduce the thickness space occupied by the whole fingerprint identification device 200, thereby further reducing the thickness of the whole fingerprint identification device.
In addition, the processing unit 240 and the fingerprint sensor 220 are disposed below the display screen 103 and disposed in the blind hole region of the middle frame through the reinforcing plate 250, so that there is no need to separately dispose a reinforcing plate below the processing unit 240 and encapsulate the processing unit 240, i.e., an additional encapsulating material layer is prepared outside the processing unit 240. Therefore, in the embodiment of the present application, compared with the setting manner of the MCU 131 in fig. 2, the setting manner of the processing unit 240 can reduce the thickness space occupied by the whole fingerprint identification device 200, thereby further reducing the thickness of the whole fingerprint identification device.
To sum up, adopt the technical scheme of this application embodiment, through windowing the circuit board 230, set up processing unit 240 and fingerprint sensor 220 in the circuit board windowing of circuit board 230, and carry out signal transmission through circuit board 230, when reducing fingerprint identification device 200's thickness, can reduce the signal transmission distance between processing unit 240 and the fingerprint sensor 220, improve the signal quality between the two, improve the fingerprint identification effect. Further, the processing unit 240 and the fingerprint sensor 220 are disposed in the middle frame through the reinforcing plate 250 and located below the display screen, and there is no need to separately dispose a reinforcing plate on the processing unit 240 and encapsulate the processing unit 240, so that the thickness space occupied by the processing unit 240 is small, and the thickness of the whole fingerprint identification device 200 can be reduced. In addition, in cooperation with the optical assembly of the present embodiment, the thickness of the optical assembly is smaller, the reinforcing plate 250 below the circuit board 230 is designed to be a special-shaped reinforcing plate, the edge region of the reinforcing plate is formed with the inverted step structure 2501, the fingerprint identification device is disposed in the accommodating region 104 of the middle frame through the inverted step structure 2501, the thickness space occupied by the whole fingerprint identification device below the screen can be further compressed, the fingerprint identification device can be more conveniently and flexibly mounted in the electronic device, and the fingerprint identification device can be suitable for more electronic devices.
Alternatively, as shown in fig. 7, one side of the processing unit 240 is parallel or perpendicular to one side of the fingerprint sensor 220 in the embodiment of the present application. The fingerprint sensor 200 and the processing unit 240 may be a quadrilateral chip, and one side of the quadrilateral chip may be any side of the quadrilateral chip.
For example, in fig. 7, if the first side of the processing unit 240 is the right side thereof and the first side of the fingerprint sensor 220 is the left side thereof, the first side of the processing unit 240 is parallel to the first side of the fingerprint sensor 220. In this case, the processing unit 240 may be said to be disposed in parallel with the fingerprint sensor 220.
Instead of the situation shown in fig. 7, the processing unit 240 may be arranged not parallel to the fingerprint sensor 220, i.e. the first side of the processing unit 240 is at an angle with the first side of the fingerprint sensor 220, which angle is not 0 ° or 90 °. The angular relationship between the processing unit 240 and the fingerprint sensor 220 is not particularly limited in the embodiment of the present application.
It can be understood that, if the layout of fig. 7 is adopted in which the processing unit 240 is disposed parallel to the fingerprint sensor 220, the distance between the right side of the processing unit 240 and the left side of the fingerprint sensor 220 is the shortest, and the pads of the circuit board 230 are located between the left side of the fingerprint sensor 220 and the right side of the processing unit 240, so that the connection between the fingerprint sensor 220 and the processing unit 240 and the pads of the circuit board is facilitated.
It should be further understood that fig. 7 only illustrates the case that the processing unit 240 is disposed in parallel on the left side of the fingerprint sensor 220, and the processing unit 240 may also be disposed in parallel or non-parallel on any one of three other sides of the second sensor 230, which is not specifically limited in this embodiment of the present application.
In the embodiments shown in fig. 3, 4 and 7 above, two windows are provided in the circuit board 230, respectively accommodating the fingerprint sensor 220 and the processing unit 240. Alternatively, in some embodiments, only one window may be provided in the circuit board 230 for accommodating the fingerprint sensor 220 or the processing unit 240.
Fig. 8 shows a schematic diagram of another fingerprint recognition device 200.
As shown in fig. 8, a first board opening window 2301 penetrating the board 230 is formed in the board 230. The fingerprint sensor 220 is disposed in the first circuit board opening window 2301 and above the reinforcing plate 250. The processing unit 240 is disposed above the circuit board 230, and the processing unit 240 and the fingerprint sensor 220 are connected to the circuit board 230 through electrical connections.
Fig. 9 shows a schematic diagram of another fingerprint recognition device 200.
As shown in fig. 9, a second board opening window 2302 penetrating the board 230 is formed in the board 230. The processing unit 240 is disposed in the second circuit board opening window 2302 and located above the reinforcing plate 250. The fingerprint sensor 220 is disposed above the circuit board 230, and the processing unit 240 and the fingerprint sensor 220 are connected to the circuit board 230 through electrical connections.
