CN204906846U - Dustproof heat dissipation type PCB circuit plate structure - Google Patents
Dustproof heat dissipation type PCB circuit plate structure Download PDFInfo
- Publication number
- CN204906846U CN204906846U CN201520655745.1U CN201520655745U CN204906846U CN 204906846 U CN204906846 U CN 204906846U CN 201520655745 U CN201520655745 U CN 201520655745U CN 204906846 U CN204906846 U CN 204906846U
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- CN
- China
- Prior art keywords
- copper sheet
- heat conduction
- conduction copper
- support
- pcb substrate
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Abstract
The utility model discloses a dustproof heat dissipation type PCB circuit plate structure, including the PCB base plate, the lower extreme of PCB base plate is attached to have one deck heat conduction copper sheet, is located PCB base plate and the outside parcel support of heat conduction copper sheet, the support includes an apron, the lower end face two ends of apron sets up a curb plate perpendicularly, the lower extreme medial surface of curb plate sets up a buckle perpendicularly, and the medial surface that is located the curb plate sets up a baffle perpendicularly, it forms a heat dissipating cavity to form between baffle and the buckle between a screens electronic component and electronic component. The utility model discloses simple structure through support of installation on the PCB base plate, through the fixed heat conduction copper sheet of this support, dispels the heat in the time of through heat conduction copper sheet and support, and the radiating effect is better, and the support can play a dustproof and waterproof's effect, and the life of circuit board is more of a specified duration.
Description
Technical field
The utility model relates to a kind of dust-proof radiating type PCB structure.
Background technology
PCB in use, owing to being in sealing state, temperature when therefore working is higher, therefore the thermal diffusivity for circuit board requires higher, if temperature is not distributed not go out easily cause burning of circuit board, and circuit board easily accumulates dust after installing, these dusts can affect the proper heat reduction of circuit board, and circuit board water proofing property of the prior art is poor.
Summary of the invention
Technical problem to be solved in the utility model is to provide that a kind of radiating effect is better, and support can play the effect of a dustproof and waterproof by dispelling the heat while heat conduction copper sheet and support, the dust-proof radiating type PCB structure that useful life of circuit board is more of a specified duration.
The utility model is achieved through the following technical solutions: a kind of dust-proof radiating type PCB structure, comprise PCB substrate, the lower end of described PCB substrate is pasted with one deck heat conduction copper sheet, the lower surface of PCB substrate is close in the upper surface of described heat conduction copper sheet, be positioned at PCB substrate and heat conduction copper sheet outer wrap one support, described support comprises a cover plate, the two ends, lower surface of described cover plate vertically arrange side plate, the lower end inside face of described side plate vertically arranges a buckle, the medial surface being positioned at side plate vertically arranges a baffle plate, a screens is formed between described baffle plate and buckle, described PCB substrate and heat conduction copper sheet are positioned in the screens between baffle plate and buckle, welding electronic elements is in the upper surface of PCB substrate, a cavity is formed between cover plate and PCB substrate, electronic component is arranged in cavity, a heat radiation cavity is formed between electronic component and electronic component.
As preferred technical scheme, the lower surface of described rack plate is provided with more than one fin, fin is arranged in heat radiation cavity, described fin is in " T " font, the upper end of fin is all provided with two heat radiation springs, the upper end of heat radiation spring is fixedly connected with cover plate lower surface, and the lower end of heat radiation spring is fixedly connected with fin.
As preferred technical scheme, described heat conduction copper sheet and support all adopt red copper material to make.
As preferred technical scheme, between described heat conduction copper sheet and PCB substrate, scribble heat-conducting silicone grease.
The beneficial effects of the utility model are: the utility model structure is simple, by installing a support in PCB substrate, heat conduction copper sheet is fixed by this support, by dispelling the heat while heat conduction copper sheet and support, radiating effect is better, and support can play the effect of a dustproof and waterproof, the useful life of circuit board is more of a specified duration.
Accompanying drawing explanation
In order to be illustrated more clearly in the utility model embodiment or technical scheme of the prior art, be briefly described to the accompanying drawing used required in embodiment or description of the prior art below, apparently, accompanying drawing in the following describes is only embodiments more of the present utility model, for those of ordinary skill in the art, under the prerequisite not paying creative work, other accompanying drawing can also be obtained according to these accompanying drawings.
