CN203851362U - High-performance dustproof circuit board - Google Patents

High-performance dustproof circuit board Download PDF

Info

Publication number
CN203851362U
CN203851362U CN201420239675.7U CN201420239675U CN203851362U CN 203851362 U CN203851362 U CN 203851362U CN 201420239675 U CN201420239675 U CN 201420239675U CN 203851362 U CN203851362 U CN 203851362U
Authority
CN
China
Prior art keywords
circuit board
dustproof
layer
dust
performance
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN201420239675.7U
Other languages
Chinese (zh)
Inventor
冯建明
戴莹琰
李后清
王敦猛
寇化吉
钱伟
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
KUNSHAN CITY HUATAO ELECTRONIC CO Ltd
Original Assignee
KUNSHAN CITY HUATAO ELECTRONIC CO Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by KUNSHAN CITY HUATAO ELECTRONIC CO Ltd filed Critical KUNSHAN CITY HUATAO ELECTRONIC CO Ltd
Priority to CN201420239675.7U priority Critical patent/CN203851362U/en
Application granted granted Critical
Publication of CN203851362U publication Critical patent/CN203851362U/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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  • Non-Metallic Protective Coatings For Printed Circuits (AREA)

Abstract

The utility model relates to a high-performance dustproof circuit board, comprising an insulation substrate. The top of the insulation substrate is provided with a circuit layer. The top of the circuit layer is provided with a dustproof support. The top of the dustproof support is fixedly provided with a dustproof plate. The top of the dustproof plate and the bottom of the insulation substrate are both provided with a reflective ink layer. The high-performance dustproof circuit board is reasonable in structural design. As the top of the circuit layer is provided with the dustproof support and the dustproof plate, dust is prevented from falling on the circuit layer and accumulating, the normal operation of a printed circuit board is protected, and usage effects are good. In addition, the top of the dustproof plate and the bottom of the insulation substrate are both provided with the reflective ink layer, so that a fact that the reflective layer is arranged after the circuit board is processed and mounted is prevented, the process is simplified, and increase in heat of the circuit board is reduced.

Description

The dustproof circuit board of a kind of high-performance
Technical field
The utility model relates to the dustproof circuit board of a kind of high-performance.
Background technology
Printed circuit board uses widely in electronics manufacturing enterprise at present, the mode that electric component on printed circuit board adopts spot welding to connect, be fixed on printed circuit board, in the operational environment of electronic equipment, there will be the environment of many dusts, the extruding of dust can affect the normal work of electric elements.
Utility model content
For solving the problems of the technologies described above, the utility model provides a kind of high-performance circuit board that prevents dust.
The high-performance of the present utility model circuit board that prevents dust, comprise insulating substrate, the top of described insulating substrate is provided with circuit layer, and the top of circuit layer is provided with dust-proof frame, the fixing dust excluding plate in top of dust-proof frame, the top of dust excluding plate and the bottom of insulating substrate are equipped with reflective ink layer.
Compared with prior art the beneficial effects of the utility model are: the dustproof board structure of circuit of high-performance of the present utility model is reasonable in design; the top of circuit layer is provided with dust-proof frame and dust excluding plate; can avoid dust to drop on circuit layer; avoid overstocking of dust; the normal operation of protection printed circuit board; result of use is good; simultaneously at the top of dust excluding plate and the bottom of insulating substrate be equipped with reflective ink layer; after installing in circuit board processing, reflector layer is set again; technique is simple, has reduced the increase of circuit board heat.
Brief description of the drawings
Fig. 1 is the structural representation of the dustproof circuit board of a kind of high-performance described in the utility model embodiment.
In figure:
1, insulating substrate; 2, circuit layer; 3, dust-proof frame; 4, dust excluding plate; 5, reflective ink layer.
Embodiment
Below in conjunction with drawings and Examples, embodiment of the present utility model is described in further detail.Following examples are used for illustrating the utility model, but are not used for limiting scope of the present utility model.
As shown in Figure 1, a kind of high-performance circuit board that prevents dust, comprises insulating substrate 1, the top of described insulating substrate 1 is provided with circuit layer 2, the top of circuit layer 2 is provided with dust-proof frame 3, the fixing dust excluding plate 4 in top of dust-proof frame 3, and the bottom of the top of dust excluding plate 4 and insulating substrate 1 is equipped with reflective ink layer 5.
The dustproof board structure of circuit of high-performance of the present utility model is reasonable in design; the top of circuit layer is provided with dust-proof frame and dust excluding plate; can avoid dust to drop on circuit layer; avoid overstocking of dust; the normal operation of protection printed circuit board; result of use is good; simultaneously at the top of dust excluding plate and the bottom of insulating substrate be equipped with reflective ink layer; after installing in circuit board processing, reflector layer is set again; technique is simple; reduced the increase of circuit board heat, the structure of circuit layer and function at this not as patent protection.
The above is only preferred implementation of the present utility model; should be understood that; for those skilled in the art; do not departing under the prerequisite of the utility model know-why; can also make some improvement and modification, these improve and modification also should be considered as protection range of the present utility model.

Claims (1)

1. the dustproof circuit board of high-performance, comprise insulating substrate (1), it is characterized in that: the top of described insulating substrate (1) is provided with circuit layer (2), the top of circuit layer (2) is provided with dust-proof frame (3), the fixing dust excluding plate (4) in top of dust-proof frame (3), the bottom of the top of dust excluding plate (4) and insulating substrate (1) is equipped with reflective ink layer (5).
CN201420239675.7U 2014-05-12 2014-05-12 High-performance dustproof circuit board Expired - Fee Related CN203851362U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201420239675.7U CN203851362U (en) 2014-05-12 2014-05-12 High-performance dustproof circuit board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201420239675.7U CN203851362U (en) 2014-05-12 2014-05-12 High-performance dustproof circuit board

Publications (1)

Publication Number Publication Date
CN203851362U true CN203851362U (en) 2014-09-24

Family

ID=51564327

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201420239675.7U Expired - Fee Related CN203851362U (en) 2014-05-12 2014-05-12 High-performance dustproof circuit board

Country Status (1)

Country Link
CN (1) CN203851362U (en)

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Legal Events

Date Code Title Description
C14 Grant of patent or utility model
GR01 Patent grant
CF01 Termination of patent right due to non-payment of annual fee
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20140924

Termination date: 20180512