CN203912334U - Collapsible-type double-layer printed circuit board - Google Patents
Collapsible-type double-layer printed circuit board Download PDFInfo
- Publication number
- CN203912334U CN203912334U CN201420220340.0U CN201420220340U CN203912334U CN 203912334 U CN203912334 U CN 203912334U CN 201420220340 U CN201420220340 U CN 201420220340U CN 203912334 U CN203912334 U CN 203912334U
- Authority
- CN
- China
- Prior art keywords
- tellite
- printed circuit
- circuit board
- hasp
- pcb
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- Structure Of Printed Boards (AREA)
Abstract
The utility model discloses a collapsible-type double-layer printed circuit board, comprising a first printed circuit substrate and a second printed circuit substrate which are both circular and are in movable connection through a connection hinge pin. The first printed circuit substrate is provided with a first hasp; the second printed circuit substrate is provided with a second hasp; the first hasp is in connection with the second hasp. The first printed circuit substrate is provided with a plurality of first location holes; and the second printed circuit is provided with a plurality of second location holes. The first location holes and the second location holes are in butt joint. The collapsible-type double-layer printed circuit board is convenient to dissipate heat and substantially increases use space of the printed circuit substrate.
Description
Technical field
The utility model relates to a kind of printed circuit board (PCB), is specifically related to a kind of folded double-layered printed circuit board (PCB).
Background technology
In prior art, as patent ZL201010239356.2 discloses a kind of printed circuit board (PCB), comprise a circuit substrate, circuit substrate has a First Line line structure; At least one build-up circuit structure, is arranged on the First Line line structure of this circuit substrate; One top insulating barrier, is arranged in this at least one build-up circuit structure; One conductive blind hole, is arranged in this top insulating barrier; And a metal coupling, be arranged on the conductive blind hole in this top insulating barrier, wherein this metal coupling has different shapes or size from this conductive blind hole.The present invention is in another embodiment, in the insulating barrier of top, form a plurality of conductive blind holes, and form a metal pad on above-mentioned a plurality of conductive blind holes, wherein the size of metal pad is greater than the size of above-mentioned conductive blind hole, and via above-mentioned conductive blind hole, is electrically connected the electric connection pad of at least one build-up circuit structure.This printed circuit board (PCB) does not have folder function, and heat radiation is inconvenient, takes up room large.
Utility model content
The deficiency existing for prior art, the utility model provides a kind of convenient heat radiation, has greatly improved the folded double-layered printed circuit board (PCB) of tellite usage space.
To achieve these goals, the utility model is to realize by the following technical solutions:
A kind of folded double-layered printed circuit board (PCB), comprise the first tellite and the second tellite, the first tellite and the second tellite are round-shaped, described the first tellite is flexibly connected by being connected bearing pin with the second tellite, the first tellite is provided with the first hasp, the second tellite is provided with the second hasp, the first hasp is connected with the second hasp, the first tellite is provided with some the first location holes, the second tellite is provided with some the second location holes, the first location hole docks with the second location hole.
Further, described the first tellite is provided with cushion block.
Further, described cushion block is arranged in the marginal position near the first tellite.
Further, the surface of described cushion block is provided with layer of silica gel.
Further, described the first tellite is identical with the shape size of the second tellite.
Further, described the first location hole and the second location hole are round-shaped.
The beneficial effects of the utility model: because described the first tellite is flexibly connected by being connected bearing pin with the second tellite, the first tellite is provided with the first hasp, the second tellite is provided with the second hasp, the first hasp is connected with the second hasp, the first tellite is provided with some the first location holes, the second tellite is provided with some the second location holes, and the first location hole docks with the second location hole; So can make the first tellite overlap and be connected with the second tellite by connecting bearing pin, the first hasp and the second hasp, and leave gap between the first tellite and the second tellite, convenient heat radiation, has improved the usage space of tellite greatly.
Accompanying drawing explanation
Fig. 1 is the structural representation of the utility model folded double-layered printed circuit board (PCB).
Embodiment
For technological means, creation characteristic that the utility model is realized, reach object and effect is easy to understand, below in conjunction with embodiment, further set forth the utility model.
As shown in Figure 1, a kind of folded double-layered printed circuit board (PCB), comprise the first tellite 1 and the second tellite 2, the first tellite 1 and the second tellite 2 are round-shaped, the first tellite 1 is flexibly connected by being connected bearing pin 3 with the second tellite 2, the first tellite 1 is provided with the first hasp 4, the second tellite 2 is provided with the second hasp 5, the first hasp 4 is connected with the second hasp 5, the first tellite 1 is provided with some the first location holes 6, the second tellite 2 is provided with some the second location holes 7, the first location hole 6 docks with the second location hole 7.
The first tellite 1 is provided with cushion block 8, cushion block 8 is arranged in the marginal position near the first tellite 1, the surface of cushion block 8 is provided with layer of silica gel, the first tellite 1 is identical with the shape size of the second tellite 2, the first location hole 6 and the second location hole 7 are round-shaped, the surface of the first tellite 1 and the second tellite 2 is equipped with Waterproof glue line, and Waterproof glue line is provided with rag.
More than show and described basic principle of the present utility model and principal character and advantage of the present utility model.The technical staff of the industry should understand; the utility model is not restricted to the described embodiments; that in above-described embodiment and specification, describes just illustrates principle of the present utility model; do not departing under the prerequisite of the utility model spirit and scope; the utility model also has various changes and modifications, and these changes and improvements all fall within the scope of claimed the utility model.The claimed scope of the utility model is defined by appending claims and equivalent thereof.
Claims (6)
1. a folded double-layered printed circuit board (PCB), comprise the first tellite and the second tellite, the first tellite and the second tellite are round-shaped, it is characterized in that: described the first tellite is flexibly connected by being connected bearing pin with the second tellite, the first tellite is provided with the first hasp, the second tellite is provided with the second hasp, the first hasp is connected with the second hasp, the first tellite is provided with some the first location holes, the second tellite is provided with some the second location holes, the first location hole docks with the second location hole.
2. folded double-layered printed circuit board (PCB) according to claim 1, is characterized in that: described the first tellite is provided with cushion block.
3. folded double-layered printed circuit board (PCB) according to claim 2, is characterized in that: described cushion block is arranged in the marginal position near the first tellite.
4. folded double-layered printed circuit board (PCB) according to claim 2, is characterized in that: the surface of described cushion block is provided with layer of silica gel.
5. folded double-layered printed circuit board (PCB) according to claim 1, is characterized in that: described the first tellite is identical with the shape size of the second tellite.
6. folded double-layered printed circuit board (PCB) according to claim 1, is characterized in that: described the first location hole and the second location hole are round-shaped.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420220340.0U CN203912334U (en) | 2014-04-30 | 2014-04-30 | Collapsible-type double-layer printed circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420220340.0U CN203912334U (en) | 2014-04-30 | 2014-04-30 | Collapsible-type double-layer printed circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203912334U true CN203912334U (en) | 2014-10-29 |
Family
ID=51786574
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201420220340.0U Expired - Fee Related CN203912334U (en) | 2014-04-30 | 2014-04-30 | Collapsible-type double-layer printed circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203912334U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103974533B (en) * | 2014-04-30 | 2017-03-15 | 苏州倍辰莱电子科技有限公司 | A kind of folded double-layered printed circuit board (PCB) |
-
2014
- 2014-04-30 CN CN201420220340.0U patent/CN203912334U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103974533B (en) * | 2014-04-30 | 2017-03-15 | 苏州倍辰莱电子科技有限公司 | A kind of folded double-layered printed circuit board (PCB) |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20141029 Termination date: 20150430 |
|
| EXPY | Termination of patent right or utility model |