Fig. 1 is overall structure schematic diagram of the present utility model.
Embodiment
All features disclosed in this specification, or the step in disclosed all methods or process, except mutually exclusive feature and/or step, all can combine by any way.
Arbitrary feature disclosed in this specification (comprising any accessory claim, summary and accompanying drawing), unless specifically stated otherwise, all can be replaced by other equivalences or the alternative features with similar object.That is, unless specifically stated otherwise, each feature is an example in a series of equivalence or similar characteristics.
As shown in Figure 1, a kind of dust-proof radiating type PCB structure of the present utility model, comprise PCB substrate 7, the lower end of described PCB substrate 7 is pasted with one deck heat conduction copper sheet 8, the lower surface of PCB substrate 7 is close in the upper surface of described heat conduction copper sheet 8, be positioned at PCB substrate 7 and heat conduction copper sheet 8 outer wrap one support, described support comprises a cover plate 4, the two ends, lower surface of described cover plate 4 vertically arrange side plate 1, the lower end inside face of described side plate 1 vertically arranges a buckle 9, the medial surface being positioned at side plate 1 vertically arranges a baffle plate 2, a screens is formed between described baffle plate 2 and buckle 9, described PCB substrate 7 and heat conduction copper sheet 8 are positioned in the screens between baffle plate 2 and buckle 9, electronic component 3 is welded in the upper surface of PCB substrate 7, a cavity is formed between cover plate 4 and PCB substrate 7, electronic component 3 is arranged in cavity, form one between electronic component 3 and electronic component 3 to dispel the heat cavity.
Wherein, the lower surface of rack plate 4 is provided with more than one fin 6, fin 6 is arranged in heat radiation cavity, described fin is in " T " font, and the upper end of fin is all provided with two heat radiation springs 5, and the upper end of heat radiation spring 5 is fixedly connected with cover plate lower surface, the lower end of heat radiation spring 5 is fixedly connected with fin, the installation of fin can carry out a heat radiation to the stability in PCB substrate, absorbs the temperature between electronic component, by fin, heat water suction is passed to support.
Wherein, heat conduction copper sheet 8 and support all adopt red copper material to make; Scribble heat-conducting silicone grease between heat conduction copper sheet and PCB substrate, thermal diffusivity is better.
The heat that heat conduction copper sheet absorbs in PCB substrate dispels the heat, and fixes PCB substrate and heat conduction copper sheet by support, and support also can play the effect that absorbs heat simultaneously.
The beneficial effects of the utility model are: the utility model structure is simple, by installing a support in PCB substrate, heat conduction copper sheet is fixed by this support, by dispelling the heat while heat conduction copper sheet and support, radiating effect is better, and support can play the effect of a dustproof and waterproof, the useful life of circuit board is more of a specified duration.
The above, be only embodiment of the present utility model, but protection range of the present utility model is not limited thereto, and any change of expecting without creative work or replacement, all should be encompassed within protection range of the present utility model.Therefore, the protection range that protection range of the present utility model should limit with claims is as the criterion.
Claims (4)
1. a dust-proof radiating type PCB structure, it is characterized in that: comprise PCB substrate, the lower end of described PCB substrate is pasted with one deck heat conduction copper sheet, the lower surface of PCB substrate is close in the upper surface of described heat conduction copper sheet, be positioned at PCB substrate and heat conduction copper sheet outer wrap one support, described support comprises a cover plate, the two ends, lower surface of described cover plate vertically arrange side plate, the lower end inside face of described side plate vertically arranges a buckle, the medial surface being positioned at side plate vertically arranges a baffle plate, a screens is formed between described baffle plate and buckle, described PCB substrate and heat conduction copper sheet are positioned in the screens between baffle plate and buckle, welding electronic elements is in the upper surface of PCB substrate, a cavity is formed between cover plate and PCB substrate, electronic component is arranged in cavity, a heat radiation cavity is formed between electronic component and electronic component.