It can be understood that, if an opening is formed in the circuit board 230, in the top view in fig. 7, that is, only the first circuit board opening window 2301 or the second circuit board opening window 2302 is correspondingly disposed, the top view corresponding to fig. 8 and fig. 9 is not shown here, and the specific solution can be referred to the related description in fig. 7 above.
Taking fig. 8 as an example, a related technical solution of the fingerprint identification device 200 when a window is formed in the circuit board 230 is illustrated. The specific embodiment of the fingerprint identification device in fig. 9 can be referred to the following related description, and will not be described herein again.
As shown in fig. 8, the fingerprint sensor 220 is disposed in the first circuit board opening window 2301 of the circuit board 230, and in order to facilitate electrical connection between the fingerprint sensor 220 and the circuit board 230, if the circuit board 230 has a first pad connected to the fingerprint sensor 220 formed in a region where a first edge (left edge) of the first circuit board opening window 2301 is located, a thickness of the circuit board 230 in the region where the first edge of the first circuit board opening window 2301 is located may be smaller than a thickness of the circuit board 230 in other regions.
The circuit board 230 may be provided with only one layer of metal pads and metal traces in the area of the first edge of the first circuit board opening window 2301, and the other area of the circuit board 230 may be provided with multiple layers of metal traces. By adopting the design mode, the section difference between the bonding pads on the circuit board and the bonding pads on the fingerprint sensor can be increased, the lead connection between the bonding pads is convenient, the arc height of the lead is reduced, and the thickness of the whole fingerprint identification device is favorably reduced.
Further, as shown in fig. 8, the circuit board 230 is adjacent to the processing unit 240 at a first edge (left edge) of the first circuit board opening window 2301, and a second pad connected to the processing unit 240 may be further formed in a region of the circuit board 230 at the first edge of the first circuit board opening window 2301.
As an example, the pad of the fingerprint sensor 220 is disposed on only one side of the fingerprint sensor 220, and correspondingly, the first pad of the circuit board 230 connected to the fingerprint sensor 220 is disposed on only the first side of the first circuit board opening 2301.
Similarly, in the fingerprint recognition device 200 shown in fig. 9, the circuit board 230 is provided with a second pad connected to the processing unit 240 at a first edge (right edge) of the second circuit board opening window 2302, and the thickness of the circuit board 230 at the area where the first edge of the second circuit board opening window 2302 is located is smaller than the thickness of the circuit board 230 at other areas.
In some embodiments, the circuit board 230 is adjacent to the fingerprint sensor 220 at a first side of the second circuit board opening window 2302, and the circuit board 230 is further provided with a first pad connected to the fingerprint sensor 220 at the first side of the second circuit board opening window 2302.
As an example, in the fingerprint recognition device 200 shown in fig. 9, the pads of the processing unit 240 are disposed on three sides of the processing unit 240, and correspondingly, the second pad of the circuit board 230, which is connected to the processing unit 240, is disposed on two sides of the second circuit board opening window 2302 in addition to the first side of the second circuit board opening window 2302.
When different requirements of different electronic devices are met, if the transverse installation space of the fingerprint identification device 200 is limited and the area of the circuit board 230 is small, a plurality of open windows are not suitable to be arranged in the fingerprint identification device, the actual use area of the circuit board 230 is affected, and the overall reliability of the fingerprint identification device is not facilitated. Therefore, the technical solution of the above application embodiment can be adopted, only one window is arranged in the circuit board 230, the thickness of the fingerprint identification device is reduced, and meanwhile, the transverse installation area of the whole fingerprint identification device and the actual use area of the circuit board 230 can be considered, so that the reliability of the fingerprint identification device is improved.
Fig. 10 to 12 show schematic structural diagrams of another fingerprint identification device 200. The several fingerprint recognition devices 200 correspond to the fingerprint recognition devices of fig. 4, 8 and 9, respectively, above.
Next, a specific configuration of the fingerprint recognition device will be described with reference to fig. 13 to 15, taking the fingerprint recognition device in fig. 10 as an example. The structure of the fingerprint identification apparatus in fig. 11 and 12 can be referred to the related description below, and is not described herein again.
As shown in fig. 10, the circuit board 230 is adhered to the reinforcing plate 250 by the first adhesive layer 231. Further, the reinforcing plate 250 is adhered to the upper surface of the step structure 1041 of the middle frame 101 by the second glue layer 251.
By way of example, the first adhesive layer 231 includes, but is not limited to, a conductive adhesive for connecting the FPC with the reinforcing steel plate. The second adhesive layer 251 includes, but is not limited to, a module-bonded double-sided adhesive tape, a glue solution, a foam layer with an adhesive layer on a solid adhesive tape, or other types of adhesive layers. The embodiment of the present application does not limit the specific types of the first adhesive layer 231 and the second adhesive layer 251.
Further, as shown in fig. 10, the fingerprint sensor 220 may be adhered to the reinforcing plate 250 by the third glue layer 221, and the processing unit 240 is adhered to the reinforcing plate 250 by the fourth glue layer 241. The third adhesive layer 221 and the fourth adhesive layer 241 include, but are not limited to, a Die Attach Film (DAF), which can realize an ultra-thin connection between a chip and a circuit board.
In addition, in fig. 10, a first lead line 2311 for connecting the fingerprint sensor 220 and the circuit board 230, and a second lead line 2312 for connecting the processing unit 240 and the circuit board 230 are wrapped with a lead line protective adhesive 232 to support and protect the lead lines.
Through the lead protection paste 232, the stability of the electrical connection between the circuit board 230 and the fingerprint sensor 220, and between the circuit board 230 and the processing unit 240 can be ensured, and further, the performance of the fingerprint recognition device 200 can be ensured.
In the embodiment of the present application, in order to limit the thickness of the entire fingerprint recognition device, the height of the wire protective paste 232 is not more than 150 μm, and the height of the wire protective paste 232 is a height between the highest point of the upper surface thereof and the upper surface of the circuit board 230.
Specifically, in addition to the above-mentioned reliable connection between the components through the glue layer, as shown in fig. 10, in the embodiment of the present application, the fingerprint identification device 200 may further include the following components.
Optionally, the fingerprint recognition device 200 may further include:
the light-shielding layer 270 has a first window 2701 formed therein, and the first window 2701 is located above the fingerprint sensor 220 and is used for passing through the fingerprint light signal to be received by the fingerprint sensor 220.
For convenience of illustration of the light-shielding layer 270, fig. 13 is a schematic top view of the fingerprint identification device shown in fig. 10.
Referring to fig. 10 and 13, in the embodiment of the present application, besides the area of the first window 2701, a light shielding layer is disposed in the area around the first window 2701, and may be used to shield stray light or fingerprint light signals in a non-target direction from entering the fingerprint sensor 220, so as to reduce interference of environmental factors on the fingerprint identification process. Further, set up light shield layer 270 and also can promote the outward appearance problem of fingerprint identification device 200 under the display screen, owing to be provided with light shield layer 270, it can absorb the light signal from the display screen top transmission, reduces the intensity of the light signal of reflecting back the display screen, avoids the user to observe the fingerprint identification device of display screen below to improve user's use and experience.
In some embodiments of the present application, the light shielding layer 270 is a light shielding glue layer, and optionally, the thickness of the light shielding layer 270 is 10-30 μm, for example, 20 μm. Of course, the thickness of the light-shielding layer 270 may also be other specific values or within another preset value range, which is not specifically limited in this application.
Of course, in other alternative embodiments, a filter may be used instead of the light-shielding layer 270. Wherein the optical filter is used to reduce undesired ambient light in the fingerprint sensing to improve the optical sensing of the received light by the fingerprint sensor 220. The filter may specifically be used to filter out light of a particular wavelength, e.g., near infrared light and portions of red light, etc. For example, a human finger absorbs most of the energy of light with a wavelength below 580nm, based on which the filter can be designed to filter light with a wavelength from 580nm to the infrared to reduce the influence of ambient light on the optical detection in fingerprint sensing.
Optionally, in some embodiments, at least a portion of the area of the optical assembly 210 is located in the first window 2701.
For example, as shown in fig. 10 and 13, the microlens array 211 in the optical assembly 210 is located in the first window 2701, at least one aperture layer in the optical assembly 210 is integrated with the fingerprint sensor 220 in the fingerprint sensor chip, and the peripheral region of the first window 2701 in the light shielding layer 270 is disposed on the surface of the edge region of the fingerprint sensor chip.
It should be noted that a light shielding layer 270 is also disposed between the first lead 2311 of the fingerprint sensor 220 and the microlens array 211, and the light shielding layer 270 may be used to block stray light and also block the lead protection adhesive 232 from spreading to the microlens array 211, thereby affecting the light guiding effect of the microlens array 211.
In some embodiments, as shown in fig. 10 and 13, in the light shielding layer 270, a second window 2702 is provided in correspondence to a lead wire connection region, in addition to a first window 2701 provided in correspondence to a region above the fingerprint sensor 220.
Specifically, the top area of the first lead 2311 of the fingerprint sensor 220 connected to the circuit board 240 and the top area of the second lead 2312 of the processing unit 240 connected to the circuit board 240 are both located in the second window 2702. Further, top regions of the wire protection paste 232 of the first and second wires 2311 and 2312 are also located in the second window 2702.
In some embodiments, as shown in fig. 13, the first side of the fingerprint sensor 220 (the left side of the fingerprint sensor 220 in the figure) is disposed adjacent to the first side of the processing unit 240 (the right side of the processing unit 240 in the figure). A plurality of first leads 2311 are disposed on a first side (a left side of the fingerprint sensor 220 in the drawing) of the fingerprint sensor 220, a plurality of second leads 2312 are disposed on a first side (a right side of the processing unit 240 in the drawing) of the processing unit 240, top regions of the plurality of first leads 2311 on the first side of the fingerprint sensor 220 and top regions of the plurality of second leads 2312 on the first side of the processing unit 240 are both located in the second window 2702, and further, a top region of the lead protection adhesive 232 on the first side of the fingerprint sensor 220 and a top region of the lead protection adhesive 232 on the first side of the processing unit 240 are also located in the second window 2702.
In other words, in fig. 13, a plurality of first lead lines 2311 and a plurality of second lead lines 2312 are provided between the fingerprint sensor 220 and the processing unit 240, and the second window 2702 covers an area between the fingerprint sensor 220 and the processing unit 240.
As an example, as shown in fig. 13, all of the first lead lines 2311 of the fingerprint sensor 220 can be disposed at the first side of the fingerprint sensor 220. And a portion of the second wire 2312 of the processing unit 240 is disposed at a first side of the processing unit 240, and another portion of the second wire 2312 is disposed at another side of the processing unit 240.
It is understood that, in this case, in addition to the second lead 2312 and the top area of the lead protective paste thereof located at the first side of the processing unit 240 being located in the second window 2702, the second lead and the top area of the lead protective paste thereof located at the other side of the processing unit 240 may be located in the second window 2702.
Since the processing unit 240 generally involves a large number of connection ports, its connection pins may be disposed on multiple sides of the processing unit 240. In some embodiments, for example, as shown in fig. 13, the lead pad of the processing unit 240 is disposed on three sides (an upper side, a lower side, and a right side), the second window 2702 is located above the processing unit 240, the light shielding layer 270 does not cover the processing unit 240 at all, and a projection of the second window 2702 on a plane where the processing unit 240 is located completely covers a region where the processing unit 240 is located.
In other embodiments, the light shielding layer 270 may cover a side of the processing unit 240 where the second lead is not disposed, for example, the light shielding layer 270 may cover a left side in fig. 13, in which case, the projection of the second window 2702 on the plane where the processing unit 240 is located may only partially cover the area where the processing unit 240 is located.
It is understood that the first and second windows 2701 and 2702 may have other regular or irregular shapes besides the design shape shown in fig. 13, and this is not particularly limited in the embodiments of the present application.
In this embodiment, by providing the second window 2702 in the light shielding layer 270 and disposing the top area of the lead and the lead protection adhesive thereof in the second window 2702, the thickness of the entire fingerprint identification device can be further reduced compared to the case where the light shielding layer 270 is directly disposed on the top of the lead and the lead protection adhesive.
Further, the upper surface of the light shielding layer 270 is not higher than the highest point of the upper surface of the lead protection paste 232, and/or the upper surface of the light shielding layer 270 is not higher than the highest point of the upper surface of the optical element 210. The light-shielding layer 270 is disposed to improve the performance of the fingerprint identification device 200 without increasing the thickness of the fingerprint identification device 200.
To sum up, adopt this embodiment, through the setting of light shield layer 270, wherein the cooperation microlens array 211 forms first windowing 2701, and the cooperation lead wire and lead wire protection glue form second windowing 2702, can shelter from stray light or the fingerprint light signal of non-target direction to reduce the interference of external world to the fingerprint identification process, and reduce fingerprint identification device's thickness, it is further, can also promote the outward appearance problem of fingerprint identification device under the display screen.
Optionally, as shown in fig. 10, the fingerprint recognition device 200 may further include: and a support layer 260 disposed between the circuit board 230 and the light shielding layer 270 to support the light shielding layer 270.
For convenience of illustration of the light shielding layer 260, fig. 14 is another schematic top view of the fingerprint identification device of fig. 10.
Referring to fig. 10 and 14, in the embodiment of the present application, a third opening 2601 is disposed in the supporting layer 260, and the fingerprint sensor 220 and the processing unit 240 are disposed in the third opening 2601.
Specifically, the light shielding layer 270 is disposed on the surface of the supporting layer 260 and extends toward the fingerprint sensor 220, and a first window 2701 is formed around the microlens array 211 of the fingerprint sensor 220. In other words, the supporting layer 260 supports a portion of the light shielding layer 270, and another portion of the light shielding layer 270 is suspended below or supported by the fingerprint sensor 220.
Optionally, the upper surface of the supporting layer 260 is not higher than the highest point of the upper surface of the microlens array 211 in the optical assembly 210, and further, as shown in fig. 10, at least one layer of diaphragm layer in the optical assembly 210 is integrated with a fingerprint sensor chip, and the upper surface of the supporting layer 260 is not higher than the upper surface of the fingerprint sensor chip. In addition, the upper surface of the supporting layer 260 is also not higher than the upper surface of the processing unit 240.
In some embodiments, the support layer 260 is fixed to the upper surface of the circuit board 230 by a fixing paste. For example, the material of the supporting layer 260 includes, but is not limited to, metal, resin, glass fiber composite board, glue layer, and the like. For example, the supporting layer 260 may be a polyethylene terephthalate (PET) material layer or a Polyimide (PI) material layer. For another example, the support layer 260 may be a scaffold formed from a foam material. Alternatively, the fixing glue may be a double-sided glue.
Through the scheme of the embodiment of the application, the arrangement of the supporting layer 260 does not additionally increase the thickness of the fingerprint identification device 200, but only supports the light shielding layer 270, so as to improve the stability of the light shielding layer 270.
Optionally, as shown in fig. 10, the fingerprint recognition device 200 may further include: a foam layer 280, the foam layer 280 may be attached to the surface of the light shielding layer 270 by a tape (tape)281 to fix the foam layer 280 above the fingerprint sensor 220 and the processing unit 240.
To facilitate the description of the foam layer 280, fig. 15 shows another schematic top view of the fingerprint identification device of fig. 10.
Alternatively, as shown in fig. 10 and 15, the foam layer 280 may be provided with a fourth louver 2801 penetrating the foam layer 280. Optionally, the fourth window 2801 is disposed directly above the optical assembly, specifically, directly above the microlens array 211, so that the fingerprint light signal can be received by the optical assembly 210 and the fingerprint sensor 220 through the fourth window 2801. Optionally, the area of the fourth opening 2801 is not less than the area of the first opening 2701 in the light-shielding layer 270.
In some embodiments, the upper surface of the fingerprint identification device 200 abuts against the lower surface of the display screen or keeps a certain gap with the lower surface of the display screen through the foam layer 280, and the foam layer 280 can be used for avoiding the influence on the detection performance of the fingerprint identification device 200 due to the fact that the fingerprint identification device 200 touches the display screen, and can also be sealed and dust-proof, so that the identification performance of the fingerprint identification device 200 is ensured, and the service life of the fingerprint identification device 200 is prolonged. In addition, the foam layer 280 can further play a role in shading light, so that the visibility of the user when watching the fingerprint identification device 200 from the front of the display screen is reduced, and the appearance of the electronic device can be beautified.
Optionally, in this embodiment of the present application, the fingerprint identification device 200 further includes: and an optical filter disposed between the fingerprint sensor 220 and the display screen. The optical filter is used for filtering the optical signals of the non-target wave bands and transmitting the optical signals of the target wave bands.
Optionally, the area of the filter is larger than the area of the fingerprint detection area of the fingerprint sensor 220.
Optionally, the optical filter may comprise one or more optical filters, which may be configured, for example, as a band pass filter to allow transmission of light emitted by an OLED display screen or light emitted by a fingerprint recognition assisted light source in an LCD display screen, while blocking other light components such as infrared light in sunlight.
In the present embodiment, the optical filter is used to reduce the undesired ambient light in the fingerprint sensing to improve the optical sensing of the received light by the fingerprint sensor 220. The filter may specifically be used to filter out light of a particular wavelength, e.g., near infrared light and portions of red light, etc.
Optionally, the reflectivity of the optical filter to light is less than 1%, so that it can be ensured that the fingerprint sensor 220 can receive enough optical signals, and the fingerprint identification effect is further improved.
In some embodiments, the optical filter is disposed above the optical assembly 210, and may be connected to the circuit board 230 by a bracket or an adhesive layer, for example, so as to be disposed above the optical assembly.
Optionally, an air gap without any auxiliary material may be filled between the optical filter and the optical assembly 210, or a glue material with a refractive index lower than a predetermined refractive index, for example, the predetermined refractive index includes but is not limited to 1.3.
In other embodiments, the optical filter may also be grown on the surface of the fingerprint sensor through a semiconductor process, and specifically, a filter layer for passing optical signals in a target wavelength band and filtering optical signals in a non-target wavelength band is grown on the surface of the fingerprint sensor, and the filter layer is integrated with the fingerprint sensor in a chip.
Specifically, the above-mentioned filter layer may be formed by plating on the light detection array of the fingerprint sensor 220 using an evaporation process, for example, a multi-layer filter material film is prepared above the sensor chip by atomic layer deposition, sputter plating, electron beam evaporation plating, ion beam plating, and the like.
As can be seen from fig. 13 to 15, in the embodiment of the present application, the circuit board 230 may have an irregular shape, in which the head area is approximately a quadrilateral, and the fingerprint sensor 220, the processing unit 240, the supporting layer 260, the light shielding layer 270, the foam layer 280, and the like are all disposed on the head area of the circuit board 230, and for convenience of description, except for specific descriptions, the circuit board 230 is specifically the head area of the circuit board 230.
Further, referring to fig. 13 to 15, in the embodiment of the present application, the light shielding layer 270, the supporting layer 260, the foam layer 280 and the reinforcing plate 250 have a peripheral shape similar to the head region of the circuit board 230, so as to provide good protection for the head region of the circuit board 230 and the fingerprint sensor 220 and the processing unit 240 disposed thereon, and facilitate installation in the blind hole of the middle frame, without causing appearance problems due to light reflection of the circuit board 230.
In the above-mentioned embodiments, the fingerprint identification apparatus includes a single fingerprint sensor 220 and a single processing unit 240 as an example, and the related technical solutions are described.
Optionally, in this embodiment, the fingerprint identification device may further include a plurality of fingerprint sensors 220 and/or a plurality of processing units 240. Specifically, a plurality of fingerprint sensor 220 set up side by side in circuit board 230 top to the concatenation forms a fingerprint sensor subassembly, and wherein the induction area of a plurality of fingerprint sensor 220 constitutes the fingerprint detection area of fingerprint identification device 200 in the display screen jointly, thereby enlarges the fingerprint detection area, realizes full-screen fingerprint identification.
Specifically, a plurality of processing units 240 are disposed side-by-side above the circuit board 230 to form a processing unit assembly. The processing unit component is arranged adjacent to the fingerprint sensor component and used for processing fingerprint image signals acquired by the fingerprint sensor component.
As an optional embodiment, the accommodating area 104 of the middle frame is disposed in the middle area or the lower middle area of the middle frame 101, so that the fingerprint detection area of the at least one fingerprint sensor 220 is located in the middle position or the lower middle position of the display area of the display screen 103, which is convenient for a user to hold for fingerprint identification, thereby improving the user experience.
The preferred embodiments of the present application have been described in detail with reference to the accompanying drawings, however, the present application is not limited to the details of the above embodiments, and various simple modifications can be made to the technical solution of the present application within the technical idea of the present application, and these simple modifications are all within the protection scope of the present application.
For example, the various features described in the foregoing detailed description may be combined in any suitable manner without contradiction, and various combinations that may be possible are not described in this application in order to avoid unnecessary repetition.
For example, various embodiments of the present application may be arbitrarily combined with each other, and the same should be considered as the disclosure of the present application as long as the concept of the present application is not violated.
An embodiment of the present application further provides an electronic device, which may include:
a display screen;
fingerprint identification device of any of the above application embodiments, and
the upper surface of this center is provided with the holding region, and this holding region is located the display screen below, and this fingerprint identification device installs in the holding region of center to make fingerprint identification device set up in the display screen below, in order to carry out fingerprint identification under the screen.
The electronic device may be any electronic device having a display screen. The display screen may be an OLED display screen, an LCD display screen, or other types of display screens known in the art. Specifically, the display screen 103 in the foregoing embodiment may be referred to for related descriptions, which may refer to the foregoing description about the display screen 103, and for brevity, the description is not repeated here.
The middle frame may correspond to the middle frame 101 in the foregoing embodiment, and for the related description, reference may be made to the foregoing description about the middle frame 101, and for the accommodation area, reference may be made to the foregoing description about the accommodation area 104, which is not described herein again for brevity.
Optionally, in an embodiment of the present application, the accommodating area of the middle frame is disposed in a middle area or a lower middle area of the middle frame, so that the fingerprint detection area of the fingerprint identification device is located in a middle position or a lower middle position of the display area of the display screen.
Optionally, in an embodiment of the present application, a distance between the fingerprint identification device and the light emitting layer of the display screen is less than a preset threshold, for example, 600 μm.
It should be understood that the specific examples in the embodiments of the present application are for the purpose of promoting a better understanding of the embodiments of the present application and are not intended to limit the scope of the embodiments of the present application.
It is to be understood that the terminology used in the embodiments of the present application and the appended claims is for the purpose of describing particular embodiments only and is not intended to be limiting of the embodiments of the present application. For example, as used in the examples of this application and the appended claims, the singular forms "a," "an," and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise.
Those of ordinary skill in the art will appreciate that the elements of the examples described in connection with the embodiments disclosed herein may be implemented as electronic hardware, computer software, or combinations of both, and that the components and steps of the examples have been described above generally in terms of their functionality in order to clearly illustrate the interchangeability of hardware and software. Whether such functionality is implemented as hardware or software depends upon the particular application and design constraints imposed on the implementation. Skilled artisans may implement the described functionality in varying ways for each particular application, but such implementation decisions should not be interpreted as causing a departure from the scope of the present application.
In the several embodiments provided in the present application, it should be understood that the disclosed system and apparatus may be implemented in other manners. For example, the above-described apparatus embodiments are merely illustrative, and for example, the division of the units is only one logical division, and other divisions may be realized in practice, for example, a plurality of units or components may be combined or integrated into another system, or some features may be omitted, or not executed. In addition, the shown or discussed mutual coupling or direct coupling or communication connection may be an indirect coupling or communication connection through some interfaces, devices or units, and may also be an electric, mechanical or other form of connection.
The units described as separate parts may or may not be physically separate, and parts displayed as units may or may not be physical units, may be located in one place, or may be distributed on a plurality of network units. Some or all of the units can be selected according to actual needs to achieve the purpose of the solution of the embodiments of the present application.
In addition, functional units in the embodiments of the present application may be integrated into one processing unit, or each unit may exist alone physically, or two or more units are integrated into one unit. The integrated unit can be realized in a form of hardware, and can also be realized in a form of a software functional unit.
The integrated unit, if implemented in the form of a software functional unit and sold or used as a stand-alone product, may be stored in a computer readable storage medium. Based on such understanding, the technical solution of the present application may be substantially or partially contributed by the prior art, or all or part of the technical solution may be embodied in a software product, which is stored in a storage medium and includes instructions for causing a computer device (which may be a personal computer, a server, or a network device) to execute all or part of the steps of the method according to the embodiments of the present application. And the aforementioned storage medium includes: various media capable of storing program codes, such as a usb disk, a removable hard disk, a Read-Only Memory (ROM), a Random Access Memory (RAM), a magnetic disk, or an optical disk.
While the invention has been described with reference to specific embodiments, the scope of the invention is not limited thereto, and those skilled in the art can easily conceive various equivalent modifications or substitutions within the technical scope of the invention. Therefore, the protection scope of the present application shall be subject to the protection scope of the claims.

Claims (37)

1. The utility model provides a fingerprint identification device for set up the center below the display screen of electronic equipment, fingerprint identification device includes:
a fingerprint sensor;
the optical assembly is arranged above the fingerprint sensor and used for guiding a fingerprint optical signal which passes through the display screen to enter the fingerprint sensor after being reflected or scattered by a finger above the display screen;
the processing unit is arranged on one side of the fingerprint sensor and used for processing a fingerprint image signal acquired by the fingerprint sensor, and the processed fingerprint image signal is used for fingerprint identification;
a circuit board, wherein at least one circuit board window is arranged, at least one of the fingerprint sensor and the processing unit is arranged in the at least one circuit board window, and the circuit board is used for transmitting signals of the fingerprint sensor and the processing unit;
the reinforcing plate is arranged below the circuit board and used for supporting the circuit board, the edge of the reinforcing plate bends upwards to form a reversed step structure, the upper surface of the middle frame of the electronic equipment extends downwards to form a containing area, and the reversed step structure of the reinforcing plate is used for being installed at the edge of the containing area, so that the fingerprint sensor, the processing unit and the circuit board are installed in the containing area of the middle frame through the reinforcing plate.
2. The fingerprint identification device of claim 1, wherein a step structure is formed on the upper surface of the middle frame at the edge of the accommodating area, and the inverted step structure of the reinforcing plate is overlapped and attached to the upper surface of the step structure.
3. The fingerprint identification device of claim 1, wherein the inverted step structure of the stiffening plate is attached to the edge of the receiving area.
4. The fingerprint identification device of claim 1, wherein a partial area of the edge of the reinforcing plate is warped upwards to form the inverted step structure.
5. The fingerprint identification device of claim 4, wherein the reinforcing plate is a quadrilateral, the edge regions of two opposite sides of the reinforcing plate are warped upwards to form the inverted step structure, and the edge regions of the other two sides of the reinforcing plate are located at the same horizontal plane with the central region of the reinforcing plate.
6. The fingerprint identification device according to any one of claims 1 to 5, wherein the central region of the reinforcing plate is located in the accommodating region of the middle frame, and the upper surface of the inverted step structure of the reinforcing plate is not higher than the upper surface of the other region of the middle frame except the accommodating region.
7. The fingerprint identification device of claim 6, wherein the lower surface of the central area of the stiffening plate is not lower than the lower surface of the other areas of the middle frame except the accommodating area.
8. The fingerprint recognition device of any one of claims 1-5, wherein the receiving area is a through hole.
9. The fingerprint identification device according to any one of claims 1 to 5, wherein the at least one circuit board window is a first circuit board window and a second circuit board window, the fingerprint sensor is disposed in the first circuit board window, and the processing unit is disposed in the second circuit board window.
10. The fingerprint identification device of claim 9, wherein each side of the first circuit board fenestration is parallel or perpendicular to each side of the fingerprint sensor; and/or the presence of a gas in the gas,
each side of the second circuit board windowing is parallel or vertical to each side of the processing unit.
11. The fingerprint identification device of claim 10, wherein the circuit board is provided with a first pad connected to the fingerprint sensor on a first side of the first circuit board opening window;
the circuit board is provided with a second bonding pad connected with the processing unit on the first edge of the second circuit board windowing;
the thickness of the circuit board in the area where the first edge of the first circuit board windowing is located, and/or the thickness of the circuit board in the area where the first edge of the second circuit board windowing is located is smaller than the thickness of the circuit board in other areas.
12. The fingerprint identification device of claim 11, wherein the first edge of the first circuit board fenestration is adjacent to the first edge of the second circuit board fenestration.
13. The fingerprint identification device according to any one of claims 1 to 5, wherein the at least one circuit board window is a first circuit board window, the fingerprint sensor is disposed in the first circuit board window, and the processing unit is disposed above the circuit board.
14. The fingerprint identification device of claim 13, wherein each side of the first circuit board fenestration is parallel or perpendicular to each side of the fingerprint sensor.
15. The fingerprint identification device of claim 14, wherein the circuit board is provided with a first pad connected to the fingerprint sensor on a first side of the first circuit board opening window;
the thickness of the circuit board in the area where the first edge of the first circuit board windowing is located is smaller than the thickness of the circuit board in other areas.
16. The fingerprint identification device of claim 15, wherein the circuit board is adjacent to the processing unit at a first edge of the first circuit board opening window, and the circuit board is further provided with a second pad connected to the processing unit at the first edge of the first circuit board opening window.
17. The fingerprint identification device according to any one of claims 1 to 5, wherein the at least one circuit board window is a second circuit board window, the processing unit is disposed in the second circuit board window, and the fingerprint sensor is disposed above the circuit board.
18. The fingerprint recognition device of claim 17, wherein each side of the second circuit board fenestration is parallel or perpendicular to each side of the processing unit.
19. The fingerprint recognition device of claim 18, wherein the circuit board is provided with a second pad connected to the processing unit on a first side of the second circuit board opening window,
the thickness of the circuit board in the area where the first edge of the second circuit board windowing is located is smaller than the thickness of the circuit board in other areas.
20. The fingerprint identification device of claim 19, wherein the circuit board is adjacent to the fingerprint sensor on the first edge of the second circuit board opening window, and the circuit board is further provided with a first pad connected to the fingerprint sensor on the first edge of the second circuit board opening window.
21. The fingerprint recognition device according to any one of claims 1 to 5, further comprising:
a light shielding layer, wherein a first window is formed, the first window is disposed above the fingerprint sensor, and the first window is used for passing through the fingerprint optical signal to be received by the fingerprint sensor.
22. The fingerprint recognition device of claim 21, wherein the optical assembly is positioned in the first fenestration.
23. The fingerprint recognition device of claim 21, wherein the light shielding layer further has a second window formed therein, and wherein the top area of the first lead of the fingerprint sensor connected to the circuit board and the top area of the second lead of the processing unit connected to the circuit board are both located in the second window.
24. The fingerprint recognition device of claim 23, wherein the first lead is disposed on a first side of the fingerprint sensor, the second lead is disposed on a first side of the processing unit, and the first side of the fingerprint sensor is adjacent to the first side of the processing unit.
25. The fingerprint recognition device of claim 24, wherein the first side of the fingerprint sensor and the first side of the processing unit are parallel to each other.
26. The fingerprint recognition device according to claim 23, wherein the first lead and/or the second lead is coated with a lead protection paste, and the height of the lead protection paste is not more than 150 μm.
27. The fingerprint identification device of claim 26, wherein an upper surface of the light shielding layer is not higher than a highest point of an upper surface of the lead protection adhesive, and/or an upper surface of the light shielding layer is not higher than a highest point of an upper surface of the optical component.
28. The fingerprint recognition device of claim 21, further comprising:
the supporting layer is arranged between the circuit board and the shading layer and is used for supporting the shading layer;
the fingerprint sensor and the processing unit are arranged in the third opening window.
29. The fingerprint recognition device of claim 28, wherein an upper surface of the support layer is no higher than a highest point of the upper surface of the optical assembly, and the upper surface of the support layer is no higher than an upper surface of the processing unit.
30. The fingerprint recognition device of claim 21, further comprising:
steep cotton layer, wherein be formed with the fourth windowing, the fourth windowing set up in fingerprint sensor top, the fourth windowing is used for passing through fingerprint light signal is in order to be received by fingerprint sensor, the area of fourth windowing is not less than in the light shield layer the area of first windowing.
31. The fingerprint recognition device of claim 30, wherein the fourth window is positioned directly above the optical assembly.
32. The fingerprint recognition device of any one of claims 1-5, wherein the optical assembly comprises:
a microlens array;
the at least one diaphragm layer is arranged below the micro lens array, and a plurality of light passing small holes are formed in each diaphragm layer in the at least one diaphragm layer;
the micro lens array is used for converging the fingerprint optical signals into the plurality of light-passing small holes of the at least one diaphragm layer, and the fingerprint optical signals are transmitted to the fingerprint sensor through the plurality of light-passing small holes to perform optical fingerprint imaging.
33. The fingerprint recognition device of claim 32, wherein each microlens in the microlens array corresponds to at least one light-passing aperture in each aperture layer, and at least one pixel element in the fingerprint sensor;
the fingerprint sensor is used for receiving fingerprint light signals in at least one direction so as to acquire fingerprint image signals of at least one fingerprint image.
34. The fingerprint recognition device according to any one of claims 1 to 5, wherein the fingerprint recognition device comprises:
the fingerprint sensors are arranged above the circuit board side by side so as to be spliced to form a fingerprint sensor assembly; and/or the presence of a gas in the gas,
the processing units are arranged above the circuit board side by side so as to form a processing unit assembly in a splicing mode.
35. The fingerprint recognition device according to any one of claims 1 to 5, wherein the distance between the fingerprint recognition device and the light emitting layer of the display screen is less than 600 μm.
36. An electronic device, comprising: a display screen;
the fingerprint recognition device according to any one of claims 1 to 35;
the upper surface downwardly extending of center forms the holding region, the holding region is located the display screen below, fingerprint identification device install in the holding region, so that fingerprint identification device set up in the display screen below.
37. The electronic device according to claim 36, wherein the receiving area of the middle frame is disposed in a middle area or a lower middle area of the middle frame, so that the fingerprint detection area of the fingerprint recognition device is located in a middle position or a lower middle position of the display area of the display screen.
CN202022094227.0U 2020-09-21 2020-09-21 Fingerprint identification device and electronic equipment Active CN213423972U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202022094227.0U CN213423972U (en) 2020-09-21 2020-09-21 Fingerprint identification device and electronic equipment

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202022094227.0U CN213423972U (en) 2020-09-21 2020-09-21 Fingerprint identification device and electronic equipment

Publications (1)

Publication Number Publication Date
CN213423972U true CN213423972U (en) 2021-06-11

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Family Applications (1)

Application Number Title Priority Date Filing Date
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Country Link
CN (1) CN213423972U (en)

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