2. dust-proof radiating type PCB structure according to claim 1, it is characterized in that: the lower surface of described rack plate is provided with more than one fin, fin is arranged in heat radiation cavity, described fin is in " T " font, the upper end of fin is all provided with two heat radiation springs, the upper end of heat radiation spring is fixedly connected with cover plate lower surface, and the lower end of heat radiation spring is fixedly connected with fin.
3. dust-proof radiating type PCB structure according to claim 1, is characterized in that: described heat conduction copper sheet and support all adopt red copper material to make.
4. dust-proof radiating type PCB structure according to claim 1, is characterized in that: scribble heat-conducting silicone grease between described heat conduction copper sheet and PCB substrate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520655745.1U CN204906846U (en) | 2015-08-27 | 2015-08-27 | Dustproof heat dissipation type PCB circuit plate structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520655745.1U CN204906846U (en) | 2015-08-27 | 2015-08-27 | Dustproof heat dissipation type PCB circuit plate structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN204906846U true CN204906846U (en) | 2015-12-23 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201520655745.1U Expired - Fee Related CN204906846U (en) | 2015-08-27 | 2015-08-27 | Dustproof heat dissipation type PCB circuit plate structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN204906846U (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105764244A (en) * | 2016-04-19 | 2016-07-13 | 泰和电路科技（惠州）有限公司 | Circuit board and manufacturing method thereof |
| CN108306144A (en) * | 2017-02-16 | 2018-07-20 | 番禺得意精密电子工业有限公司 | Electric connector combination |
| CN108361563A (en) * | 2018-02-23 | 2018-08-03 | 芜湖乐知智能科技有限公司 | A kind of encapsulation LED light emission device |
| CN108770301A (en) * | 2018-06-22 | 2018-11-06 | 芜湖纯元光电设备技术有限公司 | A kind of instrument and meter radiator |
| CN110494012A (en) * | 2019-07-29 | 2019-11-22 | 常州澳弘电子股份有限公司 | One kind being used for pcb board embedded resistors material |
| EP3654441A1 (en) * | 2018-11-15 | 2020-05-20 | Contemporary Amperex Technology Co., Limited | Cell supervision circuit and battery pack |
-
2015
- 2015-08-27 CN CN201520655745.1U patent/CN204906846U/en not_active Expired - Fee Related
Cited By (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105764244A (en) * | 2016-04-19 | 2016-07-13 | 泰和电路科技（惠州）有限公司 | Circuit board and manufacturing method thereof |
| CN105764244B (en) * | 2016-04-19 | 2019-06-11 | 泰和电路科技（惠州）有限公司 | Wiring board and its manufacturing method |
| CN108306144A (en) * | 2017-02-16 | 2018-07-20 | 番禺得意精密电子工业有限公司 | Electric connector combination |
| CN108306144B (en) * | 2017-02-16 | 2019-10-01 | 番禺得意精密电子工业有限公司 | Electric connector combination |
| CN108361563A (en) * | 2018-02-23 | 2018-08-03 | 芜湖乐知智能科技有限公司 | A kind of encapsulation LED light emission device |
| CN108770301A (en) * | 2018-06-22 | 2018-11-06 | 芜湖纯元光电设备技术有限公司 | A kind of instrument and meter radiator |
| EP3654441A1 (en) * | 2018-11-15 | 2020-05-20 | Contemporary Amperex Technology Co., Limited | Cell supervision circuit and battery pack |
| WO2020098764A1 (en) * | 2018-11-15 | 2020-05-22 | 宁德时代新能源科技股份有限公司 | Battery monitoring unit, fabrication method for battery monitoring unit, and battery pack |
| US11050109B2 (en) | 2018-11-15 | 2021-06-29 | Contemporary Amperex Technology Co., Limited | Cell supervision circuit and battery pack |
| CN110494012A (en) * | 2019-07-29 | 2019-11-22 | 常州澳弘电子股份有限公司 | One kind being used for pcb board embedded resistors material |
| CN110494012B (en) * | 2019-07-29 | 2023-08-04 | 常州澳弘电子股份有限公司 | Buried resistor PCB |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20151223 Termination date: 20210827 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |